Photoelectric module and preparation method thereof

Abstract

A photoelectric module and a preparation method thereof, the method is that an electrical connection surface and an optical coupling surface are arranged at intervals on a single PCB board, the electrical connection surface and the optical coupling surface are prepared respectively, and electrical contacts are bonded, after the installation of the photoelectric coupler and the additional test steps are completed, the PCB units are cut and prepared, and the corresponding photoelectric modules are further prepared. The present invention can prepare multiple photoelectric modules at the same time, improving the assembly efficiency; it can complete the aging of multiple photoelectric modules at one time, reducing the requirements for the test jig, and can test multiple photoelectric modules in batches, with high test efficiency; the photoelectric module is controlled to emit light by the test jig, and the test method is simple; the assembly process of the photoelectric module is simple.

Description

Technical Field

[0001] The present invention relates to the field of optical communications, and in particular to an optoelectronic module and a preparation method thereof, wherein the method improves the preparation efficiency of the optoelectronic module and simplifies an aging test method. Background Art

[0002] As the density and integration of communication electronic devices increase, optical transceiver modules are required to have smaller packages.

[0003] The common method in the industry is to encapsulate the chip in the sub-PCBA, connect the sub-PCBA and the fiber optic connector, and then assemble them together on the main PCB. The sub-PCB has a certain degree of versatility. Although this structure eliminates the need for optical coupler optical path conversion, it limits the optical coupling between the sub-PCBA and the fiber optic connector to active coupling, which takes longer to couple than passive coupling and has low production efficiency. In addition, the main PCBA and sub-PCBA of this structure are fixed at 90 degrees. The circuit pads between the main PCBA and the sub-PCBA are also welded at a 90-degree angle. It is difficult to apply the currently widely used reflow soldering surface mounting technology, and the production efficiency is low.

[0004] Alternatively, the optical transceiver is soldered on a printed circuit board and then assembled together on the base. The integrated transceiver optical module can significantly reduce the module packaging area, while improving the reliability and replaceability of the module. However, in the integrated transceiver optical module, the optical transceiver and the printed circuit board are installed in the base, and the optical transceiver requires a fixed position on the base, otherwise it cannot be coupled and aligned with the optical fiber. This structure has many parts and is complex to assemble.

[0005] The production of existing improved optoelectronic modules is usually achieved on a single carrier board, where a single module is chip mounted, optically coupled, and then subjected to aging test. This method has high requirements for fixtures and low production efficiency, and aging tests require special aging boxes to be implemented, which is not conducive to reducing costs.

[0006] Therefore, how to improve the structure of the optoelectronic module, simplify the preparation method of the optoelectronic module, and reduce the production cost has become a technical problem that needs to be solved urgently in the prior art. Summary of the invention

[0007] The purpose of the present invention is to provide an optoelectronic module and a preparation method thereof, which can improve assembly efficiency, simplify an aging test method, improve test efficiency, simplify an aging test box, and save equipment costs.

[0008] To achieve this object, the present invention adopts the following technical solutions:

[0009] A method for preparing a photoelectric module comprises the following steps:

[0010] Substrate preparation step S110:

[0011] Obtaining a prepared PCB board, wherein the PCB board is provided with an electrical connection surface and an optical coupling surface at intervals, and the PCB board has a plurality of PCB units, each PCB unit corresponding to the optoelectronic module to be prepared;

[0012] Electrical connection surface preparation step S120:

[0013] Printing and preparing a metal pad on the electrical connection surface, wherein the metal pad includes a plurality of first contacts at a central position and a plurality of second contacts located at the periphery of the first contacts, wherein the surface area of ​​the first contacts is larger than the surface area of ​​the second contacts, and solder is fixed on the first contacts and the second contacts;

[0014] Chip mounting step S130:

[0015] Mounting a plurality of driver chips and a plurality of optical transmitting / receiving devices on the optical coupling surface;

[0016] Bonding step S140:

[0017] The electrical contacts of the plurality of driving chips and the plurality of optical emitting / receiving devices are electrically connected to the electrical contacts of the PCB board.

