electronic components

Abstract

The present application provides an electronic assembly, which includes a circuit board, an interference source, a shield, an antenna and a near-shield pad. The interference source is disposed on and electrically connected to the circuit board. The shield includes a side perimeter plate and a top plate. The side perimeter plate is disposed on the circuit board. The top plate is connected to a side of the side perimeter plate away from the circuit board. The top plate has an opening. The side perimeter plate surrounds the interference source. The interference source is located in the opening. The antenna is located on a side of the shield. The near-shield pad is disposed on a side of the top plate of the shield away from the side perimeter plate and between the opening and the antenna. Electromagnetic waves emitted by the interference source have a wavelength λ. The antenna has a radiation pattern. A minimum distance X between the interference source and the radiation pattern satisfies the inequality

Description

Technical Field

[0001] This invention relates to an electronic component, and more particularly to an electronic component comprising an antenna. Background Technology

[0002] In recent years, in pursuit of thinner and lighter electronic devices such as laptops, many manufacturers have moved the antennas to the vicinity of the motherboard. This causes interference sources such as the voltage regulator module (VRM) located on the motherboard to generate electromagnetic interference to the antennas.

[0003] Therefore, circuit boards typically feature shielding covers to mitigate electromagnetic interference (EMI) on the antenna. Furthermore, to meet the heat dissipation requirements of the interference source and address space constraints within the electronic device, openings are created in the shielding cover to house the interference source. While these openings satisfy the heat dissipation needs of the interference source and address the space limitations within the electronic device, they also reduce the effectiveness of the shielding cover in mitigating EMI on the antenna. Therefore, manufacturers incorporate absorbing materials on the shielding cover to absorb electromagnetic waves and reduce EMI on the antenna.

[0004] However, to effectively utilize absorbing materials to mitigate electromagnetic interference on antennas, the magnetic permeability, thickness, and other characteristics of the absorbing material need to be designed specifically for different types of interference sources and antennas. In other words, absorbing materials are difficult to use for all types of interference sources and antennas. Furthermore, the use of absorbing materials also increases the manufacturing cost of electronic devices. Summary of the Invention

[0005] The present invention provides an electronic component that effectively mitigates electromagnetic interference between interference sources of different specifications and an antenna through near-shielding pads or far-shielding pads, while reducing the manufacturing cost of the electronic component.

[0006] An embodiment of the present invention discloses an electronic component comprising a circuit board, an interference source, a shielding cover, an antenna, and a near-shielding pad. The interference source is disposed and electrically connected to the circuit board. The shielding cover includes a side peripheral plate and a top plate. The side peripheral plate stands on the circuit board. The top plate is connected to the side peripheral plate away from the circuit board. The top plate has an opening. The side peripheral plate surrounds the interference source. The interference source is located at the opening. The antenna is located on one side of the shielding cover. The near-shielding pad is disposed on the top plate of the shielding cover away from the side peripheral plate and is located between the opening and the antenna. The electromagnetic wave emitted by the interference source has a wavelength λ. The antenna has a radiation pattern. The minimum distance X between the interference source and the radiation pattern conforms to the inequality...

[0007] Another embodiment of the present invention discloses an electronic component comprising a circuit board, an interference source, a shielding cover, an antenna, and a far-shielding pad. The interference source is disposed and electrically connected to the circuit board. The shielding cover includes a side peripheral plate and a top plate. The side peripheral plate stands on the circuit board. The top plate is connected to the side of the side peripheral plate away from the circuit board. The top plate has an opening. The side peripheral plate surrounds the interference source. The interference source is located at the opening. The antenna is located on one side of the shielding cover. The far-shielding pad is separated from the shielding cover and located between the opening and the antenna. The electromagnetic wave emitted by the interference source has a wavelength λ. The antenna has a radiation pattern. The minimum distance X between the interference source and the radiation pattern conforms to the inequality...

[0008] According to the electronic components disclosed in the above embodiments, the electromagnetic waves emitted by the interference source are attenuated before propagating to the antenna due to reflection, diffraction, and penetration of the near-shielding pad located between the opening and the antenna, or by the far-shielding pad located separately from the shielding cover and between the opening and the antenna, respectively. This effectively mitigates electromagnetic interference between interference sources of different specifications and the antenna, while reducing the manufacturing cost of the electronic components.

[0009] Furthermore, the minimum distance X between the interference source and the radiation field pattern conforms to the inequality. In other words, this invention uses the antenna's radiation pattern, rather than the distance between the antenna and the interference source, to determine whether the interference source is likely to cause electromagnetic interference to the antenna. Therefore, this invention can accurately identify interference sources that are more likely to cause electromagnetic interference to the antenna and provide near-shielding or far-shielding pads for these interference sources. Attached Figure Description

[0010] Figure 1 This is a top view of an electronic component according to a first embodiment of the present invention.

[0011] Figure 2 for Figure 1 A side view of the electronic components.

[0012] Figure 3 To present Figure 1 A schematic diagram of the radiation pattern of the antenna of the electronic components in the diagram.

[0013] Figure 4 This is a schematic diagram illustrating the radiation pattern of the antenna of an electronic component according to a second embodiment of the present invention.

[0014] Figure 5 A schematic diagram illustrating the radiation pattern of an antenna of an electronic component according to a third embodiment of the present invention.

[0015] Figure 6 This is a schematic diagram illustrating the radiation pattern of the antenna of an electronic component according to a fourth embodiment of the present invention.

[0016] Figure 7 A schematic diagram illustrating the radiation pattern of the antenna of the electronic component according to the fifth embodiment of the present invention.

[0017] Figure 8 This is a schematic diagram illustrating the radiation pattern of the antenna of an electronic component according to a sixth embodiment of the present invention.

[0018] Figure 9 A schematic diagram illustrating the radiation pattern of an antenna of an electronic component according to a seventh embodiment of the present invention.

[0019] Figure 10 A schematic diagram illustrating the radiation pattern of the antenna of the electronic component according to the eighth embodiment of the present invention.

[0020] Figure 11 This is a top view of an electronic component according to a ninth embodiment of the present invention.

[0021] Figure 12 This is a top view of an electronic component according to a tenth embodiment of the present invention.

[0022] Figure 13 This is a top view of an electronic component according to the eleventh embodiment of the present invention.

[0023] Figure 14 This is a top view of an electronic component according to the twelfth embodiment of the present invention.

[0024] Figure 15 This is a top view of an electronic component according to a thirteenth embodiment of the present invention.

[0025] Figure 16 This is a top view of an electronic component according to the fourteenth embodiment of the present invention.

[0026] Figure 17 This is a top view of an electronic component according to the fifteenth embodiment of the present invention.

[0027] Figure 18 This is a top view of the shielding cover and near-shielding pad of an electronic component according to the sixteenth embodiment of the present invention.

[0028] Figure 19 This is a top view of the shielding cover and near-shielding pad of an electronic component according to the seventeenth embodiment of the present invention.

