Integrated circuit test handler

Abstract

The application discloses an integrated circuit test and sorting device, which is characterized in that a temporary storage table is arranged at one end of a guide rail away from a vibrating disc, a gantry is arranged at one side of the temporary storage table, a shaping plate corresponding to a position avoiding groove is arranged in a stepped shape along a direction away from a circuit package tube, an initial position of one shaping plate close to the circuit package tube is the lowest, a single-arc surface shaping claw is arranged at the bottom of each end of the shaping plate, a double-arc surface shaping claw is arranged between two oppositely arranged single-arc surface shaping claws, a test electrode fixedly connected with an insulating guide rod is arranged in the inside of a left accommodating cavity and a right accommodating cavity, the insulating guide rod is slidably connected between the shaping plate and the test electrode, and a switch electrode A and a switch electrode B are oppositely arranged between the shaping plate and the test electrode. The application realizes shaping of pins with different deformation degrees, realizes electrical property test of the circuit package tube through multi-point contact conduction of the pins of the circuit package tube, and improves the overall production efficiency.

Description

Technical Field

[0001] This invention relates to the field of testing and sorting equipment technology, specifically to an integrated circuit testing and sorting device. Background Technology

[0002] An integrated circuit is a miniature electronic device or component. Using certain processes, the transistors, resistors, capacitors, inductors, and other components required for a circuit, along with interconnecting wiring, are fabricated on one or several small pieces of semiconductor wafers or dielectric substrates. These are then packaged in a casing to form a miniature structure with the required circuit function. Pins are provided on the side of the miniature structure for connection, allowing it to be electrically connected to the circuit board.

[0003] A search revealed Chinese patent CN108311419B, which discloses an integrated circuit testing and sorting machine. The machine includes a sorting body, supporting legs, a control cabinet, a cabinet door, a high-precision automatic sorting device, a testing frame, a testing body, an adjustable-distance testing pen, a conveying device, side panels, a control computer, and a control panel. The sorting body has a rectangular structure. The supporting legs are located at the four ends of the sorting body and are vertically connected by welding. The control cabinet is located inside the sorting body on the right side and is integrally formed with the sorting body. The cabinet door is located at the front of the sorting body and is movably connected to the sorting body via hinges. This invention, by incorporating a high-precision automatic sorting device, can automatically and accurately sort integrated circuit boards based on whether there are problems, effectively preventing sorting errors and achieving more accurate and faster testing and sorting, thus effectively improving the testing and sorting accuracy and efficiency of the integrated circuit testing and sorting machine.

[0004] After integrated circuits are packaged, the pins are exposed outside the package tube, and these pins are prone to deformation. When using the above-mentioned device, the adjustable distance test pen cannot adapt to the pins with different degrees of deformation for testing. Furthermore, reshaping the pins separately before testing would increase the testing process and reduce production efficiency. Summary of the Invention

[0005] The purpose of this invention is to provide an integrated circuit testing and sorting device. This device not only reshapes pins with different degrees of deformation, improving the pin position accuracy, but also achieves electrical testing of the circuit package tubes by making multi-point contact with the pins of the circuit package tubes, thereby improving the overall production efficiency.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is: an integrated circuit testing and sorting device, comprising: a base, a vibratory feeder installed on one side of the top of the base, wherein a guide rail is provided at the discharge port of the vibratory feeder, and a temporary storage platform is provided at the end of the guide rail away from the vibratory feeder;

[0007] A gantry frame is provided on one side of the temporary storage platform. A support platform with several clearance slots is provided below the gantry frame, and the clearance slots are spaced apart along the length of the support platform. A lifting plate with several shaping plates movably connected to its bottom is provided above the support platform. The shaping plates that correspond to the clearance slots are arranged in a stepped manner along the direction away from the circuit encapsulation tube, and the shaping plate closest to the circuit encapsulation tube has the lowest initial position.

[0008] A single-arc shaping claw is provided at each of the two bottom ends of the shaping plate, and a double-arc shaping claw is provided between the two oppositely arranged single-arc shaping claws, thereby forming a left accommodating cavity and a right accommodating cavity between the roots of the single-arc shaping claw and the double-arc shaping claw. A test electrode with an insulating guide rod fixedly connected to its top is provided inside the left accommodating cavity and the right accommodating cavity, and the insulating guide rod is slidably connected to the shaping plate. A switching electrode A and a switching electrode B are arranged opposite to each other between the shaping plate and the test electrode, and the switching electrode A is fixedly connected to the shaping plate, and the switching electrode B is fixedly installed on the top of the test electrode. The test electrode is electrically connected to the paired switching electrodes A and B.

