A leveling device and leveling method for IC carrier board after cutting

Abstract

This invention relates to the field of IC substrate processing technology, and in particular to a leveling device and method for IC substrates after cutting. The device further includes: a leveling box, fixed inside an opening at the top of a worktable; a leveling block, mounted on the top of the worktable via a lifting drive, the leveling block being pressed downwards into the leveling box to level the IC substrate; and a flattening mechanism, detachably installed between the leveling box and the leveling block. The flattening mechanism includes an upper pushing member installed at the bottom of the leveling block and a lower pushing member installed inside the leveling box. This device, through the flattening mechanism, allows the engaging upper and lower pushing members to clamp the IC substrate vertically, thereby facilitating the flattening of any potentially warped edges of the IC substrate before leveling, and thus enabling leveling of the IC substrate while it is flat.

Description

Technical Field

[0001] This invention relates to the field of IC substrate processing, and more particularly to a leveling device and a leveling method for IC substrates after cutting. Background Technology

[0002] IC card packaging frame refers to a key special base material used for packaging integrated circuit card modules. It mainly serves to protect the chip and act as an interface between the integrated circuit chip and the outside world. It is in the form of a strip and is usually golden yellow.

[0003] Existing technologies disclose some invention patents related to IC carrier boards. Chinese utility model patent application number CN202122675229.3 discloses a leveling device for IC carrier boards, relating to the field of electronic component manufacturing technology. The device includes a leveling plate with an internal cavity. Threaded rods are rotatably connected to the front of both sides of the inner wall of the cavity. A first rotating rod is fixedly connected to the opposite ends of the two threaded rods. A first sector gear is fixedly connected to the left side of the first rotating rod wall. A second sector gear is meshed with the lower surface of the first sector gear. Moving blocks are threadedly connected to the middle of the walls of both threaded rods. Racks are fixedly connected to the upper surfaces of both moving blocks.

[0004] In the existing technology, a pressure plate is used to level the IC carrier board. However, after the IC carrier board is processed and cut into strips, the edges of the carrier board will warp due to stress differences caused by the different designs of various parts of the board. When the IC carrier board is leveled directly by the pressure plate, the warping of the edges will cause the IC carrier board to be squeezed, resulting in uneven edge thickness, which will affect the leveling effect of the IC carrier board. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a leveling device and method for IC carrier boards after cutting.

[0006] In a first aspect, the present invention provides a leveling device for IC carrier boards after cutting, comprising a worktable and a support platform fixed to the top of the worktable, and further comprising:

[0007] The leveling box is fixed inside the opening provided on the top of the workbench;

[0008] A leveling block is installed on the top of the worktable via a lifting drive component. The leveling block is pressed downward into the interior of the leveling box to level the IC carrier board.

[0009] A flattening mechanism is detachably installed between the leveling box and the leveling block. The flattening mechanism includes an upper pushing member installed at the bottom of the leveling block and a lower pushing member installed inside the leveling box. After the upper pushing member is pushed downward, it engages with the lower pushing member. The engaged upper pushing member and the lower pushing member clamp the IC carrier plate from top to bottom. The IC carrier plate with warped edges is flattened by moving the upper pushing member and the lower pushing member.

[0010] A flatness testing device is installed at the bottom of the workbench. After the IC carrier is flattened, the flatness testing device extends into the interior of the leveling box to test the flatness of the IC carrier.

[0011] The operator places the IC carrier board to be leveled inside the leveling box, and then activates the lifting drive mechanism, which includes a first cylinder. The output shaft of the first cylinder passes through the support platform and is fixedly connected to the leveling block. After the first cylinder is activated, it pushes the leveling block downwards via a telescopic rod. The leveling block drives the upper pushing component downwards, and the upper pushing component moves downwards and approaches the lower pushing component, engaging with it. The engaged upper and lower pushing components can clamp the IC carrier board vertically. Subsequently, the leveling block continues to move downwards, pushing the engaging body of the upper and lower pushing components towards both ends of the IC carrier board. The device moves to flatten the warped edges of the IC substrate, thus facilitating the flattening of any potentially warped edges before the IC substrate is leveled. This prevents the IC substrate edges from folding during leveling. After the IC substrate is flattened, a flatness detection device is activated to check the surface flatness of the IC substrate. The flatness check of the IC substrate is completed after the surface flatness is checked.

[0012] Preferably, the flatness testing component includes:

[0013] The second cylinder is fixed to the bottom of the workbench surface by a mounting bracket;

[0014] A flatness tester is fixed to the end of the telescopic rod of the second cylinder by a pusher frame. The flatness tester extends into the interior of the leveling box through the feeding port opened on the side wall of the leveling box to level the IC carrier board.

[0015] After the flattening mechanism completes the flattening of the IC carrier board, the second cylinder is activated. The second cylinder pushes the pusher frame to move through the telescopic rod, so that the pusher frame extends into the interior of the leveling box through the feeding port. The pusher frame drives the flatness tester into the interior of the leveling box, so that the flatness tester can detect the flatness of the surface of the IC carrier board inside the leveling box. After the flattened IC carrier board is tested and found to be flat, the IC carrier board is removed to complete the leveling operation.

[0016] Preferred options also include:

[0017] The second electric push rod is fixed to the top of the push frame by a bracket, and the telescopic end of the second electric push rod passes through the push frame and is fixed with a toggle plate.

[0018] The second collection box is fixed below the workbench surface and collects the IC carrier boards discharged along the discharge port.

