A temperature sensor for temperature field testing and its fabrication method

Abstract

This application provides a temperature sensor and its fabrication method for temperature field testing. The temperature sensor includes a measuring end and a reference end, each comprising a first substrate and a second substrate. Each substrate has multiple pairs of through-holes, through which a first thermocouple electrode wire and a second thermocouple electrode wire pass, respectively. A thermal junction is formed on the upper surface of the first substrate between the first and second through-holes of the through-hole pairs to connect the first ends of the first and second thermocouple electrode wires. The first and second thermocouple electrode wires pass through the lower surface of the first substrate and then through the reference end, with extensions formed at their second ends. The extensions of the first and second thermocouple electrode wires in the multiple through-hole pairs are connected to a measuring circuit in parallel or series. This application enables accurate measurement of temperature field distribution on a plane or curved surface and improves the sensitivity of temperature measurement.

Description

Technical Field

[0001] This application relates to the field of temperature sensing technology, specifically to a temperature sensor for temperature field testing and its fabrication method. Background Technology

[0002] The uniformity of temperature field distribution and the effective temperature range are important indicators for evaluating the performance of furnaces such as tube furnaces and crystal growth furnaces. Temperature field distribution is also a necessary parameter for thermal management of heated or self-heating devices such as spacecraft components and lithium batteries. Therefore, the demand for measuring temperature field distribution on two-dimensional surfaces is increasing.

[0003] In existing technologies, while thin-film thermocouples and thin-film thermistors can measure temperatures on planar or curved surfaces relatively well, they can only measure the average temperature on the thin film, essentially remaining single-point temperature measurement. Currently, a common method for measuring two-dimensional temperature field distribution is to lay multiple pairs of thermocouples on the measuring surface. Specific processes can be categorized into methods that alter the measuring surface structure, such as pre-embedding, welding, or drilling, or methods that do not alter the measuring surface structure, such as bonding with conductive silver paste or adhesive tape. Modifying the measuring surface structure not only damages the original device's heat transfer performance but also presents significant difficulties in actual manufacturing, resulting in cumbersome and redundant processes. While bonding does not change the measuring structure, the firmness and uniformity of bonding multiple thermocouple pairs can be inconsistent, making it unsuitable for high-temperature environments and prone to peeling off during heating, leading to significant errors in the measurement results.

[0004] Meanwhile, if the temperature gradient on the measurement surface is small, the low sensitivity of existing thermocouples cannot accurately track the differences in temperature field distribution in a two-dimensional temperature field, and cannot meet the actual measurement requirements. Summary of the Invention

[0005] To address the problems in the prior art, the purpose of this application is to provide a temperature sensor and its preparation method for temperature field testing, which can accurately measure the temperature field distribution on a plane or curved surface and improve the sensitivity of temperature measurement.

[0006] This application provides a temperature sensor for temperature field testing, including a measuring end and a reference end. The measuring end includes a first substrate, and the reference end includes a second substrate. The first substrate and the second substrate are respectively formed with a plurality of through-hole pairs. Each through-hole pair includes a first through-hole and a second through-hole. A first thermocouple electrode wire and a second thermocouple electrode wire pass through the first through-hole and the second through-hole, respectively.

[0007] A thermal junction is formed on the upper surface of the first substrate between the first and second through holes of each through hole pair to connect the first end of the first thermocouple electrode wire and the first end of the second thermocouple electrode wire.

[0008] The first thermocouple electrode wire and the second thermocouple electrode wire pass through the lower surface of the first substrate and then through the reference end, and extension sections are formed at the second ends of the first thermocouple electrode wire and the second thermocouple electrode wire, respectively.

[0009] In this embodiment, the extensions of the first thermocouple electrode wire and the extensions of the second thermocouple electrode wire in the plurality of through-hole pairs are connected to the measurement circuit in parallel and / or in series.

[0010] In some embodiments, the extensions of the first thermocouple electrode wire and the extensions of the second thermocouple electrode wire in the plurality of through-hole pairs are respectively connected in parallel to the measurement circuit via compensating wires; and / or,

[0011] After the extensions of the first thermocouple electrode wire and the second thermocouple electrode wire in the plurality of through-hole pairs are connected in series alternately, the extensions of the first thermocouple electrode wire and the second thermocouple electrode wire at the beginning and end are respectively connected to the measurement circuit through compensating wires.

[0012] In some embodiments, the first substrate is a rectangular or circular planar sheet; or, the first substrate is a cylindrical or U-shaped curved cavity.