[0029] Figure 20 This is a top view of the shielding cover and near-shielding pad of an electronic component according to the eighteenth embodiment of the present invention.

[0030] Figure 21 This is a top view of an electronic component according to the nineteenth embodiment of the present invention.

[0031] Figure 22ATo present Figure 21 A schematic diagram showing the distance between the shielding pads and antennas of the electronic components.

[0032] Figure 22B To demonstrate the suppression effect between the shielding pad and the antenna at different intervals.

[0033] Figure 23 This is a top view of an electronic component according to the twentieth embodiment of the present invention.

[0034] Figure 24 This is a top view of an electronic component according to the twenty-first embodiment of the present invention.

[0035] Figure 25 This is a top view of an electronic component according to the twenty-second embodiment of the present invention.

[0036] Figure 26 A graph illustrating the shielding effect of the electronic components according to the present invention.

[0037] Figure 27 Another graph is provided to illustrate the shielding effect of the electronic components according to the present invention.

[0038] The reference numerals in the attached figures are explained as follows:

[0039] 10, 10a, 10b, 10c, 10d, 10e, 10f, 10g, 10h, 10i, 10j, 10k, 10l, 10m, 10n, 10p, 10q, 10r, 10s, 10t, 10u, 10v: Electronic components

[0040] 100, 100k, 550k, 100l, 550l, 100m, 550m, 100n, 550n, 100t, 550t, 100v, 550v: Circuit Board

[0041] 200: Interference source

[0042] 300, 300p, 300q, 300r: Shielding cover

[0043] 310: Side plate

[0044] 311: First outer surface

[0045] 312: Second outer surface

[0046] 313: Third outer surface

[0047] 314: Fourth outer surface

[0048] 320, 320p, 320q, 320r: Top plate

[0049] 321, 321p, 321q, 321r: Opening

[0050] 322: Bottom

[0051] 323: Top surface

[0052] 350: Shielding clip

[0053] 400, 401h, 402h, 401i, 402i, 401j, 402j, 403j: Near-shielding pads

[0054] 450, 450k, 450l, 450m, 450n, 450t, 450v: First expansion circuit board

[0055] 500, 500a, 500b, 500c, 500d, 500e, 500f, 500g, 500h, 500i, 501j, 502j: Antennas

[0056] 600s, 600t: Second expansion circuit board

[0057] 650s: Housing

[0058] 700s, 700u: Far-field shielding pad

[0059] G: Interval

[0060] L: Length

[0061] H1, H2: Height

[0062] B: Reference plane

[0063] C: Center point

[0064] F, F1, F2, F3, F4, F5, F6, F7: Radiation field patterns

[0065] F4a, F5a, F6a: Main extension

[0066] F7a: Ring radiation field

[0067] F4b, F5b, F6b: First extension

[0068] F4c, F5c, F6c: Second extension

[0069] X, X1, X2, X3, X4, X5, X6, X7: Minimum distance

[0070] D: Spacing distance

[0071] p4, p5, p6: Reference points

[0072] F7D: Diameter Detailed Implementation

[0073] The following detailed description of the embodiments of the present invention outlines its features and advantages. This description is sufficient to enable anyone skilled in the art to understand the technical content of the embodiments of the present invention and to implement them accordingly. Furthermore, based on the disclosure, claims, and drawings in this specification, anyone skilled in the art can easily understand the related objectives and advantages of the present invention. The following embodiments are intended to further illustrate the viewpoints of the present invention, but are not intended to limit the scope of the invention in any way.

[0074] Please see Figure 1 and Figure 2 , Figure 1 This is a top view of an electronic component according to a first embodiment of the present invention. Figure 2 for Figure 1 A side view of the electronic components.

[0075] In this embodiment, the electronic component 10 includes a circuit board 100, an interference source 200, a shielding cover 300, a plurality of shielding clips 350, a near-shielding pad 400, a first expansion circuit board 450, and an antenna 500. The interference source 200 is disposed and electrically connected to the circuit board 100.

[0076] In this embodiment, the interference source 200 is, for example, a voltage regulator module (VRM) that emits electromagnetic waves with a wavelength λ. In this embodiment, the frequency of the electromagnetic waves emitted by the interference source 200 is, for example, greater than or equal to 700 MHz and less than or equal to 8 billion GHz.

[0077] The shielding cover 300 includes a side peripheral plate 310 and a top plate 320. The side peripheral plate 310 stands on the circuit board 100. The top plate 320 is connected to the side of the side peripheral plate 310 away from the circuit board 100. The top plate 320 has an opening 321, a bottom surface 322, and a top surface 323. The bottom surface 322 and the top surface 323 face away from each other. The bottom surface 322 faces the circuit board 100. The opening 321 extends through the bottom surface 322 and the top surface 323. The side peripheral plate 310 surrounds an interference source 200. The interference source 200 is located in the opening 321. In this embodiment, the total perimeter of the cross-section of all openings 321 on the shielding cover 300 is, for example, less than or equal to λ / 2 and greater than or equal to λ / 32. In this embodiment, the shielding cover 300 has only one opening 321. Therefore, the total perimeter of the cross-sections of all openings 321 on the shielding cover 300 is the perimeter of the cross-section of opening 321, but this is not a limitation. In embodiments where the shielding cover has multiple openings, the total perimeter of the cross-sections of all openings on the shielding cover is also less than or equal to λ / 2 and greater than or equal to λ / 32. Furthermore, in this embodiment, the cross-section of opening 321 is, for example, square.

[0078] These shielding clips 350 are located at the connection between the side peripheral plate 310 and the circuit board 100 and fix the shielding cover 300 to the circuit board 100. The shielding cover 300 is electrically connected to the ground layer (not shown) of the circuit board 100 through the shielding clips 350. In this embodiment, the spacing G between adjacent shielding clips 350 is, for example, less than or equal to λ / 2 and greater than or equal to λ / 32.

[0079] The near-shielding pad 400 is disposed on the side of the top plate 320 of the shielding cover 300 away from the side peripheral plate 310, that is, on the top surface 323 of the top plate 320. The near-shielding pad 400 is made of, for example, a conductive material, such as metal. In this embodiment, the length L of the near-shielding pad 400 is, for example, less than or equal to λ / 2 and greater than or equal to λ / 32. In this embodiment, the near-shielding pad 400 and the shielding cover 300 are, for example, separate components combined together, but this is not a limitation. In other embodiments, the near-shielding pad and the shielding cover may also be integrally formed.

[0080] The first expansion circuit board 450 is located on one side of the circuit board 100. The antenna 500 is disposed and electrically connected to the first expansion circuit board 450. The antenna 500 is located on one side of the shielding cover 300. The near shielding pad 400 is located between the opening 321 and the antenna 500. In this embodiment, the first expansion circuit board 450 and the circuit board 100 are separate from each other and electrically insulated from each other. Therefore, in this embodiment, the antenna 500 electrically connected to the first expansion circuit board 450 and the shielding cover 300 electrically connected to the circuit board 100 do not share a common ground. It should be noted that in this embodiment, the shielding cover 300 and the antenna 500 are electrically connected to the ground planes of different circuit boards and do not share a common ground, in order to further reduce the probability of interference to the operation of the antenna 500 due to the shielding cover 300 and the antenna 500 sharing a common ground, but the present invention is not limited thereto. In other embodiments, the shielding cover and the antenna may also be electrically connected to two electrically insulated ground planes in the same circuit board to achieve a non-common ground relationship.

