A silicon rod cutting machine and a method for cutting a silicon rod

Abstract

The application discloses a silicon rod cutting machine and a cutting method of a silicon rod. The silicon rod cutting machine comprises a machine table, a carrier, a laser emitter and a mechanical hand. The carrier is arranged on the machine table in a first direction, a silicon rod is placed on the carrier, and the first direction is the extension direction of the silicon rod. The laser emitter is arranged on the side of the carrier away from the machine table, the laser emitter is spaced apart from the carrier, the laser emitter moves in a second direction, and the second direction intersects the first direction. The mechanical hand is used for clamping or overturning the silicon rod. After the laser emitter cuts off the silicon rod, the mechanical hand clamps and overturns the silicon rod and places the silicon rod on the carrier to continue completing the square. The laser cutting method improves the cutting precision, reduces the damage of the silicon rod cross section, reduces the silicon loss, and can complete the cutting off and squaring of the silicon rod in one cutting machine, saves the occupied area of the site, and saves the cost.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic technology, and more specifically, to a silicon rod cutting machine and a method for cutting silicon rods. Background Technology

[0002] Currently, solar energy, as a clean and renewable energy source, has received widespread attention. Crystalline silicon solar cells, made using semiconductor technology, are the core component of photovoltaic power generation. Solar cells are obtained by cutting, squaring, and slicing silicon rods.

[0003] Existing silicon rod cutting machines use diamond wire to cut crystal rods. In practical applications, problems arise because the diamond wire is not taut during use, resulting in damage to the cross-section of round rods and wire marks on square rods. This leads to insufficient cutting accuracy, high losses, and high costs.

[0004] Therefore, we continue to provide a silicon rod cutting machine and a silicon rod cutting method that improves cutting accuracy and reduces damage to the cross-section of the silicon rod during cutting. Summary of the Invention

[0005] In view of this, the present invention provides a silicon rod cutting machine, comprising:

[0006] Machine tool;

[0007] A carrier, wherein multiple carriers are arranged on the machine platform along a first direction, and a silicon rod is placed on the carrier, wherein the first direction is the extension direction of the silicon rod;

[0008] A laser emitter is disposed on the side of the carrier away from the machine platform, the laser emitter is spaced apart from the carrier, and the laser emitter moves along a second direction, the second direction intersecting the first direction;

[0009] A robotic arm for gripping or flipping the silicon rod.

[0010] Optionally, the silicon rod cutting machine is further provided with a first guide rail extending along the second direction on the side of the carrier away from the machine platform, and the laser emitter moves in the second direction within the first guide rail; along a third direction, the orthographic projection of the first guide rail at least partially overlaps with the orthographic projection of the silicon rod, and the third direction is the direction in which the silicon rod cutting machine platform points to the ground.

[0011] Optionally, the silicon rod cutting machine is further provided with a telescopic device, which is arranged adjacent to the first guide rail along the first direction and extends and retracts along the third direction; along the third direction, the orthographic projection of the telescopic device at least partially overlaps with the orthographic projection of the silicon rod.

[0012] Optionally, a second guide rail extending along the first direction is provided between the carrier and the machine platform, and the carrier moves along the first direction within the second guide rail.

[0013] Optionally, a third guide rail is provided on the ground extending along a first direction, and the robotic arm moves within the third guide rail along the first direction.

[0014] Optionally, the carrier includes a groove extending through the carrier in a first direction; and in a second direction, the spacing between the inner walls of the groove is greater than or equal to the diameter of the silicon rod.

[0015] Optionally, the inner wall of the groove includes a first part, a second part, and a third part connecting the first part and the second part; the first part and the second part are disposed opposite to each other along the second direction;

[0016] Along the second direction, the cross-sections of the first and second parts are L-shaped, and the cross-section of the third part is arc-shaped.

[0017] Optionally, the diameter of the silicon rod is R, and along the second direction, the maximum distance between the first part and the second part is D1, where D1 ≥ R; the minimum distance between the first part and the second part is D2.

[0018] Optionally, the curvature of the third part is equal to the curvature of the outer periphery of the silicon rod.

[0019] This invention provides a method for cutting silicon rods, applicable to any of the silicon rod cutting machines described above, comprising:

[0020] The silicon rod to be cut is placed on the carrier along the first direction;

[0021] The laser emitter moves along the second direction to cut the silicon rod, resulting in a short silicon rod.

[0022] The robotic arm flips the short silicon rod and places it on the carrier.

