A high board, a flash module, a circuit board and an electronic device

Abstract

The application provides a high board, a flash module, a circuit board and an electronic device, relates to the technical field of electronic products, and is used for solving the problem of how to reduce the development cost of the circuit board and save the circuit board space. Specifically, the electronic device comprises a high board, a first flash and a second flash. The high board comprises a board body, a first external port and a second external port. The first external port and the second flash are arranged on the second surface of the board body, and the second external port and the first flash are arranged on the first surface of the board body. The first external port is electrically connected with the first flash, and the second external port is electrically connected with the second flash. The orthographic projection of the first flash on the second surface is a first projection, the orthographic projection of the second flash on the first surface is a second projection, and the position of the first projection on the second surface relative to the first external port is different from the position of the second projection on the first surface relative to the second external port. The application provides the electronic device for shooting images or videos.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic products, and in particular to a heightening board, a flash module, a circuit board and an electronic device. BACKGROUND

[0002] With the development of technology, electronic devices such as mobile phones and tablet computers have a shooting function. When shooting, a flash is used for light compensation to achieve video or image shooting in a dimly lit environment.

[0003] In the electronic device, a circuit board (such as a mainboard) is provided with a flash interface for electrically connecting the flash. For different models of the same type of electronic device, the position of the flash is different, and accordingly, the position of the flash interface on the circuit board is also different. However, the processor, memory and other hardware structures on the circuit board in the same type of different models of electronic devices may be the same.

[0004] On the basis of the above, in order to reduce the development cost of the circuit board, a circuit board that can be applied to different models of electronic devices can be designed. Specifically, a plurality of flash interfaces with different positions can be provided on the circuit board to electrically connect the flash with different positions, so as to adapt to different models of electronic devices. However, in this way, a large area of the circuit board is occupied, resources are wasted, and in the electronic device, the flash is electrically connected to one of the flash interfaces, and the other flash interfaces are exposed, which has the risk of short circuit. SUMMARY

[0005] The embodiments of the present application provide a heightening board, a flash module, a circuit board and an electronic device, which are used to solve the problem of how to reduce the development cost of the circuit board while saving the space of the circuit board and reducing the risk of short circuit of the circuit board.

[0006] To achieve the above-mentioned purpose, the embodiments of the present application adopt the following technical solutions:

[0007] In a first aspect, an electronic device is provided, which includes a circuit board, a first flash, a second flash, and a heightening board. The heightening board, the first flash, and the second flash form a flash module. The circuit board is provided with a flash interface. The heightening board includes a board body, a first external port, and a second external port. The board body includes opposite first and second surfaces. The first external port and the second flash are disposed on the second surface. The second external port and the first flash are disposed on the first surface. The first external port is electrically connected to the first flash, and the second external port is electrically connected to the second flash. The second external port is the same as the first external port. A normal projection of the first flash on the second surface is a first projection, and a normal projection of the second flash on the first surface is a second projection. The position of the first projection on the second surface relative to the first external port is different from the position of the second projection on the first surface relative to the second external port. The board body of the heightening board is stacked and spaced apart from the circuit board, and the first or second surface of the board body faces the circuit board. When the first surface of the board body faces the circuit board, the second external port is electrically connected to the flash interface in cooperation, and when the second surface of the board body faces the circuit board, the first external port is electrically connected to the flash interface in cooperation.

[0008] In the electronic device provided by the present application, the second external port is the same as the first external port, so that one flash interface is designed on the circuit board, which can be adapted to the first external port and the second external port. Thus, the area of the flash interface on the circuit board can be reduced, the space of the circuit board can be saved, and the risk of short circuit of the flash interface can be reduced. In addition, the position of the first projection on the second surface relative to the first external port is different from the position of the second projection on the first surface relative to the second external port, so that when the first external port and the second external port respectively face the circuit board and are electrically connected to the flash interface in cooperation, the first flash and the second flash located away from the side of the board body facing away from the circuit board are used for light compensation. The positions of the first flash and the second flash relative to the flash interface are different, and two different models of electronic devices can be formed. Thus, one heightening board can be adapted to two different models of electronic devices, the design cost can be saved, and unified transportation and management can be facilitated.

[0009] In a possible implementation manner of the first aspect, the first external port comprises a first external positive terminal and a first external negative terminal. A projection of the first external positive terminal on the first surface is a third projection, and a projection of the first external negative terminal on the first surface is a fourth projection. The second external port comprises a second external positive terminal and a second external negative terminal. The third projection is symmetrically arranged with an occupied area of the second external positive terminal on the first surface about the first axis. The fourth projection is also symmetrically arranged with an occupied area of the second external negative terminal on the first surface about the first axis. In this way, the flash lamp module is flipped about the first axis, so that the first external port and the second external port are respectively aligned with the flash lamp interfaces on the circuit board to determine the correct assembly mode in the assembly process. This operation is convenient and efficient, and can improve the installation efficiency of the flash lamp module on the circuit board.

[0010] In a possible implementation manner of the first aspect, a projection of the first flash lamp on the first surface is a fifth projection, and the fifth projection and the second projection are located on the same side of the first axis. In this way, when the flash lamp module is flipped about the first axis so that the first external port and the second external port are respectively aligned with the flash lamp interfaces on the circuit board, the second flash lamp can be flipped to the upper side of the first axis to adapt to two different models of electronic devices. On the premise that the positions of the flash lamps on the two different models of electronic devices are deviated in a direction perpendicular to the first axis by a certain distance, the distance from the first flash lamp to the first external port and the distance from the second flash lamp to the second external port can both be designed to be relatively short in the direction perpendicular to the first axis, which is beneficial to reducing the area of the elevated plate in the flash lamp module and facilitating installation on the circuit board.

[0011] In a possible implementation manner of the first aspect, an absolute value of a difference between a vertical distance from the fifth projection to the first axis and a vertical distance from the second projection to the first axis is less than or equal to 1 mm. In this way, the first flash lamp and the second flash lamp are arranged approximately flush, which is beneficial to further reducing the area of the elevated plate in the flash lamp module and facilitating installation on the circuit board.

[0012] In a possible implementation manner of the first aspect, the plate body comprises a first part and a second part. The first external port and the second external port are arranged on the first part, and the first flash lamp and the second flash lamp are arranged on the second part. The arrangement direction of the first part and the second part is arranged obliquely relative to the first axis. In this way, it is beneficial to further reduce the area of the elevated plate in the flash lamp module and facilitate installation on the circuit board.

[0013] In a possible implementation manner of the first aspect, a normal projection of the first external port on the first surface is a sixth projection, and the sixth projection at least partially overlaps with an occupied area of the second external port on the first surface. In this way, the first external port and the second external port occupy the same area on the board body, and thus it is beneficial to reduce the setting area of the board body and facilitate installation on the circuit board.

[0014] In a possible implementation manner of the first aspect, the first external positive terminal, the first external negative terminal, the second external positive terminal and the second external negative terminal are all pads arranged on the surface of the board body. In this way, the structure of the heightening board is simple, and the space occupied is small.

[0015] In a possible implementation manner of the first aspect, the heightening board further comprises a first flash port and a second flash port. The first flash port is arranged on the board body, the first flash port is electrically connected with the first external port, and the first flash light is electrically connected to the first flash port. The second flash port is arranged on the board body, the second flash port is electrically connected with the second external port, and the second flash light is electrically connected to the second flash port. In this way, the connection operation of the first flash light and the second flash light on the board body is convenient, and the processing efficiency of the flash light module is higher.

[0016] In some embodiments, the first flash interface comprises a first flash positive terminal and a first flash negative terminal, the first flash positive terminal is electrically connected with the first external positive terminal, and the first flash negative terminal is electrically connected with the first external negative terminal. The second flash interface comprises a second flash positive terminal and a second flash negative terminal, the second flash positive terminal is electrically connected with the second external positive terminal, and the second flash negative terminal is electrically connected with the second external negative terminal.

[0017] In a possible implementation manner of the first aspect, the first flash positive terminal, the first flash negative terminal, the second flash positive terminal and the second flash negative terminal are all pads arranged on the surface of the board body. In this way, the structure of the heightening board is simple, and the space occupied is small.

[0018] In a possible implementation manner of the first aspect, the first flash positive terminal and the first flash negative terminal are arranged on the first surface. The second flash positive terminal and the second flash negative terminal are arranged on the second surface. In this way, the first flash light and the second flash light can be respectively soldered on the first flash port and the second flash port by the surface mounting technology, the efficiency of the surface mounting technology soldering is higher, and the processing efficiency of the flash light module can be improved.

[0019] In one possible implementation of the first aspect, the first projection and the second projection are both rectangular, with the length of the first projection being perpendicular to the length of the second projection. This allows the first flashlight and the second flashlight to be arranged in different orientations, making it easier for a user to distinguish between the first and second surfaces of the flashlight module, thereby preventing users from making mistakes.