[0009] The following are further improvements to the above technical solution:

[0010] 1. In the above scheme, a second telescopic device with a negative pressure suction head at its movable end is fixedly installed on the other side of the temporary storage platform. The negative pressure suction head is connected to the air inlet of a negative pressure vacuum pump. A material leakage groove is opened on the base between the temporary storage platform and the second telescopic device. A second through hole is opened at intervals along the extension direction of the guide rail on the temporary storage platform. A baffle is slidably connected inside the second through hole. A drive mechanism for driving the two baffles to extend alternately is provided below the temporary storage platform and between the two baffles.

[0011] 2. In the above scheme, the driving mechanism includes a motor and a lever with waist-shaped holes at both ends. The output shaft of the motor is fixedly connected to the middle of the side wall of the lever, and the bottom side wall of the baffle is movably installed on the inner wall of the waist-shaped hole through a limiting post.

[0012] 3. In the above scheme, a limiting plate is rotatably connected to the side of the temporary storage platform away from the second telescopic device via a hinge shaft, and a torsion spring is fastened between the limiting plate and the temporary storage platform.

[0013] 4. In the above scheme, the two test electrodes inside the left and right accommodating cavities are connected in series, and the test electrodes between different left accommodating cavities and the test electrodes inside different right accommodating cavities are connected in parallel.

[0014] 5. In the above scheme, a cutting groove is opened at the end of the support platform away from the circuit packaging tube, and a cutting blade is fixedly installed above the cutting groove and at the bottom of the lifting plate.

[0015] 6. In the above scheme, a waste bin with an opening at the top is provided below the blade groove.

[0016] 7. In the above scheme, a first telescopic device is fixedly installed on the top of the gantry frame, and the output shaft of the first telescopic device passes through the gantry frame and is fixedly connected to the lifting plate.

[0017] 8. In the above scheme, a second guide slide rod is provided between the lifting plate and the shaping plate, and the upper end of the second guide slide rod can pass through the lifting plate and be fixedly connected to a stop block, and the lower end of the second guide slide rod is fixedly connected to the shaping plate.

[0018] 9. In the above scheme, a first guide slide rod is provided on the top of the lifting plate and symmetrically about the axis of the telescopic device, and a through hole is provided on the top of the gantry frame for the first guide slide rod to slide and connect.

[0019] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0020] 1. The integrated circuit testing and sorting device of the present invention includes a support platform with several clearance slots below a gantry frame, a lifting plate with several shaping plates movably connected to its bottom above the support platform, a single-arc shaping claw at each end of the bottom of the shaping plate, and a double-arc shaping claw between two opposing single-arc shaping claws, a test electrode with an insulating guide rod fixedly connected to its top is provided inside the left and right accommodating cavities, and a switching electrode A and a switching electrode B are positioned opposite each other between the shaping plate and the test electrode, respectively. During the descent of the lifting plate, the connecting plate drives the single-arc shaping claws, The double-arc shaping claw is embedded in the clearance groove of the support platform. During the descent of the single-arc and double-arc shaping claws, the two pins of the circuit package tube are gathered into the left and right accommodating cavities, respectively. This not only shapes the pins with different degrees of deformation and improves the positional accuracy of the pins, but also pushes the test electrode upward, so that multiple paired switch electrodes A and B are in contact and connected between the two pins to form a circuit. This enables the electrical testing of the circuit package tube. Since multiple switch electrodes A and B must be connected to form a circuit, the reliability of the electrical test is guaranteed and the overall production efficiency is improved.

[0021] 2. The integrated circuit testing and sorting device of the present invention has a second telescopic device with a negative pressure suction head fixedly installed on the other side of the temporary storage platform. The negative pressure suction head is connected to the air inlet of a negative pressure vacuum pump. A material leakage groove is opened on the base between the temporary storage platform and the second telescopic device. A second through hole is opened at intervals along the extension direction of the guide rail on the temporary storage platform. A baffle is slidably connected inside the second through hole. A driving mechanism for driving the two baffles to extend alternately is set below the temporary storage platform and between the two baffles. When the package tube is determined to be unqualified, the circuit package tube can be adsorbed by the telescopic device with a negative pressure suction cup. The second telescopic contraction moves the circuit package tube to the top of the material leakage groove for release. When the package tube is determined to be qualified, the driving mechanism drives the baffle away from the guide rail to descend and the baffle close to the guide rail to rise. The product to be tested rolls out along the temporary storage platform, which can realize the discharge of qualified products and avoid the downward movement of the product to be tested, improve the positional accuracy of the product, realize the automatic separation of qualified and unqualified products, facilitate personnel to classify and collect products, and improve the overall production efficiency. Attached Figure Description

