Chip appearance detection device, chip, and chip appearance detection method

Abstract

The present application provides a chip appearance detection device, a chip, and a chip appearance detection method. The detection device includes: a chip clamping component and a first optical detector. The first optical detector is arranged on one side of the chip clamping component and is used to perform appearance detection on the chip on the chip clamping component at a first position; the chip clamping component includes: a rotating disk, positioning teeth and a fixed frame; the rotating disk is used to transfer the chip to a second position corresponding to the first position so that the first optical detector can perform appearance detection on the chip. The rotating disk is evenly provided with positioning teeth along the circumference, and the sides of the positioning teeth facing the fixed frame are provided with a shading portion, which is used to block the light transmitted through the chip; a fixed frame connected to the circumference of the rotating disk and a rotating space for the fixed frame to rotate to the shading portion are provided between adjacent positioning teeth, and the fixed frame is used to fix the chip. The shading portion is used to block the light transmitted through the chip circuit board, effectively image the chip appearance, and avoid light interference.

Description

Technical Field

[0001] The present application relates to the field of chip detection technology, and in particular to a chip appearance detection device and method. Background Art

[0002] PCBs are one of the carriers of integrated circuits (ICs) containing microelectronic components. They organically connect the various components on a chip via printed circuits on the substrate, offering the advantages of a compact package and high component interchangeability. A key step in inspecting the appearance quality of IC chips is testing the appearance quality of the PCBs that hold the electronic components. Existing chip appearance inspection devices, such as the one disclosed in Chinese patent number CN201489009U, employ a high-speed appearance inspection device for chip-type components. This device uses a vibrating plate to load micro-components such as chips. A rotating plate carries a first-side inspector, a second-side inspector, a third-side inspector, and a fourth-side inspector for inspecting the chips. The chips are then transported along a track on the rotating plate, passing through each inspector in turn to detect appearance defects. Finally, a sorting machine sorts the inspected chips according to their quality level.

[0003] While the above-mentioned solution can achieve efficient inspection of chip appearance, it also presents some problems during use. For example, when optically inspecting a chip based on a transparent circuit board, such as a glass-based circuit board, the printed circuit patterns on the remaining surfaces may be scanned into the camera lens under the projection of light, thereby confusing the image received by the camera module and causing inconvenience in subsequent appearance defect analysis. For another example, in order to inspect the appearance of multiple surfaces of a chip to be inspected during a single transport, a surface optical inspector is required for each surface to be inspected, which increases equipment cost and is not conducive to comparing the differences in inspection results between multiple chips. Summary of the Invention

[0004] In view of this, the purpose of this application is to propose a chip appearance inspection device, a chip, and a chip appearance inspection method that solve the above problems or at least partially solve the above problems.

[0005] Based on the above purpose, a first aspect of the present application provides a chip appearance inspection device, comprising: a chip clamping component and a first optical detector, wherein the first optical detector is arranged on one side of the chip clamping component and is used to perform appearance inspection on the chip on the chip clamping component at a first position;

[0006] The chip clamping component includes: a rotating disk, positioning teeth and a fixing frame;

[0007] The rotating disk is used to transfer the chip to a second position corresponding to the first position so that the first optical detector can perform appearance inspection on the chip. The rotating disk is evenly provided with positioning teeth along the circumference. The sides of the positioning teeth facing the fixing frame are each provided with a light shielding portion, and the light shielding portion is used to shield light transmitted through the chip.

[0008] A fixing frame connected to the circumferential rotation of the rotating disk and a rotation space for the fixing frame to rotate to the shading portion are provided between adjacent positioning teeth. The fixing frame is used to carry the chip and make the chip abut against the corresponding shading portion in the second position.

[0009] Optionally, the first optical detector includes a cantilever base, a first movable base, a camera module, a polarizer, a ring light source and a prism;

[0010] A first movable seat is provided on the side of the cantilever seat facing the rotating disk, and the first movable seat is slidably connected to the cantilever seat. The first movable seat is provided with a camera module, a polarizer, an annular light source and a prism in sequence in the direction facing the rotating disk, wherein the light emitting direction of the annular light source is toward the prism, and the polarizer is located in the collection direction of the camera module;

[0011] A second movable seat is provided at one end of the first movable seat close to the rotating disk, and the end of the prism is fixedly set on the second movable seat. The second movable seat is slidably connected to the cantilever seat, and the plane where the moving direction of the second movable seat is located is parallel to the plane where the light shielding part is abutted against the chip.

[0012] Optionally, the fixing frame includes a support rod and a connecting rod;

[0013] The support rods are arranged in parallel on opposite sides of the rotating disk and are rotatably connected to the rotating disk at one end thereof. A clamping groove extending from an end of the support rod away from the rotating disk to an end thereof close to the rotating disk is provided on a side adjacent to the two support rods. The width of the clamping groove is smaller than the thickness of the chip, and the clamping groove is elastic.

[0014] The connecting rod is fixedly connected between the two supporting rods; wherein, the connecting rod is located at one end of the clamping groove close to the rotating disk.

