A power supply system

Abstract

This invention provides a power supply system belonging to the field of communication equipment technology. It includes two parallel subsystems, each subsystem comprising a heat sink housing and a printed circuit board (PCB) fixedly disposed within the inner cavity of the heat sink housing. The two heat sink housings are fastened together. The two PCBs are connected via a copper busbar assembly. One of the PCBs has a locking element detachably connected to one end of the copper busbar assembly. A mounting opening is provided on the side wall of one of the heat sink housings, corresponding to the locking element. A sealing plate can also be detachably connected to the mounting opening. After the sealing plate is removed from the heat sink housing, the locking element is exposed at the mounting opening. The power supply system provided by this invention allows each subsystem to function as an independent power source for reference power supply, and also enables parallel connection via the copper busbar assembly. The parallel connection of the two PCBs via the copper busbar assembly is performed at the mounting opening on the outer side wall of one of the heat sink housings, making the operation simple and convenient.

Description

Technical Field

[0001] This invention belongs to the field of communication equipment technology, and more specifically, relates to a power supply system. Background Technology

[0002] In the field of communication technology, it is often necessary to install and configure a separate power supply system for a base station to provide outdoor power for the relevant communication equipment of the base station.

[0003] In the prior art, a single power supply system can be used to power the base station; in order to save installation space and simplify the fixing process of the power supply system while increasing the power of the power supply system, two independent power supply systems can also be connected in parallel to power the base station.

[0004] Taking a 5G power system as an example, each power system has a printed circuit board inside its casing. Since the casing of a 5G power system is very small, when two casings are connected, the two printed circuit boards are encapsulated inside the casing, making it difficult to operate the two printed circuit boards in parallel. Summary of the Invention

[0005] The purpose of this invention is to provide a power supply system that solves the technical problem of difficulty in parallel operation of two printed circuit boards after two power supply systems are connected in the prior art.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: a power supply system is provided, comprising two parallel subsystems, each subsystem comprising a heat sink housing and a printed circuit board fixedly disposed within the inner cavity of the heat sink housing; the two heat sink housings are fastened together; the two printed circuit boards are connected by a copper busbar assembly;

[0007] One of the printed circuit boards is provided with a locking element that is detachably connected to one end of the copper busbar assembly;

[0008] One of the heat dissipation housings has a mounting opening on its side wall, which corresponds to the locking member; a sealing plate can also be detachably connected to the mounting opening.

[0009] After the sealing plate is removed from the heat dissipation housing, the locking member is exposed at the mounting opening.

[0010] In one possible implementation, the two printed circuit boards are arranged in parallel with their front surfaces facing each other, and the two ends of the copper busbar assembly are respectively disposed on the front surfaces of the two printed circuit boards.

[0011] In one possible implementation, another of the printed circuit boards is provided with an anti-rotation platform that is inserted and connected to the other end of the copper busbar assembly.

[0012] In one possible implementation, the two heat dissipation shells are fastened together and placed in a vertical direction; each heat dissipation shell has a heat dissipation tooth assembly on its outer side wall; the heat dissipation tooth assembly includes a plurality of spaced heat dissipation teeth, each of which extends upward from the bottom end of the heat dissipation shell to the top end of the heat dissipation shell.

[0013] In some embodiments, the two heat dissipation housings are fastened together and placed in the vertical direction; there is a heat dissipation space between the upper edge of the two printed circuit boards and the upper inner wall of the corresponding heat dissipation housing; a heat sink is fixedly installed in the heat dissipation space.

[0014] In some embodiments, the heat sink is provided with a first insulating pad, and the first insulating pad is provided with a first electronic component group;

[0015] The printed circuit board is provided with a first clearance hole, and a second electronic component group is provided at the first clearance hole. The second electronic component group is attached to the inner sidewall of the heat dissipation housing.

[0016] The first electronic component group and the second electronic component group are electrically connected to the printed circuit board, and the heat generated by the first electronic component group is greater than the heat generated by the second electronic component group.

