Semiconductor package dispensing jig

Abstract

The application discloses a semiconductor packaging point gluing jig and relates to the technical field of semiconductor packaging tools.The semiconductor packaging point gluing jig comprises an operation table, a mounting rack mounted on the top of the operation table, a point gluing machine arranged at the front end of the top of the mounting rack and a pressure bucket arranged on one side of the mounting rack, a supporting plate movably arranged horizontally on the top of a fixing plate, a rotating disc arranged in a mounting groove, a buffer assembly arranged in a fixing box, a plurality of electromagnet pieces mounted on the top surface of the fixing plate, a wiring board box mounted on the upper portion of the fixing plate, a magnet plate movably arranged horizontally in a fixing groove and a limiting mechanism arranged in a mounting box.The cooperation of the fixing plate, the supporting plate and the rotating disc can provide a good buffering effect when placing the workpiece to be processed in an unpackaged state, the cooperation of the magnet plate, the electromagnet pieces and the limiting mechanism can effectively limit and fix the workpiece to be processed before point gluing operation, and the stability and packaging effect during semiconductor packaging point gluing are effectively improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging fixtures, and more particularly to a semiconductor packaging dispensing fixture. Background Technology

[0002] Currently, China's semiconductor wafer packaging technology is developing rapidly, leading to increasingly higher demands on the capacity, efficiency, and precision of semiconductor wafer packaging die bonding equipment. Capacity, efficiency, and precision have become important indicators for evaluating equipment. The main way existing equipment performs semiconductor chip dispensing is by using a lead screw to drive the dispensing head to move up and down, or by using an eccentric wheel to drive the dispensing head to move up and down.

[0003] When semiconductors are being dispensed, most dispensing devices have a rigid connection between the support plate and the moving base used to place the workpiece. This can cause the workpiece to collide with the support plate, affecting its performance. Furthermore, it makes it difficult to adjust the horizontal angle of the workpiece after placement. Therefore, these problems need to be optimized and solved. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a semiconductor packaging dispensing fixture.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor packaging dispensing fixture, comprising an operating table, a mounting frame mounted on the top of the operating table, a dispensing machine located at the front end of the top of the mounting frame, and a pressure tank located on one side of the mounting frame. The infusion tube of the pressure tank is connected to the dispensing needle tube on the dispensing machine. A longitudinally arranged fixing plate is horizontally mounted in the middle of the top surface of the operating table. A support plate is horizontally movably mounted on the top of the fixing plate. A circular mounting groove is opened on the top surface of the support plate. A rotating disk is horizontally rotatable in the mounting groove. The fixing plate is an inverted U-shaped plate. A ball screw is longitudinally rotatable inside the fixing plate. A servo motor is provided on the front end face of the fixing plate. A ball sleeve is movably sleeved on the ball screw. The front end of the ball screw is coaxially fixed to the drive shaft of the servo motor.

[0006] Both sides of the ball sleeve are horizontally fixed with horizontal plates. The front and rear ends of both sides of the bottom of the support plate are vertically provided with fixing boxes, and the fixing boxes are provided with buffer components. Several electromagnet plates are evenly installed on the top surface of the fixing plate. A wiring board box is horizontally suspended in the upper part of the fixing plate. Several power transmission wires for powering the electromagnet plates are provided inside the wiring board box. Several unlockable push-button switches electrically connected to the electromagnet plates are provided at equal intervals at the bottom of the wiring board box. Several fixing grooves are equally spaced on the bottom surface of the support plate. A magnetic plate is horizontally movable inside the fixing groove. The electromagnet plates and the magnetic plates have the same magnetic poles. Several mounting boxes are equally spaced in the mounting groove. The mounting boxes are provided with limiting mechanisms that cooperate with the magnetic plates.

[0007] Preferably, the buffer assembly includes a buffer rod movably disposed inside the fixed box and a buffer spring vertically fixed to the top of the buffer rod. The top end of the buffer spring is fixedly connected to the inner top surface of the fixed box, and the bottom end of the buffer rod movably extends out of the bottom of the fixed box and is fixedly connected to the outer end of the horizontal plate by bolts. An anti-detachment ring is fixedly sleeved on the top end of the buffer rod.

