Substrate structure and forming method, display panel

Abstract

The application belongs to the technical field of display, and discloses a substrate structure, a forming method, a display panel and a substrate splicing layout structure. The substrate structure comprises at least one substrate unit, the substrate unit has a first side edge and two second side edges adjacent to and opposite to the first side edge, the first side edge is used to correspond to the direction of a chip on film circuit, and the second side edge is used to correspond to the direction of a gate driver on array circuit; the at least one substrate unit comprises a first substrate unit, the first substrate unit is provided with an alignment area and a wiring area, the alignment area is used to align an inner alignment part arranged on a mask plate, the wiring area is used to supply a common electrode line, the alignment area is arranged adjacent to one of the second side edges, and the wiring path of the wiring area is arranged to avoid the alignment area. In the application, the first substrate unit can be positioned in the GDL direction when splicing, so that the splicing is not limited by the direction, the wiring area is avoided in the first substrate unit, and it is ensured that the pixels can be normally displayed.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a substrate structure and molding method, and a display panel. Background Technology

[0002] In the current display manufacturing industry, large-screen products are more popular with users, and their market share is increasing year by year. With the support of large screens, users can enjoy a more immersive viewing experience, especially when watching movies, allowing them to experience a cinematic experience. Currently, the trend of "larger screens" in television products has become a common trend in the industry. However, due to limitations in production lines, existing production processes often require splicing in the production of large-screen TV panels, making splicing technology increasingly important.

[0003] Current splicing solutions all involve splicing in the COF (Chip-on-Foil) direction. However, some products are limited by production capacity. Because the splicing direction is fixed, the glass substrates can only be spliced ​​in a fixed way, making it difficult to adjust the production schedule and limiting exposure time to the maximum number of exposures. In summary, existing technologies restrict the splicing direction of glass substrates, hindering the expansion of application scope and production efficiency. Summary of the Invention

[0004] The main objective of this application is to provide a substrate structure and molding method, a display panel, and a substrate splicing layout structure, which aims to solve the problem of limited splicing direction of the mask.

[0005] To achieve the above objectives, this application provides a substrate structure including at least one substrate unit, the substrate unit having a first side and two second sides that are adjacent to and opposite to the first side, the first side being used to correspond to the flip-chip thin film circuit direction, and the second side being used to correspond to the gateless driving circuit direction.

[0006] At least one of the substrate units includes a first substrate unit, on which an alignment region and a routing region are formed. The alignment region is configured to align with an inner alignment portion located on a photomask. The routing region is configured to route a common electrode line. The alignment region is located adjacent to one of the second sides. The routing path of the routing region bypasses the alignment region.

[0007] Optionally, multiple alignment regions are provided, and the multiple alignment regions are spaced apart along the extension direction of the second side.

[0008] Optionally, multiple first substrate units are provided, and the multiple first substrate units are spliced ​​together along the extension direction of the second side.

[0009] Optionally, a splicing area is formed between two adjacent first substrate units, and the alignment areas of the two first substrate units in the splicing area overlap.

[0010] Optionally, at least one of the substrate units further includes a second substrate unit, wherein a first side of the second substrate unit is aligned with a first side of the first substrate unit, and a second side of the second substrate unit has the same width as a second side of the first substrate unit and is fitted together.

[0011] The alignment region formed on the first substrate unit is also used to align the second substrate unit.

[0012] Optionally, the first substrate unit forms a first display area;

[0013] Multiple second substrate units are provided, and the multiple second substrate units are spaced apart along the extension direction of the first side, forming a second display area;

[0014] The first display area and the second display area are the same size.

[0015] The present invention also provides a display panel, comprising:

[0016] An array substrate, the array substrate comprising a substrate structure, wherein the substrate structure is any one of the substrate structures described above;

[0017] A color filter substrate is disposed on the array substrate; and...

[0018] A liquid crystal layer is disposed between the array substrate and the color filter substrate.

[0019] The present invention also provides a method for forming a substrate structure, comprising:

[0020] Sites are formed on a glass substrate using photolithography.

[0021] According to the site, at least one first substrate unit is formed on the glass substrate using a first exposure machine, and the alignment region is formed within the first substrate unit;

[0022] According to the alignment region, a second substrate unit is formed on the glass substrate using a second exposure machine, wherein at least one of the second substrate units is provided corresponding to the first substrate unit.