[0017] In some embodiments, an insulating limiting sleeve is embedded in the heat sink, and the first electronic component group, the first insulating gasket, and the insulating limiting sleeve are fixedly connected by fasteners.

[0018] In some embodiments, a third electronic component group is provided on the back surface of the printed circuit board, and the third electronic component group is attached to the inner sidewall of the heat dissipation housing; the heat generation of the third electronic component group is less than that of the first electronic component group.

[0019] The front side of the printed circuit board is provided with a fourth electronic component group, and the heat generation of the fourth electronic component group is less than that of the third electronic component group.

[0020] In some embodiments, a first protrusion is provided on the inner sidewall of the heat sink housing at the location corresponding to the second electronic component group, and a second insulating pad is provided on the first protrusion; the second insulating pad abuts against the second electronic component group;

[0021] The inner wall of the heat sink housing is provided with a second protrusion at the location corresponding to the third electronic component group, and a third insulating pad is provided on the second protrusion; the third insulating pad abuts against the third electronic component group.

[0022] In some embodiments, an insulating plate is provided between each printed circuit board and the inner wall of the corresponding heat sink housing, and the insulating plate is provided with second clearance holes at the locations corresponding to the second electronic component group and the third electronic component group.

[0023] In this invention's power system, before the two subsystems are connected in parallel, the copper busbar assembly is not connected to the two printed circuit boards. The two subsystems can be assembled, transported, and fixed independently, and each subsystem can serve as an independent power source to power the base station. If it is necessary to connect the two subsystems in parallel, first connect the copper busbar assembly to one of the printed circuit boards, then fasten the two heat sink housings together, then open the cover plate to expose the mounting port, and use a locking device to lock the copper busbar assembly to the other printed circuit board from the mounting port to achieve the connection of the two printed circuit boards. Finally, seal the mounting port with the cover plate.

[0024] Compared with the prior art, the power system provided by the present invention allows each subsystem to function as an independent power source to power the base station, and also to be connected in parallel via copper busbar assemblies. The parallel connection of the two printed circuit boards via the copper busbar assemblies is performed at the mounting port on the outer wall of one of the heat sink housings. The operation is simple and convenient, and can achieve a stable connection between the two subsystems. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is an exploded structural diagram of a power supply system provided in an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the power supply system after removing the heat sink housing, as provided in an embodiment of the present invention.

[0028] Figure 3 A schematic diagram of the power supply system provided in an embodiment of the present invention (the cover plate is not shown in the figure);

[0029] Figure 4 This is a schematic diagram of the anti-rotation platform of the power supply system provided in an embodiment of the present invention;

[0030] Figure 5 An exploded structural diagram of one of the subsystems of the power supply system provided in an embodiment of the present invention (the heat dissipation housing is not shown in the figure).

[0031] Figure 6An exploded structural diagram of another subsystem of the power system provided in an embodiment of the present invention (the heat sink is not shown in the figure).

[0032] Figure 7 This is a schematic diagram of the structure of one of the heat dissipation housings of the power supply system provided in an embodiment of the present invention;

[0033] Figure 8 This is a schematic diagram of another heat dissipation housing of the power supply system provided in an embodiment of the present invention;

[0034] Figure 9 This is a schematic diagram of the structure of one of the subsystems of the power supply system provided in an embodiment of the present invention;

[0035] Figure 10 A schematic diagram of the heat sink of the power system provided in an embodiment of the present invention after removing the IGBT transistors and fasteners;

[0036] Figure 11 for Figure 6 Enlarged structural diagram of point A in the middle circle;

[0037] Figure 12 This is a schematic diagram of the installation structure of a power supply system provided in an embodiment of the present invention.