[0013] In some embodiments, the hot junction is a metal thin film, the material of which is different from that of the first thermocouple electrode wire and the second thermocouple electrode wire; or, the hot junction is formed by overlapping the first metal thin film and the second metal thin film, the first metal thin film being the same material as the first thermocouple electrode wire, and the second metal thin film being the same material as the second thermocouple electrode wire.

[0014] In some embodiments, the reference terminal is disposed in a constant temperature environment or a constant temperature water-cooled environment.

[0015] This application embodiment also provides a method for fabricating a temperature sensor for temperature field testing, the method comprising the following steps:

[0016] A first substrate for the measuring end and a second substrate for the reference end are processed, wherein the first substrate and the second substrate are each formed with a plurality of through-hole pairs;

[0017] A thermal junction is prepared on the upper surface of the first substrate at the position corresponding to each pair of through holes using a printing process;

[0018] A first thermocouple electrode wire and a second thermocouple electrode wire are filled and solidified in the first and second through holes of the through hole pair, and the first end of the first thermocouple electrode wire and the first end of the second thermocouple electrode wire are connected through the thermal junction. The second end of the first thermocouple electrode wire and the second end of the second thermocouple electrode wire respectively pass through the second substrate to form an extension section.

[0019] The extensions of the first thermocouple electrode wire and the extensions of the second thermocouple electrode wire in the plurality of through-hole pairs are connected to the measurement circuit in parallel and / or in series.

[0020] In some embodiments, the preparation of the hot junction includes the following steps:

[0021] A first paste and a second paste, made of the same material as the first and second thermocouple electrode wires, are selected. The first paste is applied to the periphery of the first through-hole and extends to the outside of the second through-hole using a printing process. After sintering to obtain a first metal film, the second paste is applied to the periphery of the second through-hole and extends to the outside of the first through-hole. After sintering, a second metal film is obtained. The heat junction is formed at the overlapping position of the first and second metal films; or...

[0022] A metal paste of a different material from both the first and second thermocouple electrode wires is selected. The metal paste is then used to cover the first and second through holes of the through-hole pair through a printing process. After sintering, a metal film is formed, which serves as the heat junction.

[0023] In some embodiments, filling and solidifying a first thermocouple electrode wire and a second thermocouple electrode wire into the first and second through holes of the through-hole pair includes the following steps:

[0024] Prepare a first slurry made of the same material as the first thermocouple electrode wire and a second slurry made of the same material as the second thermocouple electrode wire;

[0025] One end of the first thermocouple electrode wire is melted into a metal ball using a high-temperature flame, such that the diameter of the metal ball is larger than the diameter of the first through hole.

[0026] The first thermocouple electrode wire is inserted into the first through hole of the first substrate, and the metal ball protruding from the upper surface of the first substrate is polished so that the front end of the metal ball forms a circular foil, the diameter of which is larger than the diameter of the first through hole.

[0027] The first slurry is applied to the lower surface of the circular foil, and stress is applied to make the circular foil adhere tightly and seal the first through hole. The first slurry is used to fill the gap between the first thermocouple electrode wire and the first through hole.

[0028] Drying and sintering are performed to complete the filling and solidification of the first thermocouple electrode wire;

[0029] Prepare a metal paste of the same material as the second thermocouple electrode wire;

[0030] One end of the second thermocouple electrode wire is melted into a metal ball using a high-temperature flame, such that the diameter of the metal ball is larger than the diameter of the second through hole;

[0031] The second thermocouple electrode wire is inserted into the second through hole of the measuring end, and the metal ball is polished so that the front end of the metal ball forms a circular foil, the diameter of which is larger than the diameter of the second through hole.

[0032] The second thermocouple electrode wire paste is applied to the lower surface of the circular foil, stress is applied to make the circular foil adhere tightly and seal the second through hole, and the gap between the second thermocouple electrode wire and the second through hole is filled with the second thermocouple electrode wire paste.

[0033] Drying and sintering are performed to complete the filling and curing of the second thermocouple electrode wire.

[0034] The temperature sensor and its fabrication method for temperature field testing provided in this application have the following advantages:

[0035] By adopting this application, accurate measurement of temperature field distribution on a plane or curved surface is achieved. It is not only suitable for high-temperature environments, but also, combined with the structural design of the thermopile, can improve the sensitivity of temperature measurement and enable the identification of minute temperature differences. Attached Figure Description

[0036] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings.