[0020] In one possible implementation of the first aspect, the electronic device further includes a camera decorative member. The camera decorative member is disposed on a side of the elevated plate facing away from the circuit board. A relief groove is provided on the surface of the camera decorative member facing the circuit board, and the elevated plate is received within the relief groove. This prevents the elevated plate and the camera decorative member from overlapping in the thickness direction of the electronic device, thereby facilitating a thinner electronic device.

[0021] In one possible implementation of the first aspect, a limiting notch is provided on an edge of the plate body. A limiting post is provided on the bottom wall of the avoidance groove, and the limiting post is received in the limiting notch. This can limit the installation position of the elevated plate on the circuit board, thereby improving the alignment accuracy between the elevated plate and the circuit board.

[0022] In a second aspect, a flashlight module is also provided, which includes an elevated plate, a first flashlight, and a second flashlight. The elevated plate includes a plate body, a first external port, and a second external port. The plate body includes a first surface and a second surface relative to each other. The first external port and the second flashlight are arranged on the second surface. The second external port and the first flashlight are arranged on the first surface. The first external port is electrically connected to the first flashlight, and the second external port is electrically connected to the second flashlight. The second external port is the same as the first external port, the orthographic projection of the first flashlight on the second surface is the first projection, the orthographic projection of the second flashlight on the first surface is the second projection, and the position of the first projection on the second surface relative to the first external port is different from the position of the second projection on the first surface relative to the second external port.

[0023] The flash module provided in the application has the same second external port as the first external port, so that a flash interface is designed on a circuit board of the electronic device to which the flash module is connected, and the first external port and the second external port are adapted. Thus, the area of the flash interface on the circuit board can be reduced, the space of the circuit board is saved, and the risk of short circuit of the flash interface is reduced. In addition, the position of the first projection on the second surface relative to the first external port is different from the position of the second projection on the first surface relative to the second external port, so that when the first external port and the second external port are respectively oriented towards the circuit board and electrically connected with the flash interface, the first flash and the second flash located away from the board body and away from the circuit board are used for light compensation, and the positions of the first flash and the second flash relative to the flash interface are different to adapt to the assembly of two different models of electronic devices, so that one elevated board can be adapted to two different models of electronic devices, and the design cost can be saved, and unified transportation and management are facilitated.

[0024] In a third aspect, an elevated board is also provided. The elevated board includes a board body, a first flash port, a first external port, a second flash port and a second external port. The board body includes opposite first and second surfaces. The first flash port is disposed on the board body and is configured to electrically connect a first flash and position the first flash on the first surface. The first external port is disposed on the second surface and is electrically connected with the first flash port. The second flash port is disposed on the board body and is configured to electrically connect a second flash and position the second flash on the second surface. The second external port is disposed on the first surface and is electrically connected with the second flash port. The second external port is the same as the first external port. A first projection of the first flash port on the second surface is a seventh projection, and a second projection of the second flash port on the first surface is an eighth projection. The position of the seventh projection on the second surface relative to the first external port is different from the position of the eighth projection on the first surface relative to the second external port.

[0025] The first flash lamp port is used for electrically connecting the first flash lamp and locating the first flash lamp on the first surface, and the second flash lamp port is used for electrically connecting the second flash lamp and locating the second flash lamp on the second surface, so that the first flash lamp and the second flash lamp can be connected on the first flash lamp port and the second flash lamp port respectively to form a flash lamp module. On this basis, since the second external port is the same as the first external port, a flash lamp interface can be designed on a circuit board in the electronic device connecting the flash lamp module, which can be adapted to the first external port and the second external port. In this way, the area of the flash lamp interface on the circuit board can be reduced, the circuit board space can be saved, and the risk of short circuit of the flash lamp interface can be reduced. In addition, since the position of the first projection of the first external port relative to the first external port on the second surface is different from the position of the second projection of the second external port relative to the second external port on the first surface, when the first external port and the second external port are respectively oriented towards the circuit board and electrically connected with the flash lamp interface, the first flash lamp and the second flash lamp located away from the board body away from the circuit board are used for light compensation, and the positions of the first flash lamp and the second flash lamp relative to the flash lamp interface are different to adapt to the assembly of two different models of electronic devices, so that one elevated plate can be adapted to two different models of electronic devices, the design cost can be saved, and unified transportation and management are facilitated.

[0026] In a possible implementation manner of the third aspect, the first external port includes a first external positive terminal and a first external negative terminal. The normal projection of the first external positive terminal on the first surface is a third projection, and the normal projection of the first external negative terminal on the first surface is a fourth projection. The second external port includes a second external positive terminal and a second external negative terminal. The third projection and the second external positive terminal are symmetrically arranged about the first axis in the occupied area of the first surface. The fourth projection and the second external negative terminal are also symmetrically arranged about the first axis in the occupied area of the first surface. In this way, the elevated plate is flipped about the first axis, so that the first external port and the second external port are aligned with the flash lamp interface on the circuit board respectively to determine the correct assembly mode in the assembly process. This operation is convenient, efficient, and can improve the installation efficiency of the elevated plate on the circuit board.

[0027] In a possible implementation manner of the third aspect, a normal projection of the first flash port on the first surface is a ninth projection, and the ninth projection and the eighth projection are located on the same side of the first axis. In this way, the first flash and the second flash connected to the first flash port and the second flash port respectively can be located on the same side of the first axis. When the stand plate is flipped around the first axis to align the first external port and the second external port with the flash interfaces on the circuit board respectively, the second flash port can be flipped to the upper side of the first axis to adapt to two different models of electronic devices. On the premise that the positions of the flashes on the two different models of electronic devices are deviated in the direction perpendicular to the first axis by a certain distance, the distance from the first flash to the first external port and the distance from the second flash to the second external port can be designed to be relatively short in the direction perpendicular to the first axis, which is beneficial to reducing the area of the stand plate and facilitating installation on the circuit board.

[0028] In a possible implementation manner of the third aspect, the plate body includes a first part and a second part. The first external port and the second external port are arranged on the first part, and the first flash port and the second flash port are arranged on the second part. The arrangement direction of the first part and the second part is arranged obliquely relative to the first axis. In this way, it is beneficial to further reduce the area of the stand plate and facilitate installation on the circuit board.

[0029] In a possible implementation manner of the third aspect, a normal projection of the first external port on the first surface is a sixth projection, and the sixth projection at least partially overlaps with the occupied area of the second external port on the first surface. In this way, the first external port and the second external port occupy the same area on the plate body, and therefore it is beneficial to reduce the arrangement area of the plate body and facilitate installation on the circuit board.

[0030] The fourth aspect further provides a circuit board including a circuit board body and the stand plate according to any one of the technical solutions.

[0031] The circuit board provided by the embodiments of the present application has the following advantages. Since the edge of the stand plate and the edge of the circuit board body at the opening are connected through the disconnectable structure, the circuit board body and the stand plate are connected as a whole and can be integrally formed, and meanwhile, the automatic connection of electronic devices on the circuit board body and the stand plate is facilitated, and the processing efficiency is improved. On this basis, since the disconnectable structure is disconnectable, after the electronic devices are welded on the circuit board body and the stand plate respectively, the stand plate can be disconnected from the circuit board body by means of the disconnectable structure, so as to facilitate independent assembly.

[0032] In a possible implementation form of the fourth aspect, the breakable structure comprises a breakable line. The breakable line is located between the edge of the elevated plate and the edge of the circuit board body at the opening. It should be noted that the breakable line is a linear region on the circuit board, and the thickness of the linear region can be smaller than that of other parts to achieve breakability. The linear region can also be formed by alternately arranging solid parts and hollow parts along the length direction of the linear region to achieve breakability.

[0033] In a possible implementation form of the fourth aspect, the breakable line comprises a first breakable line and a second breakable line. The breakable structure further comprises a connecting plate. The connecting plate is located between the edge of the elevated plate and the edge of the circuit board body at the opening. The first breakable line is connected between the edge of the elevated plate and the connecting plate. The second breakable line is arranged between the connecting plate and the edge of the circuit board body at the opening. In this way, the first breakable line and the second breakable line can extend along different paths, so that the shape of the opening and the profile shape of the edge of the elevated plate can be different, to meet the forming requirement that the shape of the opening and the profile shape of the edge of the elevated plate are different. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 A perspective view of an electronic device provided for some embodiments of the present application;

[0035] Figure 2 An exploded view of the electronic device shown in FIG. 1; Figure 1

[0036] An exploded view of the electronic device shown in FIG. 1; Figure 3 Figure 2 An exploded view of the electronic device shown in FIG. 1;

[0037] An exploded view of the electronic device shown in FIG. 1; Figure 4 Figure 2 An exploded view of the electronic device shown in FIG. 1;

[0038] An exploded view of the electronic device shown in FIG. 1; Figure 5 An exploded view of the electronic device shown in FIG. 1;

[0039] Figure 6 An exploded view of the electronic device shown in FIG. 1;

[0040] An exploded view of the electronic device shown in FIG. 1; Figure 7 An exploded view of the electronic device shown in FIG. 1;

[0041] Figure 8 An exploded view of the electronic device shown in FIG. 1; Figure 7 An exploded view of the electronic device shown in FIG. 1;

