A method of micro-needle tailoring

Abstract

The application discloses a micro-needle cutting method, which comprises the following steps: obtaining blood vessel information of an area to be invaded; obtaining a cutting area according to the blood vessel information; and cutting micro-needles in the cutting area to avoid the micro-needles in the cutting area from causing harm to the human body. Specifically, the cutting area can be an area where blood vessels and other human tissues are located in a micro-needle implantation area, and the micro-needles in the area are cut off, so that the blood vessels of a patient can be prevented from being punctured, and the safety of the patient can be ensured, and the patient can be prevented from suffering pain.

Description

Technical Field

[0001] This invention relates to the field of neural interface technology, specifically a microneedle cutting method. Background Technology

[0002] Neural interface technology enables interaction between biological information and electronic devices, holding immense promise for unlocking the mysteries of biological communication. In neural interface technology, biological signals are typically collected via electrodes, which can be invasive or non-invasive. Invasive electrodes, however, provide more accurate and reliable signals.

[0003] Area array microneedle electrodes, with their high microneedle density and high detection accuracy, have become a key research direction for invasive electrodes. However, due to the high microneedle density and large implantation area of ​​area array microneedles, there is a risk of blood vessels in some areas being punctured by the microneedles during implantation surgery. Summary of the Invention

[0004] In view of the above problems, the present invention provides a microneedle cutting method that overcomes or at least partially solves the above problems, which can solve the problem that blood vessels in the implantation area are easily punctured, thereby ensuring patient safety.

[0005] Specifically, the present invention provides a microneedle cutting method, including:

[0006] Obtain vascular information of the area to be invaded;

[0007] The cropping area is obtained based on the described blood vessel information;

[0008] The microneedles within the cutting area are cut.

[0009] Optionally, the step of obtaining vascular information of the area to be invaded includes:

[0010] Obtain the location image of the blood vessels in the area to be invaded.

[0011] Optionally, the step of obtaining the clipping region based on the blood vessel information includes:

[0012] Obtain the real-time projection of the microneedle along its length direction;

[0013] The location image is overlaid with the real-time projection to obtain the overlapping region; the circumscribed graphic of the overlapping region is obtained, and the circumscribed graphic is the cropped region.

[0014] Optionally, the step of cutting the microneedles within the cutting area includes:

[0015] The cutting area is divided into multiple sequentially connected rectangles, and the micro-needles within each rectangle are cut sequentially.

[0016] Optionally, the microneedle cutting method further includes:

[0017] Determine whether the real-time projection matches the cropping area; if not, continue cropping.

[0018] Optionally, obtaining the real-time projection of the microneedle along its length direction includes:

[0019] Before cutting the microneedles within the cutting area, obtain the real-time projection of the microneedles along their length; or

[0020] After the microneedles in the cutting area are cut, in response to the triggering of a preset condition, the real-time projection of the microneedles in their length direction is acquired again.

[0021] Optionally, the step of acquiring the real-time projection of the microneedle along its length direction again in response to triggering a preset condition includes:

[0022] At preset time intervals, acquire the real-time projection of the microneedle along its length direction; or

[0023] After the microneedles within a rectangle are cut, a real-time projection of the microneedles along their length direction is obtained.

[0024] Optionally, the step of cutting the microneedles within the cutting area further includes:

[0025] The cutting area is divided into multiple rectangles of equal width connected in sequence, so that the same blade can be driven to perform multiple repeated cutting operations.

[0026] Optionally, the step of cutting the microneedles within the cutting area further includes:

[0027] The cutting area is divided into multiple rectangles of different widths connected in sequence. When the width of the rectangle changes, the cutting blade is replaced so that the length of the blade is the same as the width of the rectangle.

[0028] Optionally, the microneedle cutting method further includes:

[0029] After cutting the microneedles within the cutting area, the cut microneedles are collected.

[0030] The present invention also provides a computer device, including a memory, a processor, and a machine-executable program stored in the memory and running on the processor; when the processor executes the machine-executable program, it implements the microneedle cutting method described in any of the above claims.

[0031] The beneficial effects of this invention are as follows:

[0032] The control method for the microneedle cutting device provided by this invention can remove microneedles from the cutting area as needed to avoid harm to the human body. Specifically, the cutting area can be the area where blood vessels or other human tissues are located in the microneedle implantation area. Removing the microneedles from this area can prevent the patient's blood vessels from being punctured, thus ensuring the patient's safety and avoiding pain.