[0037] Figure 1 This is a schematic diagram of the measuring end of a temperature sensor for measuring the temperature field distribution in a two-dimensional plane according to an embodiment of this application;

[0038] Figure 2 yes Figure 1 Sectional view at point AA;

[0039] Figure 3 This is a schematic diagram of the structure of the reference end of a temperature sensor according to an embodiment of this application;

[0040] Figure 4This is a schematic diagram of the structure of a temperature sensor for measuring the temperature field distribution on a cylindrical wall, according to another embodiment of this application.

[0041] Figure 5 yes Figure 4 Sectional view at point BB;

[0042] Figure 6 yes Figure 4 Sectional view at point CC.

[0043] Figure label:

[0044] 1.1' First substrate 5.5' Hot junction

[0045] 2, 2' Second substrate 6, 6' First thermocouple electrode wire

[0046] 3' First through hole; 7' Second thermocouple electrode wire

[0047] 4, 4' Second Through Hole Detailed Implementation

[0048] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted. The words “or” and “or” in the specification may mean “and” or “or”. Although the terms “upper,” “lower,” “between,” etc., may be used in this specification to describe different exemplary features and elements of this application, these terms are used herein only for convenience, such as the orientation according to the examples described in the accompanying drawings. Nothing in this specification should be construed as requiring a specific three-dimensional orientation of the structure to fall within the scope of this application. Although “first” or “second,” etc., are used in this specification to denote certain features, they are merely indicative of function and not as a limitation on the number or importance of specific features.

[0049] This application provides a temperature sensor for temperature field testing, which can be used to test the temperature field distribution on a two-dimensional plane or curved surface, and can also be used for testing the temperature field distribution in three-dimensional space. Figures 1-3As shown in one embodiment of this application, the temperature sensor includes a measuring end and a reference end. The measuring end includes a first substrate 1, and the reference end includes a second substrate 2. The first substrate 1 and the second substrate 2 each have multiple pairs of through holes, which extend along the thickness direction of the first substrate 1 and the second substrate 2. The number of through hole pairs in the first substrate 1 and the second substrate 2 are the same and they are arranged in a one-to-one correspondence. Each through hole pair includes a first through hole 3 and a second through hole 4. The inner diameter of the first through hole 3 and the second through hole 4 can be 0.1 mm to 1 mm.

[0050] In this embodiment, the first substrate 1 is a thin sheet with a thickness of less than or equal to 5 mm. The shape of the first substrate 1 is not limited to the rectangle shown in the figure; it can also be circular, square, elliptical, etc., from a top view. The surface of the first substrate 1 can be planar or curved. The second substrate 2 is cylindrical with a thickness greater than or equal to 20 mm. The second substrate 2 can be cylindrical, cuboid, cube, etc., and its surface can be planar or curved. To ensure the temperature resistance of the sensor, the material of the first substrate 1 can be a temperature-resistant material such as alumina, silicon oxide, quartz, or mica. The material of the second substrate 2 is an easily processed insulating material such as acrylic plastic.

[0051] Different first thermocouple electrode wires 6 and second thermocouple electrode wires 7 pass through the first through hole 3 and the second through hole 4, respectively. The thermocouple electrode wires can be made of standard thermocouple materials such as type E and type K, or non-standard thermocouple materials such as Au-Pt. A thermal junction 5 is formed on the upper surface of the first substrate 1 between the first through hole 3 and the second through hole 4 of each through hole pair using a film printing technique to connect the first end of the first thermocouple electrode wire 6 and the first end of the second thermocouple electrode wire 7. The first thermocouple electrode wire 6 and the second thermocouple electrode wire 7 in each through hole pair form a thermocouple. The thermal junction 5 is formed as a metal thin film, the width of which is slightly larger than the diameter of the through hole, and the thickness is maintained below 20 μm. In one embodiment, the material of the thermal junction 5 is different from that of the first thermocouple electrode wire 6 and the second thermocouple electrode wire 7. In another embodiment, the hot junction 5 is formed by overlapping a first metal film and a second metal film, wherein the first metal film is made of the same material as the first thermocouple electrode wire 6, and the second metal film is made of the same material as the second thermocouple electrode wire 7.