[0022] Appendix Figure 1 This is a schematic diagram of the integrated circuit testing and sorting device of the present invention;

[0023] Appendix Figure 2 This is a schematic diagram of the internal structure of the gantry in the integrated circuit testing and sorting device of the present invention;

[0024] Appendix Figure 3 This is a partial structural diagram of the integrated circuit testing and sorting device of the present invention. Figure 1 ;

[0025] Appendix Figure 4 This is a partial structural diagram of the integrated circuit testing and sorting device of the present invention. Figure 2 ;

[0026] Appendix Figure 5 This is a schematic cross-sectional view of the shaping plate in the integrated circuit testing and sorting device of the present invention.

[0027] Appendix Figure 6 This is a partial structural diagram of the integrated circuit testing and sorting device of the present invention. Figure 3 ;

[0028] Appendix Figure 7 This is a partial structural diagram of the integrated circuit testing and sorting device of the present invention. Figure 4 ;

[0029] Appendix Figure 8 This is a partially enlarged structural schematic diagram of the integrated circuit testing and sorting device of the present invention;

[0030] Appendix Figure 9This is a schematic diagram of the drive mechanism in the integrated circuit testing and sorting device of the present invention;

[0031] Appendix Figure 10 This is a schematic diagram of the test circuit structure of the integrated circuit test and sorting device of the present invention.

[0032] In the attached diagrams: 1. Base; 2. Through hole; 3. Circuit encapsulation tube; 4. Stop block; 501. Left accommodating cavity; 502. Right accommodating cavity; 6. Lifting plate; 7. First guide slide rod; 8. First telescopic device; 9. Gantry frame; 10. Temporary storage platform; 11. Support platform; 12. Alternating groove; 13. Support leg; 14. Second through hole; 15. Spring; 16. Second guide slide rod; 17. Shaping plate; 18. Single arc-shaped shaping claw; 19. Double arc-shaped shaping claw; 21. Limiting device. 21. Bolt; 22. Limiting nut; 23. Insulating guide rod; 24. Switch electrode A; 25. Switch electrode B; 26. Test electrode; 27. Scrap bin; 28. Vibratory feeder; 29. ​​Knife groove; 30. Guide rail; 31. Negative pressure suction head; 33. Discharge trough; 34. Second expansion joint; 35. Hinge shaft; 36. Limiting plate; 37. Torsion spring; 38. Baffle; 39. Waist-shaped hole; 40. Limiting post; 41. Lever; 42. Motor; 43. Cutter; 44. Rubber sheet. Implementation

[0033] The present patent can be further understood through the specific embodiments given below, but they are not intended to limit the present patent.

[0034] Example 1: An integrated circuit testing and sorting device includes: a base 1, a vibratory feeder 28 installed on one side of the top of the base 1, a guide rail 30 is provided at the discharge port of the vibratory feeder 28, and a temporary storage platform 10 is provided at the end of the guide rail 30 away from the vibratory feeder 28.

[0035] A gantry frame 9 is provided on one side of the temporary storage platform 10. A support platform 11 with several clearance slots 12 is provided below the gantry frame 9, and the clearance slots 12 are spaced apart along the length of the support platform 11. A lifting plate 6 with several shaping plates 17 movably connected to the bottom is provided above the support platform 11. The shaping plates 17 corresponding to the clearance slots 12 are arranged in a stepped manner along the direction away from the circuit encapsulation tube 3, and the shaping plate 17 closest to the circuit encapsulation tube 3 has the lowest initial position.

[0036] The second telescopic device pushes out the circuit package tube, with the roots of the two pins of the circuit package tube placed horizontally on the surface of the support platform. The first telescopic device is activated to lower the lifting plate. First, a group of shaping plates located at the root uses the gap formed by the single-arc shaping claw and the double-arc shaping claw to limit and shape the root of the pin until the test electrode contacts the pin. The displacement of this group of shaping plates ends after the test electrode contacts the pin. Then, another group adjacent to the root limits and shapes the adjacent part of the pin root until the displacement of this group ends after the test electrode contacts the pin. This process is repeated until all the shaping plates reach the working state.