[0018] Optionally, also include,

[0019] Photocoupler installation step S150:

[0020] Aligning and fixing the photoelectric coupler with the optical transmitting / receiving device;

[0021] PCB unit preparation step S160:

[0022] The PCB board is cut into a plurality of PCB units by using a precision cutting process, and the sides of the PCB units are provided with a plurality of semicircular through holes.

[0023] Optionally, in the electrical connection surface preparation step S120, the electrical connection surface is prepared using a printed plate, the printed plate having a plurality of first through holes and a plurality of second through holes, the first through holes corresponding to the first contacts, the second through holes corresponding to the second contacts, and solder paste is applied to prepare the electrical connection surface.

[0024] Optionally, the first through hole is aligned with the center of the first contact, the second through hole is aligned with the center of the second contact, the first through hole of the printed plate is 40%-60% of the first contact; the size of the second through hole is 40%-60% of the second contact.

[0025] Optionally, in the electrical connection surface preparation step S120, fixing solder on the first contact and the second contact specifically includes:

[0026] The prefabricated solder beads are distributed and mounted on the positions of the printed plate with solder paste, and the solder paste is melted and fixed by hot air heating, and then the printed plate is removed. The temperature of the hot air heating is higher than the melting point of the solder paste and lower than the melting point of the solder beads.

[0027] Optionally, in the electrical connection surface preparation step S120, fixing solder on the first contact and the second contact specifically includes:

[0028] The printed plate is removed, and the solder paste is heated to fix it on the PCB board.

[0029] Optionally, in the chip mounting step S130,

[0030] The driving chip is mounted on the optical coupling surface, the optical transmitting / receiving device is mounted on a bracket, and the bracket is vertically mounted on the optical coupling surface; or,

[0031] The driving chip and the optical emitting / receiving device are mounted on the optical coupling surface.

[0032] Optionally, an aging test step S145 is further provided between the bonding step S140 and the photoelectric coupler installation step S150:

[0033] The PCB board is placed on an aging carrier, aging conditions are set, and an aging test is performed on the optoelectronic module.

[0034] Optionally, the aging carrier includes a main body, a cover plate and a test base plate, the PCB board is placed in a groove of the main body and fixed by the cover plate, the test base plate is arranged at the lower part of the main body and has a test probe, the test probe passes through the main body, maintains the relative position between the test base plate and the main body and is electrically connected to the test contact.

[0035] Optionally, the test base plate controls the light emitting / receiving device of each of the plurality of PCB units to emit light in sequence;

[0036] When the light emitting / receiving device of each of the plurality of PCB units emits light, moving the light detection unit to the corresponding position of the light emitting / receiving device to detect the light intensity;

[0037] Qualified PCB units are screened based on the changes in light intensity of the light emitting / receiving devices of each of the PCB units before and after the aging test.

[0038] The invention also discloses a photoelectric module, which is prepared by adopting the above method.

[0039] The present invention further discloses a photoelectric unit, comprising the above-mentioned photoelectric module; the semicircular through hole on the side of the photoelectric module is connected to the bottom plate.

[0040] Optionally, when the driving chip and the optical emitting / receiving device are mounted on the optical coupling surface, the optical emitting / receiving device is coupled to the optical fiber via a photoelectric coupler.

[0041] Optionally, the photoelectric coupler includes a first lens, a second lens and a reflective surface, the photoelectric coupler has an accommodating inner cavity, the first lens is aligned with the optical window of the optical transmitting / receiving device, and the second lens is installed in alignment with the end face of the optical fiber.

[0042] Optionally, it further includes a first protective cover, which is arranged on the outer sides of the first lens, the second lens and the reflecting surface.

