Display device including display module and method of manufacturing the same

Abstract

According to an aspect of the present application, a display module includes a substrate having a side surface and a mounting surface on which a thin film transistor (TFT) layer is formed, a plurality of inorganic light emitting devices mounted on the mounting surface, a front cover electrically connecting the TFT layer and the plurality of inorganic light emitting devices, and covering an anisotropic conductive layer disposed on an upper surface of the TFT layer and the mounting surface, and a side cover covering the side surface, wherein a side end of the front cover extends to an area outside the mounting surface, the side cover is disposed to be adhered to a lower surface of the front cover and the side surface of the substrate corresponding to the area outside the mounting surface, and a side end of the anisotropic conductive layer is disposed inside the side end of the front cover.

Description

TECHNICAL FIELD

[0001] The disclosure relates to a display device capable of displaying an image by combining modules in which inorganic light emitting devices that self-emit light are mounted on a substrate. BACKGROUND

[0002] A display device is an output device that visually displays data information (e.g., characters and numbers) and images.

[0003] Generally, a display device mainly uses a liquid crystal panel that requires backlight or an organic light emitting diode (OLED) panel provided with a film of an organic compound that self-emits light in response to a current. However, the liquid crystal panel can have difficulties such as slow response time and high power consumption. In addition, since the liquid crystal panel does not self-emit light and requires backlight, it is difficult to make the liquid crystal panel compact. Also, since the OLED panel self-emits light, the OLED panel does not require backlight, thereby making it possible to thin the OLED panel. However, the OLED panel is vulnerable to burn-in. Burn-in is a phenomenon in which if the same screen is displayed for a long time, the lifespan of a sub-pixel expires, and even when the screen changes, the previous screen remains unchanged. Accordingly, a micro light emitting diode (micro LED or μLED) panel, in which inorganic light emitting devices are mounted on a substrate and the inorganic light emitting devices themselves are used as pixels, has been researched as a new panel to replace the OLED.

[0004] A micro light emitting diode display panel (hereinafter, a micro LED panel) is a flat display panel and is composed of a plurality of inorganic light emitting diodes (inorganic LEDs) having a size of 100 micrometers or less.

[0005] The micro LED panel is also a self-emitting device, but due to its inorganic nature, the micro LED is not vulnerable to burn-in and has excellent brightness, resolution, power consumption, and durability.

[0006] Compared to an LCD panel that requires backlight, the micro LED panel can provide better contrast, response time, and energy efficiency. Both an organic light emitting diode (OLED) and a micro LED corresponding to an inorganic light emitting diode have good energy efficiency. However, the micro LED has higher brightness and light emission efficiency and a longer lifespan than the OLED.

[0007] In addition, by arranging LEDs on a circuit board in units of pixels, a display module can be manufactured in a substrate unit, and it is easy to manufacture in various resolutions and screen sizes according to a customer's order. SUMMARY

[0008] TECHNICAL PROBLEM

[0009] A display device and a manufacturing method thereof are provided, and more particularly, a display module capable of being adapted to expansion and a display device including the same, which can prevent a seam caused by an anisotropic conductive layer from being recognized and can prevent electrostatic discharge.

[0010] Technical Solution

[0011] According to an aspect of the disclosure, a display module includes a substrate having a mounting surface and a side surface, a thin film transistor (TFT) layer disposed on the mounting surface of the substrate, a plurality of inorganic light emitting diodes mounted on the mounting surface of the substrate, an anisotropic conductive layer disposed on an upper surface of the TFT layer and electrically connecting the TFT layer to the plurality of inorganic light emitting diodes, a front cover covering the mounting surface, and a side cover surrounding the side surface, wherein a side end of the front cover extends to an area outside the mounting surface, the side cover is joined to a lower surface of the front cover corresponding to the area outside the mounting surface and the side surface of the substrate, and a side end of the anisotropic conductive layer is disposed on an inner side with respect to the side end of the front cover.

[0012] The side end of the front cover and the side end of the side cover can be coplanar.

[0013] The side end of the anisotropic conductive layer can be between the side surface of the substrate and the side end of the front cover.

[0014] The display module can further include a side end member disposed at the side end of the side cover, the side end member including a material having a higher electrical conductivity than that of the side cover.

[0015] The display module can further include a metal plate joined to a rear surface of the substrate and disposed on a side of the substrate opposite the mounting surface.

[0016] One end of the side end member can contact the front cover.

[0017] The side end of the anisotropic conductive layer can be disposed on an inner side with respect to the side surface of the substrate.

[0018] The substrate can further include a side wire extending along the side surface of the substrate and electrically connected to the TFT layer, and the side end of the anisotropic conductive layer can be disposed between a side end of the side wire of the substrate and the side end of the front cover.

[0019] The side cover can include a non-conductive material.

[0020] The side cover can include a light-absorbing material.

[0021] The side surface of the substrate can be positioned to correspond to the four edges of the mounting surface; the front cover can extend to the area beyond the four edges of the mounting surface; and the side cover can contact the entire lower surface of the front cover corresponding to the area beyond the mounting surface and surround the side surface of the substrate along the four edges of the mounting surface.

[0022] According to one aspect of this disclosure, a display device includes: a display module array comprising a plurality of display modules arranged horizontally in an M×N matrix, wherein each of the plurality of display modules includes: a substrate having a mounting surface and a side surface; a thin-film transistor (TFT) layer disposed on the mounting surface; a plurality of inorganic light-emitting diodes mounted on the mounting surface; an anisotropic conductive layer disposed on the upper surface of the TFT layer and electrically connecting the TFT layer to the plurality of inorganic light-emitting diodes; a front cover covering the mounting surface; and a side cover surrounding the side surface, wherein a side end of the front cover extends to a region outside the mounting surface, the side cover is engaged with a lower surface of the front cover and a side surface of the substrate corresponding to the region outside the mounting surface, and a side end of the anisotropic conductive layer is disposed on an inner side relative to the side end of the front cover.

[0023] The side ends of the front cover and the side ends of the side cover can be coplanar.

[0024] The side end of the anisotropic conductive layer can be disposed between the side surface of the substrate and the side end of the front cover.

[0025] Each of the plurality of display modules may further include a side end member disposed at a side end of the side cover, the side end member comprising a material having a higher conductivity than that of the side cover.

[0026] Each of the multiple display modules may also include a metal plate that is bonded to the rear surface of the substrate and disposed on the opposite side of the mounting surface.

[0027] The side ends of the anisotropic conductive layer can be arranged on the inside relative to the side surface of the substrate.

[0028] The substrate of the multiple display modules may also include side wiring extending along the side surface and electrically connected to the TFT layer, and the side end of the anisotropic conductive layer may be disposed between the side end of the side wiring of the substrate and the side end of the front cover.

[0029] The side surface can be configured to correspond to the four edges of the mounting surface, the front cover can be configured to extend beyond the four edges of the mounting surface, and the side cover can surround the entire lower surface of the front cover corresponding to the outer side of the mounting surface along the four edges of the mounting surface in the side surface and the front cover.

[0030] According to another aspect of this disclosure, a display module includes: a substrate having a side surface and a mounting surface on which a thin-film transistor (TFT) layer is formed; a plurality of inorganic light-emitting diodes mounted on the mounting surface; an anisotropic conductive layer configured to electrically connect the TFT layer to the plurality of inorganic light-emitting diodes and disposed on the upper surface of the TFT layer; a front cover covering the mounting surface; a side cover surrounding the side surface; and a side end member disposed at a side end of the side cover and formed of a material with a higher conductivity than the side cover. The side end of the front cover extends to a region beyond the mounting surface, and the side cover is configured to engage with a lower surface of the front cover corresponding to the region beyond the mounting surface and a side surface of the substrate. The side ends of the front cover and the side ends of the side cover are arranged on the same line, and the side end of the anisotropic conductive layer is disposed between the side surface of the substrate and the side end of the front cover.

[0031] Beneficial effects

[0032] The display device can achieve a seamless effect where the seams are not visually visible by absorbing light incident on the gap between adjacent display modules.

[0033] Furthermore, for display devices, each of the cover and substrate of the display module may individually include a component configured to absorb light incident on or reflected in the gap formed between adjacent display modules, thus making it easier and more efficient to achieve a seamless effect even when multiple display modules are assembled together.

[0034] Furthermore, for display devices, it is possible to prevent the anisotropic conductive layer disposed on the display module of the display device from being disposed outside the display module, thereby preventing the identification of seams that may be generated by the anisotropic conductive layer, and thus preventing current from flowing through the anisotropic conductive layer from the outside. The display device can prevent the display module from being damaged by electrostatic discharge. Attached Figure Description

[0035] Figure 1 This is a diagram illustrating a display device according to an embodiment of the present disclosure.

[0036] Figure 2 It shows Figure 1 An exploded view of the main configuration of the display device.

[0037] Figure 3 It shows Figure 1 The image shows an enlarged cross-sectional view of a portion of a display module.

[0038] Figure 4 It shows Figure 1 The rear perspective view of the display module of the display device shown.

[0039] Figure 5 It shows Figure 1The view shown is a perspective view of a portion of the configuration of the display module.

[0040] Figure 6 It shows Figure 1 A cross-sectional view of a portion of the configuration of the display device relative to a second direction.

[0041] Figure 7 It shows Figure 6 An enlarged cross-sectional view of a portion of the configuration shown.

[0042] Figure 8 It shows Figure 1 A cross-sectional view of a portion of the configuration of a display device relative to a third direction.

[0043] Figure 9 It shows Figure 8 An enlarged cross-sectional view of a portion of the configuration shown.

[0044] Figure 10 It is shown schematically. Figure 1 A diagram showing the electrostatic discharge (ESD) flow as part of the configuration of the display device.

[0045] Figure 11 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present disclosure.

[0046] Figure 12 This is a diagram illustrating the manufacturing process of a display device according to an embodiment of the present disclosure.

[0047] Figure 13 It is shown in Figure 12 A diagram illustrating the manufacturing process of the subsequent display device.

[0048] Figure 14 This disclosure shows that Figure 13 A diagram illustrating the manufacturing process of the subsequent display device.

[0049] Figure 15 This disclosure shows that Figure 14 A diagram illustrating the manufacturing process of the subsequent display device.

[0050] Figure 16 This disclosure shows that Figure 15 A diagram illustrating the manufacturing process of the subsequent display device.

[0051] Figure 17 This disclosure shows that Figure 16 A diagram illustrating the manufacturing process of the subsequent display device.

[0052] Figure 18 This is an enlarged cross-sectional view showing a portion of the configuration of a display device according to another embodiment of the present disclosure relative to a second direction.

[0053] Figure 19 FIG. 4 is an enlarged cross-sectional view showing a portion of the configuration of the display device according to another embodiment of the disclosure with respect to a third direction.

[0054] Figure 20 FIG. 5 is an enlarged cross-sectional view showing a portion of the configuration of the display device according to another embodiment of the disclosure with respect to a second direction. DETAILED DESCRIPTION

[0055] The embodiments described in the disclosure and the configurations shown in the drawings are only examples, and the scope of the disclosure should be understood to include various modifications or equivalents of the embodiments as of the filing date of the present application.

[0056] The singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The shapes and the dimensions of the elements in the drawings can be exaggerated for the purpose of clarity.

[0057] In the disclosure, the terms "include," "comprise," "have," and the like are used to designate the presence of features, numbers, steps, operations, elements, components, or a combination thereof, but do not preclude the presence or addition of one or more of the features, numbers, steps, operations, elements, components, or a combination thereof.

[0058] In addition, in the disclosure, the meaning of "the same" includes things that are similar in properties to each other or similar within a certain range. In addition, "the same" means "substantially the same." It should be understood that "substantially the same" means that a value corresponding to a negligible range with respect to a reference value or a numerical value corresponding to a manufacturing error range is included in the range of "the same."

[0059] Hereinafter, embodiments according to the disclosure will be described in detail with reference to the accompanying drawings.

[0060] Figure 1 FIG. 1 is a diagram showing a display device according to an embodiment of the disclosure, Figure 2 is an exploded view showing a main configuration of the display device of Figure 1 Figure 3 is a diagram showing Figure 1 is an enlarged cross-sectional view showing a portion of one display module shown in Figure 4 is a diagram showing Figure 1 is a rear perspective view of a display module of the display device shown in Figure 5 is a diagram showing Figure 1 is a perspective view showing a portion of the configuration of the display module shown in

[0061] ​A portion of the configuration of the display device 1 and the plurality of inorganic light emitting diodes 50 shown in the drawing are components in a micro unit having a size of several μm to several hundred μm, and the size of some components (e.g., the plurality of inorganic light emitting diodes 50 and the black matrix 48, etc.) is exaggerated for ease of description.

[0062] The display device 1 is a device that displays information, materials, data, etc. as characters, numbers, graphics, images, etc., and a television, a personal computer, a mobile device, and a digital signage can be implemented as the display device 1.

[0063] According to an embodiment of the disclosure, as shown in Figure 1 and Figure 2 The display device 1 can include a display panel 20 disposed to display an image, a power supply device configured to supply power to the display panel 20, a main board 25 configured to control the overall operation of the display panel 20, a frame 15 disposed to support the display panel 20, and a back cover 10 disposed to cover a rear surface of the frame 15.

[0064] The display panel 20 can include a plurality of display modules 30A to 30P, a driver board configured to drive each of the display modules 30A to 30P, and a timing controller (T-con) board configured to generate a timing signal to control each of the display modules 30A to 30P.

[0065] The back cover 10 can support the display panel 20. The back cover 10 can be installed on a floor using a stand, or can be installed on a wall using a hanger.