[0008] Preferably, the limiting mechanism includes a limiting post vertically movably disposed inside the mounting box, a lifting rod vertically fixed to the bottom end face of the limiting post, and a limiting frame fixedly sleeved on the bottom of the outer wall of the limiting post. The top end of the limiting post movably extends out of the mounting box and is fixedly attached to a limiting rubber block. The bottom end of the lifting rod movably extends into the fixing groove and is horizontally fixedly attached to an anti-collision rubber plate. The bottom surface of the anti-collision rubber plate is fixedly bonded to the top surface of the magnet plate. The bottom surface of the rotating disk has multiple annular limiting ring grooves from the inside to the outside. The inner top surface of each limiting ring groove is horizontally provided with an anti-slip rubber ring that cooperates with the limiting rubber block.

[0009] Preferably, the top surface of the limiting rubber block and the bottom surface of the anti-slip rubber ring are both raised with a number of anti-slip protrusions, all of which are hemispherical structures, and a rectangular compression cavity is opened inside the limiting rubber block.

[0010] Preferably, the top surface of the horizontal plate is provided with a longitudinally arranged abutting protrusion that cooperates with the unlocked push-button switch. The front and rear edges of the top of the abutting protrusion are both arc-shaped, and the abutting protrusion is located directly below the unlocked push-button switch.

[0011] Preferably, a drive box is provided in the middle of the bottom surface of the mounting groove, a rotating shaft is provided vertically on the top surface of the drive box, the top end of the rotating shaft is fixedly connected to the bottom of the rotating disk, a micro motor is provided inside the drive box, a drive gear is fixedly sleeved on the drive shaft of the micro motor, a rotating rod is provided vertically on the bottom end surface of the rotating shaft, and a driven gear that meshes with the drive gear is fixedly sleeved on the bottom end of the rotating rod.

[0012] Preferably, the top surface of the rotating disk is provided with a disc-shaped support pad, and the top surface of the support pad is evenly provided with several transverse anti-slip grooves; both sides inside the fixed plate are longitudinally fixed with stabilizing rods, the rod body of the stabilizing rod moves longitudinally through the transverse plate, and several stabilizing balls are evenly rolled and locked on the outer wall of the stabilizing rod.

[0013] Preferably, a rotating ring plate is fixedly sleeved on the upper part of the outer wall of the rotating disk, the rotating ring plate is movably covered on the upper part of the outer wall of the support plate, and a number of U-shaped handles are fixedly connected at equal intervals on the outer periphery of the rotating ring plate.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: The present invention, through the cooperation of the fixed plate, the support plate, and the rotating disk, provides a good buffering effect when placing the unpackaged workpiece during semiconductor packaging. Simultaneously, it allows for horizontal adjustment of the workpiece before packaging according to the required angle. The cooperation of the magnetic plate, the electromagnet plate, and the limiting mechanism not only facilitates the height limitation of the support plate but also limits and fixes the rotating disk after rotation adjustment. This effectively limits and fixes the workpiece before dispensing, preventing the support plate from dropping in height during dispensing and effectively improving the stability and packaging effect during semiconductor packaging dispensing. Attached Figure Description

[0015] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this application, illustrate exemplary embodiments of the invention and, together with their description, serve to explain the invention and do not constitute an undue limitation thereof. In the drawings:

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0017] Figure 2 This is a partial structural cross-sectional view of the main view of the present invention;

[0018] Figure 3 This is a cross-sectional view of the rotating disk structure of the present invention in its rotating state;

[0019] Figure 4 This is a cross-sectional view of the rotating disk in a limiting state according to the present invention;

[0020] Figure 5 For the present invention Figure 3 Schematic diagram of the cross-sectional view of section A in the middle;

[0021] Figure 6 This is a schematic diagram of the structure of one side of the abutting protrusion of the present invention;

[0022] Figure 7 This is a schematic diagram of the three-dimensional structure of the support pad of the present invention.

