FPC hot pressing horizontal adjustment mechanism

By combining the base, pressure head, hollow screw, and lifting screw, the complexity and inconvenience of the FPC hot pressing level adjustment mechanism are solved, enabling convenient adjustment and replacement of the pressure head, and improving the stability of the hot pressing process and product quality.

CN117192818BActive Publication Date: 2026-04-21SHENZHEN COMWIN AUTOMATION TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN COMWIN AUTOMATION TECH
Filing Date
2023-08-15
Publication Date
2026-04-21

AI Technical Summary

Technical Problem

The existing FPC hot pressing level adjustment mechanism is complex in structure, inconvenient to adjust, and inconvenient to replace the pressure head, which affects the stability of the hot pressing process and product quality.

Method used

The system employs a combination structure of base, pressure head, hollow screw, and lifting screw. The pressure head is suspended and adjusted through the cooperation of axial stepped holes and hanging threaded holes. Combined with the design of heating element, connecting block and fixing plate, the system ensures that the level of the pressure head can be adjusted accurately and conveniently.

Benefits of technology

The compact design of the pressure head is achieved, which makes it easy to adjust and has a good fine-tuning effect, improving the stability of the hot pressing process and the convenience of pressure head replacement, thus enhancing product quality.

✦ Generated by Eureka AI based on patent content.

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    Figure CN117192818B_ABST
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Abstract

This application provides an FPC hot-pressing level adjustment mechanism, including a base, a pressure head, multiple hollow screws, and multiple lifting screws. The base is provided with multiple lifting threaded holes, and the pressure head is located below the base and is provided with multiple mounting threaded holes. The multiple hollow screws are threaded into the lifting threaded holes, and the hollow screws are provided with axial stepped holes. The multiple lifting screws are limited and assembled through the axial stepped holes and engage with the mounting threaded holes to suspend the pressure head relative to the base. The hollow screws abut against the top of the pressure head to push the pressure head down relative to the base for adjustment, and the lifting screws are used to pull the pressure head up relative to the base for adjustment. The FPC hot-pressing level adjustment mechanism provided in this application has axial stepped holes on the hollow screws, and the lifting screws are limited and assembled through the axial stepped holes and engage with the mounting threaded holes to suspend the pressure head relative to the base. The pressure head is leveled by multiple nested hollow screws and lifting screws, which has a compact structure, is easy to adjust, and has a good fine-tuning effect.
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Description

Technical Field

[0001] This application relates to the field of hot-press connection manufacturing technology, and in particular to an FPC hot-press level adjustment mechanism. Background Technology

[0002] Currently, the hot pressing process in LCD module bonding equipment is a critical process, and the stability of the hot pressing process directly affects the quality of the product.

[0003] Hot pressing is a process that uses high temperature and high pressure to press products together. Therefore, a certain pressure needs to be applied to the pressing head mechanism to heat the pressing head, and the surface of the pressing head needs to be kept horizontal with the surface of the product during the pressing process.

[0004] Because the pressure head and its auxiliary mechanisms are made of metal, the material is prone to deformation under high temperature and pressure, causing the surface of the pressure head to change from being horizontal to the surface of the product. Therefore, a leveling adjustment mechanism is needed to adjust the relative parallelism between the surface of the pressure head and the surface of the product. In particular, for medium and large-sized LCD products, the bonding area is longer, requiring a longer pressure head, and thus placing higher demands on the stability of the hot pressing pressure head mechanism.

[0005] Currently, the FPC hot pressing level adjustment mechanism has a complex structure, is inconvenient to adjust, and is also inconvenient to replace the pressure head. Summary of the Invention

[0006] This application provides an FPC hot pressing level adjustment mechanism to solve the technical problems in the prior art, such as complex structure, inconvenient adjustment, and inconvenient pressure head replacement of the FPC hot pressing level adjustment mechanism.