[0042] Figure 9A schematic diagram of the assembly structure of a circuit board and a flashlight in an electronic device provided in some other embodiments of the present application;

[0043] Figure 10 for Figure 9 The schematic diagram of the structure of the flash module in the assembly structure shown is as follows; specifically, Figure 10 (a) is a schematic diagram of the structure of the flash module on the first surface. Figure 10 (b) is a schematic structural diagram of the flash module on the second surface;

[0044] Figure 11 for Figure 10 The schematic diagram of the structure of the elevated plate in the flash module shown in FIG. Figure 11 (a) is a schematic structural diagram of the first surface of the elevated plate. Figure 11 (b) is a schematic structural diagram of the second surface of the elevated plate;

[0045] Figure 12 for Figure 10 Another schematic diagram of the assembly structure of the flash module and the circuit board is shown;

[0046] Figure 13 for Figure 10 A schematic structural diagram of the first surface of the flash module shown;

[0047] Figure 14 A schematic structural diagram of a first surface of a flash module provided in some further embodiments of the present application;

[0048] Figure 15 A schematic structural diagram of a first surface of a flash module provided in some further embodiments of the present application;

[0049] Figure 16 A schematic structural diagram of a first surface of a flash module provided in some further embodiments of the present application;

[0050] Figure 17 A schematic diagram of the structure of a circuit board provided in some embodiments of the present application;

[0051] Figure 18 This is a schematic structural diagram of a circuit board provided in some further embodiments of the present application. DETAILED DESCRIPTION

[0052] In the embodiments of the present application, the terms "first", "second", "third", "fourth", "fifth", "sixth", "seventh", "eighth" and "ninth" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second", "third", "fourth", "fifth", "sixth", "seventh", "eighth" and "ninth" can be explicitly or implicitly included one or more of the features.

[0053] In the embodiments of the present application, it should be understood that the terms "upper", "lower", "left", "right", etc. indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0054] In the embodiments of the present application, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or device including the element.

[0055] In the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting" should be understood broadly, for example, "connecting" can be detachable connection or non-detachable connection; can be direct connection or indirect connection through intermediate medium. Among them, "fixed connection" means that the relative positional relationship after connection is unchanged.

[0056] In the embodiments of the present application, "and / or" is only a description of the association relationship between the associated objects, which means that there can be three kinds of relationships, for example, A and / or B can represent the existence of A alone, the existence of A and B at the same time, and the existence of B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects have an "or" relationship.

[0057] In the embodiments of the present application, it should be noted that the descriptions of "symmetry", "perpendicularity", "coincidence" all represent approximately symmetry, approximately perpendicularity, approximately coincidence within a certain error range.

[0058] In order to save the circuit board space and reduce the risk of circuit board short circuit, an interface of a flash is arranged on the circuit board in the electronic device provided by the embodiment of the present application. On this basis, a raised plate is arranged between the circuit board and the flash, the raised plate has two opposite surfaces, the two surfaces are both provided with the flash and an external port, the flash of one surface is electrically connected with the external port of the other surface, the flash of the other surface is electrically connected with the external port of the one surface, the external ports of the two surfaces can be adapted with the flash interface on the circuit board, when the external ports of the two surfaces are adapted with the flash interface on the circuit board respectively, the positions of the flash relative to the flash interface are different, therefore, the flash of the two surfaces can be used respectively to adapt to two different models of electronic devices, thereby achieving the purpose of reducing the development cost of the circuit board.

[0059] The embodiments of the present application will be described in detail below with reference to the drawings, and before the embodiments of the present application are described, the application scenarios of the present application will be first introduced.

[0060] The present application provides an electronic device, which is a kind of electronic device with a photographing function. Specifically, the electronic device can be a portable electronic device or other suitable electronic device. For example, the electronic device can be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses or a VR helmet, etc.

[0061] Please refer to Figure 1 , Figure 1 A perspective view of an electronic device 100 provided by some embodiments of the present application is shown. The present embodiment and the following embodiments are exemplarily described by taking the electronic device 100 as a mobile phone. The electronic device 100 is approximately in the shape of a rectangular plate. On this basis, in order to facilitate the description of the following embodiments, an XYZ coordinate system is established, and the width direction of the electronic device 100 is defined as the X-axis direction, the length direction of the electronic device 100 is defined as the Y-axis direction, and the thickness direction of the electronic device 100 is defined as the Z-axis direction. It can be understood that the coordinate system of the electronic device 100 can be flexibly set according to actual needs, which is not specifically limited here. In some other embodiments, the shape of the electronic device 100 can also be a square flat plate, a circular flat plate, an elliptical flat plate, etc., which is not specifically limited here.

[0062] Please refer to Figure 1 andFigure 2 , Figure 2 for Figure 1 Exploded view of the electronic device 100. In this embodiment, the electronic device 100 includes a screen 10, a back cover 20, a circuit board 30, a camera 40 and a flash 50.

[0063] It is understandable that Figure 1 and Figure 2 Only some components of the electronic device 100 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not affected by the present invention. Figure 1 and Figure 2 In some other examples, the electronic device 100 may not include the screen 10.

[0064] The screen 10 is used to display images, videos, etc. The screen 10 includes a transparent cover plate 11 and a display screen 12 (English name: panel, also called display panel). The transparent cover plate 11 and the display screen 12 are stacked. The transparent cover plate 11 is mainly used to protect the display screen 12 and prevent dust. The material of the transparent cover plate 11 includes but is not limited to glass. The display screen 12 can be a flexible display screen or a rigid display screen. For example, the display screen 12 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MLE) display screen, a micro organic light-emitting diode (MLE) display screen, a micro organic light-emitting diode (MLE) display screen, a quantum dot light emitting diode (QLED) display screen, or a liquid crystal display (LCD).

[0065] The back shell 20 is used to protect the internal electronic devices of the electronic device 100. The back shell 20 can include a back cover 21 and a frame 22. The back cover 21 is located on the side of the display screen 12 away from the light-transmitting cover plate 11 and is stacked with the light-transmitting cover plate 11 and the display screen 12. The frame 22 is located between the back cover 21 and the light-transmitting cover plate 11. The frame 22 is fixed to the back cover 21. For example, the frame 22 can be fixed to the back cover 21 by adhesive. Alternatively, the frame 22 can be integrally formed with the back cover 21, i.e., the frame 22 and the back cover 21 are one structural member. The light-transmitting cover plate 11 is fixed to the frame 22 by adhesive. The light-transmitting cover plate 11, the back cover 21 and the frame 22 enclose an internal accommodating space of the electronic device 100. The internal accommodating space accommodates the display screen 12, the circuit board 30, the camera 40 and the flash 50.

[0066] The circuit board 30 is fixed inside the electronic device 100. Specifically, the circuit board 30 can be fixed to the side of the display screen 12 facing the back cover 21. In other embodiments, please refer to Figure 2 , the electronic device 100 can further include a middle plate 23, the edge of the middle plate 23 is fixed to the inner surface of the frame 22. On this basis, the circuit board 30 can be fixed to the surface of the middle plate 23 facing the back cover 21. The circuit board 30 can be used to set chips. For example, the chips can be central processing units (CPUs), graphics processing units (GPUs) and universal flash storage (UFS) and the like.

[0067] The camera 40 is used to take photos / videos. The flash 50 is used to provide light to facilitate the camera 40 to take photos or videos in a dim environment. The camera 40 and the flash 50 are arranged on the circuit board 30. In some embodiments, please refer to Figure 2 , the camera 40 and the flash 50 are arranged at the middle part of the circuit board 30 in the X-axis direction. In other embodiments, the camera 40 and the flash 50 can also be arranged at the left end or the right end of the circuit board 30 in the X-axis direction. The present embodiment and the following embodiments are exemplarily described with the camera 40 and the flash 50 arranged at the middle part of the circuit board 30 in the X-axis direction.

[0068] With the improvement of the performance of the camera 40, such as the improvement of the shooting resolution, at least one camera 40 (such as a main camera) includes more components, and the height of the at least one camera 40 in the Z-axis direction is larger. On this basis, in order to realize the thinness of the electronic device 100, please refer to Figure 3 , Figure 3 Figure 2 ​The figure shows an exploded view of the camera 40 and the circuit board 30 in the electronic device 100. An avoidance opening 30a is provided on the circuit board 30 at a position corresponding to the at least one camera 40. The at least one camera 40 is arranged in the avoidance opening 30a to avoid high overlap of the circuit board 30 and the camera 40 in the Z-axis direction, thereby facilitating the thinning of the electronic device 100.

[0069] The back cover 21 is provided with a mounting opening 60, into which a camera decorative member 70 is mounted. The camera decorative member 70 serves to protect and decorate the camera 40 and the flash 50. Light-transmitting windows 70a are provided in the areas of the camera decorative member 70 that face the camera 40 and the flash 50. The camera decorative member 70 may partially protrude from the outer surface of the back cover 21, or it may be flush with the outer surface of the back cover 21.