[0023] The laser emitter moves along the second direction to cut the short silicon rod.

[0024] Optionally, the silicon rod cutting machine includes a first guide rail extending along the second direction, and the laser emitter moves within the first guide rail along the second direction to cut the silicon rod.

[0025] Optionally, the robotic arm grips and rotates the short silicon rod by 90°;

[0026] The machine platform is provided with a second guide rail, and the carrier moves along the first direction within the second guide rail to a position below the laser emitter.

[0027] The robotic arm places the short silicon rod onto the carrier;

[0028] The silicon rod cutting machine is also equipped with a telescopic device. The telescopic device is arranged adjacent to the first guide rail along the first direction. The telescopic device extends along a third direction to abut against the short silicon rod. The third direction is the direction in which the silicon rod cutting machine platform points to the ground.

[0029] The laser emitter moves along the second direction to cut the short silicon rod.

[0030] Compared with the prior art, the silicon rod cutting machine and silicon rod cutting method provided by the present invention achieve at least the following beneficial effects:

[0031] This invention provides a silicon rod cutting machine, comprising: a machine base; a carrier, wherein multiple carriers are arranged on the machine base along a first direction, and silicon rods are placed on the carriers, the first direction being the extension direction of the silicon rods; a laser emitter, the laser emitter being arranged on the side of the carriers away from the machine base, the laser emitter being spaced apart from the carriers, the laser emitter moving along a second direction, the second direction intersecting the first direction; and a robotic arm, the robotic arm being used to grip or flip the silicon rods. After the silicon rods are cut by the laser emitter, the robotic arm grips and flips the silicon rods, placing them on the carriers to continue squaring. Using laser cutting improves cutting accuracy, reduces damage to the silicon rod cross-section, and reduces silicon loss. The cutting and squaring of silicon rods can be completed in a single cutting machine, saving space and reducing costs.

[0032] Of course, any product implementing this invention does not necessarily need to achieve all of the technical effects described above at the same time.

[0033] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0034] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention.

[0035] Figure 1 This is a front view of the silicon rod cutting machine provided by the present invention;

[0036] Figure 2 This is another front view of the silicon rod cutting machine provided by the present invention;

[0037] Figure 3 This is a side view of the silicon rod cutting machine provided by the present invention;

[0038] Figure 4 This is a side view of the carrier in the silicon rod cutting machine provided by the present invention;

[0039] Figure 5 This is a flowchart of a silicon rod cutting method provided by the present invention;

[0040] 1-Machine platform, 2-Carrier, 3-Silicon rod, 4-Laser emitter, 5-Robot arm, 6-First guide rail, 7-Telescopic device, 8-Second guide rail, 9-Third guide rail, 20-Groove, 201-First part, 202-Second part, 203-Third part, X-First direction, Y-Second direction, Z-Third direction. Detailed Implementation

[0041] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0042] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0043] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0044] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0045] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0046] Reference Figure 1 The present invention provides a silicon rod cutting machine, comprising:

[0047] Machine 1;

[0048] Carrier 2, multiple carriers 2 are set on machine platform 1 along the first direction X, and silicon rods 3 are placed on carriers 2, the first direction X is the extension direction of silicon rods 3;

[0049] Laser emitter 4 is located on the side of carrier 2 away from machine 1. Laser emitter 4 is spaced apart from carrier 2. Laser emitter 4 moves along the second direction Y, which intersects the first direction X.

[0050] Robotic arm 5 is used to grip or flip silicon rod 3.

[0051] It should be noted that the silicon rod cutting machine is equipped with at least one set of laser emitters 4 and robotic arms 5. Figure 1 This illustration only uses a single laser emitter 4 and robotic arm 5 as an example. The specific number of laser emitters 4 and robotic arms 5 is not limited here. The robotic arm 5 can be any robotic arm 5 that meets the requirements in existing applications, such as FUNAC, EFFORT, ESTUN, etc. Setting up multiple laser emitters 4 and robotic arms 5 can improve the cutting and squaring efficiency of the silicon rod 3. For example, Figure 1 The illustration only shows the laser emitter 4 being placed on top of the silicon rod cutting machine. The laser emitter 4 can also be placed on the truss, bracket or other support device inside the silicon rod cutting machine, so that there is a certain distance between the laser emitter 4 and the carrier 2.