[0007] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide an FPC hot-pressing level adjustment mechanism, the FPC hot-pressing level adjustment mechanism comprising:

[0008] The base is equipped with multiple lifting threaded holes;

[0009] The pressure head is located below the base and is provided with multiple mounting threaded holes;

[0010] Multiple hollow screws are threaded into the lifting threaded holes, and the hollow screws are provided with axial stepped holes;

[0011] Multiple lifting screws are assembled and limited by the axial stepped holes and cooperate with the hanging threaded holes to suspend the pressure head relative to the base;

[0012] The hollow screw abuts against the top of the pressure head to push the pressure head downward relative to the base, and the lifting screw is used to pull the pressure head upward relative to the base.

[0013] In one specific embodiment of this application, the FPC hot-pressing level adjustment mechanism further includes a plurality of locking nuts, which are threadedly engaged with the hollow screw on the side of the hoisting threaded hole away from the mounting threaded hole.

[0014] In one specific embodiment of this application, the FPC hot-pressing level adjustment mechanism further includes:

[0015] The heating element is fixed to the base and makes thermal contact with the first side of the pressure head;

[0016] Multiple connecting blocks are fixed to the heating element and located between the pressure head and the base, while also being positioned between the multiple hollow screws;

[0017] A fixing plate is fixed to the connecting block and contacts the second side of the pressure head.

[0018] In one specific embodiment of this application, the pressure head includes a connecting part, a ramp part, and a pressure connector connected in sequence. The connecting part is provided with the mounting threaded hole. The thickness of the ramp part gradually decreases from the connecting part toward the pressure connector. The pressure connector is used to thermally press the FPC to the circuit board.

[0019] In one specific embodiment of this application, the fixing plate includes a mounting part and a sloping support part connected to each other. The mounting part is provided with a fixing hole to fix it to the connecting block, and the sloping support part is in contact with the inclined surface of the slope part.

[0020] In one specific embodiment of this application, the thickness of the connecting block is greater than the thickness of the pressure head, and the mounting portion is spaced apart from the connecting portion.

[0021] In one specific embodiment of this application, the FPC hot-pressing level adjustment mechanism further includes a heat insulation plate, which is disposed between the heating element and the base.

[0022] In a specific embodiment of this application, the FPC hot-pressing level adjustment mechanism further includes a positioning screw and a plurality of heat insulation columns. The base is provided with a positioning hole, the heat insulation columns are disposed between the connecting block and the base, the positioning screw passes through the positioning hole, and the heat insulation columns are fixed to the connecting block.

[0023] In one specific embodiment of this application, the bottom of the base is provided with an assembly step and an assembly hole, the heat insulation plate is positioned and assembled through the assembly step, and the heating element and the heat insulation plate are provided with through holes that align with the assembly hole for assembly by screws.

[0024] In one specific embodiment of this application, the base is provided with a cavity for accommodating the hollow screw and the lifting screw.

[0025] The beneficial effects of this application are: the FPC hot pressing level adjustment mechanism provided by this application has an axial stepped hole in the hollow screw, the lifting screw is limited by the axial stepped hole and cooperates with the hanging thread hole to suspend the pressure head relative to the base, and the pressure head is adjusted horizontally by multiple nested hollow screws and lifting screws. Its structure is compact, the adjustment is convenient, and the fine adjustment effect is good. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0027] Figure 1 This is a three-dimensional structural schematic diagram of the FPC hot-pressing level adjustment mechanism provided in the embodiments of this application;

[0028] Figure 2 yes Figure 1 The exploded structural diagram of the FPC hot-pressing level adjustment mechanism shown in the figure;

[0029] Figure 3 yes Figure 1 The diagram shows a partially enlarged cross-sectional view of the FPC hot-pressing level adjustment mechanism.

[0030] Explanation of reference numerals in the attached drawings: 10, FPC hot pressing level adjustment mechanism; 100, base; 101, lifting threaded hole; 102, assembly step; 103, cavity; 200, pressure head; 201, hanging threaded hole; 210, connecting part; 220, ramp part; 230, pressure joint; 300, hollow screw; 301, axial step hole; 400, lifting screw; 500, lock nut; 610, heating element; 611, heating tube; 620, connecting block; 630, fixing plate; 631, fixing hole; 632, mounting part; 634, inclined support part; 640, heat insulation plate; 650, positioning screw; 660, heat insulation column. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0033] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0034] Please refer to the following: Figures 1 to 3 This application provides an FPC hot pressing level adjustment mechanism 10, which mainly includes a base 100, a pressure head 200, a plurality of hollow screws 300, and a plurality of lifting screws 400.

