Laser processing equipment

Abstract

This invention provides a laser processing apparatus using an air-floating stage. The laser processing apparatus includes: an air-floating stage configured to float an object to be processed; a conveying section configured to convey the object to be processed on the air-floating stage in a first axial direction; a cooling module disposed on one side of both sides of the air-floating stage in the first axial direction; and a laser irradiation section disposed above the cooling module.

Description

Technical Field

[0001] This disclosure relates to a laser processing apparatus, and more specifically, to a laser processing apparatus employing an air-floating stage. Background Technology

[0002] Display devices can be used in mobile devices such as smartphones, tablet PCs, laptops, digital cameras, camcorders, and portable information terminals or electronic products (such as thin-screen TVs, display monitors, and billboards).

[0003] As the liquid crystal display (LCD) industry matures and is eagerly pursued by major competitors, there is an urgent need to enter the next-generation flexible display market, which can create high-resolution panels and high added value. To date, glass has been widely used as an encapsulation material, but its sensitivity to oxygen and moisture increases with the encapsulation area. Therefore, determining the glass substrate and using moisture-absorbing methods is not suitable for large-size organic light-emitting diode (OLED) TVs. As an alternative to large-size encapsulation technology, thin-film encapsulation methods that protect the elements through multilayer organic-inorganic composite films will become essential.

[0004] Flexible OLEDs are the technology that will dominate most flexible displays in the future, and the substrate for flexible OLEDs is currently almost universally confirmed to be polyimide (PI). In practice, existing active matrix organic light-emitting diode (AMOLED) processes are used. Here, PI is attached to a carrier glass, thin-film transistors (TFTs) and the OLED are formed on the PI, and then a passivation film for encapsulating the thin film is formed on the TFTs and the OLED. Furthermore, another film can be formed on the passivation film, and after the OLED process is fully executed, the carrier glass located on the lower side is detached by methods such as laser, heating, or chemical peeling.

[0005] Laser lift-off (LLO) technology, used to detach the carrier glass, is performed by placing a carrier glass uniformly formed with a passivation film or membrane on a worktable. In this case, due to the contact between the passivation film or membrane and the surface of the worktable to irradiate the carrier glass with a laser, according to the prior art, there are instances of the passivation film or membrane being dented or scratched.

[0006] Due to the characteristics of laser processing, separate post-treatment of the worktable may not be performed to prevent punctures and scratches. For this reason, after placing the carrier glass, which is uniformly formed with the passivation film or film, on the worktable, during vacuum adsorption, indentations may occur in the passivation film or film due to uneven pores, depending on the surface conditions of the worktable, due to the pressure and / or particles on the worktable.

[0007] Therefore, there is a need for technologies that can address limitations such as dents, scratches, slippage, holes, and particles by minimizing the contact between the surface of the worktable and the passivation film or film when placing the carrier glass.

[0008] [Existing Technical Documents]

[0009] [Patent Documents]

[0010] Korean Patent No. 10-1600913 Summary of the Invention

[0011] This disclosure provides a laser processing apparatus that performs laser processing on an object to be processed while it is floating and transported on an air-floating platform.

[0012] According to an exemplary embodiment, a laser processing apparatus includes: an air-floating platform configured to float an object to be processed; a conveying section configured to convey the object to be processed on the air-floating platform in a first axial direction; a cooling module disposed on one side of both sides of the air-floating platform in the first axial direction; and a laser irradiation section disposed above the cooling module.

[0013] Multiple air-floating platforms can be set up, and the air-floating platforms are respectively set on both sides of the cooling module in the first axial direction.

[0014] Multiple air-floating platforms can be symmetrical about each other relative to the cooling module.

[0015] The air flotation platform may include: a purge port configured to eject gas; and a suction port configured to provide suction force through exhaust.

[0016] The air flotation platform may include a first region and a second region that differ in the number of at least one of the purge holes and suction holes.

[0017] The first region may be relatively adjacent to the cooling module and have a first number of purge holes compared to the second region, and the second region may have a second number of purge holes, which is less than the first number of purge holes.

[0018] In the first area, purge holes and suction holes can be arranged alternately.

[0019] In the second region, the number of suction holes can be less than the number of purge holes.

[0020] The first region may include a recessed portion with a purge or suction hole formed therein.

[0021] The recessed portion may extend in a second axial direction that intersects the first axial direction.

[0022] The length of the cooling module in the first axial direction can be less than the length of the air-floating platform in the first axial direction.

[0023] The laser processing apparatus may further include a rotating portion configured to rotate an object to be processed on at least one of a plurality of air-bearing platforms, wherein the laser irradiation portion may be configured to irradiate a laser having a length in a second axial direction intersecting a first axial direction, the length being less than the length of the object to be processed in the second axial direction.

[0024] The conveying section may include a fixed support section configured to fix and support the object to be processed in a floating state on the air-bearing platform.

[0025] The cooling module may include: a first cooling portion having a non-uniform surface on a first surface, wherein a laser irradiated from a laser irradiation portion is incident on the first surface; and a second cooling portion made of a material different from that of the first cooling portion and disposed on a second surface facing the first surface of the first cooling portion.

[0026] The first cooling section may have a first cooling channel, and the second cooling section may have a second cooling channel, wherein the number of the second cooling channels is greater than the number of the first cooling channels.

[0027] The cooling module may further include a light-transmitting plate disposed on a first surface of the first cooling section. Attached Figure Description

[0028] The exemplary embodiments can be understood in more detail from the following description taken in conjunction with the accompanying drawings, in which:

[0029] Figure 1 A schematic cross-sectional view of a laser processing apparatus according to an exemplary embodiment is shown.

[0030] Figure 2 A conceptual diagram illustrating the first and second regions of the air-floating platform according to an exemplary embodiment.

[0031] Figure 3 A schematic cross-sectional view showing the recessed portions surrounding the purge and suction holes according to an exemplary embodiment.

