A production method for defect detection pre-inspection and re-inspection automation control of a semiconductor 12-inch mes system

Abstract

This invention provides a production method for automated control of defect detection pre-inspection and re-inspection in a 12-inch semiconductor MES system. The method includes an MES system, a pre-inspection machine, a re-inspection machine, and a shared storage system, Samba. After the pre-inspection machine completes its pre-inspection, it saves the pre-inspection result graphic text file (klarf) in the shared storage system, Samba. Based on the pre-inspection results, the MES system obtains batches to be re-inspected, and its control data updates the pre-inspection result filenames and their paths based on these batches. During the re-inspection of these batches, the control data is used as the selection rule to determine their validity. If valid, the re-inspection machine's feeding process is initiated, and the corresponding pre-inspection result file is loaded from the shared storage system, Samba, according to the pre-inspection result filenames and their paths in the control data. This method improves production efficiency and enables the operation of lighting during the pre-inspection and re-inspection stages.

Description

Technical Field

[0001] This invention relates to semiconductor manufacturing systems, specifically to an automated control system for pre-inspection and re-inspection of semiconductor wafers, and more specifically, to a production method for automated control of defect detection, pre-inspection, and re-inspection of a 12-inch semiconductor MES system. Background Technology

[0002] In the current 12-inch semiconductor wafer manufacturing process, defect detection involves a pre-inspection machine that performs pre-inspection on batches. If the pre-inspection passes, the machine is manually skipped; if it fails, the pre-inspection result file (Klarf) is manually moved to the re-inspection machine. The re-inspection machine is then manually configured with the pre-inspection result file (Klarf). However, the pre-inspection results and re-inspection configuration are difficult to synchronize. This often results in batches requiring re-inspection skipping the re-inspection step while batches not requiring re-inspection are fed into the re-inspection machine. Furthermore, when configuring the re-inspection machine, it is difficult to determine the appropriate wafer selection based on the pre-inspection result file (Klarf). Often, the wafer selection for re-inspection is not the same as the pre-inspection selection, leading to a mismatch between the pre-inspection result file (Klarf) and the re-inspection selection, resulting in re-inspection failure, low efficiency, and reduced product yield and production efficiency.

[0003] Specifically, in the defect detection process of 12-inch semiconductor wafer manufacturing, the inspection machine performs a pre-inspection of the incoming batch, and the pre-inspection results are saved as a graphic text file (Klarf). If the pre-inspection is successful, the re-inspection step is skipped; if the pre-inspection fails, the review machine performs a re-inspection of the batch. In this industry, on existing production lines, the inspection machine and the review machine are two independent machines that cannot communicate with each other. During the review, the pre-inspection result file (Klarf) generated by the inspection machine must be manually provided. This is determined by the working mechanism of the review machine. Therefore, in the current technology, there is a problem that the review machine's expected result file and the pre-inspection result file are difficult to synchronize, which can easily cause the review process to fail, thereby reducing review efficiency and product yield. For example, the review machine may malfunction due to the input of an invalid Klarf file, or the batch may not be allowed to enter the machine due to failure to meet process control requirements. Summary of the Invention

[0004] This invention aims to overcome the aforementioned shortcomings by providing an automated control method for pre-inspection and re-inspection based on a 12-inch Manufacturing Execution System (MES). After a batch is fed into the pre-inspection machine, control data and engineering data (EDC) are collected in real time based on the pre-inspection machine signals. The batch process flow is controlled based on whether the collected engineering data exceeds the specification (OOS). The pre-inspection result file transfer (FileMove) and re-inspection machine prediction (LotPrepare) are controlled based on the control data. This improves the accuracy of the pre-inspection and re-inspection process flow and the efficiency of the re-inspection process, thereby improving production efficiency and product yield.

[0005] This invention provides a production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system, comprising an MES system, a pre-inspection machine, and a re-inspection machine, characterized in that:

[0006] It also includes the shared storage system Samba;

[0007] Among them, after the pre-inspection machine completes the pre-inspection, the graphic text file klarf of the chip pre-inspection results is saved in the shared storage system Samba;

[0008] The MES system obtains the batches to be re-inspected based on the pre-inspection results of the pre-inspection machine, and its control data updates the file name and path of the pre-inspection results based on the batches to be re-inspected.