[0038] In the diagram: 1. Heat sink housing; 11. Heat dissipation space; 13. Heat dissipation gear assembly; 14. Mounting port; 15. Sealing plate; 16. First boss; 17. Second boss; 2. Printed circuit board; 21. First clearance hole; 31. First electronic component group; 32. Second electronic component group; 33. Third electronic component group; 34. Fourth electronic component group; 4. Copper busbar assembly; 41. Locking element; 42. Anti-rotation platform; 421. Positioning post; 422. Limiting post; 43. Positive power supply copper busbar; 44. Negative power supply copper busbar; 45. DC positive copper busbar; 46. DC negative copper busbar; 51. Insulating plate; 511. Second clearance hole; 53. First insulating gasket; 54. Insulating limiting sleeve; 6. Heat sink; 7. Fastener; 81. Connecting seat; 82. Second output plug; 9. Pole structure; 91. Utility pole. Detailed Implementation

[0039] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0040] Please refer to the following: Figures 1 to 3The power supply system provided by the present invention will now be described. The power supply system includes two parallel subsystems, each subsystem including a heat sink 1 and a printed circuit board 2 fixedly disposed in the inner cavity of the heat sink 1; the two heat sink 1s are fastened together; the two printed circuit boards 2 are connected by a copper busbar assembly 4; one of the printed circuit boards 2 is provided with a locking member 41 that is detachably connected to one end of the copper busbar assembly 4; one of the heat sink 1s has an installation opening 14 on its side wall, the installation opening 14 corresponding to the locking member 41; a sealing plate 15 can also be detachably connected to the installation opening 14; wherein, after the sealing plate 15 is removed from the heat sink 1, the locking member 41 is exposed at the installation opening 14.

[0041] It should be noted that the two heat sink housings 1 have roughly the same structural dimensions, or the two heat sink housings 1 are housings with the same shape. This allows the same mold to be used to produce the aforementioned heat sink housings 1, thereby reducing production costs.

[0042] The two heat sink housings 1 are fastened together. Specifically, threaded holes can be added to the mating surfaces of the two heat sink housings 1 respectively. The threaded holes of the two heat sink housings 1 are aligned and connected by threaded fasteners.

[0043] The inner cavity of the heat sink housing 1 can be a closed cavity, with the printed circuit board 2 enclosed within it, to ensure good sealing and waterproofing performance for each subsystem. However, the aforementioned closed cavity can be opened, meaning that the heat sink housing 1 consists of at least two parts. After removing one part, the inner cavity is exposed to facilitate the assembly of the printed circuit board 2 and the copper busbar assembly 4.

[0044] The two subsystems can function as independent power sources for the base station, or they can be connected in parallel to form a larger power system to power the base station. Specifically, before the two subsystems are connected in parallel, the copper busbar assembly 4 is not connected to the two printed circuit boards 2. The two subsystems can be assembled, transported, and fixed separately, and each subsystem can be used independently.

[0045] If the two subsystems need to be connected in parallel, first connect the copper busbar assembly 4 to one of the printed circuit boards 2, then fasten the two heat sink housings 1 together, then open the cover plate 15 to expose the mounting port 14, and use the locking member 41 to lock the copper busbar assembly 4 onto the other printed circuit board 2 from the mounting port 14 to achieve the connection of the two printed circuit boards 2. Finally, cover the mounting port 14 with the cover plate 15 to complete the parallel connection of the two subsystems.

[0046] Since the locking member 41 is inserted into the copper busbar assembly 4 through the mounting port 14, the operating space for locking the locking member 41 is large, which makes it easy for the operator to perform fastening operations on the copper busbar assembly 4, saving operation time, improving efficiency, and effectively providing insulation protection for the operator.

[0047] Compared with the prior art, the power system provided by the present invention allows each subsystem to function as an independent power source to power the base station, and can also be connected in parallel through the copper busbar assembly 4. The parallel connection of the two printed circuit boards 2 through the copper busbar assembly 4 is performed at the mounting port 14 on the outer side wall of one of the heat dissipation housings 1. The operation is simple and convenient, and can achieve a stable connection between the two subsystems.