[0015] Optionally, the positioning teeth include a first panel and a second panel, the first panel is inclined at one end away from the rotating disk toward a side close to the second panel, and the second panel is inclined at one end away from the rotating disk toward a side close to the first panel, a partition is provided between the first panel and the second panel, and a accommodating cavity is formed between the first panel and the second panel respectively and the partition, and an electromagnet is respectively provided in the accommodating cavity passing through the first panel and the second panel, and the electromagnet is connected to a power supply.

[0016] Optionally, an elastic member is provided between adjacent positioning teeth and the fixing frame, and the elastic force of the elastic member is less than half of the sum of the gravity of the fixing frame and the chip.

[0017] Optionally, a locking structure is further included, wherein the locking structure includes a locking rod and an indexing wheel;

[0018] The locking rod is arranged on a side of the first movable seat facing the chip clamping component, and a linear motor is arranged on a side of the first movable seat and the locking rod away from the chip clamping component;

[0019] The indexing wheel is coaxially arranged with the rotating disk, and the gap between the teeth of the indexing wheel is between the positioning teeth in the radial extension direction of the indexing wheel and the radial extension direction of the rotating disk; one end of the locking rod facing the indexing wheel is adapted to the teeth of the indexing wheel.

[0020] Optionally, a second optical detector is further included, the second optical detector being used to perform appearance inspection on the chip on the chip clamping component at a third position; at the third position, the rotating disk is used to transfer the chip to a fourth position corresponding to the third position so that the second optical detector performs appearance inspection on the chip, and the third position is symmetrical to the first position along the chip clamping component;

[0021] The surfaces of the chip undergoing appearance inspection at the third position and the fourth position are opposite to each other.

[0022] In a second aspect of the present application, a chip is provided, comprising a chip circuit board and a clamping portion;

[0023] The clamping parts are arranged at opposite ends of the chip circuit board, an easy-folding edge is provided between the clamping parts and the chip circuit board, and the clamping parts are configured to be fixed by a fixing frame of the chip appearance inspection device;

[0024] The area of the chip circuit board is not larger than the area of the light shielding portion on the chip appearance inspection device.

[0025] Optionally, a separator is further included, the separator being located between the two clamping portions, and the separator being located at one end of the chip circuit board close to the rotating disk of the chip appearance inspection device, and the separator is connected to the chip circuit board via a second easy-folding edge;

[0026] A positioning hole is formed through the partition, a metal coating is provided in the positioning hole, and the positioning hole corresponds to the electromagnet of the chip appearance detection device.

[0027] A third aspect of the present application provides a chip appearance inspection method, which is used for the chip appearance inspection device according to the first aspect and the chip according to the second aspect, the method comprising:

[0028] placing the clamping portion of the chip in the fixing frame;

[0029] controlling the optical detector to the first position;

[0030] controlling the rotating disk of the chip clamping component to rotate so that the chip circuit board of the chip is in close contact with the light shielding portion on the positioning teeth until the chip circuit board rotates to a second position corresponding to the first position;

[0031] The optical detector performs a feature scan on the first surface and forms a feature image.

[0032] From the above description, it can be seen that the present application provides a chip appearance detection device, chip and chip appearance detection method, which perform appearance detection on the chip installed on the chip clamping component through the cooperation of the chip clamping component and the first optical detector, realizes the transmission of the chip by the rotation of the rotating disk, and realizes the fixation of the clamping part of the chip by the fixed frame, so that the chip is fixed without blocking the surface of the chip circuit board. The chip is attached to the light-shielding part of the side of the positioning tooth through the rotation connection of the fixed frame and the rotating disk, thereby blocking the light transmitted through the chip circuit board, overcoming light interference, and realizing effective imaging of the chip surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in this application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are merely embodiments of this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0034] Figure 1 This is a schematic diagram of the overall cooperation between the chip appearance inspection device and the chip according to an embodiment of the present application;

[0035] Figure 2This is a schematic diagram of the chip appearance inspection device and the chip in cooperation with each other according to an embodiment of the present application;

[0036] Figure 3 This is a schematic diagram of the other side of the chip appearance inspection device and the chip according to an embodiment of the present application;

[0037] Figure 4 This is a schematic diagram of the chip circuit board and the light shielding portion in accordance with an embodiment of the present application;

[0038] Figure 5 A schematic diagram of setting a second optical detector according to an embodiment of the present application;

[0039] Figure 6 A schematic diagram of a chip according to an embodiment of the present application;

[0040] Figure 7 This is a flow chart of a chip appearance detection method according to an embodiment of the present application. DETAILED DESCRIPTION

[0041] In order to make the objectives, technical solutions and advantages of this application more clear, this application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0042] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should have the usual meanings understood by people with ordinary skills in the field to which this application belongs. The "first", "second" and similar words used in the embodiments of the present application do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0043] This application provides a chip appearance detection device, referring to Figures 1 to 3As shown, it includes: a chip clamping component and a first optical detector. The first optical detector is arranged on one side of the chip clamping component and is used to perform appearance inspection on the chip on the chip clamping component at a first position. The chip clamping component includes: a rotating disk 11, positioning teeth 12 and a fixing frame 13; the rotating disk 11 is used to transfer the chip to a second position corresponding to the first position so that the first optical detector can perform appearance inspection on the chip. The rotating disk 11 is evenly provided with positioning teeth 12 along the circumference. The sides of the positioning teeth 12 facing the fixing frame 13 are provided with light shielding portions 14. The light shielding portions 14 are used to block light that transmits through the chip; between adjacent positioning teeth 12, there is a fixing frame 13 rotatably connected along the circumference of the rotating disk 11 and a rotation space for the fixing frame 13 to rotate to the light shielding portion 14. The fixing frame 13 is used to carry the chip and make the chip rest on the corresponding light shielding portion 14 at the second position.