[0009] When re-inspecting batches that are pending re-inspection, control data is used as the selection rule for re-inspection to determine its legality;

[0010] When it is valid, the feeding process of the re-inspection machine is started, and the corresponding pre-inspection result file is loaded from the shared storage system Samba according to the file name and path of the pre-inspection result in the control data.

[0011] Furthermore, the present invention provides a production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system, characterized in that:

[0012] The aforementioned MES system includes a Work in Process (WIP) module, an Engineering Data (EDC) module, and a Defect Management (DMS) module.

[0013] Among them, the aforementioned Engineering Data Module (EDC) obtains the pre-inspection batch engineering data report from the pre-inspection machine, calculates the engineering data OOS, and returns the result to the Product Management Module (WIP).

[0014] When OOS=Y, the WIP module of the product management module sends a FileMove signal. The DMS module of the defect management module finds the corresponding graphic text file klarf of the pre-inspection result of the selected piece in the shared storage system Samba, analyzes it, and reports the analysis result to the WIP module of the product management module.

[0015] The MES system updates the filenames and paths of valid pre-inspection results in the control data based on the analysis results.

[0016] The Defect Management Module (DMS) is responsible for Klarf file management and Defect Coding. When a batch is non-conforming, the Work Injection (WIP) notifies the DMS to analyze the Klarf file of that batch on a specified pre-inspection machine at a specified step via the FileMoveStart signal. After processing and analyzing the Klarf file, the DMS notifies the WIP via the FileMoveComplete signal. The WIP then processes FileMoveComplete to obtain the wafers that can be fed into the re-inspection machine. The WIP uses this wafer information when unloading wafers into the re-inspection machine.

[0017] Furthermore, the present invention provides a production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system, characterized in that:

[0018] When OOS=N, the WIP module sets the flag for the batch at the automatic pick-up station in the re-inspection step and clears the relevant data for that batch from the control data.

[0019] Furthermore, the present invention provides a production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system, characterized in that:

[0020] The aforementioned MES system also includes a chip selection module called Sampling;

[0021] In the pre-inspection step, the Work Processing (WIP) module obtains the selection rules configured by the factory model data based on the batch process information, and the Sampler module obtains the pre-inspection selections based on these selection rules.

[0022] Generally, Sampling is responsible for implementing the batch extraction rules. WIP obtains the extraction rules configured by the factory model data based on the batch process information (process, step), and hands them over to Sampling for execution. The execution results are used by WIP in batch loading (LotInfoDownload).

[0023] Furthermore, the present invention provides a production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system, characterized in that:

[0024] In the re-inspection process, the data of temporary engineering changes in the control data (Tecn) are used as the re-inspection selection rules.

[0025] The aforementioned sample selection module, Sample, performs re-examination and sample selection based on the re-examination sample selection rules.

[0026] Furthermore, the present invention provides a production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system, characterized in that:

[0027] The above-mentioned re-examination and selection rules include the following judgments:

[0028] S1. Is the batch number for re-inspection the same as the batch number for pre-inspection in the control data?

[0029] S2. Check whether the current step number of the re-inspection batch is the same as the re-inspection step number in the control data;

[0030] S3. Does the wafer number for which the analysis report has been completed exist, along with its Klarf file name and path?

[0031] Furthermore, the present invention provides a production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system, characterized in that:

[0032] The aforementioned MES system also includes a real-time dispatch and transportation module (RTD) to enable the transfer of workpieces between various devices.

[0033] Specifically, the Real-time Dispatch and Transport Module (RTD) obtains batches that can be dispatched through Work Instruction (WIP). When dispatch is successful, the RTD creates a General Transport Manage (GTM) Job. This Job is then sent by the GTM to the Transport Physical Layer (MCS / OHTS) to complete the transport task and get the vehicle to the Load Port (LP) of the machine.

[0034] Furthermore, the present invention provides a production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system, characterized in that:

[0035] After completing the re-inspection, the aforementioned re-inspection machine stores the re-inspection results as a graphic text file on the shared storage system Samba.

[0036] Furthermore, the present invention provides a production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system, characterized in that:

[0037] After completing the re-inspection, the aforementioned re-inspection machine will send the re-inspection data report to the Defect Management Module (DMS).

[0038] The aforementioned Defect Management System (DMS) performs defect determination on the re-inspection data.

