A method, device, equipment and storage medium for thermal analysis of electrical components

Abstract

The present invention relates to a method, device, equipment and storage medium for thermal analysis of electrical components. The method comprises: dividing a joint actual model to be analyzed into a plurality of finite element analysis grids; the joint actual model to be analyzed comprises thermally conductive silicone, electrical components and at least one contact surface between the thermally conductive silicone and the electrical components; allocating contact surface mass and contact surface heat dissipation to each contact surface according to the thermally conductive silicone parameters; establishing a simplified simulation model through the contact surface mass and the contact surface heat dissipation, and calibrating the contact thermal resistance between the thermally conductive silicone and the electrical components in the actual model; analyzing the temperature change of the electrical components according to the contact thermal resistance, the simulation model and the contact surface heat dissipation. The present invention analyzes the actual model through the finite element analysis method, thereby allocating the contact surface mass and the contact surface heat dissipation, simplifying the simulation model, calibrating the contact thermal resistance, and finally analyzing the temperature change process of the electrical components according to the contact thermal resistance, the simulation model and the contact surface heat dissipation.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal analysis of electrical components, and in particular to a method, device, equipment and storage medium for thermal analysis of electrical components. Background Art

[0002] With the development of intelligence and electrification, there are more and more automotive electrical components, and the heat dissipation problem of the resulting electrical components is becoming more and more prominent. Electrical components can easily malfunction due to untimely heat dissipation, causing the car to lose balance and pose a safety hazard.

[0003] Existing heat dissipation simulation of electrical components generally adopts a steady-state calculation method. When the electrical components reach a stable state, thermal analysis is performed on the electrical components to more accurately obtain the final equilibrium temperature of each heat-generating component.

[0004] However, this method ignores the influence of material specific heat capacity and contact thermal resistance on heat dissipation results. In actual engineering applications, the heat dissipation of many electrical components cannot be reflected by steady-state calculations, and the heat dissipation process of the heating electrical components cannot be accurately described. Moreover, if transient calculations are directly used, due to the complex contact surface structure between the electrical components and the thermal conductive silicone, if corresponding simplification work is not performed, the amount of calculation required is very large, and it is difficult to meet the design iteration development cycle. Summary of the invention

[0005] In view of this, it is necessary to provide a thermal analysis method, device, equipment and storage medium for electrical components to solve the problem that the steady-state calculation method in the prior art cannot accurately describe the heat dissipation process of the heat-generating electrical components because it ignores the influence of the material specific heat capacity properties and the contact thermal resistance on the heat dissipation results.

[0006] In order to achieve the above technical objectives, the present invention adopts the following technical solutions:

[0007] In a first aspect, the present invention provides a method for thermal analysis of an electrical component, comprising:

[0008] Dividing the joint actual model to be analyzed into a plurality of finite element analysis grids; the joint actual model to be analyzed includes thermal conductive silicone, electrical components, and at least one contact surface between the thermal conductive silicone and the electrical components;

[0009] According to the thermal conductive silicone parameters, the contact surface mass and the contact surface heat dissipation are allocated to each contact surface;

[0010] A simplified simulation model is established through the contact surface mass and the heat dissipation of the contact surface, and the contact thermal resistance between the thermal conductive silicone and the electrical components in the actual joint model to be analyzed is calibrated;

[0011] Analyze the temperature changes of electrical components based on contact thermal resistance, simulation model and heat dissipation of the contact surface.

[0012] In some possible implementations, the thermal conductive silicone parameters include the thermal conductive silicone mass and the thermal conductive silicone heat dissipation; and the contact surface mass and the contact surface heat dissipation are allocated to each contact surface according to the thermal conductive silicone parameters, including:

[0013] Calculate the thermal conductivity of multiple contact surfaces between thermally conductive silicone and electrical components;

[0014] Calculate the distribution ratio based on the thermal conductivity of all contact surfaces;

[0015] Determine the contact surface quality based on the distribution ratio and the quality of the thermally conductive silicone;

[0016] The heat dissipation of the contact surface is determined based on the distribution ratio and the heat dissipation of the thermally conductive silicone.

[0017] In some possible implementations, the thermal conductive silicone parameters further include thermal conductivity and thermal conductive silicone thickness; and the thermal conductive power is calculated for multiple contact surfaces between the thermal conductive silicone and the electrical component, including:

[0018] Determine the mesh area of ​​all contact surfaces;

[0019] The thermal conductivity of multiple contact surfaces is calculated according to the thermal conductivity, the thickness of the thermal conductive silicone and the mesh area of ​​the contact surface.

