A high-efficiency surface light source emitting device

Abstract

The application relates to the technical field of surface light source heat dissipation, and provides a surface light source light-emitting device with high heat dissipation efficiency, wherein a lamp cap assembly comprises a connecting plate clamped to a light-transmitting cover, a lamp cap cover plate fixedly connected to the other side of the connecting plate and facing away from the light-transmitting cover, and a lamp cap seat buckled to the lamp cap cover plate; an electrical cavity is formed between the lamp cap seat and the lamp cap cover plate, and a power supply assembly is installed in the electrical cavity; a light-emitting chamber is formed between the connecting plate and the light-transmitting cover, one side of the light-emitting chamber close to the electrical cavity is connected with the electrical cavity, and the other side of the light-emitting chamber far away from the electrical cavity is connected with the outside; the power supply assembly generates heat to increase the air pressure in the electrical cavity, so as to accelerate the air flow in the light-emitting chamber to flow outwards. The surface light source is arranged to make the light distribution more uniform, to accelerate the heat transfer speed when the light is emitted, to accelerate the air flow speed in the light-emitting chamber to flow outwards, and to realize the convection through the communication mode to quickly dissipate heat, so that the high efficiency and stability of the surface light source during work are ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of light source heat dissipation, in particular to a high-efficiency heat dissipation surface light source lighting device. BACKGROUND

[0002] As is known to all, LED is a light-emitting diode light source. Such light source has the advantages of small size, long service life, high efficiency, etc., and can be used continuously for 100,000 hours, so LED has been widely and rapidly applied to various light use occasions. With the development of society, the role played by LED in some high-power light sources is also becoming more and more important, which makes the heat dissipation performance of LED directly affect the service life and use characteristics of LED, so the requirements of people on the heat dissipation process of light source are also getting higher and higher.

[0003] At present, the existing LED light source is a point light source, and the light-emitting effect is granular, which is not uniform. Moreover, the heat dissipation structure of such LED light source cannot meet the use requirements of light source power components and light-emitting components, and in the case that heat is difficult to dissipate, the heat energy consumption of the light source is too high, thereby greatly reducing the working efficiency and service life of the light source. In order to ensure the service life and use characteristics of the light source, the heat dissipation requirements of the light source need to be continuously improved, and with the increase of the power of the light source, the heat generated by the light source drive is also increased. Therefore, the patent number 201510467028.0 discloses a high-efficiency heat dissipation LED lamp, which comprises a lamp holder, a lamp body, an LED lamp plate and a lampshade. The LED lamp plate is installed in the lamp body, and the lampshade is located below the LED lamp plate. The LED lamp further comprises an upper cover, a lower cover and a wire pipe. The wire pipe is cylindrical and located in the center of the lamp body. The upper cover is located above the wire pipe, and the lower cover is located below the wire pipe. The lamp body, the upper cover, the wire pipe and the lower cover enclose a sealed heat dissipation cavity. The heat dissipation cavity contains superconducting liquid. The LED lamp plate is fixed below the lower cover, and the wires of the LED lamp plate are connected with the lamp holder through the wire pipe. The heat dissipation of the LED lamp is realized by the superconducting liquid. However, the sealing of the superconducting liquid installed in the lamp body directly affects the safety of the LED lamp, so that the use range of the structure is limited, and the heat dissipation effect is not good. SUMMARY

[0004] In view of the deficiencies of the prior art, the purpose of the present application is to provide a light source which can guarantee safety and high-efficiency heat dissipation.

[0005] To solve the above problems, the present application provides the following technical solutions:

[0006] A high-efficiency heat dissipation surface light source lighting device comprises:

[0007] A light-emitting component, comprising a light-emitting part and a light-transmitting cover covering the outer peripheral side of the light-emitting part;

[0008] A power component electrically connected with the light-emitting component;

[0009] The lamp head assembly is used for loading the light emitting assembly, and comprises a connecting plate snap-connected to the light-transmitting cover, a lamp head cover plate fixedly connected to the other side of the connecting plate and facing away from the light-transmitting cover, and a lamp head seat buckled to the lamp head cover plate, wherein an electrical cavity is formed between the lamp head seat and the lamp head cover plate, and the power supply assembly is installed in the electrical cavity.