[0052] The first thermocouple electrode wire 6 and the second thermocouple electrode wire 7 pass through the lower surface of the first substrate 1 and then through the reference end, with extensions of a certain length formed at the second ends of the first thermocouple electrode wire 6 and the second thermocouple electrode wire 7, respectively. The extensions of the first thermocouple electrode wire 6 and the second thermocouple electrode wire 7 in the plurality of through-hole pairs are connected to the measurement circuit in parallel and / or series. Specifically, in one embodiment, the extensions of the first thermocouple electrode wire 6 and the second thermocouple electrode wire 7 in the plurality of through-hole pairs are connected to the measurement circuit in parallel via compensating wires. In another embodiment, after the extensions of the first thermocouple electrode wire 6 and the second thermocouple electrode wire 7 in the plurality of through-hole pairs are alternately connected in series, the extensions of the first thermocouple electrode wire 6 and the second thermocouple electrode wire 7 at their beginning and end are connected to the measurement circuit via compensating wires, thereby realizing the series connection of multiple pairs of thermocouple electrode wires and enhancing the measurement signal. In another embodiment, the first thermocouple electrode wire 6 and the second thermocouple electrode wire 7 in some of the through-hole pairs can be connected in series and then connected in parallel with other thermocouple electrode wires to the measurement circuit. For example, the formed thermocouples are arranged in m rows and n columns, with m thermocouples in each row connected in series to form n sets of thermocouples, and the n sets of thermocouples are connected in parallel to the measurement circuit; or n thermocouples in each column are connected in series to form m sets of thermocouples, and the m sets of thermocouples are connected in parallel to the measurement circuit.

[0053] By adopting this application, accurate measurement of temperature field distribution on a plane or curved surface is achieved. It is not only suitable for high-temperature environments, but also allows some thermocouples to be connected in series to form a thermopile. Combined with the structural design of the thermopile, the measurement signal is amplified, which can improve the sensitivity and accuracy of temperature measurement and enable the identification of minute temperature differences.

[0054] In use, the reference terminal is calibrated and measured in a constant temperature environment, such as a constant temperature environment or a constant temperature water-cooled environment. Therefore, the sensor's cold junction temperature is not affected by room temperature fluctuations, and no signal compensation is required, allowing for accurate measurement of the temperature field distribution on a two-dimensional surface.

[0055] The first base 1 is cylindrical, and the second base 2 is cylindrical surrounding the outside of the first base 1. In other alternative embodiments, the first base may also be other curved cavities, such as a U-shape.

[0056] This application embodiment also provides a method for fabricating a temperature sensor for temperature field testing, the method comprising the following steps:

[0057] The first base 1 of the measuring end and the second base 2 of the reference end are processed according to the shape of the measuring surface. The first base 1 and the second base 2 are respectively formed with multiple pairs of through holes.

[0058] A thermal junction 5 is prepared on the upper surface of the first substrate 1 at the position corresponding to each pair of through holes using a printing process;

[0059] The first thermocouple electrode wire 6 and the second thermocouple electrode wire 7 are filled and solidified in the first through hole 3 and the second through hole 4 of the through hole pair, and the first end of the first thermocouple electrode wire 6 and the first end of the second thermocouple electrode wire 7 are connected through the thermal junction 5. The second end of the first thermocouple electrode wire 6 and the second end of the second thermocouple electrode wire 7 respectively pass through the second substrate 2 and form an extension section.

[0060] The extensions of the first thermocouple electrode wire 6 and the second thermocouple electrode wire 7 in the multiple through-hole pairs are connected to the measurement circuit in parallel and / or in series. For example, according to actual test needs, the first thermocouple electrode wire 6 and the second thermocouple electrode wire 7 in the multiple through-hole pairs are alternately connected in series by welding or winding to form a cold node.

[0061] The order of the steps in the above method is not limited. For example, a first substrate 1 and a second substrate 2 can be prepared first, and multiple pairs of through holes can be formed on the first substrate 1 and the second substrate 2 respectively. Then, the first thermocouple electrode wire 6 and the second thermocouple electrode wire 7 can be uniformly filled and solidified into the pairs of through holes in the first substrate 1 and the second substrate 2. Alternatively, a first substrate 1 can be prepared first, and multiple pairs of through holes can be formed on the first substrate 1. Then, the first thermocouple electrode wire 6 and the second thermocouple electrode wire 7 can be filled and solidified into the pairs of through holes in the first substrate 1. Then, a second substrate 2 can be prepared, and multiple pairs of through holes can be formed on the second substrate 2, so that the first thermocouple electrode wire 6 and the second thermocouple electrode wire 7 pass through the pairs of through holes in the second substrate 2. The preparation of the thermal junction can be done before, after, before or after the filling of the first thermocouple electrode wire 6 and the second thermocouple electrode wire 7, or before or after the preparation of the second substrate 2, etc., all of which are within the scope of protection of this application.

[0062] The temperature sensor prepared by this method can accurately measure the temperature field distribution on a plane or curved surface. It is not only suitable for high-temperature environments, but also allows some thermocouples to be connected in series to form a thermopile. By combining the structural design of the thermopile and amplifying the measurement signal, the sensitivity and accuracy of temperature measurement can be improved, and the identification of minute temperature differences can be achieved.