[0037] A single-arc shaping claw 18 is provided at each of the bottom ends of the shaping plate 17, and a double-arc shaping claw 19 is provided between the two oppositely arranged single-arc shaping claws 18, thereby forming a left accommodating cavity 501 and a right accommodating cavity 502 between the roots of the single-arc shaping claw 18 and the double-arc shaping claw 19. A test electrode 26 with an insulating guide rod 23 fixedly connected to its top is provided inside the left accommodating cavity 501 and the right accommodating cavity 502, and the insulating guide rod 23 is slidably connected to the shaping plate 17. A switching electrode A24 and a switching electrode B25 are oppositely arranged between the shaping plate 17 and the test electrode 26, and the switching electrode A24 is fixedly connected to the shaping plate 17. The switching electrode B25 is fixedly installed on the top of the test electrode 26, and the test electrode 26 is electrically connected to the paired switching electrodes A24 and B25.

[0038] The test electrode contacts the pin, allowing energization of the test electrode to perform an energization test on the pin. Simultaneously, a cutter is included to cut the shaped pin, ensuring the pin length. Additionally, a waste bin and a rubber sheet are provided. The rubber sheet prevents the pin from popping out during cutting, and the waste bin collects the cut pin waste.

[0039] A second telescopic device 34 with a negative pressure suction head 31 at its movable end is fixedly installed on the other side of the temporary storage platform 10. The negative pressure suction head 31 is connected to the air inlet of a negative pressure vacuum pump. A material leakage groove 33 is opened on the base 1 between the temporary storage platform 10 and the second telescopic device 34. A second through hole 14 is opened at intervals along the extension direction of the guide rail 30 on the temporary storage platform 10. A baffle 38 is slidably connected inside the second through hole 14. A drive mechanism for driving the two baffles 38 to extend alternately is provided below the temporary storage platform 10 and between the two baffles 38.

[0040] After the test, if the circuit under test package tube is powered on and passes the test, the second telescopic device will pull the circuit under test package tube back and place it in its original position on the guide rail. At this time, the motor will start and drive the lever to rotate. The lever will pull down the left baffle and roll the qualified product along the guide rail. At the same time, the right baffle will move up to prevent the untested circuit under test package tube from rolling down. If it fails the test, the second telescopic device will pull the circuit under test package tube to the leakage trough and drop it through the leakage trough to achieve sorting.

[0041] The aforementioned drive mechanism includes a motor 42 and a lever 41 with waist-shaped holes 39 at both ends. The output shaft of the motor 42 is fixedly connected to the middle of the side wall of the lever 41. The bottom side wall of the aforementioned baffle 38 is movably mounted on the inner wall of the waist-shaped hole 39 via a limiting post 40.

[0042] A limiting plate 36 is rotatably connected to the side of the temporary storage platform 10 away from the second telescopic device 34 via a hinge shaft 35, and a torsion spring 37 is fastened between the limiting plate 36 and the temporary storage platform 10.

[0043] The two test electrodes 26 inside the left accommodating cavity 501 and the right accommodating cavity 502 are connected in series, while the test electrodes 26 between different left accommodating cavities 501 and the test electrodes 26 inside different right accommodating cavities 502 are connected in parallel.

[0044] The height ΔH between the upper surface of the aforementioned limiting plate 36 in the upright state and the bottom upper surface of the temporary storage stage 10 satisfies ΔH=hr, where h is the height of the pin axis from the edge of the circuit package tube 3 when the two pins of the circuit package tube 3 are horizontal, and r is the radius of the pin.

[0045] The distance between the two baffles 38 is greater than the diameter of one of the circuit under test package tubes 3 and less than the sum of the diameters of the two circuit under test package tubes 3.

[0046] The circuit package tube is fed by a vibratory feeder. When the circuit package tube under test is not pushed out, the limiting plate is subjected to the torsion force of the torsion spring and is in a vertical state. The vibration of the vibratory feeder is transmitted to the guide rail. Combined with the height setting of the limiting plate, if the pins of the circuit package tube under test are not horizontal, it will be lifted by the limiting plate. The lifted package tube will be vibrated and gradually rotate until the two pins are horizontal, which improves the positional accuracy of the circuit package tube and facilitates the feeding of the package tube.