[0044] In some exemplary embodiments, the center of the rotating disk 11 can be fixedly connected to the output shaft of a servo motor, and the rotation of the rotating disk 11 can be controlled by controlling the operation of the servo motor so that the chip on the fixed frame 13 is attached to the surface of the shading portion 14 on the positioning tooth 12 as the turntable rotates, thereby effectively performing appearance inspection on the chip.

[0045] In some embodiments, the main function of the chip clamping component is to effectively block the chip circuit board 41 of the chip to be inspected, so that light cannot pass through the chip circuit board. The obtained appearance image of the chip circuit board 41 is more comprehensive, and the appearance defect image of the chip circuit board 41 is clearer.

[0046] The rotation space allows the fixed frame 13 to rotate along the circumference of the rotating disk 11 and to rest against the light shielding portion 14 of the positioning tooth 12 . Similarly, the rotation space provides a measurement space for the first optical detector to perform appearance measurement.

[0047] In some embodiments, the first position and the second position are both preset positions, and the first optical detector can be detected by a position sensor to the first position, and the chip can be detected by a position sensor to the second position.

[0048] During specific implementation, the chip is mounted on the fixing frame 13, the first optical detector is controlled to the first position, and the rotating disk 11 is rotated to rotate the chip fixed on the fixing frame 13. The fixing frame 13 is connected with the rotating disk 11 to make the chip abut against the light shielding portion 14 on the surface of the positioning tooth 12 until the chip reaches the second position corresponding to the first position. The first optical detector performs appearance inspection on the surface of the chip away from the light shielding portion 14. The light shielding portion 14 blocks the light passing through the chip, so that the first optical detector can effectively image the surface of the chip away from the light shielding portion 14.

[0049] In some embodiments, the first optical detector is no higher than the level of the center of the rotating disk 11 .

[0050] In some embodiments, the first optical detector includes a cantilever base 21, a first movable base 22, a camera module 24, a polarizer 25, a ring light source 26, and a prism 27;

[0051] A first movable seat 22 is provided on the side of the cantilever seat 21 facing the rotating disk 11. The first movable seat 22 is slidably connected to the cantilever seat 21. The first movable seat 22 is provided with a camera module 24, a polarizer 25, an annular light source 26 and a prism 27 in sequence facing the rotating disk 11, wherein the light emitting direction of the annular light source 26 is toward the prism 27, and the polarizer 25 is located in the collection direction of the camera module 24;

[0052] A second moving seat 28 and a second moving seat 2823 are provided at one end of the first moving seat 22 close to the rotating disk 11, and the end of the prism 27 is fixedly set on the second moving seat 28 and the second moving seat 2823. The second moving seat 28 and the second moving seat 2823 are slidingly connected to the cantilever seat 21, and the plane where the moving direction of the second moving seat 28 and the second moving seat 2823 is located is parallel to the plane where the light shielding portion 14 to which the chip is attached is located.

[0053] During use, the rotating disk 11 rotates, driving the chip on the fixed frame 13 to rotate to the second position, and the rotating disk 11 stops rotating. The first movable seat 22 drives the camera module 24, the polarizer 25, the ring light source 26 and the second movable seat 28 and the second movable seat 2823 to move toward the direction of the rotating disk 11 until the camera module 24, the polarizer 25 and the ring light source 26 are in the first position. Then the ring light source 26 is turned on, and the second movable seat 28 and the second movable seat 2823 are fine-tuned until the prism 27 is between the ring light source 26 and the chip, so that the light emitted by the ring light source 26 can be transmitted through the prism 27 to the surface of the chip to form the surface feature information of the chip circuit board 41. The camera module 24 images the feature information. When collecting feature information, the camera module 24 filters out the diffuse reflected light of the feature information collected by the camera module 24 through the polarizer 25, making the imaging clearer.

[0054] Exemplarily, the camera module 24 may be connected to a terminal device, which may be connected to a display device. The terminal device compares and analyzes the images captured by the camera module 24 with image parameters preset in the terminal device, and displays the comparison results through the display device.

[0055] Exemplarily, a first linear electric cylinder can be provided between the first movable seat 22 and the cantilever seat 21. The first movable seat 22 is provided at the output end of the first linear electric cylinder. The operation of the first linear electric cylinder pushes the first movable seat 22 toward or away from the rotating disk 11. A second linear electric cylinder can also be provided between the second movable seat 28, the second movable seat 2823, and the first movable seat 22. The output end of the second linear electric cylinder is connected to the second movable seat 28, the second movable seat 2823. The second linear electric cylinder pushes the second movable seat 28, the second movable seat 2823 to move the prism 27 above the side surface of the chip away from the positioning teeth 12, thereby positioning the prism 27 between the annular light source 26 and the chip.