[0032] Figure 4 This is a schematic diagram illustrating a cooling module according to an exemplary embodiment.

[0033] Figure 5This is a conceptual diagram used to explain the rotating portion according to an exemplary embodiment.

[0034] Figure 6 A schematic perspective view illustrating the fixed support portion according to an exemplary embodiment.

[0035] Explanation of icon numbers

[0036] 10: Object;

[0037] 10a, 10b: Half of the object;

[0038] 11: Carrier glass;

[0039] 12: Polyimide layer;

[0040] 13: Organic light-emitting diode layer;

[0041] 14: Thin film encapsulation layer;

[0042] 15: Protective film layer;

[0043] 40: Laser;

[0044] 100: Laser processing equipment;

[0045] 110: Air-floating platform;

[0046] 110a: First air flotation platform;

[0047] 110b: Second air-floating platform;

[0048] 111: Purge port;

[0049] 111a, 112a: Depressed portion;

[0050] 111b: Gas supply pipeline;

[0051] 112: Suction hole;

[0052] 115a: First region;

[0053] 115b: Second region;

[0054] 120: Teleportation section;

[0055] 121: Fixed support section;

[0056] 122: Track;

[0057] 123: Movable subject;

[0058] 130: Cooling module;

[0059] 131: First cooling section;

[0060] 131a: First cooling channel;

[0061] 131b: Second cooling channel;

[0062] 132: Second cooling section;

[0063] 133: Light transmission plate;

[0064] 140: Laser irradiation section;

[0065] 150: Processing chamber;

[0066] 151a: Loading platform;

[0067] 151b: Unloading platform;

[0068] 160: Rotation section. Detailed Implementation

[0069] Specific embodiments will be described in more detail below with reference to the accompanying drawings. However, the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the description, like elements are denoted by like reference numerals. In the drawings, the dimensions of layers and regions are enlarged for clarity of illustration. Like reference numerals refer to like elements throughout.

[0070] Figure 1 A schematic cross-sectional view of a laser processing apparatus according to an exemplary embodiment is shown.

[0071] refer to Figure 1 According to an exemplary embodiment, the laser processing apparatus 100 may include: an air-floating stage 110 capable of floating an object 10 to be processed; a conveying section 120 for conveying the object 10 to be processed on the air-floating stage 110 in a first axial direction; a cooling module 130 disposed on one side of both sides of the air-floating stage 110 in the first axial direction; and a laser irradiation section 140 disposed above the cooling module 130.

[0072] The air-floating stage 110 allows the object 10 to be processed to float (or suspend) and spaces the object 10 from its surface to support it in a non-contact manner. For example, the air-floating stage 110 can float (or suspend) the object 10 by spraying gas (e.g., air) onto the bottom surface of the object 10. Here, the object 10 may be a substrate or glass, and may include a carrier glass 11, a polyimide (PI) layer 12, a thin-film transistor (TFT), an organic light-emitting diode (OLED) layer 13, a thin-film encapsulation (TFE) layer 14, and a protective film layer 15.

[0073] The conveying section 120 can convey the object 10 to be processed on the air-bearing table 110 in a first axial direction, and the object 10 to be processed can move linearly in the first axial direction in a state spaced apart from the surface of the air-bearing table 110 (e.g., maintained at a predetermined interval). Therefore, the object 10 to be processed can avoid contact with the surface of the air-bearing table 110 during transport, so as to prevent dents and scratches from occurring in a part of the object 10 to be processed (e.g., the thin film encapsulation (TFE) layer 14 or the protective film layer 15) due to contact between the worktable (which supports the object 10 to be processed) and the object 10 to be processed in the prior art.

[0074] The cooling module 130 may be disposed on at least one side of the air-bearing stage 110 in the first axial direction to cool the heat generated during laser processing and to suppress or prevent the object 10 to be processed from being affected by heat during the laser processing.

[0075] The laser irradiation section 140 can irradiate the laser 40, can be positioned above the cooling module 130, and can allow the irradiated laser 40 to enter the cooling module 130. For example, the laser irradiation section 140 can irradiate the laser 40 toward the cooling module 130. In this case, the object 10 to be processed can be conveyed by the conveying section 120 in a first axial direction and placed on the cooling module 130, such that the laser 40 irradiates the object 10 to be processed, and laser processing can be performed on the object 10 to be processed. Here, the laser 40, whether it does not pass through the object 10 to be processed or has passed through or transmitted through the object 10 to be processed, can enter the cooling module 130. Here, the laser processing can be a laser lift-off (LLO) process, and the laser 40 can irradiate the carrier glass 11 of the object 10 to be processed to lose (or remove) the adhesion between the carrier glass 11 and the polyimide (PI) layer, thereby peeling the carrier glass 11 off from the object 10 to be processed (or the polyimide (PI) layer).

[0076] According to an exemplary embodiment, the laser processing apparatus 100 can perform laser processing on an object 10 to be processed, while simultaneously causing the object 10 to be processed to float and be conveyed through an air-bearing stage 110. Therefore, in the prior art, dents or scratches (e.g., a thin-film encapsulation (TFE) layer or protective film layer) on a portion of the object 10 to be processed, which inevitably occurs during the conveyance of the object 10 due to contact between the stage and the object 10, can be prevented. Furthermore, dents and / or scratches on portions of the object 10 to be processed can be prevented to reduce the process defect rate, thereby ensuring process stability.

[0077] Furthermore, since the cooling module 130 is configured to face the laser irradiation section 140, the heat generated when the laser 40 irradiated from and subsequently incident on the laser irradiation section 140 is deflected can be cooled to prevent or suppress damage to the object 10 to be processed due to heat.