[0033] The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments of the invention in conjunction with the accompanying drawings. Attached Figure Description

[0034] The following sections will describe some specific embodiments of the invention in detail by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or portions. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0035] Figure 1 This is a schematic structural diagram of a microneedle cutting device according to an embodiment of the present invention;

[0036] Figure 2 This is a schematic structural diagram of a microneedle cutting device according to an embodiment of the present invention;

[0037] Figure 3 This is a schematic structural diagram of a microneedle fixing module in a microneedle cutting device according to an embodiment of the present invention;

[0038] Figure 4 This is a schematic exploded view of a microneedle fixing module in a microneedle cutting device according to an embodiment of the present invention;

[0039] Figure 5 This is a schematic structural diagram of the rotation angle adjustment mechanism in a microneedle cutting device according to an embodiment of the present invention;

[0040] Figure 6 This is a schematic structural diagram of the swing angle adjustment motor in a microneedle cutting device according to an embodiment of the present invention;

[0041] Figure 7 This is a schematic structural diagram of a clamping component in a microneedle cutting device according to an embodiment of the present invention;

[0042] Figure 8 This is a schematic structural diagram of a microneedle in a microneedle cutting device according to an embodiment of the present invention;

[0043] Figure 9This is a schematic structural diagram of the cutting action execution module in a microneedle cutting device according to an embodiment of the present invention;

[0044] Figure 10 This is a schematic exploded view of the cutting action execution module in a microneedle cutting device according to an embodiment of the present invention;

[0045] Figure 11 This is a schematic structural diagram of the Z-axis lifting motor in a microneedle cutting device according to an embodiment of the present invention;

[0046] Figure 12 This is a schematic structural diagram of the Y-axis translation motor in a microneedle cutting device according to an embodiment of the present invention;

[0047] Figure 13 This is a schematic structural diagram of a microneedle cutting tool module in a microneedle cutting device according to an embodiment of the present invention;

[0048] Figure 14 This is a schematic structural diagram of a microneedle cutting tool in a microneedle cutting device according to an embodiment of the present invention.

[0049] Figure 15 This is a schematic partial structural diagram of a microneedle cutting tool in a microneedle cutting device according to an embodiment of the present invention;

[0050] Figure 16 This is a schematic structural diagram of the cutting structure in a microneedle cutting device according to an embodiment of the present invention.

[0051] Figure 17 This is a schematic diagram illustrating the implementation principle of the cutting action execution module in a microneedle cutting device according to an embodiment of the present invention;

[0052] Figure 18 This is a schematic diagram illustrating the lifting effect of the cutting action execution module in a microneedle cutting device according to an embodiment of the present invention.

[0053] Figure 19 This is a schematic diagram illustrating the principle of cutting action in a microneedle cutting device according to an embodiment of the present invention;

[0054] Figure 20 This is a schematic structural diagram of the optical lens module in a microneedle cutting device according to an embodiment of the present invention;

[0055] Figure 21 This is a schematic structural diagram of a microneedle debris collection module in a microneedle cutting device according to an embodiment of the present invention;

[0056] Figure 22 This is a schematic exploded view of a microneedle debris collection module in a microneedle cutting device according to an embodiment of the present invention;

[0057] Figure 23 This is a schematic structural diagram of a debris collection component in a microneedle cutting device according to an embodiment of the present invention;

[0058] Figure 24 This is a schematic structural diagram of the Y-axis swing adjustment mechanism in a microneedle cutting device according to an embodiment of the present invention;

[0059] Figure 25 This is a schematic structural diagram of the base assembly in a microneedle cutting device according to an embodiment of the present invention;

[0060] Figure 26 This is a schematic structural diagram of the Z-axis rotation adjustment mechanism in a microneedle cutting device according to an embodiment of the present invention;

[0061] Figure 27 This is a schematic structural diagram of a microneedle debris collection groove assembly in a microneedle cutting device according to an embodiment of the present invention;

[0062] Figure 28 This is a schematic structural diagram of the posture adjustment mechanism in a microneedle cutting device according to an embodiment of the present invention;

[0063] Figure 29 This is a schematic diagram illustrating the implementation principle of a microneedle debris collection module in a microneedle cutting device according to an embodiment of the present invention.