[0081] In this embodiment, the height H1 of the side of the near-shielding pad 400 away from the circuit board 100 relative to the circuit board 100 is greater than the height H2 of the side of the interference source 200 away from the circuit board 100 relative to the circuit board 100, so as to improve the near-shielding pad 400 and reduce the electromagnetic interference caused by the interference source 200 to the antenna 500, but it is not limited thereto. In other embodiments, the height of the side of the near-shielding pad away from the circuit board relative to the circuit board may also be less than or equal to the height of the side of the interference source away from the circuit board relative to the circuit board.

[0082] Furthermore, in this embodiment, the side peripheral plate 310 has a first outer surface 311, a second outer surface 312, a third outer surface 313, and a fourth outer surface 314. The first outer surface 311, second outer surface 312, third outer surface 313, and fourth outer surface 314 face away from the interference source 200. The first outer surface 311 faces the antenna 500. The second outer surface 312 faces away from the first outer surface 311. The third outer surface 313 and fourth outer surface 314 face away from each other and connect the first outer surface 311 and the second outer surface 312. In this embodiment, the near-shielding pad 400 is located between the first outer surface 311 and the opening 321. A reference plane B is defined, perpendicular to the first outer surface 311 of the side peripheral plate 310 and the top surface 323 of the top plate 320. Furthermore, the reference plane B passes through the center point C of the opening 321. In this embodiment, at least a portion of the antenna 500 overlaps with the reference plane B, and at least a portion of the near-shielding pad 400 also overlaps with the reference plane B.

[0083] Please see Figure 3 , Figure 3 To present Figure 1 A schematic diagram of the radiation pattern of the antenna of the electronic component is shown. The antenna 500 has a radiation pattern F. In this embodiment, the radiation pattern F is elliptical in shape and extends from the antenna 500 in a direction close to the interference source 200. The minimum distance X between the interference source 200 and the radiation pattern F satisfies the inequality. It should be noted that the minimum distance X can also be called the distance between the maximum peak gain of the antenna and the RF noise.

[0084] In this embodiment, only the top plate 320 of the shielding cover 300 has an opening 321, while the side plates 310 of the shielding cover 300 do not have openings, but this is not a limitation. In other embodiments, the side plates of the shielding cover may also have one or more openings, as long as the openings are not located on the side of the side plate closest to the antenna. In such embodiments, the total perimeter of the cross-section of all openings on the shielding cover is the sum of the total perimeter of the cross-section of all openings on the top plate and the total perimeter of the cross-section of all openings on the side plates.

[0085] In other embodiments, the electronic component may also include a pulse-width modulation (PWM) integrated circuit and a capacitor located between the top plate of the shield and the circuit board and electrically connected to the circuit board.

[0086] It should be noted that, unless otherwise stated, the same reference numerals refer to the same or similar elements in this specification.

[0087] It should be noted that this invention is not limited to the form of the antenna's radiation pattern. Please refer to [link / reference]. Figure 4 , Figure 4This is a schematic diagram illustrating the radiation pattern of the antenna of the electronic component according to a second embodiment of the present invention. It should be noted that the electronic component 10a according to the second embodiment of the present invention and... Figures 1 to 3 The differences between the electronic components 10 according to the first embodiment of the present invention lie only in the form of the antenna radiation pattern. The electronic component 10a according to the second embodiment of the present invention may also include... Figures 1 to 3 The circuit board 100, interference source 200, shielding cover 300, multiple shielding clips 350, near-shielding pad 400, and first expansion circuit board 450 according to the first embodiment of the present invention are described below, and can be referenced. Figures 1 to 3 The description of antenna 500 in the text helps to understand other features of antenna 500a according to the second embodiment of the present invention. Therefore, only the radiation pattern F1 of antenna 500a will be described in detail below, and other similar contents will not be repeated. In this embodiment, the radiation pattern F1 of antenna 500a is elliptical and symmetrical with respect to antenna 500a. In this embodiment, the minimum distance X1 between interference source 200 and radiation pattern F1 also satisfies the inequality.

[0088] Alternatively, please see Figure 5 , Figure 5 This is a schematic diagram illustrating the radiation pattern of the antenna of the electronic component according to a third embodiment of the present invention. It should be noted that the electronic component 10b according to the third embodiment of the present invention and... Figures 1 to 3 The differences between the electronic components 10 according to the first embodiment of the present invention lie only in the form of the antenna radiation pattern. The electronic component 10b according to the third embodiment of the present invention may also include... Figures 1 to 3 The circuit board 100, interference source 200, shielding cover 300, multiple shielding clips 350, near-shielding pad 400, and first expansion circuit board 450 according to the first embodiment of the present invention are described below, and can be referenced. Figures 1 to 3 The description of antenna 500 in the text helps to understand other features of antenna 500b according to the third embodiment of the present invention. Therefore, only the radiation pattern F2 of antenna 500b will be described in detail below, and other similar contents will not be repeated. In this embodiment, the radiation pattern F2 of antenna 500b is elliptical and extends from antenna 500b in the direction close to the interference source 200 and in the direction away from the first expansion circuit board 450. In this embodiment, the minimum distance X2 between the interference source 200 and the radiation pattern F2 also satisfies the inequality.

[0089] Alternatively, please see Figure 6 , Figure 6 This is a schematic diagram illustrating the radiation pattern of the antenna of the electronic component according to the fourth embodiment of the present invention. It should be noted that the electronic component 10c according to the fourth embodiment of the present invention and... Figures 1 to 3The differences between the electronic components 10 according to the first embodiment of the present invention lie only in the form of the antenna radiation pattern. The electronic component 10c according to the fourth embodiment of the present invention may also include... Figures 1 to 3 The circuit board 100, interference source 200, shielding cover 300, multiple shielding clips 350, near-shielding pad 400, and first expansion circuit board 450 according to the first embodiment of the present invention are described below, and can be referenced. Figures 1 to 3 The description of antenna 500 in the text helps to understand other features of antenna 500c according to the fourth embodiment of the present invention. Therefore, only the radiation pattern F3 of antenna 500c will be described in detail below, and other similar contents will not be repeated. In this embodiment, the radiation pattern F3 of antenna 500c is elliptical and extends from antenna 500c in a direction away from interference source 200 and away from first expansion circuit board 450. In this embodiment, the minimum distance X3 between interference source 200 and radiation pattern F3 also satisfies the inequality.