[0019] When the second electric push rod telescopic rod is in the retracted state, the bottom of the actuating plate is higher than the bottom of the flatness tester;

[0020] After the flatness tester detects that the IC carrier board surface is flat, the second electric push rod is activated. The second electric push rod pushes the actuating plate downward through the telescopic rod, so that the bottom of the actuating plate contacts the bottom of the inner wall of the leveling box. Thus, during the process of the second cylinder driving the push frame to reset, the actuating plate drives the leveled IC carrier board to move, so that the IC carrier board is pushed out along the discharge port. After the leveled IC carrier board is pushed out along the discharge port, it is collected by the second collection box. This automatically collects the leveled IC carrier board without the need for the operator to manually remove the leveled IC carrier board, thereby improving the working efficiency of the leveling device.

[0021] Secondly, a leveling method is provided for a leveling device after IC carrier board cutting, wherein a controller is fixed on the top of the worktable, and the leveling method includes the following steps:

[0022] Obtain first request information, which is generated by the second pressure sensor after obtaining first pressure information;

[0023] Generate first control information and second control information;

[0024] The first control information is sent to the first cylinder to control the first cylinder to reset after a specified time interval, and the second control information is sent to the positioning component to control the positioning component to position the limit sleeve.

[0025] Obtain second request information, which is generated by the first cylinder after the telescopic rod is reset;

[0026] Generate third-party control information;

[0027] The third control information is sent to the flatness detection device to control the flatness detection device to start the flatness detection of the IC carrier board;

[0028] In this process, when the insertion sleeve slides past and presses against the second pressure sensor, the second pressure sensor acquires first pressure information. Subsequently, the second pressure sensor generates first request information and sends it to the controller. After receiving the first request information, the controller generates first control information and second control information. The controller sends the first control information to the first cylinder to control the first cylinder to reset after a specified time interval. This allows the first cylinder to drive the leveling block to level the IC carrier board for a period of time before resetting. The controller then sends the second control information to the positioning component to control the positioning component to position the limiting sleeve. This ensures that the position of the limiting sleeve is limited by the positioning component after the leveling block resets, preventing the positioning component from resetting under the elastic force of the first spring and obstructing the flatness detection component from detecting the flatness of the IC carrier board. After resetting, the first cylinder generates the second request information and sends it to the controller. After receiving the second request information, the controller generates third control information and sends it to the flatness detection component to control the flatness detection component to start detecting the flatness of the IC carrier board, thereby detecting the flatness of the leveled IC carrier board.

[0029] Preferred options also include:

[0030] Obtain third request information, which is generated by the flatness detection component after obtaining flatness information;

[0031] Generate fourth control information;

[0032] The fourth control information is sent to the second electric actuator to control the second electric actuator to start pushing out the toggle plate;

[0033] Obtain fourth request information, which is generated by the flatness detection component after obtaining unevenness information;

[0034] Generate the fifth control information;

[0035] The fifth control information is sent to the first cylinder to control the first cylinder to start and push out the leveling block to perform secondary leveling of the IC carrier board;

[0036] In this system, after detecting that the surface of the IC carrier board is flat, the flatness detection component generates a third request message and sends it to the controller. After receiving the third request message, the controller generates a fourth control message and sends it to the second electric push rod to control the second electric push rod to start pushing out the toggle plate. This allows the toggle plate to drive the IC carrier board to be collected along the feeding port when the second cylinder is reset. After detecting that the surface of the IC carrier board is uneven, the flatness detection component generates a fourth request message and sends it to the controller. After receiving the fourth request message, the controller generates a fifth control message and sends it to the first cylinder to control the first cylinder to start pushing out the leveling block to perform secondary leveling of the IC carrier board. After the IC carrier board is leveled, it is pushed out for collection.

[0037] Preferred options also include:

[0038] Obtain fifth request information, which is generated by the first pressure sensor after acquiring the second pressure information;

[0039] Generate the sixth control information;

[0040] The sixth control information is sent to the electromagnetic component to control the electromagnetic component to turn on the power;

[0041] Obtain the sixth request information, which is generated by the second pressure sensor after obtaining the first pressure information;

[0042] Generate the seventh control information;

[0043] The seventh control information is sent to the electromagnetic component to control the electromagnetic component to shut down its power supply;

[0044] Obtain the seventh request information, which is generated by the second cylinder after reset;

[0045] Generate the eighth control information;

[0046] The eighth control information is sent to the positioning component to control the positioning component to reset and cancel the positioning of the limit sleeve;

[0047] In this process, as the leveling block moves downward, the insertion block moves downward synchronously. When the insertion block inserts into the insertion sleeve, it presses against the first pressure sensor, causing the first pressure sensor to acquire second pressure information. Subsequently, the first pressure sensor generates a fifth request message and sends it to the controller. After receiving the fifth request message, the controller generates a sixth control message and sends it to the electromagnetic component to control it to be energized. When energized, the electromagnetic component generates strong magnetism, causing it to exert a magnetic attraction force on the elastic limiting component, releasing the elastic limiting component's limitation and limiting the limiting block, thus limiting the... The positioning block engages with the limiting groove, limiting the insertion of the plug-in block and the plug-in sleeve. When the plug-in sleeve slides past the second pressure sensor and presses against it, the second pressure sensor acquires the first pressure information. Subsequently, the second pressure sensor generates a sixth request information and sends it to the controller. After receiving the sixth request information, the controller generates a seventh control information and sends it to the electromagnetic component to control it to shut off, thus resetting the limiting block and the elastic limiting component. This allows the plug-in sleeve and the plug-in block to disengage, and the plug-in sleeve can return to its limiting position after resetting.