[0066] The plurality of display modules 30A to 30P can be arranged vertically and horizontally adjacent to each other, for example, in a continuous arrangement. The plurality of display modules 30A to 30P can be arranged in an M x N matrix. In the present embodiment, 16 display modules 30A to 30P are provided, and the 16 display modules 30A to 30P are arranged in a 4 x 4 matrix, but there is no limitation on the number and arrangement method of the plurality of display modules 30A to 30P.

[0067] The plurality of display modules 30A to 30P can be installed in the frame 15. The plurality of display modules 30A to 30P can be installed in the frame 15 by various known methods, for example, magnetic force using a magnet or a mechanical assembly structure. The back cover 10 can be coupled to the rear of the frame 15, and the back cover 10 can form the rear appearance of the display device 1.

[0068] The back cover 10 can include a metal material. Accordingly, heat generated from the plurality of display modules 30A to 30P and the frame 15 can be easily conducted to the back cover 10 to improve the heat dissipation efficiency of the display device 1.

[0069] As described above, the display device 1 can implement a large screen by tiling the plurality of display modules 30A to 30P.

[0070] As another example, a single display module among the plurality of display modules 30A to 30P can be applied to a display device. That is, the display modules 30A to 30P can be installed and applied as a single unit in a wearable device, a portable device, a handheld device, and an electronic product or electronic component requiring a display. As described in the disclosure, the plurality of display modules 30A to 30P can be assembled in a matrix type and then applied to a display device such as a monitor of a personal computer (PC), a high-resolution TV, a signboard, or an electronic display.

[0071] The plurality of display modules 30A to 30P can include the same configuration. Therefore, the following description of any display module can equally apply to all other display modules.

[0072] Hereinafter, since all of the plurality of display modules 30A to 30P are identically formed, each of the plurality of display modules 30A to 30P will be described with reference to the first display module 30A.

[0073] That is, in order to avoid repetitive description, the display module 30, the substrate 40, and the front cover 70 will be described as representatives of the configuration of the plurality of display modules 30A to 30P.

[0074] In addition, the first display module 30A among the plurality of display modules 30A to 30P, a second display module 30E arranged adjacent to the first display module 30A in a second direction Y, and a third display module 30B arranged adjacent in a third direction Z will be described as needed.

[0075] Among the plurality of display modules 30A to 30P, the first display module 30A can be formed in a quadrilateral type. Alternatively, the first display module 30A can be provided in a rectangular type or a square type.

[0076] Therefore, the first display module 30A can include edges 31, 32, 33, and 34 formed in upper, lower, left, and right directions with respect to a first direction X, which is a front direction perpendicular to a display surface of the display device 1.

[0077] As Figure 3 indicated, each of the plurality of display modules 30A to 30P can include a substrate 40 and a plurality of inorganic light emitting diodes 50 mounted on the substrate 40. The plurality of inorganic light emitting diodes 50 can be mounted on a mounting surface 41 of the substrate 40 facing the first direction X. In Figure 3 In order to facilitate description, the thickness of the substrate 40 in the first direction X is shown as being enlarged.

[0078] The substrate 40 can be formed in a quadrilateral type. As described above, each of the plurality of display modules 30A to 30P can be provided in a quadrilateral type, and thus the substrate 40 can be formed in a quadrilateral type to correspond to the type of the display module.

[0079] Alternatively, the substrate 40 can be provided in a rectangular type or a square type.

[0080] Thus, for the first display module 30A, the substrate 40 can include 4 edges E corresponding to the edges 31, 32, 33, and 34 of the first display module 30A formed in the up, down, left, and right four directions with respect to the first direction X as the front direction (see FIG. 1). Figure 5 ).

[0081] The substrate 40 can include a substrate body 42, a mounting surface 41 forming one surface of the substrate body 42, a rear surface 43 disposed at an opposite side of the mounting surface 41 and forming another surface of the substrate body 42, and a side surface 45 disposed between the mounting surface 41 and the rear surface 43.

[0082] The side surface 45 can form a side end of the substrate 40 in a second direction Y and a third direction Z perpendicular to the first direction X.

[0083] The substrate 40 can include a chamfer 49 formed between the mounting surface 41 and the side surface 45 and between the rear surface 43 and the side surface 45.

[0084] The chamfer 49 can prevent the respective substrates from colliding and being damaged when the plurality of display modules 30A to 30P are disposed.

[0085] The edge E of the substrate 40 can include the side surface 45 and the chamfer 49.

[0086] The substrate 40 can include a thin film transistor (TFT) layer 44 formed on the substrate body 42 to drive the inorganic light emitting diode 50. The substrate body 42 can include a glass substrate. That is, the substrate 40 can include a chip on glass (COG) type substrate. First and second pad electrodes 44a and 44b provided to electrically connect the inorganic light emitting diode 50 to the TFT layer 44 can be formed on the substrate 40.

[0087] The TFTs forming the thin film transistor (TFT) layer 44 are not limited to a specific structure or type and can be configured in various embodiments. That is, the TFTs of the TFT layer 44 according to an embodiment of the disclosure can be implemented as organic TFTs and graphene TFTs as well as low temperature poly-silicon (LTPS) TFTs, oxide TFTs, and Si TFTs such as poly-silicon or amorphous silicon TFTs.

[0088] Alternatively, when the substrate body 42 of the substrate 40 is formed of a silicon wafer, the TFT layer 44 can be replaced with a complementary metal-oxide semiconductor (CMOS) transistor or an n-type MOSFET or p-type MOSFET transistor.

[0089] The plurality of inorganic light emitting diodes 50 can be formed of an inorganic material, and can include inorganic light emitting diodes having sizes of several μm to several tens of μm in width, length, and height, respectively. The length of a short side among the width, length, and height of the micro inorganic light emitting device can be 100 μm or less. That is, the inorganic light emitting device 50 can be picked up from a sapphire or silicon wafer, and directly transferred onto the substrate 40. The plurality of inorganic light emitting diodes 50 can be picked up and transferred by an electrostatic method using an electrostatic head or an imprint method using an elastic polymer material such as PDMS or silicon as a head.

[0090] The plurality of inorganic light emitting diodes 50 can be a light emitting structure including an n-type semiconductor 58a, an active layer 58c, a p-type semiconductor 58b, a first contact electrode 57a, and a second contact electrode 57b.

[0091] Any one of the first contact electrode 57a and the second contact electrode 57b can be electrically connected to the n-type semiconductor 58a, and the other of the first contact electrode 57a and the second contact electrode 57b can be electrically connected to the p-type semiconductor 58b.

[0092] The first contact electrode 57a and the second contact electrode 57b can be a flip-chip type in which the first contact electrode 57a and the second contact electrode 57b are horizontally arranged to face the same direction (a direction opposite to a light emitting direction).

[0093] The inorganic light emitting device 50 can include a light emitting surface 54 arranged to face a first direction X, a side surface 55, and a bottom surface 56 arranged to be opposite to the light emitting surface 54, based on an arrangement in which the inorganic light emitting device 50 is mounted on the mounting surface 41. The first contact electrode 57a and the second contact electrode 57b can be formed on the bottom surface 56.

[0094] That is, the contact electrodes 57a and 57b of the inorganic light emitting device 50 can be arranged at opposite sides of the light emitting surface 54, and thus, the contact electrodes 57a and 57b can be arranged at opposite sides of the light emitting direction.

[0095] The contact electrodes 57a and 57b can be arranged to face the mounting surface 41, and provided to be electrically connected to the TFT layer 43. The light emitting surface 54 that emits light can be arranged in a direction opposite to an arrangement direction of the contact electrodes 57a and 57b.

[0096] Therefore, when light generated from the active layer 58c is emitted through the light emitting surface 54 in the first direction X, the light can be emitted toward the first direction X without interfering with the first contact electrode 57a or the second contact electrode 57b.

[0097] That is, the first direction X can be defined as a direction in which the light emitting surface 54 is arranged to emit light.

[0098] The first contact electrode 57a and the second contact electrode 57b can be electrically connected with the first pad electrode 44a and the second pad electrode 44b formed on the mounting surface 41 side of the substrate 40, respectively.

[0099] The inorganic light emitting device 50 can be directly connected to the pad electrodes 44a and 44b through the anisotropic conductive layer 47 or a joining structure such as solder.

[0100] The anisotropic conductive layer 47 can be formed on the substrate 40 as a medium for electrical joining between the contact electrodes 57a and 57b and the pad electrodes 44a and 44b. The anisotropic conductive layer 47 can include a structure in which an anisotropic conductive adhesive is attached to a protective film, and specifically, can include a structure in which conductive balls 47a are dispersed in an adhesive resin. The conductive balls 47a can be conductive balls surrounded by a thin insulating film, and can be electrically connected to each other and / or to other conductors when the insulating film is broken by pressure.

[0101] The anisotropic conductive layer 47 can include an anisotropic conductive film (ACF) in the form of a film and an anisotropic conductive paste (ACP) in the form of a paste.

[0102] In an embodiment, the anisotropic conductive layer 47 can be provided with an anisotropic conductive film.

[0103] Therefore, by pressure applied to the anisotropic conductive layer 47 when the plurality of inorganic light emitting diodes 50 are mounted on the substrate 40, the insulating film of the conductive balls 47a can be broken, and thus the contact electrodes 57a and 57b of the inorganic light emitting device 50 can be electrically connected to the pad electrodes 44a and 44b of the substrate 40.

[0104] However, the plurality of inorganic light emitting diodes 50 can be mounted on the substrate 40 through solder instead of the anisotropic conductive layer 47. After aligning the inorganic light emitting devices 50 on the substrate 40, the inorganic light emitting devices 50 can be joined to the substrate 40 through a reflow process.

[0105] The plurality of inorganic light emitting diodes 50 can include a red light emitting device 51, a green light emitting device 52, and a blue light emitting device 53. For the inorganic light emitting device 50, the series of red light emitting device 51, green light emitting device 52, and blue light emitting device 53 can be mounted as one unit on the mounting surface 41 of the substrate 40. The series of red light emitting device 51, green light emitting device 52, and blue light emitting device 53 can form a single pixel. In this case, the red light emitting device 51, green light emitting device 52, and blue light emitting device 53 can each form a sub-pixel.

[0106] In an embodiment, the red light emitting device 51, green light emitting device 52, and blue light emitting device 53 can be arranged in a line at predetermined intervals, and alternatively, can be arranged in other shapes such as a triangle.

[0107] The substrate 40 can include a light absorbing layer 44c to absorb external light to improve contrast. The light absorbing layer 44c can be formed on the entire mounting surface 41 of the substrate 40. The light absorbing layer 44c can be formed between the TFT layer 43 and the anisotropic conductive layer 47.

[0108] The plurality of display modules 30A to 30P can further include a black matrix 48 formed between the plurality of inorganic light emitting diodes 50.

[0109] The black matrix 48 can perform a function to complement the light absorbing layer 44c integrally formed on the mounting surface 41 side of the substrate 40. That is, the black matrix 48 can absorb external light so that the substrate 40 appears black, thereby improving the contrast of the picture.

[0110] Appropriately, the black matrix 48 has a black color.

[0111] According to an embodiment, the black matrix 48 can be arranged between the pixels formed by the series of red light emitting device 51, green light emitting device 52, and blue light emitting device 53. As another example, the black matrix 48 can be more precisely formed to separate each of the light emitting devices 51, 52, and 53 corresponding to the sub-pixels.

[0112] The black matrix 48 can be formed in a grid shape having a horizontal pattern and a vertical pattern to be arranged between the pixels.

[0113] The black matrix 48 can be formed by applying light absorbing ink on the anisotropic conductive layer 47 via an inkjet process and then curing the light absorbing ink, or by applying a light absorbing film on the anisotropic conductive layer 47.

[0114] That is, on the anisotropic conductive layer 47 integrally formed on the mounting surface 41, the black matrix 48 can be arranged on spaces between the plurality of inorganic light emitting diodes 50 in which the plurality of inorganic light emitting diodes 50 are not mounted.

[0115] The plurality of display modules 30A to 30P can include a front cover 70 disposed on the mounting surface 41 in the first direction X to cover the mounting surface 41 of the plurality of display modules 30A to 30P.

[0116] A plurality of front covers 70 can be provided so as to be formed on the plurality of display modules 30A to 30P, respectively, in the first direction X (see Figure 6 and Figure 7 ).

[0117] Each of the plurality of display modules 30A to 30P can be assembled after the separate front cover 70 is formed. That is, for a first display module 30A and a second display module 30E among the plurality of display modules 30A to 30P, a first front cover 70A can be formed on the mounting surface 41 of the first display module 30A, and a second front cover 70E can be formed on the mounting surface 41 of the second display module 30E.

[0118] The front cover 70 can be provided to cover the substrate 40 to protect the substrate 40 from external force or external moisture.

[0119] The plurality of layers of the front cover 70 can be provided as a functional film having optical properties. This will be described in detail hereinafter.

[0120] A part of the plurality of layers of the first cover 70 can include a base layer formed of an optically clear resin (OCR). The base layer can be provided to support the plurality of other layers. The OCR can be in a highly transparent state having a transmittance of 90% or more.

[0121] The OCR can improve visibility and image quality by increasing transmittance according to low reflectance properties. That is, in a structure including an air gap, light loss can occur due to a difference in refractive index between a film layer and an air layer. However, in a structure including the OCR, the difference in refractive index can be reduced, and thus light loss can also be reduced, thereby improving visibility and image quality.

[0122] That is, the OCR can improve image quality and protect the substrate 40.