[0010] A light emitting chamber is formed between the connecting plate and the light-transmitting cover, and the light emitting chamber is connected to the electrical cavity on one side close to the electrical cavity and is connected to the outside on the other side away from the electrical cavity. The power supply assembly generates heat to increase the air pressure in the electrical cavity, so as to accelerate the air flow in the light emitting chamber to be discharged to the outside.

[0011] In an embodiment, the light emitting piece comprises a plurality of LED wafer chips and a wafer carrier plate, and the plurality of LED wafer chips are all packaged on one side of the wafer carrier plate.

[0012] In an embodiment, the top of the light emitting piece is provided with a first heat dissipation hole penetrating through the light emitting piece and the light-transmitting cover, the first heat dissipation hole is arranged in the center of the light emitting piece along a first direction, and the light emitting chamber is connected to the outside through the first heat dissipation hole.

[0013] In an embodiment, the connecting plate is provided with a second heat dissipation hole, the second heat dissipation hole is arranged opposite to the first heat dissipation hole, and the light emitting chamber is connected to the outside through the second heat dissipation hole.

[0014] The light-transmitting cover is provided with a mesh structure corresponding to the first heat dissipation hole, and the second heat dissipation hole is arranged as a mesh hole.

[0015] In an embodiment, the light emitting piece comprises a top light plate arranged along a first direction and a side light plate arranged on the circumferential side of the top light plate and perpendicular to the top light plate, and the side light plate is arranged as a circumferentially closed curved surface structure.

[0016] In an embodiment, the wafer carrier plate is made of aluminum foil material.

[0017] In an embodiment, the lamp head cover plate is provided with a communication piece on the side facing the light emitting chamber at the center, and the communication piece extends into the light emitting chamber.

[0018] In an embodiment, a heat dissipation channel is formed between the lamp head cover plate and the connecting plate, and the heat dissipation channel is connected to the second heat dissipation hole.

[0019] In an embodiment, the lamp head cover plate is provided with a buckling piece, the inner side of the lamp head seat is provided with a chamfering piece matched with the buckling piece, and the buckling piece and the chamfering piece are snap-connected to each other to snap-fix the lamp head cover plate and the lamp head seat.

[0020] In an embodiment, the lamp head assembly further comprises a lamp head, and the lamp head is provided with a third heat dissipation hole communicated with the electric cavity near one side of the electric cavity.

[0021] The present application has the advantages that the light distribution is more uniform by arranging the surface light source, and when the surface light source works to emit light, the light emitting part generates heat to increase the temperature in the light emitting chamber, at this time, the air pressure in the light emitting chamber is greater than that outside the light emitting chamber, so that the air flow in the light emitting chamber flows outwards; in this process, the power supply assembly also generates heat to increase the temperature in the electric cavity, and by arranging the electric cavity to be communicated with the light emitting chamber and the other side of the light emitting chamber far from the electric cavity to be communicated with the outside, the hot air flow in the electric cavity flows to the light emitting chamber to form convection, so that the power supply assembly is quickly cooled, and the hot air flow in the electric cavity further increases the air pressure in the light emitting chamber, so as to accelerate the speed of the air flow in the light emitting chamber flowing outwards, and ensure the high efficiency and stability of the light source when working. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a perspective view of one embodiment of the surface light source light emitting device with high efficiency heat dissipation of the present application;

[0023] Figure 2 It is a sectional view of one embodiment of the surface light source light emitting device with high efficiency heat dissipation of the present application;

[0024] Figure 3 It is an exploded view of one embodiment of the surface light source light emitting device with high efficiency heat dissipation of the present application;

[0025] Figure 4 It is Figure 3 It is a schematic view of the principle structure of one embodiment of the light emitting part in the present application;

[0026] Figure 5 It is a heat dissipation schematic view of one embodiment of the surface light source light emitting device with high efficiency heat dissipation of the present application.

