Light-emitting substrate, backlight module and display device

Abstract

The application discloses a light-emitting substrate, a backlight module and a display device, and relates to the technical field of display, so as to improve the overall light-emitting efficiency of the light-emitting substrate and improve the display effect of the display device. The light-emitting substrate comprises a substrate, a reflecting layer and a support column. The reflecting layer is arranged on the substrate; the reflecting layer is provided with a plurality of first openings, the first openings exist in at least two cross sections parallel to the plane where the substrate is located, wherein the area of the cross section relatively close to the substrate is smaller than the area of the cross section relatively far from the substrate. The support column is fixed on the substrate; the orthographic projection of the support column on the substrate is a first projection, the orthographic projection of the smallest cross section of the first opening in the plurality of cross sections parallel to the plane where the substrate is located on the substrate is a second projection, and the second projection is within the range of the first projection. The application is used for manufacturing a display device.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a light-emitting substrate, a backlight module, and a display device. Background Technology

[0002] With the development of LED technology, backlights using sub-millimeter or even micrometer-scale LEDs have become widely used. This allows products utilizing this backlight, such as transmissive liquid crystal displays (LCDs), to achieve the same contrast ratio as OLED displays, while retaining the technological advantages of LCDs, thus enhancing the display effect and providing users with a superior visual experience.

[0003] In related technologies, the overall light extraction efficiency of display devices using LED backlights at the sub-millimeter or even micrometer scale still needs to be improved.

[0004] Public content

[0005] This disclosure provides a light-emitting substrate, a backlight module, and a display device to improve the overall light extraction efficiency of the light-emitting substrate and enhance the display effect of the display device.

[0006] To achieve the above objectives, the present disclosure adopts the following technical solution:

[0007] On one hand, a light-emitting substrate is provided. The light-emitting substrate includes a substrate, a reflective layer, and a support pillar. The reflective layer is disposed on the substrate; the reflective layer has a plurality of first openings, and at least two of the first openings have cross-sections parallel to the plane of the substrate, wherein the area of ​​the cross-section relatively closer to the substrate is smaller than the area of ​​the cross-section relatively farther from the substrate. The support pillar is fixed to the substrate; the orthographic projection of the support pillar on the substrate is a first projection, and the orthographic projection of the smallest cross-section of the first opening among the multiple cross-sections parallel to the plane of the substrate on the substrate is a second projection, the second projection being within the range of the first projection.

[0008] In some embodiments, the smallest cross-section of the first opening among a plurality of cross-sections parallel to the plane of the substrate is the cross-section closest to the substrate.

[0009] In some embodiments, the maximum dimension of the support column towards the surface of the substrate is D1, and the mounting tolerance of the support column is T1; the maximum dimension of the minimum cross section is D2, and the dimensional tolerance of the second sub-hole is T2;

[0010]

[0011] In some embodiments, the edge of the support column towards the surface of the substrate is arc-shaped, and the tolerance of the arc-shaped edge is R;

[0012]

[0013] In some embodiments, the maximum dimension of the support column towards the surface of the substrate is D1, and the mounting tolerance of the support column is T1; the maximum dimension of the maximum cross section in the plurality of cross sections parallel to the plane on which the substrate is located is D3, and the radial dimensional tolerance of the maximum cross section is T3;

[0014]

[0015] In some embodiments, the edge of the support column towards the surface of the substrate is arc-shaped, and the tolerance of the arc-shaped edge is R;

[0016]

[0017] In some embodiments, the light-emitting substrate further comprises a fixing portion, and the support column is fixed to the substrate through the fixing portion.

[0018] In some embodiments, the material of the fixing portion comprises hot melt adhesive.

[0019] In some embodiments, the reflective layer comprises a first sub-reflection layer and a second sub-reflection layer disposed on the substrate, the first opening comprises a first sub-hole and a second sub-hole connected in communication, the first sub-hole penetrates through the first sub-reflection layer, and the second sub-hole penetrates through the second sub-reflection layer. The first sub-hole is farther away from the substrate than the second sub-hole, and the aperture of the end of the first sub-hole close to the second sub-hole is greater than the aperture of the end of the second sub-hole close to the first sub-hole, so that the sidewall of the first opening forms a stepped structure.

[0020] In some embodiments, the maximum dimension of the support column towards the surface of the substrate is greater than the maximum dimension of the second sub-hole and less than the maximum dimension of the first sub-hole. The shape of the second sub-hole is approximately cylindrical, the depth of the second sub-hole is H, the bottom area of the second sub-hole is S, and the tolerance of the depth of the second sub-hole is T4; the mass of the hot melt adhesive is M, the density of the hot melt adhesive is p, and the tolerance of the amount of hot melt adhesive is T5;

[0021]

[0022] In some embodiments, the support column comprises a support body and a support frame, the support frame is located on one side of the support body close to the substrate. The support frame is located in the second sub-hole, and in the direction perpendicular to the substrate, the thickness of the support frame is substantially equal to the thickness of the second sub-reflection layer.

[0023] In some embodiments, the shape of the second sub-hole is substantially cylindrical, the depth of the second sub-hole is H, the bottom area of the second sub-hole is S, and the tolerance of the depth of the second sub-hole is T4; the mass of the hot melt adhesive is M, the density of the hot melt adhesive is p, and the tolerance of the amount of hot melt adhesive is T5; the volume of the support frame is V;

[0024]

[0025] In some embodiments, the light-emitting substrate further comprises at least one alignment mark, and at least one of the first openings is provided with an alignment mark.

[0026] In some embodiments, the substrate comprises a substrate and a plurality of conductive layers disposed on the substrate, the alignment mark is the same material as at least one of the plurality of conductive layers and is disposed in the same layer.

[0027] In some embodiments, the reflectivity of the support column is substantially the same as the reflectivity of the reflection layer.

[0028] In some embodiments, the reflection layer is further provided with a plurality of second openings, and the second openings exist in at least two cross sections parallel to the plane in which the substrate is located, the area of the cross section relatively close to the substrate is smaller than the area of the cross section relatively far from the substrate. The light-emitting substrate further comprises a light-emitting device, and the light-emitting device is fixed on the substrate. The orthographic projection of the light-emitting device on the substrate is a third projection, the orthographic projection of the smallest cross section of the second opening in the plurality of cross sections parallel to the plane in which the substrate is located on the substrate is a fourth projection, and the third projection falls within the fourth projection.

[0029] In some embodiments, the light-emitting substrate further comprises a reflection part, the reflection part is at least partially disposed in the second opening, and at least covers the exposed part of the substrate between the second opening and the light-emitting device.

[0030] In some embodiments, the reflectivity of the reflection part is substantially the same as the reflectivity of the reflection layer.

[0031] The light-emitting substrate provided by the embodiments of the present disclosure is provided. The second projection (the orthographic projection of the minimum section of the first opening in the plurality of sections parallel to the plane where the substrate is located on the substrate) is within the range of the first projection (the orthographic projection of the support column on the substrate), so that the support column can block the minimum section, avoiding the problem that the area between the boundary of the first opening of the reflective layer and the support column cannot be reflected, thereby reducing the reflection area, thereby improving the overall light-emitting efficiency of the light-emitting substrate, and improving the display effect of the display device.