[0023] The components in the diagram are numbered as follows: 1. Control panel; 2. Mounting bracket; 3. Dispensing machine; 4. Pressure tank; 5. Fixing plate; 6. Support plate; 7. Rotating disc; 8. Servo motor; 9. Ball screw; 10. Horizontal plate; 11. Stabilizing bar; 12. Fixing box; 13. Buffer bar; 14. Buffer spring; 15. Support pad; 16. Mounting box; 17. Limiting post; 18. Limiting rubber block; 19. Lifting rod; 20. Anti-collision rubber plate; 21. Magnetic plate; 22. Anti-slip rubber ring; 23. Electromagnetic sheet; 24. Wiring board box; 25. Abutment protrusion; 26. Lockless push-button switch; 27. Micro motor; 28. Rotating ring plate. Detailed Implementation

[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0025] Example: See Figure 1-7A semiconductor packaging dispensing fixture includes an operating table 1, a mounting bracket 2 mounted on top of the operating table 1, a dispensing machine 3 located at the front end of the top of the mounting bracket 2, and a pressure tank 4 located on one side of the mounting bracket 2. The operating table 1 is a control device with an internal controller and several control switches mounted on its front end. The infusion tube of the pressure tank 4 is connected to the dispensing needle tube on the dispensing machine 3. A longitudinally arranged fixing plate 5 is horizontally mounted in the middle of the top surface of the operating table 1. A support plate 6 is horizontally movable on the top of the fixing plate 5. A circular mounting groove is opened on the top surface of the support plate 6, and a rotating disk 7 is horizontally rotatable in the mounting groove. The fixing plate 5 is an inverted U-shaped plate. A ball screw 9 is longitudinally mounted inside the fixing plate 5. A servo motor 8 is mounted on the front end of the fixing plate 5. A ball sleeve is movably fitted onto the ball screw 9. The front end of the ball screw 9 is coaxially fixed to the drive shaft of the servo motor 8. Horizontal plates 10 are laterally fixed to both sides of the ball sleeve. Fixing boxes 12 are vertically mounted at the front and rear ends of both sides of the bottom of the support plate 6. Buffer components are installed inside the fixing boxes 12. Several electromagnet plates 23 are evenly installed on the top surface of the fixing plate 5. A wiring board box 24 is laterally suspended inside the upper part of the fixing plate 5. The wiring board box 24 contains... There are several power supply wires for powering the electromagnet 23. The bottom of the wiring board box 24 is provided with several unlockable push-button switches 26 that are electrically connected to the electromagnet 23 at equal intervals. The bottom surface of the support plate 6 has several fixing slots at equal intervals. A magnet plate 21 is horizontally movable inside each fixing slot, and the electromagnet 23 has the same magnetic pole as the magnet plate 21. Several mounting boxes 16 are provided at equal intervals inside the mounting slot, and each mounting box 16 has a limiting mechanism that cooperates with the magnet plate 21. Through the cooperation of the fixing plate 5, the support plate 6, and the rotating disk 7, when packaging semiconductors, the unpackaged workpiece is... It provides a good buffering effect during placement and can adjust the horizontal position of the workpiece to be processed before packaging according to the required angle. Through the cooperation of the magnetic plate 21, the electromagnet plate 23 and the limiting mechanism, it not only facilitates the height limit of the support plate 6, but also limits and fixes the rotating disk 7 after rotation adjustment. It effectively limits and fixes the workpiece before dispensing, and avoids the height of the support plate 6 from dropping when dispensing the workpiece. It effectively improves the stability and packaging effect of semiconductor packaging dispensing.

[0026] In this invention, the buffer assembly includes a buffer rod 13 movably disposed inside the fixed box 12 and a buffer spring 14 vertically fixed to the top of the buffer rod 13. The top end of the buffer spring 14 is fixedly connected to the inner top surface of the fixed box 12, and the bottom end of the buffer rod 13 movably extends out of the bottom of the fixed box 12 and is fixedly connected to the outer end of the horizontal plate 10 by bolts. An anti-detachment ring is fixedly sleeved on the top end of the buffer rod 13. This facilitates the buffering and force-relieving function when placing the workpiece to be processed, and provides a good buffering effect when placing the workpiece to be processed.