[0056] For example, the first movable seat 22 and the cantilever seat 21 are slidably connected via a first slider and a first slide rail. The second movable seat 2823 can be a straight plate-shaped seat body, and the second movable seat 2823 can be slidably connected to the first movable seat 22 via a second slider and a second slide rail.

[0057] In some embodiments, reference Figure 1 As shown, the fixing frame 13 includes a support rod 131 and a connecting rod 132; the support rods 131 are arranged in parallel on opposite sides of the rotating disk 11, and are rotatably connected to the rotating disk 11 at one end facing the rotating disk 11, and a clamping groove 133 extending from the end of the support rod 131 away from the rotating disk 11 to the end close to the rotating disk 11 is provided on the side close to the two support rods 131; the connecting rod 132 is fixedly connected between the two support rods 131; wherein, the connecting rod 132 is located at the end of the clamping groove 133 close to the rotating disk 11, and the clamping groove 133 is elastic.

[0058] By providing a clamping groove 133 between the fixing rods provided on opposite sides of the rotating disk 11 and the fixing rods, the clamping portion 42 of the chip is inserted into the supporting groove to fix the chip without obstructing the chip circuit board 41 that needs to undergo appearance inspection. While the clamping groove 133 on the support rod 131 fixes the chip, the end of the support rod 131 close to the rotating disk 11 rotates on the rotating disk 11 as the rotating disk 11 rotates, so that the chip circuit board 41 is closely attached to the light shielding portion 14. At the same time, the width of the clamping groove 133 is less than the thickness of the chip. The clamping groove 133 is elastic so that the contact between the chip and the clamping groove 133 is not rigid contact. At the same time, the chip can be inserted into the clamping groove 133. Due to the elasticity of the clamping groove 133, the chip inserted into the clamping groove 133 will not fall out. The connecting rod 132 is used to fix the two support rods 131 and play a role in limiting and fixing the support rods 131.

[0059] In some exemplary embodiments, the contact surfaces between the side walls of the clamping groove 133 and the clamping portion 42 of the chip are roughened to increase the friction between the side walls of the clamping groove 133 and the clamping portion 42 of the chip, thereby preventing the chip from falling out of the clamping groove 133 of the fixing frame 13.

[0060] In some embodiments, reference Figure 3 As shown, the positioning teeth 12 include a first panel 121 and a second panel 122. The end of the first panel 121 away from the rotating disk 11 is inclined toward the side close to the second panel 122, and the end of the second panel 122 away from the rotating disk 11 is inclined toward the side close to the first panel 121. A partition 123 is provided between the first panel 121 and the second panel 122. An accommodating cavity is formed between the first panel 121 and the second panel 122 and the partition 123 respectively. An electromagnet bolt is respectively provided in the accommodating cavity through the first panel 121 and the second panel 122, and the electromagnet bolt is connected to a power supply.

[0061] In some exemplary embodiments, the first panel 121, the second panel 122 and the rotating disk 11 form a positioning tooth 12 similar to an isosceles triangle. During the rotation of the rotating disk 11, the first panel 121 and the second panel 122 are relatively tilted, and a light shielding portion 14 is installed on the side of the first panel 121 and the second panel 122 that are away from each other. When the fixed frame 13 drives the chip to rotate on the rotating disk 11, the tilted setting of the first panel 121 and the second panel 122 can make the chip circuit board 41 of the chip fit on the first panel 121 or the second panel 122, and the light shielding portion 14 effectively shields the chip circuit board 41. An electromagnetic bolt is respectively provided in the accommodating cavity through the first panel 121 and the second panel 122, and the electromagnetic bolt is inserted into the positioning hole 431 of the chip on the partition 43. When the electromagnetic bolt is energized, it generates magnetic force, which generates suction on the metal coating in the positioning air, so that the chip circuit board 41 is further pressed against the light shielding portion 14, facilitating the appearance inspection of the chip circuit board 41.

[0062] It is understandable that the partition plate 123 divides the electromagnetic bolts passing through the first panel 121 and the second panel 122 respectively to avoid mutual interference between the magnetic forces generated by the electromagnetic bolts after being energized.

[0063] In some exemplary embodiments, the partition plate 123 is insulating. The partition plate 123 may be made of epoxy phenolic glass cloth, polyvinyl chloride, or polyethylene, without specific limitation. The electromagnet 124 may be an electromagnet bolt or other component or object that generates magnetism when energized, also without specific limitation.

[0064] Furthermore, the extension direction of the first panel 121 and the second panel 122 toward the rotating disk 11 is parallel to the plane of the rotating axis of the fixed frame 13 connected to the rotating disk 11, so that the extension direction of the light-shielding portion 14 toward the rotating disk 11 intersects with the rotating axis of the fixed frame 13 on the rotating disk 11, and further when the fixed frame 13 rotates on the rotating disk 11, the chip circuit board 41 is just attached to the light-shielding portion 14, avoiding the existence of a gap between the chip circuit board 41 and the light-shielding portion 14, causing the light-shielding portion 14 to be unable to completely block the light passing through the chip circuit board 41.

