Solder wire and method for producing the same
By combining tin, silver, copper, composite rosin, activator and solvent in a specific ratio, disproportionated rosin is modified and defoamer is added, which solves the problem of high splatter rate of solder wire flux, achieves low splatter rate of flux during soldering, and improves soldering safety and appearance quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HONGQIAO METAL PROD (KUNSHAN CO LTD
- Filing Date
- 2023-10-23
- Publication Date
- 2026-06-26
AI Technical Summary
Existing solder wires have a high rate of flux spatter during soldering, which affects the appearance of the solder and operator safety.
By using a combination of tin, silver, copper, composite rosin, activator and solvent in a specific ratio, and by modifying disproportionated rosin and adding defoamer, the spatter rate of flux during soldering is reduced.
It effectively reduces the spatter rate of flux during soldering, improving soldering safety and appearance quality.
Abstract
Description
Technical Field
[0001] This application relates to the technical field of solder wire, and in particular to a solder wire and a method for preparing the same. Background Technology
[0002] Solder wire is primarily used as a filler metal or a conductive metal wire in soldering. Solder wire can be categorized into rosin-based, no-clean, nickel-plated, solderable, and solid core types. The raw materials for solder wire are generally tin, silver, copper, and other additives. The manufacturing process typically involves melting and mixing the metal raw materials, then extruding them using an extruder. Other additives may be added during extrusion. The extruded solder bar is then drawn to obtain solder wire. Commonly used solder wires often exhibit a high rate of flux spatter during soldering, which can affect the appearance of the soldered object and the safety of the soldering operator. Summary of the Invention
[0003] In order to reduce the splashing rate of flux during soldering, this application provides a solder wire.
[0004] Firstly, the solder wire provided in this application adopts the following technical solution:
[0005] A solder wire, wherein the raw materials of the solder wire comprise the following components in parts by weight: 80-83 parts tin, 2.7-3.2 parts silver, 0.3-0.7 parts copper, 2-4 parts composite rosin, 2-3 parts activator, and 5-7 parts solvent; wherein the raw materials of the composite rosin include: water-white rosin, disproportionated rosin, catalyst, polyol, and defoamer.
[0006] By adopting the above technical solution, under the action of a catalyst, polyols are used to modify disproportionated rosin, thereby improving the thermal stability of disproportionated rosin. Furthermore, by combining water-white rosin and disproportionated rosin, the spatter rate of solder wire during soldering can be reduced. In addition, defoamers have a certain inhibitory effect on the spatter of solder wire, thereby further reducing the spatter rate of solder wire during soldering.
[0007] In one specific implementation, the preparation method of the composite rosin includes the following steps: grinding disproportionated rosin, heating it under nitrogen protection to soften the disproportionated rosin, starting stirring, adding a catalyst and polyol when the disproportionated rosin reaches a molten state, continuing to heat and stir, stopping the reaction when the acid value of the mixture remains unchanged, cooling to 100-150°C, adding water-white rosin and defoamer, stirring evenly, cooling, and obtaining the composite rosin.
[0008] By adopting the above technical solution, disproportionated rosin is first ground and heated to melt. Then, a catalyst and polyol are added to modify the disproportionated rosin to obtain modified disproportionated rosin. Finally, water-white rosin and defoamer are added to compound the rosin to obtain composite rosin.
[0009] In one specific implementation, the weight ratio of the disproportionated rosin to the water-white rosin is 1:(3-4).
[0010] By adopting the above technical solution, this application further defines the ratio of disproportionated rosin to water-white rosin, thereby improving the performance of the prepared composite rosin.
[0011] In one specific implementation, the catalyst comprises zinc oxide.
[0012] In one specific implementation, the polyol comprises a mixture of ethylene glycol and pentaerythritol.
[0013] By adopting the above technical solution, the modification effect of disproportionated rosin can be improved by using a composite polyol composed of ethylene glycol and pentaerythritol.
[0014] In one specific implementation, the activator comprises a mixture of diethylene glycol, octanoic acid, and adipic acid, wherein the weight ratio of the diethylene glycol, octanoic acid, and adipic acid is 1:(4-5):(3-4).
[0015] By adopting the above technical solution, a composite activator composed of diethylene glycol, octanoic acid, and adipic acid is used, and the ratio of diethylene glycol, octanoic acid, and adipic acid is further improved, thereby improving the performance of the solder wire.
[0016] In one specific embodiment, the solvent comprises a mixture of ethylene glycol and ethylene glycol phenyl ether.