[0090] Alternatively, please see Figure 7 , Figure 7 This is a schematic diagram illustrating the radiation pattern of the antenna of the electronic component according to a fifth embodiment of the present invention. It should be noted that the electronic component 10d according to the fifth embodiment of the present invention and... Figures 1 to 3 The differences between the electronic components 10 according to the first embodiment of the present invention lie only in the form of the antenna radiation pattern. The electronic component 10d according to the fifth embodiment of the present invention may also include... Figures 1 to 3 The circuit board 100, interference source 200, shielding cover 300, multiple shielding clips 350, near-shielding pad 400, and first expansion circuit board 450 according to the first embodiment of the present invention are described below, and can be referenced. Figures 1 to 3The description of antenna 500 in the text will help you understand other features of antenna 500d according to the fifth embodiment of the present invention. Therefore, only the radiation pattern F4 of antenna 500d will be described in detail below, and other similar contents will not be repeated. In this embodiment, the radiation pattern F4 of antenna 500d includes a main extension F4a, a plurality of first extensions F4b and a plurality of second extensions F4c, and the radiation pattern F4 has a reference point p4. The coverage area of ​​the main extension F4a is larger than the coverage area of ​​each of the first extensions F4b and the second extensions F4c. The reference point p4 is closer to the side of antenna 500d that is closer to the first expansion circuit board 450 than the side of antenna 500d that is farther away from the first expansion circuit board 450. The main extension F4a extends from the reference point p4 in a direction away from the first expansion circuit board 450. These first extensions F4b extend from the reference point p4 in a direction close to the interference source 200 and are arranged in a ring around the reference point p4. These secondary extensions F4c extend from the reference point p4 in a direction away from the interference source 200 and are arranged in a ring around the reference point p4. In this embodiment, the minimum distance X4 between the interference source 200 and the radiation field pattern F4 also satisfies the inequality.

[0091] Alternatively, please see Figure 8 , Figure 8 This is a schematic diagram illustrating the radiation pattern of the antenna of the electronic component according to the sixth embodiment of the present invention. It should be noted that the electronic component 10e according to the sixth embodiment of the present invention and... Figures 1 to 3 The differences between the electronic components 10 according to the first embodiment of the present invention lie only in the form of the antenna radiation pattern. The electronic component 10e according to the sixth embodiment of the present invention may also include... Figures 1 to 3 The circuit board 100, interference source 200, shielding cover 300, multiple shielding clips 350, near-shielding pad 400, and first expansion circuit board 450 according to the first embodiment of the present invention are described below, and can be referenced. Figures 1 to 3The description of antenna 500 in the text will help you understand other features of antenna 500e according to the sixth embodiment of the present invention. Therefore, only the radiation pattern F5 of antenna 500e will be described in detail below, and other similar contents will not be repeated. In this embodiment, the radiation pattern F5 of antenna 500e includes a main extension F5a, a plurality of first extensions F5b and a plurality of second extensions F5c, and the radiation pattern F5 has a reference point p5. The coverage area of ​​the main extension F5a is larger than the coverage area of ​​each of the first extensions F5b and the second extensions F5c. The reference point p5 is closer to the side of antenna 500e that is closer to the first expansion circuit board 450 than the side of antenna 500e that is farther away from the first expansion circuit board 450. The main extension F5a extends from the reference point p5 in a direction close to the interference source 200. These first extensions F5b extend from the reference point p5 in a direction close to the first expansion circuit board 450 and are arranged in a ring around the reference point p5. These secondary extensions F5c extend from the reference point p5 in a direction away from the first extended circuit board 450 and are arranged in a ring around the reference point p5. In this embodiment, the minimum distance X5 between the interference source 200 and the radiation field pattern F5 also satisfies the inequality.

[0092] Alternatively, please see Figure 9 , Figure 9 This is a schematic diagram illustrating the radiation pattern of the antenna of the electronic component according to the seventh embodiment of the present invention. It should be noted that the electronic component 10f according to the seventh embodiment of the present invention and... Figures 1 to 3 The differences between the electronic components 10 according to the first embodiment of the present invention lie only in the form of the antenna radiation pattern. The electronic component 10f according to the seventh embodiment of the present invention may also include... Figures 1 to 3 The circuit board 100, interference source 200, shielding cover 300, multiple shielding clips 350, near-shielding pad 400, and first expansion circuit board 450 according to the first embodiment of the present invention are described below, and can be referenced. Figures 1 to 3The description of antenna 500 in the text is for understanding other features of antenna 500f according to the seventh embodiment of the present invention. Therefore, only the radiation pattern F6 of antenna 500f will be described in detail below, and other similar contents will not be repeated. In this embodiment, the radiation pattern F6 of antenna 500f includes two main extensions F6a, two first extensions F6b, and two second extensions F6c, and the radiation pattern F6 has a reference point p6. The coverage area of ​​each main extension F6a is larger than the coverage area of ​​each first extension F6b and each second extension F6c. The reference point p6 is closer to the side of antenna 500f that is closer to the first expansion circuit board 450 than the side of antenna 500f that is farther away from the first expansion circuit board 450. One of the main extensions F6a extends from the reference point p6 in a direction close to the interference source 200 and in a direction away from the first expansion circuit board 450. The other main extension F6a extends from the reference point p6 in a direction away from the interference source 200 and in a direction close to the first expansion circuit board 450. The first extension F6b extends from the reference point p6 in a direction close to the interference source 200 and is arranged in a ring around the reference point p6. The second extension F6c extends from the reference point p6 in a direction away from the interference source 200 and is arranged in a ring around the reference point p6. In this embodiment, the minimum distance X6 between the interference source 200 and the radiation field pattern F6 also satisfies the inequality.

[0093] Alternatively, please see Figure 10 , Figure 10 This is a schematic diagram illustrating the radiation pattern of the antenna of the electronic component according to the eighth embodiment of the present invention. It should be noted that the electronic component 10g according to the eighth embodiment of the present invention... Figures 1 to 3 The differences between the electronic components 10 according to the first embodiment of the present invention lie only in the form of the antenna radiation pattern. The electronic component 10g according to the eighth embodiment of the present invention may also include... Figures 1 to 3 The circuit board 100, interference source 200, shielding cover 300, multiple shielding clips 350, near-shielding pad 400, and first expansion circuit board 450 according to the first embodiment of the present invention are described below, and can be referenced. Figures 1 to 3 The description of antenna 500 in the text explains other features of antenna 500g according to the eighth embodiment of the present invention. Therefore, only the radiation pattern F7 of antenna 500g will be described in detail below, and other similar contents will not be repeated. In this embodiment, the radiation pattern F7 of antenna 500g includes a plurality of annular radiation fields F7a centered on antenna 500g, and the diameter F7D of the annular radiation fields F7a closer to the two ends of antenna 500g is smaller. In this embodiment, the minimum distance X7 between interference source 200 and radiation pattern F7 also satisfies the inequality.