[0035] The base 100 is provided with a plurality of lifting threaded holes 101, which are vertically arranged and penetrate the bottom of the base 100. The base 100 can be made of SUS440C metal material. The notch at the center of the top of the base 100 is used to connect the hot press cylinder. Since the hot press cylinder is not related to the point of invention, it will not be described in detail in this application.

[0036] The base 100 is provided with a cavity 103, and multiple lifting threaded holes 101 penetrate the bottom of the base 100 and the cavity 103. The cavity 103 is used to accommodate the hollow screw 300 and the lifting screw 400, preventing the hollow screw 300 and the lifting screw 400 from being exposed. This avoids the hollow screw 300 and the lifting screw 400 from being easily misoperated due to exposure. At the same time, the cavity 103 accommodating the hollow screw 300 and the lifting screw 400 makes the overall structure of the FPC hot pressing level adjustment mechanism 10 compact and thinner. The cavity 103 is not a hollow structure that penetrates the thickness direction of the base 100, but a partially recessed non-hollow structure. This non-hollow structure can ensure the mechanical strength of the base 100, and its stability is better than that of a hollow structure.

[0037] The pressure head 200 is located below the base 100 and is provided with multiple mounting threaded holes 201. The top of the pressure head 200 is relatively thick for mechanical connection assembly, and the bottom of the pressure head 200 is relatively thin for heat-pressing the gold finger portion of the FPC (not shown) to the gold finger portion on the circuit board (not shown).

[0038] Multiple hollow screws 300 are threaded into lifting threaded holes 101. Each hollow screw 300 has an axial stepped hole 301, which is a smooth hole rather than a threaded hole. Screws are generally solid screws. This application uses hollow screws 300 as a component of the FPC hot-pressing level adjustment mechanism 10. Lifting screws 400 can be coaxially nested with hollow screws 300, which not only makes the FPC hot-pressing level adjustment mechanism 10 more compact but also allows for fine-tuning in the same axial position when adjusting the level of the pressure head 200. If the lifting screws 400 and hollow screws 300 are non-coaxial and spaced apart, the number of lifting screws 400 and hollow screws 300 installed in the same length installation environment is relatively small. This is not conducive to short-distance local leveling fine-tuning. In this application, the lifting screw 400 can be coaxially nested with the hollow screw 300. Under the same installation length, more sets of lifting screws 400 and hollow screws 300 can be set, which is beneficial for short-distance local leveling fine adjustment.

[0039] Multiple lifting bolts 400 pass through axial stepped holes 301 (see...) Figure 3 The limiting assembly 400 engages with the mounting threaded hole 201 to suspend the pressure head 200 relative to the base 100. The lifting screw 400 can be an internal hexagonal screw. The length of the lifting screw 400 is greater than the length of the hollow screw 300, and after the lifting screw 400 is limited and assembled in the axial stepped hole 301, it can engage with the mounting threaded hole 201.

[0040] The hollow screw 300 abuts against the top of the pressure head 200 to push the pressure head 200 down relative to the base 100. When the hollow screw 300 rotates relative to the lifting threaded hole 101, it can increase or decrease the pushing force on the pressure head 200. The lifting screw 400 is used to pull the pressure head 200 up relative to the base 100. When the lifting screw 400 rotates, it can lift or lower the pressure head 200 to a certain extent.

[0041] The FPC hot-pressing level adjustment mechanism 10 also includes multiple locking nuts 500. The locking nuts 500 are threadedly engaged with the hollow screw 300 on the side of the lifting threaded hole 101 away from the hanging threaded hole 201. They are mainly used to lock the position of the hollow screw 300 after it has been adjusted, thereby reducing the loosening of the hollow screw 300 during the use of the FPC hot-pressing level adjustment mechanism 10.

[0042] The FPC hot-press level adjustment mechanism 10 also includes a heating element 610, multiple connecting blocks 620, and a fixing plate 630.

