Processing system

Abstract

[Problem] To provide a machining system capable of machining a workpiece with high accuracy. [Solution] A machining system 1 is configured to include: a tilting device capable of tilting a rotation axis 3a of a chuck 3 holding a workpiece W; a film thickness measuring device 7 measuring a film thickness of the workpiece W after finish grinding in a non-contact manner; and a control device 8 calculating a tilt angle of the tilting device that reduces a difference between a maximum thickness and a minimum thickness in the workpiece W after finish grinding based on a measurement value of the film thickness measuring device 7, and tilting the chuck 3 at the tilt angle, wherein the workpiece W after finish grinding is re-machined in the order of rough grinding, middle grinding, and finish grinding in a state where the chuck 3 is tilted at the tilt angle.

Description

Technical Field

[0001] The present invention relates to a processing system for making a workpiece thinner. Background Art

[0002] In the field of semiconductor manufacturing, as a device for grinding a semiconductor wafer such as a silicon wafer (hereinafter referred to as "workpiece") thin and flat, a grinding device is known that presses the grinding surface of a rotating grinding stone against the workpiece to grind the workpiece.

[0003] In Patent Document 1, the following device is disclosed: The workpiece is processed in the order of rough grinding and finish grinding. After cleaning the protective tape and the back surface of the workpiece, the thickness of the workpiece is measured using a capacitance sensor.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: JP-A-2009-117648 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] However, in order to process the workpiece with high precision, sometimes the finish grinding of the workpiece is temporarily stopped to measure the thickness of the workpiece, and based on the measurement result, the same workpiece is finish - ground again. However, recently, the grain size of the grinding stone has become finer, and even if finish grinding is restarted after thickness measurement, the dressing of the grinding stone is insufficient, resulting in poor cutting of the grinding stone, and it is possible that the shape of the workpiece after re - grinding becomes unstable or surface burning (surface burn) occurs.

[0009] Therefore, a technical problem to be solved for processing the workpiece with high precision is generated, and an object of the present invention is to solve this problem.

[0010] Technical Means for Solving the Problems

[0011] In order to achieve the above object, the present invention relates to the following processing system that processes a workpiece in the order of pre - grinding and finish grinding, and is characterized in that the processing system includes:

[0012] An inclination device that can incline the rotation axis of a chuck holding the workpiece;

[0013] A measurement device that measures the film thickness of the workpiece after finish grinding in a non - contact manner;

[0014] The control device calculates the shape of the workpiece after fine grinding based on the measurements from the measuring device, calculates the tilt angle of the tilting device to reduce the difference between the maximum and minimum thicknesses of the workpiece, and tilts the chuck at the tilt angle.

[0015] In this process, with the chuck tilted at the aforementioned tilt angle, the workpiece after fine grinding is reprocessed in the order of pre-grinding and fine grinding.

[0016] According to this structure, the measuring device measures the film thickness of the workpiece after the first stage of processing, and the control device calculates the tilt angle of the chuck's rotating shaft that can process the workpiece into a roughly flat shape based on the shape of the workpiece after the first stage of processing. The workpiece is then pre-ground and fine-ground again with the chuck's rotating shaft tilted at this tilt angle. Thus, even when the fine grinding stone is fine, the cutting of the grinding stone can be maintained by sharpening the fine grinding stone through pre-grinding, thereby enabling efficient and high-precision processing of the workpiece.

[0017] Invention Effects

[0018] This invention enables high-precision machining of workpieces. Attached Figure Description

[0019] Figure 1 A top view illustrating a processing system according to one embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram showing the positional relationship of the measuring points of the measuring device on the workpiece;

[0021] Figure 3 This is a schematic diagram illustrating the first stage of processing on a workpiece.

[0022] Figure 4 This is a schematic diagram illustrating the second stage of processing on the workpiece.

[0023] Figure 5 This is a schematic diagram illustrating the processing of the second workpiece. Detailed Implementation

[0024] An embodiment of the present invention will be described with reference to the accompanying drawings. Furthermore, when referring to the quantity, value, amount, range, etc., of the constituent elements, they are not limited to that specific quantity, except where specifically stated or where the quantity is clearly limited in principle; they may be more than or less than that specific quantity.