[0048] In some embodiments, the two printed circuit boards 2 described above can be adopted as follows: Figure 2 The structure shown is described in the following document. Figure 2 Two printed circuit boards 2 are arranged in parallel with their front surfaces facing each other, and the two ends of the copper busbar assembly 4 are respectively arranged on the front surfaces of the two printed circuit boards 2.

[0049] Generally, the front surface of the printed circuit board 2 is used to set electronic components. When the front surfaces of two printed circuit boards 2 are facing each other, that is, when the two front surfaces are set face to face, the electronic components are confined between the two printed circuit boards 2. On the one hand, the electronic components can increase the distance between the two printed circuit boards 2, that is, each printed circuit board 2 is closer to the side wall of the heat sink housing 1, and the heat generated by the two printed circuit boards 2 is prevented from accumulating. On the other hand, it ensures that the distance between the two printed circuit boards 2 exceeds the specified distance, which facilitates the assembly of the copper busbar assembly 4.

[0050] In some embodiments, the copper busbar assembly 4 and another printed circuit board 2 may also be connected by a means such as Figure 4 The structure shown is described in the following document. Figure 4 Another printed circuit board 2 is provided with an anti-rotation platform 42 that is inserted and connected to the other end of the copper busbar assembly 4.

[0051] Specifically, the anti-rotation platform 42 is provided with a positioning post 421, and one end of the copper busbar assembly 4 is provided with a positioning hole. The positioning post 421 is inserted and limited in the positioning hole to realize the connection between the copper busbar assembly 4 and the anti-rotation platform 42. In addition, two sets of limiting posts 422 are provided around the positioning post 421 on the anti-rotation platform 42. The two sets of limiting posts 422 abut against the two side walls of the copper busbar assembly 4 to limit the rotation of the copper busbar assembly 4.

[0052] By using the anti-rotation platform 42 connected to the copper busbar assembly 4, when the locking member 41 is rotated and tightened, the copper busbar assembly 4 can be prevented from rotating with the locking member 41, thereby ensuring the accurate fixing position of the copper busbar assembly 4 and ensuring the connection stability between the copper busbar assembly 4 and the printed circuit board 2.

[0053] Specifically, the aforementioned copper busbar assembly 4 includes a positive power supply copper busbar 43, a negative power supply copper busbar 44, a DC positive power supply copper busbar 45, and a DC negative power supply copper busbar 46. It should be noted that one end of each of the above copper busbars is fixed on an anti-rotation platform 42, and the other end is locked by a locking member 41.

[0054] In some embodiments, the heat sink 1 may be as follows: Figure 7 and Figure 8 The structure shown is described in the following document. Figure 7 and Figure 8 Two heat dissipation shells 1 are fastened together and placed vertically; one side of each heat dissipation shell 1 is an open surface, and the open surfaces of the two heat dissipation shells 1 are fastened together; each heat dissipation shell 1 has a heat dissipation tooth assembly 13 on its outer side wall. The heat dissipation tooth assembly 13 includes multiple spaced heat dissipation teeth, each of which extends from the bottom end of the heat dissipation shell 1 upwards to the top end.

[0055] The heat dissipation fins 13 can cover the entire outer wall of the heat sink housing 1, or they can be distributed only on one of the outer walls of the heat sink housing 1, that is, the heat dissipation fins 13 correspond to the printed circuit board 2. The heat generated by the electronic components can be carried away from the heat sink housing 1 through the heat dissipation fins 13, so that the power system can use the structure of the heat sink housing 1 itself to dissipate heat from the printed circuit board 2.

[0056] It should be noted that, since the two heat sink housings 1 need to be fastened together and the copper busbar assembly 4 needs to be installed in the inner cavity of the two heat sink housings 1, the two heat sink housings 1 have open surfaces; when the two subsystems do not need to be connected in parallel, a cover plate can be installed on the open surface of the heat sink housing 1 to seal the inner cavity of the heat sink housing 1, so that the subsystem can be used independently.