[0020] In some possible implementations, the distribution ratio is calculated based on the thermal conductivity of all contact surfaces, including:

[0021] Calculate the total thermal conductivity of all contact surfaces;

[0022] The distribution ratio of all contact surfaces is determined according to the ratio of the heat conduction power of each contact surface to the total heat conduction power.

[0023] In some possible implementations, the contact surface quality is determined according to the distribution ratio and the quality of the thermal conductive silicone, including:

[0024] The mass of each contact surface is obtained according to the product of the distribution ratio of each contact surface and the mass of the thermal conductive silicone.

[0025] In some possible implementations, the heat dissipation of the contact surface is determined according to the distribution ratio and the heat dissipation of the thermally conductive silicone, including:

[0026] The heat dissipation of each contact surface is obtained according to the product of the distribution ratio of each contact surface and the heat dissipation of the thermal conductive silicone.

[0027] In some possible implementations, a simplified simulation model is established by using the contact surface mass and the heat dissipation of the contact surface, and the contact thermal resistance between the thermal conductive silicone and the electrical components in the joint actual model to be analyzed is calibrated, including:

[0028] A simplified simulation model with the same mass and material as the actual model is established according to the contact surface mass and the heat dissipation of the joint contact surface to be analyzed;

[0029] respectively obtaining the slope of the temperature-time curve of the actual joint model to be analyzed and the slope of the temperature-time curve of the simulation model;

[0030] The contact thermal resistance of the simulation model is adjusted until the slope of the temperature-time curve of the simulation model is the same as the slope of the temperature-time curve of the actual model to be analyzed, and the contact thermal resistance is calibrated.

[0031] In a second aspect, the present invention further provides an electrical component thermal analysis device, comprising:

[0032] A partitioning module is used to partition a joint actual model to be analyzed into a plurality of finite element analysis grids; the joint actual model to be analyzed includes thermal conductive silicone, electrical components, and at least one contact surface between the thermal conductive silicone and the electrical components;

[0033] An allocation module, used for allocating contact surface mass and contact surface heat dissipation to each contact surface according to thermal conductive silicone parameters based on a finite element analysis method;

[0034] Modeling module, used to establish a simplified simulation model through contact surface quality and contact surface heat dissipation, and calibrate the contact thermal resistance between the thermal conductive silicone and the electrical components in the joint actual model to be analyzed;

[0035] The analysis module is used to analyze the temperature changes of electrical components based on contact thermal resistance, simulation model and heat dissipation of the contact surface.

[0036] In a third aspect, the present invention further provides an electrical component thermal analysis device, comprising a memory and a processor, wherein:

[0037] Memory, used to store programs;

[0038] The processor is coupled to the memory and is used to execute the program stored in the memory to implement the steps in the electrical component thermal analysis method in any of the above implementations.

[0039] In a fourth aspect, the present invention further provides a computer-readable storage medium for storing computer-readable programs or instructions, which, when executed by a processor, can implement the steps of the thermal analysis method for electrical components in any of the above-mentioned implementations.

[0040] The beneficial effects of adopting the above embodiment are as follows: the present invention relates to a method, device, equipment and storage medium for thermal analysis of electrical components, the method comprising: dividing a joint actual model to be analyzed into a plurality of finite element analysis grids; the joint actual model to be analyzed comprises thermally conductive silicone, electrical components and at least one contact surface between the thermally conductive silicone and the electrical components; allocating a contact surface mass and a contact surface heat dissipation for each contact surface according to the thermally conductive silicone parameter; establishing a simplified simulation model through the contact surface mass and the contact surface heat dissipation, and calibrating the contact thermal resistance between the thermally conductive silicone and the electrical components in the joint actual model to be analyzed; analyzing the temperature change of the electrical components according to the contact thermal resistance, the simulation model and the contact surface heat dissipation. The present invention analyzes the joint actual model to be analyzed by the finite element analysis method, thereby allocating the contact surface mass and the contact surface heat dissipation of the contact surface between the electrical components and the thermally conductive silicone, and also understanding the specific heat capacity of the contact surface of the thermally conductive silicone, which is conducive to realizing the simplification of the simulation model, and then calibrating the contact thermal resistance in the joint actual model to be analyzed, and finally analyzing the temperature change process of the electrical components according to the contact thermal resistance, the simulation model and the contact surface heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 A schematic diagram of a flow chart of an embodiment of a method for thermal analysis of an electrical component provided by the present invention;

