An optical module

Abstract

The optical module provided by the application has the following technical effects: the end of the optical transceiver cavity is provided with an opening, one end of the circuit board extends into the inner cavity of the optical transceiver cavity from the opening; the optical transmitter, the optical receiver and the optical assembly are arranged in the inner cavity of the optical transceiver cavity, and the optical assembly comprises a displacement prism and a reflection prism. The optical transmitter comprises an optical transmitter chip, and the optical receiver comprises an optical receiver chip; the height of the light-sensitive surface of the optical receiver chip is less than 1 mm different from the height of the light-emitting optical axis of the optical transmitter chip. The displacement prism is arranged on the transmission light path of the optical signal to be received by the optical receiver chip, and is used for adjusting the transmission height of the optical signal; the reflection surface of the reflection prism is arranged above the optical receiver chip, and is used for reflecting the optical signal to be received to the optical receiver chip. In the optical module provided by the application, when the height of the light-sensitive surface of the optical receiver chip is less than the height of the light-emitting optical axis of the optical transmitter chip, the optical receiver chip can still normally receive the optical signal.

Description

Technical Field

[0001] This application relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new services and application models such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, the optical module is the tool for converting between photoelectric signals and signals, and it is one of the key components in optical communication equipment. Furthermore, with the development of optical communication technology, the transmission rate of optical modules is constantly increasing. At the same time, with the development of optical modules, their internal structures are becoming increasingly sophisticated to facilitate their use and manufacturing. Summary of the Invention

[0003] This application provides an optical module with a novel structure, which enables the optical receiver chip to receive optical signals normally even when the height of the photosensitive surface of the optical receiver chip and the height of the optical axis of the optical emitter chip are located in the same cavity and the difference between them is small.

[0004] This application provides an optical module, comprising:

[0005] Circuit board;

[0006] Optical transceiver assembly, used to generate optical signals and receive optical signals from outside the optical module;

[0007] An optical fiber assembly that connects the optical port of the optical module to the optical transceiver assembly;

[0008] The optical transceiver component includes:

[0009] An optical transceiver cavity has an adapter mounting hole at one end for connecting the optical fiber assembly, and an opening at the other end that connects to the inner cavity of the optical transceiver cavity. One end of a circuit board extends into the inner cavity through the opening. A partition is provided inside the inner cavity along the length of the optical transceiver cavity, and along the width of the optical transceiver cavity, the partition divides the inner cavity into a first inner cavity and a second inner cavity. A through hole is provided on the partition that connects the second inner cavity and the second inner cavity.

[0010] A light-emitting device is disposed on the bottom plate of the first inner cavity and electrically connected to the circuit board, including a light-emitting chip;

[0011] A light receiving device is disposed on the top surface of a circuit board extending into the inner cavity and located in the second inner cavity, electrically connected to the circuit board, and includes a light receiving chip. The height of the photosensitive surface of the light receiving chip is less than 1 mm different from the height of the light emitting axis of the light emitting chip.

[0012] An optical component, disposed within the inner cavity of the optical transceiver cavity, includes a displacement prism and a reflecting prism; the displacement prism is disposed on the transmission optical path of the optical signal to be received by the optical receiving chip, and is used to adjust the transmission height of the optical signal transmission optical path in the optical transceiver cavity; the reflecting prism is located above the reflecting surface of the optical receiving chip, and is used to reflect the optical signal to be received back to the optical receiving chip.

[0013] The optical module provided in this application includes an opening at one end of an optical transceiver cavity, with one end of a circuit board extending into the inner cavity of the optical transceiver cavity through the opening. A partition is provided within the optical transceiver cavity, dividing the inner cavity into a first inner cavity and a second inner cavity along its width. An optical emitting device is disposed on the bottom plate of the first inner cavity, and an optical receiving device is disposed on the top surface of the circuit board extending into the inner cavity and located in the second inner cavity. Optical components are disposed within the inner cavity of the optical transceiver cavity, including a displacement prism and a reflection prism. The optical emitting device includes an optical emitting chip, and the optical receiving device includes an optical receiving chip. The height of the photosensitive surface of the optical receiving chip differs from the height of the optical axis emitting light from the optical emitting chip by less than 1 mm. In the optical module provided in this application, the displacement prism is disposed on the transmission optical path of the optical signal to be received by the optical receiving chip, used to adjust the transmission height of the optical signal; the reflective surface of the reflection prism is disposed above the optical receiving chip, used to reflect the optical signal to be received towards the optical receiving chip. Furthermore, the optical module provided in this application offers a novel optical module structure that enables the optical receiver chip to receive optical signals normally even when the height difference between the photosensitive surface of the optical receiver chip and the height of the optical emission axis of the optical transmitter chip within the optical transceiver cavity is small. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0015] Figure 1 This is a connection diagram of an optical communication system according to some embodiments;

[0016] Figure 2 This is a structural diagram of an optical network terminal according to some embodiments;

[0017] Figure 3 This is a schematic diagram of the structure of an optical module according to some embodiments;

[0018] Figure 4An exploded view of an optical module according to some embodiments;

[0019] Figure 5 This is a schematic diagram of the internal structure of an optical module according to some embodiments;

[0020] Figure 6 This is an exploded view of an optical transceiver cavity and circuit board according to some embodiments;

[0021] Figure 7 This is a schematic diagram of the structure of an optical transceiver assembly with its cover opened according to some embodiments;

[0022] Figure 8 This is an exploded view of an optical receiving device and circuit board according to some embodiments. Figure 1 ;

[0023] Figure 9 This is a structural schematic diagram of a cover plate according to some embodiments;

[0024] Figure 10 This is a schematic diagram of a shell structure according to some embodiments. Figure 1 ;

[0025] Figure 11 This is a schematic diagram of the structure of an optical transceiver cavity according to some embodiments;

[0026] Figure 12 This is a schematic diagram of a shell structure according to some embodiments. Figure 2 ;

[0027] Figure 13 A cross-sectional view of a casing according to some embodiments. Figure 1 ;

[0028] Figure 14 A cross-sectional view of a casing according to some embodiments. Figure 2 ;

[0029] Figure 15 This is a usage state diagram provided according to some embodiments;

[0030] Figure 16 A cross-sectional view of a casing in use according to some embodiments. Figure 1 ;