[0064] Figure 30 This is a schematic flowchart of a microneedle cutting method according to an embodiment of the present invention;

[0065] Figure 31 This is a matching diagram of vascular information and implantation area in a microneedle cutting method according to an embodiment of the present invention;

[0066] Figure 32 This is a schematic diagram illustrating the principle of converting the cutting area in a microneedle cutting method according to an embodiment of the present invention;

[0067] Figure 33 This is a schematic diagram illustrating the matching of microneedles with the cutting area in a microneedle cutting method according to an embodiment of the present invention.

[0068] Figure 34 This is a schematic diagram illustrating the decomposition of the cutting region in a microneedle cutting method according to an embodiment of the present invention;

[0069] Figure 35 This is a schematic diagram illustrating the principle of moving a microneedle cutting tool in a microneedle cutting method according to an embodiment of the present invention;

[0070] Figure 36 This is a schematic diagram illustrating the lifting principle of the cutting tool in a microneedle cutting method according to an embodiment of the present invention;

[0071] Figure 37 This is a schematic diagram illustrating the positioning of the debris collection module in a microneedle cutting method according to an embodiment of the present invention.

[0072] Figure 38 This is a schematic diagram illustrating the lifting of the debris collection module in a microneedle cutting method according to an embodiment of the present invention.

[0073] Figure 39 This is a schematic diagram illustrating the movement of the cutting tool in a microneedle cutting method according to an embodiment of the present invention.

[0074] Figure 40 This is a schematic diagram illustrating the movement of the debris collection module in a microneedle cutting method according to an embodiment of the present invention.

[0075] Figure 41 This is a schematic diagram illustrating the descent of the cutting tool module in a microneedle cutting method according to an embodiment of the present invention.

[0076] Figure 42 This is a schematic structural diagram of the completed microneedle cutting process according to an embodiment of the present invention.

[0077] In the diagram: 1. Microneedle fixing module; 11. Rotation angle adjustment mechanism; 111. First motor; 112. First base; 113. Turntable; 12. First swing angle adjustment motor; 121. Second motor; 122. Second base; 123. Slide table; 13. Second swing angle adjustment motor; 14. Clamping assembly; 141. Fixing seat; 142. Sliding finger; 143. Microneedle; 144. Compression spring; 2. Cutting action execution module; 21. First Z-axis lifting motor; 211. Third base. 212. Base, Lifting Platform, 213. Third Motor, 22. First Y-axis Translation Motor, 221. Fourth Base, 222. First Slider, 223. Fourth Motor, 23. First X-axis Translation Motor, 24. Cutting Tool Module, 241. First Mounting Base, 242. Cutting Tool, 2421. Main Structure, 2422. Connecting Structure, 2423. Cutting Structure, 243. Cutting Tool Mounting Block, 3. Optical Lens Module, 31. Fifth Motor, 32. Lead Screw, 33. Second Slider 34. Optical lens; 35. Camera; 4. Microneedle debris collection module; 41. Second Z-axis lifting motor; 42. Second Y-axis translation motor; 43. Second X-axis translation motor; 44. Debris collection assembly; 441. Fixing structure; 442. Attitude adjustment mechanism; 443. Microneedle debris collection groove assembly; 4421. Y-axis swing adjustment mechanism; 4422. Z-axis rotation adjustment mechanism; 4423. Mounting block; 44211. Second mounting base; 44212. First push knob; 44 213. First push rod; 44214. Roller; 44215. Return spring; 44221. Third mounting base; 44222. Arc-shaped protrusion; 44223. Second push knob; 44224. Second push rod; 44225. Return top rod; 44226. Second baffle; 4431. Microneedle debris collection groove mounting base; 4432. Side wall; 4433. Microneedle debris collection groove; 4434. First baffle; 4435. Ring column structure; 5. System control module; 6. Display module. Detailed Implementation