[0043] Optionally, when the optical transmitting / receiving device is mounted on the optical coupling surface via a bracket,

[0044] A side frame is also provided on the optical coupling surface, and an optical fiber guide hole is mounted on the side frame. The optical fiber guide hole is aligned with the center of the optical window of the optical transmitting / receiving device.

[0045] Optionally, it further includes a second protective cover, which is arranged on the outer sides of the driving chip and the bracket.

[0046] In summary, the present invention has the following characteristics:

[0047] 1. A plurality of PCB units are arranged on a large carrier board, and the plurality of PCB units are cut after the preparation process is completed, so as to prepare corresponding optoelectronic modules and improve assembly efficiency.

[0048] 2. Performing aging test before cutting can complete the aging of multiple optoelectronic modules at one time, reducing the requirements for test fixtures. Multiple optoelectronic modules can be tested in batches with high test efficiency. The test fixture is used to control the light emission of the optoelectronic module, and the test method is simple.

[0049] 3. The packaging structure of the optoelectronic module directly uses a base to install the optical transmitting / receiving device. No base is required. There are only optical transceiver devices and printed circuit boards, and the assembly process is simple.

[0050] 4. The protective cover and the substrate form an accommodating space, and the optical path coupling between the optical transmitting / receiving device and the optical fiber is achieved through photoelectric couplers in different ways, with flexible construction and simple structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1is a flow chart of a method for preparing an optoelectronic module according to a specific embodiment of the present invention;

[0052] Figure 2 This is a view of the optical coupling surface of the PCB board in the preparation method of the present invention when no components are mounted;

[0053] Figure 3 This is a view of the optical coupling surface of the PCB board after components are mounted in the preparation method of the present invention;

[0054] Figure 4 is a view of a photovoltaic module prepared by the preparation method of the present invention;

[0055] Figure 5 is another view of the optoelectronic module prepared by the preparation method of the present invention;

[0056] Figure 6 is a top view of a photovoltaic module according to a specific embodiment of the present invention;

[0057] Figure 7 is a schematic diagram of an electrical connection unit of an optoelectronic module according to a specific embodiment of the present invention;

[0058] Figure 8 This is a view of a PCB board prepared according to the preparation method of the present invention being placed in an aging carrier for aging testing;

[0059] Fig. 9 is a cross-sectional view of a photoelectric coupler of a photoelectric unit according to an embodiment of the present invention;

[0060] Fig.10 is an appearance diagram of a photovoltaic unit according to an embodiment of the present invention;

[0061] Fig.11 Schematic diagram of a photovoltaic unit according to an embodiment of the present invention.

[0062] The technical features indicated by the reference numerals in the figure are:

[0063] 1. PCB unit; 2. first protective cover; 3. optocoupler; 4. bracket; 5. side frame; 6. optical fiber guide hole; 7. optical fiber; 8. second protective cover; 11. first contact; 12. second contact; 21. electrical connection unit; 22. optical coupling unit; 31. driver chip; 32. optical transmitting / receiving device; 33. first lens; 34. reflecting surface; 35. second lens; 41. body; 42. cover plate; 43. test base plate; 44. test probe. DETAILED DESCRIPTION

[0064] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0065] The present invention mainly lies in that: an electrical connection surface and an optical coupling surface are arranged at intervals along the thickness direction on a large carrier board, such as a large single PCB board, a plurality of electrical connection units are arranged on the electrical connection surface, and a plurality of optical coupling units are arranged on the optical coupling surface. After the electrical connection surface and the optical coupling surface are prepared separately and additional testing steps are performed, they are cut and prepared into a plurality of PCB units, thereby preparing corresponding optoelectronic modules, improving assembly efficiency, simplifying aging test methods, improving test efficiency, simplifying aging test boxes, and saving equipment costs.

[0066] In the following embodiments, a PCB board is used as an example of a carrier board, but the present invention is not limited thereto, and a ceramic substrate may also be used, all of which are within the scope of protection requested by the present invention.