[0027] In this invention, the limiting mechanism includes a limiting post 17 vertically movably disposed inside the mounting box 16, a lifting rod 19 vertically fixed to the bottom end face of the limiting post 17, and a limiting frame fixedly sleeved on the bottom of the outer wall of the limiting post 17. The top end of the limiting post 17 movably extends out of the mounting box 16 and is fixedly connected to a limiting adhesive block 18. The bottom end of the lifting rod 19 movably extends into the fixed groove and is horizontally fixedly connected to an anti-collision adhesive plate 20. The bottom surface of the anti-collision adhesive plate 20 is fixedly bonded to the top surface of the magnet plate 21. The bottom surface of the rotating disk 7 has multiple annular limiting ring grooves from the inside to the outside. The inner top surface of each limiting ring groove is horizontally provided with an anti-slip adhesive ring 22 that cooperates with the limiting adhesive block 18. This facilitates the limiting and fixing of the rotating disk 7 when the magnet plate 21 lifts and limits the height of the support plate 6, thereby preventing the rotating disk 7 from rotating during the dispensing and encapsulation of semiconductors.

[0028] In this invention, the top surface of the limiting rubber block 18 and the bottom surface of the anti-slip rubber ring 22 are both raised with a number of anti-slip protrusions. The anti-slip protrusions are all hemispherical structures. A rectangular compression cavity is opened inside the limiting rubber block 18, which facilitates the deformation of the limiting rubber block 18 when it is compressed, thereby improving the limiting effect of the limiting rubber block 18 on the rotating disk 7. The top surface of the horizontal plate 10 is provided with a longitudinal abutting protrusion 25 that cooperates with the unlocked button switch 26. The front and rear edges of the top of the abutting protrusion 25 are all arc-shaped. The abutting protrusion 25 is located directly below the unlocked button switch 26, which facilitates the abutting protrusion 25 to press the unlocked button switch 26 when the horizontal plate 10 moves, thereby energizing the electromagnet plate 23 corresponding to the unlocked button switch 26.

[0029] In this invention, a drive box is provided in the middle of the bottom surface of the mounting groove, and a rotating shaft is provided vertically on the top surface of the drive box. The top end of the rotating shaft is fixedly connected to the bottom of the rotating disk 7. A micro motor 27 is provided inside the drive box. The drive shaft of the micro motor 27 is fixedly sleeved with a drive gear. A rotating rod is provided vertically on the bottom end surface of the rotating shaft. A driven gear that meshes with the drive gear is fixedly sleeved at the bottom end of the rotating rod.

[0030] In this invention, the top surface of the rotating disk 7 is provided with a disc-shaped support pad 15, and the top surface of the support pad 15 is evenly provided with several transverse anti-slip grooves; both sides of the inside of the fixed plate 5 are longitudinally fixed with stabilizing rods 11, the rod body of the stabilizing rod 11 moves longitudinally through the horizontal plate 10, and several stabilizing balls are evenly rolled and clamped on the outer wall of the stabilizing rod 11, which facilitates the improvement of the stability and smoothness of the horizontal plate 10 when moving; a rotating ring plate 28 is fixedly sleeved on the upper part of the outer wall of the rotating disk 7, and the rotating ring plate 28 is movably covered on the upper part of the outer wall of the support plate 6. Several U-shaped handles are equidistantly fixed on the outer periphery of the rotating ring plate 28, which facilitates the horizontal rotation adjustment of the rotating disk 7 by manual means.

[0031] Working principle: In this embodiment, the present invention also proposes a method for using a semiconductor packaging dispensing fixture, including the following steps:

[0032] Step 1: First, connect the operating table 1 to the dispensing machine 3, servo motor 8 and micro motor 27 via wires, and connect the operating table 1 to the external power supply. Then, connect the pressure tank 4 to the external control device, and connect the power supply wire in the wiring board box 24 to the control switch on the operating table 1. The lockless button switch 26 is connected in series with the electromagnet 23 and the control switch. Then, place the PCB board to be dispensed into semiconductors on top of the support pad 15.