[0027] Reference signs:

[0028] 100, surface light source; 110, light emitting assembly; 121, light emitting piece; 122, light-transmitting cover; 130, sealing glue; 131, LED wafer chip; 132, wafer carrier plate; 111, power supply assembly; 112, lamp head assembly; 141, connecting plate; 142, lamp head cover plate; 143, lamp head seat; 11a, electric cavity; 15a, first heat dissipation hole; 15b, second heat dissipation hole; 15c, light emitting cavity; 161, top light plate; 162, side light plate; 11b, communication piece; 11c, heat dissipation channel; 171, buckling piece; 172, chamfering piece; 144, lamp head; 15d, third heat dissipation hole; y, first direction. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0030] In addition, the terms "first", "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0031] Please refer to Figures 1-4As shown, the embodiment provides a high-efficiency heat-dissipation surface light source light emitting device 100, which comprises a light emitting assembly 110, a lamp cap assembly 112 for loading the light emitting assembly 110, and a power supply assembly 111 installed inside the lamp cap assembly 112; wherein the light emitting assembly 110 comprises a light emitting piece 121 and a light-transmitting cover 122 covering the outer peripheral side of the light emitting piece 121; the light emitting piece 121 comprises a plurality of LED wafer chips 131 and wafer carrier plates 132, and the plurality of wafer carrier plates 132 are all encapsulated on one side of the wafer carrier plate 132, and the surface light source 100 is formed through key processes such as die bonding, wire bonding, precision bending forming, and powder point, so that the light distribution is more uniform, and the temperature is quickly conducted; the power supply assembly 111 is electrically connected with the light emitting assembly 110; the lamp cap assembly 112 comprises a connecting plate 141 clamped and connected to the light-transmitting cover 122, a lamp cap cover plate 142 fixedly connected to the other side of the connecting plate 141 away from the light-transmitting cover 122, and a lamp cap seat 143 buckled to the lamp cap cover plate 142; the connecting plate 141 and the light-transmitting cover 122 jointly form a light emitting chamber 15c, the lamp cap seat 143 and the lamp cap cover plate 142 jointly form an electrical cavity 11a, and the power supply assembly 111 is installed in the electrical cavity 11a; further, the connecting plate 141 and the light-transmitting cover 122 form the light emitting chamber 15c, one side of the light emitting chamber 15c close to the electrical cavity 11a is in communication with the electrical cavity 11a, the other side of the light emitting chamber 15c away from the electrical cavity 11a is in communication with the outside, and the power supply assembly 111 generates heat to increase the air pressure in the electrical cavity 11a, so as to accelerate the airflow in the light emitting chamber 15c to be discharged outward.

[0032] Preferably, the wafer carrier plate 132 is made of aluminum foil material, which has a fast heat dissipation speed.

[0033] Optionally, the LED wafer chip 131 is integrated on the wafer carrier plate 132 through the sealing glue 130, and the epoxy resin sealing glue 130 is adopted.

[0034] According to the above scheme, it can be understood that the traditional LED wafer chip 131 is packaged on the aluminum substrate, and the aluminum substrate is installed on the heat sink, which increases the installation mode, thereby increasing the thermal resistance and slow import speed. In the embodiment, the plurality of LED wafer chips 131 are integrated and packaged on the wafer carrier plate 132, and the heat sink is not needed for heat dissipation, thereby reducing the installation process and thermal resistance. It can be understood that when the light source works and emits light, the light emitting part 121 will generate heat to increase the temperature in the light emitting chamber 15c. At this time, the air pressure in the light emitting chamber 15c is greater than that outside the light emitting chamber 15c, so that the airflow in the light emitting chamber 15c flows outwards. In this process, the power supply assembly 111 also generates heat to increase the temperature in the electrical cavity 11a. By setting the electrical cavity 11a in communication with the light emitting chamber 15c, the airflow in the electrical cavity 11a flows to the light emitting chamber 15c, and the airflow in the electrical cavity 11a further increases the air pressure in the light emitting chamber 15c, thereby accelerating the speed of the hot airflow in the light emitting chamber 15c flowing outwards, thereby improving the overall heat dissipation speed of the light source and ensuring the high efficiency and stability of the light source during work.