[0039] Furthermore, the present invention provides a production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system, characterized in that:

[0040] When the judgment result exceeds the control line, the re-inspection batch enters the rework or scrap process.

[0041] When the judgment result meets the control line, the re-inspection batch enters the next process.

[0042] Specifically, the Defect Management module (DMS) analyzes the Klarf file of the re-inspection machine and performs Defect Coding. Then, it notifies the Work Processing (WIP) via the Defect Coding signal to allow the batch to leave the re-inspection step and controls whether the batch enters Rework / Scrap.

[0043] The function and effects of this invention:

[0044] The MES system of this invention includes a Work-in-Process (WIP) module, an Engineering Data (EDC) module, a Sampler module, a Defect Management (DMS) module, a Real-Time Dispatch (RTD) module, and a Ground Transportation (GTM) module. The WIP module, in collaboration with the EDC module, controls the batch process flow. The DMS module, in collaboration with the Sampler and WIP modules, controls the transmission of pre-inspection result files and the timing of re-inspection. The RTD and GTM modules, in collaboration with the WIP module, can dispatch batches of materials to the equipment for pre-inspection or re-inspection in real time.

[0045] After the invention is used, the pre-inspection and re-inspection process in the cleanroom for 12-inch semiconductor manufacturing can achieve the "lights off" effect, and no operator is required in the cleanroom.

[0046] Furthermore, the solution of this invention does not involve actual file movement, thus avoiding problems caused by file movement; after the Klarf file is generated, it is managed by DMS, and when MES / WIP notifies DMS to analyze the Klarf file, DMS can accurately inform you of the analysis results of the MES / WIP Klarf file, and there is no possibility of error in this process. Attached Figure Description

[0047] Figure 1 The pre-inspection and re-inspection process flow model involved in this embodiment;

[0048] Figure 2 The timing interaction diagram of the pre-detection control involved in this embodiment;

[0049] Figure 3 The timing interaction diagram of the re-inspection control involved in this embodiment; Detailed Implementation

[0050] This invention is capable of various modifications and embodiments, and therefore specific embodiments are illustrated and described in the accompanying drawings. However, this is not intended to limit the invention to specific implementations, but should be understood to include all modifications, equivalents, and even substitutions that fall within the spirit and scope of this invention.

[0051] This embodiment provides a production method for automated control of defect detection pre-inspection and re-inspection. In the pre-inspection file transfer control method, the pre-inspection machine and the re-inspection machine use the same shared file system (Samba) or file transfer service (FTP) to make the pre-inspection result graphic text file (Klarf) visible and readable to the re-inspection machine, without actual transmission. Simultaneously, the MES system collects signals from the pre-inspection machine in real time and controls the automatic skipping of pre-inspection batches (re-inspection steps) and collaborates with the Defect Management Module (DMS) to control the pre-inspection machine's prediction and unloading. This is how the MES system achieves automated control of pre-inspection and re-inspection.

[0052] like Figure 1 As shown, the pre-inspection and re-inspection process steps of the present invention are as follows:

[0053] ① Batches arrive at the pre-inspection step after leaving the station of the previous step. MES selects batches according to the batch selection rules.

[0054] ② The batch was not selected in the pre-inspection step and proceeded to the re-inspection step (and skipped the station at the same time);

[0055] ③ If a batch is not selected in the re-inspection step, it will proceed to the next step in the re-inspection process (and skip a station).

[0056] ④ Batches selected during the pre-inspection process will enter the pre-inspection process (at the same time they enter the station);

[0057] ⑤ The batch was still selected by the batch selection rules after leaving the pre-inspection station (and entered the station at the same time);

[0058] ⑥ Whether a batch enters the re-inspection step after leaving the pre-inspection step is controlled by whether it exceeds the standard (OOS);

[0059] ⑦ Whether a batch enters the next step after leaving the re-inspection step is controlled by whether it exceeds the control line (OOC);

[0060] ⑧ If the control line is exceeded, proceed to the rework or scrap process; otherwise, proceed to the next step.

