A photoelectric sensor thermostat device based on semiconductor refrigeration

Abstract

The application relates to the technical field of semiconductor temperature control, in particular to a photoelectric sensor constant-temperature device based on semiconductor refrigeration, which comprises a connecting sleeve, a semiconductor sheet is fixed on the connecting sleeve, a heat dissipation fin is fixedly installed on the semiconductor sheet, a first protective plate is also fixed on the semiconductor sheet, a heat dissipation assembly is arranged on the first protective plate, a refrigeration sheet is fixed on the semiconductor sheet, a second protective plate is fixed on the semiconductor sheet, a sensor body is arranged on the semiconductor sheet, a guide assembly is arranged on the semiconductor sheet, a temperature difference sensing assembly is arranged in the connecting sleeve, a sponge scraper is arranged on the semiconductor sheet, a scraping mechanism connected with the sponge scraper is arranged on the semiconductor sheet, a guide mechanism is arranged on the semiconductor sheet and connected with the scraping mechanism, and a dehumidification mechanism is arranged on the semiconductor sheet and connected with the temperature difference sensing assembly and the sponge scraper.

Description

Technical Field

[0001] This invention relates to the field of semiconductor temperature control technology, specifically a photoelectric sensor-based temperature control device based on semiconductor refrigeration. Background Technology

[0002] Photoelectric sensors are key components in various photoelectric detection systems that realize photoelectric conversion. They are devices that convert light signals (visible and ultraviolet laser light) into electrical signals.

[0003] In the optoelectronic industry, operating temperature is a very important monitoring indicator. The control center mainly monitors the temperature of optical modules. Therefore, the operating temperature of optical modules is crucial to the smooth operation of the entire system. Generally, if the temperature of the optical module is too high, it will lead to excessive emission power and burn out the device. If the temperature of the optical module is too low, it will lead to unstable performance. The core issue to achieve stable operation of optical modules is to keep the temperature of the optical modules stable.

[0004] Maintaining stable temperature is generally achieved through semiconductor coolers. However, when a semiconductor cooler is in use, prolonged power supply can cause overheating and burnout. Furthermore, when it operates at its cold end, the temperature difference becomes larger, leading to condensation. This can cause short circuits in sensors or corrosion of materials. Summary of the Invention

[0005] The purpose of this invention is to provide a thermostatic device for a photoelectric sensor based on semiconductor cooling, in order to solve the above-mentioned problems.

[0006] The problems raised in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] A photoelectric sensor temperature control device based on semiconductor cooling, comprising:

[0009] A connecting sleeve, wherein a first semiconductor plate and a second semiconductor plate are fixed at both ends of the connecting sleeve in a symmetrical arrangement;

[0010] A heat sink is fixedly mounted on the first semiconductor chip. A first protective plate is also fixedly mounted on the first semiconductor chip and sleeved on the heat sink. A heat dissipation component is provided on the first protective plate.

[0011] A cooling chip is fixedly mounted on the second semiconductor chip, and a second protective plate is also fixedly mounted on the second semiconductor chip and sleeved on the cooling chip.

[0012] A sensor body is disposed on the second semiconductor chip, and a guide assembly connected to the sensor body and the cooling chip is disposed on the second semiconductor chip. The guide assembly is used to guide the sensor body to be installed on the second semiconductor chip.

[0013] Also includes:

[0014] A temperature difference sensing component is disposed inside the connecting sleeve and connected to the heat dissipation component. The temperature difference sensing component can activate when the temperature difference between the cooling element and the environment is too large.

[0015] A sponge scraper is disposed on the second semiconductor chip and cooperates with the cooling chip. The second semiconductor chip is provided with a scraping mechanism connected to the sponge scraper. The scraping mechanism can be activated when the temperature difference sensing component moves, and drive the sponge scraper to scrape off the condensation on the cooling chip.

[0016] A guiding mechanism is disposed on the second semiconductor wafer and connected to the scraping mechanism. The guiding mechanism is able to operate when the scraping mechanism moves and control the sponge scraper to move to a state of being in contact with or separated from the cooling chip.

[0017] A dehumidification mechanism is disposed on the second semiconductor chip and connected to the temperature difference sensing component and the sponge scraper. The scraping mechanism can control the movement of the sponge scraper to cooperate with the dehumidification mechanism so that the water in the sponge scraper enters the dehumidification mechanism. At the same time, the temperature difference sensing component can deliver hot air into the dehumidification mechanism.

[0018] As a further embodiment of the present invention: the heat dissipation component includes an air vent formed on the first protective plate and connected to the heat sink, a fan connected to the air vent is fixedly installed on the first protective plate, and through holes formed on the heat sink and the first semiconductor chip are connected to the connecting sleeve, and the through holes are connected to the temperature difference sensing component.