[0035] Specifically, the top of the light emitting part 121 is provided with a first heat dissipation hole 15a penetrating the light emitting part 121 and the light-transmitting cover 122, and the first heat dissipation hole 15a is arranged at the center of the light emitting part 121 along the first direction y. This structure is to make the airflow in the light emitting chamber 15c flow outwards through the first heat dissipation hole 15a, thereby facilitating the heat dissipation of the light emitting part 121 in the light emitting chamber 15c. Further, the connecting plate 141 is provided with a second heat dissipation hole 15b, and the second heat dissipation hole 15b is arranged opposite to the first heat dissipation hole 15a along the first direction y. The light emitting chamber 15c is connected to the outside through the second heat dissipation hole 15b on one side of the connecting plate 141, thereby forming a convection airflow channel, which helps to improve the flow speed of the airflow in the light emitting chamber 15c. In addition, in the embodiment, a mesh structure is arranged on the light-transmitting cover 122 corresponding to the first heat dissipation hole 15a, and the second heat dissipation hole 15b is arranged as a mesh hole. Optionally, in the embodiment, the first heat dissipation hole 15a is partially blocked by the mesh structure, and the second heat dissipation hole 15b is arranged as a mesh hole, thereby avoiding the falling of microparticles or impurities into the light emitting chamber 15c through the first heat dissipation hole 15a and the second heat dissipation hole 15b to affect heat dissipation. Further, the heat dissipation channel 11c is formed between the lamp cap cover plate 142 and the connecting plate 141, and the heat dissipation channel 11c is in communication with the second heat dissipation hole 15b. It can be understood that the airflow can be quickly dissipated to the outside through the heat dissipation channel 11c. The advantage of this structure is that it can avoid the heat transfer at the second heat dissipation hole 15b to the electrical cavity 11a, which causes the power supply assembly 111 to heat up, thereby improving the heat insulation effect.

[0036] Preferably, in the embodiment, the light emitting part 121 is arranged in a cylindrical structure.

[0037] Specifically, the light emitting piece 121 includes a top light plate 161 arranged along the first direction y and a side light plate 162 arranged on the side of the top light plate 161 and perpendicular to the top light plate 161; wherein the side light plate 162 is arranged as a circumferentially closed curved surface structure, and the side light plate 162 in the embodiment is arranged as a cylindrical structure, and the light emitting piece 121 emits light from both the top light plate 161 and the side light plate 162 to generate a surface light source lighting effect and improve the uniformity of the light, and by arranging the structure, the dead angle in the light emitting chamber 15c is reduced, thereby further reducing the accumulation of hot air flow, which is helpful for the circulation of the air flow.

[0038] According to the above scheme, it can be understood that, as shown in Figure 5 the side light plate 162 in the working process, the LED wafer chip 131 generates heat on the side of the light emitting chamber 15c, so that the temperature on the side of the light emitting chamber 15c is higher than the temperature in the center of the light emitting chamber 15c, and the air pressure on the side of the light emitting chamber 15c is higher than the air pressure in the center of the light emitting chamber 15c, and the hot air flow flows from the side to the center, and then accelerates to flow to the first and second heat dissipation holes 15a and 15b, thereby improving the rate of the hot air flow in the light emitting chamber 15c to flow outwards, and improving the heat dissipation effect.

