Superfine superhard material grinding tool and its preparation method

Abstract

The application discloses an ultra-precision superhard material grinding tool and a preparation method thereof, and belongs to the technical field of superhard material grinding wheels.The ultra-precision superhard material grinding tool comprises a base body and a grinding material layer, and the grinding material layer is composed of raw materials with the following mass percentages: 10-30% of grinding material and 70-90% of composite binder.The particle size of the grinding material in the ultra-precision superhard material grinding tool is less than 10 mu m, and the grinding material is a core-shell structure grinding material, wherein the outer layer of the diamond micro-powder grinding material is wrapped with a uniform silicon carbide layer.The silicon carbide layer can prevent the carbonization of diamond in the sintering process, thereby reducing the service life of the grinding wheel, and meanwhile, the silicon carbide layer can participate in grinding to increase the sharpness of the grinding wheel.The ultra-precision superhard material grinding tool prepared by using the grinding material can increase the sharpness of the grinding wheel while improving the service life, and has good machining effect.

Description

Technical Field

[0001] This invention belongs to the field of superhard material grinding wheels, specifically relating to an ultra-precision superhard material abrasive and its preparation method. Background Technology

[0002] Semiconductor wafers typically require high surface roughness after chamfering. Correspondingly, superhard material grinding wheels generally use diamond micronized abrasives with a particle size typically below 10 μm. However, this particle size of diamond micronized abrasive is difficult to mix uniformly due to electrostatic adsorption, resulting in excessive surface roughness during semiconductor wafer processing. Silicon carbide, due to its good chemical stability, excellent high-temperature electrical properties, and high thermal shock resistance, has become a key material of interest in high-end technology and equipment fields. However, its complex manufacturing process and uncontrollable dimensions limit its use in the field of superhard material grinding wheels to that of ordinary abrasives. Therefore, combining diamond and silicon carbide to form a diamond-silicon carbide composite material exhibits superior properties.

[0003] Superhard material grinding wheels are widely used in the machining of materials such as metals, ceramics, and glass. Commonly used superhard material grinding wheels are metal-bonded. The advantages of metal-bonded wheels are good wear resistance and the ability to maintain dimensional accuracy for extended periods. However, a disadvantage is that metal-bonded wheels are formed by high-temperature pressing, and the diamond micro-powder abrasive used inside the wheel is prone to graphitization during the high-temperature sintering process, leading to a decrease in diamond strength and consequently a reduced wheel lifespan. Furthermore, while metal-bonded wheels offer good durability, they also have poor sharpness, easily generating chatter marks during grinding, resulting in poor workpiece surface roughness. Composite bonds combine the durability of metals with the added resins and ceramics to improve abrasive sharpness. However, the molding temperatures of conventional resins and ceramics differ significantly from the sintering temperatures of metals, making it impossible to combine the advantages of both. Further research is needed. Summary of the Invention

[0004] To overcome the problems in the prior art, this invention provides an ultra-precision and ultra-hard material abrasive and its preparation method. In this preparation method, the micro-powder abrasive undergoes special treatment to tightly coat a uniform layer of silicon carbide, upon which the ultra-hard material abrasive is then fabricated. The ultra-hard material abrasive uses polyetheretherketone (PEEK), which has high strength and high toughness, as a filler. Under optimized process conditions, PEEK can form a micro-network structure inside the abrasive. This increases the abrasive's service life without decreasing the wheel's sharpness or grinding uniformity, resulting in excellent processing performance. The surface roughness of the processed semiconductor silicon wafer can reach within Sa0.6 μm.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] A core-shell structured abrasive, wherein the core-shell structured abrasive is diamond micro powder abrasive with a silicon carbide layer wrapped around it; the diamond micro powder has a particle size of less than 10 μm, and the thickness of the silicon carbide coating layer is 5-15 μm.

[0007] Furthermore, the core-shell structured abrasive is obtained through the following process:

[0008] 1) Take 5-10 parts by weight of sucrose, 20-40 parts by weight of diamond powder and 15-30 parts by weight of sodium silicate, dissolve them in 20-60 parts by weight of distilled water, stir evenly, add 1-3 parts by weight of hydrofluoric acid, and form a blank after the reaction is complete.