[0123] A part of the plurality of layers can include an adhesive layer provided to join the front cover 70 to the mounting surface 41 of the substrate 40.

[0124] In general, the front cover 70 can be provided to have a predetermined height or greater in the first direction X in which the mounting surface 41 or the light emitting surface 54 faces.

[0125] This is to sufficiently fill a gap that can be formed between the front cover 70 and the plurality of inorganic light emitting diodes 50 when the front cover 70 is formed on the substrate 40.

[0126] In addition, each of the plurality of display modules 30A to 30P can include a rear adhesive tape 61 disposed between the rear surface 43 and the metal plate 60 to join the metal plate 60 to the rear surface 43 of the substrate 40.

[0127] The rear adhesive tape 61 can be provided as a double-sided adhesive tape, but is not limited thereto, and can be provided in the form of an adhesive layer instead of a tape shape. That is, the rear adhesive tape 61 is an example of a medium for joining the metal plate 60 to the rear surface 43 of the substrate 40, and is not limited to a tape, but can be provided in various medium shapes.

[0128] The plurality of inorganic light emitting diodes 50 can be electrically connected to a pixel driving wire formed on the mounting surface 41, and an upper wire layer extending through the side surface 45 of the substrate 40 and formed as a pixel driving wire.

[0129] The upper wire layer can be formed below the anisotropic conductive layer 47. The upper wire layer can be electrically connected to a side wire 46 formed on the side surface 45 of the substrate 40. The side wire 46 can be provided in the form of a thin film (see, for example, Figure 5 ). The side wire 46 can include a side wire coating layer 46b surrounding the side wire 46 to prevent damage that can occur when the side wire 46 is exposed to the outside (see, Figure 9 ).

[0130] When assuming that a first direction X facing the front of the display device 1, a direction perpendicular to the first direction X and corresponding to the left-right direction of the display device 1 is defined as a second direction Y, and a direction perpendicular to the first direction X and the second direction Y and corresponding to the up-down direction of the display device 1 is defined as a third direction Z, the side wire 46 can extend to the rear surface 43 of the substrate along the chamfer 49 and the side surface 45 of the substrate 40 in the third direction Z.

[0131] However, the present disclosure is not limited thereto, and the side wire 46 can extend to the rear surface 43 of the substrate 40 along the chamfer 49 and the side surface 45 of the substrate 40 in the second direction Y.

[0132] According to an embodiment, the side wire 46 can extend along one or more edges E of the substrate 40 corresponding to the upper edge 32 and / or the lower edge 34 of the first display module 30A.

[0133] However, the present disclosure is not limited thereto, and the side wire 46 can extend along one or more edges E of the substrate 40 corresponding to at least two edges among the four edges 31, 32, 33, and 34 of the first display module 30A.

[0134] The upper wire layer can be connected to the side wire 46 through an upper connection pad formed on the edge E side of the substrate 40.

[0135] The side wiring 46 can extend along the side surface 45 of the substrate 40, and can be connected to the rear wiring layer 43b formed on the rear surface 43.

[0136] The insulating layer 43c covering the rear wiring layer 43b can be formed on the rear wiring layer 43b in a direction in which the rear surface of the substrate 40 faces.

[0137] That is, the plurality of inorganic light emitting diodes 50 can be sequentially electrically connected to the upper wiring layer, the side wiring 46, and the rear wiring layer 43b.

[0138] In addition, as Figure 4 indicated, the display module 30A can include a driver circuit board 80 disposed to electrically control the plurality of inorganic light emitting diodes 50 mounted on the mounting surface 41. The driver circuit board 80 can be formed of a printed circuit board. The driver circuit board 80 can be disposed on the rear surface 43 of the substrate 40 in the first direction X. Although described in detail later, the driver circuit board 80 can be disposed on the metal plate 60 that is engaged with the rear surface 43 of the substrate 40.

[0139] The display module 30A can include a flexible film 81 connecting the driver circuit board 80 to the rear wiring layer 43b to allow the driver circuit board 80 to be electrically connected to the plurality of inorganic light emitting diodes 50.

[0140] Specifically, one end of the flexible film 81 can be connected to a rear connection pad 43d disposed on the rear surface 43 of the substrate 40 and electrically connected to the plurality of inorganic light emitting diodes 50.

[0141] The rear connection pad 43d can be electrically connected to the rear wiring layer 43b. Accordingly, the rear connection pad 43d can electrically connect the rear wiring layer 43b to the flexible film 81 (see, for example, Figure 7 and Figure 8 ).

[0142] Since the flexible film 81 is electrically connected to the rear connection pad 43d, the flexible film 81 can transmit power and electrical signals from the driver circuit board 80 to the plurality of inorganic light emitting diodes 50.

[0143] The flexible film 81 can be formed of a flexible flat cable (FFC) or a chip on film (COF). The flexible film 81 can include a first flexible film 81a and a second flexible film 81b disposed in an up-down direction (e.g., a Z direction), respectively.

[0144] The first flexible film 81a and the second flexible film 81b are not limited thereto and can be disposed in a left-right direction (e.g., a Y direction), or can be disposed in at least two directions among the up, down, left, and right directions, respectively.

[0145] A plurality of second flexible films 81b can be provided. However, the present disclosure is not limited thereto, and a single second flexible film 81b can be provided, and a plurality of first flexible films 81a can also be provided.

[0146] The first flexible film 81a can transmit a data signal from the driver circuit board 80 to the substrate 40. The first flexible film 81a can be formed of a COF.

[0147] The second flexible film 81b can transmit power from the driver circuit board 80 to the substrate 40. The second flexible film 81b can be formed of an FFC.

[0148] However, the present disclosure is not limited thereto, and the first flexible film 81a can be formed of an FFC, and the second flexible film 81b can be formed of a COF.

[0149] The driver circuit board 80 can be electrically connected to the main board 25 (see Figure 2 ). The main board 25 can be disposed at the rear side of the frame 15, and at the rear portion of the frame 15, the main board 25 can be connected to the driver circuit board 80 through a cable.

[0150] As described above, the metal plate 60 can be provided to be in contact with the substrate 40. The metal plate 60 and the substrate 40 can be engaged with each other by a rear adhesive tape 61 disposed between the rear surface 43 of the substrate 40 and the metal plate 60.

[0151] The metal plate 60 can be formed of a metal material having a high thermal conductivity. For example, the metal plate 60 can be formed of an aluminum material.

[0152] Heat generated by the plurality of inorganic light emitting diodes 50 mounted to the substrate 40 and the TFT layer 44 can be transferred to the metal plate 60 through the rear adhesive tape 61 along the rear surface 43 of the substrate 40.

[0153] Accordingly, heat generated by the substrate 40 can be easily transferred to the metal plate 60, and the substrate 40 can be prevented from rising above a predetermined temperature.

[0154] The plurality of display modules 30A to 30P can be disposed in an M x N matrix form at various positions. Each of the display modules 30A to 30P is provided to be individually movable. In this case, each of the display modules 30A to 30P can include the metal plate 60 to maintain a certain level of heat dissipation performance regardless of where each of the display modules 30A to 30P is disposed.

[0155] The plurality of display modules 30A to 30P can be provided in various M x N matrix forms so as to form screens of various sizes of the display device 1. According to an embodiment, instead of heat dissipation through a single metal plate provided for heat dissipation, each of the display modules 30A to 30P can include an independent metal plate 60 so as to individually dissipate heat, thereby improving heat dissipation performance of the entire display device 1.

[0156] When a single metal plate is arranged inside the display device 1, a portion of the metal plate can not be arranged at a position corresponding to a position at which some of the display modules are arranged in the front-rear direction, and the metal plate can be arranged at a position corresponding to a position at which none of the display modules are arranged in the front-rear direction. Accordingly, heat dissipation efficiency of the display device 1 can be reduced.

[0157] That is, regardless of positions of the display modules 30A to 30P, the display modules 30A to 30P can perform self-heat dissipation through the metal plates 60 arranged on the display modules 30A to 30P, and thus heat dissipation performance of the entire display modules 30A to 30P can be improved.

[0158] The metal plate 60 can be provided in a quadrangular shape substantially corresponding to a shape of the substrate 40.

[0159] An area of the substrate 40 can be at least equal to or greater than an area of the metal plate 60. In response to the substrate 40 and the metal plate 60 being arranged side by side in the first direction X (e.g., stacked in the X direction), four edges of the substrate 40 having a rectangular shape can be formed to correspond to four edges of the metal plate 60 with respect to a center of the substrate 40 and the metal plate 60, or the four edges of the substrate 40 having a rectangular shape can be formed to be arranged outside with respect to the four edges of the metal plate 60.

[0160] Appropriately, the four edges E of the substrate 40 are arranged outside the four edges of the metal plate 60. That is, an area of the substrate 40 can be provided to be greater than an area of the metal plate 60.

[0161] The substrate 40 and the metal plate 60 can be thermally expanded by heat transferred to each of the display modules 30A to 30P. Since a thermal expansion coefficient of the metal plate 60 is higher than a thermal expansion coefficient of the substrate 40, a value at which the metal plate 60 is expanded is greater than a value at which the substrate 40 is expanded.

[0162] In this case, in response to the four edges E of the substrate 40 being formed to correspond to the four edges of the metal plate 60 or to be arranged inside with respect to the four edges of the metal plate 60, edges of the metal plate 60 can protrude to an outside of the substrate 40.

[0163] Accordingly, the interval distance between the gaps formed between the respective display modules 30A to 30P can be irregularly formed by thermal expansion of the metal plate 60 of each of the modules 30A to 30P. Accordingly, it can be easy to identify some of the seams, thereby possibly reducing the overall sense in the picture of the display panel 20.

[0164] However, when the four edges E of the substrate 40 are arranged outside the four edges of the metal plate 60, the metal plate 60 can not protrude outside the four edges E of the substrate 40 even when thermal expansion occurs in the substrate 40 and the metal plate 60. Accordingly, the interval distance of the gaps formed between the display modules 30A to 30P can be maintained constant.

[0165] In addition, in order to maintain the constant interval distance of the gaps formed between the display modules 30A to 30P, the frame 15 supporting the display modules 30A to 30P can include a front surface having a material property similar to that of the substrate 40. That is, each of the display modules 30A to 30P can be joined to the front surface of the frame 15.

[0166] According to an embodiment of the disclosure, the area of the substrate 40 can be set to substantially correspond to the area of the metal plate 60. Accordingly, heat generated from the substrate 40 can be uniformly dissipated in the entire area of the substrate 40, without being isolated to a partial area.

[0167] The metal plate 60 can be joined to the rear surface 43 of the substrate 40 through a rear adhesive tape 61.

[0168] The size of the rear adhesive tape 61 can correspond to the size of the metal plate 60. That is, the area of the rear adhesive tape 61 can be set to correspond to the area of the metal plate 60. The metal plate 60 can be set to a substantially quadrangular shape, and the rear adhesive tape 61 can be set to a quadrangular shape to correspond to the shape of the metal plate 60.

[0169] The edges of the metal plate 60 of the rectangular shape and the edges of the rear adhesive tape 61 can be formed to correspond to each other with respect to the centers of the metal plate 60 and the rear adhesive tape 61.

[0170] Accordingly, the metal plate 60 and the rear adhesive tape 61 can be easily manufactured in a single coupling configuration, thereby improving the manufacturing efficiency of the entire display apparatus 1.

[0171] That is, when the metal plate 60 is cut from one plate into a unit number, the rear adhesive tape 61 can be pre-joined to the one plate before the metal plate 60 is cut, and thus, the rear adhesive tape 61 and the metal plate 60 can be simultaneously cut into the unit number, thereby simplifying the process.

[0172] The heat generated by the substrate 40 can be transferred to the metal plate 60 through the rear adhesive tape 61. Accordingly, the rear adhesive tape 61 can be provided to bond the metal plate 60 to the substrate 40 while transferring the heat generated by the substrate 40 to the metal plate 60.

[0173] Accordingly, the rear adhesive tape 61 can include a material having a high heat dissipation property.

[0174] Basically, the rear adhesive tape 61 can include a material having an adhesive property to bond the substrate 40 and the metal plate 60.

[0175] In addition, the rear adhesive tape 61 can include a material having a higher heat dissipation property than a material having a general adhesive property. Accordingly, heat can be effectively transferred from between the substrate 40 and the metal plate 60 to each component.

[0176] In addition, the material having an adhesive property of the rear adhesive tape 61 can be formed of a material having a higher heat dissipation property than an adhesive material forming a general adhesive.

[0177] A material having a higher heat dissipation property refers to a material having a high thermal conductivity, a high heat transfer rate, and a low specific heat for effective transfer of heat.

[0178] For example, the rear adhesive tape 61 can include a graphite material. However, the present disclosure is not limited thereto, and the rear adhesive tape 61 can generally be formed of a material having a high heat dissipation property.

[0179] The flexibility of the rear adhesive tape 61 can be greater than the flexibility of the substrate 40 and the metal plate 60. Accordingly, the rear adhesive tape 61 can be formed of a material having a high flexibility while having an adhesive property and a heat dissipation property. The rear adhesive tape 61 can be formed of an inorganic double-sided tape. As described above, the rear adhesive tape 61 is formed of an inorganic tape, and thus the rear adhesive tape 61 can be provided as a single layer between one surface bonded to the substrate 40 and another surface bonded to the metal plate 60, without a base material supporting the one surface and the another surface.