[0047] A cutting groove 29 is provided at the end of the support platform 11 away from the circuit encapsulation tube 3. A cutting blade 43 is fixedly installed above the cutting groove 29 and at the bottom of the lifting plate 6. A waste bin 27 with an opening at the top is provided below the cutting groove 29.

[0048] A first telescopic device 8 is fixedly installed on the top of the gantry frame 9. The output shaft of the first telescopic device 8 passes through the gantry frame 9 and is fixedly connected to the lifting plate 6.

[0049] A second guide slide rod 16 is provided between the lifting plate 6 and the shaping plate 17. The upper end of the second guide slide rod 16 can pass through the lifting plate 6 and be fixedly connected to a stop block 4. The lower end of the second guide slide rod 16 is fixedly connected to the shaping plate 17.

[0050] A first guide slide rod 7 is provided on the top of the aforementioned lifting plate 6 and symmetrically about the axis of the telescopic device 8. A through hole 2 is provided on the top of the aforementioned gantry frame 9 for sliding connection of the first guide slide rod 7.

[0051] A spring 15 is located between the lifting plate 6 and the shaping plate 17 and is fitted on the outer wall of the second guide slide rod 16.

[0052] A rubber sheet 44 is adhered to the side wall of the aforementioned lifting plate 6.

[0053] The aforementioned negative pressure suction head 31 is connected to a negative pressure pump.

[0054] The aforementioned motor 42 is located at the bottom of the base 1, and the aforementioned baffle 38 can extend through the base 1 and out of the second through hole 14.

[0055] Example 2: An integrated circuit testing and sorting device includes: a base 1, a vibratory feeder 28 installed on one side of the top of the base 1, a guide rail 30 is provided at the discharge port of the vibratory feeder 28, and a temporary storage platform 10 is inclinedly provided at the end of the guide rail 30 away from the vibratory feeder 28.

[0056] A gantry frame 9 is provided on one side of the temporary storage platform 10. A support platform 11 with several clearance slots 12 is provided below the gantry frame 9, and the clearance slots 12 are spaced apart along the length of the support platform 11. A lifting plate 6 with several shaping plates 17 movably connected to the bottom is provided above the support platform 11. The shaping plates 17 corresponding to the clearance slots 12 are arranged in a stepped manner along the direction away from the circuit encapsulation tube 3, and the shaping plate 17 closest to the circuit encapsulation tube 3 has the lowest initial position.

[0057] During the descent of the lifting plate, the connecting plate drives the single-arc-surface shaping claw and the double-arc-surface shaping claw to embed into the clearance groove of the support platform. During the descent of the single-arc-surface shaping claw and the double-arc-surface shaping claw, the two pins of the circuit package tube are gathered into the left accommodating cavity and the right accommodating cavity respectively. This not only achieves the shaping of pins with different degrees of deformation, but also improves the positional accuracy of the pins.

[0058] A single-arc shaping claw 18 is provided at each of the bottom ends of the shaping plate 17, and a double-arc shaping claw 19 is provided between the two oppositely arranged single-arc shaping claws 18, thereby forming a left accommodating cavity 501 and a right accommodating cavity 502 between the roots of the single-arc shaping claw 18 and the double-arc shaping claw 19. A test electrode 26 with an insulating guide rod 23 fixedly connected to its top is provided inside the left accommodating cavity 501 and the right accommodating cavity 502, and the insulating guide rod 23 is slidably connected to the shaping plate 17. A switching electrode A24 and a switching electrode B25 are oppositely arranged between the shaping plate 17 and the test electrode 26, and the switching electrode A24 is fixedly connected to the shaping plate 17. The switching electrode B25 is fixedly installed on the top of the test electrode 26, and the test electrode 26 is electrically connected to the paired switching electrodes A24 and B25.

[0059] Next, the pin pushes the test electrode upward, so that multiple paired switch electrodes A and B are in contact and connected between the two pins to form a circuit, thus realizing the electrical test of the circuit package tube. Since multiple switch electrodes A and B are connected to form a circuit, products with partially non-conductive pins can also be identified, which greatly improves the identification accuracy of qualified products and helps to improve product quality.

