An optical module

Abstract

The application discloses an optical module, comprising: a cavity formed by a top shell and a bottom shell; a circuit board arranged in the cavity and fixedly connected with the bottom shell; a sub-circuit board arranged above the circuit board. A fixing frame comprises a base and a support which are detachably connected. The support comprises a supporting column and a pressing plate, one end of the supporting column is connected with the pressing plate, and the other end of the supporting column is connected with the base. The base comprises a fixing part which is hung below the inner wall of the top shell, and the sub-circuit board is arranged below the fixing part. A light source mounting part is arranged above the circuit board and located at one side of the fixing part. A light source emitter is arranged between the light source mounting part and the pressing plate and emits light without carrying signals. The sub-circuit board is fixed to the top shell through the fixing part, the light source emitter is fixed to the fixing frame, and then the fixing frame is fixed to the lower surface of the top shell, so that the installation and fixation of the light source emitter in the optical module are realized.

Description

[0001] This application is a divisional application, the original application number is 202111342027.5, the original application date is November 12, 2021, and the entire contents of the original application are incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the field of communication technology, in particular to an optical module. BACKGROUND

[0003] With the development of new business and application modes such as cloud computing, mobile Internet, video, etc., the development and progress of optical communication technology become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals, and are one of the key devices in optical communication equipment. With the development needs of optical communication technology, the transmission rate of optical modules is continuously increasing.

[0004] With the miniaturization of devices, the distribution of optical and electrical devices inside the optical module is more compact and occupies less space. SUMMARY

[0005] The present application provides an optical module to reduce the space of internal components of the optical module.

[0006] To solve the above technical problems, the present application discloses the following technical solutions:

[0007] The present application discloses an optical module, comprising:

[0008] an upper shell;

[0009] a lower shell, which is combined with the upper shell to form a wrapped cavity;

[0010] a circuit board, which is arranged in the wrapped cavity and fixedly connected with the lower shell; the circuit board is provided with an optical modulation chip;

[0011] a sub-circuit board, which is arranged above the circuit board;

[0012] a fixing frame, comprising a base and a support, the support being detachably connected with the base; wherein the support comprises a supporting column and a pressing plate, one end of the supporting column being connected with the pressing plate, and the other end of the supporting column being connected with the base;

[0013] the base comprises:

[0014] a fixing part, which is hung below the inner wall of the upper shell, and the sub-circuit board is arranged below the fixing part; and

[0015] a light source mounting part, which is arranged above the circuit board and located on one side of the fixing part;

[0016] The light source emitter is arranged between the light source mounting portion and the pressing plate, a side wall of the light source emitter is provided with a pin, and the pin is connected with the sub-circuit board; wherein the pressing plate is fixedly connected with the supporting column; the light source emitter is located above the circuit board, the light source emitter emits light without carrying a signal, and the light modulation chip loads a signal on the light to form signal light.

[0017] Compared with the prior art, the present application has the following beneficial effects:

[0018] The present application discloses a kind of optical modules, comprising: the package cavity formed by upper shell and lower shell cover;Circuit board is arranged in package cavity, and is fixedly connected with lower shell;Sub-circuit board is arranged above the circuit board.Fixing frame, including detachably connected base and support.The support includes supporting column and pressing plate, one end of the supporting column is connected with the pressing plate, and the other end of the supporting column is connected with the base.The base includes: fixed part, hoisting in the lower wall of upper shell, and sub-circuit board is arranged below the fixed part.Light source mounting portion is arranged above the circuit board, and is located at one side of fixed part.Light source emitter is arranged between light source mounting portion and pressing plate, and emits light without carrying a signal.The present application fixes sub-circuit board to upper shell by fixed part, and light source emitter is connected between fixing frame and upper shell.Finally, light source emitter is fixed on fixing frame, and fixing frame is fixed on the lower surface of upper shell, realize the installation and fixation of light source emitter in optical module, and light source emitter is connected with upper shell by base, and the heat dissipated by light source emitter is transmitted to upper shell by base, improve heat dissipation effect.When disassembling, only need to unscrew a few turns of screw connected between supporting column and base, and the connection between light source emitter and base can be released.Therefore, when repairing and replacing light source emitter, only need to unscrew the screw connected between supporting column and base, and light source emitter can be taken out, which is convenient and fast. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, for those skilled in the art, other drawings can also be obtained from these drawings without any creative effort.