[0180] Since the rear adhesive tape 61 does not include a base material, the rear adhesive tape 61 can not include a material that interferes with heat conduction, thereby improving the heat dissipation property. However, the rear adhesive tape 61 is not limited to an inorganic double-sided tape, and can be provided as a heat dissipation tape having a better heat dissipation property than a general double-sided tape.

[0181] As described above, since the substrate 40 is formed of a glass material and the metal plate 60 is formed of a metal material, material properties thereof can be different from each other, and thus the degree to which the materials are deformed by the same heat can be different. That is, in response to heat generated in the substrate 40, the substrate 40 and the metal plate 60 can be thermally expanded to different sizes due to the heat. Accordingly, the display module 30A can be damaged.

[0182] The substrate 40 and the metal plate 60 have different expansion values at the same temperature, and thus, when the substrate 40 and the metal plate 60 expand to different sizes in a state in which the substrate 40 and the metal plate 60 are fixed to each other, stress can occur in the substrate 40 and the metal plate 60.

[0183] With respect to material properties, each material has a different coefficient of thermal expansion, and thus, there is a difference in physical deformation of the material due to heat. Specifically, the coefficient of thermal expansion of a metal material is greater than that of glass, and thus, in response to the same amount of heat applied to the substrate 40 and the metal plate 60, the degree to which the metal plate 60 expands and deforms can be greater than the degree to which the substrate 40 expands and deforms.

[0184] Conversely, in response to the substrate 40 and the metal plate 60 being cooled after heat generation in the substrate 40 is terminated, the degree to which the metal plate 60 shrinks and deforms can be greater than the degree to which the substrate 40 shrinks and deforms.

[0185] The substrate 40 and the metal plate 60 are in a state in which they are joined to each other by the rear adhesive tape 61, and thus, when the degree to which the metal plate 60 deforms is greater than the degree to which the substrate 40 deforms, an external force can be transmitted to the substrate 40.

[0186] Conversely, an external force can be transmitted to the metal plate 60 through the substrate 40, but since the rigidity of the glass substrate 40 is less than that of the metal plate 60 formed of metal, the substrate 40 can be damaged.

[0187] The rear adhesive tape 61 can be disposed between the substrate 40 and the metal plate 60 to absorb an external force transmitted in different configurations when the substrate 40 and the metal plate 60 expand to different sizes.

[0188] Thus, an external force can be prevented from being transmitted to the substrate 40 and the metal plate 60, and further, the substrate 40 can be prevented from being damaged.

[0189] The rear adhesive tape 61 can be formed of a material having high flexibility so as to absorb an external force transmitted from the substrate 40 and the metal plate 60. Specifically, the flexibility of the rear adhesive tape 61 can be greater than that of the substrate 40 and the metal plate 60.

[0190] Thus, in response to an external force generated by a change in size of the substrate 40 and the metal plate 60 being transmitted to the rear adhesive tape 61, the rear adhesive tape 61 itself can deform, and thus, the rear adhesive tape 61 can prevent an external force from being transmitted to different configurations.

[0191] The rear adhesive tape 61 can have a predetermined thickness in the first direction X. In response to a state in which the rear adhesive tape 61 expands or shrinks due to heat, the metal plate 60 can expand or shrink in a direction perpendicular to the first direction X as well as in the first direction X, and thus, an external force can be transmitted to the substrate 40.

[0192] In response to expansion or contraction of the metal plate in a direction perpendicular to the first direction X, the thickness of the rear adhesive tape 61 can change, and an external force can be prevented from being transmitted to the substrate 40. Also, the coefficient of thermal expansion of the rear adhesive tape 61 can be different from the coefficients of thermal expansion of the substrate 40 and the metal plate 60.

[0193] Suitably, the coefficient of thermal expansion of the rear adhesive tape 61 is greater than the coefficient of thermal expansion of the substrate 40 and less than the coefficient of thermal expansion of the metal plate 60.

[0194] Accordingly, at the same temperature, the rear adhesive tape 61 can be deformed in different ways by both the substrate 40 and the metal plate 60, and thus, the rear adhesive tape 61 can mitigate deformation of each configuration between the substrate 40 and the metal plate 60.

[0195] Accordingly, the rear adhesive tape 61 can be disposed between and deformed between the substrate 40 and the metal plate 60 to easily absorb an external force generated according to a difference in the coefficient of thermal expansion between the substrate 40 and the metal plate 60.

[0196] The rear adhesive tape 61 can be formed in a predetermined thickness or more. The predetermined thickness indicates a minimum length that enables the rear adhesive tape 61 to remain in a state in which an external force is not applied to the substrate 40 even in response to deformation of the rear adhesive tape 61 caused by thermal expansion of the metal plate 60 and the substrate 40.

[0197] The display module 30A can include a fixing member 82 disposed to couple the frame 15 to the display module 30A.

[0198] The fixing member 82 can be disposed on a rear surface of the metal plate 60 to join the metal plate 60 to the frame 15.

[0199] As described above, the metal plate 60 is formed to have a size corresponding to that of the substrate 40, and can be disposed to cover the entire rear surface 43 of the substrate 40, and thus, the fixing member 82 can be disposed on the rear surface of the metal plate 60.

[0200] However, the present disclosure is not limited thereto, and the fixing member 82 can be disposed to be disposed on the rear surface 43 of the substrate 40. In this case, the substrate 40 can be directly joined to the frame 15 through the fixing member 82.

[0201] As another example, the metal plate 60 can be disposed to cover a portion of the rear surface 43 of the substrate 40, and on the rear surface 43 of the substrate 40, the fixing member 82 can be joined to an area that is not covered by the metal plate 60.

[0202] Suitably, the fixing member 82 is provided with a double-sided tape.

[0203] The front cover 70, the side cover 90, and the anisotropic conductive layer 47 will be described in detail below.

[0204] Figure 6 is a cross-sectional view showing a portion of the configuration of the display device of Figure 1 with respect to a second direction, Figure 7 is an enlarged cross-sectional view showing a portion of the configuration shown in Figure 6 , Figure 8 is a cross-sectional view showing a portion of the configuration of the display device of Figure 1 with respect to a third direction, Figure 9 is an enlarged cross-sectional view showing a portion of the configuration shown in Figure 8 , and Figure 10 is a diagram schematically showing an electrostatic discharge (ESD) flow of a portion of the configuration of the display device of Figure 1 .

[0205] The front cover 70 can protect the substrate 40 from external force, and can reduce visibility of a joint formed by the gap G between adjacent display modules among the plurality of display modules 30A to 30P, and can reduce color deviation between the plurality of display modules 30A to 30P.

[0206] In response to the array of the plurality of display modules 30A to 30P, the plurality of display modules 30A to 30P can include the side cover 90 arranged in the gap G formed between the plurality of display modules 30A to 30P.

[0207] The front cover 70 can extend to the outside of the substrate 40 of the plurality of display modules 30A to 30P in order to absorb light reflected from the gap G between the plurality of display modules 30A to 30P.

[0208] Specifically, the front cover 70 can be provided to extend to the outside of the edge (or side end) 41S of the mounting surface 41 of the substrate 40 in the second direction Y and the third direction Z (see Figure 5 and Figure 6 ).

[0209] In essence, the gap between the respective display modules 30A to 30P can be generated between the side surfaces 45 of the substrates 40 of the respective display modules 30A to 30P. However, according to an embodiment of the disclosure, the gap can refer to a non-display region formed between the respective display modules 30A to 30P, and it can be understood that the gap G formed between the plurality of display modules 30A to 30P refers to a spacing from the side end 41S of the mounting surface 41 of the substrate 40 of a corresponding display module 30A to 30P to the side end 41S of the mounting surface 41 of the substrate 40 of a corresponding display module 30A to 30P adjacent thereto.

[0210] Accordingly, the gap G formed between the plurality of display modules 30A to 30P can refer to a space from the side end 41S of the mounting surface 41 of the substrate 40 of the corresponding display module 30A to 30P to the side end 41S of the mounting surface 41 of the substrate 40 of the corresponding display module 30A to 30P adjacent thereto in the second direction Y or the third direction Z

[0211] The front cover 70 extending from each of the display modules 30A to 30P can be disposed in the gap G between the plurality of display modules 30A to 30P (e.g., disposed over the gap G in the X direction), and thus, the front cover 70 can absorb light emitted to the gap G or light reflected from the gap G, thereby minimizing recognition of the joint.

[0212] In addition, as will be described later, light emitted to the gap G can be absorbed by the side cover 90 of the plurality of display modules 30A to 30P disposed in the gap G, thereby minimizing recognition of the joint.

[0213] As shown in Figure 6 and Figure 7 , the front cover 70 can be provided to extend to the outside of the substrate 40 in the second direction Y. Specifically, the front cover 70 can be provided to extend to the outside with respect to the side surface 45 and the chamfer 49 in the second direction Y.

[0214] According to an embodiment of the disclosure, only one edge side of the substrate 40 corresponding to the right edge 31 of the first display module 30A is described, but the front cover 70 can extend outward in the second direction Y or the third direction Z with respect to the four edges E of the substrate 40.

[0215] That is, the side end 75 of the front cover 70 corresponding to the edge of the front cover 70 can extend to the outside of the substrate 40 with respect to the four edges E of the substrate 40 in the second direction Y or the third direction Z (see, for example, Figure 7 ).

[0216] The front cover 70 can include a plurality of layers each having different optical properties. Each of the plurality of layers can be disposed in a structure stacked in the first direction X.

[0217] The plurality of layers can be joined in the first direction X to form the front cover 70.

[0218] Among the plurality of layers, one layer can be provided as an anti-glare layer. However, the disclosure is not limited thereto, and can be provided as an anti-reflection layer or a layer in which an anti-glare layer and an anti-reflection layer are mixed.

[0219] Among the plurality of layers, the other layer can be provided as a light transmission control layer. However, the disclosure is not limited thereto, and the other layer can be formed of a layer including different physical properties or materials or having different functions. For example, another layer can be provided as a circularly polarized layer.

[0220] In addition, the disclosure is not limited thereto, and the plurality of layers can be provided as a single layer. The single layer can be provided as a layer configured to functionally implement all functions of the plurality of layers.

[0221] As described above, the front cover 70 can include an adhesive layer. The adhesive layer can be disposed at a last side of the plurality of layers in the first direction X and bonded to the mounting surface 41. The adhesive layer can be provided to have a predetermined height or greater in the first direction X in which the mounting surface 41 or the light emitting surface 54 faces.

[0222] This is to sufficiently fill a gap that can be formed between the adhesive layer and the plurality of inorganic light emitting diodes 50 in response to bonding the adhesive layer to the substrate 40.

[0223] The disclosure is not limited thereto, and thus the adhesive layer can be provided as an assembly that is separated from the front cover 70 and disposed between the front cover 70 and the mounting surface 41, thereby bonding the front cover 70 to the mounting surface 41.

[0224] Thus, the front cover 70 can be closely bonded to the mounting surface 41 in order to protect the assembly mounted on the mounting surface 41, and thus the display module 30 can directly bond the front cover 70 to the substrate 40 without an additional molding structure between the front cover 70 and the substrate 40.

[0225] The front cover 70 can be provided to diffusely reflect light incident from the outside in order to prevent user glare caused by specular reflection of light incident from the outside.

[0226] The front cover 70 can diffusely reflect light incident from the outside, and thus can reduce glare and improve contrast of a picture displayed on the display panel 20.

[0227] In addition, the front cover 70 can be provided to reduce transmission of incident external light or external light reflected from the substrate 40 and the gap G.

[0228] The front cover 70 according to an embodiment of the disclosure can include a material that reduces transmission of light and absorbs at least a portion of light transmitted toward the substrate 40 or at least a portion of light reflected from the substrate 40 in the first direction X.

[0229] When a plurality of substrates are manufactured, the color of some substrates can be different due to difficulties in the production process. Thus, substrates having different unique colors can be tiled to form a single display panel.

[0230] As described above, the front cover 70 according to an embodiment of the disclosure absorbs at least a portion of light reflected from the substrate 40 and transmitted to the outside, thereby improving the overall sense of a picture of the display panel 20.

[0231] That is, the front cover 70 can reduce color deviation of each of the plurality of display modules 30A to 30P generated in a production process of the plurality of display modules 30A to 30P by reducing transmission of external light.

[0232] The front cover 70 can prevent transmission of external light incident from the outside to the display panel 20 to the substrate 40, and additionally absorb a portion of light incident from the outside to the display panel 20 or a portion of light reflected from the substrate 40 and transmitted to the outside of the display panel 20. Accordingly, the front cover 70 can improve contrast of a picture displayed on the display panel 20. Different optical actions can be respectively implemented using the plurality of layers described above.

[0233] That is, the front cover 70 can be arranged in front of the substrate 40 with respect to the first direction X to improve contrast that can be reduced in a picture displayed on the display panel 20 due to external light.

[0234] As described above, in the display module 30 according to an embodiment of the disclosure, the front cover 70 can be disposed to extend to the outside of the substrate 40 in the second direction Y.

[0235] Accordingly, a portion of light introduced into the gap G formed between the plurality of display modules 30A to 30P can be blocked by at least a portion of the front cover 70 arranged in the gap G, and at least a portion of external light introduced into the gap G or external light reflected from the gap G can be absorbed by the front cover 70, and thus, light can not be transmitted to the outside. Accordingly, visibility of a joint formed in the gap G can be reduced, and thus, due to the reduction in visibility of the joint, overall sense of a picture displayed on the display panel 20 can be improved.

[0236] Specifically, the side end 75 of the front cover 70 in the second direction Y can be arranged outside the side end 41S of the mounting surface 41 in the second direction Y or arranged in the gap G.