[0019] As a further embodiment of the present invention: the guiding assembly includes a guide rod fixedly mounted on the second semiconductor chip and symmetrically arranged, a guide sleeve sleeved on the guide rod is fixed on the sensor body, a guide disk cooperating with the guide rod is fixed at one end of the guide sleeve facing the second semiconductor chip, and a heat-conducting plate that is attached to the cooling chip and the second protective plate is fixed on the sensor body.

[0020] As a further embodiment of the present invention: the temperature difference sensing component includes an air duct that is fixedly installed inside the connecting sleeve and communicates with the through hole. The side wall of the air duct has symmetrically arranged through grooves. A holding tube that communicates with the air duct is also fixed inside the connecting sleeve. A sealing plug that cooperates with the through groove is movably installed inside the air duct. The air duct is connected to the dehumidification mechanism.

[0021] As a further embodiment of the present invention: the scraping mechanism includes a fixed plate that is fixedly mounted on the second semiconductor wafer and is symmetrically arranged, a lead screw is rotatably mounted on the fixed plate, a threaded sleeve that is threadedly engaged with the lead screw is movably mounted on the lead screw, a support assembly that is connected to the threaded sleeve is provided on the second semiconductor wafer, and the support assembly is connected to the guide mechanism and the sponge scraper.

[0022] As a further embodiment of the present invention: the support assembly includes a guide rail fixedly mounted on the second semiconductor wafer, and a sliding block is fixed to the side of the threaded sleeve facing the second semiconductor wafer, the sliding block being slidably connected to the guide rail;

[0023] The support assembly further includes a support sleeve fixedly installed at the end of the threaded sleeve away from the second semiconductor wafer. A movable rod is movably installed inside the support sleeve. A limit rod is fixed on the movable rod. A limit groove is opened on the inner wall of the support sleeve to engage with the limit rod. The movable rod is fixedly connected to the sponge scraper and to the guide mechanism.

[0024] As a further embodiment of the present invention: the guiding mechanism includes a support plate fixedly mounted on the fixed plate, the support plate having a first vertical groove, the end of the movable rod away from the sponge scraper being fixed with a support rod that engages with the first vertical groove, and the second semiconductor chip being provided with an engaging assembly that connects to the support plate and the support rod.

[0025] As a further embodiment of the present invention: the engaging assembly includes a first inclined groove formed on the support plate and connected to the end of the first vertical groove, a second inclined groove formed on the support plate and connected to the end of the first inclined groove, a second vertical groove formed on the support plate and connected to the end of the second inclined groove, and a third inclined groove formed on the support plate and connected to the ends of the second vertical groove and the first vertical groove respectively. The first inclined groove, the second inclined groove, the second vertical groove and the third inclined groove engage with the support rod.

[0026] As a further embodiment of the present invention: the dehumidification mechanism includes connecting pipes fixedly installed on both sides of the air duct and arranged symmetrically, a conduit penetrating the connecting sleeve is connected to the connecting pipe, a guide pipe connected to the conduit is fixed on the second semiconductor chip, a drainage component connected to the guide pipe is provided on the second semiconductor chip, the drainage component is connected to the sponge scraper, and the connecting pipe is connected to the through groove.

[0027] As a further embodiment of the present invention: the drainage assembly includes a limiting plate fixedly installed on the guide pipe and fixedly connected to the second protective plate, and an inclined plate is also fixed on the guide pipe. A water guide groove is opened at one end of the inclined plate facing the limiting plate, and the limiting plate cooperates with the sponge scraper.

[0028] Compared with the prior art, the beneficial effects of this invention are as follows: When the cooling chip is in use, the temperature difference between the cooling chip and the ambient air will be too large, causing condensation to form on the surface of the cooling chip. This condensation may corrode the cooling chip and may also cause a short circuit in the cooling chip or the sensor body. Therefore, it is necessary to scrape off the condensation. Under the action of the guide assembly, the sensor body, cooling chip, and second protective plate can be controlled to adhere. Since the cooling chip absorbs heat when the semiconductor chip is energized, and the heat sink dissipates heat, heat will be generated when the sensor body is working. At this time, the cooling chip can absorb heat from the sensor body, ensuring that the sensor body is always at the optimal operating temperature. If the temperature difference between the cooling chip and the ambient air is caused by the cooling chip... When the temperature difference is too large, the movement of the temperature difference sensing component will be controlled. Once the temperature difference reaches a certain value, the movement of the scraping mechanism will be controlled, thereby driving the sponge scraper to scrape off the condensation on the cooling plate. After the sponge scraper separates from the cooling plate, it will move to a position that mates with the dehumidification mechanism. Under the action of the guiding mechanism, the sponge scraper will move horizontally to drain the water absorbed by the sponge scraper and enter the dehumidification mechanism. At the same time, under the action of the temperature difference sensing component, the hot air blown out by the heat dissipation component will enter the dehumidification mechanism to drain the water placed in the dehumidification mechanism. The scraping mechanism continues to move, and under the action of the guiding mechanism, the sponge scraper will reset. The above steps are repeated to ensure that the condensation on the cooling plate is cleaned after it condenses. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of one embodiment of a photoelectric sensor temperature control device based on semiconductor cooling.