[0042] Figure 2 The present invention provides Figure 1 A schematic diagram of a flow chart of an embodiment of step S102;

[0043] Figure 3 The present invention provides Figure 1 A schematic flow chart of an embodiment of step S103;

[0044] Figure 4 A simplified schematic diagram of an embodiment of a simplified transformer simulation model provided by the present invention;

[0045] Figure 5 A schematic structural diagram of an embodiment of a thermal analysis device for electrical components provided by the present invention;

[0046] Figure 6 A schematic diagram of the structure of a thermal analysis device for electrical components provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0047] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, wherein the accompanying drawings constitute a part of this application and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not used to limit the scope of the present invention.

[0048] Before describing the embodiments of the present invention, the relevant terms are explained as follows:

[0049] Specific Heat Capacity: Indicated by the symbol c, also known as specific heat capacity, or specific heat for short, is the heat capacity per unit mass of a substance, that is, the amount of heat absorbed or released when a unit mass of an object changes its unit temperature;

[0050] Contact thermal resistance: Two solid surfaces that are nominally in contact with each other actually only contact on some discrete area elements. The gaps between the non-contact interfaces are often filled with air, and heat will pass through this air gap layer by heat conduction. Compared with the complete contact of the solid surfaces, this situation adds additional transfer resistance, which is called contact thermal resistance.

[0051] In the description of the present application, “plurality” means two or more than two, unless otherwise clearly and specifically defined.

[0052] Reference to an "embodiment" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0053] The present invention provides a method, device, equipment and storage medium for thermal analysis of electrical components, which are described below respectively.

[0054] See also Figure 1 , Figure 1 A schematic flow chart of an embodiment of a thermal analysis method for an electrical component provided by the present invention. A specific embodiment of the present invention discloses a thermal analysis method for an electrical component, comprising:

[0055] S101, dividing the joint actual model to be analyzed into a plurality of finite element analysis grids; the joint actual model to be analyzed includes thermal conductive silicone, electrical components, and at least one contact surface between the thermal conductive silicone and the electrical components;

[0056] S102, based on a finite element analysis method, allocating a contact surface mass and a contact surface heat dissipation to each contact surface according to thermal conductive silicone parameters;

[0057] S103, establishing a simplified simulation model through the contact surface mass and the contact surface heat dissipation, and calibrating the contact thermal resistance between the thermal conductive silicone and the electrical components in the combined actual model to be analyzed;

[0058] S104. Analyze temperature changes of electrical components based on contact thermal resistance, simulation model, and heat dissipation of contact surface.

[0059] In the above embodiment, the main function of the thermal conductive silicone is to dissipate heat. The thermal conductive silicone is in contact with the electrical component to help the electrical component dissipate heat. In order to understand the heat dissipation process of the electrical component, multiple finite element analysis grids are divided between the combined actual model to be analyzed including the thermal conductive silicone, the electrical component and at least one contact surface. The area of ​​the grid is the maximum projection area of ​​the electrical component on the plane connected to the thermal conductive silicone.

[0060] There may be multiple contact surfaces between thermally conductive silicone and different electrical components. After dividing into multiple finite element analysis grids, the mass and heat dissipation of each finite element analysis grid can be calculated. The mass of each contact surface and the heat dissipation of the contact surface can be determined according to the number of finite element analysis grids in each contact surface, thereby determining the specific heat capacity of the contact surface.

[0061] Since the joint actual model to be analyzed is generally more complex, a simplified simulation model is established through the contact surface mass and the contact surface heat dissipation, which is beneficial to simplify the joint actual model to be analyzed, improves the accuracy of the simulation, and is beneficial to the analysis of the joint actual model to be analyzed. The contact thermal resistance between the thermal conductive silicone and the electrical components in the joint actual model to be analyzed is calibrated through the simplified simulation model.

[0062] In this embodiment, the software in the prior art can be used to input the contact thermal resistance, simulation model and heat dissipation of the contact surface, and then analyze the temperature change process of the electrical component. It can be understood that the software is a prior art and there is no need for the present invention to elaborate on it. The present invention can be used directly to obtain the temperature change process of the electrical component.

