Thermal insulation composite floor for fitting radiant floor heating

Abstract

The application discloses a heat preservation composite floor for fitting with floor heating, which comprises, from bottom to top, a heat collection layer, a heat conduction layer, a heat storage layer and a floor body, and the heat conduction coefficients of the layers of the heat preservation composite floor are set as follows: the heat conduction coefficient of the heat collection layer is higher than that of the heat conduction layer, the heat conduction coefficient of the heat conduction layer is lower than that of the rapid heat conduction layer, and the heat conduction coefficient of the rapid heat conduction layer is higher than that of the heat release layer. By adopting the technical scheme, the heat collection layer with a higher heat conduction coefficient can effectively absorb and conduct the heat emitted by the floor heating, and meanwhile, the reasonable high-low relationship arrangement of the heat conduction coefficients between different layers is utilized in combination with the heat storage capacity of the heat storage layer, so that on one hand, the heat can be effectively stored in the floor layers to avoid the invalid release of the heat, and on the other hand, the heat can be transmitted to the floor body according to a reasonable heat conduction efficiency, and then transmitted to an indoor environment, so that a comfortable environment temperature is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of floor material structure, and particularly relates to a heat preservation composite floor for cooperating with floor heating. BACKGROUND

[0002] The refrigeration technology of air conditioners is very mature, and the refrigeration effect is very satisfactory, but the heating effect of air conditioners is not ideal. In order to meet the heating demand of people in winter indoors, the laying and use of floor heating have begun to be widely popularized.

[0003] The laying mode of the existing floor heating is usually to lay an extruded plate and a reflective film on the bottom surface for transmitting heat upward, lay a floor heating pipeline on the extruded plate and the reflective film, and fix the floor heating pipeline by using cement, mortar or gravel.

[0004] In the process of floor heating work, the most ideal state is that all the heat is transmitted to the indoor space by the floor to maximize the utilization of energy, but for most floor heating laying environments, there are cement mortar and other supports or other objects around the floor heating. The heat conduction coefficients of these objects are generally between 0.5 and 1.8 W / mK according to different composition, thickness and surface smoothness, and the thermal conductivities of many solid wood floors or composite floors are not higher than them, so that heat is more easily absorbed by the cement mortar and other supports or other objects with higher thermal conductivities, thereby causing obvious energy waste and being not conducive to the temperature rise in the room. SUMMARY

[0005] The present application provides a heat preservation composite floor for cooperating with floor heating, which comprises a heat collection layer, a heat conduction layer and a heat storage layer. The heat collection layer with a high thermal conductivity can effectively absorb and conduct the heat emitted by the floor heating. Meanwhile, the reasonable high-low relationship of the thermal conductivities between different layers is arranged, and the heat storage capacity of the heat storage layer is combined. On the one hand, the heat can be effectively stored in the floor layers to avoid the invalid release of heat, and on the other hand, the heat can be transmitted to the floor body according to the reasonable heat conduction efficiency, and then transmitted to the indoor environment, so as to achieve the comfortable environmental temperature.

[0006] Technical solution: The application provides a heat preservation composite floor for fitting with floor heating, which comprises, from bottom to top, a heat collection layer, a heat conduction layer, a heat storage layer and a floor body, wherein the heat collection layer, the heat conduction layer, the heat storage layer and the floor body are connected through a formaldehyde-free adhesive; the floor body comprises a first base layer and a second base layer, and the first base layer and the second base layer are made of wood; the heat storage layer comprises, from bottom to top, a rapid heat conduction layer, a heat storage cavity and a heat release layer, a plurality of heat storage blocks are arranged in the heat storage cavity, and the interval regions between the heat storage blocks form heat storage channels; the heat conduction coefficients of the layers of the heat preservation composite floor are set as follows: the heat conduction coefficient of the heat collection layer is higher than that of the heat conduction layer, the heat conduction coefficient of the heat conduction layer is lower than that of the rapid heat conduction layer, and the heat conduction coefficient of the rapid heat conduction layer is higher than that of the heat release layer.

[0007] Specifically, the first base layer is provided with an anti-warping strip along the longitudinal direction of the floor body.

[0008] Specifically, the second base layer is provided with a groove at the bottom.

[0009] Specifically, the two ends of the floor body along the longitudinal direction are respectively provided with a connecting accommodating groove and a connecting rod, the connecting rod is connected with the accommodating groove in the transverse direction of the floor body, a protruding pressing plate is arranged on one side of the floor body along the transverse direction, and a recessed connecting plate is arranged on the other side, and the sum of the thickness of the pressing plate and the thickness of the connecting plate is equal to the sum of the thicknesses of the heat preservation composite floor.