[0078] In the description of this embodiment, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0079] In the description of this embodiment, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0080] Figure 1 This is a schematic structural diagram of a microneedle cutting device according to an embodiment of the present invention, such as... Figure 1 As shown, and with reference Figures 2 to 29 The microneedle cutting device provided in this embodiment of the invention includes a microneedle fixing module 1, a cutting action execution module 2, an optical lens module 3, a microneedle debris collection module 4, a system control module 5, and a display module 6. The microneedle fixing module 1 is used to fix the microneedle array 143. The optical lens module 3 is used to acquire the location image of the blood vessels in the area to be invaded and match it with the projection of the microneedle array to obtain the cutting area. The cutting action execution module 2 is used to cut the microneedles within the cutting area. The microneedle debris collection module 4 is used to collect the cut microneedles. The display module 6 is used to display the location image of the blood vessels, the projection of the microneedle array, etc. The system control module 5 is used to control the operation of the microneedle fixing module 1, the cutting action execution module 2, the optical lens module 3, the microneedle debris collection module 4, and the display module 6.

[0081] like Figures 3 to 7 As shown, the microneedle fixing module 1 includes a rotation angle adjustment mechanism 11, a first swing angle adjustment motor 12, a second swing angle adjustment motor 13, and a clamping assembly 14. The rotation angle adjustment mechanism 11 includes a first motor 111, a first base 112, and a turntable 113. The first base 112 is fixedly installed, and the first motor 111 is fixed on the first base 112. The first motor 111 drives the turntable 113 to rotate around the Z-axis direction through a worm gear mechanism.

[0082] It should be noted that the first direction, second direction, and third direction in this invention refer to three mutually perpendicular directions, such as the horizontal (left-right direction), the vertical (front-back direction), and the vertical (up-down direction); for example... Figure X As shown, the first direction is the X-axis direction (horizontal), the second direction is the Y-axis direction (vertical), and the first direction is the Z-axis direction (vertical).

[0083] The first swing angle adjustment motor 12 includes a second motor 121, a second base 122, and a slide 123. The second base 122 is mounted on the turntable 113, and the second motor 121 is fixed on the second base 122. The second motor 121 drives the slide 123 to swing around the Y-axis through a lead screw mechanism.

[0084] The second swing angle adjusting motor 13 has the same structure as the first swing angle adjusting motor 12. The difference is that the second swing angle adjusting motor 13 is installed perpendicular to the first swing angle adjusting motor 12, so that the slide of the second swing angle adjusting motor 13 swings around the X-axis.

[0085] The clamping assembly 14 includes a fixed base 141, sliding fingers 142, a microneedle array 143, and a compression spring 144. The fixed base 141 is mounted on the slide of the second swing angle adjusting motor 13. The sliding fingers 142 are movably mounted on the fixed base 141. The two sliding fingers 142 are connected by a slide rod. The compression spring 144 is sleeved on the slide rod, and the tension of the compression spring 144 clamps the microneedle array 143 between the fixed base 141 and the sliding fingers 142.

[0086] like Figure 8 As shown, the function of the microneedle fixing module is to fix the microneedle and adjust its posture so that the microneedle can rotate around the X, Y, and Z axes.

[0087] like Figures 9 to 19 As shown, the cutting action execution module 2 includes a first Z-axis lifting motor 21, a first Y-axis translation motor 22, a first X-axis translation motor 23, and a cutting tool module 24. The first Z-axis lifting motor 21 includes a third base 211, a lifting platform 212, and a third motor 213. The third base 211 is fixedly installed, and the third motor 213 is fixedly installed on the third base 211. The third motor 213 controls the lifting platform 212 to move up and down along the Z-axis direction through a lead screw module.

[0088] The first Y-axis translation motor 22 includes a fourth base 221, a first slider 222, and a fourth motor 223. The fourth base 221 is fixedly mounted on the lifting platform 212, and the fourth motor 223 is fixedly mounted on the fourth base 221. The fourth motor 223 controls the lifting platform 222 to translate along the Y-axis direction through a lead screw module.

[0089] The first X-axis translation motor 23 includes a fifth base, a fifth motor, a third lifting platform, a third lead screw, and a cutting tool mounting block. The third base is mounted on the second lifting platform, the fifth motor is mounted on the fifth base, the third lead screw extends along the first direction, and the third lead screw is driven to the output end of the fifth motor. The third lifting platform is screw-driven and sleeved on the third lead screw, so that the first X-axis translation motor 23 drives the cutting tool module 24 to translate along the X-axis direction.