[0063] Compared with the prior art, the present embodiment provides a method for thermal analysis of electrical components, the method comprising: dividing a joint actual model to be analyzed into a plurality of finite element analysis grids; the joint actual model to be analyzed comprises thermally conductive silicone, an electrical component, and at least one contact surface between the thermally conductive silicone and the electrical component; allocating a contact surface mass and a contact surface heat dissipation for each contact surface according to the thermally conductive silicone parameter; establishing a simplified simulation model through the contact surface mass and the contact surface heat dissipation, and calibrating the contact thermal resistance between the thermally conductive silicone and the electrical component in the joint actual model to be analyzed; analyzing the temperature change of the electrical component according to the contact thermal resistance, the simulation model, and the contact surface heat dissipation. The present invention analyzes the joint actual model to be analyzed by the finite element analysis method, thereby allocating the contact surface mass and the contact surface heat dissipation of the contact surface between the electrical component and the thermally conductive silicone, and also understanding the specific heat capacity of the contact surface of the thermally conductive silicone, which is conducive to realizing the simplification of the simulation model, and then calibrating the contact thermal resistance in the joint actual model to be analyzed, and finally analyzing the temperature change process of the electrical component according to the contact thermal resistance, the simulation model, and the contact surface heat dissipation.

[0064] See also Figure 2 , Figure 2 The present invention provides Figure 1 In some embodiments of the present invention, the thermal conductive silicone parameters include the mass of the thermal conductive silicone and the heat dissipation of the thermal conductive silicone; and the contact surface mass and the contact surface heat dissipation are allocated to each contact surface according to the thermal conductive silicone parameters, including:

[0065] S201, calculating the thermal conductivity of multiple contact surfaces between the thermally conductive silicone rubber and the electrical components respectively;

[0066] S202, calculating the distribution ratio according to the thermal conductivity of all contact surfaces;

[0067] S203, determining the contact surface quality according to the distribution ratio and the quality of the thermal conductive silicone rubber;

[0068] S204, determining the heat dissipation of the contact surface according to the distribution ratio and the heat dissipation of the thermal conductive silicone.

[0069] In the above embodiment, the thermal conductivity reflects the heat transfer capability of the contact surface. By calculating the thermal conductivity of the contact surface, the heat dissipation of the contact surface can be understood. For a case with multiple surfaces, each contact surface needs to be calculated separately, and the thermal conductivity of each contact surface may be different.

[0070] Different contact surfaces have different heat conduction powers and different heat dissipation capacities, and different masses and heat dissipation amounts can be allocated. Therefore, the allocation ratio of each contact surface is determined based on the heat conduction power of the contact surface.

[0071] The mass of each contact surface and the heat dissipation of the contact surface can be determined by the distribution ratio, the mass of the thermal conductive silicone and the heat dissipation of the thermal conductive silicone. The mass of the thermal conductive silicone and the heat dissipation of the thermal conductive silicone are inherent properties of the thermal conductive silicone and can be directly obtained and used. The specific heat capacity of the contact surface can be determined by calculating the mass of the contact surface and the heat dissipation of the contact surface.

[0072] The electrical components are regarded as uniformly heated mass or volume heat sources. According to Fourier's law of heat conduction, the simulation model is simplified, and the electrical components are divided into two contact surface grids with thickness according to the thickness and area of ​​the thermal conductive silicone. It should be noted that when there is only one contact surface between the thermal conductive silicone and the electrical components, it can be directly simplified into a surface unit with thickness attributes. The surface units are respectively the mid-surfaces of the rubber block and the electrical components, and the contact information between them and the thermal conductive silicone is set.

[0073] The distribution principle is calculated through the law of thermal conductivity. The mass of the thermal conductive silicone connection components at the upper and lower ends is m, the heat dissipation is q, and the heat is dissipated simultaneously through the upper and lower surfaces of the electrical components. The average thickness of the thermal conductive silicone on the upper surface is d1, the area is s1, and the thermal conductivity coefficient is c1. The average thickness of the thermal conductive silicone on the lower surface is d2, the area is s2, and the thermal conductivity coefficient is c2.

[0074] The calculation formula of thermal conductivity rate of thermal conductive silicone when the temperature difference is 1℃:

[0075] Q = c × s / d;

[0076] Among them, Q is the thermal conductivity, c is the thermal conductivity, s is the thermal conductivity area, and d is the thickness of the thermal conductive silicone.