[0057] Preferably, the heat dissipation fins 13 are distributed on the vertical sidewalls and top sidewalls of the heat dissipation housing 1. The aforementioned vertical sidewalls are the sidewalls corresponding to the printed circuit board 2 (i.e., corresponding to the opening surface), and are also the vertical sidewalls with the largest surface area. The heat dissipation fins 13 extend upward from the bottom end to the top end of the vertical sidewalls.

[0058] Since the heat sink 1 is arranged in the vertical direction, each heat dissipation tooth extends from the bottom end of the heat sink 1 to the top end of the heat sink 1. In other words, the extension direction of the heat dissipation tooth is the same as the airflow direction. This will not block the airflow and ensure that the upper part of the heat sink 1 has airflow. In addition, during the airflow process, the flow resistance gradually decreases and the speed gradually increases. The fast-flowing airflow can also quickly remove the heat of the heat sink 6, thereby ensuring the normal operation of the power supply system.

[0059] In addition, the heat dissipation teeth 13 are also distributed on the top wall of the heat dissipation housing 1. Since the heat is most concentrated at the top of the inner cavity of the heat dissipation housing 1, the heat dissipation teeth 13 on the top wall also correspond to the top of the inner cavity of the heat dissipation housing 1, so as to increase the area of ​​the heat dissipation teeth 13 and improve the heat dissipation effect.

[0060] In some embodiments, the power supply system described above may also employ, for example... Figure 9 and Figure 12 The structure shown is described in the following document. Figure 9and Figure 12 There is a heat dissipation space 11 between the upper edge of the two printed circuit boards 2 and the upper inner wall of the corresponding heat dissipation housing 1; a heat sink 6 is fixedly installed in the heat dissipation space 11.

[0061] Specifically, the heat dissipation housing 1 can be hung on a wall, or fixed to a utility pole 91 or steel frame using a pole-mounting structure 9. The heat dissipation housing 1 is arranged in the vertical direction, such as... Figure 12 As shown, after the power system is installed, its height direction is vertical, which is also the axis of the utility pole 91.

[0062] Airflow generally flows from bottom to top. Therefore, inside the heat sink 1, the airflow temperature is low and the flow resistance is high at the bottom. As the airflow rises, it carries away heat, and the temperature rises after the airflow reaches the upper part of the heat sink 1. Since there is a heat dissipation space 11 between the upper edge of the printed circuit board 2 and the upper inner wall of the heat sink 1, a heat sink 6 is installed in the heat dissipation space 11 to absorb the heat in the last part of the heat sink 1 in order to prevent heat from accumulating in the heat dissipation space 11 and being unable to dissipate. Furthermore, during the airflow process, the flow resistance gradually decreases and the speed gradually increases. The fast-flowing airflow can also quickly carry away the heat from the heat sink 6, thereby ensuring the normal operation of the power supply system.

[0063] In some embodiments, the power supply system described above may also employ, for example... Figure 5 , Figure 6 and Figure 9 The structure shown is described in the following document. Figure 5 , Figure 6 and Figure 9 The heat sink 6 is provided with a first insulating pad 53, and a first electronic component group 31 is provided on the first insulating pad 53; the printed circuit board 2 is provided with a first clearance hole 21, and a second electronic component group 32 is provided at the first clearance hole 21. The second electronic component group 32 is attached to the inner sidewall of the heat sink housing 1; the first electronic component group 31 and the second electronic component group 32 are electrically connected to the printed circuit board 2 respectively, and the heat generated by the first electronic component group 31 is greater than the heat generated by the second electronic component group 32.

[0064] The first electronic component group 31, which generates a lot of heat, is placed on the heat sink 6, and the heat sink 6 directly dissipates heat from the first electronic component group 31, avoiding heat concentration. In addition, a heat dissipation tooth group 13 is provided on the outer surface of the heat sink housing 1, and the heat sink housing 1 itself dissipates heat from the printed circuit board 2. Moreover, a first clearance hole 21 is opened on the printed circuit board 2, and the second electronic component group 32 is located at the first clearance hole 21, so it can fit against the inner side wall of the heat sink housing 1, reducing the heat flow path. The heat of the second electronic component group 32 can be directly dissipated through the heat sink housing 1, avoiding heat concentration.

