Ridge identification module and ridge identification device

Abstract

The present disclosure provides a texture identification module and a texture identification device. The texture identification module comprises a texture identification substrate, the texture identification substrate comprises a texture identification area and a non-texture identification area located on at least one side of the texture identification area; and an anti-static layer located on the texture identification substrate, wherein the orthographic projection of the anti-static layer on the texture identification substrate completely covers the texture identification area and extends to the non-texture identification area, and the anti-static layer and the non-texture identification area overlap with each other.

Description

Technical Field

[0001] This disclosure relates to the field of texture recognition technology, and in particular to a texture recognition module and a texture recognition device. Background Technology

[0002] Due to the uniqueness of skin patterns such as fingerprints or palm prints, texture recognition technology combined with optical imaging is increasingly being adopted by texture recognition devices for identity verification. These devices can be used independently as identity verification devices in airports, banks, and other similar settings, or they can be integrated with mobile terminals to provide identity verification, electronic payment, and other functions. Summary of the Invention

[0003] The texture recognition module and texture recognition device provided in this disclosure are as follows:

[0004] On one hand, embodiments of this disclosure provide a texture recognition module, including:

[0005] A texture recognition substrate, the texture recognition substrate including a texture recognition area and a non-texture recognition area located on at least one side of the texture recognition area;

[0006] An antistatic layer is located on the texture recognition substrate. The orthographic projection of the antistatic layer on the texture recognition substrate completely covers the texture recognition area and extends to the non-texture recognition area, and overlaps with the non-texture recognition area.

[0007] In some embodiments, the texture recognition module provided in this disclosure further includes an anti-glare layer and a first protective layer, wherein the anti-static layer is located between the anti-glare layer and the first protective layer, and the anti-glare layer is disposed adjacent to the texture recognition substrate.

[0008] In some embodiments, in the texture recognition module provided in this disclosure, the antistatic layer is a conductive layer.

[0009] In some embodiments, in the texture recognition module provided in this disclosure, the antistatic layer is a high-resistivity film.

[0010] In some embodiments, in the texture recognition module provided in the present disclosure, the antistatic layer includes a conductive layer and a high-resistivity film stacked together, wherein the conductive layer is located between the texture recognition substrate and the high-resistivity film.

[0011] In some embodiments, in the texture recognition module provided in the present disclosure, the antistatic layer includes a conductive layer and a high-resistivity film stacked together, wherein the high-resistivity film is located between the texture recognition substrate and the conductive layer.

[0012] In some embodiments, in the texture recognition module provided in this disclosure, the orthographic projection of the high-resistivity film on the texture recognition substrate is located within the orthographic projection of the conductive layer on the texture recognition substrate.

[0013] In some embodiments, in the texture recognition module provided in the present disclosure, the sheet resistance of the conductive layer is greater than or equal to 10Ω / □ and less than or equal to 100Ω / □.

[0014] In some embodiments, in the texture recognition module provided in this disclosure, the transmittance of the conductive layer is greater than 80%.

[0015] In some embodiments, in the texture recognition module provided in this disclosure, the thickness of the conductive layer in the direction perpendicular to the texture recognition substrate is greater than or equal to... and less than or equal to

[0016] In some embodiments, in the texture recognition module provided in this disclosure, the sheet resistance of the high-resistivity film is greater than or equal to 10. 8 Ω / □.

[0017] In some embodiments, in the texture recognition module provided in this disclosure, the high-resistivity film has a transmittance greater than 80%.

[0018] In some embodiments, in the texture recognition module provided in this disclosure, the thickness of the high-resistivity film in the direction perpendicular to the texture recognition substrate is greater than or equal to... and less than or equal to

[0019] In some embodiments, in the texture recognition module provided in the present disclosure, the antistatic layer is a planar structure or a mesh structure.

[0020] In some embodiments, in the texture recognition module provided in the present disclosure, the texture recognition substrate further includes a conductive structure, the conductive structure being located on the side of the antistatic layer away from the texture recognition substrate, the conductive structure being located in the non-texture recognition area and being disposed in contact with the conductive layer.

[0021] In some embodiments, the texture recognition module provided in this disclosure further includes a grounded housing, which is disposed in the non-texture recognition area and is electrically connected to the conductive structure.

[0022] In some embodiments, in the texture recognition module provided in the present disclosure, the surface of the grounding shell has an insulating varnish, except for the contact surface with the conductive structure and the grounding point.

[0023] In some embodiments, the texture recognition module provided in this disclosure further includes a gate driver chip;

[0024] The non-texture recognition area surrounds the texture recognition area. The non-texture recognition area includes a first non-texture recognition area and a second non-texture recognition area that are opposite to each other. The first non-texture recognition area is provided with the gate driving chip, and the second non-texture recognition area is provided with the conductive structure.

[0025] Within the first texture recognition area, the orthographic projection of the gate driving chip on the texture recognition substrate and the orthographic projection of the antistatic layer on the substrate do not overlap.

[0026] Within the second non-texture recognition area, the orthographic projection of the conductive structure on the texture recognition substrate roughly coincides with the orthographic projection of the antistatic layer on the texture recognition substrate.

[0027] In some embodiments, in the texture recognition module provided in the present disclosure, the first non-texture recognition area is further provided with the conductive structure, and in the first non-texture recognition area, the orthographic projection of the conductive structure on the texture recognition substrate and the orthographic projection of the antistatic layer on the texture recognition substrate substantially coincide.