[0237] Accordingly, the front cover 70 can include a first region 71 and a second region 72, wherein the first region 71 is arranged outside the side end 41S of the mounting surface 41 in the second direction Y or arranged in the gap G, and the second region 72 is arranged on the mounting surface 41 in the second direction Y, as Figure 7 shown.

[0238] The first region 71 and the second region 72 of the front cover 70 can be divided by the gap G in the second direction Y.

[0239] The first area 71 of the front cover 70 can be disposed in the gap G, and thus, external light emitted to the outside of the gap G can be blocked by the first area 71 of the front cover 70, and light reflected from the gap G can be prevented from being emitted to the outside. Accordingly, the visibility of a seam, which is a boundary between the plurality of display modules 30A to 30P and is generated by the gap G, can be reduced, and thus, the overall feeling of the display panel 20 can be improved.

[0240] As described above, the front cover 70 can be provided to extend to the outside with respect to the four edges 41S of the mounting surface 41 of the substrate 40, and thus, the visibility of a seam formed at each edge of the plurality of display modules 30A to 30P can be reduced.

[0241] When described by way of example with the first display module 30A and the second display module 30E, the first area 71A of the first front cover 70A extending from the first display module 30A can be disposed in the gap G formed between the first display module 30A and the second display module 30E.

[0242] The side ends 75A and 75E of the front cover 70A of the first module 30A and the front cover 70E of the second module 30E adjacent to each other can be disposed in the gap G.

[0243] In addition, the side surface 45 and the chamfer 49 of the first display module 30A and the second display module 30E can be disposed in the gap G.

[0244] The second area 72A of the first front cover 70A can be disposed on the mounting surface 41 of the first display module 30A.

[0245] The first area 71E of the second front cover 70E extending from the second display module 30E can be disposed in the gap G formed between the first display module 30A and the second display module 30E. The second area 72E of the second front cover 70E can be disposed on the mounting surface 41 of the second display module 30E.

[0246] That is, the first area 71A of the first front cover 70A and the first area 71E of the second front cover 70E can be disposed side by side in the second direction Y in the gap G formed between the first display module 30A and the second display module 30E.

[0247] The length of the first area 71A of the first front cover 70A and the first area 71E of the second front cover 70E extending in the second direction Y can be substantially less than or equal to half the length of the gap G.

[0248] Accordingly, in response to the first area 71A of the first front cover 70A and the first area 71E of the second front cover 70E being disposed side by side in the second direction Y, the sum of the lengths of the first areas 71A and 71E can be provided to be substantially less than or equal to the length of the gap G.

[0249] According to an embodiment of the disclosure, in response to the first area 71A of the first front cover 70A and the first area 71E of the second front cover 70E being arranged side by side in the second direction Y, a predetermined gap can be formed between the side end 75A of the first front cover 70A and the side end 75E of the second front cover 70E.

[0250] However, the gap can be a relatively small value, and thus can be negligible. Accordingly, the first display module 30A and the second display module 30E can be substantially tiled without a large gap between the first area 71A of the first front cover 70A and the first area 71E of the second front cover 70E.

[0251] As described above, in the gap G between the first display module 30A and the second display module 30E, the first area 71A of the first front cover 70A and the first area 71E of the second front cover 70E can be arranged.

[0252] External light incident on the display panel 20 can be diffusely reflected to the outside of the display panel 20 or partially absorbed by the first areas 71A and 71E while passing through the first area 71A of the first front cover 70A and the first area 71E of the second front cover 70E. Accordingly, the amount of light reaching the gap G can be reduced, and the visibility of the boundary between the first display module 30A and the second display module 30E due to the gap G can be reduced.

[0253] In addition, light reflected from the gap G and directed to the outside of the display panel 20 can be diffusely reflected to the outside of the display panel 20 or partially absorbed by the first areas 71A and 71E while passing through the first area 71A of the first front cover 70A and the first area 71E of the second front cover 70E. Accordingly, the amount of light transmitted to the outside of the display panel 20 can be reduced, and the visibility of the boundary between the first display module 30A and the second display module 30E due to the gap G can be reduced.

[0254] That is, at least a portion of the external light reflected from the gap G can be absorbed while reducing the amount of light introduced into the gap G formed between the plurality of display modules 30A to 30P. Accordingly, the overall sense of the picture of the display panel 20 can be improved.

[0255] In addition, even if the substrate 40A of the first display module 30A and the substrate 40E of the second display module 30E have different colors, at least a portion of the light reflected when each of the substrates 40A and 40E is displayed to the outside by reflection of external light can be absorbed into the first front cover 70A and the second front cover 70E, and thus the unique color of each of the substrates 40A and 40E can not be identified by the outside. Accordingly, the overall sense of the picture of the display panel 20 can be improved.

[0256] The display module 30A can include a side cover 90 disposed under the front cover 70 in a direction in which the mounting surface 41 faces and provided on the side surface 45 of the substrate 40.

[0257] Specifically, the side cover 90 can be disposed in a space formed on the lower surface 76 of the first region 71 of the front cover 70 in the first direction X and the side surface of the substrate 40 in the second direction Y.

[0258] The side cover 90 can be joined to the lower surface 76 of the first region 71, the side surface 45, and at least a portion of the metal plate 60. Appropriately, the side cover 90 is provided to be joined to the entire lower end 76 of the first region 71. Further, appropriately, the side cover 90 is provided to cover the entire region of the side surface 45.

[0259] The lower surface 76 of the first region 71 can correspond to the entire lower surface of the front cover 70, and denote an adhesive layer formed at the last end of the front cover 70.

[0260] In addition, the side cover 90 can be provided to cover all pairs of the chamfers 49 (see, for example, FIG. 6) arranged in the front and rear direction of the side surface 45 in the first direction X. Figure 7 ).

[0261] The side cover 90 can be provided to surround the entire chamfer 49 formed between the mounting surface 41 and the side surface 45 and the side surface 45.

[0262] The side cover 90 is provided to surround the chamfer 49 formed between the mounting surface 41 and the side surface 45, and thus the side cover 90 can fill all spaces formed between the substrate 40 and the front cover 70.

[0263] Accordingly, the side cover 90 can prevent foreign matter or moisture from the outside from entering the space between the substrate 40 and the front cover 70.

[0264] In addition, since the side cover 90 is provided to surround the chamfer 49 formed between the rear surface 43 and the side surface 45, the side cover 90 can fill all spaces formed between the substrate 40 and the metal plate 60.

[0265] Accordingly, the side cover 90 can prevent foreign matter or moisture from the outside from entering the space between the substrate 40 and the metal plate 60.

[0266] The side cover 90 can be provided to be in contact with the lower surface 76 of the first region 71 and the chamfer 49 and the side surface 45 of the substrate 40. Accordingly, the side cover 90 can support the lower surface 76 of the first region 71 and the chamfer 49 and the side surface 45 of the substrate 40.

[0267] As described above, the front cover 70 and the substrate 40 are coupled to each other, and the adhesion of the front cover 70 and the substrate 40 can be improved by the side cover 90. Accordingly, the side cover 90 can prevent the front cover 70 from being separated from the substrate 40.

[0268] That is, the reliability of the display module 30A can be improved by the side cover 90.

[0269] In addition, the substrate 40 and the metal plate 60 are coupled to each other by the rear adhesive tape 61, and the adhesion between the metal plate 60 and the substrate 40 can be improved by the side cover 90. Accordingly, the side cover 90 can prevent the metal plate 60 from being separated from the substrate 40.

[0270] As described above, the side surface 45 of the substrate 40 can be disposed to correspond to the four edges 41S of the mounting surface 41, and the first area 71 of the front cover 70 can extend to the outside with respect to the four edges 41S of the mounting surface 41 along the second direction Y and the third direction Z in which the mounting surface 41 extends.

[0271] The side cover 90 can be disposed to contact the entire lower surface 76 of the first area 71 and surround the side surface 45 corresponding to the four edges 41S of the mounting surface 41 along the periphery of the four edges 41S of the mounting surface 41.

[0272] That is, the side cover 90 can be disposed to seal the entire edge of the portion in which the substrate 40 and the front cover 70 are coupled to each other.

[0273] The side cover 90 can cover the lower surface 76 and the side surface 45 of the first area 71 in all directions perpendicular to the first direction X.

[0274] Accordingly, the coupling between the front cover 70 and the substrate 40 can be improved, and the side cover 90 can protect the side surface 45 of the front cover 70 and the substrate 40 from external forces.

[0275] In addition, as described above, the side cover 90 can prevent external moisture or foreign substances from entering between the substrate 40 and the front cover 70. In addition, even if a space is formed between the substrate 40 and the front cover 70 due to adhesion difficulty, the side cover 90 can prevent external moisture or foreign substances from entering the space.

[0276] The side cover 90 can be disposed to surround all four edges E of the substrate 40 along the side surface 45 of the substrate 40, and thus can be sealed between the substrate 40, the front cover 70, and the metal plate 60.

[0277] Accordingly, even when foreign substances or moisture enter the substrate 40 in any direction, the side cover 90 can prevent the foreign substances or the moisture from entering between the substrate 40 and the front cover 70.

[0278] As described above, since the distal end of the front cover 70 in the first direction X is provided as the adhesive layer, the lower surface 76 of the first area 71 can be provided as a rear surface of the adhesive layer.

[0279] Accordingly, in response to the lower surface 76 of the first area 71 being exposed to the outside, foreign substances flowing in from the outside can be attached to the lower surface 76 of the first area 71.

[0280] In response to the array of the plurality of display modules 30A to 30P in a state in which foreign substances are attached to the lower surface 76 of the first area 71, the recognition of the seams between the plurality of display modules 30A to 30P can be increased by the foreign substances attached to the lower surface 76 of the first area 71.

[0281] However, the display module 30A according to an embodiment of the disclosure includes the side cover 90, and the side cover 90 is provided to cover the lower surface 76 of the first area 71. This can prevent foreign substances from being attached to the lower surface 76 of the first area 71.

[0282] Accordingly, when the plurality of display modules 30A to 30P are arranged, foreign substances can be attached to the front cover 70, and thus, the recognition of the seams generated between the plurality of display modules 30A to 30P can be reduced.

[0283] As will be described later, in response to electrostatic discharge that can occur on the display modules 30A to 30P, a current can flow into the plurality of electronic components mounted on the substrate 40, and thus, the electronic components can be damaged. However, the side cover 90 can seal the substrate 40 with respect to the outside to prevent damage to the electronic components, and thus, prevent charges generated by electrostatic discharge from flowing into the substrate 40.

[0284] That is, the substrate 40 is sealed by the front cover 70 and the side cover 90, and thus, charges generated by electrostatic discharge cannot pass through the front cover 70 and the side cover 90. Accordingly, it is possible to prevent the charges from passing through the substrate 40, and to guide the charges flowing on the front cover 70 and the side cover 90 to the metal plate 60 in contact with the side cover 90, and thus, to provide a path of a current generated by electrostatic discharge. Accordingly, it is possible to increase the FSD withstand voltage of the electronic components mounted on the substrate 40.

[0285] As described above, the side cover 90 can be provided to be disposed under the front cover 70 in a direction in which the mounting surface 41 faces.

[0286] The frontmost surface 92 of the side cover 90 in the first direction X can be provided to be in contact with the lower surface 76 of the first area 71, and can not be disposed above the lower surface 76 of the first area 71 in the first direction X.

[0287] This is to prevent the side cover 90 from being disposed on a moving path of light emitted from the plurality of inorganic light emitting diodes 50.

[0288] In response to at least a portion of the side cover 90 being disposed in front of the lower surface 76 or in front of the front cover 70 in the first direction X, the at least a portion of the side cover 90 can be disposed on a path of light moving through the front cover 70.

[0289] That is, the side cover 90 can absorb or diffusely reflect a portion of light, and thus, a region of an image displayed on the display module 20 can be distorted.

[0290] However, the side cover 90 according to an embodiment of the disclosure is disposed behind the front cover 70 in the first direction X, and thus, the side cover 90 can not limit movement of light emitted by the plurality of inorganic light emitting diodes 50. Accordingly, image quality of the display module 20 can be improved.

[0291] The side end 75 of the front cover 70 in the second direction Y and the side end 91 of the side cover 90 in the second direction Y can be disposed on substantially the same line in the first direction X (for example, the side end 75 and the side end 91 can be coplanar).

[0292] As will be described later, this is because the front cover 70 and the side cover 90 are simultaneously cut during a manufacturing process of the display module 30A. In addition, referring to Figure 18 , the side end member 100 can be joined to the side end 75 of the front cover 70 and the side end 91 of the side cover 90 disposed on substantially the same line in the first direction X.

[0293] That is, it can be made so that a gap formed between the plurality of display modules 30A to 30P in response to an array of the plurality of display modules 30A to 30P is minimized, and it can be made so that a joint recognized by the gap between the plurality of display modules 30A to 30P is minimized.

[0294] The side cover 90 can include a material that absorbs light. For example, the side cover 90 can be formed of an opaque or translucent material.

[0295] In addition, the side cover 90 can include a light-sensitive material. For example, the side cover 90 can be formed of a light-sensitive optical clear resin (OCR). In response to external light (for example, ultraviolet (UV) light) having a wavelength different from that of visible light, a physical property of the light-sensitive material can change, and a color of the light-sensitive material can change to a dark color.

[0296] Accordingly, the side cover 90 can be provided as a material colored to a dark color in response to UV light being emitted to the side cover 90 during a manufacturing process, so as to absorb light.

[0297] The side cover 90 can have a dark color. The side cover 90 can have a color darker than that of the front cover 70.