[0060] When the test electrode is not in contact with the pin, it slides down to the lower limit position under the action of gravity. At this time, switch electrode A and switch electrode B are not in contact, and the entire series test circuit is disconnected. When the test electrode contacts the pin, the shaping plate continues to descend or causes the test electrode to shrink relatively. Switch electrode A and switch electrode B then come into contact, and one set of switches in the test circuit closes. Only after all the switches formed by switch electrodes A and B are closed will the entire circuit be connected. At this time, power can be applied to perform the test.

[0061] A second telescopic device 34 with a negative pressure suction head 31 at its movable end is fixedly installed on the other side of the temporary storage platform 10. The negative pressure suction head 31 is connected to the air inlet of a negative pressure vacuum pump. A material leakage groove 33 is opened on the base 1 between the temporary storage platform 10 and the second telescopic device 34. A second through hole 14 is opened at intervals along the extension direction of the guide rail 30 on the temporary storage platform 10. A baffle 38 is slidably connected inside the second through hole 14. A drive mechanism for driving the two baffles 38 to extend alternately is provided below the temporary storage platform 10 and between the two baffles 38.

[0062] When the encapsulation tube is deemed unqualified during the test, it can be adsorbed by a telescopic device with a negative pressure suction cup. The second telescopic contraction moves the encapsulation tube to the top of the discharge trough for release. When the encapsulation tube is deemed qualified during the test, the drive mechanism drives the baffle away from the guide rail to descend and the baffle close to the guide rail to rise. The product to be tested rolls out along the temporary storage platform, which can realize the discharge of qualified products and avoid the downward movement of the product to be tested, improve the positional accuracy of the product, realize the automatic separation of qualified and unqualified products, facilitate personnel to classify and collect products, and improve the overall production efficiency.

[0063] The aforementioned drive mechanism includes a motor 42 and a lever 41 with waist-shaped holes 39 at both ends. The output shaft of the motor 42 is fixedly connected to the middle of the side wall of the lever 41. The bottom side wall of the aforementioned baffle 38 is movably mounted on the inner wall of the waist-shaped hole 39 via a limiting post 40.

[0064] A limiting plate 36 is rotatably connected to the side of the temporary storage platform 10 away from the second telescopic device 34 via a hinge shaft 35, and a torsion spring 37 is fastened between the limiting plate 36 and the temporary storage platform 10.

[0065] The two test electrodes 26 inside the left accommodating cavity 501 and the right accommodating cavity 502 are connected in series, while the test electrodes 26 between different left accommodating cavities 501 and the test electrodes 26 inside different right accommodating cavities 502 are connected in parallel.

[0066] A cutting groove 29 is provided at the end of the support platform 11 away from the circuit encapsulation tube 3. A cutting blade 43 is fixedly installed above the cutting groove 29 and at the bottom of the lifting plate 6. A waste bin 27 with an opening at the top is provided below the cutting groove 29.

[0067] A first telescopic device 8 is fixedly installed on the top of the gantry frame 9. The output shaft of the first telescopic device 8 passes through the gantry frame 9 and is fixedly connected to the lifting plate 6.

[0068] A second guide slide rod 16 is provided between the lifting plate 6 and the shaping plate 17. The upper end of the second guide slide rod 16 can pass through the lifting plate 6 and be fixedly connected to a stop block 4. The lower end of the second guide slide rod 16 is fixedly connected to the shaping plate 17.

[0069] A first guide slide rod 7 is provided on the top of the aforementioned lifting plate 6 and symmetrically about the axis of the telescopic device 8. A through hole 2 is provided on the top of the aforementioned gantry frame 9 for sliding connection of the first guide slide rod 7.

[0070] A spring 15 is located between the lifting plate 6 and the shaping plate 17 and is fitted on the outer wall of the second guide slide rod 16.

[0071] The heights of several of the above-mentioned shaping plates 17 are set at equal intervals.

[0072] A limiting bolt 21 is threadedly connected to the opposite side of the two single-arc shaping claws 18 and to the bottom of the shaping plate 17, and a limiting nut 22 is threadedly connected to the outer wall of the limiting bolt 21.

[0073] The aforementioned test electrode 26, switch electrode A24, and switch electrode B25 are all connected to a power supply.

[0074] Several support legs 13 are provided at the bottom of the aforementioned support platform 11.

[0075] The aforementioned negative pressure suction head 31 is connected to a negative pressure pump.

[0076] The aforementioned motor 42 is located at the bottom of the base 1, and the aforementioned baffle 38 can extend through the base 1 and out of the second through hole 14.