[0028] In some embodiments, in the texture recognition module provided in this disclosure, the conductive structure is conductive foam.

[0029] In some embodiments, in the texture recognition module provided in this disclosure, the anti-glare layer is at least disposed in the texture recognition area.

[0030] In some embodiments, in the texture recognition module provided in this disclosure, the orthographic projection of the anti-glare layer on the texture recognition substrate is greater than the texture recognition area and is located within the orthographic projection of the antistatic layer on the texture recognition substrate.

[0031] In some embodiments, in the texture recognition module provided in the present disclosure, the thickness of the anti-glare layer in the direction perpendicular to the texture recognition substrate is greater than or equal to 2 μm and less than or equal to 10 μm.

[0032] In some embodiments, in the texture recognition module provided in the present disclosure, the orthographic projection of the first protective layer on the texture recognition substrate is greater than the texture recognition area and is located within the orthographic projection of the anti-glare layer on the texture recognition substrate.

[0033] In some embodiments, in the texture recognition module provided in the present disclosure, the material of the first protective layer includes silicon nitride, and the hardness of the first protective layer is greater than or equal to 6H.

[0034] In some embodiments, in the texture recognition module provided in the present disclosure, the material of the first protective layer further includes silicon oxide, and the nitrogen content in the first protective layer is greater than or equal to 60%.

[0035] In some embodiments, in the texture recognition module provided in the present disclosure, the thickness of the first protective layer in the direction perpendicular to the texture recognition substrate is greater than or equal to 300 nm and less than or equal to 10000 nm.

[0036] In some embodiments, the texture recognition module provided in this disclosure further includes a second protective layer. The second protective layer is located on the side of the first protective layer away from the antistatic layer, and the orthographic projection of the second protective layer on the texture recognition substrate substantially coincides with the orthographic projection of the first protective layer on the texture recognition substrate.

[0037] In some embodiments, in the texture recognition module provided in this disclosure, the second protective layer is configured to prevent fingerprint residue.

[0038] In some embodiments, in the texture recognition module provided in this disclosure, the thickness of the second protective layer in the direction perpendicular to the texture recognition substrate is greater than or equal to... and less than or equal to

[0039] In some embodiments, the texture recognition module provided in this disclosure further includes a flexible circuit board, which is electrically connected to the gate driver chip. The flexible circuit board includes a bending region with a length greater than or equal to 14 mm.

[0040] In some embodiments, in the texture recognition module provided in this disclosure, the flexible circuit board is a copper mesh structure.

[0041] In some embodiments, the texture recognition module provided in this disclosure further includes a reinforcing plate, which includes an integrally formed body portion and a handle portion; the flexible circuit board further includes a non-bending area, which is attached to the body portion, and the handle portion is located on the side of the body portion adjacent to the bending area.

[0042] In some embodiments, the handle portion of the texture recognition module provided in this disclosure includes a hollow structure.

[0043] In some embodiments, in the texture recognition module provided in the present disclosure, the body portion includes a crack-prevention groove, which is disposed on both sides adjacent to the extension direction of the handle portion.

[0044] In some embodiments, the texture recognition module provided in this disclosure further includes a flip-chip film and a readout circuit, wherein the readout circuit is disposed on the flip-chip film and is electrically connected to the flip-chip film.

[0045] The non-texture recognition area includes a third non-texture recognition area and a fourth non-texture recognition area placed opposite each other. The third non-texture recognition area connects the first non-texture recognition area and the second non-texture recognition area, and the fourth non-texture recognition area connects the first non-texture recognition area and the second non-texture recognition area. Both the third non-texture recognition area and the fourth non-texture recognition area are provided with the flip-chip film.

[0046] In some embodiments, the texture recognition module provided in this disclosure further includes black adhesive, which is located on the side of the readout circuit away from the flip-chip film, and the orthographic projection of the readout circuit on the flip-chip film is located within the orthographic projection of the black adhesive on the flip-chip film.

[0047] On the other hand, this disclosure provides a texture recognition device, including a texture recognition module and a backlight module, wherein the texture recognition module is the texture recognition module provided in this disclosure, and the texture recognition module is located on the light-emitting side of the backlight module. Attached Figure Description

[0048] Figure 1 A cross-sectional view of the texture recognition module provided in this embodiment of the present disclosure;

[0049] Figure 2 for Figure 1 A top view of the texture recognition module shown;

[0050] Figure 3 Another cross-sectional view of the texture recognition module provided in this embodiment of the present disclosure;

[0051] Figure 4 for Figure 3 A top view of the texture recognition module shown;

[0052] Figure 5 for Figure 3 Another top view of the texture recognition module shown;

[0053] Figure 6 Another cross-sectional view of the texture recognition module provided in this embodiment of the present disclosure;

[0054] Figure 7 Another cross-sectional view of the texture recognition module provided in this embodiment of the present disclosure;

[0055] Figure 8 for Figure 6 and Figure 7 Top view of the texture recognition module shown;

[0056] Figure 9 A cross-sectional view of the texture recognition device provided in the embodiments of this disclosure;

[0057] Figure 10 for Figure 1 Another top view of the texture recognition module shown;

[0058] Figure 11 for Figure 1 Another top view of the texture recognition module shown;

[0059] Figure 12 This is a top view of the flexible circuit board and reinforcing plate provided in an embodiment of this disclosure. Detailed Implementation

[0060] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. It should be noted that the dimensions and shapes of the figures in the drawings do not reflect actual proportions and are only intended to illustrate the content of this disclosure. Furthermore, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout the drawings.