[0067] See also Figure 1 , showing a flow chart of a method for preparing an optoelectronic module according to the present invention, comprising the following steps:

[0068] Substrate preparation step S110:

[0069] A prepared PCB board is obtained, wherein the PCB board is provided with an electrical connection surface and an optical coupling surface at intervals, and the PCB board has a plurality of PCB units, each PCB unit corresponds to an optoelectronic module to be prepared, that is, the PCB board with a plurality of PCB units of the present invention can form a plurality of optoelectronic modules at the same time.

[0070] See also Figure 2 , Figure 3 , which respectively show views of the optical coupling surface of the PCB board in the preparation method of the present invention without mounted components and with mounted components.

[0071] The electrical connection surface has a plurality of electrical connection units, and the optical coupling surface has a plurality of optical coupling units. Specifically, Figure 4 and Figure 5 A single photovoltaic module is shown, wherein Figure 4 An electrical connection unit 21 is shown, Figure 5 The optical coupling unit 22 is shown. The electrical connection unit 21 and the optical coupling unit 22 correspond to one of the two surfaces of the PCB unit respectively.

[0072] Electrical connection surface preparation step S120:

[0073] A metal pad is printed on the electrical connection surface, and the metal pad includes a plurality of first contacts 11 at a central position and a plurality of second contacts 12 located at the periphery of the first contacts, the surface area of ​​the first contacts 11 is larger than the surface area of ​​the second contacts 12, and solder is fixed on the first contacts 11 and the second contacts 12.

[0074] Chip mounting step S130:

[0075] A plurality of driving chips 31 and a plurality of light emitting / receiving devices 32 are mounted on the light coupling surface 22. This step is used to prepare the light coupling surface.

[0076] In an optional embodiment, other electrical components are mounted on the optical coupling surface, such as capacitors, EMI (Electromagnetic Interference) components, etc. Solder paste can be printed on the optical coupling surface at the corresponding mounting position, and then the electrical components to be mounted are installed at the target position, and then the electrical components are fixed to the target position by reflow soldering or wave soldering. After the above-mentioned electrical components are fixedly installed, the driver chip and the optical transmitting / receiving device are mounted to the target position.

[0077] Therefore, the optoelectronic module prepared by the present invention does not need a base, and directly uses a substrate to form the packaging structure of the optoelectronic module. One side of the substrate has multiple light emitting / receiving devices and a driver chip, and the other side is provided with multiple electrical contacts for signal, power supply, and ground connection, and can be connected to the bottom plate through the SMT (Surface Mounted Technology) process. The first contact and the second contact have different surface areas. Specifically, the first contact is larger than the second contact and is provided with a gap. The first contact and the second contact are kept in the original position by surface tension and are insulated from each other. Therefore, it can be suitable for the reflow soldering surface mounting process and simplifies the assembly process.

[0078] Step S120 and step S130 are used to prepare the electrical connection surface and the optical coupling surface, respectively. The present invention does not limit the execution order of step S120 and step S130, and it is only necessary to use the relevant steps to complete the preparation of the corresponding surface of the PCB board. For example, after executing one of step S120 and step S130 to complete the preparation of the corresponding one of the electrical connection surface and the optical coupling surface, the PCB board is flipped 180°, and the preparation of the other one of the electrical connection surface and the optical coupling surface is completed by another step of step S120 and step S130.

[0079] Bonding step S140:

[0080] The electrical contacts of the plurality of driving chips 31 and the plurality of optical emitting / receiving devices 32 are electrically connected to the electrical contacts of the optical coupling surface of the PCB board.

[0081] In a specific embodiment, the two can be electrically connected by wire connection, but the present invention is not limited thereto, and any method of electrical connection is within the scope of protection claimed by the present invention. And from the above description, it can be seen that the bonding step S140 is preferably performed after step S120 and step S130, thereby increasing the stability of the product. For example, when preparing the electrical connection surface after bonding, it is easy to damage the stability of the connection of the electrical wire, thereby damaging the product quality.