[0032] In another aspect, a backlight module is provided. The backlight module includes the light-emitting substrate described in any of the above embodiments and a plurality of optical films. The light-emitting substrate has opposite light-emitting sides and non-light-emitting sides, and the plurality of optical films are arranged on the light-emitting side of the light-emitting substrate.

[0033] In another aspect, a display device is provided. The display device includes the backlight module described in the above embodiments and a display panel, and the display panel is arranged on the side of the plurality of optical films in the backlight module away from the light-emitting substrate.

[0034] The backlight module and the display device provided by the embodiments of the present disclosure have the same beneficial effects as the light-emitting substrate provided by the above technical solutions, and will not be described here. BRIEF DESCRIPTION OF DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings needed to be used in some embodiments of the present disclosure. Obviously, the drawings in the following description are only some drawings of the embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art according to these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limited to the actual size, actual process, actual time sequence, etc. of the product involved in the embodiments of the present disclosure.

[0036] Figure 1 Structure diagram of the display device according to some embodiments;

[0037] Figure 2 Sectional view of the display device according to some embodiments;

[0038] Figure 3A Top view of the light-emitting substrate according to some embodiments;

[0039] Figure 3B Top view of the light-emitting substrate according to some other embodiments;

[0040] Figure 4 Sectional view of the light-emitting substrate in the display device along Q-Q' according to some embodiments; Figure 3B

[0041] Figure 5 ​​Figure 3A a cross-sectional view along Q-Q' of the light emitting substrate in

[0042] Figure 6 is Figure 5 a partial enlarged view at N2 in

[0043] Figure 7 is Figure 5 a partial enlarged view at M2 in

[0044] Figure 8 is a partial enlarged view of the light emitting substrate at N1 in Figure 4

[0045] Figure 9 is Figure 8 a top view of

[0046] Figure 10 is a partial enlarged view of the light emitting substrate at N1 in Figure 4

[0047] Figure 11 is Figure 10 a structural view of the support column in

[0048] Figure 12 is a partial enlarged view of the light emitting substrate at N1 in Figure 4

[0049] Figure 13 is a structural view of the support column in Figure 12

[0050] Figure 14 is a partial enlarged view of the light emitting substrate at M1 in Figure 4

[0051] Figure 15 is Figure 14 a top view of

[0052] Figure 16 is a schematic view of the positions of various test points;

[0053] Figure 17 is a test result view of the height uniformity of various support columns. DETAILED DESCRIPTION

[0054] The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present disclosure. ​​​​​

[0055] Unless otherwise required by context, as used herein and throughout this specification, the term "comprise" and variations of the term, such as "comprises" and "comprising," will be understood to imply the inclusion of a stated integer or step or group of integers or steps but not the exclusion of any other integer or step or group of integers or steps. In describing some embodiments, it will be understood that terms such as "first", "second", "third", etc., are used only to describe one of the respective features and do not imply an order or a sequence unless otherwise required by context. In describing some embodiments, it will be understood that terms such as "top", "bottom", "front", "back", "side", etc., are used only to describe one of the respective features and do not imply an order or a sequence unless otherwise required by context. In describing some embodiments, it will be understood that terms such as "coupled" and "connected" and variations thereof are used broadly and encompass both direct and indirect couplings or connections, as appropriate, unless otherwise required by context. In describing some embodiments, it will be understood that terms such as "coupled" and "connected", and variations thereof, are used broadly and encompass both direct and indirect couplings or connections, as appropriate, unless otherwise required by context. In describing some embodiments, it will be understood that terms such as "on", "under", and "on top of", and variations thereof, are used broadly and encompass both direct and indirect spatial relationships, as appropriate, unless otherwise required by context. In describing some embodiments, it will be understood that terms such as "first", "second", "third", etc., are used only to describe one of the respective features and do not imply an order or a sequence unless otherwise required by context. In describing some embodiments, it will be understood that terms such as "top", "bottom", "front", "back", "side", etc., are used only to describe one of the respective features and do not imply an order or a sequence unless otherwise required by context. In describing some embodiments, it will be understood that terms such as "coupled" and "connected" and variations thereof are used broadly and encompass both direct and indirect couplings or connections, as appropriate, unless otherwise required by context. In describing some embodiments, it will be understood that terms such as "on", "under", and "on top of", and variations thereof, are used broadly and encompass both direct and indirect spatial relationships, as appropriate, unless otherwise required by context. In describing some embodiments, it will be understood that the specific features, structures, materials or characteristics described are intended to be illustrative only and are not necessarily meant to be limiting. In describing some embodiments, it will be understood that the specific features, structures, materials or characteristics described can be combined, sub-combined, subdivided, or otherwise separated into any appropriate manner in any one or more embodiments.

[0056] Hereinafter, the terms "first", "second", etc., are used only for the purpose of description and should not be understood as indicating or implying relative importance or implying an indication of the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0057] In describing some embodiments, "coupled" and "connected", and variations thereof, can be used. For example, the term "connected" can be used in describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other. As another example, the term "coupled" can be used in describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other. However, the terms "coupled" or "communicatively coupled" can also mean that two or more components are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited by the content herein.

[0058] "A, B, and C at least one of" has the same meaning as "at least one of A, B, or C", both of which include the following combinations of A, B, and C: only A, only B, only C, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.

[0059] "A and / or B" includes the following three combinations: only A, only B, and a combination of A and B.

[0060] As used herein, the term "if' is, optionally, interpreted as meaning "when" or "while" or "in response to determining" or "in response to detecting." Similarly, the phrase "if it is determined" or "if [stated condition or event] is detected" is, optionally, interpreted as meaning "upon determining" or "in response to determining" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]."

[0061] The use of "adapted to" or "configured to" herein means open and inclusive language that does not exclude devices that are adapted to or configured to perform additional tasks or steps.

[0062] Additionally, the use of "based on" means open and inclusive, as a process, step, calculation, or other action "based on" one or more stated conditions or values can in practice be based on additional conditions or values beyond those stated.

[0063] As used herein, "parallel," "perpendicular," and "equal" include the recited condition and conditions that are approximately the recited condition, the approximation being within an acceptable range of deviation, as determined by one of ordinary skill in the art considering the measurements at issue and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and near parallel, where near parallel can be within an acceptable range of deviation of, for example, 5°; "perpendicular" includes absolute perpendicular and near perpendicular, where near perpendicular can also be within an acceptable range of deviation of, for example, 5°. "Equal" includes absolute equality and near equality, where near equality can be within an acceptable range of deviation of, for example, less than or equal to 5% of either of the two quantities being compared.

[0064] It will be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers can also be present.

[0065] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched regions shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0066] See Figure 1 Some embodiments of this disclosure provide a display device 1000, which can be any device that displays images, whether moving (e.g., video) or fixed (e.g., still images), and whether text or images. Exemplarily, the display device 1000 can be any product or component with display functionality, such as a television, laptop computer, tablet computer, mobile phone, personal digital assistant (PDA), navigator, wearable device, augmented reality (AR) device, virtual reality (VR) device, etc.

[0067] In some embodiments, the display device 1000 described above may be a liquid crystal display (LCD).