[0061] Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure and the claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “inner,” “outer,” “upper,” and “lower” are used only to indicate relative positioning; this relative positioning may change accordingly when the absolute position of the described object changes.

[0062] The fingerprint recognition device includes a backlight module and a fingerprint recognition module. When the backlight module is lit, the backlight passes through the fingerprint recognition module to the valleys and ridges of the finger. The light reflected from these valleys and ridges enters the optical fingerprint sensor within the fingerprint recognition module. Because the reflected light intensity differs between the valleys and ridges, the optical fingerprint sensor generates different electrical signals based on these differences, thereby identifying the fingerprint valleys and ridges and achieving fingerprint acquisition. However, direct contact between the finger and the fingerprint recognition module can easily generate electrostatic discharge (ESD), which can interfere with the optical fingerprint sensor and affect the fingerprint recognition performance.

[0063] To address the aforementioned technical problems in related technologies, this disclosure provides a texture recognition module that can be used for single-finger or multi-finger (e.g., four-finger) texture acquisition, such as... Figure 1 and Figure 2 As shown, it includes:

[0064] Texture recognition substrate 101 includes a texture recognition area AA and a non-texture recognition area BB located on at least one side of the texture recognition area AA; optionally, the resolution of the texture recognition area AA is 1600×1500.

[0065] An antistatic layer 102 is located on the texture recognition substrate 101. The orthographic projection of the antistatic layer 102 on the texture recognition substrate 101 completely covers the texture recognition area AA and extends to the non-texture recognition area BB, overlapping with the non-texture recognition area BB. Optionally, the antistatic layer 102 can be achieved by a coating process, which is simple and has a high product yield. The antistatic layer 102 produced by the coating process has a planar structure. Of course, in some embodiments, in order to increase the transmittance, the antistatic layer 102 can be a mesh structure. Optionally, the size of the mesh can be smaller than the size of a sub-pixel.

[0066] By adding an anti-static layer 102 to the texture recognition substrate 101, static electricity can be effectively prevented from entering the interior of the texture recognition substrate 101 and interfering with its normal operation. Therefore, the anti-static capability of the texture recognition module is effectively enhanced, which is conducive to improving the texture recognition effect.

[0067] In some embodiments, in the texture recognition module provided in this disclosure, such as Figures 1 to 7 As shown, it may also include an anti-glare layer 103 and a first protective layer 104, an anti-static layer 102 located between the anti-glare layer 103 and the first protective layer 104, and the anti-glare layer 103 is disposed adjacent to the texture recognition substrate 101.

[0068] In some embodiments, in the texture recognition module provided in this disclosure, such as Figure 1 and Figure 2As shown, the antistatic layer 102 can be a conductive layer 1021 to conduct static electricity, preventing it from entering the fingerprint recognition substrate 101 and thus avoiding defects such as dead pixels and bad lines caused by static electricity, ensuring the normal image acquisition quality of the fingerprint recognition substrate 101. Optionally, to achieve better conductivity, the sheet resistance of the conductive layer 1021 can be greater than or equal to 10Ω / □ and less than or equal to 100Ω / □. To ensure that the conductive layer 1021 does not affect the fingerprint image, the thickness of the conductive layer 1021 in the direction perpendicular to the fingerprint recognition substrate 101 can be greater than or equal to... and less than or equal to (For example The transmittance of the conductive layer 1021 can be greater than 80%. In some embodiments, the conductive layer 1021 can be made of a material such as indium tin oxide (ITO) that meets the above parameters.

[0069] In some embodiments, in the texture recognition module provided in this disclosure, such as Figures 3 to 5 As shown, the antistatic layer 102 can be a high-resistivity film 1022. The insulating properties of the high-resistivity film 1022 are used to block static electricity on the side away from the texture recognition substrate 101, preventing static electricity from entering the interior of the texture recognition substrate 101. This avoids defects such as dead pixels and bad lines caused by static electricity, ensuring the normal image acquisition quality of the texture recognition substrate 101. In some embodiments, to ensure a better blocking effect, the sheet resistance of the high-resistivity film 1022 can be greater than or equal to 10 Ω. 8 Ω / □. To ensure a good fingerprint image, the thickness of the high-resistivity film 1022 in the direction perpendicular to the fingerprint recognition substrate 101 is greater than or equal to... and less than or equal to (For example (etc.), the high-resistivity membrane 1022 has a transmittance greater than 80%.

[0070] In some embodiments, in the texture recognition module provided in this disclosure, such as Figure 6 and Figure 7 As shown, the antistatic layer 102 may further include a conductive layer 1021 and a high-resistivity film 1022 stacked together. The conductive layer 1021 may be located between the texture recognition substrate 101 and the high-resistivity film 1022, or the high-resistivity film 1022 may be located between the texture recognition substrate 101 and the conductive layer 1021. Specifically, as... Figure 6As shown, when the conductive layer 1021 is located between the fingerprint recognition substrate 101 and the high-resistivity film 1022, the high-resistivity film 1022 is closer to the contact surface between the finger and the fingerprint recognition substrate 101 than the conductive layer 1021. When a large amount of static electricity from the finger reaches the contact surface of the fingerprint recognition substrate 101, some voltage is first reduced by the high-resistivity film 1022, and the remaining static electricity reaches the conductive layer 1021 and is then drawn out by the conductive layer 1021, preventing the static electricity from reaching the fingerprint recognition substrate 101 and ensuring that the fingerprint recognition substrate 101 can normally acquire fingerprint images. Figure 7 As shown, when the high-resistivity film 1022 is located between the fingerprint recognition substrate 101 and the conductive layer 1021, the conductive layer 1021 is closer to the contact surface between the finger and the fingerprint recognition substrate 101 than the high-resistivity film 1022. When a large amount of static electricity brought by the finger reaches the contact surface of the fingerprint recognition substrate 101, some of the static electricity is first led out through the conductive layer 1021, and the remaining static electricity then reaches the high-resistivity film 1022. Through the insulating properties of the high-resistivity film 1022, the remaining static electricity can be blocked outside the fingerprint recognition substrate 101, ensuring that the fingerprint recognition substrate 101 can normally collect fingerprint images.

