Heat dissipation device and electronic device

Abstract

The application discloses a heat dissipation device and electronic equipment. The heat dissipation device comprises a first flow channel plate and a second flow channel plate. The first flow channel plate has a first plate surface, and a first flow channel wall is protruded on the first plate surface. The second flow channel plate is fixedly arranged on the first plate surface, and has a second plate surface close to the first plate surface, and a second flow channel wall is protruded on the second plate surface. The end of the second flow channel wall close to the first plate surface is abutted on the first plate surface, the end of the first flow channel wall close to the second plate surface is abutted on the second plate surface, and the first flow channel wall and the first flow channel wall form a refrigerant flow channel. At least one of the first flow channel plate and the second flow channel plate is provided with a mounting portion for mounting a power device. The application can solve the problems of complex process and high processing cost of the flow channel plate for cooling the power device in the prior art.

Description

Technical Field

[0001] This application relates to the field of cooling device technology, and more specifically, to a heat dissipation device and electronic device. Background Technology

[0002] The core components of an inverter are semiconductor power devices such as IG2T and MOSFET. These power devices generate a lot of heat when operating at high frequency and high current. If this heat cannot be dissipated in time, the chip temperature in the power device will rise too high, thereby reducing the function of the power semiconductor device or even causing it to fail completely.

[0003] In existing technologies, to dissipate heat from the power devices of an inverter, flow channel plates, i.e., cooling plates, are typically arranged on the mounting base plate of the power devices, the power module mounting plate, or the controller housing to cool the power devices. Currently, the flow channel structure of these flow channel plates is entirely machined on one surface of the module base, which places high demands on the manufacturing process. Specifically:

[0004] (1) The flow channel structure adopts machining process. When the width of the flow channel is less than 1.5mm, the machining tool must be less than φ1.5mm. Due to the small diameter and low strength of the tool, the machining speed is slow (both the feed rate and feed speed of the tool are small) and the machining cost is high.

[0005] (2) If mold forming is used, when the runner width is too small, the mold core size of the forming runner will also be very small. Since the internal pressure is very high during metal die casting, the mold core parts that are too small are difficult to meet the strength requirements. Even if they are used, the mold life will be greatly reduced.

[0006] (3) If the heat dissipation requirement is higher, a lot of flow channels need to be processed to increase the heat exchange surface between the coolant and the radiator. When the width of the flow channel is 1mm, the diameter of the milling cutter must be less than or equal to 1mm. At this time, the flow channel will be difficult to process, and even if it is processed, the cost will be very high. Summary of the Invention

[0007] The main objective of this application is to provide a heat dissipation device and electronic device to solve the problems of complex process and high processing cost of flow channel plates used for cooling power devices in the prior art.

[0008] According to one aspect of this application, a heat dissipation device is provided, comprising:

[0009] A first flow channel plate, the first flow channel plate having a first plate surface, and a first flow channel wall protruding from the first plate surface;

[0010] The second flow channel plate is fixedly disposed on the first plate surface. The second flow channel plate has a second plate surface close to the first plate surface, and a second flow channel wall protrudes from the second plate surface.

[0011] Wherein, the end of the second flow channel wall near the first plate surface abuts against the first plate surface, the end of the first flow channel wall near the second plate surface abuts against the second plate surface, and the first flow channel wall and the second flow channel wall surround to form a refrigerant flow channel, and at least one of the first flow channel plate and the second flow channel plate is provided with a mounting part for mounting power devices.

[0012] Furthermore, the first flow channel wall includes a plurality of first flow channel walls, each of which extends along a first direction, and the plurality of first flow channel walls are spaced apart along a second direction, the second direction being perpendicular to the first direction;

[0013] The second flow channel wall includes a plurality of second flow channel walls, each of which extends along the first direction, and the plurality of second flow channel walls are spaced apart along the second direction;

[0014] Along the second direction, a plurality of first flow channel walls and a plurality of second flow channel walls are arranged alternately, and the refrigerant flow channel is formed between adjacent first flow channel walls and second flow channel walls.