[0048] Compared with the prior art, the present invention has the following beneficial effects:

[0049] 1. The present invention, through the setting of the flattening mechanism, enables the upper and lower pushing members to clamp the IC carrier board from above and below. Then, the leveling block continues to move downward and pushes the locking body of the upper and lower pushing members to move towards both ends of the IC carrier board, thereby pushing and flattening the warped edges of the IC carrier board. This is beneficial for flattening the potentially warped edges of the IC carrier board before leveling, thus enabling the IC carrier board to be leveled in a flattened state. This helps to avoid the IC carrier board edges from folding when leveling in a warped state.

[0050] 2. The present invention provides support for both ends of the IC carrier board by setting the second pressure plate, so that the two ends of the IC carrier board will not tilt due to lack of support after placement. Since the IC carrier board to be leveled is placed horizontally, it helps to avoid the situation where the first pressure plate and the flattening roller will bend when clamping the IC carrier board due to tilting, thus affecting the flattening effect of the IC carrier board.

[0051] 3. The present invention, through the setting of limiting blocks and limiting grooves, allows the adsorption limiting blocks to move and engage with the limiting grooves under the magnetic attraction of the electromagnetic components, and the adsorption pins to move upwards and disengage from the slots. This ensures that when the leveling block continues to move downwards, the insertion block and the insertion sleeve remain fully engaged, thereby maintaining the squeezing and clamping of the flattening roller and the first pressure plate on the IC carrier board. This helps to prevent the clamping of the flattening roller and the first pressure plate from loosening after the flipping rod flips, thus reducing the flattening effect of the flattening roller and the first pressure plate on the IC carrier board. Attached Figure Description

[0052] Figure 1 This is a schematic diagram of the leveling method of the present invention.

[0053] Figure 2 This is a schematic diagram of the overall structure of the leveling device of the present invention.

[0054] Figure 3 This is a schematic cross-sectional view of the leveling device of the present invention.

[0055] Figure 4 For the present invention Figure 3 A magnified structural diagram of point A in the middle.

[0056] Figure 5 For the present invention Figure 3 A magnified structural diagram at point B in the middle.

[0057] Figure 6 This is a further cross-sectional structural diagram of the leveling device of the present invention.

[0058] Figure 7 For the present invention Figure 6 A magnified structural diagram at point C.

[0059] Figure 8 For the present invention Figure 7 A magnified structural diagram at point D.

[0060] Figure 9 For the present invention Figure 6 A magnified structural diagram at point E in the middle.

[0061] Figure 10 This is a cross-sectional view of the leveling device of the present invention from another angle.

[0062] Figure 11 For the present invention Figure 10 A magnified structural diagram at point F in the middle.

[0063] In the diagram: 1. Workbench; 2. Support platform; 3. Leveling box; 4. First cylinder; 5. Leveling block; 6. Tilting rod; 7. Flattening roller; 8. Rotating disk; 9. Insertion block; 10. First pressing plate; 11. Insertion sleeve; 12. Limiting sleeve; 13. First spring; 14. First collection box; 15. Waist groove; 16. First electric push rod; 17. Sliding frame; 18. Through groove; 19. Limiting block; 20. Second spring; 21. Limiting... 22. Slot; 23. First pressure sensor; 24. Electromagnetic component; 25. Groove; 26. Third spring; 27. Pin; 28. Slot; 29. ​​Fourth spring; 30. Slider; 31. Second pressure plate; 32. Second cylinder; 33. Push frame; 34. Second electric push rod; 35. Actuating plate; 36. Second collection box; 37. Discharge port; 38. Flatness tester; 39. Second pressure sensor; 30. Controller. Detailed Implementation

[0064] The following description is intended to disclose the invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art.

[0065] like Figures 2 to 11 The illustrated leveling device for IC carrier boards after cutting includes a worktable 1 and a support platform 2 fixed to the top of the worktable 1, and further includes:

[0066] The leveling box 3 is fixed inside the opening provided on the top of the workbench 1;

[0067] The leveling block 5 is installed on the top of the workbench 1 via a lifting drive component. The leveling block 5 is pressed down into the interior of the leveling box 3 to level the IC carrier board.

[0068] The flattening mechanism is detachably installed between the leveling box 3 and the leveling block 5. The flattening mechanism includes an upper pushing member installed at the bottom of the leveling block 5 and a lower pushing member installed inside the leveling box 3. After the upper pushing member is pushed down, it engages with the lower pushing member. The engaged upper and lower pushing members clamp the IC carrier board from above and below. The IC carrier board with warped edges is flattened by the moving upper and lower pushing members.

[0069] The flatness testing component is installed at the bottom of the workbench 1. After the IC carrier is flattened, the flatness testing component extends into the flattening box 3 to test the flatness of the IC carrier.

[0070] In existing technologies, pressure plates are used to level IC carrier boards. However, after the IC carrier board is cut into strips, the edges may warp due to stress differences caused by variations in the design of different parts of the board. When the IC carrier board is directly leveled by pressure plates, the warped edges are squeezed, resulting in uneven edge thickness and affecting the leveling effect. This embodiment of the present invention can solve the above problems. The specific implementation method is as follows: The operator places the IC carrier board to be leveled inside the leveling box 3, and then activates the lifting drive, which includes a first cylinder 4. The output shaft of the first cylinder 4 passes through the support platform 2 and is fixedly connected to the leveling block 5. After the first cylinder 4 is activated, it pushes the leveling block 5 downward through the telescopic rod. The leveling block 5 drives the upper pushing component downward. The upper pusher moves downwards and approaches the lower pusher, engaging with it. The engaged upper and lower pushers clamp the IC carrier board. Then, the leveling block 5 continues to move downwards, pushing the engaging parts of the upper and lower pushers towards both ends of the IC carrier board. This flattens the warped edges of the IC carrier board, allowing it to be flattened before leveling. This helps to prevent the edges of the IC carrier board from folding during leveling. After the IC carrier board is flattened, the flatness detection device is activated to detect the surface flatness of the IC carrier board. After the surface flatness of the IC carrier board is detected, the leveling of the IC carrier board is completed.