[0077] Working principle:

[0078] In use, the circuit package tube is fed by a vibratory feeder. When the circuit package tube under test is not pushed out, the limiting plate is subjected to the torsion force of the torsion spring and is in a vertical state. The vibration of the vibratory feeder is transmitted to the guide rail. Combined with the height setting of the limiting plate, if the pins of the circuit package tube under test are not horizontal, they will be lifted by the limiting plate. Combined with the principle of the lowest energy state in physics, the lifted limiting plate will be vibrated and gradually rotate until the two pins are horizontal, thus playing the function of unloading.

[0079] The second telescopic device pushes out the circuit package tube, with the roots of the two pins of the circuit package tube placed horizontally on the surface of the support platform. The first telescopic device is activated to lower the lifting plate. First, a group of shaping plates located at the root uses the gap formed by the single-arc shaping claw and the double-arc shaping claw to limit and shape the root of the pin until the test electrode contacts the pin. The displacement of this group of shaping plates ends after the test electrode contacts the pin. Then, another group adjacent to the root limits and shapes the adjacent part of the pin root until the displacement of this group ends after the test electrode contacts the pin. This process is repeated until all the shaping plates reach the working state, at which point the shaping is completed.

[0080] The test electrode contacts the pin, allowing energization to be applied to the test electrode to perform an energization test on the pin. Simultaneously, a cutter is provided to cut the shaped pin, ensuring the pin length. Additionally, a waste bin and a rubber sheet are included. The rubber sheet prevents the pin from popping out during cutting, and the waste bin collects the waste pin material after cutting.

[0081] When the test electrode is not in contact with the pin, it slides down to the lower limit position under the action of gravity. At this time, switch electrode A and switch electrode B are not in contact, and the entire series test circuit is disconnected. When the test electrode contacts the pin, the shaping plate continues to descend or causes the test electrode to shrink relatively. Switch electrode A and switch electrode B then come into contact, and one set of switches in the test circuit closes. Only after all the switches formed by switch electrodes A and B are closed will the entire circuit be connected. At this time, power can be applied to perform the test.

[0082] After the test, if the circuit under test package tube is powered on and passes the test, the second telescopic device will pull the circuit under test package tube back and place it in its original position on the guide rail. At this time, the motor will start and drive the lever to rotate. The lever will pull down the left baffle and roll the qualified product along the guide rail. At the same time, the right baffle will move up to prevent the untested circuit under test package tube from rolling down. If it fails the test, the second telescopic device will pull the circuit under test package tube to the leakage trough and drop it through the leakage trough to achieve sorting.

[0083] When using the aforementioned integrated circuit testing and sorting device, the two pins of the circuit package transistor are respectively gathered inside the left and right accommodating cavities. This not only reshapes pins with different degrees of deformation and improves the pin position accuracy, but also pushes the test electrodes upward, so that multiple paired switch electrodes A and B are in contact and connected between the two pins to form a circuit, thus realizing the electrical testing of the circuit package transistor. Since multiple switch electrodes A and B must be connected to form a circuit, the reliability of the electrical test is guaranteed. It can also identify products with partially non-conductive pins, greatly improving the identification accuracy of qualified products and helping to improve product quality.

[0084] Furthermore, when the encapsulation tube is determined to be unqualified, the circuit encapsulation tube can be adsorbed by a telescopic device with a negative pressure suction cup. The second telescopic contraction moves the circuit encapsulation tube to the top of the discharge trough for release. When the encapsulation tube is determined to be qualified, the drive mechanism drives the baffle away from the guide rail to descend and the baffle close to the guide rail to rise. The product to be tested rolls out along the temporary storage platform, which can realize the discharge of qualified products and avoid the downward movement of the product to be tested, improve the positional accuracy of the product, realize the automatic separation of qualified and unqualified products, facilitate personnel to classify and collect products, and improve the overall production efficiency.