[0015] Furthermore, a plurality of first U-shaped grooves are provided on the side wall surface of the second flow channel wall, and the plurality of first U-shaped grooves are arranged sequentially along the first direction;

[0016] The sidewall of the second flow channel is provided with a plurality of second U-shaped grooves, which are arranged sequentially along the first direction;

[0017] The depth directions of the first U-shaped groove and the second flow channel wall are both consistent with the second direction. The first U-shaped groove is inserted into the second flow channel wall in a staggered manner so that an S-shaped refrigerant flow channel is formed between the first flow channel wall and the second flow channel wall.

[0018] Furthermore, the first flow channel wall and the second flow channel wall are arranged in the form of straight strips, arc strips, or corrugated strips.

[0019] Furthermore, the width of the refrigerant channel is 0.5 mm to 1.5 mm.

[0020] Furthermore, a first sealing layer is provided between the first flow channel wall and the second plate surface;

[0021] A second sealing layer is provided between the second flow channel wall and the first plate surface.

[0022] Furthermore, the first sealing layer and the second sealing layer include an adhesive layer or an elastic pad layer.

[0023] Furthermore, at least one of the first flow channel plate and the second flow channel plate is provided with an annular groove, the annular groove surrounding the outer periphery of the first flow channel wall and the second flow channel wall, and a sealing element is embedded in the annular groove.

[0024] Furthermore, the first flow channel plate and the second flow channel plate are connected by at least one of the following methods: screws, bolts, welding, and snap-fit ​​connection.

[0025] On the other hand, this application also provides an electronic device that includes the above-described heat dissipation device.

[0026] In this application, during the actual fabrication of the heat dissipation device, a first flow channel wall and a second flow channel wall can be formed separately on the first flow channel plate and the second flow channel plate. Then, the fabricated first and second flow channel plates are assembled together to form a refrigerant flow channel. Compared to the structure mentioned in the prior art where the flow channel groove is fabricated on a single flow channel plate, the heat dissipation device of this application only requires the formation of a first flow channel wall and a second flow channel wall separately on the first and second flow channel plates. During this process, larger cutting tools can be used to fabricate the first and second flow channel walls, improving the fabrication efficiency and reducing the fabrication cost of the heat dissipation device. Attached Figure Description

[0027] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0028] Figure 1 This is a cross-sectional view of a heat dissipation device disclosed in an embodiment of this application;

[0029] Figure 2 This is a front view of the first and second flow channel plates of a heat dissipation device disclosed in an embodiment of this application when they are disassembled.

[0030] Figure 3 This is a front view of the first and second flow channel plates of another heat dissipation device disclosed in the embodiments of this application when they are disassembled.

[0031] Figure 4 This is a cross-sectional view of another heat dissipation device disclosed in an embodiment of this application;

[0032] Figure 5 This is a cross-sectional view of the third heat dissipation device disclosed in the embodiments of this application;

[0033] Figure 6This is a front view of the fourth heat dissipation device (with the second flow channel plate removed) disclosed in the embodiments of this application;

[0034] Figure 7 for Figure 6 A magnified view of region M in the image.

[0035] The above figures include the following reference numerals:

[0036] 10. First flow channel plate; 11. First plate surface; 12. First flow channel wall; 121. First U-shaped groove; 20. Second flow channel plate; 21. Second plate surface; 22. Second flow channel wall; 221. Second U-shaped groove; 40. Power device; 50. Refrigerant flow channel; 60. Annular groove; 70. Seal. Detailed Implementation

[0037] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0038] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0039] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0040] To address the technical problems of complex processing technology and high processing cost of flow channel plates in existing technologies, this application provides a heat dissipation device with simple processing technology, low manufacturing cost, and is more suitable for mass production and use.

[0041] See Figures 1 to 6As shown, the heat dissipation device in this embodiment includes a first flow channel plate 10 and a second flow channel plate 20.

[0042] The first flow channel plate 10 has a first plate surface 11, on which a first flow channel wall 12 protrudes. The second flow channel plate 20 is fixedly disposed on the first plate surface 11. The second flow channel plate 20 has a second plate surface 21 near the first plate surface 11, on which a second flow channel wall 22 protrudes. One end of the second flow channel wall 22 near the first plate surface 11 abuts against the first plate surface 11, and one end of the first flow channel wall 12 near the second plate surface 21 abuts against the second plate surface 21. The first flow channel wall 12 and the second flow channel plate 20 together form a refrigerant flow channel 50. At least one of the first flow channel plate 10 and the second flow channel plate 20 is provided with a mounting portion (not shown in the figure) for mounting a power device 40.