[0078] Here, multiple (e.g., two) air-floating stages 110 can be provided, and the air-floating stages are respectively disposed on both sides of the cooling module 130 in the first axial direction. For example, the air-floating stage 110 can be composed of a first air-floating stage 110a and a second air-floating stage 110b. Here, the first air-floating stage 110a can be disposed on one side of the cooling module 130 in the first axial direction, and the second air-floating stage 110b can be disposed on the other side of the cooling module 130 in the first axial direction. Here, the air-floating stage 110 can be disposed on one side of the cooling module 130 in the first axial direction to limit a portion of the object 10 to be processed in the first axial direction, the portion of which leaves the air-floating stage 110 when the object 10 to be processed is transferred to the cooling module 130, so that the laser 40 can irradiate the object 10 to be processed. Furthermore, while the object 10 to be processed is held at a predetermined (specific) distance from the surface of the air-bearing platform 110 and is not tilted (flat) on the cooling module 130 which does not provide, for example, buoyancy (or levitation) from gas ejection, the laser 40 can scan the entire length of the object 10 to be processed in the first axial direction.

[0079] In the laser processing apparatus 100 according to an exemplary embodiment, an air-bearing stage 110 may be disposed on both sides of a cooling module 130 in a first axial direction, such that the object to be processed 10 passes through the cooling module 130, while maintaining the distance between the surface of the air-bearing stage 110 and the object to be processed at a predetermined (specific) interval, so as to stably scan the entire length of the object to be processed 10 in the first axial direction using a laser 40.

[0080] Multiple air-bearing platforms 110 may be symmetrical to each other with respect to the cooling module 130. That is, the first air-bearing platform 110a and the second air-bearing platform 110b may be symmetrical to each other with respect to the cooling module 130 and may be respectively disposed on both sides of the cooling module 130 in the first axial direction. Therefore, when the distance between the surface of the air-bearing platform 110 and the object 10 to be processed is maintained at a constant interval, the object 10 to be processed can pass through the cooling module 130 to stably scan the entire length of the object 10 to be processed in the first axial direction by using the laser 40, and in addition, the entire length of the object 10 to be processed in the first axial direction can be scanned in two directions (reciprocating) by using the laser 40 via the air-bearing platforms 110 (i.e., the first air-bearing platform and the second air-bearing platform) that are symmetrical to each other with respect to the cooling module 130.

[0081] For example, the air flotation platform 110 may include a purge port 111 for ejecting gas and a suction port 112 for providing suction force through exhaust. The purge port 111 can eject gas and provide buoyancy (or levitation) to make the object 10 to be treated float (or suspend). Therefore, the object 10 to be treated can float and be supported by floating on the air flotation platform 110. For example, multiple purge ports 111 may be provided, and the multiple purge ports 111 may be connected (or communicated) to each other via a gas supply line 111b. Therefore, gas can be distributed to be supplied from a gas supply source (not shown) to multiple purge ports 111.

[0082] The suction port 112 can provide suction force to create a vacuum through exhaust. For example, the suction port 112 can be connected to a vacuum pump to create a vacuum. Here, multiple suction ports 112 can be provided, and the suction ports are then connected (or communicated) with each other through exhaust lines (not shown). Thus, a vacuum can be generated in multiple suction ports 112 by a single vacuum pump (not shown). Thus, a suction force can be generated to produce an attraction force that pulls the object 10 to be processed, and thus the object 10 to be processed can be spaced apart from the surface of the air-floating platform 110 to maintain a constant height. In addition, the gas ejected from the purge ports 111 can be smoothly discharged (or released) without stagnating between the air-floating platform 110 and the object 10 to be processed.

[0083] When only the purge port 111 is present and the suction port 112 is absent, the gas ejected from the purge port 111 can be discharged (or expelled) to the outside of the air-float platform 110 and the object 10 to be processed. Therefore, the gas may not be discharged smoothly between the air-float platform 110 and the object 10 to be processed. For this reason, although the gas is discharged to a certain extent in the edge regions of the air-float platform 110 and the object 10 to be processed near the periphery, the gas (discharge) can stagnate on the air-float platform 110 far from the periphery, and the central region of the object 10 to be processed becomes warped due to the bulge (e.g., air pocket) in the central region. That is, the gas discharge capacity can vary with distance from the periphery, and therefore, the gas density gradient can vary for each region (e.g., edge region and central region) between the air-float platform 110 and the object 10 to be processed. Thus, it can be recessed in regions with relatively low gas density (e.g., edge regions) and bulge in regions with relatively high gas density (e.g., central regions).

[0084] However, in the laser processing apparatus 100 according to an exemplary embodiment, the air-floating stage 110 may include a suction port 112 and a purge port 111, through which gas is discharged and through which gas is ejected. Therefore, a uniform gradient of gas density can be achieved between the air-floating stage 110 and the object 10 to be processed, thereby suppressing or preventing warping of the object 10.

[0085] When only the suction port 112 is present and there is no purge port 111, the object 10 to be treated can be adsorbed and supported, and therefore, the object 10 to be treated may inevitably come into contact with the surface of the air flotation platform 110. As a result, damage to dents and stretching may occur in a portion of the object 10 to be treated (e.g., a thin film encapsulation (TFE) layer or a protective film layer).

[0086] Figure 2 A conceptual diagram illustrating the first and second regions of the air-floating platform according to an exemplary embodiment.

[0087] refer to Figure 2 The air-float platform 110 may include a first region 115a and a second region 115b, which differ in the number of at least one of the purge holes 111 or the suction holes 112. The number of at least one of the purge holes 111 or the suction holes 112 may differ in the first region 115a and the second region 115b. Furthermore, the first region 115a and the second region 115b may be classified according to their distance from the cooling module 130 (in the first axial direction).

[0088] For example, a location close to the cooling module 130 (in the first axial direction) can be defined as a first region 115a. Thus, the object 10 to be processed can float precisely at a location close to the location where the laser 40 is irradiated to perform the processing, making the object 10 flat. Therefore, precise (and / or uniform) laser processing can be performed on the object 10. Furthermore, a location far from the cooling module 130 (in the first axial direction) can be defined as a second region 115b. Thus, since the laser processing has (almost) no effect on locations far from the location where the laser 40 is irradiated to perform the processing, the object 10 to be processed can float for rapid transport in the first axial direction.

