A thermostat control system with temperature feedback

Abstract

The application provides a constant temperature control system with temperature feedback, and the overall scheme design comprises a temperature control object, a heat transfer system, an energy storage system, a heat insulation system and a heat dissipation system; the temperature control object, the energy storage system and the heat dissipation system are connected through the heat transfer system; the energy storage system is installed in the heat insulation system; and the heat dissipation system is located outside the heat insulation system. The energy storage system and the heat transfer system are designed, the function of waste heat recovery of the system is realized, no additional power input is needed, the utilization rate of energy is improved, the heat transfer system is designed, the passive control system controls the size of the heat transferred to the outside, the system is stable and reliable, and can normally operate under low temperature conditions.

Description

Technical Field

[0001] This invention belongs to the field of temperature control system technology, specifically relating to a constant temperature control system with temperature feedback. Background Technology

[0002] Most existing constant temperature control systems use heating and cooling modules to achieve constant temperature range control. Specifically, at low temperatures, a certain amount of power is consumed, and the controller activates the heating module to raise the temperature. When the temperature exceeds the preset temperature, the cooling module dissipates heat to lower the temperature. Once the preset temperature is reached, the system enters the constant temperature range control phase. However, these systems generally have some shortcomings and limitations, mainly manifested in the following ways:

[0003] 1. Existing constant temperature control systems require an additional power source and consume a large amount of energy to maintain a constant temperature when the external ambient temperature is low.

[0004] 2. Electronic components of the temperature control system, such as temperature sensors, controllers, heating modules, and heat dissipation modules, are prone to failure under low temperature conditions, which can cause the temperature control system to fail as well. Summary of the Invention

[0005] In view of this, in order to overcome the defects and shortcomings of the existing technology, the purpose of this invention is to provide a constant temperature control system with temperature feedback, which can absorb the waste heat of the system to maintain a constant temperature and ensure the stability of the constant temperature system at low temperatures.

[0006] The overall design includes a temperature-controlled object, a heat transfer system, an energy storage system, a thermal insulation system, and a heat dissipation system. The temperature-controlled object, energy storage system, and heat dissipation system are connected by the heat transfer system. The energy storage system is installed within the thermal insulation system, while the heat dissipation system is located outside the thermal insulation system. This invention designs an energy storage system and a heat transfer system to achieve waste heat recovery without requiring additional power input, thus improving energy utilization. The heat transfer system passively controls the amount of heat transferred externally, ensuring system stability and reliability, and enabling normal operation even under low-temperature conditions.

[0007] The specific technical solution adopted by this invention to solve its technical problem is as follows:

[0008] A constant temperature control system with temperature feedback is characterized by comprising: a heat transfer system (200), an energy storage system (300), a heat insulation system (400), and a heat dissipation system (500).

[0009] The heat transfer system includes a heat dissipation substrate (201), heat transfer system I (202), and heat transfer system II (203); both heat transfer systems I and II include a working medium and a transmission pipeline; the energy storage system includes a heat absorber (301), a heat conduction device (302), and a heat absorber shell (303); the heat insulation system includes an outer shell (401), an inner shell (402), and a heat insulation layer (403); the heat dissipation substrate is in close contact with the temperature control object (100), heat transfer system I connects the heat dissipation substrate and the heat storage system, heat transfer system II connects the heat dissipation substrate and the heat dissipation system, the energy storage system is installed inside the heat insulation system, the heat dissipation system is located outside the heat insulation system, the heat insulation layer is disposed between the outer shell and the inner shell, and the inner surface of the heat insulation layer is fixed to the outer surface of the inner shell.

[0010] Furthermore, the temperature settings of the temperature control system are as follows: the solid-liquid phase change point T1 of the working medium of heat transfer system I; the solid-liquid phase change point T2 of the working medium of heat transfer system II; the solid-liquid phase change point T3 of the heat absorber in the energy storage system; the minimum failure temperature T4 of the temperature-controlled object; the above four temperatures need to satisfy the following order: T2>T3>T4>T1.

[0011] Furthermore, the constant temperature control system has two states: operating state and dormant state. The latent heat stored in the heat absorber of the energy storage system needs to be greater than the heat dissipation of the constant temperature system during dormant period. The calculation methods for the mass of the heat absorber and the heat dissipation of the constant temperature system during dormant period are as follows:

[0012]

[0013]

[0014] In the formula T a For the temperature of the object being controlled, T e Where H is the ambient temperature, H is the latent heat of the endothermic agent, and t is the temperature. a R is the duration of the system's dormancy state, m is the equivalent thermal resistance from the environment to the constant temperature system, and Q is the heat dissipation of the constant temperature system during its dormancy period.