[0070] As users' requirements for image clarity, angle, and distance increase, electronic devices 100 are often not limited to just one camera 40. For example, two, three, or four cameras 40 may be used. The number and arrangement of cameras 40 may vary for different models of electronic devices 100. To provide simultaneous fill light for multiple cameras 40, the distance between the flash 50 and the cameras 40 should be as equal as possible. Therefore, depending on the number and arrangement of cameras 40, the flash 50 may be positioned differently on the circuit board 30.

[0071] For examples, see Figure 4 , Figure 4 for Figure 2 The arrangement diagram of the camera 40 and the flash 50 on the circuit board 30 in the electronic device 100 is shown. In this embodiment, there are three cameras 40, and the three cameras 40 and the flash 50 are arranged in a square. In this way, the distance between the flash 50 and the three cameras 40 is uniform, and the fill light effect is better.

[0072] For another example, see Figure 5 , Figure 5 This is a diagram illustrating the arrangement of the camera 40 and flash 50 on the circuit board 30 within the electronic device 100 provided in some embodiments of the present application. In this embodiment, there are two cameras 40, and the two cameras 40 and the flash 50 are arranged in a triangle. This ensures a uniform distance between the flash 50 and the two cameras 40, resulting in a better fill light effect.

[0073] contrast Figure 4 and Figure 5 The arrangement of the cameras 40 and the flash 50 in the two different models of electronic devices 100 is shown. For different models of electronic devices 100, after the number of cameras 40 is reduced from three to two, the setting position of the flash 50 is moved upward to a certain extent.

[0074] On the basis of the above, please refer to Figure 6 , Figure 6 is a front view of the circuit board 30 in the electronic device 100 provided by some embodiments of the present application. The circuit board 30 is provided with a flash interface 31. The flash interface 31 can have various structural forms, such as a spring interface, a plug interface, a pad interface, etc., which are not specifically limited here. The flash interface 31 is used for electrically connecting the flash 50 and corresponds to the position of the flash 50. For different models of electronic devices 100, the position of the flash 50 is different, and the setting position of the flash interface 31 on the circuit board 30 is also different. However, for electronic devices of the same type but different models, the processor, memory and other hardware structures on the circuit board 30 can be the same. On this basis, in order to reduce the development cost of the circuit board 30, a circuit board that can be applied to electronic devices of different models can be designed. Specifically, a plurality of flash interfaces 31 with different positions can be provided on the circuit board 30 to adapt to the electrical connection requirements of flashes 50 with different positions, thereby being used for electronic devices of different models.

[0075] For example, please continue to refer to Figure 6 , the circuit board 30 is provided with two flash interfaces 31, which are used to adapt to the electrical connection requirements of two flashes 50 with different positions. However, with the increase in the number of flash interfaces 31, the area occupied on the circuit board 30 is larger, which wastes resources. Moreover, in the electronic device 100, when the flash 50 is electrically connected to one of the flash interfaces 31, the other flash interfaces 31 are idle and exposed, which has the risk of short circuit.

[0076] In order to reduce the development cost of the circuit board 30, save the space of the circuit board 30 and reduce the risk of short circuit, one flash interface 31 can be provided on the circuit board 30, and different height boards are connected to the one flash interface 31, and the flashes are provided on the height boards. When the flash interface 31 is connected to different height boards, the positions of the flashes 50 on the height boards relative to the flash interface 31 are different. For example, please refer to Figure 7 and Figure 8 , Figure 7 is an assembly view of the circuit board 30 and a height board 80 in the electronic device 100 provided by some embodiments of the present application, Figure 8 is Figure 7As shown in the assembly structure of the circuit board 30 and another elevated board 80, the relative positions of the flash 50 on the two elevated boards 80 and the flash interface 31 are different when the flash interface 31 on the circuit board 30 is connected to the two elevated boards 80 respectively. Thus, the development cost of the circuit board 30 is reduced, the area of the flash interface 31 on the circuit board 30 is reduced, the space of the circuit board 30 is saved, and the risk of short circuit of the flash interface 31 is reduced. However, in this way, manufacturers need to design or purchase different elevated boards when manufacturing different models of electronic devices, which is of high design cost and is not convenient for unified transportation and management.

[0077] To avoid the above problems, please refer to Figure 9 , Figure 9 The assembly structure of the circuit board 30 and the flash in the electronic device 100 provided by some embodiments of the present application is shown in the schematic view. In the embodiment, the electronic device 100 further comprises a flash module 300, which is electrically connected to the circuit board 30.

[0078] Specifically, please refer to Figure 10 , Figure 10 For Figure 9 The structure of the flash module 300 in the assembly structure is shown in the schematic view. The flash module 300 comprises an elevated board 80, a first flash 51 and a second flash 52.

[0079] Please refer to Figure 11 , Figure 11 For Figure 10 The structure of the elevated board 80 in the flash module 300 is shown in the schematic view. The elevated board 80 comprises a board body 81, a first external port 83 and a second external port 85.

[0080] The board body 81 is used to carry the first flash 51, the second flash 52, the first external port 83 and the second external port 85. The shape of the board body 81 includes but is not limited to a rectangle, a circle, a square, a polygon, an ellipse or Figure 11 an irregular shape as shown. The board body 81 comprises a first surface A and a second surface B opposite to each other. Specifically, Figure 11 (a) in the above is a schematic view of the first surface A of the elevated board 80, Figure 11 (b) in the above is a schematic view of the second surface B of the elevated board 80. Figure 10 (a) in the above is a schematic view of the first surface A of the flash module 300, Figure 10 (b) in the above is a schematic view of the second surface B of the flash module 300.

[0081] In some embodiments, the structure of the board body 81 may be the same as that of the circuit board. Specifically, the board body 81 may include a multi-layer wiring structure and metallized vias arranged in the multi-layer wiring structure. The multi-layer wiring structure is formed by metal layers and insulating dielectric layers alternately arranged in sequence, wherein the metal layers and the metallized vias can realize electrical connection between multiple pads on the board body 81.

[0082] The first flashlight 51 is disposed on the first surface A. Specifically, the first flashlight 51 is located on the side of the first surface A away from the second surface B. The first flashlight 51 can be directly disposed on the first surface A or disposed on the first surface A via a port. In some embodiments, see Figure 11 In (a), the elevated plate 80 further includes a first flashlight port 82, which is disposed on the plate body 81 and electrically connected to the first flashlight 51. The first flashlight port 82 can have various structural forms, such as a plug-in port or a solder pad port, which are not specifically limited herein. This embodiment and the following embodiments illustrate the first flashlight port 82 as a solder pad port.

[0083] In some embodiments, the first flash lamp port 82 includes a first flash lamp positive terminal 821 and a first flash lamp negative terminal 822. The first flash lamp positive terminal 821 is used to electrically connect to the positive electrode of the first flash lamp 51, and the first flash lamp negative terminal 822 is used to electrically connect to the negative electrode of the first flash lamp 51. In other embodiments, the first flash lamp port 82 may include other terminals in addition to the first flash lamp positive terminal 821 and the first flash lamp negative terminal 822, which are not specifically limited herein.

[0084] The first flash lamp positive terminal 821 and the first flash lamp negative terminal 822 are both solder pads disposed on the surface of the plate 81. The solder pads can be in the shape of a circle, square, rectangle, polygon, oval, or the like. This embodiment is described as an example in which the solder pads are generally rectangular. Based on this, the first flash lamp positive terminal 821 and the first flash lamp negative terminal 822 can be disposed on the first surface A for soldering the first flash lamp 51 using surface mount technology, or they can be disposed on the second surface B for soldering the first flash lamp 51 using plug-in technology. This is sufficient as long as the first flash lamp 51 electrically connected thereto is located on the side of the first surface A away from the second surface B. This embodiment and the following embodiments are described as an example in which the first flash lamp positive terminal 821 and the first flash lamp negative terminal 822 are disposed on the first surface A for soldering the first flash lamp 51 using surface mount technology.

[0085] The first external port 83 is used to connect to the flash interface 31 on the aforementioned circuit board 30. The first external port 83 is arranged on the second surface B and is electrically connected to the first flash 51. In some embodiments, the first external port 83 can be electrically connected to the first flash 51 with the help of the metal layer and metallized vias in the board body 81. When the elevated plate 80 includes the first flash port 82, the first external port 83 can be electrically connected to the first flash port 82 with the help of the metal layer and metallized vias in the board body 81, and further electrically connected to the first flash 51 with the help of the first flash port 82. Specifically, the metal layer and metallized vias in the board body 81 can be designed according to the position of the connected object, which will not be elaborated here.

[0086] The first external connection port 83 can have various structural forms, such as a plug-in port or a solder pad port, which are not specifically limited here. This embodiment and the following embodiments are exemplified by taking the first external connection port 83 as a solder pad port.