[0039] In some embodiments of the present application, the normal line of the heat dissipation surface of the LED wafer chip 131 can also form an angle with the radial axis of the light emitting piece 121, and be arranged in a circumferential array along the central axis of the light emitting piece 121, so that the direction of heat dissipation of the LED wafer chip 131 is the same, and forms an angle with the diameter direction of the light emitting piece 121, thereby forming a spiral flowing hot air flow, it can be understood that the first and second heat dissipation holes 15a and 15b in the embodiment are oppositely arranged on the central axis of the light emitting chamber 15c, and the spiral hot air flow is formed between the first and second heat dissipation holes 15a and 15b, so that the hot air flow in the light emitting chamber 15c is more quickly discharged from the first and second heat dissipation holes 15a and 15b, and the heat dissipation effect is further improved.

[0040] In some embodiments of the present application, the angle A between the normal line of the heat dissipation surface of the LED wafer chip 131 and the radial axis of the light emitting piece 121 can be configured as: 15°≤A≤60°. If the angle A is too large, the heat dissipated by the LED wafer chip 131 will be dissipated to the side wall of the light emitting piece 121, thereby causing the accumulation of hot air and the heat absorption of the light emitting piece 121, making it difficult to dissipate heat. If the angle A is too small, it will be difficult to form a spiral flowing hot air flow, thereby resulting in poor heat dissipation effect. By configuring A as 15°≤A≤60°, the accumulation of hot air can be effectively reduced, the heat absorption of the light emitting piece 121 can be reduced, and an effective spiral flowing hot air flow can be formed, thereby making the heat dissipation effect meet the expected requirements.

[0041] Preferably, the center of the lamp cap cover plate 142 is provided with a communication piece 11b towards the light emitting chamber 15c, the communication piece 11b extends into the light emitting chamber 15c so as to make the light emitting chamber 15c and the electric cavity 11a communicate with each other, and the light emitting piece 121 is electrically connected with the power supply assembly 111 through the communication piece 11b; further, the lamp cap assembly 112 further comprises a lamp cap, the lamp cap is provided with a third heat dissipation hole 15d which is communicated with the electric cavity 11a on the side close to the electric cavity 11a; this structure is to make the lamp cap communicate with the electric cavity 11a through the third heat dissipation hole 15d, and make the electric cavity 11a and the light emitting chamber 15c communicate through the communication piece, so as to realize the overall communication structure inside the light source, further disperse the heat, and accelerate the heat transfer speed and the heat dissipation speed.

[0042] Preferably, the lamp cap cover plate 142 is provided with a buckling piece 171, and the inner side of the lamp cap base 143 is provided with a chamfering piece 172 matched with the buckling piece 171, the buckling piece 171 and the chamfering piece 172 are clamped with each other so as to clamp and fix the lamp cap cover plate 142 and the lamp cap base 143.

[0043] In summary, the application provides a high-efficiency heat dissipation surface light source light emitting device, the light distribution is more uniform through the setting of the surface light source, and when the surface light source works and emits light, the light emitting piece will generate heat to make the temperature in the light emitting chamber increase, at this time, the air pressure in the light emitting chamber is greater than that outside the light emitting chamber, so that the air flow in the light emitting chamber flows outwards; in this process, the power supply assembly will also generate heat to make the temperature in the electric cavity increase, and through the setting of the electric cavity which is communicated with the light emitting chamber, and the other side of the light emitting chamber which is far away from the electric cavity is communicated with the outside, the hot air flow in the electric cavity flows to the light emitting chamber to form a convection, so as to achieve the effect of quickly dissipating heat for the power supply assembly, and the hot air flow in the electric cavity further improves the air pressure in the light emitting chamber, so as to accelerate the speed of the air flow in the light emitting chamber flowing outwards, and ensure the high efficiency and stability of the light source when working.

[0044] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the application, but not to limit them; although the application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: they can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not drive the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the application.