[0094] This invention is not limited to the antenna's placement location, the number of near-shielding pads, or the placement location of the near-shielding pads. Please refer to [link / reference]. Figure 11 , Figure 11 This is a top view of an electronic component according to a ninth embodiment of the present invention. It should be noted that the electronic component 10h according to the ninth embodiment of the present invention is... Figures 1 to 3 The differences between the electronic components 10 according to the first embodiment of the present invention lie only in the antenna placement position, the number of near-shielding pads, and the placement position of the near-shielding pads. The electronic component 10h according to the ninth embodiment of the present invention may also include... Figures 1 to 3 The circuit board 100, interference source 200, shielding cover 300, multiple shielding clips 350, and first expansion circuit board 450 according to the first embodiment of the present invention are described below, and can be referenced. Figures 1 to 3 The description of the near-shielding pads 401h, 402h, and antenna 500h according to the ninth embodiment of the present invention will be used to understand other features of the near-shielding pads 401h, 402h, and antenna 500h. Therefore, only the placement position of antenna 500h, the number of near-shielding pads 401h and 402h, and the placement position of near-shielding pads 401h and 402h will be described in detail below, without repeating other similar content. In this embodiment, electronic component 10h includes two near-shielding pads 401h and 402h. In this embodiment, these two near-shielding pads 401h and 402h are disposed on the top surface 323 of top plate 320 and are located between opening 321 and antenna 500h. Specifically, near-shielding pad 401h is located between opening 321 and first outer surface 311, and near-shielding pad 402h is located between opening 321 and third outer surface 313, and the third outer surface 313 is closer to antenna 500h than the fourth outer surface 314. In this embodiment, antenna 500h is located on one side of reference plane B, at least a portion of near-shielding pad 401h overlaps with reference plane B, and near-shielding pad 402h is located on the same side of reference plane B as antenna 500h. In this embodiment, the two near-shielding pads 401h and 402h are separate from each other, but this is not a limitation. In other embodiments, the two near-shielding pads may also be directly connected to each other and together form an L-shaped shape.

[0095] Alternatively, please see Figure 12 , Figure 12 This is a top view of an electronic component according to a tenth embodiment of the present invention. It should be noted that the electronic component 10i according to the tenth embodiment of the present invention is... Figures 1 to 3 The differences between the electronic components 10 according to the first embodiment of the present invention lie only in the antenna placement position, the number of near-shielding pads, and the placement position of the near-shielding pads. The electronic component 10i according to the tenth embodiment of the present invention may also include... Figures 1 to 3 The circuit board 100, interference source 200, shielding cover 300, multiple shielding clips 350, and first expansion circuit board 450 according to the first embodiment of the present invention are described below, and can be referenced. Figures 1 to 3 The description of the near-shielding pads 400 and antenna 500 according to the tenth embodiment of the present invention will help to understand other features of the near-shielding pads 401i, 402i and antenna 500i. Therefore, only the placement position of antenna 500i, the number of near-shielding pads 401i and 402i and the placement position of near-shielding pads 401i and 402i will be described in detail below, and other similar contents will not be repeated. In this embodiment, electronic component 10i includes two near-shielding pads 401i and 402i. In this embodiment, these two near-shielding pads 401i and 402i are disposed on the top surface 323 of top plate 320 and are located between opening 321 and antenna 500i. In detail, near-shielding pad 401i is located between opening 321 and first outer surface 311, and near-shielding pad 402i is located between opening 321 and fourth outer surface 314, and the fourth outer surface 314 is closer to antenna 500i than the third outer surface 313. In this embodiment, antenna 500i is located on the other side of reference plane B, at least a portion of near-shielding pad 401i overlaps with reference plane B, and near-shielding pad 402i is located on the same side of reference plane B as antenna 500i. In this embodiment, the two near-shielding pads 401i and 402i are separate from each other, but this is not a limitation. In other embodiments, the two near-shielding pads may also be directly connected to each other and together form an L-shaped shape.

[0096] Alternatively, please see Figure 13 , Figure 13 This is a top view of an electronic component according to the eleventh embodiment of the present invention. It should be noted that the electronic component 10j according to the eleventh embodiment of the present invention is... Figures 1 to 3 The differences between the electronic components 10 according to the first embodiment of the present invention lie only in the number of antennas, the antenna placement positions, the number of near-shielding pads, and the placement positions of the near-shielding pads. The electronic component 10j according to the eleventh embodiment of the present invention may also include... Figures 1 to 3 The circuit board 100, interference source 200, shielding cover 300, multiple shielding clips 350, and first expansion circuit board 450 according to the first embodiment of the present invention are described below, and can be referenced. Figures 1 to 3The description of the near-shielding pads 400 and antennas 500 in this embodiment will help you understand other features of the near-shielding pads 401j, 402j, 403j and antennas 501j, 502j according to the eleventh embodiment of the present invention. Therefore, only the number of antennas 501j, 502j, the placement position of antennas 501j, 502j, the number of near-shielding pads 401j, 402j, 403j, and the placement position of near-shielding pads 401j, 402j, 403j will be described in detail below, and other similar contents will not be repeated. In this embodiment, the electronic component 10j includes two antennas 501j, 502j and three near-shielding pads 401j, 402j, 403j. In this embodiment, the three near-shielding pads 401j, 402j, 403j are disposed on the top surface 323 of the top plate 320 and are located between the opening 321 and the antennas 501j, 502j. In detail, the near shielding pad 401j is located between the opening 321 and the first outer surface 311, the near shielding pad 402j is located between the opening 321 and the third outer surface 313, and the near shielding pad 403j is located between the opening 321 and the fourth outer surface 314. The third outer surface 313 is closer to the antenna 501j than the fourth outer surface 314, and the fourth outer surface 314 is closer to the antenna 502j than the third outer surface 313. In this embodiment, the antennas 501j and 502j are located on opposite sides of the reference plane B. At least a portion of the near shielding pad 401j overlaps with the reference plane B, the near shielding pad 402j and the antenna 501j are located on the same side of the reference plane B, and the near shielding pad 403j and the antenna 502j are located on the same side of the reference plane B.

[0097] This invention is not limited to the grounding relationship between the circuit board and the first expansion circuit board. Please refer to [link / reference]. Figure 14 , Figure 14 This is a top view of an electronic component according to the twelfth embodiment of the present invention. It should be noted that the electronic component 10k according to the twelfth embodiment of the present invention is... Figures 1 to 3 The difference between the electronic components 10 according to the first embodiment of the present invention lies only in the grounding relationship between the circuit board and the first expansion circuit board. The electronic component 10k according to the twelfth embodiment of the present invention may also include... Figures 1 to 3 The interference source 200, shielding cover 300, multiple shielding clips 350, near-shielding pad 400, and antenna 500 according to the first embodiment of the present invention are described below, and can be referenced. Figures 1 to 3The description of circuit board 100k and first expansion circuit board 450k in the following section explains other features of circuit board 100k and first expansion circuit board 450k according to the twelfth embodiment of the present invention. Therefore, only the grounding relationship between circuit board 100k and first expansion circuit board 450k will be described in detail below, and other similar contents will not be repeated. In this embodiment, circuit board 100k and first expansion circuit board 450k together constitute a circuit board 550k, and shielding cover 300 and antenna 500 are electrically connected to the same ground layer (not shown) in circuit board 550k and share a common ground.