[0071] Specifically, the flatness inspection items include:

[0072] The second cylinder 31 is fixed to the bottom of the workbench 1 by a mounting bracket;

[0073] The flatness tester 37 is fixed to the end of the telescopic rod of the second cylinder 31 by the push frame 32. The flatness tester 37 extends into the interior of the leveling box 3 through the feeding port 36 opened on the side wall of the leveling box 3 to detect the flatness of the IC carrier board.

[0074] In this process, after the flattening mechanism completes the flattening of the IC carrier board, the second cylinder 31 is activated. The second cylinder 31 pushes the pusher 32 to move through the telescopic rod, so that the pusher 32 extends into the interior of the leveling box 3 through the unloading port 36. The pusher 32 drives the flatness tester 37 into the interior of the leveling box 3, so that the flatness tester 37 performs flatness detection on the surface of the IC carrier board inside the leveling box 3, thereby performing flatness detection on the IC carrier board after the flattening is completed. After the flatness of the IC carrier board surface is detected, the IC carrier board is taken out to complete the flattening operation.

[0075] Furthermore, it also includes:

[0076] The second electric push rod 33 is fixed to the top of the push frame 32 by a bracket, and the telescopic end of the second electric push rod 33 passes through the push frame 32 and is fixed with a toggle plate 34.

[0077] The second collection box 35 is fixed below the table surface of the workbench 1. The second collection box 35 collects the IC carrier boards discharged along the discharge port 36.

[0078] When the second electric push rod 33 is in the retracted state, the bottom of the actuating plate 34 is higher than the bottom of the flatness tester 37.

[0079] In this process, after the flatness tester 37 detects that the surface of the IC carrier board is flat, the second electric push rod 33 is activated. The second electric push rod 33 pushes the actuating plate 34 downward through the telescopic rod, so that the bottom of the actuating plate 34 contacts the bottom of the inner wall of the leveling box 3. Thus, during the process of the second cylinder 31 driving the push frame 32 to reset, the actuating plate 34 drives the leveled IC carrier board to move, so that the IC carrier board is pushed out along the discharge port 36. After the leveled IC carrier board is pushed out along the discharge port 36, it is collected by the second collection box 35. Thus, the leveled IC carrier board is automatically collected without the need for the operator to manually remove the leveled IC carrier board, which helps to improve the working efficiency of the leveling device.

[0080] Specifically, the upward-pushing components include:

[0081] The flipping rods 6 are arranged in pairs, with two sets symmetrically arranged. The flipping rods 6 in the same set are symmetrically rotated and installed on both sides of the leveling block 5. A limit component is provided between the two sets of flipping rods 6 and the leveling block 5. The limit component limits the initial position of the flipping rods 6 to an inclined state.

[0082] There are two flattening rollers 7, which are rotatably installed between the two flipping rods 6 in the same group;

[0083] The plug-in block 9 is set corresponding to the flip rod 6 and is rotatably installed on the side wall of the flip rod 6 via the rotating disk 8. The plug-in block 9 and the lower pusher are detachably plugged in and engaged.

[0084] When the leveling block 5 moves downward, it causes the flipping rod 6 to move downward. The initial state of the flipping rod 6 is restricted by a limiting component, which includes a fixed rod and a limiting platform. The limiting platform is fixed to the side wall of the leveling block 5, and the fixed rod is fixed to the outer wall of the rotating ring at the top of the flipping rod 6. The fixed rod is locked onto the bottom surface of the limiting platform, so that the two flipping rods 6 on the same side are tilted in a V-shape and will not fall downward under the action of gravity. The insertion block 9 at the bottom of the flipping rod 6 drives the rotating disk 8 to rotate under the action of gravity, so that the insertion block 9 remains downward under the action of the rotating disk 8. The downward pushing component is located directly below the insertion block 9. After the insertion block 9 moves downward, it inserts the lower pusher, so that the lower pusher and the insertion block 9 are engaged. After the lower pusher and the insertion block 9 are engaged, the flattening roller 7 supports the IC carrier plate from the top, and the lower pusher supports the IC carrier plate from below, so that the IC carrier plate is supported from both the top and bottom. Then, the leveling block 5 continues to move downward and pushes the two sets of flipping rods 6 to flip in opposite directions, so that the flipping rods 6 drive the insertion block 9 to move in opposite directions, so that the flattening roller 7 and the lower pusher move in opposite directions to flatten the IC carrier plate. This is beneficial to flatten any curled edges of the IC carrier plate before leveling the IC carrier plate.

[0085] Specifically, the downward-pushing component includes:

[0086] The first collection box 14 is symmetrically fixed at both ends of the leveling box 3;

[0087] The plug-in sleeves 11 are arranged in pairs, with two sets symmetrically arranged, and are slidably installed inside the leveling box 3. A first pressure plate 10 is fixed between the plug-in sleeves 11 in the same group.

[0088] The limiting sleeve 12 is set in correspondence with the plug-in sleeve 11 and is fixedly connected to the corresponding plug-in sleeve 11. The two sets of limiting sleeves 12 are elastically connected to the corresponding first collection box 14 through the first spring 13 respectively.