[0089] Here, the first region 115a may be closer to the cooling module 130 than the second region 115b and may have a first number of purge holes 111, while the second region 115b may have a second number of purge holes 111, less than the first number. The first region 115a may be closer to the cooling module 130 than the second region 115b and may be in contact with the cooling module 130. That is, the first region 115a may be a precise segment (or area) or processing area (or section) on which the object to be processed 10 is precisely floated to perform precise (and / or uniform) laser processing on the object to be processed 10. In this case, the first region 115a may have a first number of purge holes 111 and may have a large number (or multiple) of purge holes 111 for precisely floating the object to be processed 10. Therefore, the floating of the object to be processed 10 can be precisely controlled.

[0090] The second region 115b may have a second number of purge holes 111, less than the first number, and may be spaced apart from the cooling module 130 compared to the first region 115a. For example, the second region 115b may be a conveying section (or area) or a non-processing area (or section) for buoying the object 10 to be processed so as to rapidly convey the object 10 to be processed (or convey it to the first region) in the first axial direction. Here, since the second region 115b is sufficient to buoy the object 10 to be processed, a small number (or few) of purge holes 111 may be provided. In this case, the second region 115b can maintain the suspension (or floating) of the object 10 to be processed using a small number of purge holes 111, and therefore, the object 10 to be processed can move rapidly in the first axial direction while floating.

[0091] In other words, the air-floating platform 110 can be divided into a first region 115a and a second region 115b according to the distance of the cooling module 130 in the first axial direction. The first region 115a may be another region (or one) that is close to the cooling module 130 in the first axial direction, and the second region 115b may be another region (or one) that is far away from the cooling module 130 in the first axial direction.

[0092] Here, the first air-bearing stage 110a and the second air-bearing stage 110b (i.e., a plurality of air-bearing stages) can be symmetrical to each other relative to the cooling module 130. Therefore, the first air-bearing stage 110a can be a first region 115a, which is another region close to the cooling module 130 in the first axial direction, and a region far from the cooling module 130 in the first axial direction can be a second region 115b. Similarly, in the second air-bearing stage 110b, a region close to the cooling module 130 in the first axial direction can be the first region 115a, and a region far from the cooling module 130 in the first axial direction can be the second region 115b. Therefore, the first region 115a, as a precise segment, can be provided around the cooling module 130 (i.e., both sides of the cooling module in the first axial direction), and thus, precise laser processing can be performed on the object 10 to be processed.

[0093] Here, in the first region 115a, the purge hole 111 and the suction hole 112 can be arranged alternately. For example, in the first region 115a, the purge hole 111 and the suction hole 112 can be arranged alternately in a first axial direction, and the purge hole 111 and the suction hole 112 can be arranged alternately in a second axial direction intersecting the first axial direction. Furthermore, the purge hole 111 and the suction hole 112 can be arranged alternately in both the first and second axial directions. In this case, to achieve a high flatness of the object 10 to be processed, the purge hole 111 and the suction hole 112 can be arranged alternately in both the first and second axial directions.

[0094] Therefore, the purge holes 111 and suction holes 112 are uniformly (or evenly) distributed in the first region 115a (for each region) to form a gas flow ejected from the purge holes 111, and thus the gas density gradient in each region (or overall) can be uniform between the air-floating platform 110 and the object 10 to be processed. Therefore, warping of the object 10 to be processed can be more effectively suppressed or prevented.

[0095] Furthermore, the number of suction holes 112 on the second region 115b may be less than the number of purge holes 111. Here, in the second region 115b, the number of suction holes 112 may be less than the second number, and additionally, there may be no suction holes 112. Since the second region 115b is a non-processed region on which no basic processing is performed, the object 10 to be processed may only need to be conveyed rapidly in the first axial direction, and therefore, it is sufficient if the object 10 to be processed floats through the purge holes 111. Here, if there are no suction holes 112 at all, warping of the object 10 to be processed may occur, damaging the object 10 to be processed. For this reason, in order to suppress (or minimize) warping of the object 10 to be processed so as to avoid damage to the object 10 to be processed, the second region 115b may have at least one suction hole with fewer than the second number of suction holes 112.

[0096] Figure 3 A schematic cross-sectional view is provided to illustrate the recessed portions surrounding the purge and suction holes according to an exemplary embodiment. Figure 3 (a) shows a recessed portion surrounding the purge hole, and Figure 3 (b) shows the recessed portion surrounding the suction hole.

[0097] refer to Figure 3 The first region 115a may include recessed portions 111a and 112a having a purge hole 111 or a suction hole 112 formed therein. Either the purge hole 111 or the suction hole 112 may be formed in the recessed portions 111a and 112a. For example, the recessed portions 111a and 112a may be defined in the bottom surface and sidewall to communicate with the purge hole 111 or the suction hole 112 formed in the bottom surface, and therefore, the recessed portions 111a and 112a may be provided around at least one of the purge hole 111 or the suction hole. That is, the purge hole 111 can be formed in the recessed portion 111a, such that the recessed portion 111a is provided (or formed) around the purge hole 111 in the first region 115a, or the suction hole 112 can be formed in the recessed portion 112a, such that the recessed portion 112a is provided around the suction hole in the first region 115a. Furthermore, the recessed portions 111a and 112a can be provided around the purge hole 111 and the suction hole 112 in the first region 115a. Here, the suction hole 112 can be formed in the recessed portion 112a, such that the recessed portion 112a is provided around at least one suction hole 112 in the first region 115a.