[0068] See Figure 2 The display device 1000 may include a backlight module 100, a display panel 200, and a glass cover 300. The display panel 200 includes a light-emitting side and a non-light-emitting side disposed opposite to each other. The light-emitting side refers to the side of the display panel 200 used for displaying the image. Figure 2 The non-light-emitting side (the upper side of the display panel 200) refers to the side opposite to the light-emitting side. The backlight module 100 is located on the non-light-emitting side of the display panel 200. Figure 2 (Lower side of the display panel 200), the backlight module 100 is used to provide a light source for the display panel 200.

[0069] like Figure 2As shown, the backlight module 100 can include a light-emitting substrate 110 and a plurality of optical films 120. The light-emitting substrate 110 has opposite light-emitting and non-light-emitting sides, and the plurality of optical films 120 are arranged on the light-emitting side of the light-emitting substrate 110. At this time, the light-emitting substrate 110 can directly emit white light, and the white light is emitted to the display panel 200 after uniform light processing. Alternatively, the light-emitting substrate 110 can emit light of other colors, and then emit to the display panel 200 after color conversion and uniform light processing.

[0070] For example, as shown in Figure 2 , the plurality of optical films 120 include a diffusion plate 121, a quantum dot film 122, a diffusion sheet 123, and a composite film 124 arranged in sequence in a direction away from the light-emitting substrate 110. Among them, the diffusion plate 121 and the diffusion sheet 123 can mix the white light to improve the light shadow generated by the light-emitting substrate 110 and improve the display quality of the display device 1000. The composite film 124 can improve the light-emitting efficiency of the backlight module 100 and improve the display brightness of the display device 1000. The quantum dot film 122 can convert the light emitted by the light-emitting substrate 110 into white light under the excitation of light of a certain color emitted by the light-emitting substrate 110, so as to improve the utilization rate of light energy of the light-emitting substrate 110.

[0071] For example, the light-emitting substrate 110 emits blue light, and the quantum dot film 122 can include red quantum dot material, green quantum dot material and transparent material. The blue light emitted by the light-emitting substrate 110 is converted into red light when passing through the red quantum dot material; the blue light is converted into green light when passing through the green quantum dot material; the blue light can directly pass through the transparent material; then, the blue light, the red light and the green light are mixed and superimposed in a certain proportion to present white light.

[0072] In some embodiments, as shown in Figure 2 , Figure 3B and Figure 4 , the light-emitting substrate 110 includes a substrate 10, a reflective layer 20, a support column 30 and a light-emitting device 40.

[0073] As shown in Figure 2 and Figure 3B , the substrate 10 can include a substrate 11.

[0074] The substrate 11 includes any one of a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, and the like; or a semiconductor substrate such as a single-crystal semiconductor substrate or a polycrystal semiconductor substrate of silicon or silicon carbide and the like, a compound semiconductor substrate of silicon germanium and the like, a silicon on insulator (SOI) substrate, and the like; the substrate 11 can also include an organic resin material such as an epoxy resin, a triazine, a silicone resin, or a polyimide. In the above cases, at least one conductive layer is further provided on the substrate 11.

[0075] Exemplarily, referring to Figure 4 On one side of the substrate 11, in a direction perpendicular to the substrate 11 and away from the substrate 11, the substrate 10 further includes, in sequence, a buffer layer 12, a second conductive layer 13, an insulating layer 14, a first conductive layer 15, a passivation layer 16, and a planarization layer 17. The first conductive layer 15 can include pads to be connected to the light emitting devices and / or leads to connect different pads, and the second conductive layer 13 can include traces for transmitting signals. The material of the first conductive layer 15 includes at least one of copper, molybdenum-niobium alloy (MoNb), nickel, and indium tin oxide. The material of the second conductive layer 13 includes at least one of copper, molybdenum-niobium alloy (MoNb), nickel, and indium tin oxide.

[0076] In other examples, the substrate 11 can be a FR4 type printed circuit board (PCB), or can be a flexible PCB that is easy to deform. In some example embodiments, the substrate can include a ceramic material such as silicon nitride, AIN, or AI2O3, or a metal or a metal compound, or any one of a metal core printed circuit board (Metal Core PCB) or a metal copper clade laminination (MCCL).

[0077] As shown in Figure 3B and Figure 4 At least part of the boundary of the reflective layer 20 coincides with at least part of the boundary of the substrate 10.

[0078] Exemplarily, as shown in Figure 3B and Figure 4 The substrate 10 includes a light emitting area 10A and a functional area 10B, the light emitting area 10A is configured to dispose the light emitting devices 40 and a microchip (not shown in the figure), and the functional area 10B is configured to bind a circuit board. The microchip includes a sensing chip and a driving chip, the sensing chip can be a photosensitive sensor chip, a thermosensitive sensor chip, and the like, and the driving chip is used to provide a driving signal to the light emitting devices.

[0079] The boundary of the reflective layer 20 coincides with the boundary of the light-emitting region 10A of the substrate 10, that is, the functional region 10B of the substrate 10 is not provided with the reflective layer 20. Figure 2 and Figure 3B The partial boundary of the reflective layer 20 coincides with the partial boundary of the substrate 10.

[0080] As shown in Figure 4 and Figure 5 , the reflective layer 20 is provided with a plurality of first openings 210 and a plurality of second openings 220. The support column 30 is fixed to the substrate 10 through the first opening 210, and the light-emitting device 40 is fixed to the substrate 10 through the second opening 220.

[0081] It should be noted that the shape of the contour of the orthographic projection of the first opening 210 on the substrate 10 can be circular, triangular, rectangular, etc., and the present embodiment does not make specific limitations here. The shape of the contour of the orthographic projection of the second opening 220 on the substrate 10 can be circular, triangular, rectangular, etc., and the present embodiment does not make specific limitations here.

[0082] Here, the reflectivity of the reflective layer 20 is greater than or equal to 90%. Exemplarily, the material of the reflective layer 20 can include white ink and / or silicon-based white glue. For example, the material of the reflective layer 20 can include resin (e.g., epoxy resin, polytetrafluoroethylene resin), titanium dioxide (chemical formula TiO2), and organic solvent (e.g., dipropylene glycol methyl ether), etc.

[0083] Referring to Figure 2 and Figure 4 , the support column 30 is used to support the optical film 120 on the light-emitting side of the light-emitting substrate 110, so that there is a light mixing distance between the reflective layer 20 in the light-emitting substrate 110 and the optical film 120, thereby improving the lamp shadow generated by the light-emitting substrate 110 and improving the display quality of the display device 1000.

[0084] It should be noted that the reflectivity of the above-mentioned support column 30 can be approximately equal to the reflectivity of the reflective layer 20, that is, the reflectivity of the support column 30 is greater than or equal to 90%, so that the display brightness of the whole picture is approximately the same, and the uniformity of the picture brightness is improved. Exemplarily, the material of the support column 30 can include white high molecular polymer. For example, the material of the support column 30 can include white polycarbonate.

[0085] In some embodiments, as shown in Figure 5 and Figure 6 , the above-mentioned first opening 210 exists in at least two cross sections parallel to the plane in which the substrate 10 is located, wherein the area of the cross section relatively close to the substrate 10 is smaller than the area of the cross section relatively far from the substrate 10.