[0033] Step two: After the workpiece is placed, its weight will press down on the support plate 6 to lower it. The lowering of the support plate 6 allows the fixing box 12 to compress the internal buffer spring 14, which helps to buffer and unload the force when placing the workpiece, ensuring a good buffering effect. Then, if it is necessary to adjust the horizontal angle of the placed workpiece, the micro motor 27 can be started to drive the drive gear to rotate. The meshing of the drive gear and the driven gear drives the rotating disk 7 connected to the rotating shaft to rotate horizontally, thereby adjusting the horizontal angle of the placed workpiece.

[0034] Step 3: After the workpiece is placed, the control switch on the operating table 1 is turned on to power the transmission line. However, since the unlocked button switch 26 is not pressed, the electromagnet 23 has not yet been energized to generate magnetic force. Then, the servo motor 8 is controlled by the operating table 1 to drive the ball screw 9 to move, thereby causing the ball sleeve to drive the support plate 6 connected to the horizontal plate 10 to move backward on the top of the fixed plate 5, so that the placed workpiece can be moved to the bottom of the dispensing machine 3.

[0035] Step four: During the movement of the horizontal plate 10, the abutting protrusion 25 will press the unlocked button switch 26 at the bottom of the wiring board box 24. At this time, the unlocked button switch 26 will energize the electromagnet 23. Then, under the action of the electromagnet 23 and the magnet plate 21 having the same magnetic poles and repulsion, the magnet plate 21 will rise into the fixing groove, thereby pushing the anti-collision rubber plate 20 to raise the height of the support plate 6, so that the distance between the support plate 6 and the fixing plate 5 is constant. Then, the buffer component loses its buffering effect and avoids the height of the support plate 6 from dropping when the glue is applied to the processed part.

[0036] Step 5: When the magnet plate 21 rises into the fixing groove, it will push the anti-collision rubber plate 20 to rise synchronously. Then, under the action of the lifting rod 19, the limiting post 17 will be pushed out of the mounting box 16, so that the limiting rubber block 18 at the top of the limiting post 17 will be inserted into the limiting ring groove of the rotating disk 7, thereby limiting and locking the rotatable rotating disk 7. Through the cooperation of the limiting rubber block 18 and the anti-slip rubber ring 22, the effect of limiting the rotation of the rotating disk 7 is effectively improved.

[0037] Step six: After the rotating disk 7 is fixed in place, the height and angle of the workpiece to be processed are both in a limited state. Then, the dispensing machine 3 can be started to encapsulate the semiconductor on the workpiece. After the encapsulation is completed, the various mechanisms can be reset and powered off.