[0052] Understandably, the silicon rod 3 to be cut is placed on the carrier 2, and the silicon rod 3 can fit snugly against the carrier 2. The carrier 2 stabilizes the silicon rod 3, preventing displacement of the silicon rod 3 during laser cutting and affecting the cutting effect. The laser emitter 4 moves along the second direction Y to cut the silicon rod 3, thus obtaining a shorter silicon rod 3 after cutting. The robot arm 5 picks up the silicon rod 3, rotates it 90°, and then places the silicon rod 3 on the carrier 2. That is, when the silicon rod 3 is cut, it is placed parallel to the machine table 1. When the silicon rod 3 is squared, it is placed perpendicular to the machine table 1. The laser emitter 4 continues to cut the silicon rod 3 to complete the squaring of the silicon rod 3. Specifically, when squaring, after the laser emitter 4 cuts one side of the silicon rod 3, the robot arm 5 rotates the silicon rod 3 until all four sides of the silicon rod 3 are cut to complete the squaring. The machine table 1 is also equipped with a waste port (not shown in the figure) to collect the waste material cut off during squaring. The silicon rod cutting machine uses laser cutting, which improves cutting accuracy, reduces damage to the cross-section of silicon rod 3, and reduces silicon loss. The cutting and squaring of silicon rod 3 can be completed in one cutting machine, saving space and reducing costs.

[0053] In existing technologies, silicon rod cutting and squaring require separate cutting and squaring devices, both using diamond wire cutting. Compared to existing technologies, the silicon rod cutting machine provided in this embodiment offers the following advantages: increased production capacity, with the cutting and squaring process capacity increasing from the current 1000 rods per machine per day to over 1300 rods per day; optimized quality, reducing the twinning rate from approximately 3000 wafers per 100 million wafers to around 1000 wafers per 100 million wafers, and silicon loss decreasing from the current 1.2% to below 1%; and reduced costs, with the labor cost required for the cutting and squaring process decreasing from the current 20 people per process to below 10 people.

[0054] In some alternative embodiments, refer to Figure 1 , Figure 3The silicon rod cutting machine also has a first guide rail 6 extending along the second direction Y on the side of the carrier 2 away from the machine platform 1. The laser emitter 4 moves in the first guide rail 6 along the second direction Y. Along the third direction Z, the orthographic projection of the first guide rail 6 at least partially overlaps with the orthographic projection of the silicon rod 3. The third direction Z is the direction in which the machine platform 1 of the silicon rod cutting machine points to the ground.

[0055] It should be noted that, Figure 1 The illustration only shows the first guide rail 6 being set on the top of the silicon rod cutting machine. The first guide rail 6 can also be set on the truss, bracket or other support device inside the silicon rod cutting machine.

[0056] It is understandable that the laser emitter 4 moves along the second direction Y within the first guide rail 6 to cut off the silicon rod 3. Specifically, the orthographic projection of the silicon rod 3 along the third direction Z can be located within the orthographic projection of the first guide rail 6, ensuring that the reciprocating motion of the silicon laser emitter 4 within the first guide rail 6 can completely cut off the silicon rod 3.

[0057] In some alternative embodiments, refer to Figure 2 The silicon rod cutting machine is also equipped with a telescopic device 7. The telescopic device 7 is arranged adjacent to the first guide rail 6 along the first direction X, and the telescopic device 7 extends and retracts along the third direction Z. Along the third direction Z, the orthographic projection of the telescopic device 7 at least partially overlaps with the orthographic projection of the silicon rod 3.

[0058] It should be noted that the telescopic device 7 can be a cylinder, which is a commonly used power component in mechanical equipment. It converts the pressure energy of compressed air into mechanical energy to drive the mechanism to achieve reciprocating linear motion.

[0059] Understandably, when silicon rod 3 is cut, the telescopic device 7 is in a retracted state. After silicon rod 3 is cut, the robotic arm 5 can rotate silicon rod 3 90° and place it on carrier 2, waiting for laser emitter 4 to continue cutting and squaring. Since the length of silicon rod 3 in the third direction Z after rotation is much greater than the diameter of silicon rod 3, silicon rod 3 is prone to instability and tipping. At this time, telescopic device 7 extends along the third direction Z and abuts against the center of silicon rod 3 to limit silicon rod 3 and prevent silicon rod 3 from being unstable during squaring.

[0060] In some alternative embodiments, refer to Figure 1 , Figure 3 A second guide rail 8 extending along the first direction X is provided between the carrier 2 and the machine base 1, and the carrier 2 moves along the first direction X within the second guide rail 8.