[0025] In addition, when referring to the shape and positional relationship of constituent elements, etc., except for cases that are specifically stated or that are obviously not the case in principle, it includes shapes that are substantially similar or analogous to that shape.

[0026] Furthermore, the accompanying drawings may exaggerate characteristic features by enlarging them to make them easier to understand, and the size ratios of the constituent elements may not be the same as actual dimensions. Additionally, in sectional views, section lines of some constituent elements are sometimes omitted to facilitate understanding of the cross-sectional structure.

[0027] Figure 1 This is a top view showing the basic structure of machining system 1. Machining system 1 performs multiple grinding operations continuously on workpiece W. Alternatively, machining system 1 can perform either grinding or lapping operations only.

[0028] The machining system 1 is equipped with four worktables: platform worktable ST1, rough grinding worktable ST2, medium grinding worktable ST3, and fine grinding worktable ST4. In addition, the number of worktables (pre-grinding worktables) that process the workpiece W sequentially on the upstream side of the fine grinding worktable ST4 is not limited to the rough grinding worktable ST2 and the medium grinding worktable ST3, but can also be one or more.

[0029] The processing system 1 includes the ability to... Figure 1 The indexing table 2 rotates clockwise on the paper surface, and four chucks 3 are equally spaced on a concentric circle with the rotation axis 2a of the indexing table 2 as the center. The indexing table 2 rotates 90° in each step, so that the chucks 3 can move in the order of platform table ST1, rough grinding table ST2, medium grinding table ST3, and fine grinding table ST4.

[0030] The chuck 3 has an adsorption body 32, described later, made of a porous material such as alumina, embedded on the upper surface of the rotary table 31. The chuck 3 includes a conduit (not shown) extending from its interior to its surface. The conduit is connected to a vacuum source, a compressed air source, or a water supply source via a rotary joint (not shown). When the vacuum source is activated, the workpiece W placed on the chuck 3 is adsorbed and held on the chuck 3. Conversely, when the compressed air source or water supply source is activated, the adsorption of the workpiece W on the chuck 3 is released.

[0031] The rotary table 31 is connected to a chuck spindle (not shown in the figure). The chuck spindle is configured to rotate about a rotation axis perpendicular to the rotary table 31. Furthermore, the chuck 3 may also include a tilting mechanism (not shown in the figure) that allows the rotary table 31 to tilt and is constructed of a known structure.

[0032] In the platform worktable ST1, the workpiece W, before grinding, is transferred to the chuck 3 via a transfer arm (not shown in the figure). The workpiece W is pre-positioned so that its orientation is aligned with a specified direction. After grinding, the workpiece W is removed from the chuck 3 via a conveyor arm to a cleaning device (not shown in the figure).

[0033] A rough grinding device 4 is provided on the rough grinding worktable ST2. The rough grinding device 4 includes a rough grinding stone (not shown in the figure); a first spindle 41 on which the rough grinding stone is mounted at its lower end and rotatably supported; and a first spindle feed mechanism 42 that moves the first spindle 41 up and down in the vertical direction.

[0034] For coarse grinding, a cup-shaped grinding stone of #8000 is used, for example. The first spindle feed mechanism 42 consists of two linear guides 43 that guide the movement direction of the first spindle 41 and a ball screw sliding mechanism 44 that raises and lowers the first spindle 41.

[0035] In addition, a first contact thickness measuring device 45 is provided in the rough grinding apparatus 4. The first contact thickness measuring device 45 includes a pair of detection arms 46, 47 with contacts provided at the front ends.

[0036] During rough grinding, the contact of the detection arm 46 abuts against the upper surface of the workpiece W, and the contact of the detection arm 47 abuts against the upper surface of the chuck 3. This allows the thickness of the workpiece W to be measured based on the difference in height detected by the contacts of the detection arms 46 and 47. Furthermore, the thickness of the workpiece W measured by the first contact thickness measuring device 45 includes the thickness of components formed on one side of the workpiece W, protective strips adhered to that side, etc.