[0031] Figure 17 A cross-sectional view of a casing in use according to some embodiments. Figure 2 ;

[0032] Figure 18 A top view of a tube shell according to some embodiments;

[0033] Figure 19 This is a top view of a casing in use according to some embodiments;

[0034] Figure 20 A cross-sectional view of a casing in use according to some embodiments. Figure 3 ;

[0035] Figure 21 A cross-sectional view of a casing in use according to some embodiments. Figure 4 ;

[0036] Figure 22 This is an exploded view of an optical receiving device and circuit board according to some embodiments. Figure 2 ;

[0037] Figure 23 This is an exploded view of an optical receiving device and circuit board according to some embodiments. Figure 3 . Detailed Implementation

[0038] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0039] In optical communication systems, optical signals carry the information to be transmitted and are transmitted through information transmission equipment such as optical fibers or waveguides to information processing equipment such as computers to complete the information transmission. Because light has passive transmission characteristics when transmitted through optical fibers or waveguides, low-cost, low-loss information transmission can be achieved. However, the signals transmitted by information transmission equipment such as optical fibers or waveguides are optical signals, while the signals that information processing equipment such as computers can recognize and process are electrical signals. Therefore, in order to establish an information connection between information transmission equipment such as optical fibers or waveguides and information processing equipment such as computers, it is necessary to achieve mutual conversion between electrical and optical signals.

[0040] In the field of optical communication technology, optical modules realize the mutual conversion function between optical signals and electrical signals. An optical module includes an optical port and an electrical port. The optical port enables optical communication with information transmission devices such as optical fibers or optical waveguides, while the electrical port enables electrical connection with optical network terminals (e.g., optical modems). The electrical connection is mainly used for power supply, I2C signal transmission, data transmission, and grounding. The optical network terminal transmits electrical signals to information processing devices such as computers via network cables or Wi-Fi.

[0041] Figure 1This is a diagram showing the connection relationships within an optical communication system. (Example:) Figure 1 As shown, the optical communication system includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0042] One end of optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 via optical module 200. Optical fiber itself can support long-distance signal transmission, such as signal transmission over several kilometers (6 to 8 kilometers). Theoretically, unlimited distance transmission can be achieved by using repeaters. Therefore, in typical optical communication systems, the distance between the remote server 1000 and the optical network terminal 100 can typically reach several kilometers, tens of kilometers, or hundreds of kilometers.

[0043] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing device 2000 can be any one or more of the following devices: router, switch, computer, mobile phone, tablet computer, television, etc.

[0044] The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by optical fiber 101 and network cable 103; while the connection between optical fiber 101 and network cable 103 is completed by optical module 200 and optical network terminal 100.

[0045] The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101. The electrical port is configured to connect to the optical network terminal 100, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the optical network terminal 100. The optical module 200 performs mutual conversion between optical and electrical signals, thereby establishing an information connection between the optical fiber 101 and the optical network terminal 100. For example, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and then input to the optical fiber 101. Since the optical module 200 is a tool for mutual conversion between optical and electrical signals and does not have the function of data processing, the information does not change during the above photoelectric conversion process.

[0046] The optical network terminal 100 includes a generally cuboid housing, and an optical module interface 102 and a network cable interface 104 disposed on the housing. The optical module interface 102 is configured to connect to an optical module 200, thereby establishing a bidirectional electrical signal connection between the optical network terminal 100 and the optical module 200; the network cable interface 104 is configured to connect to a network cable 103, thereby establishing a bidirectional electrical signal connection between the optical network terminal 100 and the network cable 103. The optical module 200 and the network cable 103 are connected through the optical network terminal 100. For example, the optical network terminal 100 transmits electrical signals from the optical module 200 to the network cable 103, and vice versa, thus the optical network terminal 100 acts as a host computer for the optical module 200, monitoring its operation. Besides the optical network terminal 100, the host computer for the optical module 200 may also include an optical line terminal (OLT), etc.

[0047] The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing equipment 2000 through optical fiber 101, optical module 200, optical network terminal 100 and network cable 103.

[0048] Figure 2 This is a structural diagram of an optical network terminal. To clearly show the connection relationship between the optical module 200 and the optical network terminal 100... Figure 2 Only the structure of the optical network terminal 100 related to the optical module 200 is shown. For example... Figure 2 As shown, the optical network terminal 100 also includes a circuit board 105 disposed within a housing, a cage 106 disposed on the surface of the circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has protrusions such as fins to increase the heat dissipation area.

[0049] The optical module 200 is inserted into the cage 106 of the optical network terminal 100, where it is secured. Heat generated by the optical module 200 is conducted to the cage 106 and then dissipated through the heat sink 107. After insertion into the cage 106, the optical module 200's electrical port connects to an electrical connector inside the cage 106, establishing a bidirectional electrical signal connection between the optical module 200 and the optical network terminal 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0050] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed inside the shell, and an optical transceiver assembly 209.

[0051] The housing includes an upper housing 201 and a lower housing 202, with the upper housing 201 covering the lower housing 202 to form the aforementioned housing with two openings; the outer contour of the housing is generally square.

[0052] In some embodiments of this disclosure, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0053] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0054] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (Left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200. Opening 204 is an electrical port, through which the gold fingers of circuit board 300 extend and are inserted into a host computer (e.g., optical network terminal 100); opening 205 is an optical port, configured to connect to external optical fiber 101 so that external optical fiber 101 can connect to the optical transceiver assembly 209 inside optical module 200.

[0055] The assembly method using an upper housing 201 and a lower housing 202 facilitates the installation of components such as the circuit board 300 and the optical transceiver assembly 209 into the housing, with the upper housing 201 and lower housing 202 providing encapsulation and protection for these components. Furthermore, the assembly of the circuit board 300 and the optical transceiver assembly 209 facilitates the deployment of positioning components, heat dissipation components, and electromagnetic shielding components, which is beneficial for automated production.

[0056] In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0057] In some embodiments, the optical module 200 further includes an unlocking component 203 located outside its housing, the unlocking component 203 being configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0058] For example, the unlocking component 203 is located on the outer wall of the two lower side plates 2022 of the lower housing 202, and has a locking component that matches the host computer cage (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the host computer cage, the locking component of the unlocking component 203 fixes the optical module 200 in the host computer cage; when the unlocking component 203 is pulled, the locking component of the unlocking component 203 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the locking relationship between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the host computer cage.