[0010] Specifically, the formaldehyde-free adhesive is an adhesive prepared by blending polyvinyl alcohol, modified starch, latex and an additive and cross-linking with isocyanate.

[0011] Specifically, the heat release layer has a heat conduction coefficient higher than that of the heat conduction layer.

[0012] Specifically, the heat storage blocks are made of metal.

[0013] Specifically, the heat collection layer, the rapid heat conduction layer and the heat release layer are made of a material containing silicon, and the heat conduction layer is made of a material containing rubber.

[0014] Specifically, the heat collection layer is provided with a plurality of hollow holes on the surface facing the heat conduction layer.

[0015] Specifically, the heat conduction coefficient of the heat collection layer is 2-3 W / mK, the heat conduction coefficient of the heat conduction layer is 0.3-0.5 W / mK, the heat conduction coefficient of the rapid heat conduction layer is 1-1.5 W / mK, and the heat conduction coefficient of the heat release layer is 0.8-1 W / mK.

[0016] Beneficial effects: compared with the prior art, the present application has the following obvious advantages: the floor comprises a heat collection layer, a heat conduction layer and a heat storage layer, the heat collection layer with a high heat conduction coefficient can effectively absorb and conduct the heat emitted by the floor heating, and the reasonable high-low relationship of the heat conduction coefficients of different layers is arranged, combined with the heat storage capacity of the heat storage layer, on the one hand, the heat can be effectively stored in the floor layer, avoiding the invalid release of the heat, on the other hand, the heat can be transmitted to the floor body according to the reasonable heat conduction efficiency, and then transmitted to the indoor environment, so as to achieve the comfortable environment temperature. BRIEF DESCRIPTION OF DRAWINGS

[0017] Fig. 1 The overall structure schematic view of the heat preservation composite floor for cooperating with the floor heating is provided for the present application.

[0018] Fig. 2 The sectional view of the heat preservation composite floor for cooperating with the floor heating is provided for the present application.

[0019] Fig. 3 The floor body enlarged view of the heat preservation composite floor for cooperating with the floor heating is provided for the present application.

[0020] 100-floor body; 101-first base layer; 102-second base layer; 200-heat release layer; 201-heat storage block; 202-heat storage cavity; 203-fast heat conduction layer; 300-heat conduction layer; 400-heat collection layer; 401-hollow hole; 500-anti-warping edge strip; 600-containing groove; 700-connecting rod; 800-pressing plate; 900-connecting plate. DETAILED DESCRIPTION

[0021] The technical solutions of the present application will be further described below in combination with the drawings.

[0022] Referring to Figs. 1 to 3 , the overall structure schematic view, the sectional view and the floor body 100 enlarged view of the heat preservation composite floor for cooperating with the floor heating are provided for the present application.

[0023] The application provides a heat preservation composite floor for fitting with floor heating, which comprises, from bottom to top, a heat collection layer 400, a heat conduction layer 300, a heat storage layer and a floor body 100, wherein the heat collection layer 400, the heat conduction layer 300, the heat storage layer and the floor body 100 are connected by a formaldehyde-free adhesive; the floor body 100 comprises a first base layer 101 and a second base layer 102, and the first base layer 101 and the second base layer 102 are made of wood; the heat storage layer comprises, from bottom to top, a fast heat conduction layer 203, a heat storage cavity 202 and a heat release layer 200, a plurality of heat storage blocks 201 are arranged in the heat storage cavity 202, and the interval areas between the heat storage blocks 201 form heat storage channels; the heat conduction coefficients of the layers of the heat preservation composite floor are set as follows: the heat conduction coefficient of the heat collection layer 400 is higher than that of the heat conduction layer 300, the heat conduction coefficient of the heat conduction layer 300 is lower than that of the fast heat conduction layer 203, and the heat conduction coefficient of the fast heat conduction layer 203 is higher than that of the heat release layer 200.

[0024] In the embodiment of the application, the heat conduction coefficient of the heat release layer 200 is higher than that of the heat conduction layer 300.