[0061] It should be noted that since the laser emitter 4 only moves along the second direction Y, that is, the position of the laser emitter 4 along the first direction X is fixed, after the laser emitter 4 cuts the silicon rod 3, the robot arm 5 flips the silicon rod 3 and places the silicon rod 3 on the carrier 2 to continue to be squared. There is a gap between the carrier 2 and the position of the cutting point, that is, along the second direction Y, and there is a distance between the carrier 2 and the laser emitter 4.

[0062] It is understandable that a second guide rail 8 extending along the first direction X is provided between the carrier 2 and the machine 1. The carrier 2 moves along the first direction X within the second guide rail 8. After the silicon rod 3 is cut off, the robot arm 5 clamps and flips the silicon rod 3. When the carrier 2 moves to the bottom of the laser emitter 4, the robot arm 5 places the silicon rod 3 on the carrier 2 to continue the squaring process, so as to avoid the position of the silicon rod 3 deviating from the position of the laser emitter 4 and affecting the squaring of the silicon rod 3.

[0063] In some alternative embodiments, reference continues to be made to... Figure 1 A second guide rail 9 extending along the first direction X is provided on the ground, and the robotic arm 5 moves along the first direction X within the second guide rail 9.

[0064] Specifically, the second guide rail 9 can be set on any support device on the ground or inside the silicon rod cutting machine.

[0065] Understandably, the robotic arm 5 needs to grip and flip the silicon rod 3. To prevent the robotic arm 5 from being too far from the edge of the silicon rod 3 on the machine tool 1 and unable to grip the silicon rod 3, a second guide rail 9 is set up. The robotic arm 5 moves along the first direction X within the second guide rail 9 to improve the displacement flexibility of the robotic arm 5.

[0066] In some alternative embodiments, refer to Figure 3 , Figure 4 The carrier 2 includes a groove 20 extending through the carrier 2 along a first direction X; along a second direction Y, the spacing between the inner walls of the groove 20 is greater than or equal to the diameter of the silicon rod 3.

[0067] Specifically, the spacing between the inner walls of the groove 20 is equal to the diameter of the silicon rod 3 or the spacing between the inner walls of the groove 20 is greater than the diameter of the silicon rod 3.

[0068] Understandably, when silicon rod 3 is cut, silicon rod 3 extends along the first direction X and is placed on carrier 2. When the spacing of the inner walls of groove 20 is equal to the diameter of silicon rod 3, silicon rod 3 fits against the side of groove 20 of carrier 2 away from machine 1. Carrier 2 plays a role in stabilizing silicon rod 3 and preventing silicon rod 3 from moving. When silicon rod 3 is squared, robot arm 5 flips the cut silicon rod 3 and places it on carrier 2. When the spacing of the inner walls of groove 20 is greater than or equal to the diameter of silicon rod 3, the space in groove 20 is large, which is convenient for placing silicon rod 3.

[0069] In some alternative embodiments, reference continues to be made to... Figure 4The inner wall of the groove 20 includes a first part 201, a second part 202 and a third part 203 connecting the first part 201 and the second part 202; the first part 201 and the second part 202 are arranged opposite to each other along the second direction Y;

[0070] Along the second direction Y, the cross-sections of the first part 201 and the second part 202 are L-shaped, and the cross-section of the third part 203 is arc-shaped.

[0071] It is understandable that the cross-section of the third part 203 is arc-shaped. When the silicon rod 3 is cut, the silicon rod 3 extends along the first direction X and is placed on the carrier 2. The round silicon rod 3 fits into the arc-shaped third part 203. The carrier 2 plays a role in stabilizing the silicon rod 3 and preventing the silicon rod 3 from moving. The cross-section of the first part 201 and the second part 202 is L-shaped. When the silicon rod 3 is squared, the robot arm 5 flips the cut silicon rod 3 and places it on the carrier 2. The carrier 2 provides a plane for placing the silicon rod 3. At the same time, the first part 201 and the second part 202 work together with the telescopic device 7 to limit the silicon rod 3, which can play a role in preventing the silicon rod 3 from tipping over.

[0072] In some alternative embodiments, reference continues to be made to... Figure 3 , Figure 4 The diameter of silicon rod 3 is R. Along the second direction Y, the maximum distance between the first part 201 and the second part 202 is D1, where D1 ≥ R; the minimum distance between the first part 201 and the second part 202 is D2.