[0043] In this application, the heat dissipation device includes a first flow channel plate 10 and a second flow channel plate 20, which are fixed together. After assembly, the first flow channel wall 12 on the first plate surface 11 of the first flow channel plate 10 abuts against the second plate surface 21 of the second flow channel plate 20, and the second flow channel plate 20 on the second plate surface 21 of the second flow channel plate 20 abuts against the first plate surface 11 of the first flow channel plate 10. At this time, a refrigerant flow channel 50 can be formed between the first flow channel wall 12 and the second flow channel wall 22. In actual use of this heat dissipation device, the power device 40 is mounted on the mounting part on the first flow channel plate 10 or the second flow channel plate 20. When a cooling medium, such as water, is introduced into the refrigerant flow channel 50, the power device 40 can be effectively cooled.

[0044] In the actual processing of the heat dissipation device in this embodiment, the first flow channel wall 12 and the second flow channel wall 22 can be formed on the first flow channel plate 10 and the second flow channel plate 20 respectively. Then, the processed first flow channel plate 10 and the second flow channel plate 20 can be assembled together to form the refrigerant flow channel 50. Compared with the structure mentioned in the background art that processes high-density flow channel grooves on a single flow channel plate, the heat dissipation device of this application only needs to process the first flow channel wall 12 and the second flow channel wall 22 on the first flow channel plate 10 and the second flow channel plate 20 respectively. In this process, larger-sized cutting tools can be used to process the first flow channel wall 12 and the second flow channel wall 22, which can improve the processing efficiency of the heat dissipation device in this embodiment and reduce the processing cost of the heat dissipation device.

[0045] See Figure 2 and Figure 3 As shown, Figure 2 and Figure 3 In the diagram, (1) is the first flow channel plate 10, and (2) is the second flow channel plate 20. The first flow channel wall 12 includes multiple components, each of which is along a first direction (e.g., ...). Figure 2(as shown in the X direction) extends, and multiple first flow channel walls 12 extend along the second direction (as shown in the X direction). Figure 2 The first flow channel walls 12 and 22 are spaced apart (as shown in the Y direction), and the second direction is perpendicular to the first direction. Similarly, the second flow channel walls 22 include multiple second flow channel walls 22, each extending along the first direction, and the multiple second flow channel walls 22 are spaced apart along the second direction. Along the second direction, the multiple first flow channel walls 12 and multiple second flow channel walls 22 are arranged alternately, and adjacent first flow channel walls 12 and second flow channel walls 22 enclose and form the refrigerant flow channel 50 described above.

[0046] In this application, by setting multiple first flow channel walls 12 and second flow channel walls 22, and arranging the first flow channel walls 12 and second flow channel walls 22 alternately, that is, by setting one second flow channel wall 22 between two adjacent first flow channel walls 12 and one first flow channel wall 12 between two adjacent second flow channel walls 22, multiple refrigerant flow channels 50 can be formed in the second direction, which facilitates the effective cooling of the power device 40 installed on the heat dissipation device.

[0047] Combination Figures 1 to 6 As shown, in some embodiments of this application, a plurality of first U-shaped grooves 121 are provided on the sidewall surface of the second flow channel wall 22, and the plurality of first U-shaped grooves 121 are arranged sequentially along the first direction; correspondingly, a plurality of second U-shaped grooves 221 are provided on the sidewall surface of the second flow channel wall 22, and the plurality of second U-shaped grooves 221 are arranged sequentially along the first direction. The depth directions of the first U-shaped grooves 121 and the second flow channel wall 22 are both consistent with the second direction. The first U-shaped grooves 121 are staggered and inserted into the second flow channel wall 22 so that an S-shaped refrigerant flow channel 50 is formed between the first flow channel wall 12 and the second flow channel wall 22. It can be understood that the staggered insertion of the first U-shaped grooves 121 into the second flow channel wall 22 means that the two ends of the first U-shaped grooves 121 are respectively inserted into two adjacent second U-shaped grooves 221. For details, please refer to [link to relevant documentation]. Figure 1 As shown. Since the first U-shaped groove 121 in this embodiment is inserted into the second flow channel wall 22 in a staggered manner, the first flow channel wall 12 and the second flow channel wall 22 can form an S-shaped refrigerant flow channel 50. In this way, the length of the refrigerant flow channel 50 can be extended, which facilitates the improvement of the heat dissipation efficiency of the heat dissipation device in this embodiment.