[0020] Figure 1 It is a connection diagram of an optical communication system according to some embodiments.

[0021] Figure 2 It is a structural diagram of an optical network terminal according to some embodiments.

[0022] Figure 3 It is a structural diagram of an optical module according to some embodiments.

[0023] Figure 4 It is an exploded view of an optical module according to some embodiments.

[0024] Figure 5 A light source emitter and a circuit board disassembled schematic view is provided for the embodiment of the present application;

[0025] Figure 6 A light module partial cross-sectional view is provided for the embodiment of the present application;

[0026] Figure 7 A structure schematic view of an upper shell and a light emitting component is provided for the embodiment of the present application;

[0027] Figure 8 A structure schematic view of an upper shell is provided for the embodiment of the present application;

[0028] Figure 9 A structure schematic view of a light source emitter is provided for the embodiment of the present application;

[0029] Figure 10 Another angle structure schematic view of a light source emitter is provided for the embodiment of the present application;

[0030] Figure 11 A disassembled structure schematic view of a light source emitter is provided for the embodiment of the present application;

[0031] Figure 12 A disassembled structure schematic view of a sub-circuit board and a light source is provided for the embodiment of the present application;

[0032] Figure 13 A disassembled structure schematic view of a fixing frame is provided for the embodiment of the present application;

[0033] Figure 14 Another angle disassembled schematic view of a fixing frame is provided for the embodiment of the present application;

[0034] Figure 15 Another angle structure schematic view of an upper shell is provided for the embodiment of the present application;

[0035] Figure 16 A disassembled structure schematic view of an upper shell and a fixing frame is provided for the embodiment of the present application;

[0036] Figure 17 A structure schematic view of an upper shell, a light source emitter and a fiber adapter is provided for the embodiment of the present application;

[0037] Figure 18 A structure schematic view of a circuit board and a lower shell is provided for the embodiment of the present application;

[0038] Figure 19 A disassembled structure schematic view of a circuit board and a lower shell is provided for the embodiment of the present application;

[0039] Figure 20A fixed frame, an optical fiber support and a circuit board structure schematic diagram provided for an embodiment of the present application;

[0040] Figure 21 A split structure schematic diagram of an optical fiber support and a circuit board provided for an embodiment of the present application;

[0041] Figure 22 Another angle structure schematic diagram of an optical fiber support provided for an embodiment of the present application;

[0042] Figure 23 An optical module local structure schematic diagram provided for an embodiment of the present application Figure 2 ;

[0043] Figure 24 A cross-sectional schematic diagram of an optical module local structure provided for an embodiment of the present application. DETAILED DESCRIPTION

[0044] The technical solutions in some embodiments of the present disclosure will be described clearly and completely in combination with the drawings. Obviously, the described embodiments are only some of the embodiments of the present disclosure, not all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by those skilled in the art belong to the scope of protection of the present disclosure.

[0045] Unless otherwise required by the context, throughout the specification and claims, the term "comprise" and other forms such as "comprises" and "comprising" are to be construed as open, inclusive meaning, i.e. "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to mean that the specific features, structures, materials or characteristics related to the embodiment or example are included in at least one embodiment or example of the present disclosure. The illustrative representation of the above terms does not necessarily mean the same embodiment or example. In addition, the specific features, structures, materials or characteristics described can be included in any one or more embodiments or examples in any appropriate manner.

[0046] The terms "first", "second", etc. are used herein only to describe one implementation, and do not imply either or both spatial or temporal precedence. With regard to the terms "a or more" and "multiple", terms are construed to include one or more of a particular feature unless otherwise indicated.