[0023] Optionally, forming the alignment region within the first substrate unit includes:

[0024] A first film layer and a first adhesive layer are sequentially coated on the glass substrate;

[0025] Based on the stated location, the first adhesive layer is exposed and developed using the first exposure machine to form the alignment image on the first film layer;

[0026] Based on the alignment image, the first film layer is etched to remove photoresist, thereby forming the alignment region on the first film layer.

[0027] Optionally, the first exposure machine includes a first photomask;

[0028] The second exposure machine includes a second mask, and the first mask and the second mask are arranged symmetrically.

[0029] In the substrate structure provided in this application, the first side is a COF direction side, and the second side B is a GDL (Gate driverless) direction side. The alignment area is provided in the first substrate unit, and the alignment area is located close to one of the second sides, so that the first substrate unit can be positioned in the GDL direction when splicing, enriching the splicing methods, making splicing not limited by direction, and expanding the application range of spliced ​​products. At the same time, within the first substrate unit, the wiring area avoids the alignment area, ensuring that the pixels within the first substrate unit can be displayed normally. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the substrate structure provided in the embodiments of this application;

[0031] Figure 2 yes Figure 1 A schematic diagram of the hierarchical structure of the first substrate unit;

[0032] Figure 3 This is a schematic diagram of the structure of the second substrate unit provided in the embodiments of this application;

[0033] Figure 4 This is a schematic diagram of the substrate splicing layout structure provided in the embodiments of this application.

[0034] Explanation of icon numbers:

[0035] 100 substrate structure 2 Second substrate unit 1 First substrate unit 3 mask 11 Counterregion 31 External counterpart 111 splicing area A First side 12 wiring area B Second side

[0036] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0037] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0038] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0039] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0040] Please see Figures 1 to 2 This application provides a substrate structure 100, including at least one substrate unit. The substrate unit has a first side A and two second sides B that are adjacent to and opposite to the first side A. The first side A is used to correspond to the flip-chip thin film circuit direction, and the second side B is used to correspond to the gateless driving circuit direction. At least one of the substrate units includes a first substrate unit 1. The first substrate unit 1 has an alignment region 11 and a routing region 12 formed thereon. The alignment region 11 is used to align with an inner alignment portion located on a photomask. The routing region 12 is used for routing a common electrode line. The alignment region 11 is located adjacent to one of the second sides B. The routing path of the routing region 12 bypasses the alignment region 11.

[0041] In the substrate structure 100 provided in this application, the first side A is a COF direction side, and the second side B is a GDL (Gate driverless) direction side. The alignment region 11 is provided in the first substrate unit 1. The alignment region 11 is located close to one of the second sides B, so that the first substrate unit can be positioned in the GDL direction when splicing, which enriches the splicing methods, makes splicing not restricted by direction, and expands the application range of spliced ​​products. At the same time, within the first substrate unit 1, the wiring area 12 avoids the alignment region 11, ensuring that the pixels within the first substrate unit 1 can be displayed normally.

[0042] It should be noted that the substrate unit is the smallest splicing unit, the first side A corresponds to the COF setting, and the two second sides B correspond to the GDL setting, so that the substrate unit is a dual GDL substrate; wherein, the first substrate unit 1 is a layer structure, and the wiring area 12 and the alignment area 11 are set in the first substrate unit 1 through the layer structure.

[0043] Furthermore, multiple alignment regions 11 are provided, and these multiple alignment regions 11 are spaced apart along the extending direction of the second side B. In this embodiment, the multiple alignment regions 11 enable more precise positioning of the first substrate unit 1 during splicing.

[0044] On the other hand, multiple first substrate units 1 are provided, and the multiple first substrate units 1 are spliced ​​together along the extension direction of the second side B. In this embodiment, the first substrate unit 1 is provided with alignment regions 11, all of which are located in the GDL direction. When the multiple first substrate units 1 are spliced ​​along the second side B, that is, spliced ​​along the GDL direction, the alignment regions 11 on the multiple first substrate units 1 will not repel each other, which can make the multiple second side B fit tightly together, avoiding the problem that the two second side B cannot fit together due to splicing only in the COF direction.

[0045] Specifically, in the embodiments provided in this application, there are two first substrate units 1, and the two first substrate units 1 are spliced ​​together so that the second side B of the two first substrate units 1 are spliced ​​together and overlapped to form a spliced ​​substrate formed by splicing the two first substrate units 1.