[0089] The second pressure sensor 38 is fixed to the bottom of the inner wall of the leveling box 3. After the limiting sleeve 12 slides away from the IC carrier, it squeezes and triggers the second pressure sensor 38.

[0090] The positioning component is installed at the bottom of the leveling box 3 and positions the limit sleeve 12 when the second pressure sensor 38 is triggered by the limit sleeve 12.

[0091] In this process, the insertion block 9 moves downward and inserts into the insertion sleeve 11. Then, when the flipping rod 6 is pushed and flipped, the bottom of the flipping rod 6 drives the insertion block 9 to move, which in turn drives the insertion sleeve 11 to move. This causes the insertion sleeve 11 to drive the limiting sleeve 12 to move, and the limiting sleeve 12 to compress the first spring 13. After the first spring 13 is compressed, it retracts into the first collection box 14. The insertion sleeve 11 then drives the first pressing plate 10 to move, so that the first pressing plate 10 and the pressing roller 7 are aligned vertically to clamp the upper and lower surfaces of the IC carrier board. During the synchronous movement of the first pressing plate 10 and the flattening roller 7, the IC carrier plate is flattened. This helps to flatten any curled edges on the IC carrier plate before leveling. After the first pressing plate 10 and the flattening roller 7 separate from the IC carrier plate, the limiting sleeve 12 presses the second pressure sensor 38, indicating that the first pressing plate 10 and the flattening roller 7 have completely separated from the IC carrier plate. At this time, the positioning component is activated. The positioning component includes a sliding frame 17, a waist groove 15, and a first electric push rod 16. The sliding frame 17 is slidably connected to... Attached to the bottom of the leveling box 3, the first electric push rod 16 is fixed to the side wall of the sliding frame 17. The waist groove 15 is opened through the bottom of the leveling box 3. After the first electric push rod 16 is activated, the telescopic rod passes through the waist groove 15 and inserts into the inside of the limiting sleeve 12, thereby limiting the limiting sleeve 12 and preventing it from being pushed towards the center of the leveling box 3 by the elastic action of the first spring 13. Subsequently, the downward-moving leveling block 5 presses the IC carrier to level the IC carrier. After a period of time, the first cylinder 4 drives the leveling block 5 to return to its original position. When the plug-in block 9 disengages from the plug-in sleeve 11, the flatness detection device is then activated to perform a flatness test on the IC carrier board. If the test is passed, the board is unloaded. If the test is failed, the first cylinder 4 is activated again to push the leveling block 5 downwards for re-leveling until the flatness detection device detects that the surface of the IC carrier board is flat. During this process, the limiting sleeve 12 is always limited, which helps to avoid the limiting sleeve 12 from obstructing the flatness detection device's detection and the re-leveling of the leveling block 5, thereby improving the leveling efficiency of the IC carrier board.

[0092] Furthermore, it also includes:

[0093] Slider 29, two in a group, are provided in two groups and are slidably installed on the bottom of the inner wall of the leveling box 3. A second pressure plate 30 is fixed between sliders 29 in the same group, and the second pressure plate 30 supports the bottom of both ends of the IC carrier board.

[0094] The slider 29 in the same group is elastically connected to the first collection box 14 by a fourth spring 28;

[0095] The second pressure plate 30 supports the bottom ends of the IC carrier board, preventing it from tilting due to lack of support after placement. This ensures the IC carrier board is placed horizontally, avoiding tilting that could cause the first pressure plate 10 and the flattening roller 7 to bend during clamping, thus affecting the flattening effect. As the first pressure plate 10 moves towards the ends of the IC carrier board, it pushes the second pressure plate 30, which in turn moves the slider 29. The slider 29 compresses the fourth spring 28, causing it to retract into the first collection box 14. This allows the second pressure plate 30 to simultaneously detach from the IC carrier board under the push of the first pressure plate 10, facilitating subsequent flattening. After the first pressure plate 10 resets, the second pressure plate 30 resets under the elastic force of the fourth spring 28.

[0096] Furthermore, it also includes:

[0097] The through slot 18 corresponds to the number of plug-in blocks 9 and is formed through the interior of the plug-in block 9;

[0098] Limiting blocks 19, two of which are elastically connected and slidably connected inside the through groove 18;

[0099] Limiting grooves 21 are symmetrically opened on the inner wall of each plug-in sleeve 11, and the limiting grooves 21 are engaged and matched with the limiting blocks 19.

[0100] A groove 24 is formed at the bottom of each plug sleeve 11. Electromagnetic components 23 are fixedly embedded inside the groove 24 and on both sides of the plug sleeve 11. An elastic limiting component is provided between the plug sleeve 11 and the bottom of the leveling box 3.

[0101] The first pressure sensor 22 is set corresponding to the plug sleeve 11 and fixed inside the corresponding plug sleeve 11. The first pressure sensor 22 is triggered after the plug block 9 is engaged with the plug sleeve 11.

[0102] When the electromagnetic component 23 is energized, it releases the limit of the elastic limiting component through magnetic attraction. After the plug-in block 9 and the plug-in sleeve 11 are engaged, the electromagnetic component 23 drives the limiting block 19 to engage with the limiting groove 21 through magnetic attraction.