[0009] 2) Place the billet obtained in step 1) into a crucible, heat it to 180-230℃ using a high-frequency furnace and hold it for 3-10 hours. After cooling to room temperature, transfer it to a heating tube with protective gas and gradually heat it to 1100-1400℃ and hold it for 10-25 hours. After cooling again, the mixture is obtained.

[0010] 3) After washing and drying the mixture obtained in step 2), the particle size is refined by using a ball mill to obtain a core-shell structured abrasive coated with silicon carbide.

[0011] In the preparation process of the core-shell structured abrasive, the protective atmosphere in step 2) is argon gas with a flow rate of 20-40 mL / min; the particle size refinement treatment in step 3) takes 15-32 hours, and the ball mill speed is 350-450 rpm during the particle size refinement treatment. It is mainly used to remove excess silicon carbide layers around diamond micropowder and to refine the shape of the core-shell structured abrasive, preventing excessive silicon carbide coating thickness from reducing the grinding wheel life after addition.

[0012] An ultra-precision and ultra-hard material abrasive tool includes a binder and an abrasive, wherein the abrasive is a mixture of the aforementioned core-shell structured abrasive and conventional abrasive. The abrasive tool contains a core-shell structured abrasive, which is diamond micron powder coated with a uniform silicon carbide layer. This silicon carbide layer prevents the diamond from carbonizing during sintering, thus preventing a reduction in grinding wheel life. Simultaneously, the silicon carbide layer participates in grinding, increasing the sharpness of the grinding wheel. The abrasive tool binder is a composite binder, with the addition of preferred polyetheretherketone (PEEK) as a filler. Under optimized process conditions, PEEK can form a micro-network structure, possessing certain toughness and strength, reducing the rigidity at the contact point between the abrasive tool and the workpiece. During grinding, the contact point provides a certain buffering and vibration damping effect, reducing the depth of grinding grooves. The ultra-precision and ultra-hard material abrasive tool prepared using this abrasive improves both service life and grinding wheel sharpness, resulting in excellent processing performance. When applied to semiconductor wafer processing, the surface roughness of the processed silicon wafer can reach within Sa0.6 μm.

[0013] The binder is a composite binder, and the mass ratio of the abrasive to the binder is 10-30:70-90. The composite binder is composed of the following materials in parts by weight: 10-50 parts of polyether ether ketone, 5-10 parts of polyurethane, 25-35 parts of copper powder, 10-40 parts of zinc powder, and 5-10 parts of composite rare earth.

[0014] This invention provides a method for preparing the above-mentioned ultra-precision and superhard material abrasive, which includes the following steps:

[0015] 1) Mix the core-shell structure abrasive and conventional abrasive in a certain proportion, and then mix them with the formula amount of polyetheretherketone, polyurethane, copper powder, zinc powder and composite rare earth. Dry grind and mix the materials in a mixing tank using a media ball. Add the treated mixture into a mold and press it to obtain a preform.

[0016] 2) Heat the pre-bill to 340-380℃ and hold for 3-6 hours. After holding, remove the billet and place it in an oven for 12-24 hours to obtain the billet.

[0017] 3) Combine the blank obtained in 2) with the matrix and heat it to 400-500℃ under a protective atmosphere and hold it for 1-2 hours for molding and sintering. After the holding period, a mold blank is obtained.

[0018] 4) The blank obtained in 3) is processed to the required dimensional accuracy to obtain the ultra-precision and ultra-hard material abrasive.

[0019] Specifically, in step 1), the mixing time is 12-24 hours to ensure thorough mixing of all formulation components, and the pressing pressure is 6000-8000 kg / cm². 2 This increases the binding capacity of the abrasive to the abrasive by the abrasive binder; the oven temperature in step 2) is 150~250℃; the protective atmosphere in step 3) is argon, and the flow rate is 20-40mL / min.

[0020] The polyetheretherketone, polyurethane, copper powder, zinc powder, and composite rare earth are all ball-milled to a particle size between 2 and 5 μm.

[0021] In step 1), the core-shell abrasive accounts for no less than 60% of the total weight of the core-shell abrasive and the conventional abrasive.

