Method for selective laying of metal multi-material powder and laser printing device

Abstract

The application provides a metal multi-material powder selective laying method and a laser printing device, relates to the technical field of metal additive manufacturing, and solves the technical problem of low powder laying efficiency in the prior art that multiple nozzles are used for selective powder laying and powder suction. The device comprises a photosensitive adhesive coating system, a vacuum adsorption system, a picosecond laser control system, a selective laser melting system and a transmission system, and the vacuum adsorption system is arranged above the photosensitive adhesive coating system, the picosecond laser control system and the selective laser melting system. The bottom of the vacuum adsorption system is distributed with a plurality of micropores, the photosensitive adhesive coating system is used to provide photosensitive adhesive to the vacuum adsorption system and to solidify and block the photosensitive adhesive in the micropores, and the picosecond laser control system is used to remove the photosensitive adhesive of part of the micropores according to a slice model to be used for powder in the adsorption bin. The device provided by the application can place the same kind of material of each layer of a model slice on a printing platform substrate at the same time through the vacuum adsorption system, and fast powder laying can be achieved.

Description

Technical Field

[0001] This invention relates to the field of metal additive manufacturing technology, and in particular to a method for selectively laying up multi-material metal powders and a laser printing device. Background Technology

[0002] Selective laser melting is a major technique in additive manufacturing of metal materials. This technique uses a laser as an energy source and scans the metal powder bed layer by layer according to a path planned in a 3D CAD slicing model. The scanned metal powder melts and solidifies to achieve a metallurgical bonding effect, ultimately obtaining the metal part designed in the model.

[0003] The applicant has discovered that the prior art has at least the following technical problems:

[0004] Existing multi-material printing using laser selective melting technology often employs multiple nozzles for selective powder spreading and suction. When spreading material A, nozzle A spreads the powder area of ​​material A sequentially along the designed path, then nozzle B spreads the powder area of ​​material B sequentially along the designed path, and so on. The problems with this powder spreading method are low efficiency, low powder spreading accuracy (accuracy depends on the nozzle size), and inability to achieve precise powder control in each material area. Summary of the Invention

[0005] The purpose of this invention is to provide a method for selectively laying multi-material metal powders and a laser printing device, in order to solve the technical problem of low powder laying efficiency when using multiple nozzles for selective powder laying and suction in existing multi-material printing with laser selective melting technology. 。 The preferred technical solutions among the many technical solutions provided by this invention can produce a variety of technical effects, which are described in detail below.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] This invention provides a laser printing device, comprising a photosensitive adhesive coating system, a vacuum adsorption system, a picosecond laser control system, a laser melting system, and a transmission system. The laser melting system includes one or more hoppers. The photosensitive adhesive coating system, the picosecond laser control system, the hoppers, and the laser melting system are arranged sequentially. The vacuum adsorption system is positioned above the photosensitive adhesive coating system, the picosecond laser control system, and the laser melting system. The transmission system is connected to the vacuum adsorption system to drive its movement. The bottom of the vacuum adsorption system has a plurality of micropores. The photosensitive adhesive coating system provides photosensitive adhesive to the vacuum adsorption system and cures the photosensitive adhesive within the micropores. The picosecond laser control system removes a portion of the photosensitive adhesive from the micropores according to a slicing model to adsorb powder from the hoppers.

[0008] Furthermore, the photosensitive adhesive coating system includes a photosensitive adhesive curing platform and an adhesive supply device, wherein the adhesive supply device includes a photosensitive adhesive nozzle, and the photosensitive adhesive nozzle is used to spray photosensitive adhesive onto the photosensitive adhesive nozzle.

[0009] Furthermore, the length of the photosensitive adhesive nozzle is not less than that of the photosensitive adhesive curing platform. The photosensitive adhesive nozzle is disposed above the photosensitive adhesive curing platform and connected to the drive guide rail structure. The drive guide rail structure can drive the photosensitive adhesive nozzle to move along the width direction of the photosensitive adhesive curing platform.

[0010] Furthermore, the photosensitive adhesive curing platform is made of a transparent material, and a photosensitive light source is disposed below the photosensitive adhesive curing platform.