[0030] Figure 2 This is a schematic diagram of the structure of a photoelectric sensor temperature control device based on semiconductor cooling from another angle in one embodiment.

[0031] Figure 3for Figure 2 A magnified schematic diagram of the structure at point A in the middle.

[0032] Figure 4 This is a half-section schematic diagram of one embodiment of a thermostatic device for photoelectric sensors based on semiconductor cooling.

[0033] Figure 5 This is a schematic diagram showing the connection relationship between a portion of the dehumidification mechanism, the temperature difference sensing component, and the guiding component in one embodiment of a photoelectric sensor temperature control device based on semiconductor refrigeration.

[0034] Figure 6 This is an exploded structural diagram of part of the temperature difference sensing component and part of the dehumidification mechanism in one embodiment of a photoelectric sensor constant temperature device based on semiconductor refrigeration.

[0035] Figure 7 This is a schematic diagram showing the connection relationship between the scraping mechanism, the guiding mechanism, the sponge scraper, and part of the dehumidification mechanism in one embodiment of a photoelectric sensor temperature control device based on semiconductor cooling.

[0036] Figure 8 This is a schematic diagram of the scraping mechanism and the guiding mechanism in one embodiment of a thermostatic device for photoelectric sensors based on semiconductor cooling.

[0037] Figure 9 This is an exploded structural diagram of the scraping mechanism and part of the guiding mechanism in one embodiment of a thermostatic device for photoelectric sensors based on semiconductor cooling.

[0038] Figure 10 This is a schematic diagram of the dehumidification mechanism in one embodiment of a thermostatic device based on a semiconductor refrigeration photoelectric sensor.

[0039] Figure 11 This is a half-sectional schematic diagram of a portion of the dehumidification mechanism in one embodiment of a thermostatic device based on a semiconductor-cooled photoelectric sensor.

[0040] Figure 12 This is a schematic diagram of part of the guiding mechanism in one embodiment of a thermostatic device for photoelectric sensors based on semiconductor cooling.

[0041] In the diagram: 1. Connecting sleeve; 2-1. First semiconductor chip; 2-2. Second semiconductor chip; 3. Heat sink; 4. First protective plate; 5. Fan; 6. Air duct; 7. Container tube; 8. Through groove; 9. Sealing plug; 10. Connecting pipe; 11. Conduit; 12. Cooling chip; 13. Second protective plate; 14. Guide rod; 15. Guide sleeve; 16. Guide plate; 17. Sensor body; 18. Fixing plate ; 19. Lead screw; 20. Threaded sleeve; 21. Sliding block; 22. Guide rail; 23. Support sleeve; 24. Movable rod; 25. Sponge scraper; 26. Support rod; 27. Support plate; 28. No. 1 vertical groove; 29. ​​No. 1 inclined groove; 30. No. 2 inclined groove; 31. No. 2 vertical groove; 32. No. 3 inclined groove; 33. Limiting plate; 34. Guide pipe; 35. Inclined plate; 36. Water guide groove; 37. Heat conduction plate. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] Furthermore, elements in this invention are referred to as being "fixed to" or "set on" another element, which may be directly on the other element or may also include an intervening element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or may also include an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations.

[0044] Please see Figures 1-12In this embodiment of the invention, a thermostatic device for a photoelectric sensor based on semiconductor cooling includes: a connecting sleeve 1, a first semiconductor chip 2-1, a second semiconductor chip 2-2, a heat sink 3, a first protective plate 4, a cooling chip 12, a second protective plate 13, a sensor body 17, a heat dissipation assembly, a guiding assembly, a temperature difference sensing assembly, a sponge scraper 25, a scraping mechanism, a guiding mechanism, and a dehumidification mechanism. When the cooling chip 12 is working, the temperature difference between the cooling chip 12 and the ambient air will be too large, causing condensation to form on the surface of the cooling chip 12. This condensation may corrode the cooling chip and may also cause a short circuit in the cooling chip 12 or the sensor body 17. Therefore, it is necessary to scrape off the condensation. During use, the sensor body 17 can be controlled to adhere to the cooling chip 12 and the second protective plate 13 under the action of the guiding assembly. When the semiconductor chip is energized, the cooling chip 12 will absorb heat, and the heat sink 3 will dissipate heat. When the sensor body 17 is working, it will generate heat. At this time, under the action of the cooling chip 12, the heat can be dissipated. Heat absorption ensures that the sensor body 17 is always at the optimal operating temperature. If the temperature difference between the cooling element 12 and the outside air is too large due to the cooling element 12, the temperature difference sensing component will be controlled to move. When the temperature difference reaches a certain value, the scraping mechanism will be controlled to move, thereby driving the sponge scraper 25 to scrape off the condensation on the cooling element 12. After the sponge scraper 25 separates from the cooling element 12, the sponge scraper 25 will move to a position that cooperates with the dehumidification mechanism. Under the action of the guide mechanism, the sponge scraper 25 will move horizontally so that the water absorbed in the sponge scraper 25 will be discharged from the sponge scraper 25 and enter the dehumidification mechanism. At the same time, under the action of the temperature difference sensing component, the hot air blown out by the heat dissipation component will enter the dehumidification mechanism to discharge the water placed in the dehumidification mechanism. The scraping mechanism continues to move, and under the action of the guide mechanism, the sponge scraper 25 will be reset. The above steps are repeated to ensure that the condensation on the cooling element 12 is cleaned after condensation.