[0063] In one embodiment, the preparation of the hot junction 5 includes the following steps:

[0064] Select a first paste and a second paste made of the same material as the first thermocouple electrode wire 6 and the second thermocouple electrode wire 7. Use a printing process to cover the first through hole 3 and extend it to the outside of the second through hole 4 with the first paste. After sintering to obtain a first metal film, cover the second through hole 4 and extend it to the outside of the first through hole 3 with the second paste. After sintering to obtain a second metal film, form the heat junction 5 at the overlapping position of the first metal film and the second metal film.

[0065] In another embodiment, the preparation of the hot junction 5 includes the following steps:

[0066] A metal paste of a different material from both the first thermocouple electrode wire 6 and the second thermocouple electrode wire 7 is selected. The metal paste is then used to cover the first through hole 3 and the second through hole 4 of the through hole pair through a printing process. After sintering, a metal film is formed, which serves as the heat junction 5.

[0067] In this embodiment, the first thermocouple electrode wire 6 and the second thermocouple electrode wire 7 are filled and solidified in the first through hole 3 and the second through hole 4 of the through hole pair, including the following steps:

[0068] Prepare a first slurry of the same material as the first thermocouple electrode wire 6 and a second slurry of the same material as the second thermocouple electrode wire 7;

[0069] One end of the first thermocouple electrode wire 6 is melted into a metal ball using a high-temperature flame, so that the diameter of the metal ball is slightly larger than the diameter of the first through hole 3.

[0070] The first thermocouple electrode wire 6 is inserted into the first through hole 3 of the first substrate 1, and the metal ball protruding from the upper surface of the first substrate 1 is polished so that the front end of the metal ball forms a circular foil, the diameter of which is slightly larger than the diameter of the first through hole 3.

[0071] The first slurry is applied to the lower surface of the circular foil, and stress is applied to make the circular foil adhere tightly to and seal the first through hole 3. The first slurry is used to fill the gap between the first thermocouple electrode wire 6 and the first through hole 3.

[0072] Drying and sintering are performed to complete the filling and curing of the first thermocouple electrode wire 6;

[0073] Prepare a metal paste of the same material as the second thermocouple electrode wire 7;

[0074] One end of the second thermocouple electrode wire 7 is melted into a metal ball using a high-temperature flame, so that the diameter of the metal ball is slightly larger than the diameter of the second through hole 4;

[0075] The second thermocouple electrode wire 7 is inserted into the second through hole 4 of the measuring end, and the metal ball is polished so that the front end of the metal ball forms a circular foil, the diameter of which is slightly larger than the diameter of the second through hole 4.

[0076] The second thermocouple electrode wire 7 paste is applied to the lower surface of the circular foil, stress is applied to make the circular foil adhere tightly and seal the second through hole 4, and the gap between the second thermocouple electrode wire 7 and the second through hole 4 is filled with the second thermocouple electrode wire 7 paste.

[0077] Drying and sintering are performed to complete the filling and curing of the second thermocouple electrode wire 7;

[0078] After the first thermocouple electrode wire 6 and the second thermocouple electrode wire 7 are sintered, the upper surface of the measuring end is ground and polished.

[0079] The following is a detailed introduction Figures 1-3 The illustrated embodiments and Figures 4-6 The illustrated embodiment shows the structure of the temperature sensor. It is understood that... Figures 1-6 The illustrated embodiment structures and the following description are merely examples and are not intended to limit the scope of protection of this application.

[0080] like Figures 1-3 As shown, in one embodiment, the temperature sensor includes a measuring end and a reference end. The surface of the first substrate 1 of the measuring end is rectangular, the first substrate 1 has dimensions of 12mm × 100mm, a thickness of 1mm, and is made of alumina ceramic. The fabrication method of the temperature sensor in this embodiment includes the following steps:

[0081] (1) A 3×10 array of through-hole pairs is formed on the first substrate 1, and the multiple through-hole pairs are distributed at equal intervals. The diameter of the through-hole is 0.5 mm.

[0082] (2) A heat junction 5, consisting of an overlapping NiCr alloy film and a NiSi alloy film, is prepared on the upper surface of the first substrate 1 using a printing process. Screen printing can be employed to print the heat junction 5. Figure 1 The pattern shown has a thermal junction 5 with a width slightly larger than the diameter of the through hole, which is 0.75 mm. The NiCr alloy film is made of the same material as the first thermocouple electrode wire, and the NiSi alloy film is made of the same material as the second thermocouple electrode wire.