[0011] Furthermore, the vacuum adsorption system includes a vacuum chamber and an array of microporous plates. The array of microporous plates is disposed at the bottom opening of the vacuum chamber, and the vacuum chamber is connected to a vacuum device through a vacuum tube.

[0012] Furthermore, each of the hoppers corresponds to a scraper, which is used to scrape the powder adsorbed on the vacuum chamber structure.

[0013] Furthermore, the laser printing device also includes a support platform, on which the photosensitive adhesive coating system, the picosecond laser control system, and the laser melting system are sequentially arranged. The scraper is arranged on the support platform and is located between the two material bins or between the material bins and the laser melting system.

[0014] Furthermore, the laser melting system includes a substrate, a laser device, and a lifting device connected to the substrate.

[0015] Furthermore, the transmission system includes a vertical drive mechanism and a horizontal drive mechanism. The vacuum adsorption system is connected to the vertical drive mechanism, which drives the vacuum adsorption system to move along the height direction. The vertical drive mechanism is also connected to the horizontal drive mechanism, which drives the horizontal drive mechanism to move along the horizontal direction.

[0016] This invention provides a method for selectively depositing multi-material metal powders in a laser printing device, characterized by comprising the following:

[0017] Photosensitive emulsion enters the micropores of the vacuum adsorption system.

[0018] The photosensitive adhesive in the micropores is cured;

[0019] The vacuum adsorption system is moved above the picosecond laser control system, and the picosecond laser control system evaporates the photosensitive adhesive in the micropores of the area where powder material needs to be laid using laser energy, according to the slicing pattern path of the design model.

[0020] The vacuum adsorption system moves to the hopper and adsorbs the material;

[0021] The material adsorbed by the vacuum adsorption system is placed on the substrate of the laser melting system.

[0022] The preferred technical solution of the present invention can produce at least the following technical effects: Using the laser printing device provided by the present invention, the picosecond laser control system is responsible for slicing according to the design model, and using laser energy to evaporate the photosensitive adhesive in the micropores of the area where powder needs to be adsorbed on the vacuum adsorption system, so that the air path of the micropores is unobstructed, thereby allowing the negative pressure to adsorb powder particles. That is, using the laser printing device provided by the present invention, the same material of each layer of the model slice can be placed on the printing platform substrate at the same time through the vacuum adsorption system, which can realize rapid powder laying and improve the efficiency of powder laying. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of the laser printing device provided by the present invention;

[0025] Figure 2 This is a schematic diagram of the vacuum adsorption system provided by the present invention;

[0026] Figure 3 This is a schematic diagram of the structure of the array microporous plate provided by the present invention;

[0027] Figure 4 This is a schematic diagram of the material hopper structure in the laser melting system provided by the present invention;

[0028] Figure 5 This is a schematic diagram of the photosensitive adhesive coating system provided by the present invention.

[0029] In the figure: 1. Photosensitive adhesive coating system; 101. Photosensitive adhesive curing platform; 102. Photosensitive adhesive nozzle; 103. Photosensitive adhesive light source; 2. Vacuum adsorption system; 201. Micropores; 202. Vacuum chamber; 203. Arrayed microporous plate; 3. Picosecond laser control system; 4. Material hopper; 5. Laser melting system; 6. Transmission system; 7. Scraper; 8. Support platform; 9. Substrate; 10. Laser device. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be described in detail below. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0031] This invention provides a laser printing device, comprising a photosensitive adhesive coating system 1, a vacuum adsorption system 2, a picosecond laser control system 3, a laser melting system 5, and a transmission system 6. The laser melting system 5 includes one or more material bins 4. The photosensitive adhesive coating system 1, the picosecond laser control system 3, and the laser melting system 5 are arranged sequentially. The vacuum adsorption system 2 is positioned above the photosensitive adhesive coating system 1, the picosecond laser control system 3, and the laser melting system 5. The transmission system 6 is connected to the vacuum adsorption system 2 to drive its movement. The bottom of the vacuum adsorption system 2 has a plurality of micropores 201. The photosensitive adhesive coating system 1 provides photosensitive adhesive to the vacuum adsorption system 2 and cures and blocks the photosensitive adhesive within the micropores 201. The picosecond laser control system 3 removes some of the photosensitive adhesive from the micropores 201 according to the slicing model for adsorbing powder from the material bins 4.