[0022] The application of the aforementioned core-shell structured abrasive in the preparation of ultra-precision and ultra-hard material grinding tools can replace more than 60% of conventional abrasives by mass, achieving dressing-free machining throughout the entire lifespan of the ultra-hard material grinding tools. With the increased use of core-shell structured abrasives, the sharpness of the grinding tools can be further improved, and they can completely replace the original diamond micron powder abrasives without causing a decrease in grinding wheel life. This ultra-hard material grinding tool uses high-strength and high-toughness polyetheretherketone (PEEK) as a filler. Under the action of composite rare earth elements, PEEK can form a micro-network structure inside the grinding tool. This increases the tool's lifespan without decreasing grinding wheel sharpness or grinding uniformity, resulting in excellent processing effects. The surface roughness of the processed semiconductor silicon wafers can reach within Sa0.6 μm.

[0023] The innovations of this invention are as follows: 1) The selection of the outer coating layer for the diamond micron abrasive: Through extensive experiments, it was discovered that during the preparation of core-shell structured abrasives, silicon can partially react with carbon on the diamond surface, resulting in strong molecular bonds between the diamond micron abrasive and the outer silicon carbide layer. This leads to a uniform silicon carbide layer that prevents the diamond abrasive from contacting external oxygen during high-temperature sintering, thus inhibiting graphitization. 2) The Mohs hardness of the silicon carbide layer is lower than that of the diamond abrasive, but its brittleness is higher. During grinding, it forms micro-fragments, thereby improving the sharpness of the superhard material grinding wheel. 3) Fine diamond powder abrasives with a diameter of 10μm are prone to agglomeration due to electrostatic adsorption, making it difficult to disperse evenly during the grinding wheel preparation process. The uniformity problem of coarse diamond powder abrasives with a diameter of 10μm can be solved by conventional grinding wheel manufacturing processes. In this invention, after adding a 5-15μm silicon carbide coating layer to the surface of fine diamond powder abrasives with a diameter of 10μm, the size range has reached the size range that can be uniformly prepared into grinding wheels, directly increasing the uniformity of the diamond powder abrasive grinding wheel structure. 4) Diamond micro powder abrasives are generally irregularly shaped polyhedrons, which, while beneficial for improving the sharpness of the abrasive, increase the difficulty of uniform dispersion within the abrasive. The core-shell structure abrasive of this invention has a spherical shape after shaping, while the diamond micro powder inside retains its original morphology, reducing the difficulty of uniform dispersion of the abrasive within the abrasive and improving the uniformity of the abrasive structure. 5) Polyetheretherketone (PEEK) has high strength and high toughness. During the molding process, a micro-network structure can be formed between the copper and zinc powders and under the refinement of polyurethane by composite rare earth elements, giving the abrasive a certain degree of toughness and strength, reducing the rigidity when the abrasive and the workpiece are in contact, and providing a certain buffering and shock absorption effect at the contact point during grinding, reducing the depth of grinding grooves, and thus improving the surface roughness of the workpiece.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0025] 1) The core-shell structured abrasive, grinding tool, and preparation method of the present invention have simple processing technology and are easy to operate;

[0026] 2) By adding and molding core-shell structured abrasives according to a certain process, the abrasive dispersion of superhard material abrasives is improved to a certain extent. At the same time, the graphitization of diamond micro powder during the sintering process is prevented, which would lead to a decrease in the life of the abrasive.

[0027] 3) By adding fillers and molding according to a certain process, a mesh connection structure has been formed inside the prepared superhard material grinding wheel, which reduces the rigidity when the grinding wheel and the workpiece are in contact. During grinding, the contact position between the two has a certain buffering and shock absorption effect, which reduces the depth of grinding vibration and thus improves the surface roughness of the workpiece.

[0028] 3) The application of this invention in metal-bonded chamfering grinding wheels can improve the wear resistance of chamfering grinding wheels by more than 10%, and the surface roughness of the workpiece can reach within Sa0.6μm. Attached Figure Description

[0029] Because the outer layer of the core-shell structured abrasive is tightly wrapped with a silicon carbide layer, electron microscope images of the mixed material block cut before particle size refinement were used to show the silicon carbide layer on the outer layer of the abrasive.

[0030] Figure 1 The image shows an electron microscope image of the cut surface of the core-shell structured abrasive in Example 1 before the particle size refinement process, obtained by cutting with a saw blade. The black and gray dots in the image are diamond micronized abrasive, and the white part is the silicon carbide layer.