[0061] This embodiment provides a production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system, comprising an MES system, a pre-inspection machine, a re-inspection machine, and a shared storage system Samba;

[0062] The MES system includes a Work-In-Process (WIP) module, an Engineering Data (EDC) module, a Defect Management (DMS) module, a Sampler module, and a Real-Time Dispatch and Transportation (RTD) module. In this embodiment, an automated re-inspection and pre-inspection control scheme is achieved through the interaction between the above modules and the system and equipment, as detailed below:

[0063] Based on the above system and equipment, the specific interactive pre-inspection steps are as follows: Figure 2 As shown,

[0064] S1.Sampling is responsible for implementing the batch sampling rules. WIP obtains the sampling rules configured by the factory model data based on the batch process information (process, step), and hands them over to Sampling for execution. The execution results are used by WIP in batch loading (LotInfoDownload).

[0065] S2.WIP obtains engineering data collection items and specifications from EDC, that is, EDC returns engineering data to WIP in real time;

[0066] S3.WIP generates pre-inspection batch prediction information (PreparedJob) based on the batch selection results of Sampling;

[0067] S4.RTD creates a GTM (General Transport Management) Job based on the pre-inspection batch forecast information (PreparedJob). This Job is then sent by GTM to the transport physical layer (MCS / OHTS) to complete the transport task of the vehicle arriving at the pre-inspection machine LP (Load Port).

[0068] S5. The pre-inspection machine requests material feeding information from WIP and receives the return information from WIP;

[0069] S6-7. The pre-inspection batch enters the station and pre-inspection begins;

[0070] S8-10.MES / WIP creates control data, including: pre-inspection machine number, pre-inspection batch number, pre-inspection selected piece number, pre-inspection step number, pre-inspection start time, and re-inspection step number;

[0071] S11. Pre-inspection machine: After completing the pre-inspection, save the graphic text file Klarf of the chip pre-inspection results on the shared storage system Samba;

[0072] S12. The pre-inspection machine sends a signal to WIP indicating that the pre-inspection selection has ended;

[0073] S13. After all the pre-inspection chips in the current batch have finished pre-inspection, the pre-inspection machine returns a signal to WIP indicating that the pre-inspection batch has ended;

[0074] S14. The pre-inspection machine transmits the pre-inspection batch engineering data report to the EDC;

[0075] S15.EDC calculates engineering data OOS;

[0076] S16.WIP processes the engineering data based on the engineering data OOS;

[0077] S17-18. When OOS=N, set the automatic skip flag (AutoSkip=Y) for the pre-inspection batch in the re-inspection step, and clear the relevant data in the control data for that batch;

[0078] S19. When OOS = Y, send a Filemove signal to DMS;

[0079] S20.DMS locates and analyzes the corresponding chip pre-screening result graphic text file klarf in the shared storage system Samba.

[0080] S21.DMS reports the analysis results to WIP;

[0081] S22. Update the control data related to this batch in the MES / WIP control data, and save the pre-inspection result file and path;

[0082] S23. Pre-inspected batches leave the station;

[0083] S24. Move batches to different destinations according to the labels corresponding to different batches;

[0084] The MES will determine whether a batch enters the station (AutoSkip=N) or skips a station (AutoSkip=Y) based on the AutoSkip flag. Specifically, after a batch leaves the station (TrackOut) in the pre-inspection step, the MES will automatically control the batch to reach the re-inspection step (AutoSkip=N) or the next step after the re-inspection step (AutoSkip=Y). When the batch reaches the step, it is in a dispatchable state. Then, the processable equipment will issue a processable signal (LoadRequest). The RTD will dispatch the processable batch based on this signal. After dispatch, the GTM / OHTS will perform physical transportation of the batch's carrier to the equipment loading port.

[0085] That is, when AutoSkip=Y, the instruction will cause WIP to reach the next step of the re-inspection process for the batch skip station;

[0086] When AutoSkip=N, the instruction will cause WIP to proceed to the re-inspection step for that batch.

[0087] Based on the above system and equipment, the specific interactive re-inspection steps are as follows: Figure 3 As shown,

[0088] S28.WIP uses the engineering temporary change Tenn in the control data as the re-inspection selection rule, which is executed by Sampling. The execution result is used by WIP in batch loading (LotInfoDownload).

[0089] The batch selection rules include: 1. Whether the batch number for re-inspection is the same as the batch number for pre-inspection in the control data; 2. Whether the current step number of the re-inspection batch is the same as the re-inspection step number in the control data; 3. Whether the wafer number for which the analysis report has been completed, and the name and path of its graphic text file Klarf exist.