[0032] Using the laser printing device provided by this invention, the vacuum adsorption system 2 is first moved above the photosensitive adhesive coating system 1 under the drive of the transmission system 6. The photosensitive adhesive coating system 1 provides photosensitive adhesive, which can block the micropores 201 on the vacuum adsorption system 2. At the same time, the photosensitive adhesive coating system 1 can solidify the photosensitive adhesive on the micropores 201. When all the micropores 201 on the vacuum adsorption system 2 are blocked by the solidified photosensitive adhesive, the transmission system 6 is controlled to move the vacuum adsorption system 2 above the picosecond laser control system 3. The picosecond laser control system 3 is responsible for slicing according to the design model and using laser energy to evaporate the photosensitive adhesive in the micropores of the area on the vacuum adsorption system 2 where powder needs to be adsorbed, so that the air passage of the micropores is unobstructed, thereby allowing the negative pressure to adsorb powder particles. Then, the vacuum adsorption system 2 is moved above the material bin 4, and powder particles are adsorbed through the unblocked micropores 201 on the vacuum adsorption system 2. After completion, the control transmission system 6 drives the vacuum adsorption system 2 to move above the laser melting system 5. When the pressure inside the vacuum adsorption system 2 returns to atmospheric pressure, the adsorbed powder particles fall onto the printing platform substrate of the laser melting system 5, thereby achieving selective adsorption of metal powder and transferring the metal powder onto the substrate. Two or more material bins 2 can be set, and powder from different bins can be adsorbed according to the control to complete the powder spreading for each layer.

[0033] Using the laser printing device provided by this invention, the same material for each layer of the model slice can be placed simultaneously on the printing platform substrate through the vacuum adsorption system 2, which can achieve rapid powder spreading and improve the efficiency of powder spreading.

[0034] Regarding the photosensitive adhesive coating system 1, the specific structure is preferably as follows: The photosensitive adhesive coating system 1 includes a photosensitive adhesive curing platform 101 and an adhesive supply device. The adhesive supply device includes a photosensitive adhesive nozzle 102, which is used to spray photosensitive adhesive onto the photosensitive adhesive nozzle 102.

[0035] See Figure 1 The diagram illustrates the photosensitive adhesive curing platform 101. When the micropores on the vacuum adsorption system 2 need to adsorb the photosensitive adhesive, a layer of photosensitive adhesive is sprayed onto the photosensitive adhesive curing platform 101 through the photosensitive adhesive nozzle 102. Then, the transmission system 6 is controlled to slowly move the vacuum adsorption system 2 downward, so that the micropores on the vacuum adsorption system 2 are immersed in the photosensitive adhesive.

[0036] See Figure 1The diagram illustrates the arrangement of the photosensitive emulsion nozzle 102. The length of the photosensitive emulsion nozzle 102 is not less than that of the photosensitive emulsion curing platform 101. The photosensitive emulsion nozzle 102 is positioned above the photosensitive emulsion curing platform 101 and connected to a drive guide rail structure. The drive guide rail structure can drive the photosensitive emulsion nozzle 102 to move along the width direction of the photosensitive emulsion curing platform 101. That is, by being driven by the drive guide rail structure, the photosensitive emulsion nozzle 102 can be controlled to move horizontally from one side to the opposite side, thereby achieving the spraying of a layer of photosensitive emulsion onto the photosensitive emulsion curing platform 101.

[0037] Regarding the drive guide rail structure, existing technology can be used. For example, the drive guide rail structure includes a drive motor and a lead screw mechanism. The drive motor is connected to the lead screw mechanism, and the slider of the lead screw mechanism is connected to the photosensitive emulsion nozzle 102. When the drive motor is activated, the slider moves horizontally along the length of the lead screw, thereby driving the photosensitive emulsion nozzle 102 to move horizontally.

[0038] Regarding the "photosensitive adhesive coating system 1 can cure the photosensitive adhesive within the micropores 201", the specific structure is as follows: The photosensitive adhesive curing platform 101 is made of a transparent material, and a photosensitive adhesive light source 103 is placed below the photosensitive adhesive curing platform 101. When the vacuum adsorption system 2 vacuum adsorbs the photosensitive adhesive on the photosensitive adhesive curing platform 101, the photosensitive adhesive fills all the micropores 201. Then, the photosensitive adhesive light source 103 is turned on, emitting light of a specific wavelength, which cures the photosensitive adhesive within the micropores 201, thereby achieving the goal of sealing all the micropores using the photosensitive adhesive.