[0045] Specifically, the following are included:

[0046] Connecting sleeve 1, with a first semiconductor plate 2-1 and a second semiconductor plate 2-2 fixed at both ends of the connecting sleeve 1 in a symmetrical arrangement.

[0047] Please see Figure 1 , Figure 2 , Figure 4A heat sink 3 is fixedly mounted on a first semiconductor chip 2-1. A first protective plate 4, sleeved on the heat sink 3, is also fixedly mounted on the first semiconductor chip 2-1. A heat dissipation assembly is provided on the first protective plate 4. A cooling chip 12 is fixedly mounted on a second semiconductor chip 2-2. A second protective plate 13, sleeved on the cooling chip 12, is also fixedly mounted on the second semiconductor chip 2-2. The heat dissipation assembly includes an air vent that is opened on the first protective plate 4 and connected to the heat sink 3. A fan 5 connected to the air vent is fixedly mounted on the first protective plate 4. Through holes that are connected to the connecting sleeve 1 are opened on the heat sink 3 and the first semiconductor chip 2-1. The through holes are connected to the temperature difference sensing assembly.

[0048] In detail, a heat sink 3 and a cooling chip 12 are respectively installed on the first semiconductor chip 2-1 and the second semiconductor chip 2-2. When the semiconductor chips are powered on, the heat sink 3 will release heat and the cooling chip 12 will absorb heat. If the heat sink 3 cannot provide sufficient heat dissipation capacity during use, it is easy to cause the heat sink 3 to overheat and be damaged. Otherwise, it will cause the heat sink 3 to overheat and burn out. Therefore, when the heat sink 3 releases heat, it is necessary to dissipate heat. The fan 5 will work and deliver outside air into the heat sink 3 through the air guide to accelerate the air circulation of the heat sink 3. Since the spacing of the heat sink 3 is too small, it is easy to be blocked by dust. Therefore, a sieve plate is provided on the fan 5 to filter the dust blown in the outside air and ensure that dust is not blown into the heat sink 3.

[0049] Please see Figure 1 , Figure 2 , Figure 4 , Figure 5 A sensor body 17 is disposed on a second semiconductor chip 2-2. A guide assembly connected to the sensor body 17 and the cooling chip 12 is disposed on the second semiconductor chip 2-2. The guide assembly is used to guide the sensor body 17 to be installed on the second semiconductor chip 2-2. The guide assembly includes a guide rod 14 fixedly installed on the second semiconductor chip 2-2 and symmetrically arranged. A guide sleeve 15 is fixedly fitted on the guide rod 14 on the sensor body 17. A guide disk 16 cooperating with the guide rod 14 is fixed at one end of the guide sleeve 15 facing the second semiconductor chip 2-2. A heat-conducting plate 37 is fixedly attached to the cooling chip 12 and the second protective plate 13 on the sensor body 17.

[0050] It should be noted that a temperature controller is installed inside the connecting sleeve 1, and the guide plate 16 is conical. To ensure that the heat-conducting plate 37 can be smoothly inserted into the cooling chip 12, the sensor body 17 needs to be mounted on the cooling chip 12. At this time, the sensor body 17 can be controlled to move towards the second semiconductor chip 2-2, thereby driving the guide sleeve 15 and the guide plate 16 to move. When the guide plate 16 is fitted onto the guide rod 14, the guide plate 16 ensures that the guide rod 14 can smoothly enter the guide sleeve 15. When the guide rod 14 enters the guide sleeve 15, the heat-conducting plate 37 will enter the cooling chip 12 and fit against it. This ensures that the sensor body 17 can be smoothly coupled with the cooling chip 12. After installation, when the sensor body 17 is working, it will dissipate heat. As the temperature of the sensor body 17 increases, it may cause abnormal operation of the sensor body 17. Therefore, it is necessary to ensure that the sensor body 17 always maintains the optimal operating temperature. At this time, the semiconductor chip is energized and the cooling chip 12 is controlled to absorb heat to cool the sensor body 17. At the same time, under the action of the temperature controller, the sensor body 17 is ensured to be within the set temperature range. The temperature controller is an application of existing technology and will not be described in detail in this application.