[0086] It should be noted that the "plane where the substrate 10 is located" refers to the surface of the substrate 10 having the largest planar area.

[0087] In addition, the smallest cross section of the first opening 210 in the plurality of cross sections parallel to the plane where the substrate 10 is located is the cross section closest to the substrate 10.

[0088] Exemplarily, as shown in Figure 5 and Figure 6 , the first opening 210 includes one sub-hole, and the cross section of the sub-hole perpendicular to the plane where the substrate 10 is located is substantially inverted trapezoidal.

[0089] Exemplarily, as shown in Figure 5 and Figure 6 , the first opening 210 includes a plurality of sub-holes connected in communication, and the side walls of at least two sub-holes of the plurality of sub-holes are not flush, and the area of the cross section relatively close to the substrate 10 is smaller than the area of the cross section relatively far from the substrate 10.

[0090] For example, as shown in Figure 6 and Figure 8 , the above-mentioned reflective layer 20 includes a first sub-reflection layer 21 and a second sub-reflection layer 22 arranged on the substrate 10, the second sub-reflection layer 22 is in direct contact with the substrate 10, and the first sub-reflection layer 21 is located on the side of the second sub-reflection layer 22 away from the substrate 10. The first opening 210 includes a first sub-hole 211 and a second sub-hole 212 connected in communication, the first sub-hole 211 is farther away from the substrate 10 than the second sub-hole 212, the first sub-hole 211 penetrates the first sub-reflection layer 21, and the second sub-hole 212 penetrates the second sub-reflection layer 22. Among them, the aperture of the end of the first sub-hole 211 close to the second sub-hole 212 is larger than the aperture of the end of the second sub-hole 212 close to the first sub-hole 211, so that the side wall of the first opening 210 forms a stepped structure 230.

[0091] In this case, in the process of forming the first sub-hole 211 and the second sub-hole 212, the second sub-hole 212 can be directly formed after the second sub-reflection layer 22 is prepared, and the first sub-hole 211 can be directly formed after the first sub-reflection layer 21 is prepared. That is, the depth of the first sub-hole 211 is determined by the thickness of the first sub-reflection layer 21, and the depth of the second sub-hole 212 is determined by the thickness of the second sub-reflection layer 22, so as to facilitate the control of the depth of the first sub-hole 211 and the second sub-hole 212, and the process difficulty is low.

[0092] It should be noted that the shape of the contour of the orthographic projection of the first sub-hole 211 on the substrate 10 can be circular, triangular, or rectangular, and the like, which is not specifically limited in the embodiments of the present disclosure. The shape of the contour of the orthographic projection of the second sub-hole 212 on the substrate 10 can be circular, triangular, or rectangular, and the like, which is not specifically limited in the embodiments of the present disclosure.

[0093] In addition, the first sub-hole 211 has a depth of 25-35 μm; for example, the first sub-hole 211 has a depth of any one of 25 μm, 28 μm, 30 μm, 32 μm and 35 μm. The second sub-hole 212 has a depth of 25-35 μm; for example, the second sub-hole 212 has a depth of any one of 25 μm, 28 μm, 30 μm, 32 μm and 35 μm.

[0094] On this basis, referring to Figure 9 , Figure 6 and Figure 8 , the orthographic projection of the support column 30 on the substrate 10 is a first projection, the orthographic projection of the smallest cross section of the first opening 210 in multiple cross sections parallel to the plane on which the substrate 10 is located on the substrate 10 is a second projection, and the second projection is within the range of the first projection, so that the support column 30 can block the smallest cross section, avoiding the problem that the area between the boundary of the first opening 210 of the reflective layer 20 and the support column 30 cannot reflect, thereby reducing the reflection area, thereby improving the overall light extraction efficiency of the light-emitting substrate 110 and improving the display effect of the display device 1000.

[0095] It should be noted that the second projection is within the range of the first projection, including that the boundary of the second projection substantially coincides with the boundary of the first projection.

[0096] For example, as shown in Figure 9 , Figure 9 and Figure 8 , in the case where the first opening 210 includes the first sub-hole 211 and the second sub-hole 212 that are connected, the orthographic projection (second projection) of the second sub-hole 212 on the substrate 10 is within the range of the orthographic projection (first projection) of the support column 30 on the substrate 10.

[0097] For example, the area of the first projection is at least 1.16 times the area of the second projection, so as to avoid the problem that the support column 30 cannot block the smallest cross section due to the installation tolerance of the support column 30 and the dimensional tolerance of the smallest cross section, thereby causing part of the first opening 210 to be exposed, and the area exposed by the first opening 210 does not have a reflective layer, which results in light loss at this position. Wherein, the area of the first projection is at least 1.16 times the area of the second projection, which can avoid the problem that part of the first opening 210 is exposed, thereby avoiding light loss, improving the overall light extraction efficiency of the light-emitting substrate 110 and improving the display effect.

[0098] For example, as shown in Figure 5 , the maximum dimension of the support column 30 towards the surface of the substrate 10 is D1, and the installation tolerance of the support column 30 is T1; the maximum dimension of the smallest cross section is D2, and the dimensional tolerance of the smallest cross section is T2.

[0099]

[0100] In some embodiments, referring to Figure 8 , the edge of the support column 30 towards the surface of the substrate 10 is arc-shaped, and the maximum dimension of the minimum cross section D2 should satisfy the following formula:

[0101]

[0102] wherein the tolerance of the arc-shaped is R, and the tolerance R includes the variation between the actual dimension and the design dimension due to manufacturing and / or surface roughness of the material.

[0103] Hereinafter, the support column 30 is taken as a substantially circular cone, and the first opening 210 includes the first sub-hole 211 and the second sub-hole 212 which are connected to each other as an example.

[0104] As shown in Figure 9 , Figure 6 and Figure 8 , the edge of the support column 30 towards the surface of the substrate 10 is circular, and the maximum dimension D1 of the support column 30 is the maximum radial dimension of the support column 30; the first opening 210 is circular in multiple cross sections parallel to the plane on which the substrate 10 is located, and the maximum dimension D2 of the minimum cross section of the first opening 210 is the radial dimension of the second sub-hole 212, and the dimension tolerance T2 of the minimum cross section is the radial dimension tolerance of the second sub-hole 212.

[0105] In this case, the radial dimension D2 of the second sub-hole 212 is set according to the radial dimension D1 of the support column 30, and the installation tolerance T1 of the support column 30 and the radial dimension tolerance T2 of the second sub-hole 212, so that the support column 30 can shield the second sub-hole 212, and the reflection area of the reflective layer 20 can be prevented from being reduced due to the second sub-hole 212 provided in the reflective layer 20, thereby avoiding affecting the overall light extraction efficiency of the light-emitting substrate 110.

[0106] Exemplarily, the maximum radial dimension D1 of the support column 30 is 5 mm, the installation tolerance T1 of the support column 30 is ±0.02 mg; the radial dimension tolerance T2 of the second sub-hole 212 is ±0.3 mm; and the tolerance R of the support column 30 is ±0.04 mm.