[0017] Secondly, this application provides a method for preparing solder wire, which adopts the following technical solution:
[0018] A method for preparing solder wire, comprising the following steps:
[0019] The compound rosin, activator, and solvent are stirred and mixed evenly to obtain a mixture;
[0020] Tin, silver and copper are melted and mixed, poured into a mold, and cooled to obtain a rod.
[0021] The mixture and rod are placed in an extruder, poured, extruded, and drawn to obtain solder wire.
[0022] By adopting the above technical solution and using the above method, solder wire with a low flux splash rate can be obtained.
[0023] In summary, this application includes at least one of the following beneficial technical effects:
[0024] 1. In this application, under the action of a catalyst, polyols are used to modify disproportionated rosin to improve its thermal stability. Furthermore, the combination of water-white rosin and disproportionated rosin can reduce the spatter rate of solder wire during soldering. In addition, defoamer has a certain inhibitory effect on the spatter of solder wire, thereby further reducing the spatter rate of solder wire during soldering.
[0025] 2. In this application, disproportionated rosin is first ground and heated to melt, then a catalyst and polyol are added to modify the disproportionated rosin to obtain modified disproportionated rosin. Finally, water-white rosin and defoamer are added to compound the rosin to obtain compound rosin.
[0026] 3. The method in this application first involves stirring and mixing the composite rosin, activator, and solvent evenly to obtain a mixture; then, melting and mixing tin, silver, and copper, pouring the mixture into a mold, and cooling it to obtain a rod; finally, placing the mixture and the rod into an extruder for injection, extrusion, and drawing to obtain a solder wire with a low additive splash rate. Detailed Implementation
[0027] The present application will be further described in detail below with reference to the embodiments.
[0028] All raw materials used in the examples were commercially available. Water-white rosin was provided by Nantong Runfeng Petrochemical Co., Ltd.; disproportionated rosin CAS No.: 1446-61-3; and defoamer was provided by Shanghai Huiyan New Materials Co., Ltd., product number HY-300.
[0029] Preparation Example
[0030] Preparation Example 1
[0031] Preparation Example 1 provides a method for preparing a compound rosin, comprising the following steps:
[0032] Disproportionated rosin was ground and heated to 75°C under nitrogen protection to soften it. Stirring was then initiated, and heating continued. When the disproportionated rosin reached a molten state, a catalyst and polyol were added. Heating and stirring continued until the acid value of the mixture remained constant. The reaction was then stopped, and the mixture was cooled to 125°C. Water-white rosin and a defoamer were then added, stirred until homogeneous, and cooled to obtain a composite rosin. The weight ratio of disproportionated rosin to water-white rosin was 1:2.5; the weight ratio of disproportionated rosin, catalyst, polyol, and defoamer was 1:0.0125:1.5:0.05; the catalyst was zinc oxide; and the polyol was a mixture of ethylene glycol and pentaerythritol in a weight ratio of 1:2.
[0033] Preparation Example 2
[0034] The difference between Preparation Example 2 and Preparation Example 1 is that the weight ratio of disproportionated rosin to water-white rosin is 1:3; the remaining steps are the same as in Preparation Example 1.
[0035] Preparation Example 3
[0036] The difference between Preparation Example 3 and Preparation Example 1 is that the weight ratio of disproportionated rosin to water-white rosin is 1:3.5; the remaining steps are the same as those in Preparation Example 1.
[0037] Preparation Example 4
[0038] The difference between Preparation Example 4 and Preparation Example 1 is that the weight ratio of disproportionated rosin to water-white rosin is 1:4; the remaining steps are the same as in Preparation Example 1.
[0039] Preparation Example 5
[0040] The difference between Preparation Example 5 and Preparation Example 1 is that the weight ratio of disproportionated rosin to water-white rosin is 1:4.5; the remaining steps are the same as those in Preparation Example 1.
[0041] Preparation Example 6
[0042] The difference between Preparation Example 6 and Preparation Example 3 is that the polyol is ethylene glycol; the remaining steps are the same as those in Preparation Example 3.
[0043] Preparation Example 7
[0044] The difference between Preparation Example 7 and Preparation Example 3 is that the polyol is pentaerythritol; the remaining steps are the same as in Preparation Example 3.
[0045] Preparation Example 8
[0046] Preparation Example 8 provides a method for preparing a compound rosin, comprising the following steps:
[0047] Disproportionated rosin and aqueous white rosin are stirred and mixed evenly to obtain composite rosin; wherein the weight ratio of disproportionated rosin to aqueous white rosin is 1:2.5.