[0037] A medium grinding device 5 is provided on the medium grinding worktable ST3. The medium grinding device 5 includes a medium grinding stone (not shown in the figure), a second spindle 51 on which the medium grinding stone is mounted at its lower end and rotatably supported; and a second spindle feed mechanism 52 that moves the second spindle 51 up and down in the vertical direction.

[0038] For medium grinding, a cup-shaped grinding stone of #8000 is used, for example. The second spindle feed mechanism 52 consists of two linear guides 53 that guide the movement direction of the second spindle 51 and a ball screw sliding mechanism 54 that raises and lowers the second spindle 51.

[0039] In addition, a second contact thickness measuring device 55 is provided in the intermediate grinding apparatus 5. The second contact thickness measuring device 55 includes a pair of detection arms 56 and 57 with contacts provided at the front ends.

[0040] During intermediate grinding, the contact of the detection arm 56 abuts against the upper surface of the workpiece W, and the contact of the detection arm 57 abuts against the upper surface of the chuck 3. This allows the thickness of the workpiece W to be measured based on the difference in height detected by the contacts of the detection arms 56 and 57. Furthermore, the thickness of the workpiece W measured by the second contact thickness measuring device 55 includes the thickness of components formed on one side of the workpiece W, protective strips adhered to the back side, etc.

[0041] A fine grinding device 6 is provided on the fine grinding worktable ST4. The fine grinding device 6 includes a fine grinding stone 61, a third spindle 62 on which the fine grinding stone 61 is mounted at its lower end and rotatably supports the fine grinding stone 61; and a third spindle feed mechanism (not shown in the figure) that moves the third spindle 62 up and down in the vertical direction.

[0042] The grinding stone 61 for fine grinding is, for example, a cup-shaped grinding stone of #8000. Furthermore, a non-contact thickness measuring device 63, described later, is installed on the fine grinding worktable ST4. The non-contact thickness measuring device 63 measures the thickness (film thickness) of the workpiece W during fine grinding.

[0043] A film thickness measuring device 7 is provided in the processing system 1. The film thickness measuring device 7 measures the thickness (film thickness) of the workpiece W in a non-contact manner. Furthermore, the film thickness of the workpiece W measured by the film thickness measuring device 7 does not include the thickness of components formed on one side of the workpiece W, protective tape adhered to that side, etc. The film thickness measuring device 7 is, for example, a spectroscopic interferometry type film thickness measuring instrument.

[0044] The film thickness measuring device 7 is fixed on the bracket 1a installed within the processing system 1 and is positioned above the indexing table 2. The measuring point for measuring the film thickness of the workpiece W is set on the rotation track O of the central axis of the chuck 3 when viewed from above.

[0045] Figure 2 This is a schematic diagram showing the positional relationship of the measuring points of the film thickness measuring device 7 on the workpiece W. Furthermore, in Figure 2 The text describes the positional relationship of the measurement points of the film thickness measuring device 7 when the rotational speed of the indexing table 2 is set to 20 decibels / s, the rotational speed of the chuck 3 is set to 400 rpm, and the sampling period of the film thickness measuring device 7 is set to 4 msec. Since the workpiece W passes directly beneath the film thickness measuring device 7 while rotating, the trajectory of the measurement points of the film thickness measuring device 7 extends to the entire workpiece W, including its center. Furthermore, the trajectory of the measurement points of the film thickness measuring device 7 can be appropriately modified according to the rotational speed of the indexing table 2, the rotational speed of the chuck 3, and the sampling period of the film thickness measuring device 7.

[0046] In the rotation direction of the indexing table 2, a film thickness measuring device 7 is installed on both the upstream and downstream sides of the fine grinding table ST4. This is because, when the machined workpiece W is transferred from the fine grinding table ST4 to the platform table ST1, due to the rotation mechanism of the indexing table 2, the indexing table 2 has a certain degree of... Figure 1 To correspond with the rotation directions of the indexing worktable 2, clockwise and counterclockwise rotations on the paper surface are indicated by a film thickness measuring device 7 installed on the upstream and downstream sides of the precision grinding worktable ST4.