[0087] In some embodiments, the first external connection port 83 includes a first external positive terminal 831 and a first external negative terminal 832. Both the first external positive terminal 831 and the first external negative terminal 832 are solder pads disposed on the second surface B of the plate body 81. The solder pads can have shapes such as circular, square, rectangular, polygonal, or elliptical. This embodiment uses a substantially rectangular solder pad for illustrative purposes. The first external positive terminal 831 is electrically connected to the positive electrode of the first flashlight 51, and the first external negative terminal 832 is electrically connected to the negative electrode of the first flashlight 51. When the elevated plate 80 includes the first flashlight port 82, the first external positive terminal 831 is electrically connected to the first flashlight positive terminal 821, which is electrically connected to the positive electrode of the first flashlight 51; the first external negative terminal 832 is electrically connected to the first flashlight negative terminal 822, which is electrically connected to the negative electrode of the first flashlight 51.

[0088] In some other embodiments, the first external connection port 83 may include other terminals in addition to the first external positive terminal 831 and the first external negative terminal 832 , which are not specifically limited herein.

[0089] See also Figure 10 In (b), the second flashlight 52 is disposed on the second surface B. Specifically, the second flashlight 52 is located on the side of the second surface B away from the first surface A. The second flashlight 52 can be directly disposed on the second surface B or can be disposed on the second surface B via a port. In some embodiments, see Figure 11In (b) of FIG. 8, the elevated board 80 further comprises a second flash port 84, which is disposed on the board body 81 and to which the second flash 52 is electrically connected. The second flash port 84 can have various structural forms, such as a plug-in port or a pad port, which is not specifically limited herein. The embodiments of the present application and the following embodiments are exemplarily described with the second flash port 84 as a pad port.

[0090] In some embodiments, the second flash port 84 comprises a second flash positive terminal 841 and a second flash negative terminal 842. The second flash positive terminal 841 is used to electrically connect the positive pole of the second flash 52, and the second flash negative terminal 842 is used to electrically connect the negative pole of the second flash 52. In other embodiments, the second flash port 84 can comprise other terminals in addition to the second flash positive terminal 841 and the second flash negative terminal 842, which is not specifically limited herein.

[0091] The second flash positive terminal 841 and the second flash negative terminal 842 are both pads disposed on the surface of the board body 81. The pads can have various shapes, such as circular, square, rectangular, polygonal, oval, etc. The embodiments of the present application are exemplarily described with the pads having a substantially rectangular shape. On this basis, the second flash positive terminal 841 and the second flash negative terminal 842 can be disposed on the second surface B to solder the second flash 52 by surface mounting technology, or can be disposed on the first surface A to solder the second flash 52 by plug-in technology, as long as the second flash 52 electrically connected thereto is located on the side of the second surface B away from the first surface A. The embodiments of the present application and the following embodiments are exemplarily described with the second flash positive terminal 841 and the second flash negative terminal 842 disposed on the second surface B to solder the second flash 52 by surface mounting technology.

[0092] The second external port 85 is also used to connect with the flash interface 31 on the aforementioned circuit board 30. The second external port 85 is disposed on the first surface A and is electrically connected with the second flash 52. In some embodiments, the second external port 85 can be electrically connected with the second flash 52 by means of the metal layer and the metalized via in the board body 81. When the elevated board 80 comprises the second flash port 84, the second external port 85 can be electrically connected with the second flash port 84 by means of the metal layer and the metalized via in the board body 81, and further electrically connected with the second flash 52 by means of the second flash port 84.

[0093] The structure of the second external port 85 can be various, such as a plug-in port, or a pad port, which is not limited here. The second external port 85 is exemplarily taken as a pad port in the embodiment and the following embodiments.

[0094] In some embodiments, the second external port 85 includes a second external positive terminal 851 and a second external negative terminal 852. The second external positive terminal 851 and the second external negative terminal 852 are both pads arranged on the first surface A of the plate body 81. The shape of the pad can be circular, square, rectangular, polygonal, oval, etc. The shape of the pad is exemplarily taken as approximately rectangular in the embodiment. The second external positive terminal 851 is electrically connected with the positive electrode of the second flash lamp 52, and the second external negative terminal 852 is electrically connected with the negative electrode of the second flash lamp 52. When the elevated plate 80 includes the second flash lamp port 84, the second external positive terminal 851 is electrically connected with the second flash lamp positive terminal 841, which is electrically connected with the positive electrode of the second flash lamp 52; and the second external negative terminal 852 is electrically connected with the second flash lamp negative terminal 842, which is electrically connected with the negative electrode of the second flash lamp 52.

[0095] In other embodiments, the second external port 85 can include other terminals in addition to the second external positive terminal 851 and the second external negative terminal 852, which is not limited here.

[0096] The first external port 83 is the same as the second external port 85. Here, the same means that the two ports respectively include the same number of terminals, the functions of the terminals are the same, and the relative positions of the terminals with different functions in each port are the same. The structure of the terminals with the same function from the two ports can be the same or different.

[0097] For example, please refer to Figure 10The first external port 83 and the second external port 85 each include two terminals, and thus the number of included terminals is equal. The two terminals included in the first external port 83 are a first external positive terminal 831 and a first external negative terminal 832, respectively. The two terminals included in the second external port 85 are a second external positive terminal 851 and a second external negative terminal 852, respectively. Thus, the functions of the terminals are the same. The positions of the first external negative terminal 832 relative to the first external positive terminal 831 and the second external negative terminal 852 relative to the second external positive terminal 851 are substantially the same, and thus the relative positions between terminals of different functions are substantially the same. The structure of the first external positive terminal 831 can be substantially the same as or different from that of the second external positive terminal 851. The structure of the first external negative terminal 832 can be substantially the same as or different from that of the second external negative terminal 852.

[0098] In this way, the flash interface 31 is designed on the aforementioned circuit board 30, and is adapted to the first external port 83 and the second external port 85. Thus, the area of the flash interface 31 on the circuit board 30 can be reduced, the space of the circuit board 30 can be saved, and the risk of short circuit of the flash interface 31 can be reduced.

[0099] Based on the above, please continue to refer to Figure 10 Suppose that the orthographic projection of the first flash 51 on the second surface B is a first projection K1, and the orthographic projection of the second flash 52 on the first surface A is a second projection K2. The position of the first projection K1 on the second surface B relative to the first external port 83 is different from the position of the second projection K2 on the first surface A relative to the second external port 85. Since the relative positions between terminals of different functions in the first external port 83 are the same as those in the second external port 85, the meaning that the position of the first projection K1 on the second surface B relative to the first external port 83 is different from the position of the second projection K2 on the first surface A relative to the second external port 85 is that the orientation of the first projection K1 on the second surface B relative to the plurality of terminals in the first external port 83 is different from the orientation of the second projection K2 on the first surface A relative to the plurality of terminals in the second external port 85, and / or the distance from the first projection K1 to the first external port 83 is different from the distance from the second projection K2 to the second external port 85.

[0100] In Figure 10In the illustrated embodiment, the first projection K1 on the second surface B is located at the upper right position of the plurality of terminals in the first external port 83, and the second projection K2 on the first surface A is located at the lower right position of the plurality of terminals in the second external port 85, so the orientations are different. At the same time, the distance from the first projection K1 on the second surface B to the first external port 83 is greater than the distance from the second projection K2 on the first surface A to the second external port 85, so the distances are also different.

[0101] In this way, when Figure 10 When the flash module 300 shown is installed on the circuit board 30 in the electronic device 100, the first external port 83 and the second external port 85 are respectively facing the flash interface 31 on the aforementioned circuit board 30, and when they are electrically connected with the flash interface 31, the first flash 51 and the second flash 52 located on the side away from the board body 81 and away from the circuit board 30 are used for fill light, and the positions of the first flash 51 and the second flash 52 relative to the flash interface 31 are different.

[0102] There are two assembly methods as follows. For one assembly method, please refer to Figure 9 The plate body 81 of the elevated plate 80 in the flash module 300 is stacked with the circuit board 30, and the first surface A of the plate body 81 is disposed opposite to the circuit board 30, and the second surface B of the elevated plate 80 ( Figure 9 ) is disposed toward the circuit board 30, and the first external connection port 83 ( Figure 9 Not shown) is electrically connected to the flash interface 31, the first flash 51 of the flash module 300 is located on the side of the elevated plate 80 away from the circuit board 30, and the second flash 52 of the flash module ( Figure 9 (not shown) is located between the plate body 81 and the circuit board 30. In this assembly mode, the first flash lamp 51 is used to light up to play the role of fill light, and the second flash lamp 52 is not used for fill light.

[0103] For another assembly method, please refer to Figure 12 , Figure 12 for Figure 10 The schematic diagram of another assembly structure of the flash module 300 and the circuit board 30 is shown. The plate body 81 of the elevated plate 80 in the flash module 300 is stacked with the circuit board 30. The second surface B of the plate body 81 is arranged to face away from the circuit board 30. The first surface A ( Figure 12 ) is disposed toward the circuit board 30, and the second external connection port 85 ( Figure 12 ) is electrically connected to the flashlight interface 31, and the first flashlight 51 ( Figure 12The second flash 52 of the flash module is located on the side of the elevated board 80 away from the circuit board 30. In this assembly mode, the second flash 52 is used for lighting to play a role of fill light, and the first flash 51 is not used for fill light. Under the premise that the position of the flash interface 31 is fixed, Figure 9 In the assembly structure shown, the position of the first flash 51 is located Figure 12 In the assembly structure shown, the position of the second flash 52 is below the position of the first flash 51, so that the positions of the two are different, which can adapt to two different models of electronic devices, so that one elevated board 80 can adapt to two different models of electronic devices, which can save design cost and facilitate unified transportation and management.