[0298] Appropriately, the side cover 90 has a color similar to that of the black matrix 48.

[0299] Accordingly, light incident on the side cover 90 can be absorbed by the light-absorbing material of the side cover 90 without being reflected.

[0300] When a plurality of display modules 30A to 30P are arranged, the side cover 90 can be disposed in a gap G formed between the plurality of display modules 30A to 30P together with the first area 71 of the front cover 70.

[0301] Accordingly, light introduced into the gap G can be absorbed, thereby minimizing light introduced into the gap G and reflected toward the outside. Accordingly, the visibility of a seam formed by the gap G formed between the plurality of display modules 30A to 30P can be reduced.

[0302] When described by taking the first display module 30A and the second display module 30E as examples, the first side cover 90A of the first display module 30A and the second side cover 90E of the second display module 30E can be disposed in a gap G formed between the first display module 30A and the second display module 30E together with the first area 71A of the first cover 70A and the first area 71E of the second cover 70E.

[0303] The adjacent side ends 75A and 75E of the front covers 70A and 70E of the first display module 30A and the second display module 30E and the adjacent side ends 91A and 91E of the side covers 90A and 90E of the first display module 30A and the second display module 30E can be disposed in the gap G.

[0304] The adjacent side ends 75A and 75E of the front covers 70A and 70E and the adjacent side ends 91A and 91E of the side covers 90A and 90E can be disposed to face each other. Appropriately, the adjacent side ends 75A and 75E of the front covers 70A and 70E and the adjacent side ends 91A and 91E of the side covers 90A and 90E can be disposed to be parallel to each other.

[0305] That is, in the gap G formed between the first display module 30A and the second display module 30E, the first area 71A of the first front cover 70A and the first area 71E of the second front cover 70E and the first side cover 90A and the second side cover 90E can be disposed side by side in the second direction Y.

[0306] According to the first area 71A of the first front cover 70A and the first area 71E of the second front cover 70E, the length to which the first side cover 90A and the second side cover 90E extend in the second direction Y can be set to be substantially less than or equal to half of the gap G.

[0307] The first region 71A of the first front cover 70A and the first region 71E of the second front cover 70E can be disposed in the gap G formed between the first display module 30A and the second display module 30E, and the first side cover 90A and the second side cover 90E can be disposed behind the first region 71A and the first region 71E, respectively, in the first direction X.

[0308] As described above, the external light incident on the display panel 20 is diffusely reflected to the outside of the display panel 20 or partially absorbed while passing through the first region 71A of the first front cover 70A and the first region 71E of the second front cover 70E. Accordingly, the amount of light reaching the gap G can be reduced.

[0309] Further, even if a portion of the light reaches the gap G, the light introduced into the gap G is absorbed by the first side cover 90A and the second side cover 90E disposed in the gap G, and thus, the visibility of the boundary between the first display module 30A and the second display module 30E can be reduced.

[0310] That is, the light reaching the gap G can be additionally absorbed while reducing the amount of external light introduced into the gap G formed between the plurality of display modules 30A to 30P. Accordingly, the overall sense of the picture of the display panel 20 can be improved.

[0311] The light not absorbed by the first side cover 90A and the second side cover 90E and reflected on the first side cover 90A and the second side cover 90E and directed to the outside of the display panel 20 can be diffusely reflected to the outside of the display panel 20 or partially absorbed in the first regions 71A and 71E while passing through the first front cover 70A and the second front cover 70E. Accordingly, the amount of light transmitted to the outside of the display panel 20 can be reduced, and the visibility of the boundary between the first display module 30A and the second display module 30E due to the gap G can be reduced.

[0312] As described above, the side cover 90 can be disposed in the gap G formed between the plurality of display modules 30A to 30P in response to the array of the plurality of display modules 30A to 30P, and thus, the side cover 90 can absorb the light reaching the gap G so as to reduce the recognition of the joint due to the gap G.

[0313] In the above-described example, the front cover 70 is disposed to reduce the amount of light reaching the substrate 40 by diffusely reflecting, absorbing, circularly polarizing, or changing the reflection direction of a portion of the light introduced into the display module 20.

[0314] However, this disclosure is not limited thereto, and the front cover 70 may be formed of a transparent material that allows light to pass through without distortion. Even in this case, the visibility of the boundary between the multiple display modules 30A to 30P caused by the gap G can be reduced by the side cover 90 arranged between the multiple display modules 30A to 30P.

[0315] As described above, the side cover 90 can be formed of a light-absorbing material, and since at least a portion of the side cover 90 is arranged in front of the front cover 70 in the first direction X, it may absorb a portion of the light emitted from the inorganic light-emitting diode 50. Therefore, a potential problem is that a portion of the image displayed on the display module 20 may be displayed darker.

[0316] However, according to an embodiment of the present disclosure, the side cover 90 is arranged below the front cover 70 in the first direction X, specifically below the lower surface 76 of the first region 71. The side cover 90 may not absorb light emitted from the plurality of inorganic light-emitting diodes 50, therefore, the brightness of the image displayed on the display module 20 can be uniform.

[0317] like Figure 8 and Figure 9 As shown, the front cover 70 can be configured to extend to the outside of the substrate 40 along the third direction Z. Specifically, the front cover 70 can be configured to extend outward relative to the side surface 45 and the chamfer 49 in the third direction Z.

[0318] The side end 75 of the front cover 70 in the third direction Z can be arranged outside the side end 41S of the mounting surface 41 in the third direction Z or arranged in the gap G.

[0319] The first region 71 and the second region 72 of the aforementioned front cover 70 can be divided by a gap G in the third direction Z.

[0320] When the first display module 30A and the third display module 30B are described as examples, the first region 71A of the first front cover 70A extending from the first display module 30A can be arranged in the gap G formed between the first display module 30A and the third display module 30B.

[0321] The adjacent side ends 75A and 75B of the front cover 70A of the first display module 30A and the front cover 70B of the third display module 30B can be arranged in the gap G.

[0322] Furthermore, the side surfaces 45 and chamfers 49 of the first display module 30A and the third display module 30B can be arranged in the gap G.

[0323] The first area 71B of the third front cover 70B extending from the third display module 30B can be disposed in the gap G formed between the first display module 30A and the third display module 30B. The second area 72B of the third front cover 70B can be disposed on the mounting surface 41 of the third display module 30B.

[0324] That is, in the gap G formed between the first display module 30A and the third display module 30B, the first area 71A of the first front cover 70A and the first area 71B of the third front cover 70B can be disposed side by side in the third direction Z.

[0325] The external light incident into the display panel 20 can be diffusely reflected to the outside of the display panel 20 or partially absorbed by the first areas 71A and 71B while passing through the first area 71A of the first front cover 70A and the first area 71B of the third front cover 70B. Accordingly, the amount of light reaching the gap G can be reduced, and thus the visibility of the boundary between the first display module 30A and the third display module 30B due to the gap G can be reduced.

[0326] The light reflected on the gap G and directed to the outside of the display panel 20 can be diffusely reflected to the outside of the display panel 20 or partially absorbed by the first areas 71A and 71B while passing through the first area 71A of the first front cover 70A and the first area 71B of the third front cover 70B. Accordingly, the amount of light transmitted to the outside of the display panel 20 can be reduced, and thus the visibility of the boundary between the first display module 30A and the third display module 30B due to the gap G can be reduced.

[0327] As described above, the side cover 90 can be disposed in the space formed on the side surface of the substrate 40 in the third direction Z and the second direction Y.

[0328] The side wiring 46 can be disposed on the side surface 45 of the substrate 40 disposed in the third direction Z. Accordingly, the side cover 90 provided on the side surface 45 disposed toward the third direction Z can be provided to cover not only the side surface 45 and the chamfer 49 but also the side wiring 46. Accordingly, the side cover 90 can protect the side wiring 46 from an external force and prevent foreign substances or moisture from entering the side wiring 46.

[0329] That is, the side cover 90 can cover the entire lower surface 76 of the first area 71, and can surround the side surface 45 corresponding to the four edges 41S of the mounting surface 41 along the periphery of the four edges 41S of the mounting surface 41. Accordingly, the side cover 90 can surround the side wiring 46 extending along the side surface 45 in the third direction Z.

[0330] Accordingly, coupling between the front cover 70 and the substrate 40 can be improved, and the side cover 90 can protect the front cover 70, the side surface 45 of the substrate 40, and the side wiring 46 from an external force.

[0331] The side end 75 of the front cover 70 in the third direction Z and the side end 91 of the side cover 90 in the third direction Z can be arranged in the same line in the first direction X (for example, the side end 75 and the side end 91 can be coplanar). Appropriately, the side end 75 of the front cover 70 and the side end 91 of the side cover 90 can be arranged in the same line in a direction parallel to the first direction X.

[0332] When described by way of example with the first display module 30A and the third display module 30B, the first side cover 90A of the first display module 30A and the third side cover 90B of the third display module 30B can be arranged together with the first region 71A of the first front cover 70A and the first region 71B of the third front cover 70B in the gap G formed between the first display module 30A and the third display module 30B.

[0333] The adjacent side ends 75A and 75B of the front covers 70A and 70B of the first display module 30A and the third display module 30B and the adjacent side ends 91A and 91B of the side covers 90A and 90B of the first display module 30A and the third display module 30B can be arranged in the gap G.

[0334] The adjacent side ends 75A and 75B of the front covers 70A and 70B and the adjacent side ends 91A and 91B of the side covers 90A and 90B can be arranged to face each other.

[0335] Appropriately, the adjacent side ends 75A and 75B of the front covers 70A and 70B and the adjacent side ends 91A and 91B of the side covers 90A and 90B can be arranged to be parallel to each other.

[0336] That is, in the gap G formed between the first display module 30A and the third display module 30B, the first region 71A of the first front cover 70A and the first region 71B of the third front cover 70B and the first side cover 90A and the third side cover 90B can be arranged side by side in the third direction Z.

[0337] The side end 75 of the front cover 70 and the side end 91 of the side cover 90 in the third direction Z can be formed in the same line in the first direction X. The side end member 100 can be joined to the side end 75 of the front cover 70 and the side end 91 of the side cover 90 in the third direction Z (see, for example, Figure 18 ), and thus, the gap formed between the first display module 30A and the third display module 30B in response to the arrangement of the first display module 30A and the third display module 30B can be minimized.

[0338] In the gap G formed between the first display module 30A and the third display module 30B, the first region 71A of the first front cover 70A and the first region 71B of the third front cover 70B and the first side cover 90A and the third side cover 90B can be arranged side by side in the third direction Z.

[0339] In the gap G formed between the first display module 30A and the third display module 30B, the first region 71A of the first front cover 70A and the first region 71B of the third front cover 70B can be arranged, and the first side cover 90A and the third side cover 90B can be arranged behind the first region 71A and the first region 71B, respectively, in the first direction X.

[0340] As described above, the external light incident on the display panel 20 can be diffusely reflected to the outside of the display panel 20 or partially absorbed while passing through the first region 71A of the first front cover 70A and the first region 71B of the third front cover 70B. Therefore, the amount of light reaching the gap G can be reduced.

[0341] In addition, even when a part of the light reaches the gap G, the light can be absorbed by the first side cover 90A and the third side cover 90B formed in the gap G, and thus, the visibility of the boundary between the first display module 30A and the third display module 30B can be reduced.

[0342] The light not absorbed by the first side cover 90A and the third side cover 90B and reflected on the first side cover 90A and the third side cover 90B and guided to the outside of the display panel 20 can be diffusely reflected to the outside of the display panel 20 or partially absorbed in the first region 71A and 71B while passing through the first region 71A of the first front cover 70A and the first region 71B of the third front cover 70B. Therefore, the amount of light transmitted to the outside of the display panel 20 can be reduced, and thus, the visibility of the boundary between the first display module 30A and the third display module 30B due to the gap G can be reduced.

[0343] The extension length of the side end 47S of the anisotropic conductive layer 47 will be described in detail below.

[0344] As described above, the anisotropic conductive layer 47 can be provided in the shape of an anisotropic conductive film. Although the anisotropic conductive layer 47 will be described in detail later, the anisotropic conductive layer 47 can be provided in the form of a film, and is bonded to the TFT 41.

[0345] The anisotropic conductive layer 47 can be formed in the shape of a film, and thus, the area of the anisotropic conductive layer 47 can be greater than the area of the substrate 40.

[0346] Therefore, after the anisotropic conductive layer 47 is bonded to the TFT layer 41, a process of cutting the anisotropic conductive layer 47 can be performed so that the area of the anisotropic conductive layer 47 corresponds to the area of the substrate 40.

[0347] In the cutting process, the anisotropic conductive layer 47 can be cut by laser cutting so that the area of the anisotropic conductive layer 47 corresponds to the area of the substrate 40.

[0348] Suitably, the anisotropic conductive layer 47 is provided with an area corresponding to the area of the mounting surface 41. However, as described above, since the anisotropic conductive layer 47 is formed of an anisotropic conductive film, it is not easy to make the area of the anisotropic conductive film correspond to the area of the mounting surface 41. Further, in response to bonding the anisotropic conductive film corresponding to the area of the mounting surface 41 to the mounting surface 41, due to the manufacturing tolerance of the anisotropic conductive film, the cross section of the anisotropic conductive film can be smaller than the cross section of the mounting surface 41. Therefore, the reliability of the display module 30 can be reduced.

[0349] Therefore, the anisotropic conductive film having an area larger than the area of the mounting surface 41 can be bonded to the substrate 40, and then the anisotropic conductive film can be cut into an area corresponding to the area of the substrate 40, thereby forming the anisotropic conductive layer 47.