[0107]

[0108] According to the above formula, the radial dimension D2 of the second sub-hole 212 is substantially less than or equal to 4.2 mm. For example, the radial dimension D2 of the second sub-hole 212 is substantially equal to 4.2 mm, so that the bonding area of the fixing portion 60 and the support column 30 is larger, and the bonding strength of the support column 30 and the fixing portion 60 is improved.

[0109] In addition, the maximum cross section of the first opening 210 in a plurality of cross sections parallel to the plane on which the substrate 10 is located has a normal projection on the substrate 10 as a fifth projection, and the above-mentioned first projection is within the range of the fifth projection (normal projection of the support column 30 on the substrate 10) to reduce the difference in reflected brightness caused by the difference in reflectivity of different reflective surfaces (for example) and improve the uniformity of the mixing distance of light at different positions of the reflective layer 20.

[0110] It should be noted that the above-mentioned first projection is within the range of the fifth projection, including that the boundary of the first projection substantially coincides with the boundary of the fifth projection.

[0111] Exemplarily, as shown in Figure 9 , Figure 9 and Figure 8 , in the case where the first opening 210 includes the first sub-hole 211 and the second sub-hole 212 connected to each other, the normal projection of the support column 30 on the substrate 10 (the first projection) is within the range of the normal projection of the first sub-hole 211 on the substrate 10 (the fifth projection).

[0112] In addition, the area of the fifth projection is at least 1.14 times the area of the first projection to avoid the support column 30 from not being able to extend into the first opening 210 due to the mounting tolerance of the support column 30 and the dimensional tolerance of the maximum cross section.

[0113] Exemplarily, referring to Figure 5 , the maximum dimension of the support column 30 towards the surface of the substrate 10 is D1, and the mounting tolerance of the support column 30 is T1; the maximum dimension of the maximum cross section is D3, and the dimensional tolerance of the maximum cross section is T3.

[0114]

[0115] In some embodiments, referring to Figure 8 , the edge of the support column 30 towards the surface of the substrate 10 is arc-shaped, and considering the dimensional manufacturing tolerance and surface roughness of the arc-shaped, the maximum dimension D2 of the minimum cross section should satisfy the following formula:

[0116]

[0117] wherein the tolerance R of the arc-shaped includes the variation between the actual dimension and the designed dimension caused by manufacturing and / or material surface roughness.

[0118] Hereinafter, an example is taken that the support column 30 is substantially a circular cone, and the first opening 210 includes the first sub-hole 211 and the second sub-hole 212 connected to each other.

[0119] At this time, as shown in Figure 9 , Figure 5 and Figure 8 , the maximum dimension of the support column 30 towards the surface of the substrate 10 is D1, and the mounting tolerance of the support column 30 is T1; the maximum dimension of the maximum cross section is D3, and the dimensional tolerance of the maximum cross section is T3.As shown, the surface of the support column 30 facing the substrate 10 is circular, so the maximum dimension D1 of the support column 30 is the maximum radial dimension of the support column 30; the first opening 210 is circular in multiple cross sections parallel to the plane on which the substrate 10 lies, so the maximum dimension D3 of the maximum cross section of the first opening 210 is the radial dimension of the first sub-hole 211, and the dimension tolerance T3 of the maximum cross section is the radial dimension tolerance of the first sub-hole 211.

[0120] In this case, the radial dimension D3 of the first sub-hole 211 is set according to the radial dimension D1 of the support column 30, and the mounting tolerance T1 of the support column 30 and the radial dimension tolerance T3 of the first sub-hole 211, so that the support column 30 extends into the first opening 210, for example, the support column 30 extends into the first opening 210 and directly contacts the first surface of the stepped structure 230, which is the surface of the stepped structure 230 located in the first opening 210 and substantially parallel to the plane on which the substrate 10 lies, so that the end faces of all the support columns 30 close to the substrate 10 are located on the same reference surface, i.e. the first surface of the stepped structure 230. In this way, the height of the end of each support column 30 for supporting the optical film 120 is uniform, and the support height of each support column 30 for the corresponding area of the optical film 120 is substantially equal, which can improve the surface flatness of the optical film 120 and reduce the risk of poor optical uniformity.

[0121] For example, the maximum radial dimension D1 of the support column 30 is 5 mm, the mounting tolerance T1 of the support column 30 is ±0.02 mg; the radial dimension tolerance T3 of the first sub-hole 211 is ±0.3 mm; and the tolerance R of the support column 30 is ±0.04 mm.

[0122]

[0123] From the above formula, it can be seen that the radial dimension D3 of the first sub-hole 211 is greater than or equal to about 5.8 mm. For example, the radial dimension D3 of the first sub-hole 211 is equal to about 5.8 mm, which can minimize the radial dimension of the first sub-hole 211, thereby reducing the reflection area of the second sub-reflector 22, reducing the difference in reflected brightness caused by the difference in reflectivity between the first sub-reflector 21 and the second sub-reflector 22, and improving the uniformity of the mixing distance of the reflector 20 at different positions.

[0124] In some embodiments, as shown in Figure 5 and Figure 8 The support column 30 and the substrate 10 can be connected by a fixing portion 60. For example, the light-emitting substrate 110 further comprises a fixing portion 60, and the support column 30 is fixed to the substrate 10 by the fixing portion 60.

[0125] It should be noted that the material of the fixing portion 60 can include glue, which forms the fixing portion 60 after curing. Exemplarily, the material of the fixing portion 60 can include hot melt glue, for example, the material of the fixing portion 60 includes polyurethane resin (PUR) which has the characteristics of high temperature resistance, and can ensure the stability of the fixing portion 60 under high temperature.

[0126] In some embodiments, referring to Figure 5 and Figure 10 , the maximum dimension of the support column 30 towards the surface of the substrate 10 is greater than the maximum dimension of the second sub-hole 212, and is less than the maximum dimension of the first sub-hole 211.

[0127] On this basis, the second sub-hole 212 is a congruent figure in multiple cross sections parallel to the plane on which the substrate 10 is located, the depth of the second sub-hole 212 is H, the bottom area of the second sub-hole 212 is S, and the tolerance of the depth of the second sub-hole 212 is T4; the mass of the hot melt glue is M, the density of the hot melt glue is p, and the tolerance of the amount of the hot melt glue is T5.

[0128]

[0129] It should be noted that, in the case where the reflective layer 20 includes the first sub-reflection layer 21 and the second sub-reflection layer 22, and the second sub-hole 212 corresponds to penetrating through the second sub-reflection layer 22, the depth of the second sub-hole 212 is the thickness of the second sub-reflection layer 22, and the tolerance of the depth of the second sub-hole 212 is the thickness tolerance of the second sub-reflection layer 22.

[0130] In this case, the amount of the hot melt glue is set according to the volume of the second sub-hole 212 and the tolerance of the amount of the hot melt glue, so that the amount of the hot melt glue used to form the fixing portion 60 can substantially fill the second sub-hole 212, and under the condition that the connection between the hot melt glue and the substrate 10 and the support column 30 is reliable, the hot melt glue is prevented from overflowing from the second sub-hole 212, thereby avoiding the problem that the hot melt glue overflowing from the second sub-hole 212 causes the support column 30 to tilt and affects the surface flatness of the optical film 120, reduces the risk of poor optical uniformity, and avoids the color deviation problem caused by the hot melt glue overflowing from the edge of the support column 30.