[0090] The cutting tool module 24 includes a first mounting base 241, a cutting tool 242, and a cutting tool mounting block 243. The first mounting base 241 is fixedly mounted on the output end of the first X-axis translation motor 23, and the cutting tool 242 is mounted on the first mounting base 241. The cutting tool 242 consists of a main structure 2421, a connecting structure 2422, and a shearing structure 2423, and is generally sheet-like. The main structure of the cutting tool 242 can be of any shape, mainly for fixation, ensuring strength. The connecting structure is a long rod structure, distributed along the cutting motion direction, used to connect the main structure and the shearing structure. The shearing structure is perpendicular to the cutting motion direction and has different specifications depending on the number of rows required for a single cut, such as... Figure 15 The diagram shows four columns, which can be adjusted to any number of columns as needed. The shape of the shear structure can be straight, V-shaped, U-shaped, or triangular, etc.; for example... Figure 16 The shearing structure 2423 shown is in the form of a straight line and a V-shape; it is understood that the shape of the shearing structure 2423 is not limited to the above types. Any shearing structure 2423 that can apply local pressure at the root of the microneedle and is conducive to cutting the microneedle is within the protection scope of this invention.

[0091] Furthermore, the connecting structures 2422 are arranged adjacently and relatively parallel; the spacing between two adjacent connecting structures 2422 is set to be greater than the diameter of any microneedle in the microneedle array, and the width of any connecting structure 2422 is set to be less than the gap between any two adjacent microneedles. The two ends of the shearing structure 2423 are fixedly connected to the two adjacent connecting structures 2422 respectively.

[0092] Furthermore, the shearing structure 2423 is located in the middle of the connecting structure 2422, or the shearing structure 2423 is located at one end of the main structure 2421, and the end of the connecting structure 2422 without the shearing structure 2423 is connected to the main structure 2421.

[0093] Furthermore, the number of shear structures 2423 is one, and the number of connecting structures 2422 is two; or, the number of shear structures 2423 is multiple, and the difference between the number of connecting structures 2422 and the number of shear structures 2423 is 1; the shear structures 2423 extend in a linear shape in the same direction and the extension direction is perpendicular to the length direction of the connecting structures 2422.

[0094] like Figure 17As shown, when the cutting action execution module 24 is in use, the first X-axis translation motor 23 and the first Y-axis translation motor 22 are responsible for transporting the cutting tool 242 to the predetermined position, i.e., positioning the cutting tool 242. Then, the first Z-axis lifting motor 21 lifts the cutting tool 242 to the root of the microneedle, i.e., lifting the cutting tool 242. Finally, the first Y-axis translation motor 22 performs the corresponding cutting action displacement according to the expected cutting area, i.e., the cutting action is implemented. The cutting action effect diagram of the cutting tool 242 is shown in the figure. Figure 18 As shown in the diagram. The principle diagram of the cutting action is as follows. Figure 19 As shown.

[0095] like Figures 22 to 29 As shown, the microneedle debris collection module (i.e., the microneedle collection device) includes a second Z-axis lifting motor 441, a second Y-axis translation motor 42, a second X-axis translation motor 43, and a debris collection assembly 44. The second Z-axis lifting motor 41 has the same structure as the first Z-axis lifting motor 21, and also outputs vertical movement along the Z-axis; the second Y-axis translation motor 42 has the same structure as the first Y-axis translation motor 22, and also outputs movement along the Y-axis; the second X-axis translation motor 43 has the same structure as the first X-axis translation motor 23, and also outputs movement along the X-axis.

[0096] Furthermore, the microneedle collection device also includes a microneedle debris collection groove mounting base 4431, a ring column structure 4435, and a first baffle 4434. The microneedle debris collection groove mounting base 4431 fixes the microneedle debris collection groove 4433 onto the ring column structure 4435, and the first baffle 4434 is fixed onto the ring column structure 4435 and protrudes from the outer side wall of the ring column structure 4435. The microneedle debris collection groove 4433, the microneedle debris collection groove mounting base 4431, the ring column structure 4435, and the first baffle 4434 constitute the microneedle debris collection groove assembly.