[0073] It should be noted that the maximum distance between the first part 201 and the second part 202 is D1, where D1 ≥ R; specifically, D1 = R, meaning that when the maximum distance between the first part 201 and the second part 202 is equal to the diameter of the silicon rod 3, the silicon rod 3 fits against the side of the groove 20 away from the machine 1, and the carrier 2 stabilizes the silicon rod 3, preventing it from moving; after the silicon rod 3 is squared, the circular silicon rod 3 with a diameter of R becomes a side length of The minimum spacing between the first part 201 and the second part 202 of the square silicon rod 3 is D2. The silicon rod 3 can be placed at least partially on the first part 201 and the second part 202 to prevent the squared silicon rod 3 from falling into the arc-shaped third part 203, causing the silicon rod 3 to tip over and collide.

[0074] In some alternative embodiments, the curvature of the third part 203 is equal to the curvature of the outer periphery of the silicon rod 3.

[0075] It is understandable that the cross-section of the third part 203 is arc-shaped. When the silicon rod 3 is cut, the silicon rod 3 extends along the first direction X and is placed on the carrier 2. The curvature of the third part 203 is equal to the curvature of the outer periphery of the silicon rod 3. The round silicon rod 3 fits into the arc-shaped third part 203. The carrier 2 plays a role in stabilizing the silicon rod 3 and preventing the silicon rod 3 from moving.

[0076] Reference Figure 5 This invention provides a method for cutting silicon rods, applicable to any of the silicon rod cutting machines described in the above embodiments, comprising:

[0077] The silicon rod to be cut is placed on the carrier along the first direction;

[0078] The laser emitter moves along the second direction, cutting the silicon rod to obtain a short silicon rod;

[0079] After the robotic arm flips the short silicon rod, it places the short silicon rod on the carrier.

[0080] The laser emitter moves along the second direction, cutting the short silicon rod.

[0081] Understandably, placing the silicon rod to be cut on the carrier allows it to fit snugly against the carrier, stabilizing it and preventing displacement during laser cutting, which would affect the cutting effect. The laser emitter moves along the second direction, cutting the silicon rod to obtain a shorter, truncated rod. The robotic arm grips the rod, rotates it 90°, and places it back on the carrier, where the laser emitter continues cutting to complete the squaring. The silicon rod cutting method provided in this embodiment uses laser cutting, which improves cutting accuracy, reduces damage to the silicon rod's cross-section, and minimizes silicon loss. The cutting and squaring of the silicon rod can be completed in a single cutting machine, saving space and reducing costs.

[0082] In some alternative embodiments, the silicon rod cutter includes a first guide rail extending in a second direction, within which a laser emitter moves in the second direction to cut the silicon rod.

[0083] It is understandable that the laser emitter moves along the second direction within the first guide rail to cut off the silicon rod. Specifically, the orthographic projection of the silicon rod along the third direction is located within the orthographic projection of the first guide rail, ensuring that the reciprocating motion of the silicon laser emitter within the first guide rail can completely cut off the silicon rod.

[0084] In some alternative embodiments, a robotic arm grips and rotates the short silicon rod 90°.

[0085] The machine is equipped with a second guide rail, and the carrier moves along the first direction within the second guide rail to the area below the laser emitter.

[0086] The robotic arm places the short silicon rod onto the carrier;

[0087] The silicon rod cutting machine is also equipped with a telescopic device. The telescopic device is arranged adjacent to the first guide rail along the first direction. The telescopic device extends along the third direction to abut against the short silicon rod. The third direction is the direction in which the silicon rod cutting machine table points to the ground.

[0088] The laser emitter moves along the second direction, cutting the short silicon rod.

[0089] It should be noted that since the laser emitter moves along the second direction, that is, the position of the laser emitter along the first direction is fixed, after the laser emitter cuts the silicon rod, the robot flips the silicon rod and places it on the carrier to continue to be squared. There is a gap between the carrier and the position of the cutting point, that is, there is a distance between the carrier and the laser emitter along the second direction.

[0090] Understandably, a second guide rail extending along the first direction is provided between the carrier and the machine. The carrier moves along the first direction within the second guide rail. After the silicon rod is cut, the robot grips and flips the silicon rod. When the carrier moves to the area below the laser emitter, the robot places the silicon rod back onto the carrier to continue the squaring process, thus avoiding any deviation between the position of the silicon rod and the position of the laser emitter, which would affect the squaring of the silicon rod. At the same time, to prevent the robot from being too far from the edge of the machine and unable to grip the silicon rod, a third guide rail is provided. The robot moves along the first direction within the third guide rail, improving the robot's displacement flexibility.