[0065] In some embodiments, reference Figures 1 to 4 As shown, an elastic member 15 is provided between adjacent positioning teeth 12 and the fixing frame 13 , and the elastic force of the elastic member 15 is less than half of the sum of the weight of the fixing frame 13 and the chip.

[0066] In some exemplary embodiments, referring to Figure 5 As shown, the rotation direction of the rotating disk 11 is the direction indicated by the arrow X1. During the rotation of the rotating disk 11, the chip fixed on the fixed frame 13 overcomes the elastic force of the elastic member 15 under the action of gravity and rotates to abut against the light shielding portion 14 on the positioning teeth 12 located below the chip. Since there are elastic members 15 between the fixed frame 13 and the positioning teeth 12 on both sides, the gravity of the fixed frame 13 and the chip needs to overcome twice the elastic force to make the chip circuit board 41 abut against the light shielding portion 14. After the abutment is completed, the electromagnet 124 is inserted into the positioning hole 431. The electromagnet 124 is energized to generate magnetic force, which adsorbs the metal coating in the positioning hole 431 to avoid a gap between the chip circuit board 41 and the light shielding portion 14. The first optical detector is then activated to perform optical detection on the chip circuit board 41 abutted against the light shielding portion 14.

[0067] In some exemplary embodiments, the elastic member 15 may be a spring.

[0068] In some embodiments, reference Figure 3 As shown, it also includes a locking structure, which includes a locking rod 31 and a dividing wheel 32; the locking rod 31 is arranged on the side of the first movable seat 22 facing the chip clamping component, and a linear motor is provided on the side of the first movable seat 22 and the locking rod 31 away from the chip clamping component; the dividing wheel 32 is coaxially arranged with the rotating disk 11, and the gap between the teeth of the dividing wheel 32 is between the radial extension direction of the dividing wheel 32 and the radial extension direction of the positioning teeth 12 on the rotating disk 11; one end of the locking rod 31 facing the dividing wheel 32 is adapted to the teeth of the dividing wheel 32.

[0069] During the appearance inspection of the chip, when the chip currently to be inspected is inspected, the rotating disk 11 transfers the chip to the second position. Since the rotation locking of the rotating disk 11 needs to be achieved by a device that rotates the rotating disk 11, such as by starting and stopping the motor, after the rotating disk 11 stops, in order to prevent the rotating disk 11 from rotating under the action of external force and causing the chip currently to be inspected to deviate from the second position, after the first movable seat 22 transfers the camera module 24, the polarizer 25, the annular light source 26, etc. to the first position, the position of the first movable seat 22 is locked and no longer moves. The locking rod 31 slidably connected to the first movable seat 22 is moved by the linear motor, so that the locking rod 31 is close to the end of the rotating disk 11 and is inserted into the dividing wheel 32 coaxially arranged with the rotating disk 11 to achieve locking of the rotating disk 11. After completing the appearance inspection of the current chip, the locking rod 31 is retracted and the rotating disk 11 rotates again until the next chip reaches the second position, and the locking rod 31 is reinserted into the teeth of the dividing wheel 32 to lock the rotating disk 11.

[0070] It can be understood that the gap between the teeth of the indexing wheel 32 is between the radial extension direction of the positioning teeth 12 and the radial extension direction of the rotating disk 11 along the radial extension direction of the indexing wheel 32, so as to avoid interference caused by the positioning teeth 12 when the locking rod 31 is inserted into the gap between the teeth of the indexing wheel 32. It should be noted that the fixing frame 13 will also not interfere with the insertion of the locking rod 31 into the gap between the teeth of the indexing wheel 32.

[0071] In some embodiments, reference Figure 5 As shown, it also includes a second optical detector 3, which is used to perform appearance inspection on the chip on the chip clamping component at the third position; at the third position, the rotating disk 11 is used to transfer the chip to a fourth position corresponding to the third position so that the second optical detector 3 can perform appearance inspection on the chip, and the third position is symmetrical to the first position along the chip clamping component; wherein the surfaces of the chip for appearance inspection at the third position and the fourth position are opposite.

[0072] In some exemplary embodiments, the second optical detector is symmetrical to the first optical detector 3 along the center line of the rotating disk 11 in the vertical direction, or the second optical detector is symmetrical to the first optical detector 3 along the center of the rotating disk 11 .

[0073] In some embodiments, the third position and the fourth position are both preset positions. Similarly, the position sensor can be used to detect that the second optical detector 3 has reached the third position, and the position sensor can be used to detect that the chip has reached the fourth position.

[0074] In some embodiments, the chip includes a first surface and a second surface. Through the introduction of the above embodiments, the first optical detector is arranged on one side of the chip clamping component, and can perform appearance inspection on the surfaces of all chips fixed on the fixing frame 13 in the same direction. For example, appearance inspection is performed on the first surface, and to perform appearance inspection on the second surface, all chips need to be removed, turned over, and then appearance inspection is started on the second surface. Although this overcomes the problem that the imaging of the chip surface does not meet the requirements during the appearance inspection process in the related technology, the efficiency is not high.