[0097] Furthermore, the microneedle collection device also includes an attitude adjustment mechanism and a mounting block 4423. The microneedle debris collection groove assembly 443 is fixedly installed between the mounting block 4423 and the attitude adjustment mechanism. The attitude adjustment mechanism is used to adjust the attitude of the microneedle debris collection groove assembly 443.

[0098] Furthermore, the attitude adjustment mechanism includes a Z-axis rotation adjustment mechanism 4422. The Z-axis rotation adjustment mechanism 4422 includes a first mounting base 44221, a push knob 44223, a push rod 44224, and a reset rod 44225. The push rod 44224 and the reset rod 44225 are arranged opposite to each other and fixed on the first mounting base 44221. The push knob 44223 is located on the side of the push rod 44224 away from the reset rod 44225 and is connected to the push rod 44224. The first baffle 4434 is located between the push rod 44224 and the reset rod 44225. Under the push of the push rod 44224 and the reset rod 44225, the microneedle debris collection groove is driven to rotate around the Z-axis.

[0099] Furthermore, the Z-axis rotation adjustment mechanism 4422 also includes an arc-shaped slide 44222 and a baffle 44226. The arc-shaped slide 44222 is located on the side of the first mounting base 44221 and is perpendicular to the Y-axis. The baffle 44226 is fixed to the outer wall of the arc-shaped slide 44222 and is parallel to the Y-axis.

[0100] The attitude adjustment mechanism also includes a Y-axis swing adjustment mechanism, which includes a second mounting base 44211, a second push knob 44212, a second push rod 44213, a return spring 44215, and a roller 44214. The roller 44214 is fixedly connected to the side wall of the second mounting base 44211 and is located within the arc-shaped slide groove 44222 and slidably connected to the arc-shaped slide groove 44222. The second push rod 44213 is fixedly connected to the second mounting base 44211 and is slidably connected to the second push knob 44213. The second baffle plate 44226 is in contact; the second push knob 44212 is connected to the end of the second push rod 44213 away from the second baffle plate 44226. Under the push of the second push rod 44213, the second baffle plate 44226 drives the micro needle debris collection groove to swing around the Y-axis; the reset spring 44215 is fixedly installed on the side of the second mounting base 44211 near the first mounting base 44221. The reset spring 44215 is used to reset the Z-axis rotation adjustment mechanism 4422 in the Y-axis direction.

[0101] In application, rotating the first push knob 44212 causes the first push rod 44213 to extend along the X-axis, pushing the baffle 44226 and the arc-shaped protrusion 44222 to slide relative to the roller, thereby allowing the Z-axis rotation adjustment mechanism 4422 to swing around the Y-axis. Reversing the rotation of the first push knob 44212 retracts the first push rod 44213, and the Z-axis rotation adjustment mechanism 4422 resets under the action of the return spring 44215. Similarly, rotating the second push knob 44223 causes the second push rod 44224 to extend along the Y-axis, pushing the baffle 4434 on the microneedle debris collection trough assembly 443443, allowing the microneedle debris collection trough assembly 443443 to rotate around the Z-axis; the reset method is the same. After the debris collection assembly moves to the predetermined position, the Z-axis lifting motor lifts the debris collection assembly to the root of the microneedle. The area to be cut is isolated from other areas, and the cut microneedle debris will fall from the microneedle debris collection groove, preventing it from sticking to the gaps in the microneedles that do not need to be cut.

[0102] Furthermore, the mounting block 4423 has a ring column structure accommodating space, and the side wall of the mounting block 4423 has a clearance hole to make way for the second baffle 443. The top of the mounting block 4423 has a mounting hole for the microneedle debris collection groove 4433 to pass through. The mounting block 4423 is fixedly connected to the attitude adjustment mechanism.

[0103] Furthermore, the microneedle collection device also includes a fixing structure 441, which is located on the side of the attitude adjustment mechanism away from the microneedle debris collection groove assembly 443, and is used to fix the attitude adjustment mechanism.

[0104] Furthermore, the depth of the microneedle debris collection groove is not less than the length of the microneedle.

[0105] Furthermore, the length of the side is greater than the length and / or width of the microneedle array; or, the length of the side is less than the length and / or width of the microneedle array, and the length of the side is set to be greater than the diameter of any one microneedle.