[0059] Circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips include, for example, microcontroller units (MCUs), laser driver chips, limiting amplifiers, clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0060] Circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably support the aforementioned electronic components and chips. The rigid circuit board can also be inserted into the electrical connector in the host computer cage.

[0061] The circuit board 300 also includes gold fingers formed on its end surfaces, each gold finger consisting of a plurality of independent pins. The circuit board 300 is inserted into a cage 106 and electrically connected to an electrical connector within the cage 106 by the gold fingers. The gold fingers may be located only on one side of the surface of the circuit board 300 (e.g., ...). Figure 4The gold fingers (shown on the upper surface) can also be placed on the upper and lower surfaces of the circuit board 300 to accommodate applications with a large number of pins. The gold fingers are configured to establish an electrical connection with the host computer to enable power supply, grounding, I2C signal transmission, and data signal transmission.

[0062] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards. For example, flexible circuit boards can be used to connect rigid circuit boards to optical transceiver components.

[0063] In this embodiment, the optical transceiver component 209 is used to generate optical signals and receive optical signals from outside the optical module, thereby realizing the optical signal transmission and reception of the optical module. In some embodiments of this application, to facilitate the transmission of optical signals within the optical module, the optical module also includes an optical fiber assembly. The optical fiber assembly includes an optical fiber adapter 206, an optical fiber 207, and a pigtail adapter 208. One end of the optical fiber 207 is connected to the optical fiber adapter 206, and the other end of the optical fiber 207 is connected to one end of the pigtail adapter 208. The pigtail adapter 208 is optically connected to the optical transceiver component 209. Therefore, the optical signal generated by the optical transceiver component 209 is transmitted through the pigtail adapter 208 to the optical fiber 207, then through the optical fiber 207 to the optical fiber adapter 206, and finally through the optical fiber adapter 206 to the external optical fiber; the optical signal from the external optical fiber is transmitted through the optical fiber adapter 206 to the optical fiber 207, then through the optical fiber 207 to the pigtail adapter 208, and finally through the pigtail adapter 208 to the optical transceiver component 209. In this embodiment, the height of the optical fiber in the pigtail adapter 208 is flush with the height of the top surface of the circuit board 300, so that the optical signal can enter and exit the optical transceiver assembly 209 through the pigtail adapter 208.

[0064] Figure 5 This is a schematic diagram of the internal structure of an optical module according to some embodiments. Figure 6 This is an exploded view of an optical transceiver cavity and circuit board according to some embodiments. Figure 5 and 6 As shown, in some embodiments, the optical transceiver assembly 209 includes an optical transceiver cavity for housing an optical emitting device for generating optical signals, an optical receiving device for receiving optical signals, and optical components for transmitting optical signals. An opening is provided at one end of the optical transceiver cavity, and one end of a circuit board 300 extends into the inner cavity of the optical transceiver cavity through the opening. The surface of the circuit board 300 extending into the inner cavity of the optical transceiver cavity is used to support and electrically connect the devices in the optical emitting and receiving devices. For example, the optical transceiver assembly includes a housing 400 and a cover plate 500, with the cover plate 500 covering and connecting the housing 400 to form an enclosed inner cavity; an opening 410 is provided at one end of the housing 400.

[0065] In some embodiments, a mounting hole 310 is provided on the circuit board 300. The mounting hole 310 is a notch formed at one end of the circuit board 300, and the two or three sides of the mounting hole 310 are circuit boards. For example, as shown... Figure 6 As shown, circuit boards are located on three sides of the mounting hole 310. Specifically, the circuit board 300 forms a first latching area 320, a second latching area 330, and an insertion area 340 at the edge of the mounting hole 310. The first latching area 320, the insertion area 340, and the second latching area 330 are sequentially connected around the mounting hole 310. The first latching area 320 and the second latching area 330 are located on opposite sides of the mounting hole 310 and are used to latch the outer wall of the optical transceiver cavity. The insertion area 340 is used to extend into the optical transceiver cavity. Of course, in this embodiment, circuit boards are provided on both sides of the mounting hole 310, and the mounting hole 310 is located on the side of the circuit board 300. For example, there may be no first latching area 320 on the left side of the mounting hole 310 or no second latching area 330 on the right side of the mounting hole 310.

[0066] In this embodiment, a partition is provided in the optical transceiver cavity to divide the inner cavity of the optical transceiver cavity into a first inner cavity and a second inner cavity along the length of the optical transceiver cavity. An optical emitting device is disposed in the first inner cavity, and an optical receiving device is disposed in the second inner cavity. Thus, the optical signal generated by the optical emitting device is transmitted in the first inner cavity, and the optical signal to be received by the optical receiving device is transmitted in the second inner cavity. This effectively isolates the reflected optical signal from the received optical signal and avoids crosstalk between the reflected optical signal and the received optical signal, which would affect the quality of the optical signal received by the optical receiving device.

[0067] Figure 7 This is a schematic diagram of the structure of an optical transceiver assembly with its cover opened according to some embodiments. Figure 8 This is an exploded view of an optical receiving device and circuit board according to some embodiments. Figure 1 .like Figure 7 and 8 As shown, in some embodiments, a partition 420 is provided inside the housing 400, and the partition 420 is arranged along the length direction of the housing 400, thereby dividing the inner cavity of the housing 400 into a first inner cavity 430 and a second inner cavity 440 along the length direction of the housing 400. The light emitting device 600 is disposed in the first inner cavity 430, and the light receiving device 700 is disposed in the second inner cavity 440.

[0068] In some embodiments of this application, the light emitting device 600 includes an optical emitting chip, a TEC (Electronic Technology Device), and other electrical components. These electrical components are electrically connected to the circuit board 300. The electrical components in the light emitting device 600 can be directly mounted on the base plate of the housing 400 and connected to the circuit board 300 via wire bonding; alternatively, the electrical components or some of the electrical components in the light emitting device 600 can be mounted on the surface of the circuit board 300 extending into the inner cavity of the housing 400.

[0069] In some embodiments of this application, the optical receiver 700 includes an optical receiver chip, a cross-amplifier, and other electrical components, which are electrically connected to the circuit board 300. The electrical components in the optical receiver 700 can be directly disposed on the surface of the circuit board 300 extending into the inner cavity of the housing 400, or the electrical components or some of the electrical components in the optical receiver 700 can be disposed on the base plate of the housing 400.