[0043] The heating element 610 is fixed to the base 100 and makes thermal contact with the first side of the pressure head 200. The contact surface between the heating element 610 and the pressure head 200 is a plane to ensure sufficient contact area so that heat can be conducted from the heating element 610 to the pressure head 200. A heating tube 611 is provided inside the heating element 610. The inner end of the heating tube 611 can abut against the surface of the pressure head 200 to increase the heat conduction efficiency.

[0044] Multiple connecting blocks 620 are fixed to the heating element 610 and located between the pressure head 200 and the base 100, while also situated between multiple hollow screws 300. The heating element 610 and the multiple connecting blocks 620 have relatively flat reference surfaces to define the reference position of the pressure head 200; that is, the heating element 610 provides a reference position on one side, and the connecting blocks 620 provide a reference position on the top. When the pressure head 200 is replaced, the new pressure head 200 can be quickly installed based on the reference positions provided by the heating element 610 on the side and the top reference positions provided by the connecting blocks 620. The lower surface of the connecting blocks 620 is not primarily for contact with the upper surface of the pressure head 200; the upper surface of the pressure head 200 primarily contacts the multiple hollow screws 300.

[0045] The fixing plate 630 is fixed to the connecting block 620 and contacts the second side of the pressure head 200. The second side of the pressure head 200 and the first side of the pressure head 200 are side surfaces facing each other.

[0046] like Figure 2 As shown, the pressure head 200 includes a connecting part 210, a ramp part 220 and a pressure joint 230 connected in sequence.

[0047] The connecting part 210 is provided with the aforementioned mounting threaded hole 201, and the thickness of the ramp part 220 gradually decreases from the connecting part 210 toward the crimp connector 230. The crimp connector 230 is used to thermally press the FPC to the circuit board.

[0048] The fixing plate 630 includes a mounting part 632 and a sloping support part 634 connected to each other. The mounting part 632 is provided with a fixing hole 631 to fix it to the connecting block 620. The sloping support part 634 is in contact with the inclined surface of the slope part 220 and plays a role in laterally pressing and upward supporting the pressure head 200.

[0049] In this embodiment, the thickness of the connecting block 620 is greater than the thickness of the pressure head 200, and the mounting part 632 is spaced apart from the connecting part 210. This avoids the fixing plate 630 clamping the pressure head 200 too tightly, making it difficult to adjust. When the level of the pressure head 200 is adjusted by multiple hollow screws 300, multiple lifting screws 400, and locking nuts 500, the main function is to overcome the friction between the inclined support part 634 and the slope part 220, so the assembly reference of the pressure head 200 is not easily changed.

[0050] In addition, the FPC hot-pressing level adjustment mechanism 10 also includes a heat insulation plate 640, which is disposed between the heating element 610 and the base 100. The heat insulation plate 640 can be made of zirconia ceramic material. The heat insulation plate 640 is used to reduce the heat conduction from the heating element 610 to the base 100, thereby reducing the thermal deformation of the base 100.

[0051] The FPC hot-pressing level adjustment mechanism 10 also includes positioning screws 650 and multiple heat insulation columns 660. The base 100 is provided with positioning holes 651, which are alternately arranged with lifting threaded holes 101. The heat insulation columns 660 are arranged between the connecting block 620 and the base 100. The positioning screws 650 pass through the positioning holes 651 and the heat insulation columns 660 and are fixed to the connecting block 620.

[0052] Furthermore, the base 100 has an assembly step 102 and an assembly hole at its bottom. The heat insulation plate 640 is positioned and fitted via the assembly step 102. The heating element 610 and the heat insulation plate 640 have through holes that align with the assembly hole for assembly with screws. Because the base 100 has an assembly step 102 at its bottom, the heating element 610 and the heat insulation plate 640 can have a good assembly reference. The heating element 610 and the heat insulation plate 640 can be quickly assembled into place by directly abutting against the assembly step 102, providing an assembly reference for the pressure head 200.

[0053] When actually adjusting the level of the pressure head 200, it is necessary to selectively adjust the hollow screw 300, the lifting screw 400, and the locking nut 500 back and forth.