[0075] Through the setting of the second optical detector 3, after the first optical detector completes the detection of the first surface of the current chip on the left side, the electromagnet 124 corresponding to the current chip is powered off, and the fixed frame 13 is separated from the shading portion 14 as the rotating disk 11 rotates. After the current chip moves to the right side of the rotating disk 11 with the rotating disk 11, the first surface of the chip is close to the shading portion 14 on the positioning tooth 12, and the second optical detector 3 performs appearance detection on the second surface of the second chip, thereby improving the efficiency of chip appearance detection.

[0076] It should be noted that each electromagnet 124 can be independently controlled to be connected to and disconnected from the power supply.

[0077] Based on the same invention concept, Figure 6 The present application provides a chip, including a chip circuit board 41 and a clamping portion 42; the clamping portion 42 is arranged at opposite ends of the chip circuit board 41, and an easy-folding edge is provided between the clamping portion 42 and the chip circuit board 41, and the clamping portion 42 is configured to be fixed by a fixing frame 13 of a chip appearance inspection device; the area of the chip circuit board 41 is not larger than the area of the shading portion 14 on the chip appearance inspection device.

[0078] In order to ensure effective inspection of the chip to be inspected for appearance, the chip circuit board 41 is primarily inspected, and the chip circuit board 41 must not be obstructed during the inspection process to avoid incomplete inspection. The clamping portion 42 is used to cooperate with the fixing frame 13 of the chip inspection device to fix the chip, while not obstructing the chip circuit board 41 to be inspected for appearance. The area of the chip circuit board 41 is no larger than the area of the light shielding portion 14 on the chip appearance inspection device, and can effectively shield the chip circuit board 41 from transmitted light, preventing light transmitted through the chip circuit board 41 from affecting the appearance inspection of the chip, thereby causing inaccurate inspection results or unusable imaging in the camera module 24.

[0079] In some embodiments, the chip also includes a separator 43, which is located between the two clamping parts 42, and the separator 43 is located at one end of the chip circuit board 41 close to the rotating disk 11 of the chip appearance detection device, and the separator 43 and the chip circuit board 41 are connected by a second foldable edge 45; the separator 43 is penetrated by a positioning hole 431, and the positioning hole 431 is provided with a metal coating, and the positioning hole 431 corresponds to the electromagnet bolt of the chip appearance detection device.

[0080] The electromagnet 124 is effectively matched with the positioning hole 431 through the positioning hole 431 on the partition 43, and the electromagnet 124 is effectively adsorbed with the positioning hole 431 through the metal coating in the positioning hole 431. At the same time, the chip circuit board 41 and the light shielding part 14 are kept close together during the appearance inspection, thereby avoiding the influence of the transmitted light on the appearance inspection result of the chip circuit board 41.

[0081] In some embodiments, the first easy-folding edge 44 and the second easy-folding edge 45 are used to separate the chip circuit board 41 from the clamping portion 42 and the separator 43 respectively. The easy-folding edge can be as follows: Figure 6 The contact area between the chip circuit board 41 and the clamping portion 42 and the partition portion 43 is reduced by using the opening method shown in FIG.

[0082] In some exemplary embodiments, the connection material between the chip circuit board 41 , the clamping portion 42 and the partition portion 43 must ensure a certain stability and also be easy to separate, which is not specifically limited here.

[0083] Based on the same invention concept, Figure 7 As shown, the present application provides a chip appearance inspection method, which is used in the chip appearance inspection device and chip involved in the above embodiments. The method specifically includes:

[0084] S101, placing the chip clamping portion 42 in the fixing frame 13;

[0085] S102, controlling the first optical detector to a first position;

[0086] S103, controlling the rotating disk 11 of the chip clamping component to rotate so that the chip circuit board 41 of the chip is in close contact with the light shielding portion 14 on the positioning teeth 12, until the chip circuit board 41 rotates to a second position corresponding to the first position;

[0087] S104 , the optical detector performs a feature scan on the surface of the chip circuit board 41 and forms a feature image.

[0088] Specifically, all chips to be tested are inserted into the clamping grooves 133 in the fixing frame 13 through the clamping portions 42 until all chips are fixed in the fixing frame 13 .

[0089] The first movable base 22 is controlled to move on the cantilever base 21 until the camera module 24 , the polarizer 25 , the annular light source 26 and the prism 27 fixed on the first movable base 22 are at the first position.

[0090] The rotating disk 11 of the chip clamping component is controlled to rotate. When each chip on the fixed frame 13 rotates to a position close to the first optical detector, the gravity of the fixed frame 13 and the chip overcomes the elastic force of the elastic member 15, so that one surface of the chip circuit board 41 is abutted against the light-shielding portion 14 below. At the same time, the corresponding electromagnet 124 is inserted into the positioning hole 431 of the partition 43 of the chip. The electromagnet 124 is energized to generate magnetic force, which adsorbs the metal coating in the positioning hole 431 to make the chip circuit board 41 close to the light-shielding portion 14 until the rotating disk 11 rotates the adsorbed chip circuit board 41 to a second position corresponding to the first position, and controls the locking rod 31 to move until the locking rod 31 is inserted into the tooth gap in the dividing wheel 32, thereby fixing the rotating disk 11.