[0031] Figure 2 Electron micrograph of the internal structure of the ultra-precision and ultra-hard material abrasive mold produced in Example 1. Detailed Implementation

[0032] The technical solution of the present invention will be further described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] In the following examples, the diamond powder used had a particle size of 3000 mesh. The raw materials, sucrose, sodium silicate, and hydrofluoric acid, were all analytical grade and commercially available products. The polyetheretherketone, polyurethane, copper powder, zinc powder, and composite rare earth were commercially available products that had been ball-milled to a particle size between 2-5 μm before use. The composite rare earth was purchased from Hubei Chengfeng Chemical Co., Ltd., and its main component was gadolinium-zirconium composite.

[0034] Example 1

[0035] An ultra-precision and ultra-hard material abrasive tool includes an abrasive and a composite binder, wherein the mass ratio of the abrasive to the composite binder is 10:90, and the composite binder is composed of the following materials in parts by weight: 10 parts polyetheretherketone, 10 parts polyurethane, 35 parts copper powder, 40 parts zinc powder, and 5 parts composite rare earth.

[0036] The preparation method of the above-mentioned ultra-precision and superhard material abrasives includes the following steps:

[0037] 1) Dissolve 5 parts by weight of sucrose, 20 parts by weight of diamond micronized abrasive and 15 parts by weight of sodium silicate in 59 parts by weight of distilled water, stir evenly and then add 1 part by weight of hydrofluoric acid. After the reaction is complete, a blank is formed.

[0038] 2) Place the billet obtained in step 1) into a crucible, rapidly heat it to 230°C using a high-frequency furnace and hold it for 3 hours. After cooling to room temperature, transfer the new billet to a heating tube with argon gas flowing at a rate of 40 mL / min and gradually heat it to 1100°C and hold it for 10 hours. After cooling again, the mixture is obtained.

[0039] 3) Wash and dry the mixture obtained in step 2). (The dried core-shell abrasive is cut with a saw blade, and the cut surface is scanned by electron microscopy, such as...) Figure 1 As shown, from Figure 1 It can be seen that the diamond micron abrasive is dispersed and embedded in the silicon carbide layer. The particle size is refined by using a ball mill at 400 rpm for 32 hours to obtain a core-shell structure abrasive with a 5μm thick silicon carbide coating.

[0040] 4) The core-shell structured abrasive and diamond micro-powder abrasive obtained in step 3) are mixed at a mass ratio of 60:40, and then mixed with the composite binder at a mass ratio of 10:90. The mixture is then dry-ground in a mixing tank using media balls for 24 hours. The treated mixture is then added to a mold and pressed at a pressure of 6000 kg / cm². 2 The preform is obtained by molding and pressing.

[0041] 5) Heat the pre-bill to 380℃ and keep it at that temperature for 3 hours. After the holding time is over, take out the billet and place it in an oven at 200℃ for 12 hours to obtain the billet.

[0042] 6) The blank obtained in 5) is combined with the matrix and heated to 500℃ in an argon atmosphere at a flow rate of 40mL / min and held for 1 hour for molding and sintering. After the holding period, a mold blank is obtained.

[0043] 7) Machining the blank obtained in 6) to the required dimensional accuracy yields the ultra-precision, ultra-hard material abrasive. Figure 2 Electron micrograph of the internal structure of the fabricated ultra-precision and ultra-hard material abrasive. Figure 2The white, branch-like structures are the network-like interconnected structures formed, while the black, encased material consists of abrasive and metal binders.

[0044] Example 2

[0045] An ultra-precision and ultra-hard material abrasive tool includes an abrasive and a composite binder, wherein the mass ratio of the abrasive to the composite binder is 20:80, and the composite binder is composed of the following materials in parts by weight: 50 parts of polyetheretherketone, 5 parts of polyurethane, 25 parts of copper powder, 10 parts of zinc powder, and 10 parts of composite rare earth.

[0046] The preparation method of the above-mentioned ultra-precision and superhard material abrasives includes the following steps:

[0047] 1) Dissolve 7 parts by weight of sucrose, 30 parts by weight of diamond micronized abrasive and 20 parts by weight of sodium silicate in 41 parts by weight of distilled water, stir evenly and then add 1 part by weight of hydrofluoric acid. After the reaction is complete, a blank is formed.