[0077] According to the thermal conductivity calculation formula, the thermal conductivity of the rubber block on the upper surface of the electrical component is Q1 when the temperature difference is 1°C, and the thermal conductivity of the rubber block on the lower surface is Q2. The mass distribution of the surface mesh corresponding to the electrical component on the upper surface is m_1=m×Q_1 / (Q_1+Q_2), and the mass distribution of the surface mesh corresponding to the electrical component on the lower surface is m_2=m×Q_2 / (Q_1+Q_2). The heat dissipation of the surface mesh corresponding to the electrical component on the upper surface is q_1=q×Q_1 / (Q_1+Q_2), and the heat dissipation of the surface mesh corresponding to the electrical component on the lower surface is q_2=q×Q_2 / (Q_1+Q_2). The surface mesh area of ​​the electrical component is equal to the area of ​​the rubber block. According to the mass m, area s, and average density ρ of the electrical component allocated to the surface mesh, the surface mesh thickness d_1=m1 / (s1×ρ) and d_2=m2 / (s2×ρ) are obtained. The position of the thermal conductive silicone surface grid is the middle surface of the rubber block, and the distance between the electrical component surface grid and the rubber block surface grid is half of the sum of the rubber block thickness and the electrical component surface grid thickness; the upper and lower electrical component surface grids are set to zero impedance contact.

[0078] In some embodiments of the present invention, the thermal conductive silicone parameters further include thermal conductivity and thermal conductive silicone thickness; and the thermal conductive power is calculated for multiple contact surfaces between the thermal conductive silicone and the electrical component, including:

[0079] Determine the mesh area of ​​all contact surfaces;

[0080] The thermal conductivity of multiple contact surfaces is calculated according to the thermal conductivity, the thickness of the thermal conductive silicone and the mesh area of ​​the contact surface.

[0081] In the above embodiment, the area of ​​all grid divisions is obtained by the finite element analysis method, and the thickness of the thermal conductive silicone of each grid can also be determined. The thermal conductivity of each grid is calculated first, and then the thermal conductivity of the current contact surface is determined according to the number of grids in the contact surface. Finally, the thermal conductivity of multiple contact surfaces is determined, that is, the thermal conductivity of multiple contact surfaces is calculated by the finite element analysis method.

[0082] In some embodiments of the present invention, the distribution ratio is calculated according to the thermal conductivity of all contact surfaces, including:

[0083] Calculate the total thermal conductivity of all contact surfaces;

[0084] The distribution ratio of all contact surfaces is determined according to the ratio of the heat conduction power of each contact surface to the total heat conduction power.

[0085] In the above embodiment, the calculated thermal conductivity powers of multiple contact surfaces are added together to obtain the total thermal conductivity power of all contact surfaces, wherein the proportion of the thermal conductivity power of a certain contact surface in the total thermal conductivity power is the distribution ratio of the contact surface.

[0086] The ratio of the thermal conductivity power of a single contact surface to the total thermal conductivity power can reflect the overall condition of the heat dissipation capacity of the single contact surface. Therefore, the determined distribution ratio can better distribute the mass and heat dissipation of the contact surface.

[0087] In some embodiments of the present invention, the contact surface quality is determined according to the distribution ratio and the quality of the thermally conductive silicone, including:

[0088] The mass of each contact surface is obtained according to the product of the distribution ratio of each contact surface and the mass of the thermal conductive silicone.

[0089] In some embodiments of the present invention, determining the heat dissipation of the contact surface according to the distribution ratio and the heat dissipation of the thermally conductive silicone comprises:

[0090] The heat dissipation of each contact surface is obtained according to the product of the distribution ratio of each contact surface and the heat dissipation of the thermal conductive silicone.

[0091] In the above embodiment, the product of the distribution ratio of the contact surface and the mass of the thermally conductive silicone is the mass of the contact surface, and the product of the distribution ratio of the contact surface and the heat dissipation of the thermally conductive silicone is the heat dissipation of the contact surface. This facilitates the establishment of a simulation model through simulation, simplifies the structure of the simulation model, and reduces the complexity of the simulation model.

[0092] See also Figure 3 , Figure 3 The present invention provides Figure 1 In some embodiments of the present invention, a simplified simulation model is established by using the contact surface mass and the contact surface heat dissipation, and the contact thermal resistance between the thermal conductive silica gel and the electrical components in the combined actual model to be analyzed is calibrated, including:

[0093] S301, establishing a simplified simulation model with the same mass and material as the actual joint model to be analyzed according to the mass of the contact surface and the heat dissipation of the contact surface;

[0094] S302, respectively obtaining the slope of the temperature-time curve of the actual joint model to be analyzed and the slope of the temperature-time curve of the simulation model;

[0095] S303, adjusting the contact thermal resistance of the simulation model until the slope of the temperature-time curve of the simulation model is the same as the slope of the temperature-time curve of the actual model to be analyzed, and calibrating the contact thermal resistance.