[0048] Preparation Example 9
[0049] The difference between Preparation Example 9 and Preparation Example 1 is that the disproportionated rosin was ground, heated to 75°C under nitrogen protection to soften the disproportionated rosin, stirred, and heated continuously. When the disproportionated rosin reached a molten state, a catalyst and a polyol were added, and heating and stirring continued. When the acid value of the mixture remained constant, the reaction was stopped, and the mixture was cooled. When the mixture was cooled to 125°C, water-white rosin was added, stirred evenly, and cooled to obtain composite rosin. The remaining steps were the same as in Preparation Example 1.
[0050] Example
[0051] Example 1
[0052] Example 1 provides a method for preparing solder wire, comprising the following steps:
[0053] 2 kg of the composite rosin from Preparation Example 1, 2 kg of activator, and 5 kg of solvent were stirred and mixed evenly to obtain a mixture; wherein the activator was a mixture of diethylene glycol, octanoic acid, and adipic acid, and the weight ratio of diethylene glycol, octanoic acid, and adipic acid was 1:3.5:2.5; the solvent was a mixture of ethylene glycol and ethylene glycol phenyl ether, and the weight ratio of ethylene glycol and ethylene glycol phenyl ether was 1:1;
[0054] 80 kg of tin, 2.7 kg of silver and 0.3 kg of copper powder are added to a furnace and melted at 300°C. The molten mixture is poured into a mold and cooled to form a rod.
[0055] The rod is installed into the extruder, and the mixture is added into the extruder. The mixture is then poured, extruded, and drawn to obtain solder wire.
[0056] As shown in Table 1, the main difference between Examples 1-7 lies in the selection of different compound rosin.
[0057] Table 1. Selection of compound rosin in Examples 1-7
[0058] sample Selection of compound rosin Example 1 Preparation Example 1 Example 2 Preparation Example 2 Example 3 Preparation Example 3 Example 4 Preparation Example 4 Example 5 Preparation Example 5 Example 6 Preparation Example 6 Example 7 Preparation Example 7
[0059] Example 8
[0060] The difference between Example 8 and Example 3 is that 3 kg of the composite rosin, 2.5 kg of activator, and 6 kg of solvent from Example 3 were stirred and mixed evenly to obtain a mixture;
[0061] Add 81.5 kg of tin, 3.0 kg of silver and 0.5 kg of copper powder to a furnace and melt them at 300°C. Pour the molten mixture into a mold and cool it to form a rod. The remaining steps are the same as in Example 3.
[0062] Example 9
[0063] The difference between Example 9 and Example 3 is that 4 kg of the composite rosin, 3 kg of activator, and 7 kg of solvent from Example 3 were stirred and mixed evenly to obtain a mixture;
[0064] 83 kg of tin, 3.2 kg of silver and 0.7 kg of copper powder were added to a furnace and melted at 300°C. The molten mixture was poured into a mold and cooled to form a rod. The remaining steps were the same as in Example 3.
[0065] Example 10
[0066] The difference between Example 10 and Example 8 is that the activator is diethylene glycol; the remaining steps are the same as in Example 8.
[0067] Example 11
[0068] The difference between Example 11 and Example 8 is that the activator is octanediic acid; the remaining steps are the same as in Example 8.
[0069] Example 12
[0070] The difference between Example 12 and Example 8 is that the activator is adipic acid; the remaining steps are the same as in Example 8.
[0071] Example 13
[0072] The difference between Example 13 and Example 8 is that the weight ratio of diethylene glycol, octanoic acid, and adipic acid is 1:4:3; the remaining steps are the same as in Example 8.
[0073] Example 14
[0074] The difference between Example 14 and Example 8 is that the weight ratio of diethylene glycol, octanoic acid, and adipic acid is 1:4.5:3.5; the remaining steps are the same as in Example 8.
[0075] Example 15
[0076] The difference between Example 15 and Example 8 is that the weight ratio of diethylene glycol, octanoic acid, and adipic acid is 1:5:4; the remaining steps are the same as in Example 8.
[0077] Example 16
[0078] The difference between Example 16 and Example 8 is that the weight ratio of diethylene glycol, octanoic acid, and adipic acid is 1:5.5:4.5; the remaining steps are the same as in Example 8.
[0079] Comparative Example
[0080] Comparative Example 1
[0081] The difference between Comparative Example 1 and Example 1 is that the composite rosin used in Preparation Example 8 is selected; the remaining steps are the same as in Example 1.
[0082] Comparative Example 2
[0083] The difference between Comparative Example 2 and Example 1 is that the composite rosin used in Preparation Example 9 is selected; the remaining steps are the same as in Example 1.