[0071] Optionally, when the antistatic layer 102 includes a conductive layer 1021 and a high-resistivity film 1022 stacked together, the sheet resistance, thickness, transmittance, and other parameters of the conductive layer 1021 can be referenced from the relevant parameters when the antistatic layer 102 only includes the conductive layer 1021, and the resistance, thickness, transmittance, and other parameters of the high-resistivity film 1022 can be referenced from the relevant parameters when the antistatic layer 102 only includes the high-resistivity film 1022, and will not be elaborated here.

[0072] Furthermore, as can be seen from the above, comparing the four anti-static solutions, when the anti-static layer 102 includes a stacked conductive layer 1021 and a high-resistivity film 1022, the anti-static capability of the texture recognition module is superior to that when the anti-static layer 102 only includes the conductive layer 1021 or the high-resistivity film 1022. In related technologies, anti-static requirements are divided into four levels: Level 1 is 2KV for direct contact and 2KV for air contact; Level 2 is 4KV for direct contact and 4KV for air contact; Level 3 is 6KV for direct contact and 8KV for air contact; and Level 4 is 8KV for direct contact and 15KV for air contact. The aforementioned anti-static layer 102 can be adaptively selected according to different anti-static requirements. Furthermore, when the conductive layer 1021 is located between the texture recognition substrate 101 and the high-resistivity film 1022, the antistatic requirements for the high-resistivity film 1022 are relatively high; when the high-resistivity film 1022 is located between the texture recognition substrate 101 and the conductive layer 1021, the antistatic requirements for the conductive layer 1021 are also relatively high. Therefore, in specific implementations, the structure of the antistatic layer 102 can be flexibly selected based on the coating process level and antistatic requirements.

[0073] In some embodiments, in the texture recognition module provided in this disclosure, such as Figure 8 As shown, when the antistatic layer 102 has both a high-resistivity film 1022 and a conductive layer 1021, the orthographic projection of the high-resistivity film 1022 on the texture recognition substrate 101 can be set to be within the orthographic projection of the conductive layer 1021 on the texture recognition substrate 101. This ensures that a portion of the conductive layer 1021 does not overlap with the high-resistivity film 1022, which is beneficial for the non-overlapping conductive layer 1021 to be grounded.

[0074] It should be understood that when the high-resistivity film 1022 is located between the conductive layer 1021 and the texture recognition substrate 101, the high-resistivity film 1022 will not block the conductive layer 1021. Therefore, the orthographic projection of the high-resistivity film 1022 on the texture recognition substrate 101 can be located within the orthographic projection of the conductive layer 1021 on the texture recognition substrate 101, or it can approximately coincide with the orthographic projection of the conductive layer 1021 on the texture recognition substrate 101, that is, exactly coincide or within the allowable error range, so as to improve the flatness of the conductive layer 1021.

[0075] In some embodiments, in the texture recognition module provided in this disclosure, such as Figures 8 to 10 As shown, the texture recognition substrate 101 may further include a conductive structure 105. The conductive structure 105 is located on the side of the antistatic layer 102 away from the texture recognition substrate 101. The conductive structure 105 is located in the non-texture recognition area BB and is in contact with the conductive layer 1021. Since the larger the area of ​​the conductive structure 105, the better the contact effect between the conductive structure 105 and the conductive layer 1021, and the more conducive it is to the rapid discharge of static electricity, the contact area between the conductive structure 105 and the conductive layer 1021 should be as large as possible. Optionally, the area of ​​the conductive structure 105 is greater than or equal to 10 mm². 2 .

[0076] In some embodiments, in the texture recognition module provided in this disclosure, such as Figure 9 and Figure 11 As shown, it may also include a grounded housing 106. In order to expose the texture identification area AA, the grounded housing 106 can be set in the non-texture identification area BB, and the grounded housing 106 can be electrically connected to the conductive structure 105. Specifically, the grounded housing 106 can be electrically connected to the surface of the conductive structure 105 away from the antistatic layer 102. In this way, the static electricity diffused on the antistatic layer 102 can be grounded and discharged through the conductive structure 105 and the grounded housing 106.

[0077] In some embodiments, in the texture recognition module provided in the present disclosure, the surface of the grounding housing 106 is covered with insulating varnish, except for the contact surface with the conductive structure 105 and the grounding point. That is, insulating varnish is not sprayed in the areas of the grounding housing 106 that need to conduct electricity, but is sprayed in the areas of the grounding housing 106 that do not need to conduct electricity, so as to protect the grounding housing 106 by insulating varnish and prevent the grounding housing 106 from being corroded by moisture in the air.