[0096] In the above embodiment, the simulation model established during the simulation needs to be completely identical in quality to the actual model to be analyzed, and the simulation is performed using the material of the actual model to be analyzed, and is simplified by the contact surface quality and the contact surface heat dissipation to establish the simulation model. It is understandable that the simulation can be implemented by existing simulation software, and the present invention does not need to elaborate on this.

[0097] It should be noted that the simplification of the simulation model is to simplify the joint actual model to be analyzed into a surface simulation model, and set the attribute parameters of the simulation model so that the attribute parameters of the simulation model are completely consistent with the attributes of the joint actual model to be analyzed.

[0098] The contact thermal impedance between solids is affected by many factors, such as the roughness of the contact surface, the contact gap, the material of the contact solid, etc., and is difficult to measure directly, while the contact thermal resistance in the simulation model can be directly modified. The slope of the temperature-time curve of the combined actual model to be analyzed can be directly measured, and the slope of the temperature-time curve of the simulation model can be directly determined through simulation. By directly modifying the contact thermal resistance of the simulation model and obtaining the corresponding slope of the temperature-time curve, when the slope of the temperature-time curve of the simulation model is measured to be the same as the slope of the temperature-time curve of the combined actual model to be analyzed, the contact thermal impedance in the combined actual model to be analyzed is calibrated.

[0099] See also Figure 4 , Figure 4 This is a simplified schematic diagram of an embodiment of a simplified transformer simulation model provided by the present invention. In a specific embodiment of the present invention, a main transformer with upper and lower contact surfaces is taken as an example for specific description.

[0100] The mass of the main transformer is m=1.2kg, and the heat dissipation is q=14W. The heat is dissipated through the upper and lower surfaces of the inverter housing. The average thickness of the thermal conductive silicone in the upper housing is d1=1.5mm, the area is s1=1632mm2, and the thermal conductivity is c1=6W / M*K. The average thickness of the thermal conductive silicone in the lower housing is d2=0.75mm, the area is s2=1040mm2, and the thermal conductivity is c2=6W / MK.

[0101] The calculation formula of thermal conductivity rate of thermal conductive silicone when the temperature difference is 1℃:

[0102] Q = c × s / d;

[0103] Among them, Q is the thermal conductivity, c is the thermal conductivity, s is the thermal conductivity area, and d is the thickness of the rubber block.

[0104] According to the thermal conductivity calculation formula, when the temperature difference is 1°C, the thermal conductivity Q1 of the upper shell rubber block is 6.528W, and the thermal conductivity Q2 of the lower shell rubber block is 8.32W.

[0105] The mass distribution of the upper shell main transformer surface grid is m_1=m×Q_1 / (Q_1+Q_2)=0.528kg, the mass distribution of the lower shell main transformer surface grid is m_2=m×Q_2 / (Q_1+Q_2)=0.672kg, the heat dissipation of the upper shell main transformer surface grid is q_1=q×Q_1 / (Q_1+Q_2)=6.16W, and the heat dissipation of the lower shell main transformer surface grid is q_2=q×Q_2 / (Q_1+Q_2)=7.84W. The surface grid area of ​​the main transformer is equal to the area of ​​the rubber block. According to the mass, area and average density of the main transformer allocated to the surface grid, the surface grid thickness d_1 and d_2 are obtained. Figure 4The simplified rubber block surface grid position is the middle surface of the rubber block, and the distance between the main transformer surface grid and the rubber block surface grid is half of the sum of the rubber block thickness and the main transformer surface grid thickness; the upper and lower shell main transformer surface grids are set to zero impedance contact.

[0106] In order to better implement the electrical component thermal analysis method in the embodiment of the present invention, based on the electrical component thermal analysis method, correspondingly, please refer to Figure 5 , Figure 5 This is a schematic diagram of the structure of an embodiment of a thermal analysis device for an electrical component provided by the present invention. The embodiment of the present invention provides a thermal analysis device 500 for an electrical component, comprising:

[0107] A division module 510 is used to divide the joint actual model to be analyzed into a plurality of finite element analysis grids; the joint actual model to be analyzed includes thermal conductive silicone, electrical components, and at least one contact surface between the thermal conductive silicone and the electrical components;

[0108] An allocation module 520 is used to allocate a contact surface mass and a contact surface heat dissipation to each contact surface according to the thermal conductive silicone parameters based on a finite element analysis method;

[0109] Modeling module 530, used to establish a simplified simulation model through contact surface mass and contact surface heat dissipation, and calibrate the contact thermal resistance between the thermal conductive silica gel and the electrical components in the joint actual model to be analyzed;

[0110] The analysis module 540 is used to analyze the temperature change of the electrical component according to the contact thermal resistance, the simulation model and the heat dissipation of the contact surface.