Claims

1. A surface light source emission device with high-efficiency heat dissipation, characterized in that, The application relates to a light-emitting component, a power supply component and a lamp head component. The light-emitting component comprises a light-emitting element and a light-transmitting cover arranged on the periphery of the light-emitting element, and the light-emitting element is a surface light source. The power supply component is electrically connected with the light-emitting component. The lamp head component is used for loading the light-emitting component, and the lamp head component comprises a connecting plate clamped on the light-transmitting cover, a lamp head cover plate fixedly connected with the other side of the connecting plate and facing away from the light-transmitting cover, and a lamp head seat buckled on the lamp head cover plate. An electric cavity is formed between the lamp head seat and the lamp head cover plate, the power supply component is installed in the electric cavity, and the connecting plate and the light-transmitting cover form a light-emitting chamber. The side of the light-emitting chamber close to the electric cavity is communicated with the electric cavity, and the other side of the light-emitting chamber far away from the electric cavity is communicated with the outside. The power supply component generates heat to increase the air pressure in the electric cavity, so as to accelerate the air flow in the light-emitting chamber to be discharged outward.

2. The high heat dissipating area light source lighting device according to claim 1, wherein The light-emitting element comprises a plurality of LED wafer chips and a wafer carrier plate, and the plurality of LED wafer chips are uniformly distributed and encapsulated on one side of the wafer carrier plate.

3. The high heat dissipating area light source lighting device according to claim 2, wherein The normal line of the heat dissipation surface of the LED wafer chip and the radial axis of the light-emitting element form an angle A, 15 DEG <= A <= 60 DEG, and the LED wafer chips are arranged in a circumferential array along the central axis of the light-emitting element. The direction of heat dissipation of the LED wafer chips is the same, and forms a spiral flowing hot air flow with the diameter direction of the light-emitting element.

4. The high heat dissipating area light source lighting device according to claim 3, wherein The top of the light-emitting element is provided with a first heat dissipation hole penetrating through the light-emitting element and the light-transmitting cover.

5. A high heat dissipating area light source lamp according to claim 1, wherein: the light emitting diodes are arranged in a plurality of groups, each group of light emitting diodes is arranged in a plurality of rows, and each row of light emitting diodes is arranged in a plurality of columns. The first heat dissipation hole is arranged in the center of the light-emitting element along a first direction.

6. A high heat dissipating area light source lamp according to claim 3, wherein: the light emitting diodes are arranged in a plurality of groups, each group of light emitting diodes is arranged in a plurality of rows, and each row of light emitting diodes is arranged in a plurality of columns. The connecting plate is provided with a second heat dissipation hole.

7. A high heat dissipating area light source lamp according to claim 3, wherein: the light emitting diodes are arranged in a plurality of groups, each group of light emitting diodes is arranged in a plurality of rows, and each row of light emitting diodes is arranged in a plurality of columns. The second heat dissipation hole is arranged opposite to the first heat dissipation hole.

8. The efficient heat dissipation surface light source emission device according to claim 1, characterized in that: The light-transmitting cover is provided with a mesh structure corresponding to the first heat dissipation hole.

9. A high-heat dissipating area light source lamp according to claim 1, wherein: the phosphor layer is formed on the surface of the light emitting diode chip. The light-emitting element comprises a top light plate arranged along the first direction and a side light plate arranged on the periphery of the top light plate and perpendicular to the top light plate. The side light plate is arranged as a circumferentially closed curved surface structure. The wafer carrier plate is made of aluminum foil material. The center of the lamp head cover plate is provided with a communication member facing the light-emitting chamber. The communication member extends into the light-emitting chamber. The lamp head cover plate and the connecting plate form a heat dissipation channel. The lamp head cover plate is provided with a buckling member. The inner side of the lamp head seat is provided with a chamfer member matched with the buckling member. The buckling member and the chamfer member are clamped to fix the lamp head cover plate and the lamp head seat. The lamp head component further comprises a lamp head. The side of the lamp head close to the electric cavity is provided with a third heat dissipation hole communicated with the electric cavity.

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