[0131] Exemplarily, the above-mentioned second sub-hole 212 has a circular orthographic projection on the substrate 10, the second sub-hole 212 is a congruent circle in multiple cross sections parallel to the plane on which the substrate 10 is located, the diameter of the second sub-hole 212 is 4.2 mm, the thickness of the second sub-reflection layer 22 is 0.03 mm, the thickness tolerance of the second sub-reflection layer 22 is ±0.005 mm, the density of the hot melt glue p is 1.1 g / cm 3 , and the tolerance T5 of the amount of the hot melt glue is ±0.02 mg.

[0132]

[0133] From the above formula, the mass M of the hot melt adhesive is approximately 0.36 mg.

[0134] It should be noted that, according to the shape of the second sub-hole 212, the corresponding calculation formula is not the same. Here, regardless of whether the overall shape of the second sub-hole 212 is cylindrical or prismatic, etc., the depth tolerance of the second sub-hole 212 is considered in the corresponding volume formula.

[0135] In other embodiments, referring to Figure 11 , Figure 5 and Figure 10 , the support column 30 includes a support body 31 and a support frame 32, and the support frame 32 is located on the side of the support body 31 close to the substrate 10. The support frame 32 is located in the second sub-hole 212, which can increase the bonding area of the support column 30 and the fixing portion 60, improve the bonding strength, and can limit the displacement of the support column 30 in the direction S parallel to the plane where the substrate 10 is located, facilitating the installation of the support column 30.

[0136] It should be noted that the shape of the support frame 32 in the orthographic projection on the substrate 10 is circular, annular, or a plurality of fan rings arranged at intervals, which is not specifically limited in the embodiments of the present disclosure.

[0137] In addition, referring to Figure 11 , Figure 6 and Figure 5 , in the direction perpendicular to the substrate 10, the thickness of the support frame 32 is approximately equal to the thickness of the second sub-reflection layer 22, so that the support frame 32 is in direct contact with the substrate 10, and at the same time, the support column 30 can be in direct contact with the step structure 230 (see Figure 12 ), ensuring the uniformity of the installation height of the plurality of support columns 30.

[0138] On this basis, the orthographic projections of the plurality of cross sections of the second sub-hole 212 parallel to the plane where the substrate 10 is located on the substrate 10 are completely or approximately coincident, the depth of the second sub-hole 212 is H, the bottom area of the second sub-hole 212 is S, the depth tolerance of the second sub-hole 212 is T4; the mass of the hot melt adhesive is M, the density of the hot melt adhesive is p, the adhesive amount tolerance of the hot melt adhesive is T5, and the volume of the support frame 32 is V.

[0139]

[0140] It should be noted that, in the case where the reflection layer 20 includes the first sub-reflection layer 21 and the second sub-reflection layer 22, and the second sub-hole 212 corresponds to penetrating through the second sub-reflection layer 22, the depth of the second sub-hole 212 is the thickness of the second sub-reflection layer 22, and the depth tolerance of the second sub-hole 212 is the thickness tolerance of the second sub-reflection layer 22.

[0141] In some embodiments, referring to Figure 13 , Figure 2 and Figure 3B , the support column 30 is provided with at least one groove 310 on the side close to the substrate 10, and the fixing portion 60 is located in the groove 310 of the support column 30, so as to increase the bonding area of the support column 30 and the fixing portion 60, improve the bonding strength of the support column 30 and the fixing portion 60, and further reduce the risk of hot melt adhesive overflowing the edge of the support column 30.

[0142] It should be noted that the shape of the projection of the groove 310 on the substrate 10 is circular, annular, or a plurality of fan rings arranged at intervals, which is not specifically limited in the embodiments of the present disclosure.

[0143] In some embodiments, referring to Figure 3B and Figure 3B , the plurality of support columns 30 can be arranged in multiple rows and multiple columns, each row including a plurality of support columns 30 arranged along the first direction X, and each column including a plurality of support columns 30 arranged along the second direction Y, so as to provide a more uniform support force to the optical film 120, reduce the deformation difference of different areas of the optical film 120 supported by the support column 30, further improve the surface flatness of the optical film 120, and improve the uniformity of the display picture. That is, the plurality of first openings 210 can be arranged in multiple rows and multiple columns, each row including a plurality of first openings 210 arranged along the first direction X, and each column including a plurality of first openings 210 arranged along the second direction Y.

[0144] In addition, the support column 30 includes a plurality of cross sections along the direction S parallel to the plane on which the substrate 10 is located; along the thickness direction of the substrate 10 and directed from the substrate 10 to the reflective layer 20, the area of the plurality of cross sections gradually decreases; for example, the shape of the support column 30 is a cone. In this way, the volume of the support column 30 can be reduced, thereby reducing the blocking effect of the support column 30 on light, and improving the light extraction efficiency of the light-emitting substrate 110.

[0145] It should be noted that the shape of the support column 30 can also be other shapes, such as a circular truncated cone or a circular column, which is not specifically limited in the embodiments of the present disclosure.

[0146] In some embodiments, referring to Figure 3B , the plurality of light-emitting devices 40 can be arranged in multiple rows and multiple columns, each row including a plurality of light-emitting devices 40 arranged along the first direction X, and each column including a plurality of light-emitting devices 40 arranged along the second direction Y.

[0147] In some embodiments, referring to Figure 5 , the plurality of light-emitting devices 40 can be arranged in multiple rows and multiple columns, each row including a plurality of light-emitting devices 40 arranged along the first direction X, and each column including a plurality of light-emitting devices 40 arranged along the second direction Y.As shown, the support column 30 can be located at the center C of the area surrounded by the midline connecting lines of the four light emitting devices 40 adjacent to each other, so that the distance between the support column 30 and each light emitting device 40 is substantially equal, avoiding the distance between the support column 30 and any light emitting device 40 being too close to block the light emission of the light emitting device 40, thereby avoiding causing the light emission of the light emitting substrate 110 to be non-uniform.

[0148] In addition, the light emitting substrate 110 can include a plurality of light emitting units 50, and each light emitting unit 50 includes a plurality of light emitting devices 40 connected in series and / or in parallel.

[0149] Exemplarily, as shown in Figure 7 , each light emitting unit 50 includes 4 light emitting devices 40 connected in series. Of course, each light emitting unit 50 can also include 2, 3, 5 or 6 light emitting devices 40, and the connection mode of the plurality of light emitting devices 40 in the light emitting unit 50 is not limited to series connection, but can also be parallel connection or a combination of series and parallel connection, and the embodiments of the present disclosure are not limited thereto.

[0150] It should be noted that the above-mentioned light emitting device 40 can include a micro light emitting diode (Micro Light Emitting Diode, Micro LED for short) and a sub-millimeter light emitting diode (Mini Light Emitting Diode, Mini LED for short). Here, the size (e.g. length) of the Micro LED is less than 50 microns, for example, 10 microns to 50 microns; the size (e.g. length) of the Mini LED is 50 microns to 150 microns, for example, 80 microns to 120 microns.