[0085] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. An integrated circuit testing and sorting device, comprising: The base (1) and the vibratory plate (28) installed on one side of the top of the base (1) are characterized by a guide rail (30) provided at the discharge port of the vibratory plate (28). The characteristic is that a temporary storage platform (10) is provided at the end of the guide rail (30) away from the vibratory plate (28). A gantry (9) is provided on one side of the temporary storage platform (10). A support platform (11) with several clearance slots (12) is provided below the gantry (9), and the clearance slots (12) are spaced apart along the length of the support platform (11). A lifting plate (6) with several shaping plates (17) movably connected to the bottom is provided above the support platform (11). The shaping plates (17) corresponding to the clearance slots (12) are arranged in a stepped manner along the direction away from the circuit encapsulation tube (3), and the shaping plate (17) closest to the circuit encapsulation tube (3) has the lowest initial position. A single-arc shaping claw (18) is provided at each of the bottom ends of the shaping plate (17), and a double-arc shaping claw (19) is provided between the two oppositely arranged single-arc shaping claws (18), thereby forming a left receiving cavity (501) and a right receiving cavity (502) between the roots of the single-arc shaping claw (18) and the double-arc shaping claw (19); a test electrode with an insulating guide rod (23) fixedly connected to the top is provided inside the left receiving cavity (501) and the right receiving cavity (502). (26), and the insulating guide rod (23) is slidably connected to the shaping plate (17). A switching electrode A (24) and a switching electrode B (25) are arranged opposite to each other between the shaping plate (17) and the test electrode (26). The switching electrode A (24) is fixedly connected to the shaping plate (17). The switching electrode B (25) is fixedly installed on the top of the test electrode (26). The test electrode (26) is electrically connected to the paired switching electrodes A (24) and B (25). During the descent of the lifting plate, the connecting plate drives the single-arc-surface shaping claw and the double-arc-surface shaping claw to embed into the clearance groove of the support platform. During the descent of the single-arc-surface shaping claw and the double-arc-surface shaping claw, the two pins of the circuit package tube are respectively gathered inside the left accommodating cavity and the right accommodating cavity. Then the pins push the test electrode upward, so that multiple pairs of switch electrodes A and switch electrodes B are in contact and connected between the two pins to form a path.

2. The integrated circuit testing and sorting device according to claim 1, characterized in that: A second telescopic device (34) with a negative pressure suction head (31) is fixedly installed on the other side of the temporary storage platform (10). The negative pressure suction head (31) is connected to the air inlet of a negative pressure vacuum pump. A material leakage groove (33) is opened on the base (1) between the temporary storage platform (10) and the second telescopic device (34). A second through hole (14) is opened at intervals along the extension direction of the guide rail (30) on the temporary storage platform (10). A baffle (38) is slidably connected inside the second through hole (14). A drive mechanism for driving the two baffles (38) to extend alternately is provided below the temporary storage platform (10) and between the two baffles (38).

3. The integrated circuit testing and sorting device according to claim 2, characterized in that: The drive mechanism includes: a motor (42) and a lever (41) with waist-shaped holes (39) at both ends. The output shaft of the motor (42) is fixedly connected to the middle of the side wall of the lever (41). The bottom side wall of the baffle (38) is movably installed on the inner wall of the waist-shaped hole (39) by a limiting post (40).

4. The integrated circuit testing and sorting device according to claim 3, characterized in that: A limiting plate (36) is rotatably connected to the side of the temporary storage platform (10) away from the second telescopic device (34) via a hinge shaft (35), and a torsion spring (37) is fastened between the limiting plate (36) and the temporary storage platform (10).

5. The integrated circuit testing and sorting device according to claim 1 or 2, characterized in that: The two test electrodes (26) inside the left accommodating cavity (501) and the right accommodating cavity (502) are connected in series, while the test electrodes (26) between different left accommodating cavities (501) and the test electrodes (26) inside different right accommodating cavities (502) are connected in parallel.

6. The integrated circuit testing and sorting device according to claim 1 or 2, characterized in that: A cutting groove (29) is provided at one end of the support platform (11) away from the circuit encapsulation tube (3), and a cutting blade (43) is fixedly installed above the cutting groove (29) and at the bottom of the lifting plate (6).

7. The integrated circuit testing and sorting device according to claim 6, characterized in that: A waste bin (27) with an opening at the top is provided below the blade groove (29).

8. The integrated circuit testing and sorting device according to claim 1, characterized in that: A first telescopic device (8) is fixedly installed on the top of the gantry (9), and the output shaft of the first telescopic device (8) passes through the gantry (9) and is fixedly connected to the lifting plate (6).

9. The integrated circuit testing and sorting device according to claim 1, characterized in that: A second guide slide rod (16) is provided between the lifting plate (6) and the shaping plate (17), and the upper end of the second guide slide rod (16) can pass through the lifting plate (6) and be fixedly connected to a stop block (4), and the lower end of the second guide slide rod (16) is fixedly connected to the shaping plate (17).

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