[0065] In some embodiments, the power supply system described above may also employ, for example... Figure 5 and Figure 6 The structure shown is described in the following document. Figure 5 and Figure 6 The back panel of the printed circuit board 2 is provided with a third electronic component group 33, which is attached to the inner sidewall of the heat sink 1; the heat generation of the third electronic component group 33 is less than that of the first electronic component group 31; the front panel of the printed circuit board 2 is provided with a fourth electronic component group 34, which is less than that of the third electronic component group 33.

[0066] Normally, the front side of the printed circuit board 2 is used to set up electronic component groups. In this embodiment, in order to improve the heat dissipation effect, some of the third electronic component groups 33 with large heat dissipation are set on the back side of the printed circuit board 2, so that the third electronic component groups 33 are attached to the inner side wall of the heat dissipation housing 1, reducing the heat flow path and avoiding heat concentration.

[0067] It should be noted that the first electronic component group 31, the second electronic component group 32 and the third electronic component group 33 are all electronic components that generate a lot of heat, while the fourth electronic component group 34 is an electronic component that generates a little heat.

[0068] Among them, the first electronic component group 31 generates the most heat, so it is placed on the heat sink 6 to directly dissipate heat from the first electronic component group 31; the second electronic component group 32 is recessed in the first clearance hole 21, and the third electronic component group 33 is placed on the back panel of the printed circuit board 2, so that the second electronic component group 32 and the third electronic component group 33 are both attached to the inner side wall of the heat sink housing 1 to reduce the heat flow path.

[0069] Among them, the second electronic component group 32 consists of thicker electronic components, such as magnetic devices; the third electronic component group 33 consists of thinner electronic components, such as MOSFETs and bridge rectifiers.

[0070] It should be noted that although the second electronic component group 32 is recessed into the first clearance hole 21, the second electronic component group 32 is still connected to the printed circuit board 2 via solder pads.

[0071] In some embodiments, the heat sink 1 may also employ, for example... Figure 7 and Figure 8 The structure shown is described in the following document. Figure 7 and Figure 8 The inner sidewall of the heat sink housing 1 is provided with a first protrusion 16 at the location corresponding to the second electronic component group 32, and a second insulating pad is provided on the first protrusion 16; the second insulating pad abuts against the second electronic component group 32.

[0072] It should be noted that, to avoid short circuits, the second electronic component group 32 and the first boss 16 cannot be in direct contact. A second insulating gasket is provided between the second electronic component group 32 and the first boss 16. The second insulating gasket serves two purposes: insulation and heat conduction. It allows the second electronic component group 32 to contact the first boss 16 through the second insulating gasket, further reducing the heat flow path and enabling heat to dissipate quickly.

[0073] Preferably, see Figure 7 and Figure 8 Based on the above implementation, the second electronic component group 32 is a magnetic device, the first boss 16 is a strip tooth group; the second insulating pad is made of flexible material and can deform with the strip tooth group.

[0074] Specifically, the bar tooth assembly includes multiple spaced bar teeth, and a slot can be formed between each pair of adjacent bar teeth. Multiple coils of the magnetic device can be correspondingly mounted in each slot through the second insulating pad, thereby increasing the contact area between the magnetic device and the bar tooth assembly, that is, increasing the heat dissipation surface area.

[0075] It should be noted that the second insulating pad is not a rigid plate structure, but can deform with the strip tooth assembly to ensure that the magnetic devices can be snapped into the corresponding slots.

[0076] In some embodiments, the heat sink 1 may also employ, for example... Figure 7 and Figure 8 The structure shown is described in the following document. Figure 7 and Figure 8 The inner sidewall of the heat sink housing 1 is provided with a second protrusion 17 at the location corresponding to the third electronic component group 33, and a third insulating pad is provided on the second protrusion 17; the third insulating pad abuts against the third electronic component group 33.