[0083] Specifically, NiCr ink is screen-printed onto a first substrate 1, forming a pattern that extends from around the first through-hole 3 of each through-hole pair to the outside of the second through-hole 4. The first substrate 1 is then dried in an oven for 20 minutes and sintered in a nitrogen sintering furnace for 1 hour to form a NiCr alloy film. After removal, NiSi ink is screen-printed onto the first substrate 1, forming a pattern that extends from around the second through-hole 4 of each through-hole pair to the outside of the first through-hole 3. The first substrate 1 is then dried in an oven for 20 minutes and sintered in a nitrogen sintering furnace for 1 hour to form a NiSi alloy film. Thus, the formed NiCr alloy film and NiSi alloy film overlap between the first through-hole 3 and the second through-hole 4 of each through-hole pair, forming a heat junction 5.

[0084] (3) The first thermocouple electrode wire 6 and the second thermocouple electrode wire 7 are embedded in the first through hole 3 and the second through hole 4 of the through hole pair. They are NiCr electrode wire and NiSi electrode wire respectively, with a wire diameter of 0.3mm.

[0085] Specifically, firstly, a high-temperature flame gun is used to melt one end of a NiCr electrode wire into a metal sphere with a diameter between 0.5 and 0.75 mm. Then, the NiCr electrode wire is inserted into each of the first through holes 3, with the metal sphere protruding upwards on the upper surface of the first substrate 1, i.e., the measuring surface. The metal sphere is then polished flat to form a circular foil with a diameter greater than 0.5 mm. Next, NiCr ink is applied to the lower surface of the circular foil, and a certain stress is applied to make the foil adhere tightly and seal the first through holes 3. NiCr ink is then filled into the gap between the NiCr electrode wire and the first through holes 3, followed by drying and sintering. Similarly, a high-temperature flame gun is used to melt one end of a NiSi electrode wire into a metal sphere with a diameter between 0.5 and 0.75 mm. Then, the NiSi electrode wire is inserted into each of the second through holes 4, with the metal sphere protruding upwards on the upper surface of the first substrate 1, i.e., the measuring surface. The metal sphere is then polished flat to form a circular foil with a diameter greater than 0.5 mm. Next, NiSi ink is applied to the lower surface of the circular foil, and a certain stress is applied to make the circular foil adhere tightly and seal the second through hole 4. NiSi ink is then filled into the gap between the NiSi electrode wire and the second through hole 4. After drying and sintering, a shape is formed as shown in the figure. Figure 2 The cross-sectional structure shown has its upper surface of the measuring end appropriately ground and polished, and each set of through holes forms a thermocouple structure.

[0086] (4) According to Figure 3 A second substrate 2 is made of acrylic plastic. NiCr and NiSi electrode wires are inserted into the second substrate 2 and extended 20mm to form an extension section. AB strong adhesive is used to solidify the electrode wires within the through-holes, and all three sets of thermocouples in the longitudinal direction are connected in series. Specifically, the NiCr and NiSi electrode wires aligned in adjacent through-holes are spot-welded.

[0087] Thus, it was made into such a Figure 1 The temperature sensor shown in the test plane temperature field distribution has each set of thermocouple structures connected in series in the longitudinal direction connected in parallel to the measurement circuit via Cu wires. In use, the reference end is placed in a constant temperature water-cooled bath to form a temperature sensor that can measure the transverse temperature field distribution. By connecting three pairs of thermocouple structures in series in the longitudinal direction, the thermoelectric potential signal can be effectively enhanced, thereby improving the sensitivity and resolution of temperature measurement.

[0088] like Figures 4-6 As shown, in another embodiment of this application, the temperature sensor can measure the temperature field distribution on the wall surface of the cylindrical component. The first substrate 1' is cylindrical, and the second substrate 2' is a cylindrical shape surrounding the outer side of the first substrate. Both the first substrate 1' and the second substrate 2' are cylindrical, with a height of 30 mm and a wall thickness of 0.5 mm, and are made of alumina ceramic. The inner diameter of the first substrate 1' is... The inner diameter of the second base 2' is

[0089] (1) Multiple sets of through holes with a first through hole 3' and a second through hole 4' are machined on the first base 1' of the measuring end. The through hole pairs are distributed in multiple layers of annular equidistant spacing along the axial direction, with a total of 6 layers. Each layer has 10 sets of through hole pairs distributed in annular equidistant spacing, and the diameter of the through holes is 0.3 mm.