[0091] The second movable base 28 and the second movable base 2823 are moved to fine-tune the prism 27 so that the light irradiated by the annular light source 26 onto the chip circuit board 41 passes through the prism 27 .

[0092] The camera module 24 images the surface of the chip circuit board 41 and transmits the image back to the terminal device for comparison with preset image parameters.

[0093] Retract the locking rod 31 and continue to rotate the rotating disk 11 until the camera module 24 images all the chips on the fixing frame 13 .

[0094] The electromagnet 124 is powered off, the rotating disk 11 stops rotating, and the chip on the fixing frame 13 is removed, completing a surface inspection of the chip.

[0095] In other embodiments, all chips to be tested are inserted into the clamping slots 133 in the fixing frame 13 through the clamping portions 42 until all chips are fixed in the fixing frame 13 .

[0096] The first movable base 22 of the second optical detector 3 is controlled to move on the cantilever base 21 until the camera module 24 , the polarizer 25 , the annular light source 26 and the prism 27 fixed on the first movable base 22 are at the first position.

[0097] The second optical detector 3 is arranged so as to be symmetrical with the first optical detector along the rotating disk 11. It can be understood that the second optical detector 3 is identical to the first optical detector.

[0098] The rotating disk 11 of the chip clamping component is controlled to rotate. When each chip on the fixed frame 13 rotates close to the first optical detector, the gravity of the fixed frame 13 and the chip overcomes the elastic force of the elastic member 15, so that the second surface of the chip circuit board 41 is abutted against the light-shielding portion 14 below. At the same time, the corresponding electromagnet 124 is inserted into the positioning hole 431 of the partition 43 of the chip. The electromagnet 124 is energized to generate magnetic force, which adsorbs the metal coating in the positioning hole 431 to make the second surface of the chip circuit board 41 close to the light-shielding portion 14 until the rotating disk 11 rotates the adsorbed chip circuit board 41 to a second position corresponding to the first position, and controls the locking rod 31 to move until the locking rod 31 is inserted into the tooth gap in the dividing wheel 32, thereby fixing the rotating disk 11.

[0099] The second movable base 28 and the second movable base 2823 are moved to fine-tune the prism 27 so that the light irradiated by the annular light source 26 onto the chip circuit board 41 passes through the prism 27 .

[0100] The camera module 24 images the first surface of the chip circuit board 41 and transmits the image back to the terminal device for comparison with preset image parameters.

[0101] Retract the locking rod 31, continue to rotate the rotating disk 11, and the electromagnet 124 is powered off. When each chip on the fixing frame 13 rotates to a position close to the second optical detector 3, the gravity of the fixing frame 13 and the chip overcomes the elastic force of the elastic member 15, so that the first surface of the chip is against the light shielding portion 14 below. At the same time, the corresponding electromagnet 124 is inserted into the positioning hole 431 of the chip partition 43. The electromagnet 124 is energized to generate magnetic force, which adsorbs the metal coating in the positioning hole 431 so that the first surface of the chip circuit board 41 is close to the light shielding portion 14 until the rotating disk 11 rotates the adsorbed chip circuit board 41 to the detection position of the second optical detector 3. The locking rod 31 is controlled to move until the locking rod 31 is inserted into the tooth gap in the ferry, and the rotating disk 11 is fixed. The camera module 24 of the second optical detector 3 images the second surface of the chip circuit board 41 and transmits the image back to the terminal device for comparison with the preset image parameters.

[0102] Through this embodiment, the first optical detector and the second optical detector 3 cooperate to complete the detection of the first surface and the second surface of the chip circuit board 41 at one time, saving the time of chip armoring and improving the detection efficiency.

[0103] In some embodiments, the surface of the chip circuit board 41 is provided with a chip label. When the camera module 24 images the chip circuit board 41, the chip label can be simultaneously imaged. When the terminal device compares the image with preset image parameters, the chip label with defects can be directly observed and recorded on the display.

[0104] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. Within the scope of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0105] In addition, for simplicity of description and discussion, and in order not to make the embodiment of the application difficult to understand, the known power supply / ground connection with integrated circuit (IC) chip and other components may or may not be shown in the accompanying drawings provided. In addition, the device can be shown in the form of a block diagram to avoid making the embodiment of the application difficult to understand, and this also takes into account the following fact, that is, the details of the embodiment of these block diagram devices are highly dependent on the platform to be implemented in the embodiment of the application (that is, these details should be fully within the scope of understanding of those skilled in the art). When specific details (for example, circuit) are set forth to describe exemplary embodiments of the application, it will be apparent to those skilled in the art that the embodiment of the application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0106] Although the present invention has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of these embodiments will be apparent to those skilled in the art based on the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may utilize the embodiments discussed.

[0107] The embodiments of the present application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of this application.