[0077] Adding a second protrusion 17 to the inner wall of the heat sink housing 1 can increase the heat dissipation volume to the third electronic component group 33, extend the heat dissipation path from the third electronic component group 33 to the heat dissipation tooth group 13, and improve the heat dissipation efficiency of the third electronic component group 33.

[0078] In addition, a third insulating pad is provided between the second boss 17 and the third electronic component group 33 to prevent the third electronic component group 33 from directly contacting the second boss 17 and short-circuiting. The third insulating pad serves to insulate and insulate on the one hand, and to conduct heat on the other hand, so that the third electronic component group 33 can contact the second boss 17 through the third insulating pad, further reducing the heat flow path and allowing the heat to dissipate quickly.

[0079] In some embodiments, the heat sink 6 described above may also employ, for example... Figure 9 and Figure 10The structure shown is described in the following document. Figure 9 and Figure 10 An insulating limiting sleeve 54 is also embedded in the heat sink 6; specifically, a mounting hole is opened in the heat sink 6, and the insulating limiting sleeve 54 is embedded in the mounting hole. The first electronic component group 31, the first insulating gasket 53 and the insulating limiting sleeve 54 are fixedly connected by fasteners 7.

[0080] In order to insulate the first electronic component group 31 from the heat sink 6, a first insulating pad 53 is provided on the heat sink 6. The first electronic component group 31, the first insulating pad 53 and the heat sink 6 are stacked in sequence. Preferably, the first insulating pad 53 can be a ceramic insulating pad.

[0081] To insulate the fastener 7 from the radiator 6, an insulating limiting sleeve 54 is provided inside the radiator 6. Preferably, the fastener 7 is a bolt.

[0082] The bolt's shank is fastened inside the insulating limiting sleeve 54, and the bolt's nut abuts against the first electronic component group 31.

[0083] In some embodiments, the sidewall of the radiator 6 abuts against the inner sidewall of the heat sink housing 1, that is, the radiator 6 and the heat sink housing 1 are arranged without any gap, and the heat absorbed by the radiator 6 can be directly transferred to the heat sink housing 1, further reducing the heat flow path and improving the heat dissipation effect.

[0084] Since the heat sink 1 is generally a sheet metal part or an aluminum chassis, to avoid short circuits caused by contact between the various electronic component groups and printed circuit boards 2 and the heat sink 1, please refer to [the relevant documentation]. Figure 1 , Figure 5 and Figure 6 An insulating plate 51 is provided between the printed circuit board 2 and the inner wall of the heat sink 1. The insulating plate 51 is used to isolate the printed circuit board 2 from the heat sink 1.

[0085] The insulating plate 51 is provided with second clearance holes 511 corresponding to the second electronic component group 32 and the third electronic component group 33, respectively. The second electronic component group 32 and the third electronic component group 33 are also recessed into the second clearance holes 511.

[0086] In some embodiments, the front surface of the printed circuit board 2 is coated with a metal interconnect layer, and a first output plug is provided on the metal interconnect layer; the printed circuit board 2 is also provided with a connector 81, and a second output plug 82 is connected to the connector 81, such as... Figure 11 As shown.

[0087] Both the metal connection layer and the connector 81 serve as electrical connections. The first output plug can be directly electrically connected to the printed circuit board 2 through the metal connection layer, and the second output plug 82 can be directly electrically connected to the printed circuit board 2 through the connector 81. Therefore, there is no need to solder pins to the first output plug and the second output plug 82, which simplifies the assembly process.