[0090] S29. If there is no graphic or text file of the wafer pre-inspection results with a completed analysis report, the PrepareJob test for the re-inspection batch is deemed to have failed.

[0091] S30-31. When a graphic text file of the wafer pre-inspection results with a completed analysis report exists, WIP obtains the engineering data collection items and specifications from EDC and generates the expected information for the re-inspection batch (PreparedJob).

[0092] S32.RTD creates a GTMJob based on the expected information of the re-inspection batch (PreparedJob). This Job is issued by GTM to the transport physical layer (MCS / OHTS) to complete the transport task to complete the arrival of the carrier on the re-inspection machine LP (Load Port).

[0093] S33. The re-inspection machine requests material feeding information from the WIP and obtains the wafer number and the corresponding graphic text file name and path returned by the WIP;

[0094] S34. The re-inspection machine loads the pre-inspection result file of the current re-inspection batch from the shared storage system Samba according to the file name and path of the graphic text file;

[0095] S35-36. Batch to be re-inspected enters the station and re-inspection begins;

[0096] S37. Re-inspection of selected films begins;

[0097] S38. The re-inspection machine stores the graphic and text files of the selected re-inspection results on the shared storage system Samba in real time.

[0098] S39. The re-inspection machine returns a signal to WIP indicating the end of the re-inspection selection process;

[0099] S40. The re-inspection machine returns a re-inspection data report to the DMS;

[0100] S41-42.DMS uses the re-inspection data of all selected chips on the shared storage system Samba to determine the defects of the re-inspection batch and sends the results to the EDC.

[0101] S43. Batch re-inspected departs;

[0102] S44-46.WIP determines subsequent processes based on engineering data;

[0103] When OOC = Y, the re-inspected batch enters the rework or scrap process;

[0104] When OOC=N, the re-inspection batch proceeds to the next process;

[0105] S47-48. The re-inspection of the batch is completed, and the control data is cleared;

[0106] S49. Instructs RTD to transfer different batches to different destinations.

[0107] The control signal processing model that implements the above process includes:

[0108] FileMoveStart

[0109] trigger:

[0110] The pre-inspection batch is triggered when the Engineering Data Report (EDC) submitted after the pre-inspection machine has completed the pre-inspection is determined to exceed the standard.

[0111] action:

[0112] ①MES sends a message to DMS to inform that the specified batch and wafers will enter the re-inspection machine;

[0113] ②After receiving the message, DMS queries the shared file system for Klarf files containing the specified batch, wafer, pre-inspection machine, and pre-inspection step number, analyzes them, and stores them in DB;

[0114] Message format:

[0115] LOTID Batch number EQUIPMENTID Pre-inspection machine number LAYERID Pre-inspection step number WAFERUST Pre-screening selection set WAFER Film Selection ID Wafer Number INSPECTIONTIME Wafer pre-inspection start time

[0116] FileMoveComplete

[0117] trigger:

[0118] DMS receives the FileMoveStart signal and triggers it after completing the search, analysis, and archiving of graphic and text files according to the signal content.

[0119] action:

[0120] ①DMS sends a FileMoveComplete signal to MES;

[0121] ②After receiving the signal, MES updates the wafer control data and creates a temporary engineering change (Tecn) for the batch in the re-inspection step;

[0122] Message format:

[0123] LOTID Pre-inspection batches EQUIPMENTID Pre-inspection machine number LAYERID Pre-inspection step number KLARFLIST List of graphic text files KLARF Graphical text files NAME File name including path IDS The graphic text file contains a list of wafer numbering. WAFERUST Wafer List WAFER wafer ID Wafer Number STATUS Image text file status

[0124] Defect Coding

[0125] trigger:

[0126] Action triggered after qualitative and quantitative analysis of the re-inspection result graphic text file (K1arf):

[0127] ①DMS sends a DefectCoding signal to MES;

[0128] ② The MES receives the DefectCoding signal, converts it, and sends it to the SPC as post-measurement data.