[0070] To facilitate the transmission of optical signals generated by the optical emitting device 600 and the transmission of optical signals to be received by the optical receiving device 700, an optical assembly 800 is provided in the housing 400. The optical assembly 800 includes lenses, mirrors, filters and other devices. Some of the devices in the optical assembly 800 are located in the first inner cavity 430, and other devices in the optical assembly 800 are located in the second inner cavity 440.

[0071] In this embodiment, an adapter mounting hole is provided on the side wall of the housing 400, which communicates with the inner cavity of the housing 400. A pigtail adapter 208 is disposed within the adapter mounting hole, establishing an optical connection between the housing 400 and the optical fiber 207. For example, the adapter mounting hole communicates with the first inner cavity 430. Alternatively, in this embodiment, the adapter mounting hole can be disposed on one side of the second inner cavity 440, communicating with the second inner cavity 440.

[0072] Figure 9 This is a structural schematic diagram of a cover plate according to some embodiments. Figure 9 As shown, in some embodiments, the cover plate 500 includes a top plate 510 and a fourth side plate 520, one end of the fourth side plate 520 being connected to the other end of the top plate 510, and the top plate 510 and the fourth side plate 520 forming a bent structure.

[0073] Figure 10 This is a schematic diagram of a shell structure according to some embodiments. Figure 1 .like Figure 10 As shown, in some embodiments, the shell 400 includes a base plate 450, a first side plate 460, a second side plate 470, and a third side plate 480. The first side plate 460, the second side plate 470, and the third side plate 480 surround the edge of the base plate 450 and are connected sequentially. The second side plate 470 is connected to one end of the base plate 450, and the first side plate 460 and the third side plate 480 are connected to opposite sides of the base plate 450. The base plate 450, the first side plate 460, the second side plate 470, and the third side plate 480 form a shell structure without a cover and without sidewalls at the other end.

[0074] In some embodiments, such as Figure 10As shown, the adapter mounting hole 431 is provided on the second side plate 470, the adapter mounting hole 431 is connected to the first inner cavity 430, and the pigtail adapter 208 is provided in the adapter mounting hole 431.

[0075] In some embodiments, one end of the partition 420 is connected to the inner wall of the second side plate 470, the bottom of the partition 420 is connected to the bottom plate, and the extending direction of the partition 420 is parallel to the extending direction of the first side plate 460. For example, the partition 420 is integrally formed with the shell 400.

[0076] In some embodiments, a first opening groove 411 is provided at the other end of the first side plate 460, and a second opening groove 412 is provided at the other end of the third side plate 480. The first opening groove 411 and the second opening groove 412 are used to embed and fix the circuit board 300. The first opening groove 411 and the second opening groove 412 are at the same height from the base plate 450, which facilitates the assembly and fixation of the circuit board 300 on the housing 400.

[0077] In some embodiments of this application, the shell 400 and the cover plate 500 can be assembled by adhesive bonding or by pressure welding. To facilitate the assembly and fixing of the shell 400 and the cover plate 500, a first support surface 461 is provided on the top of the inner wall of the first side plate 460, the second side plate 470 and the third side plate 480. The first support surface 461 is lower than the top surface of the first side plate 460, the second side plate 470 and the third side plate 480, and the first support surface 461 is used to support the cover plate 500.

[0078] Furthermore, in some embodiments of this application, a second support surface 422 is provided on the top of the partition 420, and the second support surface 422 is flush with the first support surface 461, thereby the second support surface 422 is used to support the cover plate 500.

[0079] Figure 11 This is a schematic diagram of the structure of an optical transceiver cavity according to some embodiments. Figure 11 As shown, the cover plate 500 covers the connecting tube shell 400, the top plate 510 covers the top of the tube shell 400, and the fourth side plate 520 is engaged between the first side plate 460 and the third side plate 480 and forms an opening 410 at the other end of the tube shell 400 with the first opening groove 411 and the second opening groove 412. Thus, the cover plate 500 covers the connecting tube shell 400 to form an optical transceiver cavity with an opening 410.

[0080] The optical module provided in this application embodiment can be used in relatively stable working environments such as data centers. The optical transceiver component 209 can adopt a non-hermetic packaging structure, so that the circuit board 300 can extend into the housing 400 to shorten the bonding distance between the optical emitting chip in the optical emitting device 600 and the optical receiving chip in the optical receiving device 700 and the high-frequency signal line on the circuit board 300, so as to facilitate high-frequency signal transmission.

[0081] Therefore, in some embodiments of this application, to ensure the firmness of the assembly between the circuit board 300 and the housing 400, the circuit board 300 is typically fixed to the housing 400 with adhesive. To ensure this firmness, the contact area between the circuit board 300 and the housing 400 is usually increased. However, in this embodiment, to prevent the adhesive from adversely affecting the optical transceiver assembly 209, it is necessary to control the contact area between the circuit board 300 and the housing 400. For example, a fixed support surface 413 is provided within the opening 410. The fixed support surface 413 supports the circuit board 300 and is connected to the bottom surface of the circuit board 300 with adhesive. In some examples, the height of the fixed support surface 413 on the housing 400 is higher than the height of the top surface of the base plate 450 adjacent to the fixed support surface 413, which facilitates control of the contact area between the fixed support surface 413 and the circuit board 300.

[0082] Figure 12 This is a schematic diagram of a shell structure according to some embodiments. Figure 2 , Figure 13 A cross-sectional view of a casing according to some embodiments. Figure 1 .like Figure 12 and 13 As shown, a first stepped surface 432 and a second stepped surface 433 are provided on the base plate 450 in the first inner cavity 430. The first stepped surface 432 and the second stepped surface 433 are used to support lenses and other devices. There is a height difference between the first stepped surface 432 and the second stepped surface 433, which facilitates the setting and control of the relative height of lenses and other devices in the first inner cavity 430. Of course, in some embodiments of this application, the base plate 450 in the first inner cavity 430 is not limited to having a first stepped surface 432 and a second stepped surface 433.