[0151] In some embodiments, referring to Figure 15 , Figure 5 and Figure 7 , the second opening 220 exists in at least two cross sections parallel to the plane on which the substrate 10 is located, wherein the area of the cross section closer to the substrate 10 is smaller than the area of the cross section farther from the substrate 10.

[0152] Exemplarily, as shown in Figure 15 , Figure 4 and Figure 14As shown, the reflective layer 20 includes a first sub-reflection layer 21 and a second sub-reflection layer 22 disposed on the substrate 10, the second sub-reflection layer 22 is in direct contact with the substrate 10, and the first sub-reflection layer 21 is located on the side of the second sub-reflection layer 22 away from the substrate 10. The second opening 220 includes a third sub-hole 221 and a fourth sub-hole 222 in communication, the third sub-hole 221 is farther away from the substrate 10 than the fourth sub-hole 222, the third sub-hole 221 penetrates the first sub-reflection layer 21, and the fourth sub-hole 222 penetrates the second sub-reflection layer 22. Among them, the aperture of the third sub-hole 221 close to the end of the fourth sub-hole 222 is larger than the aperture of the fourth sub-hole 222 close to the end of the third sub-hole 221.

[0153] It should be noted that the shape of the profile of the orthographic projection of the third sub-hole 221 on the substrate 10 can be circular, triangular or rectangular, etc., which is not specifically limited in the embodiments of the present disclosure. The shape of the profile of the orthographic projection of the fourth sub-hole 222 on the substrate 10 can be circular, triangular or rectangular, etc., which is not specifically limited in the embodiments of the present disclosure.

[0154] In addition, the depth of the third sub-hole 221 is 25μm~35μm; for example, the depth of the third sub-hole 221 is any one of 25μm, 28μm, 30μm, 32μm and 35μm. The depth of the fourth sub-hole 222 is 25μm~35μm; for example, the depth of the fourth sub-hole 222 is any one of 25μm, 28μm, 30μm, 32μm and 35μm.

[0155] On this basis, referring to Figure 15 , Figure 4 and Figure 5 , the orthographic projection of the light emitting device 40 on the substrate 10 is a third projection, the smallest cross section of the second opening 220 in a plurality of cross sections parallel to the plane on which the substrate 10 is located is a fourth projection, and the third projection falls within the fourth projection, that is, the boundary of the third projection is located within the boundary of the fourth projection.

[0156] Among them, in the case where the second opening 220 includes the third sub-hole 221 and the fourth sub-hole 222 in communication, the boundary of the orthographic projection of the light emitting device 40 on the substrate 10 is located within the boundary of the orthographic projection of the fourth sub-hole 222 on the substrate 10.

[0157] In this case, the distance between the light emitting device 40 and the part of the reflective layer 20 away from the substrate 10 is far, that is, the spacing between the light emitting device 40 and the first sub-reflection layer 21 is large, so that in the process of fixing the light emitting device 40 on the substrate 10, the risk of mutual interference between the light emitting device 40 and the reflective layer 20 can be reduced, and the difficulty of installing the light emitting device 40 is reduced.

[0158] On this basis, as Figure 14、 Figure 4 and Figure 14 As shown in

[0159] Exemplarily, as shown in Figure 15 、 Figure 4 and Figure 14 The reflection part 70 is projected on the substrate 10 in a substantially annular shape, the inner boundary of the annular shape is located between the boundary of the fourth sub-hole 222 projected on the substrate 10 and the boundary of the light emitting device 40 projected on the substrate 10; the outer boundary of the annular shape is located between the boundary of the third sub-hole 221 projected on the substrate 10 and the boundary of the fourth sub-hole 222 projected on the substrate 10.

[0160] It should be noted that the reflectivity of the reflection part 70 is substantially the same as that of the reflection layer 20. Exemplarily, the reflectivity of the reflection part 70 is greater than or equal to 90%. For example, the material of the reflection part 70 includes silicon-based white glue.

[0161] In some embodiments, as shown in Figure 4 and Figure 5 The light emitting substrate 110 further comprises a packaging part 18 arranged on the side of the light emitting device 40 and the micro chip away from the substrate 10, and each packaging part 18 at least wraps one light emitting device 40 and / or micro chip. The packaging part 18 wrapping the light emitting device 40 is made of transparent material, which can be transparent silicone; and the packaging part wrapping the micro chip can be made of transparent material or reflective material, the transparent material can be transparent silicone, and the reflective material can be the same as or similar to the material of the reflection layer 20.

[0162] As shown in Figure 8 、 Figure 3A and Figure 5 The light emitting substrate 110 further comprises at least one alignment mark 80, and the at least one first opening 210 is provided with the alignment mark 80.

[0163] Exemplarily, referring to Figure 6 、 Figure 3A and Figure 5 The reflection layer 20 is provided with a plurality of first openings 210, and the plurality of first openings 210 includes an edge opening 213 and a center opening 214, and the edge opening 213 surrounds the center opening 214. Among them, at least one edge opening 213 is provided with an alignment mark 80.

[0164] For example, as shown in Figure 4 and Figure 16As shown, the shape of the contour of the orthographic projection of the reflective layer 20 on the substrate 10 is approximately quadrangular, with four corners. Among them, the plurality of first openings 210 are arranged in multiple rows and columns, and each corner of the above-mentioned quadrangle corresponds to an edge opening 213, and four edge openings 213 corresponding to the four corners are each provided with an alignment mark 80. In this way, the alignment mark 80 is arranged at the edge of the substrate 10 to facilitate the acquisition of the image of the alignment mark 80 for alignment.

[0165] It can be understood that the above-mentioned alignment mark 80 can be arranged at any position in the first opening 210, for example, the alignment mark 80 can be arranged at the center of the first opening 210, or can be arranged at other positions in the first opening 210 except the center, as long as the first opening 210 exposes the alignment mark 80 to facilitate the acquisition of the image of the alignment mark 80 for alignment.

[0166] From the above, it can be understood that the substrate 10 can include a substrate 11 and a plurality of conductive layers arranged on the substrate 11. In this case, the alignment mark 80 is the same material as at least one of the plurality of conductive layers and is arranged in the same layer.

[0167] "Same layer" refers to a layer structure formed by using the same film forming process to form a film layer for forming a specific pattern, and then using the same mask plate to form by a one-time patterning process. According to different specific patterns, the one-time patterning process can include multiple exposure, development or etching processes, and the specific patterns in the formed layer structure can be continuous or discontinuous, and these specific patterns can also be at different heights or have different thicknesses.

[0168] For example, referring to Figure 17 On one side of the substrate 11, in a direction perpendicular to the substrate 11 and away from the substrate 11, the substrate 10 further includes a second conductive layer 13, an insulating layer 14, a first conductive layer 15, a passivation layer 16 and a planarization layer 17 arranged in sequence. The alignment mark 80 can be formed by one of the first conductive layer 15 or the second conductive layer 13, or can be formed by the first conductive layer 15 and the second conductive layer 13 together. For example, the alignment mark 80 can be formed by the first conductive layer 15 to reduce the distance between the alignment mark 80 and the surface of the reflective layer 20 away from the substrate 10, so that the image of the alignment mark 80 collected from the upper side of the substrate 10 is clearer, which is beneficial to improve the alignment accuracy.