[0039] The present invention makes the photosensitive adhesive curing platform 101 transparent and the photosensitive adhesive light source 103 reasonably arranged, which facilitates the curing of photosensitive adhesive in the micropores.

[0040] For information on vacuum adsorption system 2, see [link / reference]. Figure 1 and Figure 2 The vacuum adsorption system 2 includes a vacuum chamber 202 and an array of microporous plates 203. The array of microporous plates 203 is located at the bottom opening of the vacuum chamber 202. The vacuum chamber 202 is connected to a vacuum device through a vacuum tube.

[0041] Regarding the vacuum device, existing technology is sufficient, so we will not go into detail here. Using the vacuum device and vacuum tube, air can be evacuated from the vacuum chamber 202 to facilitate the formation of a vacuum to adsorb powder.

[0042] See Figure 3 The diagram illustrates an array of microporous plates 203, on which a plurality of micropores 201 are arrayed. The diameter of the micropores 201 is on the order of micrometers.

[0043] Preferably, each hopper 4 corresponds to a scraper 7, which is used to scrape the powder adsorbed on the structure of the vacuum chamber 202. See also Figure 1The diagram illustrates the scraper 7. The scraper is used to smooth the powder layer adsorbed by the vacuum adsorption system 2, which helps to form a powder layer of uniform thickness.

[0044] The specific structure of the scraper 7 is not limited, as long as it can achieve the above functions; the length of the scraper 7 is not less than the width of the array microporous plate 203, wherein... Figure 1 The direction before and after the array microporous plate 203 is defined as the width direction.

[0045] Regarding the picosecond laser control system 3, the picosecond laser control system 3 includes a picosecond laser and control elements. The picosecond laser is responsible for slicing according to the design model and evaporating the photosensitive adhesive in the micropores of the area where powder needs to be adsorbed on the array microporous plate using laser energy.

[0046] Regarding the laser melting system 5, the existing structure can be used. In the prior art, the laser melting system 5 typically includes a substrate 9, a laser device 10, and a lifting device connected to the substrate 9. After the vacuum adsorption system 2 transfers the metal powder onto the molding chamber substrate 9, the laser device performs selective sintering according to the model slicing path. The molding chamber screw (lifting device) descends by one layer thickness, and then the powder laying and laser sintering are repeated to finally print the shaped component.

[0047] Additionally, see Figure 1 The laser printing device also includes a support platform 8, a photosensitive adhesive coating system 1, a picosecond laser control system 3, and a laser melting system 5, which are sequentially arranged on the support platform 8. A scraper 7 is arranged on the support platform 8 and is located between two material bins 4 or between the material bins 4 and the substrate 9.

[0048] Regarding the transmission system 6, the preferred structure is as follows: The transmission system 6 includes a vertical drive mechanism and a horizontal drive mechanism. The vacuum adsorption system 2 is connected to the vertical drive mechanism, which drives the vacuum adsorption system 2 to move along the height direction. The vertical drive mechanism is connected to the horizontal drive mechanism, which drives the horizontal drive mechanism to move along the horizontal direction.

[0049] See Figure 1 The diagram simply illustrates the transmission system 6. Both the vertical and horizontal drive mechanisms of the transmission system 6 can utilize existing technologies. For example, the vertical drive mechanism may include a drive motor and a lead screw mechanism. The drive motor is connected to the lead screw mechanism, and the slider of the lead screw mechanism is connected to the vacuum adsorption system 2 via a frame. The drive motor's movement causes the vacuum adsorption system 2 to move along the height direction. Similarly, the horizontal drive mechanism can also employ a drive motor and a lead screw mechanism. Figure 1The two long rod structures shown in the diagram can be considered guide rails for the lead screw mechanism and its slider. In the horizontal drive mechanism, the slider structure of the lead screw mechanism is connected to the vertical drive mechanism. The horizontal drive mechanism can drive the vertical drive mechanism and the vacuum adsorption system 2 to move horizontally together. The horizontal movement direction is consistent with the orientation of the photosensitive adhesive coating system 1, the picosecond laser control system 3, and the laser melting system 5.