[0104] In the above embodiment, when the first external positive terminal 831, the first external negative terminal 832, the second external positive terminal 851, and the second external negative terminal 852 are all pads arranged on the surface of the board body 81, the structure of the elevated board 80 is simple and occupies small space. Similarly, when the elevated board 80 includes the first flash port 82 and the second flash port 84, and the first flash positive terminal 821, the first flash negative terminal 822, the second flash positive terminal 841, and the second flash negative terminal 842 are all pads arranged on the surface of the board body 81, the structure of the elevated board 80 is simple and occupies small space.

[0105] When the first flash positive terminal 821 and the first flash negative terminal 822 are arranged on the first surface A of the board body 81, and the second flash positive terminal 841 and the second flash negative terminal 842 are arranged on the second surface B of the board body 81, the first flash 51 and the second flash 52 can be respectively soldered on the first flash port 82 and the second flash port 84 by surface mounting technology, which has high efficiency and can improve the processing efficiency of the flash module.

[0106] When the elevated board 80 includes the first flash port 82 and the second flash port 84, the connection operation of the first flash 51 and the second flash 52 on the board body 81 is convenient, and the processing efficiency of the flash module 300 is high. When the elevated board 80 includes the first flash port 82 and the second flash port 84, the first flash positive terminal 821 and the first flash negative terminal 822 of the first flash port 82 correspond to the position of the first flash 51, and the second flash positive terminal 841 and the second flash negative terminal 842 of the second flash port 84 correspond to the position of the second flash 52. Therefore, please refer to Figure 11, assuming that the first flash port 82 has a seventh projection K7 on the orthographic projection of the second surface B, and the second flash port 84 has an eighth projection K8 on the orthographic projection of the first surface A. The position of the seventh projection K7 on the second surface B relative to the first outer port 83 is different from the position of the eighth projection K8 on the first surface A relative to the second outer port 85.

[0107] During the installation of the flash module 300 on the circuit board 30, the flash module 300 needs to be flipped over sometimes, so that the first outer port 83 and the second outer port 85 are aligned with the flash interface 31 on the circuit board 30 in turn, to determine the correct assembly mode, so as to adapt to the target model of electronic equipment.

[0108] In order to improve the efficiency of the above installation process, in some embodiments, assuming that the first outer positive terminal 831 has a third projection K3 on the orthographic projection of the first surface A, and the first outer negative terminal 832 has a fourth projection K4 on the orthographic projection of the first surface A. Please refer to Figure 13 , Figure 13 For Figure 10 the first surface A of the flash module 300 shown in the structural schematic view, the third projection K3 and the second outer positive terminal 851 are arranged in the occupied area of the first surface A about the first axis L1. On this basis, the fourth projection K4 and the second outer negative terminal 852 are also arranged in the occupied area of the first surface A about the first axis L1. In this way, the flash module 300 is flipped around the first axis L1, so that the first outer port 83 and the second outer port 85 are aligned with the flash interface 31 on the circuit board 30 in turn, to determine the correct assembly mode, which is convenient and efficient, and can improve the installation efficiency of the flash module 300 on the circuit board 30.

[0109] In some embodiments, when the flash module 300 is applied in the electronic equipment 100, please continue to refer to Figure 13 , the extension direction of the first axis L1 can be substantially consistent with the width direction (that is, the X-axis direction) of the electronic equipment 100. In other embodiments, when the flash module 300 is applied in the electronic equipment 100, the extension direction of the first axis L1 can also be substantially consistent with the length direction (that is, the Y-axis direction) of the electronic equipment 100, or be inclined relative to the X-axis direction or the Y-axis direction, which is not limited here.

[0110] Specifically, the third projection K3 and the second outer positive terminal 851 are arranged in the occupied area of the first surface A about the first axis L1, and the fourth projection K4 and the second outer negative terminal 852 are also arranged in the occupied area of the first surface A about the first axis L1, including the following four possible implementation modes, which are the first implementation mode to the fourth implementation mode.

[0111] In a first implementation, refer to Figure 13 , the center O1 of the third projection K3 does not coincide with the center O2 of the second outer positive terminal 851 in the occupied area of the first surface A, and the center O3 of the fourth projection K4 does not coincide with the center O4 of the second outer negative terminal 852 in the occupied area of the first surface A. It should be noted that the centers described in the present embodiment and the following embodiments each refer to a geometric center. The first axis L1 is a straight line that passes through the midpoint of the line segment between the center O1 of the third projection K3 and the center O2 of the second outer positive terminal 851 in the occupied area of the first surface A and is perpendicular to the line segment, and the center O3 of the fourth projection K4 and the center O4 of the second outer negative terminal 852 in the occupied area of the first surface A are arranged approximately symmetrically about the first axis L1.

[0112] In this way, the first outer positive terminal 831 and the second outer positive terminal 851 are arranged in a staggered manner, and the first outer negative terminal 832 and the second outer negative terminal 852 are arranged in a staggered manner, thereby reducing the risk of short circuit between the two.

[0113] On the basis of the implementation described above, the center O1 of the third projection K3 and the center O3 of the fourth projection K4 can be located on the same side of the first axis L1 or on opposite sides of the first axis L1. In some embodiments, refer to Figure 13 , the center O1 of the third projection K3 and the center O3 of the fourth projection K4 are located on the same side of the first axis L1, and the center O2 of the second outer positive terminal 851 in the occupied area of the first surface A and the center O4 of the second outer negative terminal 852 in the occupied area of the first surface A are also located on the other side of the first axis L1. This structure is simple and easy to implement.

[0114] In a second implementation, refer to Figure 14 , Figure 14 Fig. 6 is a structural schematic view of the first surface A of the flash module 300 provided in some embodiments of the present application, the center O1 of the third projection K3 approximately coincides with the center O2 of the second outer positive terminal 851 in the occupied area of the first surface A, and the center O3 of the fourth projection K4 also approximately coincides with the center O4 of the second outer negative terminal 852 in the occupied area of the first surface A. The first axis L1 is a straight line that passes through the center O1 of the third projection K3 and the center O3 of the fourth projection K4.

[0115] In this way, the first outer positive terminal 831 and the second outer positive terminal 851 are arranged in a direct manner, and the first outer negative terminal 832 and the second outer negative terminal 852 are arranged in a direct manner, and the first outer port 83 and the second outer port 85 occupy the same area on the board 81, thereby facilitating reduction of the setting area of the board 81 and facilitating installation on the circuit board 30.

[0116] In the third implementation, refer to Figure 15 , In the third implementation, refer to Figure 15 The structural diagram of the first surface A of the flash module 300 provided by some other embodiments of the present application is shown in FIG. 3C. The center O1 of the third projection K3 does not coincide with the center O2 of the second outer positive terminal 851 in the occupied area of the first surface A, and the center O3 of the fourth projection K4 substantially coincides with the center O4 of the second outer negative terminal 852 in the occupied area of the first surface A. The first axis L1 is a straight line that passes through the midpoint of the line connecting the center O1 of the third projection K3 and the center O2 of the second outer positive terminal 851 in the occupied area of the first surface A and is perpendicular to the line, and the center O3 of the fourth projection K4 is located on the first axis L1.

[0117] In the fourth implementation, refer to Figure 16 , In the fourth implementation, refer to Figure 16 The structural diagram of the first surface A of the flash module 300 provided by some other embodiments of the present application is shown in FIG. 3D. The center O1 of the third projection K3 substantially coincides with the center O2 of the second outer positive terminal 851 in the occupied area of the first surface A, and the center O3 of the fourth projection K4 does not coincide with the center O4 of the second outer negative terminal 852 in the occupied area of the first surface A. The first axis L1 is a straight line that passes through the midpoint of the line connecting the center O3 of the fourth projection K4 and the center O4 of the second outer negative terminal 852 in the occupied area of the first surface A and is perpendicular to the line, and the center O1 of the third projection K3 is located on the first axis L1.

[0118] In the first, third and fourth implementations described above, the third projection K3 and the fourth projection K4 can be arranged substantially along the first axis L1, or can be arranged substantially along a direction perpendicular to the first axis L1. Figure 13 、 Figure 15 and Figure 16 The example in which the third projection K3 and the fourth projection K4 are arranged substantially along the first axis L1 is not considered as a special limitation to the present application. In addition, it should be noted that the first to fourth implementations described above respectively illustrate four types of arrangement of the terminals of the first outer port 83 and the second outer port 85, which are used to adapt to the flash interface 31 on the circuit board 30 in the electronic device, and thus in the actual design process, the arrangement of the terminals in the first outer port 83 and the second outer port 85 can be designed according to the arrangement of the terminals in the flash interface 31 on the circuit board 30.