[0111] It should be noted here that the electrical component thermal analysis device 500 provided in the above embodiment can implement the technical solutions described in the above method embodiments. The specific implementation principles of the above modules or units can refer to the corresponding contents in the above method embodiments, which will not be repeated here.

[0112] See also Figure 6 , Figure 6 The schematic diagram of the structure of the electrical component thermal analysis device provided by the embodiment of the present invention. Based on the above-mentioned electrical component thermal analysis method, the present invention also provides an electrical component thermal analysis device 600, which can be a computing device such as a mobile terminal, a desktop computer, a notebook, a palm computer, and a server. The electrical component thermal analysis device 600 includes a processor 610, a memory 620, and a display 630. Figure 6 Only some components of the electrical component thermal analysis device are shown, but it should be understood that it is not required to implement all of the components shown, and more or fewer components may be implemented instead.

[0113] The memory 620 may be an internal storage unit of the electrical component thermal analysis device 600 in some embodiments, such as a hard disk or memory of the electrical component thermal analysis device 600. The memory 620 may also be an external storage device of the electrical component thermal analysis device 600 in other embodiments, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped on the electrical component thermal analysis device 600. Further, the memory 620 may also include both an internal storage unit and an external storage device of the electrical component thermal analysis device 600. The memory 620 is used to store application software and various types of data installed in the electrical component thermal analysis device 600, such as a program code for installing the electrical component thermal analysis device 600. The memory 620 may also be used to temporarily store data that has been output or is to be output. In one embodiment, the memory 620 stores an electrical component thermal analysis program 640, which may be executed by the processor 610, thereby realizing the electrical component thermal analysis method of each embodiment of the present application.

[0114] In some embodiments, the processor 610 may be a central processing unit (CPU), a microprocessor or other data processing chip, used to run program codes or process data stored in the memory 620, such as executing a thermal analysis method for electrical components.

[0115] In some embodiments, the display 630 can be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, an OLED (Organic Light-Emitting Diode) touch device, etc. The display 630 is used to display information on the electrical component thermal analysis device 600 and to display a visual user interface. The components 610-630 of the electrical component thermal analysis device 600 communicate with each other via a system bus.

[0116] In one embodiment, when the processor 610 executes the electrical component thermal analysis program 640 in the memory 620 , the steps in the above electrical component thermal analysis method are implemented.

[0117] This embodiment also provides a computer-readable storage medium, on which an electrical component thermal analysis program is stored. When the electrical component thermal analysis program is executed by a processor, the following steps are implemented:

[0118] Dividing the joint actual model to be analyzed into a plurality of finite element analysis grids; the joint actual model to be analyzed includes thermal conductive silicone, electrical components, and at least one contact surface between the thermal conductive silicone and the electrical components;

[0119] Based on the finite element analysis method, the contact surface mass and contact surface heat dissipation are allocated to each contact surface according to the thermal conductive silicone parameters;

[0120] A simplified simulation model is established through the contact surface mass and the heat dissipation of the contact surface, and the contact thermal resistance between the thermal conductive silicone and the electrical components in the actual joint model to be analyzed is calibrated;

[0121] Analyze the temperature changes of electrical components based on contact thermal resistance, simulation model and heat dissipation of the contact surface.

[0122] In summary, the present embodiment provides a method, device, equipment and storage medium for thermal analysis of electrical components, the method comprising: dividing a joint actual model to be analyzed into multiple finite element analysis grids; the joint actual model to be analyzed comprises thermally conductive silicone, electrical components and at least one contact surface between the thermally conductive silicone and the electrical components; assigning a contact surface mass and a contact surface heat dissipation to each contact surface according to the thermally conductive silicone parameters; establishing a simplified simulation model through the contact surface mass and the contact surface heat dissipation, and calibrating the contact thermal resistance between the thermally conductive silicone and the electrical components in the joint actual model to be analyzed; analyzing the temperature change of the electrical components according to the contact thermal resistance, the simulation model and the contact surface heat dissipation. The present invention analyzes the joint actual model to be analyzed by the finite element analysis method, thereby assigning the contact surface mass and the contact surface heat dissipation of the contact surface between the electrical components and the thermally conductive silicone, and also understanding the specific heat capacity of the contact surface of the thermally conductive silicone, which is conducive to the simplification of the simulation model, and then calibrating the contact thermal resistance in the joint actual model to be analyzed, and finally analyzing the temperature change process of the electrical components according to the contact thermal resistance, the simulation model and the contact surface heat dissipation.