[0015] Furthermore, the maximum thermal conductivity of the insulation layer of the thermal insulation system must meet the following requirements:

[0016]

[0017] In the formula λ max R is the maximum thermal conductivity of the insulation layer. max δ is the maximum equivalent thermal resistance from the constant temperature system to the environment, A is the contact area between the outer shell of the thermal insulation system and the outside, δ is the thickness of the insulation layer, h1 is the surface heat transfer coefficient between the thermal insulation system and the internal air, and h2 is the surface heat transfer coefficient between the thermal insulation system and the external air.

[0018] Furthermore, the maximum heat transfer power of heat transfer system I and heat transfer system II must meet the following requirements:

[0019]

[0020] q max,Ⅱ =q max，热源

[0021] In the formula q max，Ⅰ q represents the maximum heat transfer power of heat transfer system I. max，Ⅱ q represents the maximum heat transfer power of heat transfer system II. max，热源 The maximum power for heating the object under temperature control.

[0022] Compared with the prior art, the present invention and its preferred embodiments have at least the following beneficial effects:

[0023] (1) It provides an energy storage system and a heat transfer system to realize the function of waste heat recovery of the system without the need for additional power input, thereby improving the energy utilization rate.

[0024] (2) A heat transfer system was designed to passively control the amount of heat transferred to the outside. The system is stable and reliable and can operate normally under low temperature conditions. Attached Figure Description

[0025] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0026] Figure 1 This is a schematic diagram of the structure and piping of an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the temperature control principle in an embodiment of the present invention;

[0028] Figure 3 This is a temperature range control diagram according to an embodiment of the present invention;

[0029] In the diagram: 100 - Temperature control object; 200 - Heat transfer system; 300 - Energy storage system; 400 - Thermal insulation system; 500 - Heat dissipation system; 401 - Outer shell; 402 - Inner shell; 403 - Thermal insulation layer; 301 - Heat absorber; 302 - Heat conduction device; 303 - Heat absorber shell; 501 - Heat dissipation base; 502 - Enhanced heat exchange device; 404 - Sealing device. Detailed Implementation

[0030] To make the features and advantages of this patent more apparent and understandable, specific embodiments are provided below for detailed explanation:

[0031] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0032] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0033] like Figure 1 As shown, this embodiment provides a constant temperature control system with temperature feedback, including a temperature-controlled object 100, a heat transfer system 200, an energy storage system 300, a thermal insulation system 400, and a heat dissipation system 500. The heat transfer system includes a heat dissipation substrate 201, a heat transfer system I 202, and a heat transfer system II 203, with heat transfer systems I and II including a working medium and a transmission pipe. The energy storage system includes a heat absorber 301, a heat conduction device 302, and a heat absorber shell 303. The thermal insulation system includes an outer shell 401, an inner shell 402, and a thermal insulation layer 403. The heat dissipation substrate is in close contact with the temperature-controlled object. The heat transfer system I connects the heat dissipation substrate and the thermal storage system, and the heat transfer system II connects the heat dissipation substrate and the heat dissipation system. The energy storage system is installed inside the thermal insulation system, and the heat dissipation system is located outside the thermal insulation system. The thermal insulation layer is disposed between the outer shell and the inner shell, and the inner surface of the thermal insulation layer is fixed to the outer surface of the inner shell.

[0034] In this embodiment, the temperature settings of the constant temperature control system are as follows: the solid-liquid phase change point T1 of the working medium of heat transfer system I; the solid-liquid phase change point T2 of the working medium of heat transfer system II; the solid-liquid phase change point T3 of the heat absorber in the energy storage system; the minimum failure temperature T4 of the temperature-controlled object; the above four temperatures need to satisfy the following order: T2>T3>T4>T1.

[0035] Its temperature feedback function is achieved through heat transfer systems I and II and an energy storage system, such as... Figure 2 , Figure 3 As shown, the equivalent thermal resistance of heat transfer system II is high in the part less than T2, so less heat is transferred. Combined with the heat release of the energy storage system, the temperature can be kept constant. When the temperature is greater than T2, the thermal resistance of heat transfer system II decreases, so more heat can be transferred. At the same time, the energy storage system can also absorb some heat, thereby slowing down the temperature rise and keeping the temperature within a certain range.