[0129] Message format:

[0130] LOTID Batch number EQUIPMENTID Re-inspection machine number INSPEQUIPMENTID Pre-inspection machine number STEPID Re-inspection step number WAFERLIST Re-examination film selection collection WAFER Re-examination and selection of films wAFERID Wafer Number SUMoFCoUNTS Total number of defects MEASURETIME Re-examination time DEFECTLIST Defect set DEFECT defect TYPE Defect Classification cODE Defect coding COUNT Number of defects

[0131] universal signal

[0132] Signal name Control Description LotPrepare The expected signal is that the re-inspection step succeeds if the FileMoveCompelted component exists, and fails if it does not. LotInfoDownload The material feeding signal is sent by the re-inspection machine, and the pre-inspection result graphic text file containing the filename path is also sent. ComponentProcessStart When the chip selection begins and the measurement signal is detected, control data is generated upon reporting by the pre-inspection machine. PostEDC Once the engineering data collection is complete, the pre-inspection step determines the 00S and performs batch process control.

[0133] The control data model for implementing the above process is as follows:

[0134] LOT_ID INSP_STEP_NAME REVIEW_STEP_NAME COMPONENT_ID MOVED_COMPONENT_ID COMP_PROCESS_TIME INSP_EQUIPMENT KLARF_FILENAME CAAC068.005 MA084528 MA084530 CAAC068.001.10 2023-05-1020:06:23.231 RMKBF01 CAAC068.005 MA084528 MA084530 CAAC068.001.11 2023-05-1020:09:13.073 RMKBF01 CAAC077.008 MA084528 MA084530 CAAC077.001.03 CAAC077.001.03 2023-05-1019:25:34.772 RMKBF01 data / klarf / rmkbf01 / TID.001.01_20220314.001 CAAC077.008 MA084528 MA084530 CAAC077.001.04 2023-05-1019:28:14.233 RMKBF01

[0135] LOT_ID: Batch number;

[0136] INSP_STEP_NAME: Pre-inspection step number;

[0137] REVIEW_STEP_NAME: Re-inspection step number;

[0138] COMPONENT_ID: Wafer number;

[0139] MOVED_COMPONENT_ID: The valid wafer number in the pre-inspection result graphic text file;

[0140] COMP_PROCESS_TIME: Wafer pre-inspection time;

[0141] INSP_EQUIPMENT: Pre-inspection machine number;

[0142] KLARF_FILENAME: The filename containing the path to the graphic text file;

[0143] ① The pre-inspection selection process is controlled by the component process start signal (Component Process Start) during the pre-inspection process on the pre-inspection machine.

[0144] ② Clear the control data for the pre-inspection batch when the project data meets the standards;

[0145] ③ After the defect management analysis of the pre-inspection results graphic and text files is completed, the control data for the selected chip is updated through the analysis report signal (FileMoveComplete);

[0146] ④ During LotPrepare, use the selected control data to generate Temporary Engineering Change (TECN) data;

[0147] ⑤ When re-inspecting the material (LotInfoDownload), use the temporary engineering change (TECN) data to inform the re-inspection machine of the location and file name of the graphic and text files of the pre-inspection results;

[0148] ⑥ After the re-inspection batch is completed, clear the control data of the pre-inspection selection.

[0149] The function and effect of this embodiment:

[0150] This embodiment achieves the following effects by using a production method that automates defect detection, pre-inspection, and re-inspection control:

[0151] 1. The pre-inspection and re-inspection machines store the pre-inspection and re-inspection results in graphic text files (Klarf) by using Samba or File Transfer Service (FTP). This makes the pre-inspection result file of the pre-inspection machine visible and readable to either re-inspection machine, without the actual movement of the graphic text file (Klarf), thus improving accuracy and reliability.

[0152] 2. MES generates control data in real time through the inspection machine signal, and controls the prediction of the re-inspection machine through the control data, which prevents the re-inspection failure due to the discrepancy between the predicted re-inspection and the actual inspection, thus improving the re-inspection efficiency;

[0153] 3. MES obtains pre-inspection results in real time through Engineering Data Collection (EDC) and diverts the pre-inspection batches to the process flow in real time according to the pre-inspection results, preventing incorrect material feeding during re-inspection, thereby improving the accuracy and efficiency of re-inspection and thus improving product yield;

[0154] 4. When the pre-inspection results are satisfactory, MES automatically skips the re-inspection step, which improves the process flow speed of the pre-inspection batch and thus improves production efficiency; at the same time, it also prevents batches that pass the pre-inspection from occupying the re-inspection equipment and improves the actual utilization rate of the re-inspection equipment.