[0103] The plug-in block 9 has a through groove 18, and a limit block 19 is slidably connected inside the through groove 18. A second spring 20 is fixed between two limit blocks 19 in the same group. The middle part of the second spring 20 is fixedly connected to the middle part of the through groove 18. After the plug-in block 9 moves downward, it drives the limit block 19 to insert into the plug-in sleeve 11. At this time, the bottom of the plug-in sleeve 11 is limited to the bottom of the inner wall of the leveling box 3 by an elastic limiter. The elastic limiter includes a third spring 25, a pin 26, and a slot 27. The third spring 25 is fixed to the bottom of the electromagnetic component 23 inside the groove 24. The electromagnetic component 23 is an electromagnet and an energized switch. The pin 26 is fixed to the bottom of the slot 27. The slot 27 is located at the bottom of the third spring 25 and is opened on the bottom of the inner wall of the leveling box 3. The bottom of the pin 26 is inserted into the slot 27. As the first cylinder 4 continues to move downward, the plug-in sleeve 11 is limited and cannot push the plug-in block 9 connected to the plug-in sleeve 11, thus preventing the flipping rod 6 from flipping. When the plug-in block 9 is inserted into the lowest part of the plug-in sleeve 11, the bottom of the plug-in block 9 presses against the first pressure sensor 22, so that the first pressure sensor 22 receives the information that the plug-in block 9 has been fully inserted. Then the electromagnetic component 23 is energized. After the electromagnetic component 23 is energized, it generates a magnetic attraction force, and both the limiting block 19 and the pin 26 are magnetized. Made of metal that attracts iron, under the magnetic attraction of the electromagnetic component 23, the adsorption limiting block 19 moves and engages with the limiting groove 21, and the adsorption pin 26 moves upward and disengages from the slot 27. This ensures that when the leveling block 5 continues to move downward, the insertion block 9 and the insertion sleeve 11 remain fully engaged, thus maintaining the pressing and clamping of the flattening roller 7 and the first pressing plate 10 on the IC carrier. This helps prevent the clamping between the flattening roller 7 and the first pressing plate 10 from loosening after the flipping rod 6 flips, thus reducing the flattening effect of the flattening roller 7 and the first pressing plate 10 on the IC carrier. At this time, the pin 26 disengages from the slot 27. This allows the insertion sleeve 11 to be pushed, enabling the flattening roller 7 and the first flattening plate 10 to begin moving and flattening the IC carrier. When the second pressure sensor 38 is squeezed, the control electromagnetic component 23 is de-energized. After the electromagnetic component 23 is de-energized, the pin 26 is pushed downward under the action of the third spring 25, so that when the insertion sleeve 11 is reset, the pin 26 is reinserted into the slot 27. At the same time, the limiting block 19 is retracted into the through slot 18 under the elastic force of the second spring 20, so that the insertion block 9 can be smoothly disengaged from the insertion sleeve 11, and the first cylinder 4 can drive the leveling block 5 and the insertion block 9 to move upward and reset.

[0104] like Figure 1 The diagram illustrates a leveling method for a leveling device used after IC carrier board cutting. A controller 39 is fixed to the top of the worktable 1. The leveling method includes the following steps:

[0105] Obtain first request information, which is generated by the second pressure sensor 38 after obtaining first pressure information;

[0106] Generate first control information and second control information;

[0107] The first control information is sent to the first cylinder 4 to control the first cylinder 4 to reset after a specified time interval, and the second control information is sent to the positioning component to control the positioning component to position the limit sleeve 12.

[0108] Obtain the second request information, which is generated by the first cylinder 4 after the telescopic rod is reset;

[0109] Generate third-party control information;

[0110] The third control information is sent to the flatness detection device to control the flatness detection device to start the flatness detection of the IC carrier board;

[0111] When the insertion sleeve 11 slides past and presses the second pressure sensor 38, the second pressure sensor 38 acquires first pressure information. Subsequently, the second pressure sensor 38 generates first request information and sends it to the controller 39. Upon receiving the first request information, the controller 39 generates first control information and second control information. The controller 39 sends the first control information to the first cylinder 4 to control the first cylinder 4 to reset after a specified time interval. This causes the first cylinder 4 to drive the leveling block 5 to level the IC carrier board for a period of time before resetting. The controller 39 then sends the second control information... The system sends a message to the positioning component to control the positioning component to position the limiting sleeve 12, so that the position of the limiting sleeve 12 is limited by the positioning component after the leveling block 5 is reset. This prevents the positioning component from resetting under the elastic force of the first spring 13 and obstructing the flatness detection component from detecting the flatness of the IC carrier board. After resetting, the first cylinder 4 generates a second request message and sends the second request message to the controller 39. After receiving the second request message, the controller 39 generates a third control message and sends the third control message to the flatness detection component to control the flatness detection component to start the flatness detection of the IC carrier board, thereby detecting the flatness of the leveled IC carrier board.

[0112] Furthermore, it also includes:

[0113] Obtain the third request information, which is generated by the flatness testing component after obtaining the flatness information;

[0114] Generate fourth control information;

[0115] The fourth control information is sent to the second electric push rod 33 to control the second electric push rod 33 to start pushing out the toggle plate 34;

[0116] Obtain the fourth request information, which is generated by the flatness detection component after obtaining the unevenness information;

[0117] Generate the fifth control information;

[0118] The fifth control information is sent to the first cylinder 4 to control the first cylinder 4 to start pushing out the leveling block 5 to perform secondary leveling of the IC carrier board;

[0119] In this process, after detecting that the surface of the IC carrier board is flat, the flatness detection component generates a third request message and sends it to the controller 39. After receiving the third request message, the controller 39 generates a fourth control message and sends it to the second electric push rod 33 to control the second electric push rod 33 to start pushing out the toggle plate 34. This allows the toggle plate 34 to drive the IC carrier board to be collected along the discharge port 36 when the second cylinder 31 is reset. After detecting that the surface of the IC carrier board is uneven, the flatness detection component generates a fourth request message and sends it to the controller 39. After receiving the fourth request message, the controller 39 generates a fifth control message and sends it to the first cylinder 4 to control the first cylinder 4 to start pushing out the leveling block 5 to perform secondary leveling of the IC carrier board. After the IC carrier board is leveled, it is pushed out for collection.