[0036] For example, the solid-liquid phase transition point T1 of the working medium in heat transfer system I is -35℃; the solid-liquid phase transition point T2 of the working medium in heat transfer system II is 5℃; the solid-liquid phase transition point T3 of the heat absorber in the energy storage system is -13℃; the minimum failure temperature T4 of the temperature-controlled object is -20℃, and the ambient temperature is -56℃. When the temperature-controlled object is in a heating state and its temperature Ta is in the range [-13, 5], the energy storage system absorbs heat because the temperature of the temperature-controlled object is higher than the solid-liquid phase transition point T3 of the heat absorber in the energy storage system, thus slowing down the temperature rise of the temperature-controlled object. When the temperature-controlled object is in a working state and its temperature Ta is greater than the solid-liquid phase transition point T2 of the working medium in heat transfer system II, the system has a strong heat dissipation demand. The temperature of heat transfer system II rises and exceeds the critical value T2, its equivalent thermal resistance is greatly reduced, and its heat transfer capacity is greatly improved, thus slowing down the temperature rise of the temperature-controlled object. At the same time, the energy storage system gradually absorbs heat until it becomes saturated.

[0037] For example, the solid-liquid phase transition point T1 of the working medium in heat transfer system I is -35℃; the solid-liquid phase transition point T2 of the working medium in heat transfer system II is 5℃; the solid-liquid phase transition point T3 of the heat absorber in the energy storage system is -13℃; the minimum failure temperature T4 of the temperature-controlled object is -20℃, and the ambient temperature is -70℃. When the temperature-controlled object is in a non-heating state and the temperature Ta is in the range [-13, 5], the equivalent thermal resistance increases due to the low gas-liquid phase transition intensity of the working medium in heat transfer system II, which significantly reduces the heat transfer capacity and slows down the cooling trend of the temperature-controlled object. When the temperature-controlled object is in a dormant state and the temperature Ta is less than -13℃, the system has a strong heat preservation requirement. The heat absorber in the energy storage system solidifies and releases a large amount of heat to maintain the system temperature above -20℃.

[0038] In this embodiment, the heat transfer system includes a working medium and a transfer pipe. The transfer pipe includes an evaporation section, an insulation section, and a condensation section. The working medium transfers heat through a gas-liquid phase change. The heat transfer rate of the heat transfer system depends on the rate at which the working medium is transferred within the pipe. The transfer rate of the working medium can be changed by increasing or decreasing the pipe diameter, changing the geometry of the transfer pipe, or changing the operating temperature.

[0039] In this embodiment, the constant temperature control system has two states: an operating state and a dormant state. The heat storage agent in the energy storage system needs to store more latent heat than the heat dissipation during the dormant period of the constant temperature control system. The calculation methods for the mass of the heat storage agent and the heat dissipation during the dormant period of the constant temperature control system are as follows:

[0040]

[0041]

[0042] In the formula T a For the temperature of the object being controlled, T eWhere H is the ambient temperature, H is the latent heat of the endothermic agent, and t is the temperature. a R is the duration of the system's dormancy state, m is the equivalent thermal resistance from the environment to the constant temperature system, and Q is the heat dissipation of the constant temperature system during its dormancy period.

[0043] In this embodiment, the maximum thermal conductivity of the insulation layer of the thermal insulation system needs to meet the following requirements:

[0044]

[0045] In the formula λ max R is the maximum thermal conductivity of the insulation layer. max δ is the maximum equivalent thermal resistance from the constant temperature system to the environment, A is the contact area between the outer shell of the thermal insulation system and the outside, δ is the thickness of the insulation layer, h1 is the surface heat transfer coefficient between the thermal insulation system and the internal air, and h2 is the surface heat transfer coefficient between the thermal insulation system and the external air.

[0046] In this embodiment, the maximum heat transfer power of heat transfer systems I and II must meet the following requirements:

[0047]

[0048] q max，Ⅱ =q max，热源

[0049] In the formula q max,Ⅰ q represents the maximum heat transfer power of heat transfer system I. max,Ⅱ q represents the maximum heat transfer power of heat transfer system II. max，热源 The maximum power for heating the object under temperature control.

[0050] In this embodiment, the heat dissipation system includes a heat dissipation base 501 and an enhanced heat exchange device 502. The enhanced heat exchange device is installed vertically to the heat dissipation base, which is located on the outer surface of the outer shell of the insulation system. The enhanced heat exchange device enhances the heat exchange effect by increasing the heat exchange area.