[0084] Performance testing splash rate: The splash rate F1 is tested according to the method in the International Electron Industries Connection Association, F1=(X2-X1) / 〔(W1-W2)*F〕, where X1 is the weight of aluminum foil, X2 is the weight of aluminum foil plus splash, W1 is the weight of solder wire before soldering, W2 is the weight of solder wire after soldering, and F is the weight percentage of flux in solder wire.
[0085] Table 2 Performance test results of solder wire
[0086] sample Splash rate (%) Example 1 0.41 Example 2 0.32 Example 3 0.30 Example 4 0.31 Example 5 0.39 Example 6 0.38 Example 7 0.36 Example 8 0.30 Example 9 0.32 Example 10 0.35 Example 11 0.38 Example 12 0.36 Example 13 0.25 Example 14 0.25 Example 15 0.26 Example 16 0.31 Comparative Example 1 0.67 Comparative Example 2 0.51
[0087] Combining Example 1 and Comparative Examples 1-2, the solder wire in Example 1 exhibited a lower spatter rate of additives during soldering. This is evident in the presence of a composite rosin consisting of water-white rosin, disproportionated rosin, and defoamer. Under the action of a catalyst, the disproportionated rosin is modified using polyols, improving its thermal stability. Furthermore, the combination of water-white rosin and disproportionated rosin, along with the defoamer's inhibitory effect on additive spatter, reduces the spatter rate of additives during soldering.
[0088] In conjunction with Examples 1-5, the solder wire in Examples 2-4 exhibited a lower spatter rate during soldering. This indicates that the preferred ratio of disproportionated rosin to water-white rosin in the preparation of composite rosin is 1:(3-4), which can improve the performance of the prepared composite rosin.
[0089] Combining Examples 3, 6, and 7, Example 3 showed the lowest spatter rate of the solder wire during soldering. This indicates that when preparing composite rosin, using a mixture of ethylene glycol and pentaerythritol as the polyol can improve the modification effect on disproportionated rosin, thereby reducing the spatter rate of the solder wire during soldering.
[0090] Combining Examples 3, 8, and 9, the spatter rate of the flux during soldering is not significantly different among Examples 3, 8, and 9. This indicates that increasing the amount of raw materials used in the preparation of solder wire has little impact on the performance of the resulting solder wire.
[0091] Combining Examples 8 and 10-12, the solder wire in Example 8 had the lowest spatter rate of additives during soldering. This shows that when preparing the mixture, the activator selected was a composite activator composed of diethylene glycol, octanoic acid, and adipic acid, resulting in a lower spatter rate of additives in the solder wire.
[0092] Combining Examples 8 and 13-16, the solder wire in Examples 13-15 had a lower spatter rate of additives during soldering. It can be seen that when preparing the mixture, the preferred ratio of diethylene glycol, octanoic acid and adipic acid in the activator is 1:(4-5):(3-4), which can further reduce the spatter rate of additives in the prepared solder wire.
[0093] This specific embodiment is merely an explanation of this application and is not intended to limit it. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they fall within the scope of the claims of this application.
Claims
1. A solder wire, characterized in that: The solder wire comprises the following components by weight: 80-83 parts tin, 2.7-3.2 parts silver, 0.3-0.7 parts copper, 2-4 parts composite rosin, 2-3 parts activator, and 5-7 parts solvent; the composite rosin comprises: water-white rosin, disproportionated rosin, catalyst, polyol, and defoamer; the preparation method of the composite rosin includes the following steps: grinding the disproportionated rosin, heating it under nitrogen protection to soften the disproportionated rosin, starting stirring, and when the disproportionated rosin reaches a molten state, adding the catalyst and polyol, and continuing to add... Stir hot until the acid value of the mixture remains constant, then stop the reaction and cool to 100-150℃. Add water-white rosin and defoamer, stir evenly, and cool to obtain composite rosin. The weight ratio of the disproportionated rosin to the water-white rosin is 1:(3-4). The catalyst includes zinc oxide. The polyol includes a mixture of ethylene glycol and pentaerythritol. The activator includes a mixture of diethylene glycol, octanoic acid, and adipic acid, and the weight ratio of the diethylene glycol, octanoic acid, and adipic acid is 1:(4-5):(3-4).
2. The solder wire according to claim 1, characterized in that: The solvent comprises a mixture of ethylene glycol and ethylene glycol phenyl ether.
3. A method for preparing solder wire as described in any one of claims 1-2, characterized in that: Includes the following steps: The compound rosin, activator, and solvent are stirred and mixed evenly to obtain a mixture; Tin, silver and copper are melted and mixed, poured into a mold, and cooled to obtain a rod. The mixture and rod are placed in an extruder, poured, extruded, and drawn to obtain solder wire.