[0046] Furthermore, a splicing area 111 is formed between two adjacent first substrate units 1, and the corresponding alignment areas 11 of the two first substrate units 1 are overlapped within the splicing area 111. In this embodiment, after the two first substrate units 1 are spliced, an overlapping splicing area 111 is formed between the two first substrate units 1. In order to reduce the impact of the alignment areas 11 within the first substrate units 1 on the display of the first substrate units 1, the two alignment areas within two adjacent first substrate units 1 are overlapped and set as one. The two first substrate units 1 share one alignment area 11 for subsequent alignment, which can reduce the number of alignment areas 11 set on the first substrate units 1 while ensuring the alignment effect.

[0047] On the other hand, please see Figure 3 At least one of the substrate units further includes a second substrate unit 2. The first side A of the second substrate unit 2 is aligned with the first side A of the first substrate unit 1. The second side B of the second substrate unit 2 and the second side B of the first substrate unit 1 have the same width and are attached together. The alignment area formed on the first substrate unit 1 is also used to align the second substrate unit 2. In this embodiment, the second substrate unit 2 is also included. The second substrate unit 2 is aligned by an external alignment method. Therefore, in this embodiment, the second side B of the second substrate unit 2 is directly attached to the second side B of the first substrate unit 1, so that the alignment area 11 located in the first substrate unit 1 can also simultaneously align the second substrate unit, minimizing the setting of the alignment structure, ensuring a simple and reliable splicing structure, and positioning multiple substrate units simultaneously through repeated alignment areas 11.

[0048] Furthermore, the first substrate unit 1 forms a first display area; multiple second substrate units 2 are provided, spaced apart along the extension direction of the first side A, and the multiple second substrate units 2 form a second display area; wherein, the first display area and the second display area are the same size. In this embodiment, since multiple second substrate units are spliced ​​to form a second display area identical to the first display area formed by the first substrate unit 1, the same size mask can be used for the two substrate units during exposure and development.

[0049] It should be noted that you should refer to [link / reference]. Figure 4 In the embodiments provided in this application, a second substrate unit 2 is attached to the first substrate unit 1 to form a bonding group. There are two bonding groups. The first substrate unit 1 in the two bonding groups is spliced ​​with each other, and the second substrate unit 2 is also spliced ​​with each other.

[0050] Based on the above substrate structure, this application also provides a method for forming a substrate structure, characterized by comprising the following steps:

[0051] S10. Using photolithography, sites are formed on a glass substrate;

[0052] S20. Based on the said site, at least one first substrate unit is formed on the glass substrate using a first exposure machine, and the alignment region is formed within the first substrate unit.

[0053] S30. Based on the alignment region, a second substrate unit is formed on the glass substrate using a second exposure machine, wherein at least one of the second substrate units is provided corresponding to the first substrate unit.

[0054] In this embodiment, the second substrate unit 2 is configured corresponding to the first substrate unit 1. During the production process, the first substrate unit 1 is formed on the glass substrate by the first exposure machine. After the first substrate unit 1 is formed, it is moved to the second exposure machine for the exposure production of the second substrate unit 2. Since the first side A of the first substrate unit 1 and the second substrate unit 2 are aligned with the first side A of the first substrate unit 1 and maintain the same number, the alignment area can be shared. At the same time, the cycle time consumed on the two exposure machines is the same.

[0055] Furthermore, step S20 includes:

[0056] S21. A first film layer and a first adhesive layer are sequentially coated on the glass substrate;

[0057] S22. Based on the stated position, the first adhesive layer is exposed and developed using the first exposure machine to form the alignment image on the first film layer;

[0058] S23. Based on the alignment image, the first film layer is etched to remove photoresist, and the alignment region is formed on the first film layer.

[0059] The alignment region is formed by etching through exposure and development to create the alignment region within the display area without affecting the normal forming process of the substrate.

[0060] In addition, the first exposure machine includes a first photomask; the second exposure machine includes a second photomask, and the first and second photomasks are symmetrically arranged. This facilitates the use of photomasks of the same specifications to perform photomask lithography on the first substrate unit 1 and the second substrate unit 2.

[0061] Based on the above substrate structure, this application also provides a display panel including the above substrate structure, which has all the technical features of the above substrate structure, and therefore also has the technical effects brought about by all the above technical features, which will not be described in detail here.

[0062] In the specific embodiments provided in this application, the mask 3 is provided with an inner alignment portion; the substrate structure 100 is disposed on a glass substrate, wherein the alignment region 11 of the substrate structure 100 is provided corresponding to the inner alignment portion of the mask 3.

[0063] The mask 3 is placed on the substrate structure 100 and exposed and developed to copy the pattern on the mask 3 onto the substrate structure 100, thereby realizing the exposure design of the substrate structure.