[0123] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by any technician familiar with the technical field within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention.

Claims

1. A thermal analysis method for electrical components, characterized in that: include: Dividing the joint actual model to be analyzed into a plurality of finite element analysis grids; the joint actual model to be analyzed includes thermal conductive silicone, an electrical component, and at least one contact surface between the thermal conductive silicone and the electrical component; Calculating the thermal conductivity of multiple contact surfaces between the thermally conductive silica gel and the electrical component respectively; Calculate the distribution ratio based on the thermal conductivity of all contact surfaces; The mass of each contact surface is obtained according to the product of the distribution ratio of each contact surface and the mass of the electrical component; The heat dissipation of each contact surface is obtained according to the product of the distribution ratio of each contact surface and the heat dissipation of the electrical component; Establishing a simplified simulation model with the same mass and material as the actual joint model to be analyzed according to the mass of the contact surface and the heat dissipation of the contact surface; Respectively obtaining the slope of the temperature-time curve of the combined actual model to be analyzed and the slope of the temperature-time curve of the simulation model; Adjusting the contact thermal resistance of the simulation model until the slope of the temperature-time curve of the simulation model is the same as the slope of the temperature-time curve of the combined actual model to be analyzed, and calibrating the contact thermal resistance; The temperature change of the electrical component is analyzed based on the contact thermal resistance, the simulation model and the heat dissipation of the contact surface.

2. The electrical component thermal analysis method according to claim 1, characterized in that: The step of calculating the thermal conductivity of the plurality of contact surfaces between the thermally conductive silica gel and the electrical component comprises: Determine the mesh area of ​​all contact surfaces; The thermal conductivity of the plurality of contact surfaces is calculated respectively according to the thermal conductivity coefficient of the thermally conductive silicone rubber, the thickness of the thermally conductive silicone rubber and the mesh area of ​​the contact surface.

3. The electrical component thermal analysis method according to claim 1, characterized in that: The calculation of the distribution ratio according to the thermal conductivity of all contact surfaces includes: Calculate the total thermal conductivity of all contact surfaces; The distribution ratio of all contact surfaces is determined according to the ratio of the heat conduction power of each contact surface to the total heat conduction power.

4. A thermal analysis device for electrical components, characterized in that: include: A division module, used for dividing the joint actual model to be analyzed into a plurality of finite element analysis grids; the joint actual model to be analyzed includes thermal conductive silicone, an electrical component, and at least one contact surface between the thermal conductive silicone and the electrical component; A distribution module is used to calculate the thermal power of the multiple contact surfaces between the thermally conductive silicone and the electrical component respectively; calculate the distribution ratio according to the thermal power of all contact surfaces; obtain the mass of each contact surface according to the product of the distribution ratio of each contact surface and the mass of the electrical component; obtain the heat dissipation of each contact surface according to the product of the distribution ratio of each contact surface and the heat dissipation of the electrical component; A modeling module is used to establish a simplified simulation model with the same mass and material as the combined actual model to be analyzed according to the mass of the contact surface and the heat dissipation of the contact surface; respectively obtain the slope of the temperature-time curve of the combined actual model to be analyzed and the slope of the temperature-time curve of the simulation model; adjust the contact thermal resistance of the simulation model until the slope of the temperature-time curve of the simulation model is the same as the slope of the temperature-time curve of the combined actual model to be analyzed, and calibrate the contact thermal resistance; The analysis module is used to analyze the temperature change of the electrical component according to the contact thermal resistance, the simulation model and the heat dissipation of the contact surface.

5. An electrical component thermal analysis device, characterized in that: comprising a memory and a processor, wherein: The memory is used to store programs; The processor is coupled to the memory and is used to execute the program stored in the memory to implement the steps in the electrical component thermal analysis method described in any one of claims 1 to 3 above.

6. A computer-readable storage medium, characterized in that: Used to store computer-readable programs or instructions, which, when executed by a processor, can implement the steps of the electrical component thermal analysis method described in any one of claims 1 to 3 above.

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