[0083] In some embodiments, a fifth stepped surface 436 is further provided on the base plate 450 in the first inner cavity 430. The fifth stepped surface 436 is lower than the second stepped surface 433 and there is a height difference between the two surfaces. The fifth stepped surface 436 is located on one side of the fixed support surface 413 and is closer to the fixed support surface 413 than the second stepped surface 433, that is, the fifth stepped surface 436 is located between the second stepped surface 433 and the fixed support surface 413. In this embodiment, providing the fifth stepped surface 436 helps to prevent excess adhesive from flowing to the second stepped surface 433 when the fixed support surface 413 and the circuit board 300 are fixedly connected by adhesive, so as to avoid affecting the devices disposed on the second stepped surface 433.

[0084] Furthermore, in some embodiments of this application, a support platform or support column is also provided on the base plate 450 in the first inner cavity 430 to facilitate the fixing of devices such as lenses. For example, such as... Figure 12 and 13As shown, a first support platform 434 and a second support platform 435 are provided on the first step surface 432. The first support platform 434 is connected to the inner wall of the third side plate 480, and the second support platform 435 is connected to the partition plate 420. A gap is provided between the first support platform 434 and the second support platform 435 to facilitate the transmission of light signals.

[0085] like Figure 13 As shown, the bottom surface of the adapter mounting hole 431 is lower than the first step surface 432, thereby forming a limiting step surface 451 with the base plate 450. The limiting step surface 451 is used to assist in the positioning and installation of the pigtail adapter 208, so as to ensure the assembly and positioning accuracy of the pigtail adapter 208, and thus ensure the optical coupling efficiency of the pigtail adapter 208.

[0086] Figure 14 A cross-sectional view of a casing according to some embodiments. Figure 2 .like Figure 12 and 14 As shown, a third step surface 441 and a fourth step surface 442 are provided on the base plate 450 of the second inner cavity 440. The third step surface 441 and the fourth step surface 442 are used to support lenses and other devices. There is a height difference between the third step surface 441 and the fourth step surface 442, which facilitates the setting and control of the relative height of lenses and other devices in the second inner cavity 440. Of course, in some embodiments of this application, the base plate 450 in the second inner cavity 440 is not limited to having a third step surface 441 and a fourth step surface 442. For example, the fourth step surface 442 is flush with the fifth step surface 436 to reduce the processing difficulty of the fourth step surface 442 and the fifth step surface 436 and control the processing cost.

[0087] Furthermore, in some embodiments of this application, a support platform or support column may also be provided on the base plate 450 of the second inner cavity 440 to facilitate the fixing of devices such as reflectors. For example, such as... Figure 12 and 14 As shown, a third support platform 443 is provided on the third step surface 441.

[0088] Figure 15 This is a usage state diagram provided according to some embodiments. Figure 16 A cross-sectional view of a casing in use according to some embodiments. Figure 1 .like Figure 15 and 16 As shown, the optical assembly 800 includes a first lens 810, a mirror 820, and an isolator 830; the first lens 810, mirror 820, and isolator 830 are disposed on a first stepped surface 432, the first stepped surface 432 supporting and connecting the bottom of the first lens 810, mirror 820, and isolator 830, and the first lens 810, mirror 820, and isolator 830 are arranged along... Figure 15and 16 The components are arranged sequentially from left to right as shown. The first support platform 434 and the second support platform 435 support and connect the side of the reflective mirror 820, and the reflective mirror 820 covers the gap between the first support platform 434 and the second support platform 435. For example, the reflective mirror 820 is arranged at a 45° angle on the first stepped surface 432, that is, the angle between the normal of the reflective mirror 820 and the straight line containing the length direction of the first inner cavity 430 is 45°.

[0089] like Figure 15 and 16 As shown, in some embodiments, the light emitting device 600 includes a light emitting chip 610 and a TEC 620. The TEC 620 is disposed on the second stepped surface 433, and the light emitting chip 610 is disposed on the TEC 620. The light emitting chip 610 and the TEC 620 are wire-connected to the circuit board 300. For example, a plurality of pads are provided on the surface edge of the circuit board 300 extending into the housing 400, and the light emitting chip 610 and the TEC 620 are wire-connected to the corresponding pads. In some embodiments, the height of the top surface of the light emitting chip 610 is flush with the height of the circuit board 300 to facilitate control of the wire length between the light emitting chip 610 and the circuit board 300.

[0090] The TEC620 is mounted on the second stepped surface 433. Since the optical transceiver assembly 209 is non-hermetically sealed, the circuit board 300 can extend into the housing 400 and be connected to the fixed support surface 413 via adhesive. To prevent excess adhesive from the fixed circuit board 300 and the fixed support surface 413 from flowing onto the second stepped surface 433, a fifth stepped surface 436 is provided between the second stepped surface 433 and the fixed support surface 413. The fifth stepped surface 436 effectively prevents excess adhesive from flowing onto the second stepped surface 433 when the fixed support surface 413 and the circuit board 300 are fixed together with adhesive, thus avoiding any impact on the performance of the TEC620.

[0091] The light emitting device 600 also includes a third lens 630, which is disposed on the TEC 620 and located in the light path of the light emitting chip 610. The third lens 630 is used to collimate the light signal emitted by the light emitting chip 610 and to ensure the coupling efficiency of the light signal.

[0092] The light emitting device 600 also includes a backlight detector 640, which is disposed in the backlight direction of the light emitting chip 610. The backlight detector 640 is used to receive the backlight of the light emitting chip 610 to assist in the detection of the emitted light power of the light emitting chip 610. For example, the backlight detector 640 is mounted on the circuit board 300 that extends into the housing 400.

[0093] Figure 17 A cross-sectional view of a casing in use according to some embodiments. Figure 2.like Figure 15 and 17 As shown, the optical receiver 700 includes an optical receiver chip 710 and a transimpedance amplifier 720; the optical receiver chip 710 and the transimpedance amplifier 720 are mounted on the edge of the circuit board 300 extending into the housing 400; the optical receiver chip 710 is wire-connected to the transimpedance amplifier 720. The mounting of the optical receiver chip 710 and the transimpedance amplifier 720 on the circuit board 300 facilitates ensuring the high-frequency signal transmission performance of the optical receiver chip 710 and the transimpedance amplifier 720.