[0051] Unless otherwise stated, if any of the technical solutions disclosed in this invention specify a numerical range, then the disclosed numerical range is a preferred numerical range. Anyone skilled in the art should understand that the preferred numerical range is merely one among many feasible numerical values ​​that has a more obvious or representative technical effect. Because there are many numerical values, it is impossible to list them all. Therefore, this invention discloses only some numerical values ​​to illustrate the technical solutions of this invention. Furthermore, the numerical values ​​listed above should not constitute a limitation on the scope of protection of this invention.

[0052] If the terms "first" or "second" are used in this document to specify components, those skilled in the art should know that the use of "first" or "second" is merely for the purpose of distinguishing components in description, and unless otherwise stated, the above terms have no special meaning.

[0053] If this invention discloses or relates to components or structural parts that are fixedly connected to each other, then, unless otherwise stated, a fixed connection can be understood as: a fixed connection that can be detached (e.g., using bolts or screws), or a fixed connection that cannot be detached (e.g., riveting, welding). Of course, a fixed connection can also be replaced by an integral structure (e.g., manufactured in one piece using a casting process) (except where it is obviously impossible to use an integral molding process).

[0054] Furthermore, the orientations or positional relationships used in any of the technical solutions disclosed in this invention above to indicate positional relationships, such as "longitudinal," "lateral," "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing this patent. They are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this patent. In addition, unless otherwise stated, the terms used to indicate shape in any of the technical solutions disclosed in this invention above include shapes that are similar to, close to, or approximate with it.

[0055] Any component provided by this invention can be assembled from multiple individual components or can be a single component manufactured by a one-piece molding process.

[0056] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them; although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications can still be made to the specific implementation of the present invention or equivalent substitutions can be made to some technical features without departing from the spirit of the technical solutions of the present invention, and all such modifications and substitutions should be covered within the scope of the technical solutions claimed in the present invention.

[0057] This patent is not limited to the above-described preferred embodiment. Anyone can derive other forms of constant temperature control system with temperature feedback under the guidance of this patent. All equivalent changes and modifications made within the scope of this patent application shall fall within the scope of this patent.

Claims

1. A constant temperature control system with temperature feedback, characterized in that, include: Heat transfer system (200), energy storage system (300), thermal insulation system (400) and heat dissipation system (500); The heat transfer system includes a heat dissipation substrate (201), heat transfer system I (202), and heat transfer system II (203); both heat transfer systems I and II include a working medium and a transmission pipeline. The transmission pipeline includes an evaporation section, an insulation section, and a condensation section. The working medium transfers heat through a gas-liquid phase change. The heat transfer rate of the heat transfer system depends on the rate at which the working medium is transferred within the pipeline. The energy storage system includes a heat absorber (301), a heat conduction device (302), and a heat absorber shell (303). The heat insulation system includes an outer shell (401), an inner shell (402), and a heat insulation layer (403). The heat dissipation substrate is in close contact with the temperature-controlled object (100). Heat transfer system I connects the heat dissipation substrate and the energy storage system. Heat transfer system II connects the heat dissipation substrate and the heat dissipation system. The energy storage system is installed inside the heat insulation system. The heat dissipation system is located outside the heat insulation system. The heat insulation layer is disposed between the outer shell and the inner shell. The inner surface of the heat insulation layer is fixed to the outer surface of the inner shell. The temperature settings of the constant temperature control system are as follows: the solid-liquid phase change point T1 of the working medium of heat transfer system I; the solid-liquid phase change point T2 of the working medium of heat transfer system II; the solid-liquid phase change point T3 of the heat absorber in the energy storage system; the minimum failure temperature T4 of the temperature-controlled object; the above four temperatures need to satisfy the following order: T2>T3>T4>T1; The constant temperature control system has two states: working state and dormant state. The latent heat stored in the heat absorber of the energy storage system needs to be greater than the heat dissipation of the constant temperature system during the dormant period.

2. The constant temperature control system with temperature feedback according to claim 1, characterized in that: The maximum thermal conductivity of the insulation layer in the thermal insulation system must meet the following requirements: In the formula The maximum thermal conductivity of the insulation layer, This represents the maximum value of the equivalent thermal resistance from the environment to the constant temperature system. The contact area between the outer shell of the thermal insulation system and the outside environment. For the thickness of the insulation layer, The surface heat transfer coefficient between the thermal insulation system and the internal air. It is the surface heat transfer coefficient between the thermal insulation system and the outside air.

3. A constant temperature control system with temperature feedback according to claim 1, characterized in that: The maximum heat transfer power of heat transfer system I and heat transfer system II must meet the following requirements: In the formula This represents the maximum heat transfer power of heat transfer system I. This represents the maximum heat transfer power of heat transfer system II. The maximum power for heating the object under temperature control.

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