[0350] The side surface 45 can be disposed outside the mounting surface 41 due to the chamfer 49. In this case, suitably, the anisotropic conductive film is cut in the second direction Y with respect to the side surface 45 of the substrate 40, and the anisotropic conductive film is cut in the third direction Z with respect to the side end 46S of the side wiring 46.

[0351] This is because: in response to cutting the anisotropic conductive film with respect to the mounting surface 41, the side surface 45 of the substrate 40, the chamfer 49, or the side wiring 46 can be damaged.

[0352] Therefore, in response to cutting the anisotropic conductive film, the side end 47S of the anisotropic conductive layer 47 can be disposed on the outer region of the mounting surface 41. Specifically, as described above, the anisotropic conductive film is cut based on the side surface 45 or the side end 46S of the side wiring 46, and therefore, suitably, the side end 47S of the anisotropic conductive layer 47 is disposed on the same line as the side end 46S of the side surface 45 or the side wiring 46 with respect to the first direction X (for example, the side end 47S is coplanar with the side surface 45 or the side end 46S). In addition, due to burrs formed on the anisotropic conductive film during cutting or due to process tolerance, the side end 47S of the anisotropic conductive layer 47 can be disposed outside with respect to the side end 46S of the side surface 45 or the side wiring 46.

[0353] However, in order to substantially prevent damage to the substrate 40 that can occur in the cutting process, the cutting position of the anisotropic conductive film can be an area other than the side surface 45 or the side end 46S of the side wiring 46.

[0354] Accordingly, the side end 47S of the anisotropic conductive layer 47 can be formed outside the substrate 40. Specifically, the side end 47S of the anisotropic conductive layer 47 can be disposed outside with respect to the side cover 90.

[0355] In response to the anisotropic conductive layer 47 being disposed outside with respect to the side cover 90, the side end 47S of the anisotropic conductive layer 47 can be disposed in the gap G between the plurality of display modules 30A to 30P. Accordingly, the side end 47S of the anisotropic conductive layer 47 can be recognized as a joint between the plurality of display modules 30A to 30P, and thus the overall sense of the picture displayed on the display panel 20 can be reduced.

[0356] In addition, a current generated by electrostatic discharge is introduced into the display module through the side end 47S of the anisotropic conductive layer 47, thereby causing damage to electronic components mounted inside the display module.

[0357] That is, the side end 47S of the anisotropic conductive layer 47 can be exposed to the outside, and in response to electrostatic discharge around the display module 30, high-voltage electricity can be introduced into the inside of the display module 30 through the side end 47S of the anisotropic conductive layer 47, thereby causing damage to the display module 30.

[0358] In the display device 1 according to the embodiment of the disclosure, in order to prevent damage to the display module 30, the side end 47S of the anisotropic conductive layer 47 can be disposed inside with respect to the side end 75 of the front cover 70, as shown in Figure 7 and Figure 9 Specifically, the side end 47S of the anisotropic conductive layer 47 can be disposed on the first area 71.

[0359] Accordingly, the area 47X of the anisotropic conductive layer 47, which extends to an area outside the mounting surface 41 of the substrate 40, can be provided to extend to the first area 71.

[0360] As described above, the display module 30 includes the side cover 90 disposed outside the substrate 40, and the side end 47S of the anisotropic conductive layer 47 can be covered by the side cover 90 even when the side end 47S of the anisotropic conductive layer 47 is disposed outside the substrate 40.

[0361] Since the anisotropic conductive layer 47 is provided not to be exposed to the outside through the side cover 90, it is possible to prevent recognition of a joint caused by the side end 47S of the anisotropic conductive layer 47, and it is possible to prevent a current from entering the side end 47S of the anisotropic conductive layer 47.

[0362] That is, even when the side end 47S of the anisotropic conductive layer 47 is disposed in a region outside the substrate 40, the side end 47S of the anisotropic conductive layer 47 can be covered by the side cover 90, and thus the above difficulty can be prevented. However, in response to the side end 47S of the anisotropic conductive layer 47 extending to the outside of the side cover 90, the side end 47S of the anisotropic conductive layer 47 can be exposed to the outside of the display module 30. Thus, the side end 47S of the anisotropic conductive layer 47 can be disposed inside with respect to the side end 91 of the side cover 90.

[0363] As described above, the side end 91 of the side cover 90 can be disposed on the same line as (e.g., coplanar with) the side end 75 of the front cover 70, and thus the side end 47S of the anisotropic conductive layer 47 can be disposed inside with respect to the side end 75 of the front cover 70.

[0364] Specifically, when assuming that a region corresponding to the first region 71 of the front cover 70 is defined as a first position region A2, and a region corresponding to the second region 72 of the front cover 70 is defined as a second position region A1, and when assuming that, in the first position region A2, with respect to the second direction Y, a region between the side end 41S of the mounting surface 41 and the side surface 45 is defined as a third position region A3, and a region between the side end 91 of the side cover 90 and the side surface 45 is defined as a fourth position region A4, the side end 47S of the anisotropic conductive layer 47 in the second direction Y can be disposed in the fourth position region A4. In other words, the edge of the anisotropic conductive layer 47 can protrude from the side surface 45 of the substrate 40 and from the mounting surface 41 of the substrate 40, and the edge of the front cover 70 can protrude from the edge of the anisotropic conductive layer 47.

[0365] Further, when assuming that, in the first position region A2, with respect to the third direction Z, a region between the side end 41S of the mounting surface 41 and the side end 46S of the side wiring 46 is defined as a third position region A3, and a region between the side end 46S of the side wiring 46 and the side end 91 of the side cover 90 is defined as a fourth position region A4, the side end 47S of the anisotropic conductive layer 47 in the third direction Z can be disposed in the fourth position region A4.

[0366] As described above, if the side end 47S of the anisotropic conductive layer 47 is disposed in the third position region A3, the side surface 45 of the substrate 40, the chamfer 49, or the side wiring 46 can be damaged. To prevent such damage, the side end 47S of the anisotropic conductive layer 47 can be disposed in the fourth position region A4.

[0367] Accordingly, the side end 47S of the anisotropic conductive layer 47 can be disposed inside the side end 75 of the front cover 70 or the side end 91 of the side cover 90, and thus, the side end 47S of the anisotropic conductive layer 47 can not be exposed to the outside of the display module 30 and be covered by the side cover 90. Accordingly, the visibility of the seam can be reduced, and the introduction of high voltage current caused by electrostatic discharge can be prevented.

[0368] The side cover 90 can not only cover the outside of the side surface 45 of the substrate 40 in the third direction Z, but also cover all of the outside of the side surface 45 in the second direction Y, as shown in Figure 10

[0369] That is, as described above, the side cover 90 can be provided to surround all four edges E of the substrate 40.

[0370] Accordingly, the mounting surface 41, which is the front surface of the substrate 40, can be covered by the front cover 70, the rear surface 43 of the substrate 40 can be covered by the metal plate 60, and the side surface 45 and the chamfer 49 of the substrate 40 can be covered by the side cover 90.

[0371] Specifically, the side cover 90 can be provided to extend from the upper portion of the metal plate 60 to the lower surface 76 of the front cover 70 in the first direction X, thereby completely sealing the substrate 40 with respect to the outside.

[0372] The front cover 70 can be formed of a non-conductive material through which electric charges do not flow.

[0373] The side cover 90 can be formed of a non-conductive material through which electric charges do not flow.

[0374] The front cover 70 and the side cover 90 can be formed of a non-conductive material, and thus, most of the current applied to the front cover 70 or the side cover 90 can flow on the front cover 70 and the side cover 90 without passing through the front cover 70 and the side cover 90.

[0375] Further, the metal plate 60 can be formed of a material having a large capacitance to function as a ground configuration. Accordingly, in response to the current applied to the metal plate 60, the potential of the metal plate 60 can be maintained at a constant potential, and thus, the current flowing into the metal plate 60 can be absorbed by the metal plate 60, and the current can not flow to the substrate 40 through the metal plate 60.

[0376] Specifically, in a conventional manner, a side wire or an anisotropic conductive layer 47 extending along the side surface of the substrate is exposed to the outside, and thus, the current caused by electrostatic discharge flows into the side wire, thereby causing damage to electronic components disposed on the substrate.

[0377] ​In the display device 1 according to the embodiment of the present disclosure, all of the side wiring 46 of the substrate 40 can be covered by the side cover 90, and thus the side wiring 46 can be sealed and can not be exposed to the outside. Therefore, even if static discharge occurs on the side surface 45 of the substrate 40, the side cover 90 can prevent the current from flowing into the side wiring 46.

[0378] The side cover 90 can be formed of a non-conductive material, and can additionally be formed of a material mixed with an antistatic agent.

[0379] Therefore, the side end 47S of the anisotropic conductive layer 47, which is covered from the outside by the side cover 90, can be provided to prevent the introduction of the current.

[0380] Specifically, as Figure 10 shown, static discharge E2 can not easily occur on the side cover 90, and even when the current e2 is generated by the static discharge E2, the amount of the current e2 can be a relatively small amount. The generated current e2 can flow on the side cover 90, and flow to the metal plate 60 provided to be in contact with the side cover 90.

[0381] In response to the current e1 generated on the front cover 70 by the static discharge E1, the current e1 can not pass through the front cover 70, and thus the current e1 can not flow into the substrate 40. Therefore, the current can flow on the front cover 70, and then flow to the side cover 90.

[0382] The current e1 flowing into the side cover 90 can not pass through the side cover 90, and thus can not flow into the substrate 40. Therefore, the current e1 can flow on the side cover 90, and then flow to the metal plate 60 in contact with the side cover 90.

[0383] That is, the side end 91 of the side cover 90 can provide a path for the current to flow to the metal plate 60.

[0384] Therefore, even when the side end 47S of the anisotropic conductive layer 47 is disposed outside the substrate 40, the display module 30 can be provided to be sealed with respect to the outside by the front cover 70 and the side cover 90. The metal plate 60 disposed on the rear surface 43 of the substrate 40 can be formed in a ground configuration, and thus even when a current caused by static discharge is generated on the front cover 70 or the side cover 90, the current can flow to the metal plate 60 along the side end 91 of the side cover 90, and thus the ESD withstand voltage of the electronic component mounted on the substrate 40 can be improved.

[0385] Hereinafter, a method of manufacturing the display module 30 according to the embodiment of the present disclosure will be briefly described.

[0386] Figure 11 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present disclosure, Figure 12This is a diagram illustrating the manufacturing process of a display device according to an embodiment of the present disclosure. Figure 13 It is shown in Figure 12 The diagram shows the subsequent manufacturing process of the display device. Figure 14 This disclosure shows that Figure 13 The diagram shows the subsequent manufacturing process of the display device. Figure 15 This disclosure shows that Figure 14 The diagram shows the subsequent manufacturing process of the display device. Figure 16 This disclosure shows that Figure 15 The diagram shows the subsequent manufacturing process of the display device, and Figure 17 This disclosure shows that Figure 16 A diagram illustrating the manufacturing process of the subsequent display device.

[0387] like Figure 12 As shown, a substrate 40 with a TFT layer 44 formed on the mounting surface 41 is prepared, and an anisotropic conductive film 47T is bonded to the TFT layer 44 (501).

[0388] like Figure 13 As shown, an anisotropic conductive film 47T, which is bonded to the substrate 40, is cut in the second direction Y relative to the side surface 45, and anisotropic conductive film 47T is cut in the third direction Z relative to the side end 46S of the side wiring 46 (502).

[0389] The cutting process can be performed by laser cutting or the like. Therefore, the anisotropic conductive film 47T can be formed as an anisotropic conductive layer 47 bonded to the substrate 40.

[0390] Appropriately, the side end 47S of the anisotropic conductive layer 47 is arranged on the same line as the side surface 45 relative to the second direction Y, and on the same line as the side end 46S of the side wiring 46 relative to the third direction Z.

[0391] However, considering the possibility of damage to the side surface 45 and the side wiring 46, the side end 47S of the anisotropic conductive layer 47 may be arranged outside the side surface 45 relative to the second direction Y, and outside the side end 46S of the side wiring 46 relative to the third direction Z.

[0392] like Figure 14 As shown, a display module 30 is fabricated, wherein a plurality of inorganic light-emitting diodes 50 and electronic components forming the display module 30 are mounted on an anisotropic conductive layer 47, and a front cover 70X is bonded to the mounting surface 41 (503) of the display module 30.

[0393] The front cover 70X refers to the front cover 70X before being cut. The front cover 70X can be provided to cover the entire area of the mounting surface 41. The front cover 70X can be formed on the mounting surface 41 by a compression curing process.

[0394] As shown in FIG. 5A, the side cover 90X is dispensed into a space (504) between the chamfer 49 formed between the rear surface of the front cover 70X and the side surface 45 of the substrate 40 in the first direction X. Figure 15

[0395] The side cover 90X refers to the side cover 90X before being cut together with the front cover 70X.

[0396] The predetermined amount can be applied to the side cover 90X by the dispenser W. The applied side cover 90X can be cured by a subsequent operation. For example, the side cover 90X can be formed of a non-conductive black resin.

[0397] The side cover 90X can be applied to cover the chamfer 49 formed between the rear surface of the front cover 70X and the side surface 45, and the mounting surface 41 and the side surface 45 of the substrate 40, and the chamfer 49 formed between the side surface 45 and the rear surface 43.

[0398] In addition, in the anisotropic conductive layer 47, the region 47X disposed outside the mounting surface 41 can also be covered by the applied side cover 90X.