[0094] In this embodiment, when the height of the optical fiber in the pigtail adapter 208 is aligned with the top surface of the circuit board 300, since the top surface of the optical emitting chip 610 is aligned with the height of the circuit board 300 and the optical receiving chip 710 is mounted on the circuit board 300, the height difference between the optical axis of the optical emitting chip 610 and the photosensitive surface of the optical receiving chip 710 will be less than 1 mm, or even less than 0.2 mm. Therefore, in order to ensure that the optical receiving chip 710 can receive the optical signal normally, the transmission height of the input optical signal through the pigtail adapter 208 needs to be adjusted within the housing 400 to facilitate the conversion of the optical signal transmission from the horizontal direction to the vertical direction.

[0095] like Figure 15 and 17As shown, the optical component 800 also includes a reflector 850, a displacement prism 860, a second lens 870, and a reflecting prism 880; the reflector 850, displacement prism 860, second lens 870, and reflecting prism 880 are sequentially arranged in the receiving optical path of the light receiving device 700. The reflector 850 and displacement prism 860 are disposed on the third step surface 441, and the second lens 870 and reflecting prism 880 are disposed on the fourth step surface 442; the reflecting prism 880 is located above the light receiving chip 710, that is, the projection of the reflecting prism 880 in the direction of the light receiving chip 710 covers the light receiving chip 710. The reflector 850 is used to reflect the optical signal to be received by the optical receiver chip 710, so as to change the transmission direction of the main optical axis of the optical signal on a plane parallel to the base plate 450; the displacement prism 860 is used to adjust the distance between the transmission direction of the main optical axis of the optical signal to be received and the base plate 450; the second lens 870 is used to converge the optical signal to be received; and the reflecting prism 880 is used to change the transmission direction of the main optical axis of the optical signal to be received from parallel to the base plate 450 to perpendicular to the base plate 450. Since the receiving optical axis of the optical receiver chip 710 is perpendicular to the base plate 450, while the optical signal transmitted to the housing 400 through the pigtail adapter 208 is parallel to the base plate 450, the transmission direction of the signal needs to be changed from parallel to the base plate 450 to perpendicular to the base plate 450 before it is transmitted to the optical receiver chip 710; at the same time, in order to ensure the feasibility of adjusting the optical path transmission height and facilitate the assembly of the device, the reflector 850, the displacement prism 860 and the reflecting prism 880 are combined during the adjustment of the optical path transmission height.

[0096] In some embodiments of this application, a third support platform 443 supports a reflector 850. For example, the reflector 850 is disposed on the third step surface 441 in a 45° reflective manner, that is, the angle between the normal of the reflector 850 and the straight line containing the length direction of the second inner cavity 440 is 45°.

[0097] In some embodiments of this application, a first support member 453 is further provided within the second inner cavity 440. The first support member 453 is disposed on the fourth step surface 442, and a reflecting prism 880 is disposed on the first support member 453, such as the top of the reflecting prism 880. By disposing the reflecting prism 880 on the first support member 453, it is convenient to position the reflecting prism 880 above the light receiving chip 710. Furthermore, a second lens 870 is disposed on the first support member 453, which facilitates the control of the relative position of the optical axis of the second control lens 870 and the reflecting surface on the reflecting prism 880, thereby facilitating the high-coupling transmission of the converged light signal to be received to the reflecting surface of the reflecting prism 880.

[0098] In some embodiments of this application, a second support member 452 is further provided within the second inner cavity 440. The second support member 452 is disposed on the third stepped surface 441, and the displacement prism 860 is disposed on the second support member 452. By disposing the displacement prism 860 on the second support member 452, it is easier to assemble the displacement prism 860 in the tube shell 400. A light-transmitting hole 4521 is provided on the second support member 452, and the displacement prism 860 is disposed on one side of the light-transmitting hole 4521, ensuring that the optical signal to be received through the light-transmitting hole 4521 can be transmitted to the displacement prism 860, or the optical signal to be received through the displacement prism 860 can be transmitted through the light-transmitting hole 4521. By providing a light-transmitting hole 4521 on the second support member 452, a relatively large second support member 452 can be selected without affecting the transmission of the optical signal to be received in the second inner cavity 440, facilitating the assembly of the displacement prism 860 on the second support member 452 and the assembly of the second support member 452 in the second inner cavity 440. For example, such as Figure 17 As shown, the displacement prism 860 has a rhomboid cross-section. The displacement prism 860 is located at the end of the light-transmitting hole 4521 away from the reflector 850. The second support member 452 is set at the edge of the third step surface 441, so that the displacement prism 860 is located above the fourth step surface 442. This can make full use of the height difference between the third step surface 441 and the fourth step surface 442, and facilitate the placement of the displacement prism 860 in the second inner cavity 440.

[0099] In some embodiments of this application, a second filter 890 is provided at one end of the light-passing aperture 4521 near the reflector 850. The second filter 890 is used for filtering in order to improve the quality of the light receiving chip 710 receiving the light signal.

[0100] In some embodiments of this application, the optical component 800 further includes a first filter 840; the side of the partition 420 supports the first filter 840, such that the first filter 840 covers the through hole 421 in a direction perpendicular to the side of the partition 420. The first filter 840 is used to filter out light of wavelengths other than the optical signal to be received, and thus covering the through hole 421 with the first filter 840 can effectively reduce the optical signal generated by the light emitting chip 610 from entering the second inner cavity 440. For example, as... Figure 17 As shown, the first filter 840 is located inside the second inner cavity 440. Of course, the first filter 840 can also be disposed in the first inner cavity 430.

[0101] Figure 18 This is a top view of a casing according to some embodiments. Figure 18As shown, in some embodiments, the first support platform 434 is connected to the inner wall of the third side plate 480. This connection effectively controls the processing procedure of the first support platform 434, such as reducing the number of sides that need to be processed, thus reducing the processing difficulty of the first support platform 434. A first fixing surface 4341 is provided on the side of the first support platform 434, supporting and connecting the side of the mirror 820. To facilitate the support of the first fixing surface 4341 on the side of the mirror 820, a first arc transition surface 4342 is also provided on the first support platform 434. This first arc transition surface 4342 connects the first fixing surface 4341 and the inner wall of the third side plate 480, effectively preventing chamfering during the processing of the first fixing surface 4341 and thus avoiding affecting the assembly accuracy of the mirror 820 on the first fixing surface 4341.