[0082] Photocoupler installation step S150:

[0083] Align and secure the photocoupler with the optical transmitting / receiving device.

[0084] This step mainly involves aligning the center of the optical channel on the optical component with the center of the optical window of the optical transmitting / receiving device for installation.

[0085] PCB unit preparation step S160:

[0086] The PCB board is cut into a plurality of PCB units by using a precision cutting process, and the sides of the PCB units are provided with a plurality of semicircular through holes.

[0087] This step is used to form a single photovoltaic module, see Figure 6 , which is a schematic diagram of an optoelectronic module corresponding to a PCB unit after cutting in the preparation method according to the present invention.

[0088] The optoelectronic module is surrounded by metallized semicircular through holes, which are connected to the bottom plate. The metallized semicircular through holes can have a positioning function to achieve alignment with the bottom plate, and also have an electrical connection channel to increase the electrical connection between the optical coupling surface and the bottom plate.

[0089] Through the method of the present invention, a large PCB board can be prepared and cut into multiple PCB units, thereby preparing corresponding optoelectronic modules and improving assembly efficiency.

[0090] See also Figure 7 The electrical connection surface of the optoelectronic module is arranged with metal pads, and spherical solder beads are installed on the metal pads.

[0091] In the electrical connection surface preparation step S120, a printing plate may be used to prepare the pads of the electrical connection surface.

[0092] The printed plate has a plurality of first through holes and a plurality of second through holes, wherein the first through holes correspond to the first contacts, and the second through holes correspond to the second contacts, and solder paste is applied to prepare the electrical connection surface.

[0093] The thickness of the printing plate is less than or equal to 0.1 mm, and when the printing plate is attached to the upper surface of the electrical connection surface, its flatness is consistent with that of the electrical connection surface.

[0094] The first through hole is aligned with the center of the first contact, the second through hole is aligned with the center of the second contact, the first through hole of the printing plate is 40%-60% of the first contact; the size of the second through hole is 40%-60% of the second contact.

[0095] Solder includes solder beads and solder paste. The metal pad may have solder beads and solder paste, or may only have solder paste.

[0096] When there are solder beads and solder paste, in the electrical connection surface preparation step S120, fixing solder on the first contact and the second contact specifically includes:

[0097] The prefabricated solder beads are distributed and mounted on the positions of the printed plate with solder paste, and the solder paste is melted and fixed by hot air heating, and then the printed plate is removed. The temperature of the hot air heating is higher than the melting point of the solder paste and lower than the melting point of the solder beads.

[0098] Hot air heating is used to melt the solder paste and fix the solder beads, which can blow away the excess solder beads and has a simple process and easy operation.

[0099] The tin beads can increase the welding strength, especially when the density of the solder joints on the base plate is high, the tin beads can facilitate the alignment of the optoelectronic module and the solder joints on the base plate.

[0100] When there is no solder ball but only solder paste, in the electrical connection surface preparation step S120, fixing solder on the first contact and the second contact specifically includes:

[0101] The printed plate is removed, and the solder paste is heated to fix it on the PCB board.

[0102] After printing, check whether the solder paste meets the design requirements. If not, wipe off the solder paste and perform the electrical connection surface preparation step S120 again.

[0103] In the chip mounting step S130 , the driving chip and the optical emitting / receiving device can be located at different positions and can be mounted at the designed positions according to design requirements.

[0104] For example, see Figure 5 The driving chip 31 and the optical transmitting / receiving device 32 are mounted on the optical coupling unit 22 .

[0105] Alternatively, see Fig.11The driving chip 31 is mounted on the optical coupling unit 22 , the optical transmitting / receiving device 32 is mounted on the bracket 4 , and the bracket 4 is vertically mounted on the optical coupling unit 22 .

[0106] In this step, the photosensitive surfaces of the multiple light emitting / receiving devices corresponding to the light coupling unit have the same height.

[0107] Since optical transmitting / receiving devices may fail prematurely or malfunction during use, optoelectronic modules need to be subjected to aging tests during production to ensure chip stability and reliability.