[0025] In the specific implementation, the floor heating releases heat, and in order to avoid the heat being absorbed by cement mortar and the like around the floor heating, the heat collection layer 400 is responsible for effectively and more quickly absorbing the heat released by the floor heating through a higher (higher than the cement mortar and the like around the floor heating) heat conduction coefficient, because when there are a plurality of objects with different heat conduction coefficients around the released heat, the heat is more easily absorbed and conducted by the object with a higher heat conduction coefficient, because the object with a higher heat conduction coefficient has a faster heat conduction speed, so that the heat can be avoided from being transmitted to the cement mortar and the like around the floor heating, and the waste of energy is avoided.

[0026] In a specific implementation, the heat conducting layer 300 is provided below the heat collection layer 400 and above the heat storage layer. Therefore, the heat conducting layer 300 needs to play a role of connecting and buffering. In the process of floor heating, the heat collection layer 400 quickly collects and conducts heat to the heat conducting layer 300, but the heat conducting layer 300 needs to play a certain blocking role, including the amount and transmission rate of heat, to avoid the heat being too quickly and intensely transmitted to the heat storage layer. Because the heat conductivity coefficient of the heat storage layer is relatively high, if the heat transmission rate is too high, the heat storage layer will quickly heat up, and the heat storage layer is directly in contact with the wooden floor body 100. In the case of a lower indoor environment temperature, if the wooden floor body 100 directly contacts the heat storage layer that quickly heats up, it will be affected by the rapid change of temperature. In the case that the heat conductivity coefficient of the wooden floor body 100 is usually not high, the temperature on both sides of the floor is not balanced, which may damage the wooden floor body 100, such as warping and swelling, and the temperature rises quickly, and the heat is directly and in large quantities transmitted to the indoor environment through the floor. In the case of human contact with the floor, it is also not comfortable.

[0027] In addition, in the case of floor heating shutdown, because the heat conductivity coefficient of the heat collection layer 400 is relatively high, and the heat conductivity coefficient of the wooden floor body 100 is low, without the blocking of the heat conducting layer 300, the heat will not be retained and effectively transmitted to the floor body 100 and the indoor environment, but will be transmitted from the heat collection layer 400 to the cement mortar and other objects around the floor heating. This will cause the temperature of the floor heating and the floor to rise and the heat release function to sharply decrease after the floor heating is shut down. In the case of setting the heat conducting layer 300, especially in the case that the heat conductivity coefficient of the heat conducting layer 300 is lower than that of the heat release layer 200 in the heat storage layer, the heat stored in the heat storage layer will be more easily absorbed and transmitted by the heat release layer 200 in the case of floor heating shutdown, and then transmitted to the floor body 100 and the indoor environment. In this way, the heat stored in the heat storage layer can be used to maintain the temperature of the indoor environment, reduce the indoor temperature drop rate as much as possible, and fully utilize the energy.

[0028] In summary, the heat conducting layer 300 plays a role in blocking the rapid transmission of heat to the heat storage layer, or blocking the transmission of heat from the heat storage layer to the heat collection layer 400, avoiding problems caused by rapid temperature changes, and also allowing more heat to be transmitted upward to the floor body 100, prolonging the indoor insulation effect and insulation time.

[0029] In a specific implementation, the thermal conductivity coefficient of the rapid heat conduction layer 203 is high, which can effectively absorb and conduct heat to the heat storage block 201 and the heat storage cavity 202. The heat storage block 201 and the heat storage channel have strong heat storage capacity for storing heat. The heat storage channel not only plays a role in gathering and storing heat, but also plays a role in increasing the contact area of the heat storage block 201 with air, which can further improve the heat storage rate and effect of the heat storage block 201. The heat is gradually released to the floor body 100 through the heat release layer 200.

[0030] In a specific implementation, the thermal conductivity coefficient of the heat release layer 200 is relatively low and relatively close to the floor body 100. The purpose is to transfer heat to the floor at a relatively moderate heat conduction rate, ensure that the temperature change will not be too intense, and the temperature rise will not be too high. On the one hand, it can ensure that the floor body 100 will not be damaged due to too fast temperature change. On the other hand, it can maintain the surface of the floor body 100 facing the indoor at a relatively moderate and comfortable temperature.

[0031] In the embodiment of the application, the thermal conductivity coefficient of the heat collection layer 400 is 2 to 3 W / mK (preferably 2.75 W / mK), the thermal conductivity coefficient of the heat conduction layer 300 is 0.3 to 0.5 W / mK (preferably 0.35 W / mK), the thermal conductivity coefficient of the rapid heat conduction layer 203 is 1 to 1.5 W / mK (preferably 1.2 W / mK), and the thermal conductivity coefficient of the heat release layer 200 is 0.8 to 1 W / mK (preferably 1 W / mK).