[0102] In some embodiments, a third arc transition surface 4343 is further provided on the first support platform 434. The third arc transition surface 4343 is located on the side of the first support platform 434 away from the first arc transition surface 4342, and the third arc transition surface 4343 is connected to the inner wall of the third side plate 480. Providing the third arc transition surface 4343 on the first support platform 434 further facilitates the processing of the first support platform 434, and can also effectively avoid the isolator 830.

[0103] In some embodiments, the second support platform 435 is connected to the side of the partition 420. Connecting the second support platform 435 to the partition 420 effectively controls the machining process of the second support platform 435, such as reducing the side of the second support platform 435 that needs to be machined, thereby reducing the machining difficulty of the second support platform 435. A second fixing surface 4351 is provided on the side of the second support platform 435. The second fixing surface 4351 supports the side of the mirror 820. The second fixing surface 4351 and the first fixing surface 4341 jointly support the mirror 820, facilitating a secure fixation of the mirror 820. To facilitate the second fixing surface 4351 supporting the side of the mirror 820, a second arc transition surface 4352 is also provided on the second support platform 435. The second arc transition surface 4352 connects the second fixing surface 4351 and the side of the partition 420, effectively preventing chamfering during the machining of the second fixing surface 4351, which would affect the assembly accuracy of the mirror 820 on the second fixing surface 4351.

[0104] In some embodiments, one side of the third support platform 443 is connected to the side of the partition plate 420, and the other side is connected to the inner wall of the first side plate 460. This can effectively control the processing procedure of the third support platform 443, such as reducing the side of the third support platform 443 that needs to be processed, thereby reducing the processing difficulty of the third support platform 443. A third fixing surface 4431 is provided on the side of the third support platform 443, and the third fixing surface 4431 supports and connects to the reflector 850.

[0105] To facilitate the support and connection of the reflector 850 on the third fixed surface 4431, a second arc transition surface 4352 is also provided on the third support platform 443. The second arc transition surface 4352 connects the side of the partition plate 420 and the third fixed surface 4431, effectively preventing the formation of a chamfer near the partition plate 420 during the machining of the third fixed surface 4431, which would affect the accuracy of the reflector 850 on the third fixed surface 4431. Furthermore, a fourth arc transition surface is also provided on the third support platform 443. The fourth arc transition surface connects the inner wall of the first side plate 460 and the third fixed surface 4431, effectively preventing the formation of a chamfer near the first side plate 460 during the machining of the third fixed surface 4431, which would affect the accuracy of the reflector 850 on the third fixed surface 4431.

[0106] Figure 19 This is a top view of a casing in use according to some embodiments. Figure 20 A cross-sectional view of a casing in use according to some embodiments. Figure 3 , Figure 21 A cross-sectional view of a casing in use according to some embodiments. Figure 4 The figure shows the optical transmission path of the optical signal generated by the optical emitting device 600 (only the main optical axis is drawn, solid line) and the optical transmission path of the optical signal to be received by the optical receiving device 700 (only the main optical axis is drawn, dashed line). The wavelength of the optical signal generated by the optical emitting device 600 is different from the wavelength of the optical signal to be received by the optical receiving device 700.

[0107] like Figure 19 and 20 As shown, the optical signal generated by the optical emitting chip 610 is transmitted to the third lens 630, collimated by the third lens 630, and then transmitted to the isolator 830. Through the isolator 830, it is transmitted to the transmission mirror 820, and then to the first lens 810. The first lens 810 then converges the optical signal to the pigtail adapter 208. The convergence of the optical signal generated by the optical emitting chip 610 to the pigtail adapter 208 by the first lens 810 helps improve the coupling efficiency of the optical signal to the pigtail adapter 208. The end face of the fiber optic ferrule in the pigtail adapter 208 is inclined, effectively reducing the return of the reflected optical signal along the incident optical path. The isolator 830 further reduces the return of the reflected optical signal along the original transmission path to the optical emitting chip 610, thereby reducing interference from the reflected optical signal on the optical signal modulated by the optical emitting chip 610.

[0108] like Figure 19 and 21As shown, the optical signal to be received by the optical receiver chip 710 from outside the optical module is transmitted to the first lens 810 through the pigtail adapter 208. After being collimated by the first lens 810, it is transmitted to the transmission mirror 820, reflected by the transmission mirror 820 to the first filter 840, filtered by the first filter 840, and then transmitted to the reflector 850. After being reflected by the reflector 850, it is transmitted to the second filter 890, filtered again by the second filter 890, and then transmitted to the light-transmitting hole 4521 of the second support member 452. Through the light-transmitting hole 4521, it is transmitted to the displacement prism 860. After the displacement prism 860 adjusts the height of the transmission optical path in the second inner cavity 440, it is transmitted to the second lens 870. After being converged by the second lens 870, it is transmitted to the reflecting prism 880, and reflected by the reflecting surface of the reflecting prism 880 to the optical receiver chip 710. The optical signal to be received is reflected twice in the displacement prism 860, so that the height of the principal optical axis of the optical signal to be received is adjusted in the second inner cavity 440.

[0109] Figure 22 This is an exploded view of an optical receiving device and circuit board according to some embodiments. Figure 2 , Figure 23 This is an exploded view of an optical receiving device and circuit board according to some embodiments. Figure 3 .like Figure 22 and 23 As shown, in some embodiments, a first snap-fit ​​surface 462 is provided on the outer wall of the first side plate 460, and a second snap-fit ​​surface 481 is provided on the outer wall of the third side plate 480. The first snap-fit ​​surface 462 and the second snap-fit ​​surface 481 are formed by the upper width of the tube shell 400 being greater than the lower width. When the tube shell 400 is assembled into the mounting hole 310 of the circuit board 300 or when the circuit board 300 extends into the opening 410, the first snap-fit ​​surface 462 limits the first snap-fit ​​area 320, and the second snap-fit ​​surface 481 limits the second snap-fit ​​area 330. The first snap-fit ​​surface 462 and the second snap-fit ​​surface 481 have a limiting and guiding function to facilitate the assembly of the tube shell 400 and the circuit board 300. For example, the top surface of the first snap-fit ​​area 320 contacts the first snap-fit ​​surface 462, and the top surface of the second snap-fit ​​area 330 contacts the second snap-fit ​​surface 481.

[0110] This application provides a novel optical module structure that separates the optical emission path and the optical reception path in two internal cavities, effectively isolating the reflected optical signal and the received optical signal, and avoiding crosstalk between the reflected optical signal and the received optical signal that could affect the quality of the optical signal received by the optical receiver.