[0108] Therefore, further, an aging test step S145 is provided between the bonding step S140 and the photoelectric coupler installation step S150:

[0109] The PCB board is placed on an aging carrier, aging conditions are set, and an aging test is performed on the optoelectronic module. The aging conditions include driving current, ambient temperature and aging time. During the aging process, each optoelectronic module emits light at the same time, so the test environment is relatively simple, and the aging of multiple optoelectronic modules can be completed at one time. The aging efficiency is high, and the requirements for the aging jig are reduced.

[0110] See also Figure 8 The aging carrier includes a body 41, a cover plate 42 and a test base plate 43. The PCB board is placed in the groove of the body 41 and fixed by the cover plate 42. The test base plate 43 is arranged at the lower part of the body 41 and has a test probe 44. The test probe 44 passes through the body, maintains the relative position between the test base plate and the body, and is electrically connected to the test contact, thereby completing data communication and power transmission.

[0111] Specifically, the bottom of the body 41 has a plurality of parallel and spaced ribs for uniformly supporting the PCB to be tested, thereby avoiding damage to the PCB. The cover 42 has a plurality of parallel and spaced strip openings, each of which leaks at least one row of light emitting / receiving devices. The cover 42 can make the surface of the PCB to be tested substantially flush.

[0112] The test baseboard controls the light emitting / receiving device of each of the plurality of PCB units to emit light in sequence;

[0113] When the light emitting / receiving device of each of the plurality of PCB units emits light, moving the light detection unit to the corresponding position of the light emitting / receiving device to detect the light intensity;

[0114] Qualified PCB units are screened based on the changes in light intensity of the light emitting / receiving devices of each of the PCB units before and after the aging test.

[0115] In a specific embodiment, the test system includes a test unit, a detection unit and a module control unit. The test unit notifies the module control unit of the module number and luminous intensity currently being tested. The module control unit controls the light-emitting device of the corresponding optoelectronic module to emit light through the test baseboard according to the received information. The test unit controls the detection unit to move to the top of the module with the corresponding number, that is, the top of the corresponding light emitting / receiving device. The detection unit detects the light intensity of the light emitting device of the optoelectronic module and transmits it to the test unit. The test unit processes the data obtained by the detection unit and saves the test results.

[0116] Therefore, qualified PCB units can be screened based on the changes in light intensity when the light emitting / receiving devices of each of the PCB units emit light before and after the aging test.

[0117] Therefore, the testing method of the present invention can perform aging tests on multiple optoelectronic modules in batches, and the testing efficiency is high; the light emission of the optoelectronic modules is controlled by the testing fixture, and the testing method is simple.

[0118] The present invention further discloses a photoelectric module, which is prepared by the above method.

[0119] Furthermore, the present invention also discloses a photoelectric unit, which includes the above-mentioned photoelectric module, and the semicircular through hole on the side of the photoelectric module is connected to the bottom plate.

[0120] See also Figure 9-11 , showing different schematic diagrams of the optoelectronic coupler of the optoelectronic unit prepared according to the present invention, the optoelectronic unit also includes a optoelectronic coupler 3, and the optical transmitting / receiving device 32 is coupled with the optical fiber through the optoelectronic coupler 3.

[0121] Embodiment 1:

[0122] See also Fig. 9 , 10 , showing an embodiment of a photovoltaic unit of the present invention.

[0123] In this embodiment, the photoelectric coupler 3 includes a first lens 33, a second lens 35 and a reflective surface 34. The photoelectric coupler 3 has an accommodating inner cavity. The first lens is aligned with the optical window of the optical transmitting / receiving device 32. The reflective surface 34 is used to couple the optical path of the first lens 33 and the optical path of the second lens 35. The second lens 35 is installed in alignment with the end face of the optical fiber 7.