[0050] See Figure 1 The specific usage process of the laser printing device provided by this invention is as follows:

[0051] 1. The vacuum adsorption system 2 is located above the photosensitive adhesive curing platform 101; in the figure, the hopper on the right is the material A powder hopper and the hopper on the left is the material B powder hopper. The material A powder hopper is filled with powder A and the material B powder hopper is filled with powder B.

[0052] 2. The photosensitive adhesive nozzle 102 moves at a constant speed from one side of the work platform along the guide rail to the other side. When it moves to the photosensitive adhesive curing platform 101, the nozzle sprays out the photosensitive adhesive evenly, forming a photosensitive adhesive layer with a uniform thickness (about 0.5 mm thick) on the photosensitive adhesive curing platform 101.

[0053] 3. The vacuum adsorption system 2 slowly descends from above the photosensitive adhesive curing platform 101 onto the curing platform, immersing the array microporous plate 203 in the photosensitive adhesive. At this time, due to the vacuum adsorption pressure, the photosensitive adhesive fills all the micropores. Then, the photosensitive adhesive (curing) light source is turned on, emitting light of a specific wavelength to cure the photosensitive adhesive, thereby achieving the purpose of using the photosensitive adhesive to block all the micropores on the array microporous plate 203, preventing gas from passing through the array microporous plate.

[0054] 4. The vacuum adsorption system 2 rises from the photosensitive adhesive curing platform 101 and moves to the focal plane height above the picosecond laser. Then, the picosecond laser uses laser energy to evaporate the photosensitive adhesive in the micropores of the area where powder material A needs to be laid, opening the micropores in that area and making the air passage unobstructed, according to the slicing pattern path of the design model.

[0055] 5. Vacuum adsorption system 2 moves from the picosecond laser to the material A powder chamber, and then the vacuum pump is turned on, creating a negative pressure in the vacuum tube and vacuum chamber. At this time, the micropores in the area where powder material A needs to be laid are unobstructed because the photosensitive adhesive has been evaporated by the picosecond laser. Therefore, the micropores in this area are connected to the vacuum chamber, and a negative pressure is also formed in the micropores. Using the adsorption force of this negative pressure, the material A powder is adsorbed. Micropores that are not unobstructed will not be able to adsorb the material A powder, thereby achieving the purpose of selectively adsorbing metal powder in specific areas.

[0056] 6. After the vacuum adsorption system 2 adsorbs the powder of material A, the scraper 7 in front of the powder A chamber is used to scrape the adsorbed powder A layer flat to form a powder layer of uniform thickness.

[0057] 7. Then, the vacuum adsorption system 2 carries the powder A of a specific shape and uniform thickness to the substrate of the laser melting system. The vacuum pump stops working, the negative pressure of the vacuum chamber disappears, and the powder A falls from the array microporous plate 203 onto the substrate due to gravity, thereby completing the purpose of selectively laying the powder A in a specific area.

[0058] 8. The laser device above the molding chamber substrate melts the material A powder on the substrate according to the designed path, completing the process of converting the powder material into a workpiece.

[0059] 9. Repeat steps 1-8 above. The vacuum adsorption system 2 transfers material B powder from the material B powder bed to the substrate. Then, the laser melts the powder B, thereby completing the selective laying and melting of the two material powders A and B in the same layer. According to this principle, the device works layer by layer, and finally realizes the printing and forming of heterogeneous materials based on selective laser melting (SLM) technology.

[0060] This invention provides a method for selectively depositing multi-material metal powders in a laser printing device, comprising the following:

[0061] The photosensitive emulsion enters through the micropores 201 of the vacuum adsorption system 2.

[0062] The photosensitive adhesive in the micropores 201 is cured;

[0063] The vacuum adsorption system 2 is moved above the picosecond laser control system 3. The picosecond laser control system 3 evaporates the photosensitive adhesive in the micropores 201 of the area where powder material needs to be laid using laser energy, according to the slicing pattern path of the design model.

[0064] Vacuum adsorption system 2 moves to hopper 4 and adsorbs material;

[0065] The material adsorbed by the vacuum adsorption system 2 is placed on the substrate 9 of the laser melting system 5.