[0155] 5. When the pre-inspection result exceeds the standard (OOS), the MES automatically triggers the Defect Management Module (DMS) through control data to find and analyze the graphic text file (Klarf) under specified conditions. Then, the Defect Management Module (DMS) reports the analysis results to the MES. The MES uses control data to record the analysis results and controls the pre-selection of the re-inspection machine according to the results, preventing invalid pre-inspection pieces from being re-inspected, improving the accuracy and efficiency of re-inspection, and thus improving product yield and production efficiency.

[0156] While the foregoing has focused on embodiments, these are merely illustrative and do not limit the invention. Those skilled in the art will understand that various modifications and applications not illustrated above can be made without departing from the essential characteristics of these embodiments. For example, the constituent elements specifically shown in the embodiments can be implemented through modifications. Furthermore, various differences related to such modifications and applications should be interpreted as being included within the scope of the invention as defined in the appended claims.

Claims

1. A production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system, comprising an MES system, a pre-inspection machine, and a re-inspection machine, characterized in that: It also includes the shared storage system Samba; Among them, after the pre-inspection machine completes the pre-inspection, the graphic text file klarf of the chip pre-inspection results is saved in the shared storage system Samba; The MES system obtains the batches to be re-inspected based on the pre-inspection results of the pre-inspection machine, and its control data updates the file name and path of the pre-inspection results based on the batches to be re-inspected. When re-inspecting batches that are pending re-inspection, control data is used as the selection rule for re-inspection to determine its legality; When it is valid, start the feeding process of the re-inspection machine, and load the corresponding pre-inspection result file from the shared storage system Samba according to the file name and path of the pre-inspection result in the control data; The MES system includes a Work-in-Process Management (WIP) module, an Engineering Data (EDC) module, and a Defect Management (DMS) module. The Engineering Data Module (EDC) obtains the pre-inspection batch engineering data report from the pre-inspection machine, calculates the engineering data OOS, and returns the result to the Product Management Module (WIP). When OOS=Y, the WIP module of the product management module sends a FileMove signal. The DMS module of the defect management module finds the corresponding graphic text file klarf of the pre-inspection result of the selected piece in the shared storage system Samba, analyzes it, and reports the analysis result to the WIP module of the product management module. The MES system updates the filenames and paths of valid pre-inspection results in the control data based on the analysis results.

2. The production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system as described in claim 1, characterized in that: When OOS=N, the WIP module in the product management module sets the flag for this batch at the automatic pick-up station in the re-inspection step; The MES system clears all data related to this batch from the control data.

3. The production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system as described in claim 1, characterized in that: The MES system also includes a chip selection module, Sampler. In the pre-inspection step, the Work Processing (WIP) module obtains the selection rules configured by the factory model data based on the batch process information, and the Sampler module obtains the pre-inspection selections based on these selection rules.

4. The production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system as described in claim 3, characterized in that: In the re-inspection process, the data of temporary engineering changes in the control data (Tecn) are used as the re-inspection selection rules. The Sample module performs sample selection based on the sample selection rules.

5. The production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system as described in claim 4, characterized in that: The re-inspection and selection rules include the following judgments: S1. Is the batch number for re-inspection the same as the batch number for pre-inspection in the control data? S2. Check whether the current step number of the re-inspection batch is the same as the re-inspection step number in the control data; S3. Does the wafer number for the completed analysis report, along with its graphic text file Klarf name and path, exist? 6. The production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system as described in claim 1, characterized in that: The MES system also includes a real-time dispatch and transportation module (RTD) to enable the transfer of workpieces between various devices.

7. The production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system as described in claim 1, characterized in that: After completing the re-inspection, the re-inspection machine stores the re-inspection result graphic text file on the shared storage system Samba.

8. The production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system as described in claim 7, characterized in that: After completing the re-inspection, the re-inspection machine sends the re-inspection data report to the Defect Management Module (DMS). The Defect Management Module (DMS) performs defect determination on the re-inspection data.

9. The production method for automated control of defect detection, pre-inspection, and re-inspection in a 12-inch semiconductor MES system as described in claim 8, characterized in that: When the judgment result exceeds the control line, the re-inspected batch will enter the rework or scrap process. When the judgment result meets the control line, the re-inspection batch enters the next process.

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