[0169] In order to objectively evaluate the technical effects of the embodiments of the present disclosure, below, the light-emitting substrate provided by the above-mentioned embodiments is subjected to thrust test, and the test results are shown in Table 1.

[0170] Table 1 Thrust test table of support column

[0171]

[0172] In the formula, related technology 1 represents the support column fixedly bonded with the reflective layer in the related technology, related technology 2 represents the support column fixedly bonded with the substrate in the related technology, MAX represents the maximum value of the nine test points, MIN represents the minimum value of the nine test points, AVE represents the average value of the nine test points, and Spec represents the maximum thrust that a single support column needs to withstand.

[0173] As shown in Table 1, the thrust test results of the embodiments of the present disclosure at each point are greater than 20N, meeting the requirement of the maximum thrust that a single support column needs to withstand. At the same time, the thrust test results of the embodiments of the present disclosure at each point are roughly the same as the thrust test results of the related technology, and do not decrease.

[0174] In order to objectively evaluate the technical effects of the embodiments of the present disclosure, the light-emitting substrate provided by the above embodiments is subjected to a height uniformity test, and the test results are shown in Figure 16 and Figure 17 . In the formula, Figure 16 is a schematic diagram of the positions of the test points, Figure 17 is a test result diagram of the height uniformity of the support columns.

[0175] As shown in ​ and ​ , in the related technology, the heights of test points 1 and 7 are obviously low. In the present disclosure, there is no sudden drop in the heights of test points 1 and 7, and the fluctuations of the multiple test points are small, and the height uniformity of the support columns is good.

[0176] The above merely describes specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art can think of changes or replacements within the technical scope disclosed by the present disclosure, which should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A light-emitting substrate, characterized in that, include: substrate; A reflective layer is disposed on the substrate; the reflective layer has a plurality of first openings, and at least two of the first openings are located in a plurality of cross-sections parallel to the plane of the substrate, wherein the area of ​​the cross-section relatively closer to the substrate is smaller than the area of ​​the cross-section relatively farther away from the substrate; A support column is fixed to the substrate; the orthographic projection of the support column on the substrate is a first projection, and the orthographic projection of the smallest cross-section among multiple cross-sections parallel to the plane of the substrate of the first opening on the substrate is a second projection, and the second projection is within the range of the first projection. The reflective layer includes a first sub-reflective layer and a second sub-reflective layer disposed on the substrate. The first opening includes a first sub-hole and a second sub-hole that are connected to each other. The first sub-hole penetrates the first sub-reflective layer, and the second sub-hole penetrates the second sub-reflective layer. The first sub-hole is farther from the substrate than the second sub-hole, and the diameter of the first sub-hole at the end near the second sub-hole is larger than the diameter of the second sub-hole at the end near the first sub-hole, so that the sidewall of the first opening forms a stepped structure; the support post extends into the first opening and is in direct contact with the first surface of the stepped structure; The reflective layer is further provided with a plurality of second openings. At least two of the second openings are located in a plurality of cross sections parallel to the plane of the substrate. The area of ​​the cross section that is relatively closer to the substrate is smaller than the area of ​​the cross section that is relatively farther away from the substrate. The light-emitting substrate further includes: A light-emitting device is fixed on the substrate; the orthographic projection of the light-emitting device on the substrate is a third projection, and the orthographic projection of the smallest cross-section of the second opening among multiple cross-sections parallel to the plane of the substrate on the substrate is a fourth projection, and the third projection falls into the fourth projection.

2. The light-emitting substrate according to claim 1, characterized in that, The smallest cross-section of the first opening among multiple cross-sections parallel to the plane of the substrate is the cross-section closest to the substrate.

3. The light-emitting substrate according to claim 2, characterized in that, The maximum dimension of the support column facing the substrate is D1, and the installation tolerance of the support column is T1; the maximum dimension of the minimum cross-section of the first opening is D2, and the dimensional tolerance of the minimum cross-section of the first opening is T2.

4. The light-emitting substrate according to claim 3, characterized in that, The edge of the support column facing the surface of the substrate is arc-shaped, and the tolerance of the arc is R; 5. The light-emitting substrate according to claim 1, characterized in that, The maximum dimension of the support column facing the substrate is D1, and the installation tolerance of the support column is T1; the maximum dimension of the largest cross-section among multiple cross-sections parallel to the plane of the substrate is D3, and the dimensional tolerance of the largest cross-section is T3; 6. The light-emitting substrate according to claim 5, characterized in that, The edge of the support column facing the surface of the substrate is arc-shaped, and the tolerance of the arc is R; 7. The light-emitting substrate according to claim 1, characterized in that, Also includes: The fixing part is used to fix the support column to the base plate.

8. The light-emitting substrate according to claim 7, characterized in that, The material of the fixing part includes hot melt adhesive.

9. The light-emitting substrate according to claim 8, characterized in that, The maximum dimension of the support post facing the substrate is greater than the maximum dimension of the second sub-hole and less than the maximum dimension of the first sub-hole; The second sub-hole is cylindrical in shape, has a depth of H, a base area of ​​S, and a depth tolerance of T4; the hot melt adhesive has a mass of M, a density of ρ, and a quantity tolerance of T5.

10. The light-emitting substrate according to claim 8, characterized in that, The support column includes a support body and a support frame, with the support frame located on the side of the support body closer to the substrate; The support frame is located inside the second sub-hole and is perpendicular to the substrate. The thickness of the support frame is equal to the thickness of the second sub-reflective layer.

11. The light-emitting substrate according to claim 10, characterized in that, The second sub-hole is cylindrical in shape, has a depth of H, a base area of ​​S, and a depth tolerance of T4; the hot melt adhesive has a mass of M, a density of ρ, and a quantity tolerance of T5; the support frame has a volume of V.

12. The light-emitting substrate according to any one of claims 1 to 11, characterized in that, Also includes: At least one alignment mark, and at least one alignment mark is provided within the first opening.

13. The light-emitting substrate according to claim 12, characterized in that, The substrate includes a substrate and a plurality of conductive layers disposed on the substrate, wherein the alignment mark is made of the same material as at least one of the plurality of conductive layers and is disposed in the same layer.

14. The light-emitting substrate according to any one of claims 1 to 11, characterized in that, The reflectivity of the support column is the same as that of the reflective layer.

15. The light-emitting substrate according to claim 1, characterized in that, Also includes: The reflective portion is at least partially disposed within the second opening and at least covers the portion of the substrate exposed between the second opening and the light-emitting device.

16. The light-emitting substrate according to claim 15, characterized in that, The reflectivity of the reflective part is the same as that of the reflective layer.

17. A backlight module, characterized in that, include: The light-emitting substrate as described in any one of claims 1 to 16 has opposing light-emitting sides and non-light-emitting sides; Multiple optical films are disposed on the light-emitting side of the light-emitting substrate.

18. A display device, characterized in that, include: The backlight module as described in claim 17; The display panel is disposed on the side of the backlight module away from the light-emitting substrate, where multiple optical films are located.

Images