[0048] 2) Place the billet obtained in step 1) into a crucible, rapidly heat it to 180°C using a high-frequency furnace and hold it for 3 hours. After cooling to room temperature, transfer the new billet to a heating tube with argon gas flowing at a rate of 30 mL / min and gradually heat it to 1400°C and hold it for 15 hours. After cooling again, the mixture is obtained.

[0049] 3) After washing and drying the mixture obtained in step 2), the particle size is refined by using a ball mill at 400 rpm for 20 hours to obtain a core-shell structured abrasive coated with 10 μm thick silicon carbide.

[0050] 4) The core-shell structured abrasive and diamond micro-powder abrasive obtained in step 3) are mixed at a ratio of 80:20, and then mixed with the composite binder at a mass ratio of 20:80. The mixture is then dry-ground in a mixing tank using media balls for 24 hours. The treated mixture is then added to a mold and pressed at a pressure of 7000 kg / cm². 2 The preform is obtained by molding and pressing.

[0051] 5) Heat the pre-bill to 340℃ and keep it at that temperature for 6 hours. After the holding time is over, take out the billet and place it in an oven at 200℃ for 24 hours to obtain the billet.

[0052] 6) The blank obtained in 5) is combined with the matrix and heated to 400℃ in an argon atmosphere at a flow rate of 40mL / min and held for 2 hours for molding and sintering. After the holding period, a mold blank is obtained.

[0053] 7) The blank obtained in 6) is processed to the required dimensional accuracy to obtain the ultra-precision and ultra-hard material abrasive.

[0054] Example 3

[0055] An ultra-precision and ultra-hard material abrasive tool includes an abrasive and a composite binder, wherein the mass ratio of the abrasive to the binder is 30:70, and the composite binder is composed of the following materials in parts by weight: 15 parts polyetheretherketone, 10 parts polyurethane, 30 parts copper powder, 38 parts zinc powder, and 7 parts composite rare earth.

[0056] The preparation method of the above-mentioned ultra-precision and superhard material abrasives includes the following steps:

[0057] 1) Dissolve 10 parts by weight of sucrose, 20 parts by weight of diamond micronized abrasive and 30 parts by weight of sodium silicate in 38 parts of distilled water, stir evenly and then add 3 parts by weight of hydrofluoric acid. After the reaction is complete, a blank is formed.

[0058] 2) Place the billet obtained in step 1) into a crucible, rapidly heat it to 180°C using a high-frequency furnace and hold it for 10 hours. After cooling to room temperature, transfer the new billet to a heating tube with argon gas flowing at a rate of 20 mL / min and gradually heat it to 1400°C and hold it for 25 hours. After cooling again, a mixture is obtained.

[0059] 3) After washing and drying the mixture obtained in step 2), the particle size is refined by using a ball mill at 400 rpm for 15 hours to obtain a core-shell structured abrasive coated with 15 μm thick silicon carbide.

[0060] 4) Mix the core-shell abrasive and composite binder obtained in step 3) at a mass ratio of 30:70. Dry grind the mixture in a mixing tank using media balls for 24 hours. Add the treated mixture to a mold and press it at a pressure of 8000 kg / cm². 2 The preform is obtained by molding and pressing.

[0061] 5) Heat the pre-bill to 360℃ and keep it at that temperature for 5 hours. After the holding time is over, take out the billet and place it in an oven at 200℃ for 16 hours to obtain the billet.

[0062] 6) The blank obtained in 5) is combined with the matrix and heated to 450℃ in an argon atmosphere at a flow rate of 40mL / min and held for 1 hour for molding and sintering. After the holding period, a mold blank is obtained.

[0063] 7) The blank obtained in 6) is processed to the required dimensional accuracy to obtain the ultra-precision and ultra-hard material abrasive.

[0064] Comparative Example 1

[0065] The grinding wheel provided in this embodiment, compared with that in Embodiment 1, does not use core-shell structure abrasive to replace the original diamond micro powder abrasive.

[0066] Comparative Example 2

[0067] Compared with Example 3, the composite binder components of the grinding wheel provided in this embodiment are adjusted to 60 parts copper powder and 40 parts zinc powder, and polyetheretherketone, polyurethane and composite rare earth are not used as fillers.