[0078] In some embodiments, in the texture recognition module provided in this disclosure, such as Figure 8 and Figure 10 As shown, it may also include a gate driver chip 107 (Gate IC); the non-texture recognition area BB surrounds the texture recognition area AA, and the non-texture recognition area BB includes a first non-texture recognition area BB1 and a second non-texture recognition area BB2 placed opposite each other. The gate driver chip 107 is disposed in the first non-texture recognition area BB1. In the first texture recognition area BB1, the orthographic projection of the gate driver chip 107 on the texture recognition substrate 101 and the orthographic projection of the antistatic layer 102 on the substrate 101 do not overlap, so as to avoid the antistatic layer 102 interfering with the normal operation of the gate driver chip 107. The second non-texture recognition area BB2 may be provided with a conductive structure 105 to ensure that there is enough space to set the conductive structure 105, so that the conductive structure 105 and the conductive layer 1021 have a large contact area, thereby facilitating static electricity discharge. Optionally, within the second non-texture recognition area BB2, the orthographic projection of the conductive structure 105 on the texture recognition substrate 101 approximately coincides with (i.e., exactly coincides or is within the error range caused by factors such as manufacturing and measurement) the orthographic projection of the antistatic layer 102 on the texture recognition substrate 101, to ensure that the conductive structure 105 and the conductive layer 1021 have a large contact area. Of course, in some embodiments, the position of the conductive structure 105 can be flexibly set according to actual needs, and no specific limitation is made here.

[0079] In some embodiments, in the texture recognition module provided in this disclosure, such as Figure 8 and Figure 10 As shown, the first non-texture recognition area BB1 can also be provided with a conductive structure 105, thereby further increasing the contact area between the conductive structure 105 and the conductive layer 1021. Furthermore, to prevent the conductive structure 105 from short-circuiting with the gate driver chip 107, the conductive structure 105 can be positioned between the gate driver chip 107 and the texture recognition area AA within the first non-texture recognition area BB1. Specifically, within the first non-texture recognition area BB1, the orthographic projection of the conductive structure 105 on the texture recognition substrate 101 can approximately coincide with the orthographic projection of the antistatic layer 102 on the texture recognition substrate 101 (i.e., exactly coincide or within the error range caused by manufacturing, measurement, etc.).

[0080] In some embodiments, in the texture recognition module provided in the present disclosure, the conductive structure 105 can be a material with good conductivity, such as conductive foam or metal.

[0081] In some embodiments, in the texture recognition module provided in this disclosure, such as Figure 8 and Figure 10 As shown, it may also include a flexible circuit board 108 (FPC), which is electrically connected to the gate driver chip 107. For example, the flexible circuit board 108 can be electrically connected to the gate driver chip 107 via metal wires to control the gate driver chip 107. Figure 12 As shown, the flexible circuit board 108 includes a bending region BA, the length of which is greater than or equal to 14 mm. In related technologies, the bending region BA of the flexible circuit board 108 is 3.5 mm long. In practical applications, this can cause the bonding region BDA on the flexible circuit board 108, which is used for electrical connection to the gate driver chip 107, to loosen, affecting fingerprint imaging. This disclosure reduces bending stress by extending the length of the bending region BA to more than 14 mm, thus preventing the bonding region BDA from loosening due to excessive bending stress. This ensures the bonding effect between the flexible circuit board 108 and the gate driver chip 107, which is beneficial for improving fingerprint imaging quality.

[0082] In some embodiments, in the texture recognition module provided in this disclosure, such as Figure 12 As shown, the flexible circuit board 108 can be a copper mesh structure, which makes the flexible circuit board 108 easier to bend without generating large bending stress, greatly reducing the probability of bonding failure due to excessive bending stress.

[0083] In some embodiments, in the texture recognition substrate 101 provided in the present disclosure, such as Figure 12 As shown, the system may also include a reinforcing plate 109, which includes an integrally formed body portion 1091 and a handle portion 1092. The flexible circuit board 108 also includes a non-bending region UBA, which is attached to the body portion 1091. The handle portion 1092 is located on the side of the body portion 1091 adjacent to the bending region UBA. In related technologies, the reinforcing plate 109 only has a body portion 1091. In this disclosure, by adding a handle portion 1092 to the reinforcing plate 109, it is convenient to control the fixed connection between the flexible circuit board 108 and the field programmable gate array (FPGA) through the handle portion 1092.

[0084] In some embodiments, in the texture recognition module provided in the present disclosure, the handle portion 1092 includes a hollow structure N to facilitate gripping the handle portion 1092 at the hollow structure N.

[0085] In some embodiments, in the texture recognition module provided in this disclosure, such as Figure 12 As shown, the body portion 1091 may include a crack-prevention groove M. The crack-prevention groove M may be provided on both sides adjacent to the extension direction of the handle portion 1092, which can effectively prevent tearing that may occur at the junction of the handle portion 1092 and the body portion 1091 when the handle portion 1092 is pulled up.

[0086] In some embodiments, in the texture recognition module provided in this disclosure, such as Figure 2 As shown, it may also include a flip-chip film 110 (COF) and a readout circuit 111 (ROIC), wherein the readout circuit 111 is disposed on the flip-chip film 110 and is electrically connected to the flip-chip film 110; the non-texture recognition area BB includes a third non-texture recognition area BB3 and a fourth non-texture recognition area BB4 disposed opposite to each other. The third non-texture recognition area BB3 is connected to the first non-texture recognition area BB1 and the second non-texture recognition area BB2, and the fourth non-texture recognition area BB4 is connected to the first non-texture recognition area BB1 and the second non-texture recognition area BB2. Both the third non-texture recognition area BB3 and the fourth non-texture recognition area BB4 are provided with the flip-chip film 110.