[0098] In the recessed portion 112a surrounding the suction hole 112 of the first region 115a, the suction force may not be concentrated on a single location corresponding to the suction hole 112 (or disposed within the suction hole), but rather dispersed over a wide region (or portion) corresponding to the width (or surface area) of the recessed portion 112a. Therefore, the height difference between the portion corresponding to the suction hole 112 and other portions (or not said portions) can be suppressed or minimized. When there is no recessed portion 112a surrounding the suction hole 112 of the first region 115a, the suction force may be concentrated on a portion of the object 10 to be processed corresponding to the suction hole 112, and thus, the height of the portion corresponding to the suction hole 112 is lower than the height of the other portion, causing a height deviation between the portion corresponding to the suction hole 112 and the other portion. Specifically, the height deviation at the portion corresponding to the suction hole 112 is greater than the height deviation at the portion corresponding to the purge hole 111 (or disposed within the purge hole). However, when a recessed portion 112a is provided around the suction hole 112 of the first region 115a, the suction force can be distributed to the wider portion (or region) corresponding to the recessed portion 112a. Therefore, the height deviation between the portion corresponding to the suction hole 112 and another portion can be suppressed or minimized.

[0099] The purge hole 111 can extend to a wide region (or portion), while gas is ejected from a location with higher pressure in a narrow (cross-sectional) region to a location with lower pressure in a wide (cross-sectional) region. Therefore, a recessed portion 111a may not be required around the purge hole 111 in the first region 115a. However, the width (or surface area) through which the gas spreads can be controlled to minimize the height deviation between the portion corresponding to the purge hole 111 (or disposed within the purge hole) and another portion. Furthermore, the recessed portion 111a surrounding the purge hole 111 in the first region 115a can form a gas flow (or ejection direction) that may (or to a maximum extent) be perpendicular to the portion (or region) corresponding to the recessed portion 111a. Generally, the ejection direction (or flow) or discharge angle of the gas can vary for each location as it ejects from a narrow location to a wide location. Depending on the difference between the gas ejection direction and the vertical (ejection) angle of the gas, a height deviation may occur at each location of the object 10 to be processed. However, when a recessed portion 111a is provided around the purge hole 111 of the first region 115a, the gas can diffuse extensively within the recessed portion 111a to correspond to the recessed portion 111a. Therefore, a vertical flow of gas can be generated in the wide portion (or surface area) corresponding to the recessed portion 111a.

[0100] By providing recessed portions 112a around the suction hole 112 of the first region 115a and / or recessed portions 111a around the purge hole 111 of the first region 115a, the object 10 to be processed floats more flatly, which can suppress or minimize the height deviation between the portion corresponding to the suction hole 112 and / or the portion corresponding to the purge hole 111 and another portion. Therefore, more precise laser processing can be performed.

[0101] The recessed portions 111a and 112a may also be provided in the suction hole 112 and / or the purge hole 111 of the second region 115b, but in the second region 115b, the (extremely) flat (or precise) floating of the object 10 to be processed is not required. Therefore, the recessed portions 111a and 112a may not be provided in the suction hole 112 and / or the purge hole 111 of the second region 115b.

[0102] Here, the recessed portions 111a and 112a may extend in a second axial direction intersecting the first axial direction, and the length in the second axial direction may be greater than the width (or length) in the first axial direction. The laser 40 may be a line beam extending in the second axial direction. In this case, the object 10 to be processed may be supported flatly along the extension direction of the laser 40, so that the portion (or area) simultaneously irradiated by the line beam laser 40 can be uniformly processed by the laser 40. When the recessed portions 111a and 112a extend in the second axial direction such that the length in the second axial direction is greater than the width in the first axial direction, the suction force may be dispersed (or distributed) in the recessed portions 111a and 112a along the extension direction of the recessed portions 111a and 112a to suppress or minimize the height deviation in the second axial direction between the portion corresponding to the suction hole 112 and another portion and / or the portion corresponding to the purge hole 111 and another portion. Thus, the portion of the object 10 to be processed can be supported flatly while being simultaneously irradiated (emitted) by the linear beam laser 40, and therefore, the portion simultaneously irradiated by the linear beam laser 40 can be uniformly processed by the laser 40.

[0103] Therefore, in the laser processing apparatus 100 according to the exemplary embodiment, the air-floating stage 110 can be divided into a first region 115a with a relatively large number of purge holes 111 and a second region 115b with a relatively small number of purge holes 111. Thus, in the first region 115a, adjacent to the irradiated laser 40 (or cooling module), the floating height and degree of floating can be maintained to perform precise laser processing. Furthermore, in the second region 115b, away from the irradiated laser 40, the movement speed of the object 10 to be processed can be improved. Therefore, precise laser processing can be stably ensured in the first region 115a, and thus, production in the second region 115a can be increased by the improved movement speed.

[0104] Here, the length (or width) of the cooling module 130 in the first axial direction may be less than the length (or width) of the air-floating platform 110 in the first axial direction. When the length of the cooling module 130 in the first axial direction is greater than or equal to the length of the air-floating platform 110 in the first axial direction, the object 10 to be processed may be conveyed through the cooling module 130 (or the area corresponding to the cooling module), thereby causing a portion not floated (or supported) by the air-floating platform 110 (or a portion not supported by the first and second air-floating platforms) to be greater than half the size of the object 10 to be processed. In this case, laser 40 may be irradiated to perform laser processing, causing the object 10 to be processed to tilt, and thus, the object 10 to be processed may conflict with, for example, other components of the cooling module 130 or may not be conveyed.

[0105] Here, the length of the cooling module 130 in the first axial direction may be less than the length of the object 10 to be processed in the first axial direction. When the length of the cooling module 130 in the first axial direction is greater than or equal to the length of the object 10 to be processed in the first axial direction, the entire object 10 to be processed may not be supported (or float) by the air-floating platform 110. In this case, the object 10 to be processed may tilt or descend (or fall) onto the cooling module 130, and may not need to be conveyed. Here, the length of the cooling module 130 in the first axial direction may be less than the length of the first region 115a in the first axial direction. When the length of the cooling module 130 in the first axial direction is equal to or greater than the length of the first region 115a in the first axial direction, more than half of the object 10 to be processed may not float (or be supported) flatly. For this reason, the flatness of the object 10 to be processed may be reduced, and the accuracy of laser processing relative to the object 10 to be processed may be reduced.