[0098] Alternatively, please see Figure 15 , Figure 15 This is a top view of an electronic component according to a thirteenth embodiment of the present invention. It should be noted that the electronic component 101 according to the thirteenth embodiment of the present invention is... Figure 11 The difference between the electronic components 10h according to the ninth embodiment of the present invention lies only in the grounding relationship between the circuit board and the first expansion circuit board. The electronic component 10l according to the thirteenth embodiment of the present invention may also include... Figures 1 to 3 According to the first embodiment of the present invention, the interference source 200, the shielding cover 300, and the plurality of shielding clips 350 may include, and may also include Figure 11 The near-shielding pads 401h and 402h and the antenna 500h according to the ninth embodiment of the present invention are referenced. Figures 1 to 3 The description of circuit board 100 and first expansion circuit board 450 in this embodiment will help you understand other features of circuit board 100 and first expansion circuit board 450 according to the thirteenth embodiment of the present invention. Therefore, only the grounding relationship between circuit board 100 and first expansion circuit board 450 will be described in detail below, and other similar contents will not be repeated. In this embodiment, circuit board 100 and first expansion circuit board 450 together constitute a circuit board 550, and shielding cover 300 and antenna 500h are electrically connected to the same ground layer (not shown) in circuit board 550 and share a common ground.

[0099] Alternatively, please see Figure 16 , Figure 16 This is a top view of an electronic component according to the fourteenth embodiment of the present invention. It should be noted that the electronic component 10m according to the fourteenth embodiment of the present invention... Figure 12 The difference between the electronic components 10i according to the tenth embodiment of the present invention lies only in the grounding relationship between the circuit board and the first expansion circuit board. The electronic component 10m according to the fourteenth embodiment of the present invention may also include... Figures 1 to 3 According to the first embodiment of the present invention, the interference source 200, the shielding cover 300, and the plurality of shielding clips 350 may include, and may also include Figure 12 The near-shielding pads 401i and 402i and the antenna 500i according to the tenth embodiment of the present invention are described herein, and may be referenced. Figures 1 to 3The description of circuit board 100m and first expansion circuit board 450m according to the fourteenth embodiment of the present invention will explain other features of circuit board 100m and first expansion circuit board 450m. Therefore, only the grounding relationship between circuit board 100m and first expansion circuit board 450m will be described in detail below, and other similar contents will not be repeated. In this embodiment, circuit board 100m and first expansion circuit board 450m together constitute a circuit board 550m, and shielding cover 300 and antenna 500i are electrically connected to the same ground layer (not shown) in circuit board 550m and share a common ground.

[0100] Alternatively, please see Figure 17 , Figure 17 This is a top view of an electronic component according to the fifteenth embodiment of the present invention. It should be noted that the electronic component 10n according to the fifteenth embodiment of the present invention is... Figure 13 The difference between the electronic components 10j according to the eleventh embodiment of the present invention lies only in the grounding relationship between the circuit board and the first expansion circuit board. The electronic component 10n according to the fifteenth embodiment of the present invention may also include... Figures 1 to 3 According to the first embodiment of the present invention, the interference source 200, the shielding cover 300, and the plurality of shielding clips 350 may include, and may also include Figure 13 The near-shielding pads 401j, 402j, 403j and antennas 501j, according to the eleventh embodiment of the present invention, may also be referred to. Figures 1 to 3 The description of circuit board 100 and first expansion circuit board 450 in this paper explains other features of circuit board 100n and first expansion circuit board 450n according to the fifteenth embodiment of the present invention. Therefore, only the grounding relationship between circuit board 100n and first expansion circuit board 450n will be described in detail below, and other similar contents will not be repeated. In this embodiment, circuit board 100n and first expansion circuit board 450n together constitute a circuit board 550n, and shielding cover 300 and antennas 501j and 502j are electrically connected to the same ground layer (not shown) in circuit board 550n and share a common ground.

[0101] This invention is not limited to the shape of the opening in the top plate of the shielding cover. Please refer to [link / reference]. Figure 18 , Figure 18 This is a top view of the shielding cover and near-shielding pad of an electronic component according to the sixteenth embodiment of the present invention. It should be noted that the electronic component 10p according to the sixteenth embodiment of the present invention... Figures 1 to 3 The difference between the electronic components 10 according to the first embodiment of the present invention lies only in the shape of the opening on the top plate of the shield. The electronic component 10p according to the sixteenth embodiment of the present invention may also include... Figures 1 to 3The circuit board 100, interference source 200, multiple shielding clips 350, near-shielding pad 400, first expansion circuit board 450, and antenna 500 according to the first embodiment of the present invention are described below, and can be referenced. Figures 1 to 3 The description of the shielding cover 300 in the text will help you understand other features of the shielding cover 300p according to the sixteenth embodiment of the present invention. Therefore, only the shape of the opening 321p of the top plate 320p of the shielding cover 300p will be described in detail below, and other similar contents will not be repeated. It should be noted that, in order to highlight the differences between this embodiment and the first embodiment, Figure 18 Only the shielding cover 300p and the near-shielding pad 400 disposed on the shielding cover 300p are shown. In this embodiment, the cross-section of the opening 321p of the top plate 320p of the shielding cover 300p is, for example, circular.

[0102] or, Figure 19 This is a top view of the shielding cover and near-shielding pad of an electronic component according to the seventeenth embodiment of the present invention. It should be noted that the electronic component 10q according to the seventeenth embodiment of the present invention and... Figures 1 to 3 The difference between the electronic components 10 according to the first embodiment of the present invention lies only in the shape of the opening on the top plate of the shield. The electronic component 10q according to the seventeenth embodiment of the present invention may also include... Figures 1 to 3 The circuit board 100, interference source 200, multiple shielding clips 350, near-shielding pad 400, first expansion circuit board 450, and antenna 500 according to the first embodiment of the present invention are described below, and can be referenced. Figures 1 to 3 The description of the shielding cover 300 in the text will help you understand other features of the shielding cover 300q according to the seventeenth embodiment of the present invention. Therefore, only the shape of the opening 321q of the top plate 320q of the shielding cover 300q will be described in detail below, and other similar contents will not be repeated. It should be noted that, in order to highlight the differences between this embodiment and the first embodiment, Figure 19 Only the shielding cover 300q and the near-shielding pad 400 disposed on the shielding cover 300q are shown. In this embodiment, the cross-section of the opening 321q of the top plate 320q of the shielding cover 300q is, for example, rectangular.