[0038] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A semiconductor packaging dispensing fixture, comprising an operating table (1), a mounting frame (2) mounted on the top of the operating table (1), a dispensing machine (3) disposed at the front end of the top of the mounting frame (2), and a pressure tank (4) disposed on one side of the mounting frame (2), characterized in that: The infusion tube of the pressure tank (4) is connected to the dispensing needle tube on the dispensing machine (3); a longitudinally arranged fixed plate (5) is horizontally installed in the middle of the top surface of the operating table (1), and a support plate (6) is horizontally movable on the top of the fixed plate (5). A circular mounting groove is opened on the top surface of the support plate (6), and a rotating disk (7) is horizontally rotatable in the mounting groove. The fixed plate (5) is an inverted U-shaped plate body. A ball screw (9) is longitudinally rotatable inside the fixed plate (5). A servo motor (8) is provided on the front end face of the fixed plate (5). A ball sleeve is movably sleeved on the ball screw (9), and the front end of the ball screw (9) is coaxially fixed to the drive shaft of the servo motor (8). Both sides of the ball sleeve are horizontally fixed with horizontal plates (10), and the front and rear ends of both sides of the bottom of the support plate (6) are vertically provided with fixing boxes (12), and the fixing boxes (12) are provided with buffer components inside; a number of electromagnet plates (23) are evenly installed on the top surface of the fixing plate (5), and a wiring board box (24) is horizontally suspended in the upper part of the fixing plate (5). The wiring board box (24) is provided with a number of power transmission lines for powering the electromagnet plates (23), and a number of lockless push-button switches (26) electrically connected to the electromagnet plates (23) are provided at equal intervals at the bottom of the wiring board box (24); a number of fixing grooves are provided at equal intervals on the bottom surface of the support plate (6), and a magnet plate (21) is horizontally movable inside the fixing groove. The electromagnet plates (23) and the magnet plate (21) have the same magnetic poles; a number of mounting boxes (16) are provided at equal intervals in the mounting groove, and a limiting mechanism that cooperates with the magnet plate (21) is provided inside the mounting box (16); the limiting mechanism includes vertical The limiting post (17) is movably installed inside the mounting box (16), the lifting rod (19) is vertically fixed to the bottom surface of the limiting post (17), and the limiting frame is fixedly sleeved on the bottom of the outer wall of the limiting post (17). The top end of the limiting post (17) movably extends out of the mounting box (16) and is fixedly connected to the limiting rubber block (18). The bottom end of the lifting rod (19) movably extends into the fixing groove and is horizontally fixed to the anti-collision rubber plate (20). The bottom surface of the anti-collision rubber plate (20) is flush with the magnetic plate (21). The top surface of the rotating disk (7) is fixedly bonded; the bottom surface of the rotating disk (7) has multiple annular limiting grooves from the inside to the outside, and the inner top surface of the limiting grooves is provided with a layer of anti-slip rubber ring (22) that cooperates with the limiting rubber block (18); the top surface of the horizontal plate (10) is provided with a longitudinal abutting protrusion (25) that cooperates with the unlocked button switch (26), and the front and rear edges of the top of the abutting protrusion (25) are arc-shaped, and the abutting protrusion (25) is located directly below the unlocked button switch (26).

2. The semiconductor packaging dispensing fixture according to claim 1, characterized in that: The buffer assembly includes a buffer rod (13) movably disposed inside the fixed box (12) and a buffer spring (14) vertically fixed to the top of the buffer rod (13). The top of the buffer spring (14) is fixed to the inner top surface of the fixed box (12). The bottom end of the buffer rod (13) movably extends out of the bottom of the fixed box (12) and is fixed to the outer end of the horizontal plate (10) by bolts. An anti-detachment ring is fixedly sleeved on the top of the buffer rod (13).

3. The semiconductor packaging dispensing fixture according to claim 1, characterized in that: The top surface of the limiting rubber block (18) and the bottom surface of the anti-slip rubber ring (22) are both raised with a number of anti-slip protrusions. The anti-slip protrusions are all hemispherical structures. A rectangular compression cavity is opened inside the limiting rubber block (18).

4. The semiconductor packaging dispensing fixture according to claim 1, characterized in that: A drive box is provided in the middle of the bottom surface of the mounting slot. A rotating shaft is provided vertically on the top surface of the drive box. The top end of the rotating shaft is fixedly connected to the bottom of the rotating disk (7). A micro motor (27) is provided inside the drive box. A drive gear is fixedly sleeved on the drive shaft of the micro motor (27). A rotating rod is provided vertically on the bottom end surface of the rotating shaft. A driven gear that meshes with the drive gear is fixedly sleeved on the bottom end of the rotating rod.

5. A semiconductor packaging dispensing fixture according to claim 4, characterized in that: The top surface of the rotating disk (7) is provided with a disc-shaped support pad (15), and the top surface of the support pad (15) is evenly provided with several transverse anti-slip grooves; both sides of the inside of the fixed plate (5) are longitudinally fixed with stabilizing rods (11), the rod body of the stabilizing rod (11) moves longitudinally through the transverse plate (10), and several stabilizing balls are evenly rolled and clamped on the outer wall of the stabilizing rod (11).

6. A semiconductor packaging dispensing fixture according to claim 5, characterized in that: A rotating ring plate (28) is fixedly sleeved on the upper part of the outer wall of the rotating disk (7). The rotating ring plate (28) is movably covered on the upper part of the outer wall of the support plate (6). Several U-shaped handles are fixedly connected at equal intervals on the outer periphery of the rotating ring plate (28).

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