[0120] Furthermore, it also includes:

[0121] Obtain the fifth request information, which is generated by the first pressure sensor 22 after obtaining the second pressure information;

[0122] Generate the sixth control information;

[0123] The sixth control information is sent to the electromagnetic component 23 to control the electromagnetic component 23 to turn on the power;

[0124] Obtain the sixth request information, which is generated by the second pressure sensor 38 after obtaining the first pressure information;

[0125] Generate the seventh control information;

[0126] The seventh control information is sent to the electromagnetic component 23 to control the electromagnetic component 23 to turn off the power;

[0127] Obtain the seventh request information, which is generated by the second cylinder 31 after reset;

[0128] Generate the eighth control information;

[0129] The eighth control information is sent to the positioning component to control the positioning component to reset and cancel the positioning of the limit sleeve 12;

[0130] When the leveling block 5 moves downward, the insertion block 9 moves downward simultaneously. When the insertion block 9 inserts into the insertion sleeve 11, it presses against the first pressure sensor 22, causing the first pressure sensor 22 to acquire second pressure information. Subsequently, the first pressure sensor 22 generates a fifth request message and sends it to the controller 39. After receiving the fifth request message, the controller 39 generates a sixth control message and sends it to the electromagnetic component 23 to control the electromagnetic component 23 to be energized. After being energized, the electromagnetic component 23 generates a strong magnetism, causing it to exert a magnetic attraction force on the elastic limiting component, releasing the elastic limiting component's limitation, and limiting the limiting block 19, causing the limiting block 19 to engage with the limiting groove 21. This limits the insertion of the insertion block 9 into the insertion sleeve 11. When the insertion sleeve 11 slides past the second pressure sensor 38 and presses against it... The second pressure sensor 38 acquires the first pressure information, then generates a sixth request information and sends it to the controller 39. After receiving the sixth request information, the controller 39 generates a seventh control information and sends it to the electromagnetic component 23 to control the electromagnetic component 23 to shut down, causing the limit block 19 to reset. At the same time, the elastic limit component resets, allowing the plug sleeve 11 to disengage from the plug block 9. The plug sleeve 11 can also return to its limit position after reset. After the second cylinder 31 resets, it generates a seventh request information and sends it to the controller 39. After receiving the seventh request information, the controller 39 generates an eighth control information and sends it to the positioning component to control the positioning component to reset and cancel the positioning of the limit sleeve 12. After the IC carrier board is leveled and unloaded, the first pressure plate 10 can automatically reset.

[0131] Working principle of this invention: The operator places the IC carrier board to be leveled inside the leveling box 3, and then activates the lifting drive mechanism, which includes a first cylinder 4. The output shaft of the first cylinder 4 passes through the support platform 2 and is fixedly connected to the leveling block 5. After the first cylinder 4 is activated, it pushes the leveling block 5 downward through the telescopic rod. The leveling block 5 drives the upper pushing component downward. After the upper pushing component moves downward and approaches the lower pushing component, it engages with the lower pushing component. The engaged upper and lower pushing components can clamp the IC carrier board from above and below. Then, the leveling block 5 continues to move downward and pushes the upper and lower pushing components to engage. The assembly moves towards both ends of the IC carrier board, thereby pushing and flattening the warped edges of the IC carrier board. This helps to flatten any potentially warped edges of the IC carrier board before leveling, allowing for leveling while the IC carrier board is flat. This helps to prevent the edges of the IC carrier board from folding when leveling while the edges are warped. After the IC carrier board is flattened, the flatness detection device is activated to detect the surface flatness of the IC carrier board. After the surface flatness of the IC carrier board is detected, the leveling of the IC carrier board is completed.

[0132] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A leveling device for IC carrier boards after cutting, comprising a worktable (1) and a support platform (2) fixed to the top of the worktable (1), characterized in that, Also includes: The leveling box (3) is fixed inside the opening provided on the top of the workbench (1); The leveling block (5) is installed on the top of the workbench (1) by a lifting drive component. The leveling block (5) is pressed down into the interior of the leveling box (3) to level the IC carrier board. A flattening mechanism is detachably installed between the leveling box (3) and the leveling block (5); the flattening mechanism includes an upper pushing member installed at the bottom of the leveling block (5) and a lower pushing member installed inside the leveling box (3). After the upper pushing member is pushed downward, it engages with the lower pushing member. The engaged upper pushing member and the lower pushing member clamp the IC carrier plate from top to bottom, and the IC carrier plate with warped edges is flattened by the moving upper pushing member and the lower pushing member. The flatness testing component is installed at the bottom of the workbench (1). After the IC carrier is flattened, the flatness testing component extends into the interior of the leveling box (3) to test the flatness of the IC carrier. The upper pushing component includes a flipping rod (6), a flattening roller (7), and a plug-in block (9). The downward pushing component includes: The first collection box (14) is symmetrically fixed at both ends of the leveling box (3); The plug sleeves (11) are arranged in pairs, with two sets symmetrically arranged. They are slidably installed inside the leveling box (3). A first pressure plate (10) is fixed between the plug sleeves (11) in the same group. The limiting sleeve (12) is provided in correspondence with the plug sleeve (11) and is fixedly connected to the corresponding plug sleeve (11). The two sets of limiting sleeves (12) are elastically connected to the corresponding first collection box (14) through the first spring (13); The second pressure sensor (38) is fixed to the bottom of the inner wall of the leveling box (3). The limiting sleeve (12) is slid away from the IC carrier plate and then squeezes to trigger the second pressure sensor (38). The positioning component is installed at the bottom of the leveling box (3) and positions the limiting sleeve (12) when the limiting sleeve (12) triggers the second pressure sensor (38); Through slots (18), corresponding to the number of plug-in blocks (9), are formed through the interior of the plug-in blocks (9); Limiting blocks (19), two of which are elastically connected and slidably connected inside the through groove (18); Limiting grooves (21) are symmetrically opened on the inner walls of each of the plug sleeves (11), and the limiting grooves (21) are engaged and adapted with the limiting blocks (19); A groove (24) is formed at the bottom of each of the plug sleeves (11). Electromagnetic components (23) are fixedly embedded in the inside of the groove (24) and on both sides of the plug sleeve (11). An elastic limiting component is provided between the plug sleeve (11) and the bottom of the leveling box (3). The first pressure sensor (22) is configured corresponding to the plug sleeve (11) and fixed inside the plug sleeve (11). The first pressure sensor (22) is triggered after the plug block (9) engages with the plug sleeve (11). When the electromagnetic component (23) is energized, it releases the limit of the elastic limiting component through magnetic attraction. After the plug-in block (9) and the plug-in sleeve (11) are engaged, the electromagnetic component (23) drives the limiting block (19) to engage with the limiting groove (21) through magnetic attraction.