[0106] like Figure 20 As shown, the optical lens module 3 includes a fifth motor 31, a lead screw 32, a second slider 33, an optical lens 34, and a camera 35. The camera 35 collects the spatial position information of the microneedles, the cutting tool, and the microneedle debris collection module in real time and sends the information to the computer. The fifth motor 31 drives the second slider 33 to move along the Z-axis via the lead screw 32, thereby moving the camera 35 and facilitating the camera 35 to observe objects at different heights.

[0107] The system control module 5 is used to send motion commands to each motor to control the corresponding module to move to the target position.

[0108] The display module 6 can display images of the spatial positions of the microneedles, cutting tools, and debris collection module in real time, while the user can input commands through the display module.

[0109] The present invention also provides a microneedle cutting method, the microneedle cutting method comprising:

[0110] Obtain vascular information of the area to be invaded; determine the trimming area based on the vascular information; trim the microneedles within the trimming area.

[0111] Among them, the vascular information of the area to be invaded is the location image of the blood vessels in the area to be invaded.

[0112] Specifically, the steps for obtaining vascular information of the area to be invaded include: obtaining location images of the blood vessels in the area to be invaded.

[0113] Further, the step of obtaining the clipping region based on vascular information includes:

[0114] Obtain the real-time projection of the microneedle along its length;

[0115] The location image is overlaid with the real-time projection to obtain the overlapping region; the outer graph of the overlapping region is the clipping region.

[0116] To facilitate cutting, the steps for cutting the micro-needles within the cutting area include:

[0117] The cutting area is divided into multiple sequentially connected rectangles, each rectangle containing at least one microneedle, and the microneedles within each rectangle are cut.

[0118] The microneedle cutting method of the present invention can be used to cut microneedles within a rectangular area of ​​equal width. Specifically, the method includes a step of cutting microneedles within the cutting area, and further includes:

[0119] The cutting area is divided into multiple sequentially connected rectangles of the same width, so that the same blade can perform multiple repeated cutting operations.

[0120] The microneedle cutting method of the present invention can be used to cut microneedles within rectangular areas of different widths. Specifically, the method includes a step of cutting microneedles within the cutting area, and further includes:

[0121] The cutting area is divided into multiple rectangles of different widths connected in sequence. When the width of the rectangle changes, the cutting blade is replaced so that the length of the blade is the same as the width of the rectangle.

[0122] Furthermore, microneedle cutting methods also include:

[0123] Determine whether the real-time projection overlaps with the cropping area;

[0124] If yes, continue cutting; if no, the cutting is complete.

[0125] To facilitate determining whether the real-time projection overlaps with the cutting area, the real-time projection of the microneedle along its length direction is obtained, including:

[0126] Before cutting the microneedles within the cutting area, obtain the real-time projection of the microneedles along their length; or

[0127] After the microneedles in the cutting area are cut, in response to the triggering of a preset condition, the real-time projection of the microneedles in their length direction is acquired again.

[0128] The step of acquiring the real-time projection of the microneedle along its length direction again in response to triggering a preset condition includes:

[0129] At preset intervals, acquire a real-time projection of the microneedle along its length; or, after the microneedle within a rectangle has been cut, acquire a real-time projection of the microneedle along its length.

[0130] Furthermore, microneedle cutting methods also include:

[0131] After cutting the microneedles within the cutting area, the cut microneedles are collected.

[0132] The specific implementation method is as follows:

[0133] like Figures 30 to 42 As shown, the vascular information of the surgical area is first imported into the computer, and the implantation area is matched with the vascular information. The computer converts the vascular location information into the area to be cropped, and then decomposes the area to be cropped into multiple areas that can be cropped in one step. Then, the microneedle is installed on the fixation module, the optical lens module images the microneedle tip, and transmits the image to the computer for matching with the cropping area. In the next step, the computer decomposes the area to be cropped into multiple small areas, and each small area can be cropped in one step.