[0119] In some embodiments, refer to Figure 13-16, assuming that the orthographic projection of the first external port 83 on the first surface A is a sixth projection, the sixth projection including the third projection K3 and the fourth projection K4. The sixth projection at least partially overlaps the second external port 85 (including the second external positive terminal 851 and the second external negative terminal 852) in the occupied area of the first surface A. The overlap includes the following two ways. The first way of overlap, when the third projection K3 and the fourth projection K4 are arranged approximately along the first axis L1, as shown in Figure 13-16 , the third projection K3 at least partially overlaps the second external positive terminal 851 in the occupied area of the first surface A, and / or, the fourth projection K4 at least partially overlaps the second external negative terminal 852 in the occupied area of the first surface A. The second way of overlap, when the third projection K3 and the fourth projection K4 are arranged approximately along a direction perpendicular to the first axis L1, the third projection K3 can at least partially overlap the second external negative terminal 852 in the occupied area of the first surface A, and / or, the fourth projection K4 can at least partially overlap the second external positive terminal 851 in the occupied area of the first surface A. In this way, the first external port 83 and the second external port 85 occupy the same area on the board 81, thus facilitating the reduction of the setting area of the board 81 and facilitating the installation on the circuit board 30.

[0120] In some embodiments, please continue to refer to Figure 13-16 , assuming that the orthographic projection of the first flash 51 on the first surface A is a fifth projection K5, the fifth projection K5 and the second projection K2 are located on the same side of the first axis L1. For example Figure 13-16 , the fifth projection K5 and the second projection K2 are both located on the lower side of the first axis L1. In this way, when the flash module 300 is flipped around the first axis L1 so that the first external port 83 and the second external port 85 are aligned with the flash interface 31 on the circuit board 30 in turn, the second flash 52 can be flipped to the upper side of the first axis L1 to adapt to two different models of electronic devices. On the premise that the positions of the flashes on the two different models of electronic devices are deviated in the direction perpendicular to the first axis L1 by a certain amount, the distances from the first flash 51 to the first external port 83 and from the second flash 52 to the second external port 85 can both be designed to be relatively short in the direction perpendicular to the first axis L1, thus facilitating the reduction of the area of the elevated board 80 in the flash module 300 and facilitating the installation on the circuit board 30.

[0121] On the basis of the above, optionally, please refer to Figure 13The absolute value of the difference between the vertical distance d1 of the fifth projection K5 to the first axis L1 and the vertical distance d2 of the second projection K2 to the first axis L1 is less than or equal to 1 mm. In this way, the first flash lamp 51 and the second flash lamp 52 are arranged substantially flush, which is conducive to further reducing the area of the heightening plate 80 in the flash lamp module 300, so as to facilitate installation on the circuit board 30.

[0122] On the basis of the above, when the heightening plate 80 comprises the first flash lamp port 82 and the second flash lamp port 84, please continue to refer to Figure 11 The first flash lamp port 82 has a ninth projection (not shown in the figure) on the orthographic projection of the first surface A, and the ninth projection and the eighth projection K8 are located on the same side of the first axis L1. In this way, it is conducive to reducing the area of the heightening plate 80 in the flash lamp module 300, facilitating installation on the circuit board 30.

[0123] In some embodiments, please continue to refer to Figure 13 The plate body 81 comprises a first portion 811 and a second portion 812. The first portion 811 and the second portion 812 are substantially rectangular regions, and in other embodiments, the first portion 811 and the second portion 812 can also be circular regions, square regions, elliptical regions, polygonal regions, etc. The first circumscribed port 83 and the second circumscribed port 85 are arranged on the first portion 811, and the first flash lamp 51 and the second flash lamp 52 are arranged on the second portion 812. The arrangement direction of the first portion 811 and the second portion 812 is arranged obliquely relative to the first axis L1. In this way, it is conducive to further reducing the area of the heightening plate 80 in the flash lamp module 300, facilitating installation on the circuit board 30.

[0124] In the above embodiment, when the heightening plate 80 comprises the first flash lamp port 82 and the second flash lamp port 84, the first flash lamp port 82 and the second flash lamp port 84 are also arranged on the second portion 812.

[0125] In some embodiments, please return to refer to Figure 10 The first projection K1 and the second projection K2 are both rectangular, and in some embodiments, the length direction of the first projection K1 is parallel to the X-axis direction, and the length direction of the second projection K2 is parallel to the Y-axis direction. The length direction of the first projection K1 is perpendicular to the length direction of the second projection K2. In this way, the arrangement directions of the first flash lamp 51 and the second flash lamp 52 are different, which is convenient for users to distinguish the first surface A and the second surface B of the flash lamp module 300, thereby playing a foolproof role.

[0126] When the heightening plate 80 comprises the first flash lamp port 82 and the second flash lamp port 84, please return to refer to Figure 11In the first flashlight port 82, the first flashlight positive terminal 821 and the first flashlight negative terminal 822 are arranged in a first direction. In some embodiments, the first direction is the X-axis. In the second flashlight port 84, the second flashlight positive terminal 841 and the second flashlight negative terminal 842 are arranged in a second direction. In some embodiments, the second direction is the Y-axis. The first direction and the second direction are substantially perpendicular. This makes it easier for users to distinguish between the first surface A and the second surface B of the elevated plate 80, thereby providing a foolproof method.

[0127] In some embodiments, please refer to Figure 11 The edge of the plate 81 is provided with a limiting notch 86. The limiting notch 86 is used to accommodate a limiting post (not shown in the figure), which can be set at Figure 2 The inner surface of the camera decorative member 70 shown can also be provided on the surface of the circuit board 30 facing the back cover 21, which is not specifically limited here. The limiting notch 86 cooperates with the limiting post to limit the installation position of the elevated plate 80 on the circuit board 30, thereby improving the alignment accuracy of the elevated plate 80 and the aforementioned circuit board 30. In some embodiments, there are multiple limiting notches 86, and these multiple limiting notches 80 are distributed at multiple positions on the edge of the plate body 81, so that the elevated plate 80 is limited at multiple positions along the circumference of the elevated plate 80, which can improve the accuracy of the limiting.

[0128] When the elevated plate 80 is mounted on the circuit board 30, the elevated plate 80 protrudes significantly from the surface of the circuit board 30. To further reduce the thickness of the electronic device 100, a relief groove (not shown) is provided on the surface of the camera decorative member 70 facing the circuit board 30. The elevated plate 80 is accommodated within the relief groove to prevent the elevated plate 80 and the camera decorative member 70 from overlapping in the Z-axis direction, thereby facilitating a thinner electronic device 100. Furthermore, the aforementioned limiting post can be provided on the bottom surface of the relief groove, and the limiting post is accommodated within the limiting notch 80.

[0129] The present application also provides a circuit board including the above-mentioned elevated board 80. Figure 17 , Figure 17A structural schematic diagram of a circuit board 200 is provided for some embodiments of the present application. The circuit board 200 includes a circuit board body 201 and a heightening plate 80. The circuit board body 201 can be the circuit board 30 described above, or can be another circuit board, which is not specifically limited here. The circuit board body 201 is provided with an opening 201a. The opening 201a can be the avoidance opening 30a of the circuit board 30 described above for avoiding the camera 40, or can be another opening, which is not specifically limited here. The heightening plate 80 is arranged in the opening 201a, and a breakable structure 202 is connected between the edge of the heightening plate 80 and the edge of the circuit board body at the opening 201a. In this way, the circuit board body 201 and the heightening plate 80 are connected as a whole, which can be integrally formed, and at the same time facilitates the automatic connection of electronic devices on the circuit board body 201 and the heightening plate 80, and can improve the processing efficiency. On this basis, since the breakable structure 202 is breakable, after the electronic devices are respectively welded on the circuit board body 201 and the heightening plate 80, the heightening plate 80 can be separated from the circuit board body 201 by means of the breakable structure 202, so as to facilitate independent assembly.

[0130] The form of the breakable structure 202 is various. In some embodiments, referring to Figure 17 , the breakable structure 202 can include a break line 2021, which is located between the edge of the heightening plate 80 and the edge of the circuit board body at the opening 201a. It should be noted that the break line 2021 is a linear region on the circuit board, and the thickness of the linear region can be smaller than that of other parts to achieve breakability, or the linear region can be formed by alternately arranging solid parts and hollow parts along the length direction of the linear region to achieve breakability, which is not specifically limited here.

[0131] In the above embodiments, the number of break lines 2021 can be one or two, which is not specifically limited here. Figure 17 An example in which the number of break lines 2021 is one is given, and this structure is simple and has high material utilization.

[0132] In other embodiments, referring to Figure 18 , Figure 18 A structural schematic diagram of a circuit board 200 is provided for some embodiments of the present application. In this embodiment, the break line 2021 includes a first break line 2021a and a second break line 2021b. The breakable structure 202 further includes a connecting plate 2022.