[0048] Optionally, in this embodiment, the width A of the first U-shaped groove 121 and the second U-shaped groove 221 is 1.5mm to 2.5mm, for example, 1.5mm, 1.7mm, 1.9mm, 2.0mm, 2.1mm, 2.3mm, or 2.5mm.

[0049] In other embodiments not shown in this application, the first flow channel wall 12 and the second flow channel wall 22 may also be arranged in the form of straight strips, arc strips, or corrugated strips. When the first flow channel wall 12 and the second flow channel wall 22 are arranged in the form of straight strips, the refrigerant flow channel 50 is a straight flow channel; when the first flow channel wall 12 and the second flow channel wall 22 are arranged in the form of arc strips, the refrigerant flow channel is an arc strip; when the first flow channel wall 12 and the second flow channel wall 22 are arranged in the form of corrugated strips, the refrigerant flow channel 50 is a corrugated strip. Of course, the first flow channel wall 12 and the second flow channel wall 22 in this application may also be other irregular strip structures. Any other modifications under the concept of this application are within the protection scope of this application.

[0050] Optionally, the width D of the refrigerant channel 50 in this embodiment is 0.5mm to 1.5mm, for example, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm or 1.5mm.

[0051] Furthermore, in this embodiment, a first sealing layer (not shown in the figure) is provided between the first flow channel wall 12 and the second plate surface 21; a second sealing layer (not shown in the figure) is provided between the second flow channel wall 22 and the first plate surface 11. Through the function of the first sealing layer and the second sealing layer, the gaps between the first flow channel wall 12 and the second plate surface 21, as well as the gaps between the second flow channel wall 22 and the first plate surface 11, can be sealed to maintain the sealing performance of the refrigerant flow channel 50.

[0052] For example, the first sealing layer and the second sealing layer include an adhesive layer or an elastic pad layer. In this embodiment, the first sealing layer and the second sealing layer are preferably set as adhesive layers. In this way, not only can the gap between the first flow channel wall 12 and the second plate surface 21 and the gap between the second flow channel wall 22 and the first plate surface 11 be sealed, but it can also play a pre-positioning role in the fixing process of the first flow channel plate 10 and the second flow channel plate 20.

[0053] Furthermore, at least one of the first flow channel plate 10 and the second flow channel plate 20 is provided with an annular groove 60, which surrounds the outer periphery of the first flow channel wall 12 and the second flow channel wall 22. A sealing element 70 is embedded in the annular groove 60. The annular groove 60 facilitates the limiting of the sealing element 70 and the sealing element 70 facilitates the sealing of the gap between the first flow channel plate 10 and the second flow channel plate 20. Optionally, the sealing element 70 in this embodiment can be a sealing ring, a sealing gasket, or other structures. Any other sealing structure that can be installed in the annular groove 60 to perform a sealing function is within the scope of protection of this application.

[0054] Optionally, the first flow channel plate 10 and the second flow channel plate 20 are connected by at least one of the following methods: screws, bolts, welding, and snap-fit ​​connection.

[0055] As can be seen from the above embodiments, the heat dissipation device of this application includes a first flow channel plate 10, a second flow channel plate 20, a sealing element 70, and several fixing screws. In actual use, the power device 40 is installed on the first flow channel plate 10; the sealing element 70 is installed in the annular groove 60 of the second flow channel plate 20. Then, the first flow channel plate 10 with the power device 40 installed is locked onto the second flow channel plate 20 with screws. The second flow channel wall 22 of the second flow channel plate 20 and the first flow channel wall 12 on the first flow channel plate 10 form a closed refrigerant flow channel 50, and form a closed-loop cooling flow channel system with the external cooling source. This split-type flow channel heat dissipation structure can be used for heat dissipation of various heat-generating components, such as the heat dissipation of power devices in various electrical appliances, controllers, and inverters.