[0124] Specifically, the first lens 33 can be a divergent lens, which is used to convert the light emitted by VCSEL (Vertical-Cavity Surface-Emitting Laser) into a group of parallel lights. The reflecting surface 34 is a reflecting surface at an angle of 45 degrees, which is used to change the propagation direction of the received light beam. The second lens 35 can be a converging lens, which converges the reflected light beam to the optical fiber 7. The first lens 33 is used to align with the light window of the optical transmitting / receiving device 32, and the reflecting surface 34 emits the received light beam in a direction perpendicular to the incident direction, thereby changing the direction of the light path.

[0125] The photoelectric coupler further includes a first protective cover 2 , which is disposed on the outer sides of the first lens 33 , the second lens 35 and the reflective surface 34 .

[0126] The photocoupler is made of plastic-like material and cannot withstand the temperature of SMT (Surface Mounted Technology). Therefore, a protective cover is installed on the photocoupler, and the protective cover is made of ceramic material. The side of the protective cover 2 can sag, thereby providing heat insulation protection for the top and side surfaces of the photocoupler 3. The lower side of the photocoupler 3 is a substrate. The optical transmitting / receiving device 32 and the driving chip 31 can be located in the cavity of the photocoupler. In this way, all-round protection can be provided for the photocoupler and other components, so that the photocoupler will not be overheated and damaged during SMT (Surface Mounted Technology).

[0127] Embodiment 2:

[0128] See also Fig.11 , shows another embodiment of the optoelectronic unit of the present invention, and the optical path coupling between the optical transmitting / receiving device and the optical fiber can also be achieved by means of an optical fiber guide hole.

[0129] The photoelectric coupler is a fiber guide hole 6, the optical transmitting / receiving device 32 is mounted on a bracket 4, the bracket 4 is mounted on a substrate 1, and the fiber guide hole 6 is aligned with the center of the optical window of the optical transmitting / receiving device 31, thereby realizing the optical path coupling between the optical fiber and the optical transmitting / receiving device.

[0130] In this embodiment, the front and side surfaces of the bracket 4 may be provided with conductive circuits. The bracket 4 is rotated 90 degrees and then mounted on the PCB board 1. The optical fiber guide hole 6 is mounted on the side frame 5. The optical fiber guide hole 6 is aligned with the center of the optical window of the optical transmitting / receiving device 31. Therefore, when the optical fiber is inserted into the optical fiber guide hole, the optical path coupling of the optical fiber and the optical transmitting / receiving device can be achieved.

[0131] Furthermore, it also includes a second protective cover 8, which is arranged on the outer sides of the driving chip and the bracket.

[0132] The protective cover 8 and the PCB board 1 can be sealed with high temperature resistant glue to form the entire optoelectronic module as a whole, which can prevent the injection plastic from entering the inner cavity, avoid damage to the light receiving / transmitting device and the driver chip during injection molding, and its deformation under the injection molding pressure will not damage the internal devices.

[0133] In summary, the present invention has the following characteristics:

[0134] 1. A plurality of PCB units are arranged on a large carrier board, and the plurality of PCB units are cut after the preparation process is completed, so as to prepare corresponding optoelectronic modules and improve assembly efficiency.

[0135] 2. Performing aging test before cutting can complete the aging of multiple optoelectronic modules at one time, reducing the requirements for test fixtures. Multiple optoelectronic modules can be tested in batches with high test efficiency. The test fixture is used to control the light emission of the optoelectronic module, and the test method is simple.

[0136] 3. The packaging structure of the optoelectronic module directly uses a base to install the optical transmitting / receiving device. No base is required. There are only optical transceiver devices and printed circuit boards, and the assembly process is simple.

[0137] 4. The protective cover and the substrate form an accommodating space, and the optical path coupling between the optical transmitting / receiving device and the optical fiber is achieved through photoelectric couplers in different ways, with flexible construction and simple structure.

[0138] The above content is a further detailed description of the present invention in combination with a specific preferred embodiment. It cannot be determined that the specific embodiments of the present invention are limited to this. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as belonging to the protection scope of the present invention determined by the submitted claims.