[0090] (2) A heat junction 5' is prepared between the first through-hole 3' and the second through-hole 4' on the inner wall of the first substrate 1' using a printing process. Ni ink can be printed using pad printing to form a heat junction 5'. Figure 5 The pattern shown has a width slightly larger than the diameter of the through-hole, approximately 0.5 mm. It is then dried in an oven for 20 minutes, followed by sintering in a nitrogen sintering furnace for 1 hour to form a Ni metal film. This Ni metal film thus covers and connects the first through-hole 3' and the second through-hole 4'. The hot junction preparation method of this embodiment can also refer to the preparation method described in the above embodiments, but is not limited to the method described herein.

[0091] (3) First thermocouple electrode wire 6' and second thermocouple electrode wire 7' are embedded in the first through hole 3' and the second through hole 4' of the through hole pair, respectively. They are E-type thermocouple electrode wires of NiCr alloy and NiCu alloy, respectively, with a wire diameter of 0.1mm.

[0092] Specifically, firstly, a high-temperature flame gun is used to melt one end of a NiCr electrode wire into a metal sphere with a diameter between 0.3 and 0.5 mm. Then, the NiCr electrode wire is inserted into a planar substrate with a 0.3 mm diameter through-hole, and the protruding metal sphere is polished to form a circular foil with a diameter greater than 0.3 mm. Next, the NiCr electrode wire is inserted from the inside to the outside along the first through-hole 3' of the first substrate 1', and NiCr ink is applied to the lower surface of the circular foil. A certain stress is applied to make the circular foil adhere tightly and seal the first through-hole 3'. NiCr ink is then filled into the gap between the NiCr electrode wire and the first through-hole 3', followed by drying and sintering. Similarly, a high-temperature flame gun is used to melt one end of a NiCu electrode wire into a metal sphere with a diameter between 0.3 and 0.5 mm. Then, the NiCu electrode wire is inserted into a planar substrate with a 0.3 mm diameter through-hole, and the protruding metal sphere is polished to form a circular foil with a diameter greater than 0.3 mm. Next, the NiCu electrode wire is threaded through the second through-hole 4' of the first substrate 1' from the inside out. NiCu ink is applied to the lower surface of the circular foil, and a certain stress is applied to make the circular foil adhere tightly and seal the second through-hole 4'. NiCu ink is then filled into the gap between the NiCu electrode wire and the second through-hole 4', followed by drying and sintering. After completion, the inner wall of the first substrate 1' at the measuring end is appropriately polished, and a thermocouple structure is formed in each set of through-holes.

[0093] (4) The same number of through-hole pairs as the first substrate 1' are machined on the second substrate 2', with the through-hole pairs evenly spaced along both the axial and circumferential directions, such as... Figure 6 As shown, NiCr and NiSi electrode wires are inserted into the second substrate 2', with the extension line of the electrode wire passing through the center of the loop. The electrode wire is then cured in the through hole of the second substrate 2' using inorganic high-temperature adhesive. The second end of the electrode wire extends 2 mm from the outer wall of the second substrate 2', forming an extension section.

[0094] Thus, it was made into such a Figure 4 The temperature sensor shown is designed to measure the temperature field distribution on the cylindrical wall. All NiCr-NiSi thermocouples are connected in parallel to the circuit via Cu wires. When in use, the second substrate 2' is placed in a constant temperature environment to form a temperature sensor that can measure the temperature field distribution on the cylindrical wall. It has 60 temperature measurement points and is suitable for applications such as three-dimensional reaction calorimetry.

[0095] The examples of materials and numerical ranges used in the above embodiments are merely illustrative and are not intended to limit the scope of protection of this application. The materials and numerical ranges can be adapted to different application scenarios and usage requirements.

[0096] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.