[0087] In some embodiments, in the texture recognition module provided in this disclosure, such as Figure 4 As shown, it also includes a black adhesive 112, which is located on the side of the readout circuit 111 away from the flip-chip film 110. The orthographic projection of the readout circuit 111 on the flip-chip film 110 lies within the orthographic projection of the black adhesive 112 on the flip-chip film 110. Since the material of the readout circuit 111 is a photosensitive material, the black adhesive 112 covering the readout circuit 111 can provide a light-shielding effect, ensuring that the readout circuit 111 is not affected by strong light. Optionally, the black adhesive 112 can be a black electromagnetic interference (EMI) shielding adhesive, utilizing its electromagnetic shielding properties to achieve electromagnetic shielding and prevent electromagnetic interference.

[0088] In some embodiments, in the texture recognition module provided in this disclosure, such as Figure 1 , Figure 3 , Figure 6 , Figure 7 and Figure 9As shown, an anti-glare layer 103 is disposed at least in the texture recognition area AA. Optionally, the anti-glare layer 103 is used to block ambient light in the range of 500nm to 780nm. By blocking light in the range of 500nm to 780nm, normal image acquisition is still possible in strong outdoor light environments, which can meet the needs of outdoor use. In some embodiments, in order not to affect image acquisition, the thickness of the anti-glare layer 103 in the direction perpendicular to the texture recognition substrate 101 is greater than or equal to 2μm and less than or equal to 10μm, for example, it can be 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, etc. The anti-glare layer 103 can be made of a material that can absorb infrared light, such as resin.

[0089] It should be noted that the photosensitive device in the texture recognition substrate of the related technology is a PIN structure made of amorphous silicon (a-Si). Amorphous silicon does not absorb wavelengths greater than 780nm. Therefore, the anti-glare layer 103 in this disclosure does not need to block wavelengths above 780nm. In specific implementation, the infrared band that the anti-glare layer 103 needs to block can be selectively set according to the external quantum efficiency (EQE) curve of the material used in the photosensitive device, so as to ensure that the photosensitive device only receives the reflected light from the fingerprint and not the ambient light transmitted through the finger, thereby improving the image acquisition quality.

[0090] In some embodiments, in the texture recognition module provided in the present disclosure, the orthographic projection of the anti-glare layer 103 on the texture recognition substrate 101 can be larger than the texture recognition area AA and located within the orthographic projection of the antistatic layer 102 on the texture recognition substrate 101, so as to effectively avoid the influence of external strong light on the image acquisition of the photosensitive device in the texture recognition area AA.

[0091] In some embodiments, in the texture recognition module provided in this disclosure, such as Figure 1 , Figures 3 to 11As shown, the orthographic projection of the first protective layer 104 on the texture recognition substrate 101 is larger than the texture recognition area AA and is located within the orthographic projection of the anti-glare layer 103 on the texture recognition substrate 101, thus exposing the antistatic layer 102 outside the anti-glare layer 11. This allows the conductive layer 1021 contained in the antistatic layer 102 to contact the grounded outer shell 106 through the conductive structure 105, achieving a grounding connection and dissipating static electricity. The material properties of the first protective layer 104 improve the surface hardness of the texture recognition module, preventing surface scratches from affecting imaging. In this disclosure, the first protective layer 104 is a film layer with silicon, oxygen, and nitrogen as the main elements. For example, the material of the first protective layer 104 may include silicon nitride, or the material of the first protective layer 104 may include silicon nitride and silicon oxide. The greater the thickness of the first protective layer 104, the greater its corresponding hardness. However, increased thickness can affect image quality. Therefore, to balance hardness and image quality, the thickness of the first protective layer 104 can be greater than or equal to 300 nm and less than or equal to 10000 nm, for example, greater than or equal to 200 nm and less than or equal to 600 nm. Increasing the nitrogen (N) content will improve the hardness of the first protective layer 104. In this disclosure, the nitrogen content in the first protective layer 104 is greater than or equal to 60%, and the hardness of the first protective layer 104 is greater than or equal to 6H. In specific implementations, the first protective layer 104 can be adjusted according to the material of its underlying substrate (including the anti-glare layer 103 and the antistatic layer 102). The lower the substrate hardness, the higher the nitrogen content and the thicker the first protective layer 104 needs to be. Therefore, increasing the hardness of the substrate material is also a way to increase the overall hardness. In this disclosure, the anti-glare layer 103 is made of resin, which has relatively poor hardness. If it is replaced with a material with consistent transmittance and higher hardness, the overall hardness will increase further, and the scratch resistance will be better.

[0092] In some embodiments, in the texture recognition module provided in this disclosure, such as Figure 1 , Figures 3 to 11 As shown, a second protective layer 113 may also be included. The second protective layer 113 is located on the side of the first protective layer 104 away from the antistatic layer 102 to prevent fingerprint residue from affecting the imaging. Optionally, the orthographic projection of the anti-fingerprint residue film on the texture recognition substrate 101 is approximately coincident with the orthographic projection of the first protective layer 104 on the texture recognition substrate 101, so as to prevent the second protective layer 113 and the first protective layer 104 from completely blocking the antistatic layer 102. In other words, a portion of the antistatic layer 102 in the non-display area can be exposed, so that the conductive layer 1021 contained in the antistatic layer 102 can contact the grounded housing 106 through the conductive structure 105 to achieve grounding connection and conduct away static electricity.