[0106] For example, the length of the cooling module 130 in the first axial direction may be approximately 5 mm to approximately 15 mm. When the length of the cooling module 130 in the first axial direction is less than approximately 5 mm, the heat generated during laser processing may not be effectively cooled. For this reason, since the length of the cooling module 130 in the first axial direction is less than the width (or length) of the laser 40 in the first axial direction, it may not effectively remove (absorb) the laser 40 irradiated from the laser irradiation portion 140 to leave (or pass through) the object 10 to be processed.

[0107] On the other hand, when the length of the cooling module 130 in the first axial direction is greater than approximately 15 mm, the length of the cooling module 130 in the first axial direction may be equal to or greater than the length of the first region 115a in the first axial direction, and more than half of the object 10 to be processed may not float flat. For this reason, the flatness of the object 10 to be processed may be reduced, and the accuracy of laser processing relative to the object 10 to be processed may be reduced.

[0108] Figure 4 To illustrate a schematic diagram of a cooling module according to an exemplary embodiment, Figure 4 (a) is a schematic cross-sectional view of the cooling module, and Figure 4 (b) is a schematic plan (or top view) of the cooling module.

[0109] refer to Figure 4 The cooling module 130 may include: a first cooling portion 131 having a non-uniform surface (or a recessed-protruding surface) on a first surface, onto which laser 40 irradiated from laser irradiation portion 140 is incident; and a second cooling portion 132 made of a material different from that of the first cooling portion 131 and disposed on a second surface of the first cooling portion 131 facing the first surface. The first cooling portion 131 may have a non-uniform surface on the first surface (on which laser 40 irradiated from laser irradiation portion 140 is incident), and may deflect and / or absorb the incident laser 40 to remove it. The non-uniform surface may diffusely reflect and / or scatter the incident laser 40, and may deflect and / or absorb the laser 40 through diffuse reflection and / or scattering.

[0110] For example, the non-uniform surface may be defined by a groove extending in the second axial direction. The laser 40 may penetrate into the groove or be diffusely reflected within the groove, thereby deflecting or absorbing the laser 40. The groove may extend in the first axial direction, but may extend along the direction of extension of the laser 40.

[0111] Here, the first cooling section 131 may be made of aluminum (Al) or an aluminum alloy, and therefore, the non-uniform surface can be easily handled, the thermal reaction may be small (or the heat resistance is high), and the laser 40 can be effectively reflected and / or absorbed. In addition, since aluminum (Al) has excellent thermal conductivity, heat from the first cooling section 131 can move (or be conducted) rapidly to the second cooling section 132.

[0112] The second cooling portion 132 may be made of a different material than the first cooling portion 131 and may be disposed on a second surface of the first cooling portion 131 facing the first surface. The second cooling portion 132 may contact the first cooling portion 131 to cool the heat generated in the first cooling portion 131 by the deflection (or absorption) of the laser 40. For example, the second cooling portion 132 may be made of steel or stainless steel to effectively dissipate the heat generated in the first cooling portion 131 by deflecting the laser 40.

[0113] In this configuration, the first cooling section 131 and the second cooling section 132 may have different thermal conductivity (or thermal conductivity). For example, the thermal conductivity of the first cooling section 131 may be higher than that of the second cooling section 132, and heat can be rapidly transferred from the portion that directly generates heat in the first cooling section 131 to the second cooling section 132, and then transferred (or conducted) to the second cooling section 132. Therefore, the heat generated by the deflection of the laser 40 in the first cooling section 131 can be effectively cooled.

[0114] Furthermore, the materials of the first cooling section 131 and the second cooling section 132 may have different heat resistance and / or processability. For example, the material of the first cooling section 131 may have better heat resistance than the material of the second cooling section 132, and the material of the first cooling section 131 may have greater processability than the material of the second cooling section 132.

[0115] The first cooling section 131 may have a first cooling channel 131a, and the second cooling section 132 may have a second cooling channel 131b, wherein the number of second cooling channels 131b is greater than the number of first cooling channels 131a. The first cooling section 131 may have a first cooling channel 131a that directly cools the heat generated by the deflection of the laser 40.

[0116] Furthermore, the number of second cooling channels 131b in the second cooling section 132 can be greater than the number of first cooling channels 131a, to effectively cool the heat generated in the first cooling section 131 by the deflection of the laser 40. The number of second cooling channels 131b can be greater than the number of first cooling channels 131a. Therefore, the temperature of the second cooling section 132 can be lower than the temperature of the first cooling section 131, and thus, heat flowing from the high temperature to the low temperature can flow from the first cooling section 131 to the second cooling section 132, effectively dissipating heat along with the cooling in the second cooling section 132.

[0117] The cooling module 130 may further include a light-transmitting plate 133 disposed on a first surface of the first cooling section 131. The light-transmitting plate 133 may be disposed on the first surface of the first cooling section 131 to prevent airflow (between the gaps) from occurring on the cooling module 130. The light-transmitting plate 133 may be made of quartz and may block airflow as it passes through the laser 40. Abnormal airflow may occur on the cooling module 130 due to heat generated by the laser 40 (e.g., deflection and / or absorption), and therefore this may affect the transport of the object 10 to be processed, for example, by causing it to shake. Furthermore, abnormal airflow may occur due to the non-uniform surface (e.g., grooves) when the non-uniform surface of the first cooling section 131 is exposed to the cooling module 130 without the light-transmitting plate 133. This can be prevented by the light-transmitting plate 133.

[0118] Figure 5 A conceptual diagram for explaining the rotating portion according to an exemplary embodiment, Figure 5 (a) shows the process in the positive direction. Figure 5 (b) shows the process in the reverse direction, and Figure 5 (c) shows a linear process.