[0047] The operation of the machining system 1 is controlled by a control device 8. The control device 8 controls each of the constituent elements of the machining system 1. The control device 8 may consist of, for example, a CPU and a memory. Furthermore, the functions of the control device 8 can be implemented using software or by operating hardware.

[0048] Next, the steps for machining two workpieces W sequentially using the same chuck will be explained. In the following description, the two workpieces W will be distinguished by the reference numerals W1 and W2.

[0049] <First workpiece (first stage of machining)>

[0050] The workpiece W1 is placed on the chuck 3 using the platform worktable ST1. When the vacuum source is activated, a negative pressure is supplied between the workpiece W1 and the chuck 3, causing the workpiece W1 to be adsorbed and held on the chuck 3.

[0051] Next, the indexing table 2 rotates, and the chuck 3 moves toward the rough grinding table ST2.

[0052] The chuck 3 moves to the rough grinding table ST2 to perform rough grinding on the workpiece W1. During rough grinding, with the rough grinding stone and chuck 3 rotating separately, the grinding surface of the rough grinding stone is pressed onto the workpiece W1 to perform rough grinding. When the measurement value of the first contact thickness measuring device 45 reaches the desired thickness, the rough grinding device 4 stops the rotation of the rough grinding stone and chuck 3, and moves the rough grinding stone upward to end the rough grinding process.

[0053] Next, the indexing table 2 rotates, and the chuck 3 moves toward the intermediate grinding table ST3. In the intermediate grinding table ST3, the workpiece W1 undergoes intermediate grinding. During intermediate grinding, with the intermediate grinding stone and chuck 3 rotating separately, the grinding surface of the intermediate grinding stone is pressed onto the workpiece W1, and intermediate grinding of the workpiece W1 is performed. When the measurement value of the second contact thickness measuring device 55 reaches the desired thickness, the intermediate grinding device 5 stops the rotation of the intermediate grinding stone and chuck 3, and moves the intermediate grinding stone upwards, ending the intermediate grinding process.

[0054] Then, the indexing table 2 rotates, and the chuck 3 moves toward the fine grinding table ST4. In the fine grinding table ST4, the workpiece W1 is finely ground. Specifically, as follows... Figure 3 As shown in (a) to (c), in the fine grinding process, with the fine grinding stone 61 and the chuck 3 rotating respectively, the grinding surface of the fine grinding stone 61 is pressed onto the workpiece W1 to perform fine grinding of the workpiece W1. When the measured value of the non-contact thickness measuring device 63 reaches the desired thickness, the fine grinding device 6 stops the rotation of the fine grinding stone 61 and the chuck 3, and moves the fine grinding stone 61 upward to end the fine grinding. It should be noted that the measured value of the non-contact thickness measuring device 63 at the end of the fine grinding is set to a value obtained by adding a specified offset thickness to the final target thickness.

[0055] Next, as the indexing table 2 rotates and the chuck 3 moves toward the platform table ST1, as... Figure 3 As shown in (d), the film thickness measuring device 7 measures the film thickness of workpiece W1 at multiple measuring points covering the entire surface of workpiece W. For example, the measuring points of the film thickness measuring device 7 on workpiece W1 are set to 200 points. With the measuring points set on the rotational track O of the central axis of the chuck 3 when viewed from above, the film thickness measuring device 7 can measure the film thickness of workpiece W1 midway through its return to the platform worktable ST1 while workpiece W1 is rotating around the central axis of the chuck 3, without reducing the productivity of the grinding process.

[0056] Next, the control device 8 calculates the shape of the workpiece W1 after precision grinding based on the measurement values ​​from the film thickness measuring device 7. For example, Figure 3 The workpiece W1 shown in (d) has a concave shape with a thicker periphery than a thicker center. The control device 8 calculates the tilt angle of the tilting mechanism to reduce the difference between the maximum and minimum film thickness in the workpiece W1 after the first processing. In addition, the relationship between the shape of the workpiece W1 and the tilt angle of the tilting mechanism is preset through experiments, etc.