[0134] Then, the first round of cutting is performed: First, the cutting tool moves to the cutting area, i.e., the cutting tool is positioned. Then, the cutting tool moves to the needle root, i.e., the cutting tool is lifted. Next, the debris collection module is moved to the cutting area, i.e., the debris collection module is positioned. Then, the debris collection module moves to the needle root, i.e., the debris collection module is lifted. Next, the computer controls the movement of the cutting tool, and the displacement value is the length of the small area after the cutting area is decomposed in the direction of movement. After the single cutting action is completed, the debris collection module descends below the needle tip. Then, the cutting tool module descends below the needle tip. At this point, the first round of single cutting is completed. After each round of single cutting, the computer compares the real-time image of the microneedle with the area to be cut. If the entire cutting area is cut, a message indicates that cutting is complete, and the microneedle can be removed. Otherwise, the single cutting process will be repeated until all the microneedles to be cut are cut. A schematic diagram of the completed microneedle cutting in the cutting area is shown below. Figure 42 As shown.

[0135] In this embodiment of the invention, the small area cut in a single operation consists of 4 rows of microneedles. Depending on actual needs, the cutting tool can be designed with other numbers of rows, meaning the small area cut in a single operation can also have other numbers of rows. The smaller the number of rows cut in a single operation, the closer the final cut shape is to the contour of the actual blood vessel, meaning the cutting is more precise.

[0136] When the needle spacing of the microneedles is different, different sizes of cutting tools can be used to complete the cutting work, and the method is the same as in this embodiment.

[0137] When the area to be cut is small, such as the area occupied by a single needle, a single-row cutting tool can be used to cut off the needle by adjusting the displacement corresponding to the needle spacing. This needle can be any position within the array, and the method is the same as in this embodiment.

[0138] This embodiment also provides a computer device, which includes a memory, a processor, and a machine-executable program stored in the memory and running on the processor; when the processor executes the machine-executable program, it implements the microneedle cutting method of any of the above embodiments.

[0139] The technical solutions of the present invention have been described in conjunction with several embodiments above. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is not limited to these specific embodiments. Without departing from the technical principles of the present invention, those skilled in the art can disassemble and combine the technical solutions in the above embodiments, and can also make equivalent changes or substitutions to related technical features. Any changes, equivalent substitutions, improvements, etc., made within the technical concept and / or technical principles of the present invention will fall within the scope of protection of the present invention.

Claims

1. A microneedle cutting method, characterized in that, include: Obtain vascular information of the area to be invaded; The cropping area is obtained based on the described blood vessel information; The microneedles within the cutting area are cut; The step of obtaining vascular information of the area to be invaded includes: Obtain the location image of the blood vessels in the area to be invaded; The step of obtaining the clipping region based on the blood vessel information includes: Obtain the real-time projection of the microneedle along its length direction; The location image is overlaid with the real-time projection to obtain an overlapping region; the circumscribed shape of the overlapping region is the cropping region. The step of cutting the microneedles within the cutting area includes: The cutting area is divided into multiple sequentially connected rectangles, each rectangle containing at least one of the microneedles, and the microneedles in each rectangle are cut. The microneedle cutting method also includes: Determine whether the real-time projection overlaps with the cropping area; If yes, continue cutting; if no, the cutting is complete.

2. The microneedle cutting method according to claim 1, characterized in that, The method of obtaining the real-time projection of the microneedle along its length includes: Before cutting the microneedles within the cutting area, obtain the real-time projection of the microneedles along their length; or After the microneedles in the cutting area are cut, in response to the triggering of a preset condition, the real-time projection of the microneedles in their length direction is acquired again.

3. The microneedle cutting method according to claim 2, characterized in that, The step of acquiring the real-time projection of the microneedle along its length direction again in response to triggering a preset condition includes: At preset time intervals, acquire the real-time projection of the microneedle along its length direction; or After the microneedles within a rectangle are cut, a real-time projection of the microneedles along their length direction is obtained.

4. The microneedle cutting method according to any one of claims 1-3, characterized in that, The step of cutting the microneedles within the cutting area further includes: The cutting area is divided into multiple rectangles of equal width connected in sequence, so that the same blade can be driven to perform multiple repeated cutting operations.

5. The microneedle cutting method according to any one of claims 1-3, characterized in that, The step of cutting the microneedles within the cutting area further includes: The cutting area is divided into multiple rectangles of different widths connected in sequence. When the width of the rectangle changes, the cutting blade is replaced so that the length of the blade is the same as the width of the rectangle.

6. The microneedle cutting method according to claim 1, characterized in that, The microneedle cutting method also includes: After cutting the microneedles within the cutting area, the cut microneedles are collected.

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