[0056] The heat dissipation device in this embodiment has advantages over the structure where the heat dissipation channel is located on a single flow channel plate: For example, a single refrigerant flow channel 50 with a width A of 1.5 mm is required; since the refrigerant flow channels 50 are staggered on the second flow channel plate 20 and the first flow channel plate 10, assuming that the width D1 of the first flow channel wall 12 and the second flow channel wall 22 is 1 mm, then the width B1 between two adjacent first flow channel walls 12 or the width B2 of the second flow channel wall 22 on the first flow channel plate 10 or the second flow channel plate 20 satisfies B1=B2=Ax2+1=4 mm. When using machining technology, a φ4.0 mm milling cutter can be used to process the flow channels on the first flow channel plate 10 or the second flow channel plate 20. If a single-plate flow channel is used, it can only be processed with a φ1.5 mm milling cutter. Obviously, the processing cost of the structure of the present invention is much lower than the processing cost of the existing single-plate flow channel. If mold forming is used, the mold core size for forming the heat dissipation flow channel of the present invention is about 4mm, which can meet the strength requirements of the die casting mold; while the mold core size for forming the single-plate flow channel is about 1.5mm, which will be difficult to meet the strength requirements of the die casting mold.

[0057] As mentioned above, compared to relatively dense heat dissipation channel grooves (with constant channel wall thickness), assuming the minimum dimension of the channel groove is 1.0 mm, for a single-plate channel, the diameter of the machining tool is ≤1.0 mm, resulting in slower machining speed and higher machining costs. The core dimension corresponding to the forming channel groove is approximately 1.0 mm, leading to weaker core strength and shorter mold life. In the split-type heat dissipation device of this application, the minimum dimension between adjacent first channel walls 12 and second channel walls 22 on the first channel plate 10 and second channel plate 20 is 3 mm, which can be machined with a φ3.0 mm tool, significantly increasing machining speed and reducing machining costs. The core dimension corresponding to the forming of the first channel wall 12 and second channel wall 22 is approximately 3.0 mm, meeting the core strength requirements, and the mold life is unaffected.

[0058] If a denser heat dissipation channel is required (with the channel wall thickness remaining constant), such as a minimum channel size of 0.5mm, corresponding to a single-plate channel, the diameter of the machining tool must be ≤0.5mm. In this case, conventional machining processes are insufficient. If a mold-forming process is used, the core size for forming the channel is approximately 0.5mm, making it extremely difficult to guarantee core strength, and the mold may be unmanufacturable. In this application, the minimum dimension between adjacent first channel walls 12 and second channel walls 22 on the first channel plate 10 and second channel plate 20 is 2mm. This can be machined using a φ2.0mm tool. Although the machining speed is relatively slow, it is still possible, and the machining cost is not too high. If a mold-forming process is used, the core size for forming the first channel wall 12 and second channel wall 22 is approximately 2.0mm, and the core strength is generally sufficient.

[0059] For heat dissipation devices that are difficult to manufacture using mold forming processes and can only be produced by machining processes (such as copper heat sinks), the cost of producing such high-density heat dissipation channels is very high due to limitations in the technical level of machining processes. Using the heat dissipation device of this invention to manufacture such high-density heat dissipation channels significantly reduces manufacturing costs under the same technological conditions; at the same time, it can also produce heat dissipation devices with higher heat dissipation channel densities that were previously impossible to manufacture (under the same technological conditions).

[0060] In summary, the heat dissipation device of the present invention has the following advantages:

[0061] (1) The heat dissipation device of the present invention has a simple manufacturing process and low manufacturing cost;

[0062] (2) The heat dissipation device of the present invention can produce a high density of refrigerant channels (relative to the traditional heat dissipation channel structure) under the same process level conditions. The heat dissipation density of the channels is large, which can reduce the mass and volume of the heat dissipation device.