2. The leveling device for IC carrier boards after cutting, as described in claim 1, is characterized in that, The flatness testing component includes: The second cylinder (31) is fixed to the bottom of the workbench (1) by a mounting bracket; The flatness tester (37) is fixed to the end of the telescopic rod of the second cylinder (31) by the push frame (32). The flatness tester (37) extends into the interior of the leveling box (3) through the discharge port (36) opened on the side wall of the leveling box (3) to detect the flatness of the IC carrier board.

3. A leveling device for IC carrier boards after cutting, as described in claim 2, characterized in that, Also includes: The second electric push rod (33) is fixed to the top of the push frame (32) by a bracket, and the telescopic end of the second electric push rod (33) passes through the push frame (32) and is fixed with a toggle plate (34). The second collection box (35) is fixed below the table surface of the workbench (1). The second collection box (35) collects the IC carrier boards discharged along the discharge port (36). When the second electric push rod (33) is in the retracted state, the bottom of the actuating plate (34) is higher than the bottom of the flatness tester (37).

4. A leveling device for IC carrier boards after cutting, as described in claim 3, characterized in that, Two flip rods (6) are arranged in a group of two, and two groups are arranged symmetrically. The flip rods (6) in the same group are symmetrically rotated and installed on both sides of the leveling block (5). A limit component is provided between the two groups of flip rods (6) and the leveling block (5). The limit component limits the initial position of the flip rod (6) to an inclined state. Two flattening rollers (7) are provided, which are rotatably installed between the two flipping rods (6) in the same group; The plug-in block (9) is correspondingly arranged with the flip rod (6) and is rotatably installed on the side wall of the flip rod (6) via the rotating disk (8). The plug-in block (9) is detachably plugged into the lower pusher.

5. A leveling device for IC carrier boards after cutting, as described in claim 4, characterized in that, Also includes: Two sliders (29) are set together and are slidably installed on the bottom of the inner wall of the leveling box (3). A second pressure plate (30) is fixed between the sliders (29) in the same group. The second pressure plate (30) supports the bottom of both ends of the IC carrier board. The slider (29) in the same group is elastically connected to the first collection box (14) by a fourth spring (28).

6. A leveling method for a leveling device after IC carrier board cutting, applicable to the leveling device for IC carrier board cutting as described in claim 5, characterized in that, A controller (39) is fixed to the top of the workbench (1), and the leveling method includes the following steps: Obtain first request information, which is generated by the second pressure sensor (38) after obtaining the first pressure information; Generate first control information and second control information; Send the first control information to the first cylinder (4) to control the first cylinder (4) to reset after a specified time interval, and send the second control information to the positioning component to control the positioning component to position the limit sleeve (12); Obtain the second request information, which is generated by the first cylinder (4) after the telescopic rod is reset; Generate third-party control information; The third control information is sent to the flatness detection device to control the flatness detection device to start the flatness detection of the IC carrier board.

7. A leveling method for a leveling device after IC carrier board cutting according to claim 6, characterized in that, Also includes: Obtain third request information, which is generated by the flatness detection component after obtaining flatness information; Generate fourth control information; The fourth control information is sent to the second electric push rod (33) to control the second electric push rod (33) to start pushing out the toggle plate (34); Obtain fourth request information, which is generated by the flatness detection component after obtaining unevenness information; Generate the fifth control information; The fifth control information is sent to the first cylinder (4) to control the first cylinder (4) to start pushing out the leveling block (5) to perform secondary leveling on the IC carrier board.

8. A leveling method for a leveling device after IC carrier board cutting according to claim 6, characterized in that, Also includes: Obtain fifth request information, which is generated by the first pressure sensor (22) after obtaining the second pressure information; Generate the sixth control information; The sixth control information is sent to the electromagnetic component (23) to control the electromagnetic component (23) to turn on the power; Obtain the sixth request information, which is generated by the second pressure sensor (38) after obtaining the first pressure information; Generate the seventh control information; The seventh control information is sent to the electromagnetic component (23) to control the electromagnetic component (23) to shut off the power supply; Obtain the seventh request information, which is generated by the second cylinder (31) after reset; Generate the eighth control information; The eighth control information is sent to the positioning element to control the positioning element to reset and cancel the positioning of the limit sleeve (12).

Images