[0093] It should be noted that in the embodiments provided in this disclosure, due to limitations of process conditions or the influence of other factors such as measurement, "approximately coincident" may coincide exactly, or there may be some deviation (e.g., a deviation of ±5μm). Therefore, as long as the relationship of "approximately coincident" between related features satisfies the allowable error, it is within the protection scope of this disclosure.

[0094] In some embodiments, in the texture recognition module provided in this disclosure, the second protective layer 113 is configured to prevent fingerprint residue. For example, it can be an anti-fingerprint (AF) film or an invisible fingerprint (IF) film. The surface of the anti-fingerprint film is glossy, and fingerprint residue is easy to wipe away. The surface of the invisible fingerprint film is frosted, and fingerprints are not easy to remain. The specific choice can be made flexibly according to actual needs.

[0095] In some embodiments, in the texture recognition module provided in this disclosure, to enhance the anti-fingerprint effect, the thickness of the second protective layer 113 in the direction perpendicular to the texture recognition substrate 101 is greater than or equal to... and less than or equal to For example wait.

[0096] Based on the same inventive concept, this disclosure provides a texture recognition device, including the texture recognition module described above. Since the principle by which this texture recognition device solves the problem is similar to that of the texture recognition module described above, the implementation of this texture recognition device can refer to the embodiments of the texture recognition module described above, and repeated details will not be elaborated further.

[0097] Specifically, the texture recognition device provided in this disclosure embodiment, such as Figure 9 As shown, the device includes a texture recognition module 001 and a backlight module 002. The texture recognition module 001 is the texture recognition module 001 described in this embodiment, and it is located on the light-emitting side of the backlight module 002. Optionally, the texture recognition device can have dimensions of 91.5mm × 90.2mm and a thickness greater than or equal to 3mm and less than or equal to 7mm, making it relatively thin and portable. Optionally, in this disclosure, the backlight module 002 may include a backlight source, with a reverse prism and a privacy film sequentially arranged on the light-emitting side of the backlight source to improve the collimation effect of the backlight.

[0098] As can be seen from the above, the texture recognition module and texture recognition device provided in this disclosure, by setting an anti-glare layer 103 on the surface of the texture recognition substrate 101, can block light in the 500nm-780nm wavelength band, thus playing a role in preventing glare. An antistatic layer 102 is plated on top of the anti-glare layer 103 to provide antistatic protection. The design of the antistatic layer 102, which uses a conductive layer 1021, needs to be matched with the connection to the grounded housing 106, so that the antistatic layer 102 needs to be connected to the ground through the grounded housing 106. A first protective layer 104 is plated on top of the antistatic layer 102 to improve the overall surface hardness and prevent surface scratches from affecting imaging. The design of the first protective layer 104 needs to be adjusted to match the characteristics of the base resin material; this disclosure uses a silicon, nitrogen, and oxygen film to achieve a hardness of 6H. A second protective layer 113 is placed on top of the first protective layer 104 to prevent fingerprint residue, thus improving the user experience. The texture recognition device of this disclosure, due to its small size, resistance to glare, fingerprint resistance, and portability, can be used outdoors.

[0099] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this disclosure without departing from the spirit and scope of the embodiments of this disclosure. Therefore, if these modifications and variations to the embodiments of this disclosure fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include these modifications and variations.

Claims

1. A texture recognition module, wherein, include: A texture recognition substrate, the texture recognition substrate including a texture recognition area and a non-texture recognition area located on at least one side of the texture recognition area; An antistatic layer is located on the texture recognition substrate. The orthographic projection of the antistatic layer on the texture recognition substrate completely covers the texture recognition area and extends to the non-texture recognition area, overlapping with the non-texture recognition area. The antistatic layer is a conductive layer. The system comprises an anti-glare layer and a first protective layer, wherein the anti-static layer is located between the anti-glare layer and the first protective layer, and the anti-glare layer is disposed adjacent to the texture recognition substrate; the orthographic projection of the first protective layer on the texture recognition substrate is larger than the texture recognition area and is located within the orthographic projection of the anti-glare layer on the texture recognition substrate; the material of the first protective layer includes silicon nitride, and the hardness of the first protective layer is greater than or equal to 6H; the texture recognition substrate further comprises a conductive structure, which is located on the side of the anti-static layer away from the texture recognition substrate, and is located in the non-texture recognition area and in contact with the conductive layer; the area of ​​the conductive structure is greater than or equal to 10 mm². 2 .

2. The texture recognition module as described in claim 1, wherein, The antistatic layer includes a conductive layer and a high-resistivity film stacked together, with the conductive layer located between the texture recognition substrate and the high-resistivity film.

3. The texture recognition module as described in claim 2, wherein, The orthographic projection of the high-resistivity film on the texture recognition substrate lies within the orthographic projection of the conductive layer on the texture recognition substrate.

4. The texture recognition module as described in claim 3, wherein, The sheet resistance of the conductive layer is greater than or equal to 10Ω / □ and less than or equal to 100Ω / □.

5. The texture recognition module as described in claim 4, wherein, The transmittance of the conductive layer is greater than 80%.

6. The texture recognition module as described in claim 5, wherein, The thickness of the conductive layer in the direction perpendicular to the texture recognition substrate is greater than or equal to 300 Å and less than or equal to 2000 Å.