[0063] (3) For heat dissipation devices that are difficult to manufacture using mold forming processes and can only be manufactured using machining processes (such as copper heat sinks), the cost of manufacturing such high-density heat dissipation channels is very high due to the limitations of machining technology. The heat dissipation device with the split combined flow channel of the present invention will significantly reduce manufacturing costs; at the same time, it can also manufacture heat dissipation devices with higher heat dissipation channel density that were originally impossible to manufacture (compared to the same level of technology conditions of setting the refrigerant flow channel on the block flow channel plate).

[0064] On the other hand, this application also provides an electronic device that includes the aforementioned heat dissipation device. The electronic device described in this embodiment may be, for example, an appliance, a controller, an inverter, or other electronic equipment. Since the electronic device in this embodiment includes the heat dissipation device described in the above embodiments, it possesses all the technical effects of the heat dissipation device described in the above embodiments. Because the technical effects of the heat dissipation device have already been described in detail above, they will not be repeated here.

[0065] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0066] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this application.

[0067] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heat dissipation device, characterized in that, include: A first flow channel plate (10) has a first plate surface (11) and a first flow channel wall (12) protruding from the first plate surface (11). The second flow channel plate (20) is fixedly disposed on the first plate surface (11). The second flow channel plate (20) has a second plate surface (21) close to the first plate surface (11), and a second flow channel wall (22) is protruding on the second plate surface (21). Wherein, the end of the second flow channel wall (22) near the first plate surface (11) abuts against the first plate surface (11), the end of the first flow channel wall (12) near the second plate surface (21) abuts against the second plate surface (21), and the first flow channel wall (12) and the second flow channel wall (22) surround to form a refrigerant flow channel (50), and at least one of the first flow channel plate (10) and the second flow channel plate (20) is provided with a mounting part for mounting power devices (40); The first flow channel wall (12) includes a plurality of first flow channel walls (12), each of which extends along a first direction, and the plurality of first flow channel walls (12) are spaced apart along a second direction, the second direction being perpendicular to the first direction; The second flow channel wall (22) includes a plurality of second flow channel walls (22), each of which extends along the first direction, and the plurality of second flow channel walls (22) are spaced apart along the second direction; Along the second direction, a plurality of first flow channel walls (12) and a plurality of second flow channel walls (22) are arranged alternately, and the refrigerant flow channel (50) is formed between adjacent first flow channel walls (12) and second flow channel walls (22). The side wall of the first flow channel wall (12) is provided with a plurality of first U-shaped grooves (121), and the plurality of first U-shaped grooves (121) are arranged sequentially along the first direction; The side wall of the second flow channel wall (22) is provided with a plurality of second U-shaped grooves (221), and the plurality of second U-shaped grooves (221) are arranged sequentially along the first direction; The depth direction of the first U-shaped groove (121) and the second U-shaped groove (221) are both consistent with the second direction. The first U-shaped groove (121) is inserted into the second flow channel wall (22) in a staggered manner so that the first flow channel wall (12) and the second flow channel wall (22) form an S-shaped refrigerant flow channel (50). The two ends of the first U-shaped groove (121) are respectively inserted into two adjacent second U-shaped grooves (221).

2. The heat dissipation device according to claim 1, characterized in that, The width of the refrigerant channel (50) is 0.5 mm to 1.5 mm.

3. The heat dissipation device according to claim 1, characterized in that, A first sealing layer is provided between the first flow channel wall (12) and the second plate surface (21); A second sealing layer is provided between the second flow channel wall (22) and the first plate surface (11).

4. The heat dissipation device according to claim 3, characterized in that, The first sealing layer and the second sealing layer include an adhesive layer or an elastic pad layer.

5. The heat dissipation device according to any one of claims 1 to 4, characterized in that, At least one of the first flow channel plate (10) and the second flow channel plate (20) is provided with an annular groove (60), the annular groove (60) surrounds the outer periphery of the first flow channel wall (12) and the second flow channel wall (22), and a sealing element (70) is embedded in the annular groove (60).

6. The heat dissipation device according to any one of claims 1 to 4, characterized in that, The first flow channel plate (10) and the second flow channel plate (20) are connected by at least one of the following methods: screws, bolts, welding, and snap-fit ​​connection.

7. An electronic device, characterized in that, The electronic device includes the heat dissipation device according to any one of claims 1 to 6.

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