[0032] In a specific implementation, after a large number of experiments and adjustments, it is found that under the condition that the floor heating temperature is set to 26 degrees Celsius, the arrangement of the above-mentioned thermal conductivity coefficient distribution can better achieve the technical purpose of the application. First, the thermal conductivity coefficient of the heat collection layer 400 is 2 to 3 W / mK, which is higher than the thermal conductivity coefficient of cement mortar, which is between 0.5 and 1.5 W / mK in most cases. The heat collection layer 400 will not absorb and conduct heat too quickly, causing rapid temperature rise. And due to the blocking effect of the heat conduction layer 300, heat is too concentrated in the heat collection layer 400. However, the setting of the thermal conductivity coefficient of the heat collection layer 400 at 2 to 3 W / mK can be high enough to prevent heat from being dispersed too much in the cement mortar and can absorb and conduct heat at a sufficient rate.

[0033] The thermal conductivity of the heat conduction layer 300 is set to 0.3-0.5 W / mK, and is preferably set to 1 / 8-1 / 4 of the thermal collection layer 400, which can make the heat conduction layer 300 play a certain barrier role, and the barrier role is limited, so that the heat is not difficult to transfer to the heat storage layer, the heat storage layer has no heat to store, and the relationship between the heat conduction layer 300 and the heat release layer 200 is considered. If the thermal conductivity of the heat conduction layer 300 is further increased, in order to obtain the heat preservation effect after the floor heating is turned off, the thermal conductivity of the heat release layer 200 needs to be higher than that of the heat conduction layer 300 to a certain extent, and the thermal conductivity of the heat release layer 200 needs to be higher, which will make the heat conduction rate of the heat release layer 200 higher, and then affect the floor body 100 and the indoor environment temperature.

[0034] The thermal conductivity of the fast heat conduction layer 203 is 1-1.5 W / mK (preferably 1.2 W / mK), and the thermal conductivity of the heat release layer 200 is 0.8-1 W / mK (preferably 1 W / mK). The thermal conductivity of the fast heat conduction layer 203 can effectively transfer the heat to the heat storage block 201 and the heat storage channel. The thermal conductivity of wood (the main material of the floor body 100) is generally 0.04-0.4 W / mK, and the heat release layer 200 can transfer heat to the floor body 100 at a reasonable heat transfer rate, and the floor body 100 can further transfer heat to the indoor environment.

[0035] In the embodiment of the application, the first base layer 101 is provided with an anti-warping strip 500 along the longitudinal direction of the floor body 100.

[0036] In the specific implementation, the anti-warping strip 500 can prevent the floor body 100 from warping and expanding due to uneven heating.

[0037] In the embodiment of the application, the bottom of the second base layer 102 is provided with a groove.

[0038] In the specific implementation, the groove has the following advantages: on the one hand, the structure of the groove can overcome the expansion or warping of the floor to a certain extent, and on the other hand, the air accumulation area formed by the groove can accumulate and store heat.

[0039] In the embodiment of the application, the two ends of the floor body 100 along the longitudinal direction are respectively provided with a connecting accommodating groove 600 and a connecting rod 700, the connecting rod 700 is slidably connected to the accommodating groove 600 from the transverse direction of the floor body 100, a protruding pressing connecting plate 800 is arranged on one side of the floor body 100 along the transverse direction, and a recessed connecting plate 900 is arranged on the other side, and the sum of the thickness of the pressing connecting plate 800 and the thickness of the connecting plate 900 is equal to the sum of the thickness of the heat preservation composite floor.

[0040] In the specific implementation, for the heat preservation composite floor provided by the application, the upper and lower sides are connected with other floors through the connecting accommodating groove 600 and the connecting rod 700, that is, the connecting rod 700 is transversely inserted into the connecting accommodating groove 600 of the other floor, or the connecting accommodating groove 600 receives the connecting rod 700 of the other floor, and the left and right sides are connected through the butt joint of the connecting plate 900 and the pressing connecting plate 800.

[0041] In the embodiment of the application, the formaldehyde-free adhesive is an adhesive prepared by blending polyvinyl alcohol, modified starch, latex and additives and crosslinking with isocyanate.

[0042] In the embodiment of the application, the material of the heat storage block 201 is metal.

[0043] In the specific implementation, metal has strong heat storage capacity due to the characteristics of fast heating and is suitable for being used as a tool for storing heat.