[0119] refer to Figure 5 The laser irradiation section 140 can irradiate a laser 40 having a length in a second axial direction intersecting the first axial direction, the length of which is less than the length of the object 10 to be processed in the second axial direction. The laser 40 can be a line beam and can extend in the second axial direction. Here, the length of the laser 40 in the second axial direction can be less than the length of the object 10 to be processed in the second axial direction. In this case, laser processing (or laser scanning) can be performed by dividing a portion (or region) of the object 10 to be processed.

[0120] The laser processing apparatus 100 may further include a rotating portion 160 for rotating the object 10 to be processed on at least one of a plurality of air-floating platforms 110a or 110b.

[0121] The rotating portion 160 allows the object 10 to be processed to be rotated on at least one of the plurality of air-bearing platforms 110a or 110b, and a portion of the object 10 to be processed can be laser-processed or scanned, and then the object 10 to be processed can be rotated to laser-process the remaining portion of the object 10 to be processed.

[0122] For example, in a processing chamber 150, half 10a of the object 10 to be processed is (firstly) scanned by laser 40 to perform laser processing, and then the object 10 to be processed is rotatable to (secondarily) scan the remaining half 10b of the object 10 to be processed by laser 40 to perform laser processing on the remaining half 10b of the object 10 to be processed. Here, the laser processing can be performed during the forward process of performing the scan using laser 40, while the object 10 to be processed is only transferred from the first air-bearing stage 110a to the second air-bearing stage 110b. Alternatively, the laser processing can be performed during the reverse process of performing the scan using laser 40, while the object 10 to be processed reciprocates between the first air-bearing stage 110a and the second air-bearing stage 110b. Loading stage 151a and unloading stage 151b can be added to the front and rear ends of processing chamber 150 (on both sides of the laser processing device in the first axial direction) to perform a linear process, wherein scanning during laser 40 is performed only from air-bearing stage 110a to second air-bearing stage 110b, while the object to be processed 10 is transferred from loading stage 151a to unloading stage 151b.

[0123] Here, during the forward and linear processes, the remaining half 10b of the object 10 to be processed can return (move) from the second air-bearing platform 110b to the first air-bearing platform to (secondarily) scan the remaining half 10b of the object 10 to be processed. Here, after the object 10 to be processed is rotated on the second air-bearing platform 110b, the object 10 to be processed can return to the first air-bearing platform 110a again, or after returning from the second air-bearing platform 110b to the first air-bearing platform 110a again, the object 10 to be processed can rotate again on the first air-bearing platform 110a.

[0124] In the reverse process, when a first scan using laser 40 is performed from the first air-bearing stage 110a to the second air-bearing stage 110b, the object 10 to be processed can be rotated on the second air-bearing stage 110b to perform a second scan, while the object 10 to be processed is transferred to the first air-bearing stage 110a. On the other hand, when a first scan using laser 40 is performed from the second air-bearing stage 110b to the first air-bearing stage 110a, the object 10 to be processed can be rotated on the first air-bearing stage 110a to perform a second scan, while the object 10 to be processed is transferred to the second air-bearing stage 110b.

[0125] Since laser processing is performed by dividing the object 10 to be processed via the rotating portion 160, the object 10 to be processed can be appropriately matched according to its size.

[0126] Therefore, the laser processing apparatus 100 according to an exemplary embodiment may include a rotating portion 160 for rotating the object 10 to be processed on at least one of a plurality of air-bearing stages 110, either air-bearing stage 110a or air-bearing stage 110b, to scan a portion of the object 10 to be processed using a laser 40 via the rotation of the object 10 to be processed. Thus, the laser processing apparatus 100 can perform forward processes, backward processes, and scalable linear processes within a processing chamber 150.

[0127] Figure 6 A schematic perspective view illustrating the fixed support portion according to an exemplary embodiment.

[0128] refer to Figure 6 The conveying section 120 may include a fixed support section 121 for fixing and supporting the object 10 to be processed when floating on the air-floating platform 110. The fixed support section 121 can fix and support the object 10 to be processed in a floating state on the air-floating platform 110, and can be moved (linearly) in a first axial direction by a drive, and fix and support the object 10 to be processed so as to move linearly by a drive.

[0129] For example, the fixed support portion 121 can contact the object 10 to be processed to fix and support the object 10, and adsorb and fix (or support) the object 10, or clamp the object 10 by holding and supporting it. The fixed support portion 121 can be connected to a movable body 123, which can move along a track 122 extending in a first axial direction to move in the first axial direction according to the movement of the movable body 123. Here, in the state where the fixed and supported object 10 floats on the air flotation platform 110 and moves in the first axial direction due to the movement of the movable body 123, the fixed support portion 121 can cause the object 10 to move linearly in the first axial direction.

[0130] In this configuration, the fixed support portion 121 can support the edge (partial) of the object 10 to be processed. Thus, when the length of the laser 40 in the second axial direction is less than the length of the object 10 to be processed in the second axial direction, the portion (or area) supported by the fixed support portion 121 can be secured. Furthermore, the object 10 to be processed can move linearly in the first axial direction without the fixed support portion 121 interfering with the laser 40.