[0088] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A power supply system, characterized in that, It includes two parallel subsystems, each of which includes a heat sink housing (1) and a printed circuit board (2) fixedly disposed in the inner cavity of the heat sink housing (1); the two heat sink housings (1) are fastened together; the two printed circuit boards (2) are connected by a copper busbar assembly (4); One of the printed circuit boards (2) is provided with a locking member (41) that is detachably connected to one end of the copper busbar assembly (4). One of the heat dissipation housings (1) has a mounting port (14) on its side wall, which corresponds to the locking member (41); a sealing plate (15) can also be detachably connected to the mounting port (14). Wherein, after the sealing plate (15) is removed from the heat dissipation housing (1), the locking member (41) is exposed at the mounting port (14); When the two subsystems are connected in parallel, the copper busbar assembly (4) is connected to one of the printed circuit boards (2), and the two heat sink housings (1) are fastened together. The copper busbar assembly (4) is locked to the other printed circuit board (2) from the mounting port (14) using the locking member (41) to realize the connection of the two printed circuit boards (2). The sealing plate (15) is sealed at the mounting port (14) to complete the parallel connection of the two subsystems.

2. The power supply system as described in claim 1, characterized in that, The two printed circuit boards (2) are arranged in parallel, and the front surfaces of the two printed circuit boards (2) are opposite each other. The two ends of the copper busbar assembly (4) are respectively arranged on the front surfaces of the two printed circuit boards (2).

3. The power supply system as described in claim 1, characterized in that, Another printed circuit board (2) is provided with an anti-rotation platform (42) that is inserted and connected to the other end of the copper busbar assembly (4).

4. The power supply system as described in claim 1, characterized in that, After the two heat dissipation shells (1) are fastened together, they are placed in the vertical direction; each heat dissipation shell (1) has a heat dissipation tooth group (13) on its outer side wall; the heat dissipation tooth group (13) includes a plurality of spaced heat dissipation teeth, each of which extends upward from the bottom end of the heat dissipation shell (1) to the top end of the heat dissipation shell (1).

5. The power supply system as described in claim 4, characterized in that, There is a heat dissipation space (11) between the upper edge of the two printed circuit boards (2) and the upper inner wall of the corresponding heat dissipation housing (1); a heat sink (6) is fixedly installed in the heat dissipation space (11).

6. The power supply system as described in claim 5, characterized in that, The heat sink (6) is provided with a first insulating pad (53), and the first insulating pad (53) is provided with a first electronic component group (31). The printed circuit board (2) is provided with a first clearance hole (21), and a second electronic component group (32) is provided at the first clearance hole (21). The second electronic component group (32) is attached to the inner sidewall of the heat sink housing (1). The first electronic component group (31) and the second electronic component group (32) are electrically connected to the printed circuit board (2), and the heat generated by the first electronic component group (31) is greater than the heat generated by the second electronic component group (32).

7. The power supply system as described in claim 6, characterized in that, An insulating limiting sleeve (54) is embedded on the heat sink (6), and the first electronic component group (31), the first insulating gasket (53) and the insulating limiting sleeve (54) are fixedly connected by fasteners (7).

8. The power supply system as described in claim 6, characterized in that, The back panel of the printed circuit board (2) is provided with a third electronic component group (33), which is attached to the inner side wall of the heat dissipation housing (1); the heat generation of the third electronic component group (33) is less than that of the first electronic component group (31). The front surface of the printed circuit board (2) is provided with a fourth electronic component group (34), and the heat generation of the fourth electronic component group (34) is less than that of the third electronic component group (33).

9. The power supply system as described in claim 8, characterized in that, The inner wall of the heat sink housing (1) is provided with a first protrusion (16) at the location corresponding to the second electronic component group (32), and a second insulating pad is provided on the first protrusion (16); the second insulating pad abuts against the second electronic component group (32); The inner wall of the heat sink housing (1) is provided with a second protrusion (17) at the location corresponding to the third electronic component group (33), and a third insulating pad is provided on the second protrusion (17); the third insulating pad abuts against the third electronic component group (33).

10. The power supply system as claimed in claim 8, characterized in that, An insulating plate (51) is provided between each printed circuit board (2) and the inner wall of the corresponding heat sink housing (1). The insulating plate (51) is provided with a second clearance hole (511) at the location corresponding to the second electronic component group (32) and the third electronic component group (33).

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