[0044] In the embodiment of the application, the material of the heat collection layer 400, the fast heat conduction layer 203 and the heat release layer 200 comprises a silicon component, and the material of the heat conduction layer 300 comprises a rubber component.

[0045] In the specific implementation, the material of the heat collection layer 400, the fast heat conduction layer 203 and the heat release layer 200 can be heat-conductive silicon, and the thermal conductivity of the heat-conductive silicon is 0.8-3 W / mK according to different factors such as composition and thickness, which is suitable for being used as the material of the heat collection layer 400, the fast heat conduction layer 203 and the heat release layer 200. The thermal conductivity of the rubber material is generally 0.19-0.26 W / mK, and some metal oxides or other materials can be added on the basis of the rubber component as a base material to improve the thermal conductivity to reach the range defined in the application.

[0046] In the embodiment of the application, the heat collection layer 400 is provided with a plurality of hollow holes 401 on the surface facing the heat conduction layer 300.

[0047] In the specific implementation, the hollow holes 401 can play a role in gathering and storing heat. Since the heat conduction rate of the heat conduction layer 300 is lower than that of the heat collection layer 400, the heat conduction layer 300 generally cannot timely transmit heat to the heat storage layer in the case that the heat collection layer 400 has completed heat transfer, and therefore part of the area is needed to gather and store heat, otherwise, heat will be wasted and diffused, and the air in the hollow holes 401 can well complete the role of gathering and storing heat.

Claims

1. A thermal insulation composite floor for use with a floor heating system, characterized in that, The heat preservation composite floor comprises, from bottom to top, a heat collection layer, a heat conduction layer, a heat storage layer and a floor body, wherein: The heat collection layer, the heat conduction layer, the heat storage layer and the floor body are connected by a formaldehyde-free adhesive; The floor body comprises a first base layer and a second base layer, and the first base layer and the second base layer are made of wood; The heat storage layer comprises, from bottom to top, a rapid heat conduction layer, a heat storage cavity and a heat release layer, and a plurality of heat storage blocks are arranged in the heat storage cavity, and the interval regions between the heat storage blocks form heat storage channels; The heat conduction coefficients of the layers of the heat preservation composite floor are set as follows: The heat conduction coefficient of the heat collection layer is higher than that of the heat conduction layer, the heat conduction coefficient of the heat conduction layer is lower than that of the rapid heat conduction layer, and the heat conduction coefficient of the rapid heat conduction layer is higher than that of the heat release layer.

2. The thermal composite floor for use with a floor heating system according to claim 1, wherein, The first base layer is provided with an anti-warping strip along the longitudinal direction of the floor body.

3. The thermal composite floor panel for use with a floor heating system according to claim 1, wherein, The bottom of the second base layer is provided with a groove.

4. The thermal composite floor panel for use with a floor heating system according to claim 1, wherein, The two ends of the floor body along the longitudinal direction are respectively provided with a connecting receiving groove and a connecting rod, the connecting rod is slidably connected with the receiving groove in the transverse direction of the floor body, a protruding pressing connecting plate is arranged on one side of the floor body along the transverse direction, and a recessed connecting plate is arranged on the other side, and the sum of the thicknesses of the pressing connecting plate and the connecting plate is equal to the sum of the thicknesses of the heat preservation composite floor.

5. The thermal composite floor panel for use with a floor heating system according to claim 1, wherein, The formaldehyde-free adhesive is made by blending polyvinyl alcohol, modified starch, latex and additives, and cross-linking with isocyanate.

6. The thermal composite floor panel for use with a floor heating system according to claim 1, wherein, The heat release layer has a higher heat conduction coefficient than the heat conduction layer.

7. The thermal composite floor panel for use with a floor heating system according to claim 6, wherein, The heat storage blocks are made of metal.

8. The thermal composite floor panel for use with a floor heating system according to claim 7, wherein, The materials of the heat collection layer, the rapid heat conduction layer and the heat release layer comprise a silicon component, and the material of the heat conduction layer comprises a rubber component.

9. The thermal composite floor panel for use with a floor heating system according to claim 8, wherein, The heat collection layer is provided with a plurality of hollow holes on the surface facing the heat conduction layer.

10. The thermal composite floor panel for use with a floor heating system according to claim 8, wherein, The heat conduction coefficient of the heat collection layer is 2-3 W / mK, the heat conduction coefficient of the heat conduction layer is 0.3-0.5 W / mK, the heat conduction coefficient of the rapid heat conduction layer is 1.2-1.5 W / mK, and the heat conduction coefficient of the heat release layer is 0.8-1 W / mK.

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