[0399] The dispensing operation of the side cover 90X can be performed on all four edges E of the substrate 40. Accordingly, the side cover 90X can be dispensed to cover all the side surfaces 45 of the substrate 40. In addition, in the anisotropic conductive layer 47, the entire region 47X disposed outside the mounting surface 41 can be covered by the side cover 90X.

[0400] When the side cover 90X is cured, the side cover 90X can be joined to the chamfer 49 formed between the rear surface of the front cover 70X and the side surface 45 of the substrate 40, and the mounting surface 41 and the side surface 45, and to the region 47X disposed outside the mounting surface 41 in the anisotropic conductive layer 47.

[0401] Based on the side cover 90X including a photosensitive material, the side cover 90X can be colored to a dark color by emitting ultraviolet rays (UX) or the like as a subsequent operation. However, based on the side cover 90X being formed of a translucent or opaque material without including a photosensitive material, such a manufacturing process is not required.

[0402] As shown in FIG. 5B, the front cover 70X and the side cover 90X are cut along the first direction X such that at least a portion of the front cover 70X extends to the outside of the substrate 40 along a second direction Y perpendicular to the first direction X in which the mounting surface 41 faces (505). Figure 16 As shown in FIG. 5B, the front cover 70X and the side cover 90X are cut along the first direction X such that at least a portion of the front cover 70X extends to the outside of the substrate 40 along a second direction Y perpendicular to the first direction X in which the mounting surface 41 faces (505).​

[0403] The cutting process can be performed by laser L cutting or the like. Thus, the front cover 70X and the side cover 90X can be simultaneously cut.

[0404] In the cutting process, the front cover 70X and the side cover 90X can be cut to allow the front cover 70X to include the first area 71 in the third direction Z perpendicular to the first direction X and the second direction Y and the second direction Y, and to allow the side cover 90X to be arranged along the second direction Y and the third direction Z.

[0405] That is, the cutting process can be performed on all four edges E of the substrate 40.

[0406] The cutting process can be performed to allow the cutting positions of the front cover 70X and the side cover 90X to be located outside with respect to the side end 47X of the anisotropic conductive layer 47.

[0407] This is because: if the cutting positions of the front cover 70X and the side cover 90X are located inside with respect to the side end 47X of the anisotropic conductive layer 47, the anisotropic conductive layer 47 can be exposed to the outside of the side cover 90.

[0408] As shown in FIG. 6, the side end 75 of the front cover 70 and the side end 91 of the side cover 90 can be formed on the same line in the first direction X by the cutting process. Appropriately, the side end 75 of the front cover 70 and the side end 91 of the side cover 90 can be cut to be formed in a direction parallel to the first direction X. Figure 16

[0409] In a state in which the display module 30 is provided as a plurality of display modules 30A to 30P, the process can be performed to allow the length of the first area 71 extending to the outside of the mounting surface 41 to be substantially less than or equal to half the length of the gap G formed between the plurality of display modules 30A to 30P.

[0410] As shown in FIG. 6, the metal plate 60 is joined to the rear surface 43 of the substrate 40 (506). Figure 17 The rear adhesive tape 61 can be arranged on the upper surface of the metal plate 60 in the first direction X, and thus, in response to the rear adhesive tape 61 and the rear surface 43 of the substrate 40 being pressed, the rear adhesive tape 61 can join the substrate 40 to the metal plate 60.

[0411] However, the present disclosure is not limited thereto, and the rear adhesive tape 61 can be arranged on the rear surface 43 of the substrate 40, and the metal plate 60 can be pressed to each other with the rear adhesive tape 61 arranged on the rear surface 43.

[0412]

[0413] ​​In this case, the portion of the side cover 90X dispensed on the rear surface 43 of the substrate 40 is retained, but this is a relatively small portion that can be ignored. Accordingly, the metal plate 60 and the rear surface 43 of the substrate 40 can be substantially horizontally joined to each other.

[0414] The display module 30 processed through the above-described process can be manufactured as a plurality of display modules 30A to 30P, and the plurality of display modules 30A to 30P can be arranged adjacent to each other. In this case, the plurality of display modules 30A to 30P can be fixed by a jig. The plurality of display modules 30A to 30P can be arranged in an M x N matrix.

[0415] A display device 1 according to an embodiment of the disclosure will be described below. The configuration to be described below, except for the side end cover 100, is the same as the configuration of the display device 1 according to the embodiment of the disclosure described above, and thus a repeated description will be omitted.

[0416] Figure 18 is an enlarged cross-sectional view illustrating a portion of a configuration of a display device according to another embodiment of the disclosure with respect to a second direction, Figure 19 is an enlarged cross-sectional view illustrating a portion of a configuration of a display device according to another embodiment of the disclosure with respect to a third direction, and Figure 20 is an enlarged cross-sectional view illustrating a portion of a configuration of a display device according to another embodiment of the disclosure with respect to a second direction.

[0417] In a process for implementing a display panel using display modules, a plurality of display modules can be tiled to form a display panel.

[0418] In this case, in a production line in which each display module is manufactured and shipped, during a process in which the display module is used to form a display panel, an electric current generated by electrostatic discharge can flow into the inside of the display module, and an electronic component installed inside the display module can be damaged.

[0419] Even before the display module is coupled to the frame 15 and assembled as the display device 1, each display module needs to include a component configured to absorb an electric shock in order to prevent an electric current generated by electrostatic discharge from flowing into the inside of the display module, and to prevent an electronic component installed inside the display module from being damaged.

[0420] That is, each of the display modules 30A to 30P can independently include a component configured to prevent an electric current generated by electrostatic discharge from flowing into a configuration mounted to the substrate 40, and include a component configured to allow an electric current generated by electrostatic discharge to be easily guided to a ground configuration on each of the display modules 30A to 30P without flowing into the component mounted to the configuration of the substrate 40.

[0421] Each of the display modules 30A to 30P of the display apparatus 1 according to the embodiment of the disclosure described above can include a side cover 90 disposed to extend from an upper portion of the metal plate 60 to a lower surface 76 of the first area 71 of the front cover 70 arranged outward of the mounting surface 41 in the first direction X in which the mounting surface 41 faces, so as to seal the side surface 45 with respect to the outside.

[0422] In addition, each of the display modules 30A to 30P of the display apparatus 1 according to the embodiment of the disclosure can additionally include a side end member 100 arranged at an outer end of the side cover 90 in the second direction Y and the third direction Z and formed of a material having a higher electrical conductivity than the side cover 90.

[0423] The respective display modules 30A to 30P are identical. Hereinafter, a first display module 30A will be described as a representative.

[0424] As shown in FIG. 1, the side cover 90 can cover the side surface 45 of the substrate 40 in the third direction Z. Figure 18 and Figure 19 As shown in FIG. 1, the side end member 100 can not only cover the outside of the side surface 45 of the substrate 40 in the third direction Z, but also cover all of the side surfaces 45 in the second direction Y.

[0425] That is, the side end member 100 can be disposed to surround all four edges E of the substrate 40.

[0426] Appropriately, the side end member 100 is formed of a metal material and formed of a material having a higher electrical conductivity than the side cover 90. The side end member 100 can be coated on the side cover 90 to be arranged on the outer end of the side cover 90.

[0427] The side end member 100 can be disposed to be in contact with the metal plate 60 in the first direction X. That is, one end 101 of the side end member 100 in the first direction X can be disposed to be in contact with the metal plate 60.

[0428] Appropriately, the one end 101 of the side end member 100 is disposed to be in contact with the side surface 60a of the metal plate 60 in the second direction Y or the third direction Z.

[0429] The side end member 100 can be disposed to be in contact with the front cover 70 in the first direction X. That is, the other end 102 of the side end member 100 in the first direction X can be disposed to be in contact with the front cover 70.

[0430] Appropriately, the other end 102 of the side end member 100 is disposed to be in contact with the side end 75 of the front cover 70 in the second direction Y or the third direction Z.

[0431] The other end 102 of the side end member 100 in the first direction X can be arranged above the lower surface 76 of the front cover 70.

[0432] One end 101 of the side end member 100 in the first direction X can be disposed below the lower surface 76 of the front cover 70.

[0433] Accordingly, the side end member 100 can be provided to surround the entire side cover 90 corresponding to the four edges E of the substrate 40, and can be provided to prevent the side cover 90 from being exposed to the outside.

[0434] As described above, the side end member 100 can be formed of a material having a higher electrical conductivity than the side cover 90.

[0435] In addition, the side end member 100 can be formed of a material having a higher electrical conductivity than the front cover 70.

[0436] That is, the display module 30 can be provided to be sealed with respect to the outside by the front cover 70, the side cover 90, and the side end member 100, so as to protect the electronic components forming the display module 30 by a physical method and an electrical method.

[0437] Hereinafter, the display module 30 according to an embodiment of the disclosure will be described. The configuration described below, except for the anisotropic conductive layer 47', is the same as that of the display module 30 described above, and thus a repeated description will be omitted.

[0438] Figure 20 is an enlarged sectional view showing a portion of a configuration of a display device according to another embodiment of the disclosure with respect to a second direction.

[0439] Unlike the display device 1 according to the embodiment of the disclosure described above, in the anisotropic conductive layer 47' of the display module 30 of the display device 1 according to another embodiment of the disclosure, the area 47X' extending to the area of the mounting surface 41 of the substrate 40 outside can be provided to be disposed in the third position area A3.

[0440] The anisotropic conductive layer 47' can be formed of an anisotropic conductive film. The anisotropic conductive film can be provided to be greater than the area of the mounting surface 41 of the substrate 40 and less than the entire area of the substrate 40.

[0441] Accordingly, in the process of the display module 30, a process of joining the anisotropic conductive film having an area smaller than that of the substrate 40 to the mounting surface 41 and cutting the anisotropic conductive film can be omitted.

[0442] The side end 47X' of the anisotropic conductive layer 47' can be disposed in the third position area A3, and thus the side end 47X' of the anisotropic conductive layer 47' can be covered by the side cover 90.

[0443] While certain embodiments of the disclosure have been shown and described, it is understood that the embodiments presented herein are merely by way of example and are not limiting as to the scope of the disclosure, which is defined only by the claims and equivalents thereof.

Claims

1. A display module comprising: a substrate having a mounting surface and a side surface; a thin film transistor (TFT) layer disposed on the mounting surface of the substrate; a plurality of inorganic light emitting diodes mounted on the mounting surface of the substrate; an anisotropic conductive layer disposed on an upper surface of the TFT layer and electrically connecting the TFT layer to the plurality of inorganic light emitting diodes; a front cover covering the mounting surface; and a side cover surrounding the side surface, wherein a side end of the front cover extends to an area outside the mounting surface, wherein the side cover is joined to a lower surface of the front cover and the side surface of the substrate corresponding to the area outside the mounting surface, and wherein a side end of the anisotropic conductive layer is disposed in the area outside the mounting surface and on an inner side with respect to the side end of the front cover. The side end of the front cover is coplanar with a side end of the side cover.

2. The display module of claim 1, wherein, The side end of the anisotropic conductive layer is between the side surface of the substrate and the side end of the front cover.

3. The display module of claim 1, wherein, 4.The display module of claim 1, further comprising: a side end member disposed at a side end of the side cover, the side end member including a material having a higher electrical conductivity than that of the side cover. 5.The display module of claim 4, further comprising: a metal plate joined to a rear surface of the substrate and disposed on a side of the substrate opposite the mounting surface. One end of the side end member contacts the front cover.

6. The display module of claim 4, wherein, The side end of the anisotropic conductive layer is disposed on an inner side with respect to the side surface of the substrate.

7. The display module of claim 1, wherein, The substrate further includes a side wire extending along the side surface of the substrate and electrically connected to the TFT layer, 8. The display module of claim 1, wherein, wherein the side end of the anisotropic conductive layer is disposed between a side end of the side wire of the substrate and the side end of the front cover. The side cover includes a non-conductive material.

9. The display module of claim 1, wherein, The side cover includes a light-absorbing material.

10. The display module of claim 1, wherein, The side surface of the substrate is positioned to correspond to four edges of the mounting surface; 11. The display module of claim 1, wherein, The front cover extends to an area outside the four edges of the mounting surface; and The side cover contacts an entire lower surface of the front cover corresponding to the area outside the mounting surface and surrounds the side surface of the substrate along the four edges of the mounting surface. 12.A display apparatus comprising: an array of display modules including a plurality of display modules arranged horizontally in an M×N matrix, wherein each of the plurality of display modules includes: a substrate having a mounting surface and a side surface; a thin film transistor (TFT) layer disposed on the mounting surface; a plurality of inorganic light emitting diodes mounted on the mounting surface; an anisotropic conductive layer disposed on an upper surface of the TFT layer and electrically connecting the TFT layer to the plurality of inorganic light emitting diodes; a front cover covering the mounting surface; and a side cover surrounding the side surface, wherein a side end of the front cover extends to an area outside the mounting surface, ​ wherein the side cover is joined to a lower surface of the front cover and the side surface of the substrate corresponding to the area outside the mounting surface, and wherein the side end of the anisotropic conductive layer is disposed in the area outside the mounting surface and on an inner side of the side end of the front cover.

13. The display device of claim 12, wherein, the side end of the front cover is coplanar with a side end of the side cover.

14. The display device of claim 12, wherein, the side end of the anisotropic conductive layer is disposed between the side surface of the substrate and the side end of the front cover.

15. The display device of claim 12, wherein, each of the plurality of display modules further includes a side end member disposed at a side end of the side cover, the side end member including a material having a higher electrical conductivity than an electrical conductivity of the side cover.

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