[0051] Also includes:

[0052] Please see Figures 4-6 , Figure 10 A temperature difference sensing component is disposed within the connecting sleeve 1 and connected to the heat dissipation component. The temperature difference sensing component can activate when the temperature difference between the cooling element 12 and the environment is too large. The temperature difference sensing component includes an air duct 6 fixedly installed within the connecting sleeve 1 and connected to the through hole. The side wall of the air duct 6 has symmetrically arranged through grooves 8. A holding tube 7 connected to the air duct 6 is also fixed within the connecting sleeve 1. A sealing plug 9 that cooperates with the through groove 8 is movably installed within the air duct 6. The air duct 6 is connected to the dehumidification mechanism.

[0053] Furthermore, the holding tube 7 is filled with gas, whose expansion coefficient is greater than that of air. Initially, when the cooling element 12 is not working, the temperature inside the holding tube 7 is the same as the outside temperature. At this time, under the action of the air pressure inside the holding tube 7, the control sealing plug 9 is positioned in the mating position of the through groove 8, completely blocking the through groove 8. Therefore, the air blown out by the fan 5 will not enter the air duct 6 after flowing through the heat sink 3. When the sensor body 17 is working, the cooling element 12 will absorb heat, causing the temperature near the cooling element 12 to decrease, thereby lowering the temperature of the gas inside the holding tube 7. The gas will contract, causing the air pressure inside the holding tube 7 to decrease, thereby controlling the sealing plug 9 to move towards the holding tube 7. As the temperature difference reaches a certain value, condensation will occur on the cooling plate 12, causing moisture in the air to condense on the surface of the cooling plate 12. Therefore, it is necessary to remove the condensation on the cooling plate 12. At the same time, when condensation occurs, the stroke of the sealing plug 9 increases, so that the sealing plug 9 no longer completely blocks the through groove 8. The through groove 8 will be connected to the air guide pipe 6, and the air blown out by the fan 5 will enter the dehumidification mechanism through the air guide pipe 6 and the through groove 8 to remove the water condensed on the cooling plate 12.

[0054] Preferably, if the temperature difference is greater, the connection between the channel 8 and the air duct 6 will increase, which will increase the amount of hot air entering the dehumidification mechanism, thereby accelerating the removal of water. When the temperature difference is small, condensation will no longer occur, and the sealing plug 9 will seal the channel 8 again to ensure that the hot air will not affect the cooling effect of the cooling plate 12.

[0055] Please see Figure 2 , Figure 3 , Figures 7-9A sponge scraper 25 is disposed on the second semiconductor wafer 2-2 and cooperates with the cooling chip 12. A scraping mechanism connected to the sponge scraper 25 is disposed on the second semiconductor wafer 2-2. The scraping mechanism is activated when the temperature difference sensing component moves, driving the sponge scraper 25 to scrape away condensation on the cooling chip 12. The scraping mechanism includes a fixed plate 18 fixedly mounted on the second semiconductor wafer 2-2 and symmetrically arranged. A lead screw 19 is rotatably mounted on the fixed plate 18. A threaded sleeve 20 threadedly engaged with the lead screw 19 is movably mounted on the lead screw 19. A support assembly connected to the threaded sleeve 20 is disposed on the second semiconductor wafer 2-2. The component is connected to the guiding mechanism and the sponge scraper 25. The supporting assembly includes a guide rail 22 fixedly mounted on the second semiconductor wafer 2-2. A sliding block 21 is fixedly mounted on the side of the threaded sleeve 20 facing the second semiconductor wafer 2-2. The sliding block 21 is slidably connected to the guide rail 22. The supporting assembly also includes a supporting sleeve 23 fixedly mounted on the end of the threaded sleeve 20 away from the second semiconductor wafer 2-2. A movable rod 24 is movably mounted inside the supporting sleeve 23. A limiting rod is fixed on the movable rod 24. A limiting groove is opened on the inner wall of the supporting sleeve 23 to engage with the limiting rod. The movable rod 24 is fixedly connected to the sponge scraper 25 and connected to the guiding mechanism.