[0068] Performance testing methods:

[0069] Examples 1-3 and Comparative Examples 1-2 of this invention were each fabricated with the same precision and model 1FF1V / 9D202×T20×H30×X6 (D represents the diameter of the grinding wheel, T represents the thickness of the grinding layer, H represents the diameter of the inner hole of the grinding wheel, and X represents the width of the grinding layer; all parameters are in mm). These grinding wheels were then sequentially mounted on a Tokyo Precision W5200 chamfering machine to chamfer 8-inch semiconductor silicon wafers. The yield rate, grinding wheel life, workpiece chipping, and finishing conditions were recorded. The results are shown in Table 1.

[0070] Table 1. Test results of chamfering grinding wheels in Examples 1-3 and Comparative Examples 1-2

[0071]

[0072] The chamfering test results in Table 1 show that the chamfering grinding wheels described in Examples 1-3 of this invention have good processing effects, reducing the surface roughness of the workpiece to 0.6μm, which is much smaller than the chipping size of the comparative grinding wheel (0.8-0.82μm). At the same time, the processing life is increased by at least 10% compared with the comparative grinding wheel. After adding 60% mass percentage abrasive replacement, the chamfering process can be used without dressing. Among them, the grinding wheel prepared in Example 3 has the best performance.

[0073] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An ultra-precision, ultra-hard material abrasive tool, comprising a binder and an abrasive, characterized in that, The abrasive is a mixture of core-shell abrasive and conventional abrasive; the core-shell abrasive is diamond micron powder coated with a silicon carbide layer; the diamond micron powder has a particle size of less than 10 μm, and the silicon carbide layer has a thickness of 5-15 μm; the core-shell abrasive is obtained through the following process: 1) Take 5-10 parts by weight of sucrose, 20-40 parts by weight of diamond powder and 15-30 parts by weight of sodium silicate, dissolve them in 20-60 parts by weight of distilled water, stir evenly, add 1-3 parts by weight of hydrofluoric acid, and form a blank after the reaction is complete. 2) Place the billet obtained in step 1) into a crucible, heat it to 180-230℃ using a high-frequency furnace and hold it for 3-10 hours. After cooling to room temperature, transfer it to a heating tube with protective gas and gradually heat it to 1100-1400℃ and hold it for 10-25 hours. After cooling again, the mixture is obtained. 3) After washing and drying the mixture obtained in step 2), the particle size is refined by using a ball mill to obtain a core-shell structured abrasive coated with silicon carbide. Step 2) The protective gas is argon, and the flow rate is 20-40 mL / min; Step 3) The particle size refinement treatment time is 15-32 hours; In the total weight of core-shell structured abrasives and conventional abrasives, core-shell structured abrasives account for no less than 60%. The binder is a composite binder, and the mass ratio of the abrasive to the binder is 10-30:70-90. The composite binder is composed of the following materials in parts by weight: 10-50 parts of polyether ether ketone, 5-10 parts of polyurethane, 25-35 parts of copper powder, 10-40 parts of zinc powder, and 5-10 parts of composite rare earth. The ultra-precision and superhard material abrasive is obtained through the following process: 1) Mix the core-shell structure abrasive and conventional abrasive in a certain proportion, and then mix them with the formula amount of polyetheretherketone, polyurethane, copper powder, zinc powder and composite rare earth. Dry grind and mix the materials in a mixing tank using a media ball. Add the treated mixture into a mold and press it to obtain a preform. 2) Heat the pre-bill to 340-380℃ and hold for 3-6 hours. After holding, remove the billet and place it in an oven for 12-24 hours to obtain the billet. 3) Combine the blank obtained in 2) with the matrix and heat it to 400-500℃ under a protective atmosphere and hold it for 1-2 hours for molding and sintering. After the holding period, a mold blank is obtained. 4) The blank obtained in 3) is processed to the required dimensional accuracy to obtain the ultra-precision and ultra-hard material abrasive.

2. The ultra-precision and superhard material abrasive tool according to claim 1, characterized in that, The mixing time in step 1) is 12-24 hours, and the pressing pressure is 6000-8000 kg / cm³. 2 Step 3) The protective atmosphere is argon, and the flow rate is 20-40 mL / min.

3. The ultra-precision and superhard material abrasive tool according to claim 1, characterized in that, The polyetheretherketone, polyurethane, copper powder, zinc powder, and composite rare earth were ball-milled to a particle size between 2 and 5 μm.

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