[0057] <First workpiece (second stage of machining)>

[0058] Next, the workpiece W1, after fine grinding, is subjected to rough grinding, medium grinding, and fine grinding again.

[0059] Specifically, the chuck 3, which holds the workpiece W1 after fine grinding, moves in the same order as in the first stage of machining, following the sequence of the rough grinding table ST2, the medium grinding table ST3, and the fine grinding table ST4, to perform rough grinding, medium grinding, and fine grinding on the workpiece W1 after fine grinding.

[0060] In the second stage of machining of the workpiece W1 after fine grinding, using the rough grinding table ST2, the medium grinding table ST3, and the fine grinding table ST4, such as... Figure 4 As shown in (a) and (b), rough grinding, medium grinding and fine grinding are performed with the tilt angle of the tilting mechanism calculated based on the shape of the workpiece W1 after the first stage of fine grinding, in which the rotation axis 3a of the chuck 3 is tilted.

[0061] Then, as Figure 4 As shown in (c), the fine grinding ends when the measured value of the non-contact thickness measuring device 63 reaches the desired thickness. It should be noted that the measured value of the non-contact thickness measuring device 63 at the end of the fine grinding is set as the final target thickness.

[0062] Next, as the indexing table 2 rotates and the chuck 3 moves toward the platform table ST1, as... Figure 4 As shown in (d), the film thickness measuring device 7 measures the film thickness at multiple measuring points covering the entire surface of the workpiece W1.

[0063] Then, the control device 8 calculates the shape of the workpiece W1 after fine grinding based on the measurements from the film thickness measuring device 7. For example, Figure 4 The workpiece W1 illustrated in (d) is formed such that the difference between the maximum and minimum thickness is smaller than that of the workpiece W1 after fine grinding in the first stage, and is approximately flat. Furthermore, the control device 8 calculates the tilt angle of the tilting mechanism that reduces the difference between the maximum and minimum film thickness in the workpiece W1 after processing in the second stage.

[0064] In this case, when the surface roughness of the fine grinding stone 61 is set to a value smaller than the previous value (about 3 to 4 nm), and the workpiece W1 after the first stage of machining is machined in the second stage using the fine grinding stone 61 as before, the cutting difference of the fine grinding stone 61 may cause the shape of the workpiece W1 after the second stage of machining to become unstable or surface burns to occur. However, by performing the second stage of machining on the workpiece W1 after the first stage of machining in the order of rough grinding, medium grinding and fine grinding, the fine grinding stone 61 is sharpened and the cutting is maintained, so the workpiece W1 can be machined stably.

[0065] Then, the workpiece W1 is released from the suction hold between the workpiece W1 and the chuck 3 using the platform worktable ST1, and the workpiece W1 is transferred from the chuck 3 to the cleaning device.

[0066] <Second workpiece>

[0067] Next, the second workpiece W2 is held in the same chuck 3 as the first workpiece W1, and rough grinding and medium grinding are performed on the second workpiece W2 in the same manner as the rough grinding and medium grinding processes performed on the first workpiece W1. Furthermore, in the rough grinding table ST2 and the medium grinding table ST3, the tilt angle of the rotation axis 3a of the chuck 3 is set to be approximately the same as when machining the first workpiece W1.

[0068] Then, the indexing table 2 rotates, and the chuck 3 moves toward the fine grinding table ST4. The workpiece W1 is then finely ground on the fine grinding table ST4.

[0069] Specifically, such as Figure 5 As shown in (a), firstly, the chuck 3's rotation axis 3a is tilted by the tilting angle calculated based on the shape of the workpiece W1 after the second stage of grinding. That is, in the rough grinding table ST2 and the medium grinding table ST3 where the approximate shape of the workpiece W is determined, the workpiece W is machined with the tilt angle of the chuck 3's rotation axis 3a set to approximately the same state. In contrast, in the fine grinding table ST4 where the fine shape of the workpiece W is determined, when machining the second workpiece W2, the tilt angle of the chuck 3's rotation axis 3a is set to take into account the machining result of the first workpiece W1.