[0056] Furthermore, a temperature sensor is installed inside the connecting sleeve 1 to detect the temperature difference between the cooling element 12 and the external environment. When the temperature difference reaches the set value of the temperature sensor, it indicates that condensation will occur on the surface of the cooling element 12. Therefore, the water on the surface of the cooling element 12 needs to be cleaned. In the initial state, under the action of the guiding mechanism, the sponge scraper 25... Located in contact with the cooling element 12, when the temperature difference reaches a set value, the lead screw 19 rotates, driving the threaded sleeve 20 to move, which in turn drives the sliding block 21 to move along the length direction of the guide rail 22. The sliding block 21 and the guide rail 22 have a guiding function, ensuring that the threaded sleeve 20 moves away from the length direction of the lead screw 19 and does not rotate with the lead screw 19. The threaded sleeve 20 also drives the support sleeve 23 to move, which in turn drives the sponge scraper 25 to slide on the surface of the cooling element 12 through the movable rod 24. Due to the engagement of the limiting rod and the limiting groove, the movable rod 24 is ensured not to deviate during movement, thus ensuring that the sponge scraper 25 is always in contact with the cooling element 12 and scrapes away and absorbs the water condensed on the surface of the cooling element 12. After the sponge scraper 25 has finished scraping, the sponge scraper 25... Sponge scraper 25 will separate from cooling chip 12 and move to a position to cooperate with the dehumidification mechanism. Under the action of the guide mechanism, the drive rod 24 moves towards cooling chip 12, causing the sponge scraper 25 to be squeezed to squeeze out the water absorbed in the sponge scraper 25 and fall into the dehumidification mechanism. After the water in the sponge scraper 25 is discharged, the lead screw 19 reverses, causing the sponge scraper 25 to move towards the initial position until the sponge scraper 25 returns to the initial position. The above steps are repeated to achieve the effect of automatically cleaning the water on cooling chip 12 by sponge scraper 25 when condensation occurs, ensuring that cooling chip 12 or sensor body 17 will not short-circuit or corrode. The temperature sensor is an application of existing technology and will not be described in detail in this application.

[0057] Please see Figure 2 , Figure 3 , Figures 7-9 , Figure 12A guiding mechanism is disposed on the second semiconductor wafer 2-2 and connected to the scraping mechanism. The guiding mechanism is capable of operating when the scraping mechanism moves, and controls the movement of the sponge scraper 25 to a state of contact or separation with the cooling chip 12. The guiding mechanism includes a support plate 27 fixedly mounted on the fixing plate 18. A first vertical groove 28 is formed on the support plate 27. A support rod 26 is fixed at the end of the movable rod 24 away from the sponge scraper 25 and engages with the first vertical groove 28. The second semiconductor wafer 2-2 is provided with a connection to the support plate 27 and the support rod 26. The engaging assembly includes a first inclined groove 29 formed on the support plate 27 and connected to the end of the first vertical groove 28; a second inclined groove 30 formed on the support plate 27 and connected to the end of the first inclined groove 29; a second vertical groove 31 formed on the support plate 27 and connected to the end of the second inclined groove 30; and a third inclined groove 32 formed on the support plate 27 and connected to the ends of the second vertical groove 31 and the first vertical groove 28, respectively. The first inclined groove 29, the second inclined groove 30, the second vertical groove 31, and the third inclined groove 32 engage with the support rod 26.

[0058] Furthermore, the inclination angle of the first inclined groove 29 is biased towards the cooling element 12, while the inclination angles of the second inclined groove 30 and the third inclined groove 32 are opposite to those of the first inclined groove 29. Initially, the support rod 26 is located at the junction of the first vertical groove 28 and the third inclined groove 32. At this time, the sponge scraper 25 is in contact with the cooling element 12. When it is necessary to scrape off the condensation on the surface of the cooling element 12, the lead screw 19 rotates, driving the support sleeve 23 to move via the threaded sleeve 20. This, in turn, drives the support rod 26 and the sponge scraper 25 to move via the movable rod 24. The support rod 26 will move along the length of the first vertical groove 28, ensuring that the sponge scraper 25 does not separate from the cooling element 12. After the sponge scraper 25 has finished scraping, it will separate from the cooling element 12. At this time, the support rod 26 moves into the first inclined groove 29 and, via the movable rod 24, drives the sponge scraper 25 towards the cooling element 12, allowing the sponge scraper 25 to cooperate with the dehumidification mechanism, so that the sponge scraper 25... The water in section 5 is squeezed out. After the squeezing is completed, if the sponge scraper 25 is in contact with the cooling plate 12 when it is reset, it will scrape off the water that has re-condensed on the cooling plate 12. When the sponge scraper 25 is reset and moves towards the first inclined groove 29, it may not be completely clean because there is water in the sponge scraper 25. Therefore, it is necessary to control the sponge scraper 25 to not interfere with the cooling plate 12 when it is reset. The support rod 26 will enter the second inclined groove 30, so that the sponge scraper 25 moves away from the cooling plate 12. When the support rod 26 moves into the second vertical groove 31, the sponge scraper 25 is separated from the cooling plate 12. When the support rod 26 moves into the third inclined groove 32, the sponge scraper 25 is controlled to move towards the cooling plate 12 again until the support rod 26 returns to the first vertical groove 28 and the sponge scraper 25 is reset. At this time, the lead screw 19 reverses again and repeats the above steps to ensure that no water remains on the surface of the cooling plate 12.