Claims

1. A method for preparing a photoelectric module, characterized in that: The steps include: Substrate preparation step S110: Obtaining a prepared PCB board, wherein the PCB board is provided with an electrical connection surface and an optical coupling surface at intervals, and the PCB board has a plurality of PCB units, each PCB unit corresponding to the optoelectronic module to be prepared; Electrical connection surface preparation step S120: Printing and preparing a metal pad on the electrical connection surface, wherein the metal pad includes a plurality of first contacts at a central position and a plurality of second contacts located at the periphery of the first contacts, wherein the surface area of ​​the first contacts is larger than the surface area of ​​the second contacts, and solder is fixed on the first contacts and the second contacts; Chip mounting step S130: Mounting a plurality of driver chips and a plurality of optical transmitting / receiving devices on the optical coupling surface; Bonding step S140: Electrically connecting the electrical contacts of the plurality of driving chips and the plurality of optical emitting / receiving devices to the electrical contacts of the PCB board; Photocoupler installation step S150: Aligning and fixing the photoelectric coupler with the optical transmitting / receiving device; There is also an aging test step S145 between the bonding step S140 and the photoelectric coupler installation step S150: Placing the PCB board on an aging carrier, setting aging conditions, and performing an aging test on the optoelectronic module; The aging carrier includes a body, a cover plate and a test base plate. The PCB board is placed in a groove of the body and fixed by the cover plate. The test base plate is arranged at the lower part of the body and has a test probe. The test probe passes through the body, maintains the relative position between the test base plate and the body, and is electrically connected to the test contact, thereby completing data communication and power transmission. The test baseboard controls the light emitting / receiving device of each of the plurality of PCB units to emit light in sequence; When the light emitting / receiving device of each of the plurality of PCB units emits light, moving the light detection unit to the corresponding position of the light emitting / receiving device to detect the light intensity; According to the change in light intensity of the light emitting / receiving device of each PCB unit before and after the aging test, qualified PCB units are screened, so as to perform aging tests on multiple optoelectronic modules in batches, and control the emission of optoelectronic modules through a test fixture.

2. The preparation method according to claim 1, characterized in that: Also includes, PCB unit preparation step S160: The PCB board is cut into a plurality of PCB units by using a precision cutting process, and the sides of the PCB units are provided with a plurality of semicircular through holes.

3. The preparation method according to claim 1 or 2, characterized in that: In the electrical connection surface preparation step S120, the electrical connection surface is prepared using a printed plate, the printed plate has a plurality of first through holes and a plurality of second through holes, the first through holes correspond to the first contacts, the second through holes correspond to the second contacts, and solder paste is applied to prepare the electrical connection surface.

4. The preparation method according to claim 3, characterized in that: The first through hole is aligned with the center of the first contact, the second through hole is aligned with the center of the second contact, the first through hole of the printing plate is 40%-60% of the first contact; the size of the second through hole is 40%-60% of the second contact.

5. The preparation method according to claim 1, characterized in that: In the electrical connection surface preparation step S120, fixing solder on the first contact and the second contact specifically includes: The prefabricated solder beads are distributed and mounted on the positions of the printed plate with solder paste, and the solder paste is melted and fixed by hot air heating, and then the printed plate is removed. The temperature of the hot air heating is higher than the melting point of the solder paste and lower than the melting point of the solder beads.

6. The preparation method according to claim 1, characterized in that: In the electrical connection surface preparation step S120, fixing solder on the first contact and the second contact specifically includes: The printed plate is removed, and the solder paste is heated to fix it on the PCB board.

7. The preparation method according to any one of claims 1-2 and 5-6, characterized in that: In the chip mounting step S130, The driving chip is mounted on the optical coupling surface, the optical emitting / receiving device is mounted on a bracket, and the bracket is vertically mounted on the optical coupling surface; or, the driving chip and the optical emitting / receiving device are mounted on the optical coupling surface.

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