[0103] This invention is not limited to the shape and number of openings on the top plate of the shielding cover. Figure 20 This is a top view of the shielding cover and near-shielding pad of an electronic component according to the eighteenth embodiment of the present invention. It should be noted that the electronic component 10r according to the eighteenth embodiment of the present invention... Figures 1 to 3 The differences between the electronic components 10 according to the first embodiment of the present invention lie only in the number and shape of the openings in the top plate of the shield. The electronic component 10r according to the eighteenth embodiment of the present invention may also include... Figures 1 to 3The circuit board 100, interference source 200, multiple shielding clips 350, near-shielding pad 400, first expansion circuit board 450, and antenna 500 according to the first embodiment of the present invention are described below, and can be referenced. Figures 1 to 3 The description of the shielding cover 300 in the text will help you understand other features of the shielding cover 300r according to the eighteenth embodiment of the present invention. Therefore, only the number and shape of the openings 321r of the top plate 320r of the shielding cover 300r will be described in detail below, and other similar contents will not be repeated. It should be noted that, in order to highlight the differences between this embodiment and the first embodiment, Figure 20 The image only shows the shielding cover 300r and the near-shielding pad 400 disposed on the shielding cover 300r. In this embodiment, the top plate 320r of the shielding cover 300r has two openings 321r that are separate from each other, and the cross-sections of these two openings 321r are, for example, triangular and square, respectively. Furthermore, the square-sectioned opening 321r is located between the triangular-sectioned opening 321r and the near-shielding pad 400.

[0104] Figure 21 This is a top view of an electronic component according to the nineteenth embodiment of the present invention. It should be noted that the electronic component 10s according to the nineteenth embodiment of the present invention is... Figures 1 to 3 The difference between the electronic components 10 according to the first embodiment of the present invention is that the electronic component 10s according to the nineteenth embodiment of the present invention further includes a second expansion circuit board 600s, a housing 650s, and a far-shielding pad 700s. The electronic component 10r according to the nineteenth embodiment of the present invention may also include Figures 1 to 3 According to the first embodiment of the present invention, a circuit board 100, an interference source 200, a shielding cover 300, a plurality of shielding clips 350, a near shielding pad 400, a first extended circuit board 450, and an antenna 500 are included. Therefore, only the second extended circuit board 600s, the housing 650s, and the far shielding pad 700s will be described in detail below, and other similar contents will not be repeated. In this embodiment, the second extended circuit board 600s is located between the circuit board 100 and the first extended circuit board 450. The housing 650s is disposed on the second extended circuit board 600s and is, for example, a computer case, a server case, a speaker case, or a battery case. The far shielding pad 700s is disposed on the side of the housing 650s away from the second extended circuit board 600s. The far shielding pad 700s is separated from the shielding cover 300 and is located between the opening 321 and the antenna 500. In this embodiment, the circuit board 100, the first expansion circuit board 450 and the second expansion circuit board 600s are separated from each other, so that the shielding cover 300, the antenna 500 and the far shielding pad 700s are not grounded together.

[0105] In addition, please see Figure 22A and Figure 22B , Figure 22A To present Figure 21A schematic diagram showing the distance between the shielding pads and antennas of the electronic components. Figure 22B To demonstrate the suppression effect between the far-shielding pad and the antenna at different spacing distances, in this embodiment, the spacing distance D between the far-shielding pad 700s and the antenna 500 conforms to the inequality... To prevent the 700s shielding pad from interfering with the operation of the 500 antenna. Figure 22B It is to present when Figure 21 When interference source 200 emits electromagnetic waves with a frequency of 780MHz, the suppression effect of the shielding pad 700s and antenna 500 on the electromagnetic waves under different spacing distances D is observed. It should be noted that... Figure 22B The horizontal axis represents the distance D between the far-shielding pad 700s and the antenna 500. For example... Figure 22B As shown, the distance D between the far-shielding pad 700s and the antenna 500 conforms to the inequality. In all cases, it has a good suppression effect on the electromagnetic waves. When the distance D between the shielding pad 700s and the antenna 500 is slightly less than... The inhibitory effect is even better when the time is right.

[0106] This invention is not limited to the grounding relationship between the circuit board, the first expansion circuit board, and the second expansion circuit board. Please refer to [link / reference]. Figure 23 , Figure 23 This is a top view of an electronic component according to a twenty-first embodiment of the present invention. The electronic component 10t according to the twenty-first embodiment of the present invention... Figure 21 The difference between the electronic components 10s according to the nineteenth embodiment of the present invention lies only in the grounding relationship between the circuit board, the first expansion circuit board, and the second expansion circuit board. The electronic component 10t according to the twentieth embodiment of the present invention may also include Figures 1 to 3 According to the first embodiment of the present invention, the interference source 200, the shielding cover 300, the plurality of shielding clips 350, the near-shielding pad 400, and the antenna 500 may include, and may also include Figure 21 and Figures 22A-22B The housing 650s and the far-shielding pad 700s according to the nineteenth embodiment of the present invention can also be referred to. Figure 1 The relevant descriptions of circuit board 100 and the first expansion circuit board 450, and Figure 21The description of the second expansion circuit board 600s in this embodiment explains other features of the circuit board 100t, the first expansion circuit board 450t, and the second expansion circuit board 600t according to the twentieth embodiment of the present invention. Therefore, only the grounding relationship between the circuit board 100t, the first expansion circuit board 450t, and the second expansion circuit board 600t will be described in detail below, and other similar contents will not be repeated. In this embodiment, the circuit board 100t and the second expansion circuit board 600t together constitute a circuit board 550t, and the shielding cover 300 and the far shielding pad 700s are electrically connected to the same ground layer of the circuit board 550t and share a common ground. In this embodiment, the first expansion circuit board 450t is separated from the circuit board 550t, so that the antenna 500 does not share a common ground with the shielding cover 300 and the far shielding pad 700s.

[0107] Figure 24 This is a top view of an electronic component according to a twenty-first embodiment of the present invention. The electronic component 10u according to the twenty-first embodiment of the present invention... Figure 13 The difference between the electronic components 10j according to the eleventh embodiment of the present invention is that the electronic component 10u according to the twenty-first embodiment of the present invention further includes two far-field shielding pads 700u. The electronic component 10u according to the twenty-first embodiment of the present invention may also include Figures 1 to 3 According to the first embodiment of the present invention, a circuit board 100, an interference source 200, a shielding cover 300, a plurality of shielding clips 350, and a first expansion circuit board 450 are included, and may also include Figure 13 The near shielding pads 401j, 402j, 403j and antennas 501j, 502j are described according to the eleventh embodiment. Therefore, only the two far shielding pads 700u are described in detail below, and other similar contents will not be repeated. In this embodiment, the two far shielding pads 700u are separated from each other and directly disposed on the circuit board 100. The two far shielding pads 700u are separated from the shielding cover 300 and are located between the opening 321 and the antennas 501j, 502j. In this embodiment, the far shielding pads 700u and the shielding cover 300 are electrically connected to the same ground layer in the circuit board 100 and share a common ground. The first expansion circuit board 450 is separated from the circuit board 100 so that the antennas 501j, 502j do not share a common ground with the shielding cover 300 and the far shielding pads 700u. It should be noted that the distance relationship between the two far shielding pads 700u and the antennas 501j, 502j according to this embodiment is different from that between the two far shielding pads 700u and the antennas 501j, 502j respectively. Figures 22A-22B The distance relationship between the far-field shielding pad 700s and the antenna 500 is similar, so it will not be described in detail here.