[0059] Please see Figures 4-6 , Figure 10 , Figure 11A dehumidification mechanism is disposed on the second semiconductor chip 2-2 and connected to the temperature difference sensing component and the sponge scraper 25. The scraping mechanism can control the movement of the sponge scraper 25 to cooperate with the dehumidification mechanism, so that the water in the sponge scraper 25 enters the dehumidification mechanism. At the same time, the temperature difference sensing component can deliver hot air into the dehumidification mechanism. The dehumidification mechanism includes connecting pipes 10 fixedly installed on both sides of the air guide pipe 6 and arranged symmetrically. A conduit 11 penetrating the connecting sleeve 1 is connected to the connecting pipe 10. A guide tube 34 is fixedly connected to the conduit 11. A drainage assembly connected to the guide tube 34 is provided on the second semiconductor chip 2-2. The drainage assembly is connected to the sponge scraper 25. The connecting pipe 10 is connected to the through groove 8. The drainage assembly includes a limiting plate 33 fixedly installed on the guide tube 34 and fixedly connected to the second protective plate 13. An inclined plate 35 is also fixed on the guide tube 34. A water guide groove 36 is opened at one end of the inclined plate 35 facing the limiting plate 33. The limiting plate 33 cooperates with the sponge scraper 25.

[0060] In detail, the inclined plate 35 is set at an angle. After the sponge scraper 25 finishes scraping, it will separate from the cooling plate 12 and move to the position where it abuts against the limiting plate 33. At this time, the support rod 26 moves into the first inclined groove 29 and controls the sponge scraper 25 to move towards the limiting plate 33, so that the sponge scraper 25 is subjected to compression force, thereby squeezing out the water in the sponge scraper 25. The squeezed water will fall into the inclined plate 35 and enter the water guide groove 36. Under the action of the water guide groove 36, the water is guided to flow into the guide pipe 34. At the same time, due to the temperature difference in the holding pipe 7, The larger size allows the through slot 8 to be open, and hot air will enter the connecting pipe 10 through the air guide pipe 6 and the through slot 8, and then enter the guide pipe 34 through the conduit 11. Under the action of the hot air, the water in the guide pipe 34 will evaporate and overflow. After the heat conduction plate 37 and the cooling chip 12 are attached, a shell is usually put on the sensor body 17 to protect the sensor body 17 and the second semiconductor chip 2-2. In order to ensure that the evaporated water does not remain in the shell, a drain pipe is also connected to the guide pipe 34. The drain pipe penetrates the shell to discharge the evaporated water to the outside of the shell.

[0061] Preferably, under the action of hot air, water may overflow back into the shell when it evaporates. During the process of water vapor dissipation, the inclined plate 35 can hinder the water vapor, thereby ensuring that the water vapor will not return into the shell.

[0062] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0063] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A photoelectric sensor temperature control device based on semiconductor cooling, comprising: A connecting sleeve (1) is provided, with a first semiconductor plate (2-1) and a second semiconductor plate (2-2) fixed at both ends of the connecting sleeve (1) in a symmetrical arrangement. A heat sink (3) is fixedly installed on the first semiconductor chip (2-1). A first protective plate (4) is also fixedly mounted on the first semiconductor chip (2-1) and sleeved on the heat sink (3). A heat dissipation component is provided on the first protective plate (4). A cooling chip (12) is fixedly mounted on the second semiconductor chip (2-2), and a second protective plate (13) is also fixedly mounted on the second semiconductor chip (2-2) and sleeved on the cooling chip (12). A sensor body (17) is disposed on the second semiconductor chip (2-2). The second semiconductor chip (2-2) is provided with a guide assembly connected to the sensor body (17) and the cooling chip (12). The guide assembly is used to guide the sensor body (17) to be installed on the second semiconductor chip (2-2). Its characteristic is that it further includes: A temperature difference sensing component is disposed inside the connecting sleeve (1) and connected to the heat dissipation component. The temperature difference sensing component can operate when the temperature difference between the cooling chip (12) and the environment is too large. A sponge scraper (25) is disposed on the second semiconductor chip (2-2) and cooperates with the cooling chip (12). The second semiconductor chip (2-2) is provided with a scraping mechanism connected to the sponge scraper (25). The scraping mechanism can operate when the temperature difference sensing component moves and drive the sponge scraper (25) to scrape off the condensation on the cooling chip (12). A guiding mechanism is disposed on the second semiconductor wafer (2-2) and connected to the scraping mechanism. The guiding mechanism can operate when the scraping mechanism moves and control the sponge scraper (25) to move to a state of being in contact with or separated from the cooling chip (12). The dehumidification mechanism is disposed on the second semiconductor chip (2-2) and connected to the temperature difference sensing component and the sponge scraper (25). The scraping mechanism can control the sponge scraper (25) to move to cooperate with the dehumidification mechanism so that the water in the sponge scraper (25) enters the dehumidification mechanism. At the same time, the temperature difference sensing component can deliver hot air to the dehumidification mechanism.

2. The thermostatic device for photoelectric sensors based on semiconductor cooling according to claim 1, characterized in that, The heat dissipation assembly includes an air vent on the first protective plate (4) and connected to the heat sink (3). A fan (5) connected to the air vent is fixedly installed on the first protective plate (4). The heat sink (3) and the first semiconductor chip (2-1) have through holes that are connected to the connecting sleeve (1). The through holes are connected to the temperature difference sensing assembly.