[0070] Next, as Figure 5 As shown in (b), with the grinding stone 61 and the chuck 3 rotating respectively, the grinding surface of the grinding stone 61 is pressed onto the workpiece W2 to perform fine grinding on the workpiece W2.

[0071] Then, when the measured value of the non-contact thickness measuring device 63 reaches the desired thickness, such as Figure 5 As shown in (c), the fine grinding device 6 stops the rotation of the fine grinding stone 61 and the chuck 3, and causes the fine grinding stone 61 to retract upward, thus ending the fine grinding process.

[0072] In this way, the film thickness measuring device 7 quickly measures the film thickness of the workpiece W1 after it has been pre-processed from the workpieces W1 and 2 that are continuously processed by the same chuck 3. The control device 8 calculates the tilt angle of the rotation axis 3a of the chuck 3, which can process the workpiece W1 into a roughly flat shape, based on the shape of the workpiece W1. The fine grinding device 6 performs fine grinding on the workpiece W2 with the rotation axis 3a of the chuck 3 tilted at this tilt angle. Thus, the workpiece W2 can be processed efficiently and with high precision based on the processing result of the workpiece W1.

[0073] Furthermore, in the rough grinding table ST2 and the medium grinding table ST3, where the approximate shape of the workpiece W is determined, each workpiece W is processed under the same conditions. In the fine grinding table ST4, where the fine shape of the workpiece W is determined, the shape of the workpiece W processed first is taken into account, and fine grinding is performed in a state where the workpiece W to be processed later is tilted. Therefore, multiple workpieces W can be processed stably and with high precision.

[0074] Next, as the indexing table 2 rotates and the chuck 3 moves toward the platform table ST1, as... Figure 5 As shown in (d), the film thickness measuring device 7 measures the film thickness of workpiece W2 at multiple measuring points covering the entire surface of workpiece W2. The measuring points of the film thickness measuring device 7 on workpiece W2 are set to, for example, 200 points.

[0075] Furthermore, the control device 8 calculates the shape of the workpiece W2 after fine grinding based on the measurements from the film thickness measuring device 7. For example, Figure 5 The workpiece W2 shown in (d) is formed such that the difference between the maximum and minimum thickness is smaller than that of workpiece W1 and is generally flat.

[0076] As needed, for the third and subsequent workpieces W, the tilt angle of the chuck 3's rotation axis 3a is calculated based on the shape of the workpiece W most recently processed by the same chuck 3, so that the difference between the maximum and minimum thickness in the most recently processed workpiece W is reduced. The subsequent workpieces W are then ground while the chuck 3's rotation axis 3a is tilted at this tilt angle.

[0077] Thus, the processing system 1 of the present invention is configured to process a workpiece W in the order of rough grinding, medium grinding, and fine grinding. The processing system 1 is characterized by comprising: a tilting device capable of tilting the rotation axis 3a of a chuck 3 holding the workpiece W; a film thickness measuring device 7 that measures the film thickness of the fine-ground workpiece W in a non-contact manner; and a control device 8 that calculates the shape of the fine-ground workpiece W based on the measurement value of the film thickness measuring device 7, calculates the tilt angle of the tilting device to reduce the difference between the maximum and minimum thicknesses in the fine-ground workpiece W, tilts the chuck 3 at this tilt angle, and, while the chuck 3 is tilted at this tilt angle, reprocesses the fine-ground workpiece W in the order of rough grinding, medium grinding, and fine grinding.

[0078] According to this structure, the film thickness measuring device 7 quickly measures the film thickness of the workpiece W1 after the first stage of processing. The control device 8 calculates the tilt angle of the rotating shaft 3a of the chuck 3, which can process the workpiece W1 into a roughly flat shape, based on the shape of the workpiece W1. With the rotating shaft 3a of the chuck 3 tilted at this tilt angle, the workpiece W1 is subjected to rough grinding, medium grinding, and fine grinding again. Thus, even when the grinding stone of the fine grinding device 6 is relatively fine, the cutting of the fine grinding stone 61 can be maintained through rough grinding and medium grinding. Therefore, the workpiece W1 can be processed efficiently and with high precision.