Claims

1. A temperature sensor for use in temperature field testing, characterized in that It includes a measuring end and a reference end. The measuring end includes a first substrate, and the reference end includes a second substrate. The first substrate and the second substrate are respectively formed with a plurality of through hole pairs. Each through hole pair includes a first through hole and a second through hole. A first thermocouple electrode wire and a second thermocouple electrode wire pass through the first through hole and the second through hole, respectively. A thermal junction is formed on the upper surface of the first substrate between the first and second through holes of each through hole pair to connect the first end of the first thermocouple electrode wire and the first end of the second thermocouple electrode wire. The first thermocouple electrode wire and the second thermocouple electrode wire pass through the lower surface of the first substrate and then through the reference end, and extension sections are formed at the second ends of the first thermocouple electrode wire and the second thermocouple electrode wire, respectively. In this configuration, the extensions of the first thermocouple electrode wire and the second thermocouple electrode wire in the plurality of through-hole pairs are connected to the measurement circuit in parallel via compensating wires; and / or, after the extensions of the first thermocouple electrode wire and the second thermocouple electrode wire in the plurality of through-hole pairs are connected in series alternately, the extensions of the first thermocouple electrode wire and the second thermocouple electrode wire at the beginning and end are connected to the measurement circuit via compensating wires. Wherein, the hot junction is a metal thin film, the material of which is different from that of the first thermocouple electrode wire and the second thermocouple electrode wire; or, the hot junction is formed by overlapping the first metal thin film and the second metal thin film, the first metal thin film being the same material as the first thermocouple electrode wire, and the second metal thin film being the same material as the second thermocouple electrode wire.

2. The temperature sensor for warm field testing according to claim 1, characterized in that, The first substrate is a rectangular or circular planar thin sheet; or, the first substrate is a cylindrical or U-shaped curved cavity.

3. The temperature sensor for use in warm field testing according to claim 1, characterized in that, The reference terminal is set in a constant temperature environment or a constant temperature water-cooled environment.

4. A method for the production of a temperature sensor for temperature field testing, characterized in that The method for preparing the temperature sensor as described in claim 1 comprises the following steps: A first substrate for the measuring end and a second substrate for the reference end are processed, wherein the first substrate and the second substrate are each formed with a plurality of through-hole pairs; A thermal junction is prepared on the upper surface of the first substrate at the position corresponding to each pair of through holes using a printing process; A first thermocouple electrode wire and a second thermocouple electrode wire are filled and solidified in the first and second through holes of the through hole pair, and the first end of the first thermocouple electrode wire and the first end of the second thermocouple electrode wire are connected through the thermal junction. The second end of the first thermocouple electrode wire and the second end of the second thermocouple electrode wire respectively pass through the second substrate to form an extension section. The extensions of the first thermocouple electrode wire and the extensions of the second thermocouple electrode wire in the plurality of through-hole pairs are connected to the measurement circuit in parallel and / or in series. The preparation of the hot junction includes the following steps: A first paste and a second paste, made of the same material as the first and second thermocouple electrode wires, are selected. The first paste is printed to cover the area around the first through-hole and extend to the outside of the second through-hole. After sintering to obtain a first metal film, the second paste is printed to cover the area around the second through-hole and extend to the outside of the first through-hole. After sintering, a second metal film is obtained. The heat junction is formed at the overlapping position of the first and second metal films; or... A metal paste of a different material from both the first and second thermocouple electrode wires is selected. The metal paste is then used to cover the first and second through holes of the through-hole pair through a printing process. After sintering, a metal film is formed, which serves as the heat junction.

5. The method of claim 4, wherein the temperature sensor is prepared for use in a temperature field test. The process of filling and solidifying a first thermocouple electrode wire and a second thermocouple electrode wire into the first and second through holes of the through-hole pair includes the following steps: Prepare a first slurry made of the same material as the first thermocouple electrode wire and a second slurry made of the same material as the second thermocouple electrode wire; One end of the first thermocouple electrode wire is melted into a metal ball using a high-temperature flame, such that the diameter of the metal ball is larger than the diameter of the first through hole. The first thermocouple electrode wire is inserted into the first through hole of the first substrate, and the metal ball protruding from the upper surface of the first substrate is polished so that the front end of the metal ball forms a circular foil, the diameter of which is larger than the diameter of the first through hole. The first slurry is applied to the lower surface of the circular foil, and stress is applied to make the circular foil adhere tightly and seal the first through hole. The first slurry is used to fill the gap between the first thermocouple electrode wire and the first through hole. Drying and sintering are performed to complete the filling and solidification of the first thermocouple electrode wire; Prepare a metal paste of the same material as the second thermocouple electrode wire; One end of the second thermocouple electrode wire is melted into a metal ball using a high-temperature flame, such that the diameter of the metal ball is larger than the diameter of the second through hole; The second thermocouple electrode wire is inserted into the second through hole of the measuring end, and the metal ball is polished so that the front end of the metal ball forms a circular foil, the diameter of which is larger than the diameter of the second through hole. The second thermocouple electrode wire paste is applied to the lower surface of the circular foil, stress is applied to make the circular foil adhere tightly and seal the second through hole, and the gap between the second thermocouple electrode wire and the second through hole is filled with the second thermocouple electrode wire paste. Drying and sintering are performed to complete the filling and curing of the second thermocouple electrode wire.

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