[0066] The method for selectively laying multi-material metal powders has been described in detail in the embodiments of the relevant apparatus, and will not be elaborated here.

[0067] In the description of this invention, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0068] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0069] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "a particular example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0070] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A laser printing apparatus, characterized by comprising: Including photosensitive glue coating system (1), vacuum adsorption system (2), picosecond laser control system (3), laser melting system (5), transmission system (6) and more than one silo (4), wherein, The photosensitive glue coating system (1), the picosecond laser control system (3), the silo (4) and the laser melting system (5) are sequentially arranged, the vacuum adsorption system (2) is arranged above the photosensitive glue coating system (1), the picosecond laser control system (3) and the laser melting system (5), and the transmission system (6) is connected with the vacuum adsorption system (2) to drive the vacuum adsorption system (2) to move. The bottom of the vacuum adsorption system (2) is distributed with a plurality of micropores (201), the vacuum adsorption system (2) comprises a vacuum chamber (202) and an array micropore plate (203), the array micropore plate (203) is arranged at the bottom opening position of the vacuum chamber (202), the vacuum chamber (202) is connected with a vacuum device through a vacuum pipe, the photosensitive glue coating system (1) is used to provide photosensitive glue to the vacuum adsorption system (2) and solidify the photosensitive glue in the micropore (201), and the picosecond laser control system (3) is used to remove part of the photosensitive glue in the micropore (201) according to the slice model to adsorb the powder in the silo (4). The photosensitive glue coating system (1) comprises a photosensitive glue solidification platform (101) and a glue supply device, the glue supply device comprises a photosensitive glue nozzle (102), and the photosensitive glue nozzle (102) is used to spray photosensitive glue to the photosensitive glue solidification platform (101). The material of the photosensitive glue solidification platform (101) is transparent material, a photosensitive glue light source (103) is arranged below the photosensitive glue solidification platform (101), when the vacuum adsorption system (2) adsorbs the photosensitive glue on the photosensitive glue solidification platform (101), the photosensitive glue fills all the micropores (201), then the photosensitive glue light source (103) is turned on to emit light of a specific wavelength to solidify the photosensitive glue in the micropore (201). The laser melting system (5) comprises a substrate (9), a laser device (10) and a lifting device connected with the substrate (9).

2. The laser printing device according to claim 1, wherein The length of the photosensitive glue nozzle (102) is not less than that of the photosensitive glue solidification platform (101), the photosensitive glue nozzle (102) is arranged above the photosensitive glue solidification platform (101) and connected with a driving guide rail structure, and the driving guide rail structure can drive the photosensitive glue nozzle (102) to move along the width direction of the photosensitive glue solidification platform (101).

3. The laser printing device of claim 1, wherein, Each silo (4) corresponds to a scraper (7), and the scraper (7) is used to scrape the powder adsorbed on the vacuum chamber (202) structure.

4. The laser printing device of claim 3, wherein, The laser printing device further comprises a support table (8), the photosensitive adhesive coating system (1), the picosecond laser control system (3) and the laser melting system (5) are sequentially arranged on the support table (8), the doctor blade (7) is arranged on the support table (8) and the doctor blade (7) is located between the two material bins (4) or between the material bin (4) and the laser melting system (5).

5. The laser printing device of claim 1, wherein, The transmission system (6) comprises a vertical driving mechanism and a horizontal driving mechanism, the vacuum adsorption system (2) is connected with the vertical driving mechanism, the vertical driving mechanism is used to drive the vacuum adsorption system (2) to move along the height direction, and the vertical driving mechanism is connected with the horizontal driving mechanism.

6. A method of selective laying of metal multi-material powder for a laser printing apparatus according to any one of claims 1 to 5, characterized in that, The following contents are included: The photosensitive adhesive in the micropore (201) of the vacuum adsorption system (2) is entered, The photosensitive adhesive in the micropore (201) is solidified; The vacuum adsorption system (2) is moved above the picosecond laser control system (3), the photosensitive adhesive in the micropore (201) of the region needing to lay the powder material is evaporated by using the laser energy according to the slice pattern path of the design model; The vacuum adsorption system (2) is moved to the material bin (4) and adsorbs the material; The material adsorbed by the vacuum adsorption system (2) is placed on the substrate (9) of the laser melting system (5).

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