[0064] In the layout structure provided in this application, the first substrate unit 1 and two second substrate units 2 are arranged in sequence. The first substrate unit 1 can be exposed by a first exposure machine, and the two second substrate units 2 are exposed by a second exposure machine at the same time, so that the exposure rhythm of the first substrate unit 1 is synchronized with that of the second substrate units 2, ensuring the exposure rhythm and improving production efficiency.

[0065] In this embodiment, four masks are respectively provided on the four first substrate units 1. Four production cycles are required to expose and produce the four first substrate units 1 respectively. After the production of the first substrate units 1 is completed, they are transferred to the second exposure machine.

[0066] Multiple second substrate units 2 are exposed simultaneously using the same mask. Therefore, for each of the four arrangement groups, four masks are set in the second exposure machine. The exposure of the four arrangement groups by the second exposure machine requires four production cycles to complete the exposure.

[0067] On the other hand, the mask 3 is also provided with an outer alignment portion 31, which is disposed outside the substrate structure 100 and works together with the inner positioning portion to align the substrate structure 100. In this embodiment, the alignment of the substrate structure by the inner positioning portion and the outer positioning portion 31 ensures the accuracy of the exposure by the exposure machine.

[0068] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A substrate structure, characterized in that, It includes at least one substrate unit, the substrate unit having a first side and two second sides that are adjacent to and opposite to the first side, the first side being used to correspond to the flip-chip thin film circuit direction, and the second side being used to correspond to the gateless driving circuit direction. At least one of the substrate units includes a first substrate unit, on which an alignment region and a routing region are formed. The alignment region is configured to align with an inner alignment portion located on a photomask. The routing region is configured to allow a common electrode line to be routed. The alignment region is located adjacent to one of the second sides. The routing path of the routing region bypasses the alignment region. At least one of the substrate units further includes a second substrate unit, wherein a first side of the second substrate unit is aligned with a first side of the first substrate unit, and a second side of the second substrate unit has the same width as a second side of the first substrate unit and is attached to each other.

2. The substrate structure according to claim 1, characterized in that, Multiple alignment regions are provided, and the multiple alignment regions are spaced apart along the extension direction of the second side.

3. The substrate structure according to claim 1, characterized in that, Multiple first substrate units are provided, and the multiple first substrate units are spliced ​​together along the extension direction of the second side.

4. The substrate structure according to claim 3, characterized in that, A splicing area is formed between two adjacent first substrate units, and the two first substrate units are respectively arranged to overlap the two alignment regions in the splicing area.

5. The substrate structure according to claim 1, characterized in that, The alignment region formed on the first substrate unit is also used to align the second substrate unit.

6. The substrate structure according to claim 5, characterized in that, The first substrate unit forms the first display area; Multiple second substrate units are provided, and the multiple second substrate units are spaced apart along the extension direction of the first side, forming a second display area; The first display area and the second display area are the same size.

7. A display panel, characterized in that, include: An array substrate, the array substrate comprising a substrate structure, the substrate structure being the substrate structure according to any one of claims 1 to 6; A color filter substrate is disposed on the array substrate; and... A liquid crystal layer is disposed between the array substrate and the color filter substrate.

8. A method for forming a substrate structure, used for forming the substrate structure as described in any one of claims 1 to 6, characterized in that, The method for forming the substrate structure includes: Sites are formed on a glass substrate using photolithography. According to the site, at least one first substrate unit is formed on the glass substrate using a first exposure machine, and the alignment region is formed within the first substrate unit; the alignment region is used to align an inner alignment portion located on a photomask. According to the alignment region, a second substrate unit is formed on the glass substrate using a second exposure machine, wherein at least one second substrate unit is provided corresponding to the first substrate unit; the first side of the second substrate unit is aligned with the first side of the first substrate unit, and the second side of the second substrate unit and the second side of the first substrate unit have the same width and are attached to each other.

9. The method for forming a substrate structure according to claim 8, characterized in that, The process of forming the alignment region within the first substrate unit includes: A first film layer and a first adhesive layer are sequentially coated on the glass substrate; Based on the stated location, the first adhesive layer is exposed and developed using the first exposure machine to form an alignment image on the first film layer; Based on the alignment image, the first film layer is etched to remove photoresist, thereby forming the alignment region on the first film layer.

10. The method for forming a substrate structure according to claim 8, characterized in that, The first exposure machine includes a first photomask; The second exposure machine includes a second photomask, and the first photomask has the same specifications as the second photomask.

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