Claims

1. A chip appearance inspection device, characterized in that: include: a chip clamping component and a first optical detector, wherein the first optical detector is arranged on one side of the chip clamping component and is used to perform appearance inspection on the chip on the chip clamping component at a first position; The chip clamping component includes: a rotating disk, positioning teeth and a fixing frame; The rotating disk is used to transfer the chip to a second position corresponding to the first position so that the first optical detector can perform appearance inspection on the chip. The rotating disk is evenly provided with positioning teeth along the circumference. The sides of the positioning teeth facing the fixing frame are each provided with a light shielding portion, and the light shielding portion is used to shield light transmitted through the chip. A fixing frame rotatably connected to the rotating disk along the circumference thereof and a rotation space for the fixing frame to rotate to the light shielding portion are provided between adjacent positioning teeth, wherein the fixing frame is used to carry the chip and place the chip against the corresponding light shielding portion at the second position; The first optical detector includes a cantilever base, a first movable base, a camera module, a polarizer, a ring light source and a prism; A first movable seat is provided on the side of the cantilever seat facing the rotating disk, and the first movable seat is slidably connected to the cantilever seat. The first movable seat is provided with a camera module, a polarizer, an annular light source and a prism in sequence in the direction facing the rotating disk, wherein the light emitting direction of the annular light source is toward the prism, and the polarizer is located in the collection direction of the camera module; A second movable seat is provided at one end of the first movable seat close to the rotating disk, and the end of the prism is fixedly provided on the second movable seat. The second movable seat is slidably connected to the cantilever seat, and the plane in which the second movable seat moves is parallel to the plane in which the light shielding portion against which the chip is abutted is located. The positioning teeth include a first panel and a second panel, the first panel is tilted from one end away from the rotating disk to the side close to the second panel, and the second panel is tilted from one end away from the rotating disk to the side close to the first panel. A partition is provided between the first panel and the second panel, and the first panel and the second panel respectively form an accommodating cavity with the partition, and an electromagnet is respectively provided in the accommodating cavity through the first panel and the second panel, and the electromagnet is connected to a power supply.

2. The chip appearance inspection device according to claim 1, characterized in that: The fixing frame includes a support rod and a connecting rod; The support rods are arranged in parallel on opposite sides of the rotating disk and are rotatably connected to the rotating disk at one end thereof. A clamping groove extending from an end of the support rod away from the rotating disk to an end thereof close to the rotating disk is provided on a side adjacent to the two support rods. The width of the clamping groove is smaller than the thickness of the chip, and the clamping groove is elastic. The connecting rod is fixedly connected between the two supporting rods; wherein, the connecting rod is located at one end of the clamping groove close to the rotating disk.

3. The chip appearance inspection device according to claim 1, characterized in that: An elastic member is provided between adjacent positioning teeth and the fixing frame, and the elastic force of the elastic member is less than half of the sum of the weight of the fixing frame and the chip.

4. The chip appearance inspection device according to claim 1, characterized in that: Also included is a locking structure comprising a locking lever and an indexing wheel; The locking rod is arranged on a side of the first movable seat facing the chip clamping component, and a linear motor is arranged on a side of the first movable seat and the locking rod away from the chip clamping component; The indexing wheel is coaxially arranged with the rotating disk, and the gap between the teeth of the indexing wheel is between the positioning teeth in the radial extension direction of the indexing wheel and the radial extension direction of the rotating disk; one end of the locking rod facing the indexing wheel is adapted to the teeth of the indexing wheel.

5. The chip appearance inspection device according to claim 1, characterized in that: The chip clamping component further includes a second optical detector, the second optical detector being used to perform an appearance inspection on the chip on the chip clamping component at a third position; at the third position, the rotating disk is used to transfer the chip to a fourth position corresponding to the third position so that the second optical detector can perform an appearance inspection on the chip, and the third position is symmetrical to the first position along the chip clamping component; The surfaces of the chip subjected to appearance inspection at the second position and the fourth position are opposite to each other.

6. The chip appearance inspection device according to any one of claims 1 to 5, characterized in that: The chip includes a chip circuit board and a clamping portion; The clamping parts are arranged at opposite ends of the chip circuit board, an easy-folding edge is provided between the clamping parts and the chip circuit board, and the clamping parts are configured to be fixed by a fixing frame of the chip appearance inspection device; The area of the chip circuit board is not larger than the area of the light shielding portion on the chip appearance inspection device.

7. The chip appearance inspection device according to claim 6, characterized in that: It also includes a separator, the separator is located between the two clamping parts, and the separator is located at one end of the chip circuit board close to the rotating disk of the chip appearance inspection device, and the separator is connected to the chip circuit board through a second easy-folding edge; A positioning hole is formed through the partition, a metal coating is provided in the positioning hole, and the positioning hole corresponds to the electromagnet of the chip appearance detection device.

8. A chip appearance inspection method, used in the chip appearance inspection device according to any one of claims 1 to 7, characterized in that: The method comprises: placing the clamping portion of the chip in the fixing frame; controlling the optical detector to the first position; controlling the rotating disk of the chip clamping component to rotate so that the chip circuit board of the chip is in close contact with the light shielding portion on the positioning teeth until the chip circuit board rotates to a second position corresponding to the first position; The optical detector performs feature scanning on the surface of the chip away from the light shielding portion and forms a feature image.

Images