[0108] Figure 25 This is a top view of an electronic component according to a twenty-second embodiment of the present invention. The electronic component 10V according to the twenty-second embodiment of the present invention... Figure 24The difference between the electronic components 10u according to the twenty-first embodiment of the present invention lies only in the grounding relationship between the circuit board and the first expansion circuit board. The electronic component 10v according to the twenty-second embodiment of the present invention may also include Figures 1 to 3 According to the first embodiment of the present invention, the interference source 200, the shielding cover 300, and the plurality of shielding clips 350 are included. Figure 13 According to the eleventh embodiment, the near-shielding pads 401j, 402j, 403j and the antennas 501j, 502j and Figure 24 The second-stage shielding pad is 700u, and can also be referenced. Figure 1 The description of circuit board 100 and the first expansion circuit board 450 in this embodiment will help you understand other features of circuit board 100v and the first expansion circuit board 450v according to the twenty-second embodiment of the present invention. Therefore, only the grounding relationship between circuit board 100v and the first expansion circuit board 450v will be described in detail below, and other similar contents will not be repeated. In this embodiment, circuit board 100v and the first expansion circuit board 450v together constitute a circuit board 550v, and the shield 300, the far shielding pad 700u and the antennas 501j and 502j are electrically connected to the same ground layer (not shown) in circuit board 550v and share a common ground.

[0109] It should be noted that in some embodiments, the electronic component may include only the far shielding pad and not the near shielding pad.

[0110] Please see Figure 26 and Figure 27 , Figure 26 To present a graph illustrating the shielding effect of the electronic components according to the present invention, and Figure 27 Another graph illustrating the shielding effect of the electronic components according to the present invention. Figure 26 and Figure 27 In the graph, the vertical axis represents the intensity of the electromagnetic interference field emitted by the interference source (in decibels per milliwatt (dBm), and the horizontal axis represents the frequency of the electromagnetic waves emitted by the interference source (in megahertz (MHz)). Figure 26 and Figure 27 In the diagram, the dashed lines represent the experimental data of Comparative Example 1, which did not have a shielding cover, near-shield pad, or far-shield pad; the thin solid lines represent the experimental data of Comparative Example 2, which had a shielding cover but no near-shield pad or far-shield pad; and the thick solid lines represent... Figure 14 Experimental data for the twelfth embodiment, which includes shielding covers and near-shielding pads that share a common ground but lacks a far-shielding pad, are shown in the diagram, represented by a single-point chain line. Figure 25 Experimental data from the twenty-second embodiment, which includes a shielding cover, a near shielding pad, and a far shielding pad that share a common ground.

[0111] like Figure 26The ranges between 762MHz and 806MHz, 850MHz and 894MHz, and 938MHz and 960MHz are shown, and as... Figure 27 As shown in the ranges between 1802MHz and 1848MHz and between 2124MHz and 2170MHz, the electromagnetic interference suppression effects of the first embodiment and the nineteenth embodiment are significantly better than those of Comparative Example 1 and Comparative Example 2, and the electromagnetic interference suppression effect of the nineteenth embodiment is better than that of the first embodiment. Therefore, using the near-shielding pad according to the present invention reduces the electromagnetic interference generated by the interference source on the antenna, and using both the near-shielding pad and the far-shielding pad according to the present invention can further reduce the electromagnetic interference generated by the interference source on the antenna.

[0112] According to the electronic components disclosed in the above embodiments, the electromagnetic waves emitted by the interference source are attenuated before reaching the antenna due to reflection, diffraction, and penetration of the near-shielding pad located between the opening and the antenna, or by the far-shielding pad located separately from the shielding cover and between the opening and the antenna, respectively. This effectively mitigates electromagnetic interference between interference sources of different specifications and the antenna, while also reducing the manufacturing cost of the electronic components.

[0113] Furthermore, the minimum distance X between the interference source and the radiation field pattern conforms to the inequality. In other words, this invention uses the antenna's radiation pattern, rather than the distance between the antenna and the interference source, to determine whether the interference source is likely to cause electromagnetic interference to the antenna. Therefore, this invention can accurately identify interference sources that are more likely to cause electromagnetic interference to the antenna and provide near-shielding or far-shielding pads for these interference sources.

[0114] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the claims appended to this specification.

Claims

1. An electronic component comprising: A circuit board; An interference source is set up and electrically connected to the circuit board; A shielding cover includes a side peripheral plate and a top plate. The side peripheral plate stands on the circuit board, and the top plate is connected to the side of the side peripheral plate away from the circuit board. The top plate has an opening, and the side peripheral plate surrounds the interference source, which is located in the opening. An antenna, located on one side of the shield; and A near-shielding pad is disposed on the top plate of the shielding cover away from the side plate and located between the opening and the antenna; in, The electromagnetic wave emitted by the interference source has a wavelength λ, and the antenna has a radiation pattern. The minimum distance X between the interference source and the radiation pattern satisfies the inequality X < λ / λ. .

2. The electronic component of claim 1, wherein the height of the side of the near-shielding pad away from the circuit board relative to the circuit board is greater than the height of the side of the interference source away from the circuit board relative to the circuit board.

3. The electronic component of claim 1 further includes a far shielding pad, the far shielding pad being separated from the shielding cover and located between the opening and the antenna.

4. The electronic component of claim 3, wherein the electromagnetic wave emitted by the interference source has a wavelength λ, the antenna has a radiation pattern, and the minimum distance D between the shielding pad and the antenna conforms to the inequality. .

5. The electronic component of claim 3, wherein the shield and the far shielding pad are grounded together, and the antenna is not grounded together with the shield and the far shielding pad.

6. The electronic component of claim 3, wherein the shield, the antenna, and the far shielding pad are not grounded together.

7. The electronic component of claim 1, wherein the shield and the antenna share a common ground.

8. The electronic component of claim 1, wherein the shield and the antenna are not grounded together.

9. The electronic component of claim 1, wherein the frequency of the electromagnetic waves emitted by the interference source is greater than or equal to 700 MHz and less than or equal to 8 GHz.

10. An electronic component comprising: A circuit board; An interference source is set up and electrically connected to the circuit board; A shielding cover includes a side peripheral plate and a top plate. The side peripheral plate stands on the circuit board, and the top plate is connected to the side of the side peripheral plate away from the circuit board. The top plate has an opening, and the side peripheral plate surrounds the interference source, which is located in the opening. An antenna is located on one side of the shielding cover; as well as A shielding pad, separate from the shielding cover and located between the opening and the antenna; The electromagnetic wave emitted by the interference source has a wavelength λ, the antenna has a radiation pattern, and the minimum distance X between the interference source and the radiation pattern satisfies the inequality X < λ / λ. .

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