[0111] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An optical module, characterized in that, include: The circuit board has a mounting hole at one end, and the edge of the mounting hole has an insertion area. Optical transceiver assembly, used to generate optical signals and receive optical signals from outside the optical module; An optical fiber assembly that connects the optical port of the optical module to the optical transceiver assembly; The optical fiber assembly includes an optical fiber and a pigtail adapter, wherein the pigtail adapter is connected to the end of the optical fiber; The optical transceiver component includes: An optical transceiver cavity has an adapter mounting hole at one end for connecting a fiber optic adapter, and an opening at the other end that connects to the inner cavity of the optical transceiver cavity. A partition is provided within the inner cavity along the length of the optical transceiver cavity, and along the width of the optical transceiver cavity, the partition divides the inner cavity into a first inner cavity and a second inner cavity. A through hole is provided on the partition, connecting the first inner cavity and the second inner cavity. The other end of the optical transceiver cavity is fitted with the mounting hole, allowing the insertion area to extend into the inner cavity of the optical transceiver cavity through the opening. A light emitting device is disposed on the bottom plate of the first inner cavity and electrically connected to the circuit board, including a light emitting chip, which is wire-connected to the circuit board; An optical receiver is disposed on the top surface of a circuit board extending into the inner cavity and located in the second inner cavity, electrically connected to the circuit board, and includes an optical receiver chip. The height of the photosensitive surface of the optical receiver chip is less than 1 mm different from the height of the optical axis of the optical emission chip, and the height of the photosensitive surface of the optical receiver chip is less than 1 mm different from the height of the end of the optical fiber. An optical component, disposed within the inner cavity of the optical transceiver cavity, includes a displacement prism and a reflecting prism; the displacement prism is disposed on the transmission optical path of the optical signal to be received by the optical receiving chip, and is used to raise the transmission height of the optical signal transmission optical path in the optical transceiver cavity; the reflecting surface of the reflecting prism is located above the optical receiving chip, and is used to reflect the optical signal to be received back to the optical receiving chip.

2. The optical module according to claim 1, characterized in that, The optical transceiver cavity includes a housing and a cover plate; The casing includes a base plate and a first side plate, a second side plate, and a third side plate disposed on the edge of the base plate and connected in sequence; the second side plate is located at one end of the base plate and is connected to the optical fiber assembly; the first side plate and the third side plate are located on both sides of the base plate; the partition is disposed inside the casing, with one end connected to the inner wall of the second side plate and the bottom connected to the base plate; The cover plate includes a top plate and a fourth side plate, wherein the fourth side plate is connected to one end of the top plate; The cover plate closes and connects to the tube shell, the top plate covers the top of the tube shell, and the fourth side plate is located between the first side plate and the third side plate; The tube shell is provided with a fixed support surface inside the opening, and the fixed support surface supports the bottom surface of the circuit board.

3. The optical module according to claim 2, characterized in that, The adapter mounting hole is provided on the second side plate, and the adapter mounting hole communicates with the first inner cavity; The bottom plate inside the first inner cavity is provided with a first stepped surface and a second stepped surface, and there is a height difference between the first stepped surface and the second stepped surface; a first lens, a reflective mirror and an isolator are provided on the first stepped surface; The light emitting device is disposed on the second step surface; A fifth step surface is also provided on the bottom plate inside the first inner cavity. The fifth step surface is located between the second step surface and the fixed support surface, and the fifth step surface is lower than the second step surface.

4. The optical module according to claim 2, characterized in that, The bottom plate inside the second inner cavity is provided with a third step surface and a fourth step surface, and there is a height difference between the third step surface and the fourth step surface; The light receiving device is disposed on the circuit board; a reflector and the displacement prism are disposed on the third step surface, and a first support is disposed on the fourth step surface, with a second lens and the reflector prism disposed on the first support.

5. The optical module according to claim 2, characterized in that, A first support surface is provided on the top of the inner wall of the first side plate, the second side plate and the third side plate, and a second support surface is provided on the top of the partition plate. The first support surface and the second support surface support and connect the top plate. The first side plate has a first opening groove at one end, and the second side plate has a second opening groove at the other end. The first opening groove and the second opening groove cooperate with the fourth side plate to form the opening at the other end of the optical transceiver cavity.

6. The optical module according to claim 3, characterized in that, A first support platform and a second support platform are provided on the first step surface. The first support platform is connected to the inner wall of the third side plate, and the second support platform is connected to the side of the partition. A first fixing surface is provided on the side of the first support platform, and a first arc transition surface is provided between the first fixing surface and the first side plate; A second fixing surface is provided on the side of the second support platform, and a second arc transition surface is provided between the second fixing surface and the partition plate; The first fixing surface and the second fixing surface fix and support the mirror.

7. The optical module according to claim 4, characterized in that, A third support platform is provided on the third step surface, a third fixed surface is provided on the third support platform, and a third arc transition surface is provided between the third fixed surface and the partition plate; The third fixed surface provides fixed support for the reflector.

8. The optical module according to claim 4, characterized in that, A second support member is provided on the third step surface. A light-transmitting hole is provided on the second support member. A second filter is provided at one end of the light-transmitting hole and the displacement prism is provided at the other end. The second support is located at the edge of the third step surface, so that the displacement prism is suspended above the fourth step surface.

9. The optical module according to claim 3, characterized in that, The light emitting device further includes a TEC and a third lens. The TEC is disposed on the second stepped surface, and the light emitting chip and the third lens are disposed on the TEC. The light emitting chip and the TEC are wired to the circuit board. The light emitting device also includes a backlight detector, which is disposed on the circuit board and electrically connected to the circuit board.

10. The optical module according to claim 2, characterized in that, A first snap-fit ​​surface is provided on the outer wall of the first side plate, and a second snap-fit ​​surface is provided on the outer wall of the third side plate; One end of the circuit board is provided with an assembly hole, and the edge of the assembly hole is provided with a first snap-fit ​​area and a second snap-fit ​​area. The first snap-fit ​​area is located on one side of the extension area, and the second snap-fit ​​area is located on the other side of the extension area. The top surface of the first snap-fit ​​area contacts the first snap-fit ​​surface, and the top surface of the second snap-fit ​​area contacts the second snap-fit ​​surface.

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