[0133] The connecting plate 2022 is located between the edge of the raised plate 80 and the edge of the circuit board body at the opening 201a. The first disconnecting line 2021a is connected between the edge of the raised plate 80 and the connecting plate 2022. The second disconnecting line 2021b is arranged between the connecting plate 2022 and the edge of the circuit board body at the opening 201a. In this way, the first disconnecting line 2021a and the second disconnecting line 2021b can extend along different paths, so that the shape of the opening 201a and the edge profile shape of the raised plate 80 can be different, to meet the molding requirements when the shape of the opening 201a and the edge profile shape of the raised plate 80 are different.

[0134] In the description of the present specification, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0135] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: include: A circuit board having a flash interface; First Flash; Second flash; Elevated board, including: A plate body comprising a first surface and a second surface opposite to each other; a first external connection port, wherein the first external connection port and the second flash lamp are disposed on the second surface; a second external connection port, wherein the second external connection port and the first flash lamp are disposed on the first surface; The first external port is electrically connected to the first flashlight, and the second external port is electrically connected to the second flashlight; the second external port is the same as the first external port, the number of terminals on the first external port is the same as the number of terminals on the second external port, and the functions of the terminals on the first external port are the same as the functions of the terminals on the second external port; The orthographic projection of the first flashlight on the second surface is a first projection, and the orthographic projection of the second flashlight on the first surface is a second projection. A position of the first projection on the second surface relative to the first external port is different from a position of the second projection on the first surface relative to the second external port. The different positions include: an orientation of the first projection on the second surface relative to a plurality of terminals in the first external port is different from an orientation of the second projection on the first surface relative to a plurality of terminals in the second external port, and / or a distance from the first projection on the second surface to the first external port is different from a distance from the second projection on the first surface to the second external port. The plate body of the elevated plate is stacked and spaced apart from the circuit board, with the first surface or the second surface of the plate body facing the circuit board; when the first surface of the plate body faces the circuit board, the second external port is electrically connected to the flash interface, and the second flash is used to light up; when the second surface of the plate body faces the circuit board, the first external port is electrically connected to the flash interface, and the first flash is used to light up.

2. The electronic device according to claim 1, wherein The first external port includes a first external positive terminal and a first external negative terminal; an orthographic projection of the first external positive terminal on the first surface is a third projection, and an orthographic projection of the first external negative terminal on the first surface is a fourth projection; The second external port includes a second external positive terminal and a second external negative terminal; the third projection and the second external positive terminal are symmetrically arranged in an area occupied by the first surface about the first axis; the fourth projection and the second external negative terminal are also symmetrically arranged in an area occupied by the first surface about the first axis.

3. The electronic device according to claim 2, wherein: The orthographic projection of the first flashlight on the first surface is a fifth projection, and the fifth projection and the second projection are located on the same side of the first axis.

4. The electronic device according to claim 3, wherein: An absolute value of a difference between a perpendicular distance from the fifth projection to the first axis and a perpendicular distance from the second projection to the first axis is less than or equal to 1 mm.

5. The electronic device according to any one of claims 2 to 4, characterized in that: The plate body includes a first part and a second part; The first external connection port and the second external connection port are provided on the first portion, and the first flashlight and the second flashlight are provided on the second portion; The arrangement directions of the first part and the second part are tilted relative to the first axis.

6. The electronic device according to any one of claims 1 to 4, characterized in that: The orthographic projection of the first external port on the first surface is a sixth projection, and the sixth projection at least partially overlaps with an occupied area of ​​the second external port on the first surface.

7. The electronic device according to any one of claims 2 to 4, characterized in that: The first external positive terminal, the first external negative terminal, the second external positive terminal and the second external negative terminal are all welding pads arranged on the surface of the board.

8. The electronic device according to any one of claims 1 to 4, characterized in that: The elevated plate further comprises: A first flashlight port is provided on the board, the first flashlight port is electrically connected to the first external port, and the first flashlight is electrically connected to the first flashlight port; The second flashlight port is provided on the board body, the second flashlight port is electrically connected to the second external port, and the second flashlight is electrically connected to the second flashlight port.

9. The electronic device according to any one of claims 1 to 4, characterized in that: The first projection and the second projection are both rectangular, and a length direction of the first projection is perpendicular to a length direction of the second projection.

10. The electronic device according to any one of claims 1 to 4, characterized in that: Also includes: The camera decoration is arranged on a side of the elevated plate away from the circuit board. The surface of the camera decoration facing the circuit board is provided with an avoidance groove, and the elevated plate is accommodated in the avoidance groove.

11. The electronic device according to claim 10, characterized in that The edge of the plate body is provided with a limiting notch; A limiting column is provided on the bottom wall of the avoidance groove, and the limiting column is accommodated in the limiting notch.

12. A flash module, characterized in that: It includes an elevated plate, a first flash lamp and a second flash lamp, wherein: The elevated plate comprises: A plate body comprising a first surface and a second surface opposite to each other; a first external connection port, wherein the first external connection port and the second flash lamp are disposed on the second surface; a second external connection port, wherein the second external connection port and the first flash lamp are disposed on the first surface; The first external port is electrically connected to the first flashlight, and the second external port is electrically connected to the second flashlight; the second external port is the same as the first external port, the number of terminals on the first external port is the same as the number of terminals on the second external port, and the functions of the terminals on the first external port are the same as the functions of the terminals on the second external port; The orthographic projection of the first flash light on the second surface is a first projection, and the orthographic projection of the second flash light on the first surface is a second projection. The position of the first projection on the second surface relative to the first external port is different from the position of the second projection on the first surface relative to the second external port. The different positions include: the orientation of the first projection on the second surface relative to the multiple terminals in the first external port is different from the orientation of the second projection on the first surface relative to the multiple terminals in the second external port, and / or the distance from the first projection on the second surface to the first external port is different from the distance from the second projection on the first surface to the second external port.

13. An elevated board, characterized in that: include: A plate body comprising a first surface and a second surface opposite to each other; A first flash lamp port is provided on the plate body, the first flash lamp port is used to electrically connect to a first flash lamp, and the first flash lamp is located on the first surface; a first external connection port, disposed on the second surface and electrically connected to the first flash port; A second flash lamp port is provided on the plate body, the second flash lamp port is used to electrically connect to a second flash lamp, and the second flash lamp is located on the second surface; a second external connection port, disposed on the first surface and electrically connected to the second flash port; The second external port is the same as the first external port, the number of terminals of the first external port is the same as the number of terminals of the second external port, and the function of the terminals of the first external port is the same as the function of the terminals of the second external port; The orthographic projection of the first flash lamp port on the second surface is the seventh projection, and the orthographic projection of the second flash lamp port on the first surface is the eighth projection; The position of the seventh projection on the second surface relative to the first external port is different from the position of the eighth projection on the first surface relative to the second external port, and the different positions include: the orientation of the seventh projection on the second surface relative to the multiple terminals in the first external port is different from the orientation of the eighth projection on the first surface relative to the multiple terminals in the second external port, and / or the distance from the seventh projection on the second surface to the first external port is different from the distance from the eighth projection on the first surface to the second external port.

14. The elevated plate according to claim 13, wherein: The first external port includes a first external positive terminal and a first external negative terminal; an orthographic projection of the first external positive terminal on the first surface is a third projection, and an orthographic projection of the first external negative terminal on the first surface is a fourth projection; The second external port includes a second external positive terminal and a second external negative terminal; the third projection and the second external positive terminal are symmetrically arranged in an area occupied by the first surface about the first axis; the fourth projection and the second external negative terminal are also symmetrically arranged in an area occupied by the first surface about the first axis.

15. The elevated plate according to claim 14, wherein: An orthographic projection of the first flash lamp port on the first surface is a ninth projection, and the ninth projection and the eighth projection are located on the same side of the first axis.

16. The elevated board according to any one of claims 13 to 15, characterized in that: The plate body includes a first part and a second part; The first external connection port and the second external connection port are provided on the first portion, and the first flashlight port and the second flashlight port are provided on the second portion; The arrangement directions of the first part and the second part are tilted relative to the first axis.

17. The elevated board according to any one of claims 13 to 15, characterized in that: The orthographic projection of the first external port on the first surface is a sixth projection, and the sixth projection at least partially overlaps with an occupied area of ​​the second external port on the first surface.

18. A circuit board, characterized in that: include: A circuit board body is provided with an opening; The elevated plate described in any one of claims 13 to 17 is arranged in the opening, and a separable structure is connected between the edge of the elevated plate and the edge of the circuit board body at the opening.

19. The circuit board according to claim 18, wherein: The separable structure includes a breaking line; the breaking line is located between the edge of the elevated plate and the edge of the circuit board body at the opening.

20. The circuit board according to claim 19, wherein: The breaking line includes a first breaking line and a second breaking line; the separable structure also includes a connecting plate; The connecting plate is located between the edge of the elevated plate and the edge of the circuit board body at the opening; the first breaking line is connected between the edge of the elevated plate and the connecting plate; the second breaking line is set between the connecting plate and the edge of the circuit board body at the opening.

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