[0079] Furthermore, by processing the same workpiece W1 in two stages, the thermal expansion and contraction of the chuck 3 and other components caused by the processing heat during grinding may not converge during the film thickness measurement in the first stage. In contrast, the thermal expansion and contraction of the chuck 3 and other components caused by the processing heat during grinding converge during the film thickness measurement in the second stage, thereby enabling the shape of the workpiece W1 to be calculated with high accuracy.

[0080] In addition, the processing system 1 of the present invention also includes an indexing table 2, which causes the chuck 3 to rotate and move on the guide rail O, and the film thickness measuring device 7 is configured to be set on the guide rail O in a top view.

[0081] According to this structure, the measuring point of the film thickness measuring device 7 is set on the guide rail O of the indexing table 2 when viewed from above, thereby enabling the film thickness of the workpiece W to be measured without reducing the productivity of the grinding process of the workpiece W.

[0082] Furthermore, various modifications can be made to this invention in addition to those described above, provided they do not depart from the spirit of the invention, and this invention certainly relates to such modified solutions.

[0083] Explanation of the labels:

[0084] Label 1 indicates the machining system;

[0085] Label 2 indicates the indexing worktable;

[0086] The designation 2a indicates the rotary axis (of the indexing table 2);

[0087] The number 3 indicates the chuck;

[0088] The designation 3a indicates the rotation axis (of the chuck);

[0089] The number 31 indicates a rotary table;

[0090] The designation 32 indicates an adsorbent;

[0091] The designation 4 indicates a rough grinding device;

[0092] The number 41 indicates the first spindle;

[0093] The number 42 indicates the first spindle feed mechanism;

[0094] The designation 43 indicates the linear guide (of the rough grinding device);

[0095] The designation 44 indicates the ball screw sliding mechanism (of the rough grinding device);

[0096] The designation 45 indicates the first contact thickness measuring device;

[0097] Numbers 46 and 47 indicate the detection arm;

[0098] The designation 5 indicates the intermediate grinding unit;

[0099] The number 51 indicates the second spindle;

[0100] The designation 52 indicates the second spindle feed mechanism;

[0101] The designation 53 indicates the linear guide (of the intermediate grinding unit);

[0102] The designation 54 indicates the ball screw sliding mechanism (in the intermediate grinding unit);

[0103] The designation 55 indicates the second contact thickness measuring device;

[0104] Numbers 56 and 57 indicate the detection arm;

[0105] The designation 6 indicates a precision grinding device;

[0106] The designation 61 indicates a fine grinding stone;

[0107] The number 62 indicates the third spindle;

[0108] The designation 63 indicates a non-contact thickness measurement device;

[0109] The number 7 indicates the film thickness measuring device;

[0110] The number 8 indicates a control device;

[0111] The symbol ST1 represents the platform workbench;

[0112] The symbol ST2 represents the rough grinding table;

[0113] The symbol ST3 represents the medium grinding table;

[0114] The symbol ST4 represents the fine grinding table;

[0115] The symbols W, W1, and W2 represent workpieces.

Claims

1. A machining system that processes a workpiece in the order of pre-grinding and fine grinding, characterized in that... The processing system includes: A tilting device that can tilt the rotation axis of the chuck holding the workpiece. A measuring device that measures the film thickness of the workpiece after fine grinding in a non-contact manner; and The control device calculates the shape of the workpiece after fine grinding based on the measurements from the measuring device, calculates the tilt angle of the tilting device to reduce the difference between the maximum and minimum thicknesses of the workpiece, and tilts the chuck at the tilt angle. In this process, with the chuck tilted at the aforementioned tilt angle, the workpiece after fine grinding is reprocessed in the order of pre-grinding and fine grinding, thereby sharpening the fine grinding stone through the aforementioned pre-grinding.

2. The processing system according to claim 1, characterized in that... It also includes an indexing table, which allows the chuck to rotate and move on specified guideways. The aforementioned measuring device is mounted on the aforementioned guide rail when viewed from above.

Images