[0091] As can be seen from the above embodiments, the silicon rod cutting machine and silicon rod cutting method provided by the present invention achieve at least the following beneficial effects:

[0092] This invention provides a silicon rod cutting machine, comprising: a machine base; a carrier, wherein multiple carriers are arranged on the machine base along a first direction, and silicon rods are placed on the carriers, the first direction being the extension direction of the silicon rods; a laser emitter, the laser emitter being arranged on the side of the carriers away from the machine base, the laser emitter being spaced apart from the carriers, the laser emitter moving along a second direction, the second direction intersecting the first direction; and a robotic arm, the robotic arm being used to grip or flip the silicon rods. After the silicon rods are cut by the laser emitter, the robotic arm grips and flips the silicon rods, placing them on the carriers to continue squaring. Using laser cutting improves cutting accuracy, reduces damage to the silicon rod cross-section, and reduces silicon loss. The cutting and squaring of silicon rods can be completed in a single cutting machine, saving space and reducing costs.

[0093] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A method for cutting silicon rods, applied to a silicon rod cutting machine, characterized in that, The silicon rod cutting machine includes: Machine tool; A carrier, wherein multiple carriers are arranged on the machine platform along a first direction, and a silicon rod is placed on the carrier, wherein the first direction is the extension direction of the silicon rod; A laser emitter is disposed on the side of the carrier away from the machine platform, the laser emitter is spaced apart from the carrier, and the laser emitter moves along a second direction, the second direction intersecting the first direction; A robotic arm for gripping and flipping the silicon rod; The silicon rod cutting machine includes a first guide rail extending along the second direction, and the laser emitter moves within the first guide rail along the second direction to cut the silicon rod; The cutting method includes: The silicon rod to be cut is placed on the carrier along the first direction; The laser emitter moves along the second direction to cut the silicon rod, resulting in a short silicon rod. When the silicon rod is cut, it is placed parallel to the machine platform. The robotic arm grips and rotates the short silicon rod 90°. The machine platform is equipped with a second guide rail, and the carrier moves along the first direction within the second guide rail to a position below the laser emitter; the robotic arm places the short silicon rod on the carrier. The silicon rod cutting machine is also equipped with a telescopic device. The telescopic device is arranged adjacent to the first guide rail along the first direction. The telescopic device extends along a third direction to abut against the short silicon rod. The third direction is the direction in which the silicon rod cutting machine platform points to the ground. The laser emitter moves along the second direction to cut the short silicon rod and perform squaring. During squaring, after the laser emitter cuts one side of the silicon rod, the robot rotates the silicon rod until all four sides of the silicon rod are cut. During squaring, the silicon rod is placed perpendicular to the machine table.

2. The method for cutting silicon rods according to claim 1, characterized in that, Along the third direction upward, the orthographic projection of the first guide rail at least partially overlaps with the orthographic projection of the silicon rod, wherein the third direction is the direction in which the silicon rod cutting machine platform points towards the ground.

3. The method for cutting silicon rods according to claim 2, characterized in that, Along the third direction upward, the orthographic projection of the telescopic device at least partially overlaps with the orthographic projection of the silicon rod.

4. The method for cutting silicon rods according to claim 1, characterized in that, A third guide rail is provided on the ground, extending along a first direction, and the robotic arm moves within the third guide rail along the first direction.

5. The method for cutting silicon rods according to claim 1, characterized in that, The carrier includes a groove extending through the carrier in a first direction; in a second direction, the spacing between the inner walls of the groove is greater than or equal to the diameter of the silicon rod.

6. The method for cutting silicon rods according to claim 5, characterized in that, The inner wall of the groove includes a first part, a second part, and a third part connecting the first part and the second part; the first part and the second part are arranged opposite to each other along the second direction; Along the second direction, the cross-sections of the first and second parts are L-shaped, and the cross-section of the third part is arc-shaped.

7. The method for cutting silicon rods according to claim 6, characterized in that, The diameter of the silicon rod is R. Along the second direction, the maximum distance between the first part and the second part is D1, where D1 ≥ R; the minimum distance between the first part and the second part is D2. .

8. The method for cutting silicon rods according to claim 6, characterized in that, The curvature of the third part is equal to the curvature of the outer periphery of the silicon rod.

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