[0054] For example, when it is necessary to lower one end of the pressure head 200, first loosen the locking nut 500, then loosen the lifting screw 400, and then tighten the hollow screw 300 to push the pressure head 200 downwards. After adjusting it to the correct position, tighten the locking nut 500 to lock it in place. Of course, this process may require multiple adjustments, such as adjusting the tightness of the lifting screw 400 according to changes in the levelness of the pressure head 200.

[0055] In summary, those skilled in the art will readily understand that the FPC hot pressing level adjustment mechanism 10 provided in this application has an axial stepped hole 301 in the hollow screw 300. The lifting screw 400 is limited and assembled through the axial stepped hole 301 and cooperates with the hanging threaded hole 201 to suspend the pressure head 200 relative to the base 100. The pressure head 200 is horizontally adjusted by multiple nested hollow screws 300 and lifting screws 400. Its structure is compact, adjustment is convenient, and fine adjustment effect is good.

[0056] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An FPC hot-pressing level adjustment mechanism, characterized in that, The FPC hot-pressing horizontal adjustment mechanism is applied to the LCD module bonding device and includes: The base (100) is provided with multiple lifting threaded holes (101); The pressure head (200) is located below the base (100) and is provided with multiple mounting threaded holes (201); Multiple hollow screws (300) are threaded into the lifting threaded holes (101), and the hollow screws (300) are provided with axial stepped holes (301). Multiple lifting screws (400) are limited and assembled through the axial stepped hole (301) and cooperate with the mounting threaded hole (201) to suspend the pressure head (200) relative to the base (100); The heating element (610) is fixed to the base (100) and makes thermal contact with the first side of the pressure head (200); Multiple connecting blocks (620) are fixed to the heating element (610) and located between the pressure head (200) and the base (100), while also being located between multiple hollow screws (300); A fixing plate (630) is fixed to the connecting block (620) and contacts the second side of the pressure head (200); The hollow screw (300) abuts against the top of the pressure head (200) to push the pressure head (200) down relative to the base (100), and the lifting screw (400) is used to pull the pressure head (200) up relative to the base (100). The pressure head (200) includes a connecting part (210), a ramp part (220), and a pressure connector (230) connected in sequence. The connecting part (210) is provided with the mounting threaded hole (201). The thickness of the ramp part (220) gradually decreases from the connecting part (210) toward the pressure connector (230). The pressure connector (230) is used to thermally press the FPC to the circuit board. The fixing plate (630) includes a mounting part (632) and a sloping support part (634) connected to each other. The mounting part (632) is provided with a fixing hole (631) to be fixed with the connecting block (620). The sloping support part (634) is in contact with the inclined surface of the slope part (220).

2. The FPC hot-pressing level adjustment mechanism according to claim 1, characterized in that, It also includes a plurality of locking nuts (500), which are threadedly engaged with the hollow screw (300) on the side of the lifting threaded hole (101) away from the mounting threaded hole (201).

3. The FPC hot-pressing level adjustment mechanism according to claim 1, characterized in that, The thickness of the connecting block (620) is greater than the thickness of the pressure head (200), and the mounting part (632) is spaced apart from the connecting part (210).

4. The FPC hot-pressing level adjustment mechanism according to claim 1, characterized in that, It also includes a heat insulation plate (640) disposed between the heating element (610) and the base (100).

5. The FPC hot-pressing level adjustment mechanism according to claim 4, characterized in that, The base (100) has an assembly step (102) and an assembly hole at its bottom. The heat insulation plate (640) is positioned and assembled by the assembly step (102). The heating element (610) and the heat insulation plate (640) have through holes that align with the assembly hole for assembly by screws.

6. The FPC hot-pressing level adjustment mechanism according to claim 1, characterized in that, It also includes a positioning screw (650) and a plurality of heat insulation columns (660). The base (100) is provided with a positioning hole (651). The heat insulation column (660) is disposed between the connecting block (620) and the base (100). The positioning screw (650) passes through the positioning hole (651), and the heat insulation column (660) is fixed to the connecting block (620).

7. The FPC hot-pressing level adjustment mechanism according to claim 1, characterized in that, The base (100) is provided with a cavity (103) for accommodating the hollow screw (300) and the lifting screw (400).

Citation Information

Patent Citations

  • Mechanism for adjusting flatness of pressing head

    TWM295750U