3. The thermostatic device for a photoelectric sensor based on semiconductor cooling according to claim 1, characterized in that, The guiding assembly includes a guide rod (14) fixedly mounted on the second semiconductor chip (2-2) and arranged symmetrically. A guide sleeve (15) is fixedly sleeved on the guide rod (14) on the sensor body (17). A guide disk (16) cooperating with the guide rod (14) is fixed at one end of the guide sleeve (15) facing the second semiconductor chip (2-2). A heat-conducting plate (37) that is attached to the cooling chip (12) and the second protective plate (13) is fixed on the sensor body (17).

4. The photoelectric sensor temperature control device based on semiconductor cooling according to claim 2, characterized in that, The temperature difference sensing component includes an air duct (6) fixedly installed inside the connecting sleeve (1) and connected to the through hole. The side wall of the air duct (6) is provided with symmetrically arranged through grooves (8). The connecting sleeve (1) is also fixed with a holding tube (7) connected to the air duct (6). A sealing plug (9) that cooperates with the through groove (8) is movably installed inside the air duct (6). The air duct (6) is connected to the dehumidification mechanism.

5. The photoelectric sensor temperature control device based on semiconductor cooling according to claim 1, characterized in that, The scraping mechanism includes a fixed plate (18) fixedly mounted on the second semiconductor wafer (2-2) and symmetrically arranged. A lead screw (19) is rotatably mounted on the fixed plate (18). A threaded sleeve (20) that is threadedly engaged with the lead screw (19) is movably mounted on the lead screw (19). A support assembly connected to the threaded sleeve (20) is provided on the second semiconductor wafer (2-2). The support assembly is connected to the guide mechanism and the sponge scraper (25).

6. The thermostatic device for a photoelectric sensor based on semiconductor cooling according to claim 5, characterized in that, The support assembly includes a guide rail (22) fixedly mounted on the second semiconductor wafer (2-2), and a sliding block (21) fixed on the side of the threaded sleeve (20) facing the second semiconductor wafer (2-2), the sliding block (21) being slidably connected to the guide rail (22); The support assembly further includes a support sleeve (23) fixedly installed at one end of the threaded sleeve (20) away from the second semiconductor chip (2-2). A movable rod (24) is movably installed inside the support sleeve (23). A limit rod is fixed on the movable rod (24). A limit groove is opened on the inner wall of the support sleeve (23) to engage with the limit rod. The movable rod (24) is fixedly connected to the sponge scraper (25) and connected to the guide mechanism.

7. The thermostatic device for a photoelectric sensor based on semiconductor cooling according to claim 6, characterized in that, The guiding mechanism includes a support plate (27) fixedly installed on the fixed plate (18), a first vertical groove (28) is provided on the support plate (27), and a support rod (26) is fixed at one end of the movable rod (24) away from the sponge scraper (25) and engages with the first vertical groove (28). The second semiconductor chip (2-2) is provided with an engaging assembly that connects to the support plate (27) and the support rod (26).

8. The thermostatic device for a photoelectric sensor based on semiconductor cooling according to claim 7, characterized in that, The engaging assembly includes a first inclined groove (29) formed on the support plate (27) and connected to the end of the first vertical groove (28), a second inclined groove (30) formed on the support plate (27) and connected to the end of the first inclined groove (29), a second vertical groove (31) formed on the support plate (27) and connected to the end of the second inclined groove (30), and a third inclined groove (32) formed on the support plate (27) and connected to the ends of the second vertical groove (31) and the first vertical groove (28), respectively. The first inclined groove (29), the second inclined groove (30), the second vertical groove (31) and the third inclined groove (32) engage with the support rod (26).

9. The photoelectric sensor temperature control device based on semiconductor cooling according to claim 4, characterized in that, The dehumidification mechanism includes connecting pipes (10) fixedly installed on both sides of the air duct (6) and arranged symmetrically. A conduit (11) passing through the connecting sleeve (1) is connected to the connecting pipe (10). A guide pipe (34) connected to the conduit (11) is fixed on the second semiconductor chip (2-2). A drainage assembly connected to the guide pipe (34) is provided on the second semiconductor chip (2-2). The drainage assembly is connected to the sponge scraper (25). The connecting pipe (10) is connected to the through groove (8).

10. A photoelectric sensor temperature control device based on semiconductor cooling according to claim 9, characterized in that, The drainage assembly includes a limiting plate (33) fixedly installed on the guide pipe (34) and fixedly connected to the second protective plate (13). An inclined plate (35) is also fixed on the guide pipe (34). A water guide groove (36) is opened at one end of the inclined plate (35) facing the limiting plate (33). The limiting plate (33) cooperates with the sponge scraper (25).

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