7. The texture recognition module as described in claim 4, wherein, The sheet resistance of the high-resistivity film is greater than or equal to 10. 8 Ω / □.

8. The texture recognition module as described in claim 7, wherein, The high-resistivity membrane has a transmittance of more than 80%.

9. The texture recognition module as described in claim 8, wherein, The thickness of the high-resistivity film in the direction perpendicular to the texture recognition substrate is greater than or equal to 100 Å and less than or equal to 300 Å.

10. The texture recognition module as described in claim 9, wherein, The antistatic layer has a planar structure or a mesh structure.

11. The texture recognition module as described in claim 1, wherein, It also includes a grounded housing, which is disposed in the non-texture identification area and is electrically connected to the conductive structure.

12. The texture recognition module as described in claim 11, wherein, The surface of the grounding housing, except for the contact surface with the conductive structure and the grounding point, is covered with insulating varnish.

13. The texture recognition module as described in claim 11 or 12, wherein, It also includes the gate driver chip; The non-texture recognition area surrounds the texture recognition area. The non-texture recognition area includes a first non-texture recognition area and a second non-texture recognition area that are opposite to each other. The first non-texture recognition area is provided with the gate driving chip, and the second non-texture recognition area is provided with the conductive structure. Within the first non-texture recognition area, the orthogonal projection of the gate driving chip on the texture recognition substrate and the orthogonal projection of the antistatic layer on the substrate do not overlap; the substrate is the texture recognition substrate. Within the second non-texture recognition area, the orthographic projection of the conductive structure on the texture recognition substrate roughly coincides with the orthographic projection of the antistatic layer on the texture recognition substrate.

14. The texture recognition module as described in claim 13, wherein, The first non-texture recognition area is further provided with the conductive structure, and within the first non-texture recognition area, the orthographic projection of the conductive structure on the texture recognition substrate and the orthographic projection of the antistatic layer on the texture recognition substrate approximately coincide.

15. The texture recognition module as described in claim 14, wherein, The conductive structure is conductive foam.

16. The texture recognition module as described in claim 1, wherein, The anti-glare layer is at least disposed in the texture recognition area.

17. The texture recognition module as described in claim 16, wherein, The projection of the anti-glare layer onto the texture recognition substrate is larger than the texture recognition area and is located within the projection of the antistatic layer onto the texture recognition substrate.

18. The texture recognition module as described in claim 16 or 17, wherein, The thickness of the anti-glare layer in the direction perpendicular to the texture recognition substrate is greater than or equal to 2 μm and less than or equal to 10 μm.

19. The texture recognition module as described in claim 18, wherein, The material of the first protective layer also includes silicon oxide, and the nitrogen content in the first protective layer is greater than or equal to 60%.

20. The texture recognition module as described in claim 18, wherein, The thickness of the first protective layer in the direction perpendicular to the texture recognition substrate is greater than or equal to 300 nm and less than or equal to 10000 nm.

21. The texture recognition module as described in claim 20, wherein, It also includes a second protective layer, which is located on the side of the first protective layer away from the antistatic layer, and the orthographic projection of the second protective layer on the texture recognition substrate roughly coincides with the orthographic projection of the first protective layer on the texture recognition substrate.

22. The texture recognition module as described in claim 21, wherein, The second protective layer is configured to prevent fingerprint residue.

23. The texture recognition module as described in claim 21 or 22, wherein, The thickness of the second protective layer in the direction perpendicular to the texture recognition substrate is greater than or equal to 100 Å and less than or equal to 500 Å.

24. The texture recognition module as described in claim 13, wherein, It also includes a flexible circuit board, which is electrically connected to the gate driver chip. The flexible circuit board includes a bending region with a length greater than or equal to 14 mm.

25. The texture recognition module as described in claim 24, wherein, The flexible circuit board has a copper mesh structure.

26. The texture recognition module as described in claim 24 or 25, wherein, It also includes a reinforcing plate, which includes an integrally formed body portion and a handle portion; the flexible circuit board also includes a non-bending area, which is attached to the body portion, and the handle portion is located on the side of the body portion adjacent to the bending area.

27. The texture recognition module as described in claim 26, wherein, The handle portion includes a hollow structure.

28. The texture recognition module as described in claim 27, wherein, The body portion includes anti-crack grooves, which are provided on both sides adjacent to the extension direction of the handle portion.

29. The texture recognition module as described in claim 13, wherein, It also includes a flip-chip film and a readout circuit, wherein the readout circuit is disposed on the flip-chip film and is electrically connected to the flip-chip film; The non-texture recognition area includes a third non-texture recognition area and a fourth non-texture recognition area placed opposite each other. The third non-texture recognition area connects the first non-texture recognition area and the second non-texture recognition area, and the fourth non-texture recognition area connects the first non-texture recognition area and the second non-texture recognition area. Both the third non-texture recognition area and the fourth non-texture recognition area are provided with the flip-chip film.

30. The texture recognition module as described in claim 29, wherein, It also includes black adhesive, which is located on the side of the readout circuit away from the flip-chip film, and the orthographic projection of the readout circuit on the flip-chip film is located within the orthographic projection of the black adhesive on the flip-chip film.

31. A texture recognition device, wherein, It includes a texture recognition module and a backlight module, wherein the texture recognition module is the texture recognition module as described in any one of claims 1 to 30, and the texture recognition module is located on the light-emitting side of the backlight module.

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