[0131] As described above, in the exemplary embodiment, laser processing can be performed on the object to be processed while the object is floating and conveyed through the air-floating stage. This prevents dents and scratches on a portion of the object that inevitably occur during transport due to contact between the stage and the object, as is common in the prior art. Furthermore, dents and / or scratches on portions of the object are prevented, reducing the process defect rate and thus ensuring process stability. Additionally, since the cooling module is positioned facing the laser irradiation section, heat generated when deflecting the laser beam irradiated from and subsequently incident on the laser irradiation section can be cooled to prevent or suppress damage to the object due to heat. Moreover, since the air-floating stage includes not only purge holes (through which gas is ejected) but also suction holes (through which exhaust is performed), a uniform gas density gradient between the air-floating stage and the object to be processed can be achieved to suppress or prevent warping of the object. Furthermore, the air-floating stage can be divided into a first region with a relatively large number of purge holes and a second region with a relatively small number of purge holes to perform precise laser processing, while maintaining the floating height and degree of floating in the first region adjacent to the irradiated laser area, and improving the movement speed of the object to be processed in the second region far from the irradiated laser area. Therefore, precise laser processing can be stably ensured in the first region, and production in the second region can be increased by improving the movement speed. A rotating portion can be provided on at least one of a plurality of air-floating stages to rotate the object to be processed, thereby providing the laser processing apparatus in a scalable manner (e.g., forward and backward directions and linear processes) by rotating the portion of the object to be processed relative to the laser scanning of the portion of the object to be processed.

[0132] The term “~on…” as used in the above description includes both direct and indirect contact at positions relative to the upper and lower portions. It is also possible to locate not only the entire top or bottom surface, but also portions of the top or bottom surface, and this is used to indicate that it is in position relative to or in direct contact with the top or bottom surface.

[0133] The laser processing apparatus according to the embodiment can perform laser processing on an object to be processed while it is floating and transported through an air-floating table. Therefore, in the prior art, dents or scratches on portions of the object to be processed (e.g., thin-film encapsulation (TFE) layers or protective film layers) that inevitably occur during transport due to contact between the table and the object can be prevented. Furthermore, dents and / or scratches on portions of the object to be processed can be prevented to reduce the process defect rate, thereby ensuring process stability.

[0134] Furthermore, since the cooling module is configured to face the laser irradiation section, the heat generated when the laser irradiating from and subsequently incident on the laser irradiation section is deflected can be cooled to prevent or suppress damage to the object to be processed due to heat.

[0135] Furthermore, since the air flotation platform includes not only a purge port (through which gas is ejected) but also a suction port (through which exhaust is performed), a uniform gas density gradient can be achieved between the air flotation platform and the object to be treated, thereby suppressing or preventing warping of the object to be treated.

[0136] Furthermore, the air-floating platform can be divided into a first region with a relatively large number of purge holes and a second region with a relatively small number of purge holes to perform a precise laser processing procedure. This allows for maintaining the floating height and degree of buoyancy in the first region, adjacent to the irradiated laser area (or cooling module), while improving the movement speed of the workpiece in the second region, which is farther from the irradiated laser area. Therefore, precise laser processing can be stably ensured in the first region, and increased production in the second region can be achieved by improving the movement speed.

[0137] A rotating portion may be provided on at least one of a plurality of air-bearing platforms to rotate an object to be processed, thereby providing a laser processing apparatus in a scalable manner (e.g., forward and backward directions and linear processes) by means of the rotation of the object to be processed relative to a portion of the laser scanning of the object to be processed.

[0138] Although the embodiments have been described with reference to several illustrative examples, the embodiments are not limited to the foregoing embodiments, and therefore it should be understood that numerous other modifications and embodiments falling within the spirit and scope of the principles of this disclosure can be devised by those skilled in the art. Therefore, the actual scope of protection of the invention will be determined by the technical scope of the appended claims.

Claims

1. A laser processing device, comprising: An air flotation platform, configured to allow the object to be processed to float; The conveying section is configured to convey the object to be processed on the air-bearing platform in a first axial direction; A cooling module is disposed on one side of both sides of the air-floating platform in the first axial direction; as well as The laser irradiation section is located above the cooling module. The cooling module includes: The first cooling section has a non-uniform surface on the first surface, and the laser irradiated from the laser irradiation section is incident on the first surface; The second cooling section is made of a different material than the first cooling section and is disposed on a second surface facing the first surface of the first cooling section; and A light-transmitting plate is disposed on the non-uniform surface of the first cooling section.

2. The laser processing equipment according to claim 1, wherein a plurality of air-floating platforms are provided, and the air-floating platforms are respectively disposed on both sides of the cooling module in the first axial direction.

3. The laser processing apparatus according to claim 2, wherein the plurality of air-floating platforms are symmetrical to each other relative to the cooling module.

4. The laser processing apparatus according to claim 1, wherein the air-floating stage comprises: The purge port is configured to eject gas. as well as The suction port is configured to provide suction force through exhaust.

5. The laser processing apparatus according to claim 4, wherein the air-floating stage includes a first region and a second region that differ from each other in the number of at least one of the purge holes and the suction holes.

6. The laser processing apparatus according to claim 5, wherein the first region is relatively adjacent to the cooling module compared to the second region, and has a first number of purge holes, and The second region has a second number of purge holes, which is less than the first number.

7. The laser processing apparatus according to claim 5, wherein in the first region, the purge port and the suction port are alternately arranged.

8. The laser processing apparatus according to claim 5, wherein in the second region, the number of suction holes is less than the number of purge holes.

9. The laser processing apparatus according to claim 5, wherein the first region includes a recessed portion having the purge hole or the suction hole formed therein.

10. The laser processing apparatus of claim 9, wherein the recessed portion extends in a second axial direction intersecting the first axial direction.

11. The laser processing apparatus according to claim 1, wherein the length of the cooling module in the first axial direction is less than the length of the air-bearing platform in the first axial direction.

12. The laser processing apparatus of claim 2, further comprising a rotating portion configured to rotate the object to be processed on at least one of the plurality of air-floating platforms. The laser irradiation portion is configured to irradiate a laser having a length in a second axial direction intersecting the first axial direction, the length being less than the length of the object to be processed in the second axial direction.

13. The laser processing apparatus of claim 1, wherein the conveying section includes a fixed support section configured to fix and support the object to be processed in a floating state on the air-bearing platform.

14. The laser processing apparatus according to claim 1, wherein the first cooling section has a first cooling channel, and The second cooling section has a second cooling channel, and the number of the second cooling channel is greater than the number of the first cooling channel.

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