[0047] In describing some embodiments, "coupled" and "connected", and variations thereof, can be used. For example, some embodiments can be described as being "connected", to indicate that two or more elements are either in direct physical or electrical contact with each other, or there are two or more elements are not in direct contact with each other, but still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited in this context.

[0048] "A, B, and C, at least one of" has the same meaning as "at least one of A, B, or C", includes the following combinations: only A, only B, only C, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.

[0049] "A and / or B" includes the following three combinations: A alone, B alone, and a combination of A and B.

[0050] The use of "adapted to" or "configured to" herein means open and inclusive language that does not exclude additional devices or steps not explicitly described.

[0051] As used herein, "about", "approximately", or "around" includes the recited value and the average value within an acceptable range of deviation from the particular value, as determined by one of ordinary skill in the art considering the measurement being discussed and the error in measurement associated with the particular quantity being measured (i.e., the limitations of the measurement system).

[0052] In optical communication technology, light carries the information to be transmitted, and the information-carrying optical signal is transmitted to information processing equipment such as computers through information transmission equipment such as optical fibers or optical waveguides to complete the information transmission. Because optical signals have passive transmission characteristics when transmitted through optical fibers or optical waveguides, low-cost and low-loss information transmission can be achieved. However, the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that information processing equipment such as computers can recognize and process are electrical signals. Therefore, in order to establish an information connection between information transmission equipment such as optical fibers or optical waveguides and information processing equipment such as computers, it is necessary to realize the mutual conversion between electrical signals and optical signals.

[0053] In the field of optical fiber communication technology, optical modules realize the aforementioned functions of converting between optical signals and electrical signals. An optical module includes an optical port and an electrical port. The optical port enables optical communication with information transmission devices such as optical fibers or optical waveguides, while the electrical port enables electrical connection with optical network terminals (e.g., optical modems). The electrical connection is mainly used for power supply, I2C signal transmission, data signal transmission, and grounding. The optical network terminal transmits electrical signals to information processing devices such as computers via network cables or Wi-Fi.

[0054] Figure 1 This is a connection diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0055] One end of optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 via optical module 200. Optical fiber itself can support long-distance signal transmission, such as signal transmission over several kilometers (6 to 8 kilometers). Theoretically, ultra-long-distance transmission can be achieved by using repeaters. Therefore, in typical optical communication systems, the distance between the remote server 1000 and the optical network terminal 100 can usually reach several kilometers, tens of kilometers, or hundreds of kilometers.

[0056] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing device 2000 can be any one or more of the following devices: router, switch, computer, mobile phone, tablet computer, television, etc.

[0057] The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

[0058] The optical module 200 includes an optical port and an electrical port. The optical port is configured to be connected with the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional optical signal connection; and the electrical port is configured to be connected with the optical network terminal 100, so that the optical module 200 and the optical network terminal 100 establish a bidirectional electrical signal connection. The optical module 200 realizes mutual conversion between optical signals and electrical signals, so that the optical fiber 101 and the optical network terminal 100 are connected. For example, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input into the optical network terminal 100; and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and then input into the optical fiber 101.

[0059] The optical network terminal 100 includes a housing in the shape of a cuboid, and an optical module interface 102 and a network cable interface 104 arranged on the housing. The optical module interface 102 is configured to be connected with the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection; and the network cable interface 104 is configured to be connected with the network cable 103, so that the optical network terminal 100 and the network cable 103 establish a bidirectional electrical signal connection. The optical module 200 and the network cable 103 are connected through the optical network terminal 100. For example, the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the signal from the network cable 103 to the optical module 200, so that the optical network terminal 100 acts as a host of the optical module 200 and can monitor the operation of the optical module 200. The host of the optical module 200 can also include an optical line terminal (OLT) and the like in addition to the optical network terminal 100.

[0060] The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.

[0061] Figure 2 FIG. 2 is a structural diagram of an optical network terminal according to some embodiments, in order to clearly show the connection relationship between the optical module 200 and the optical network terminal 100, Figure 2 Only the structure of the optical network terminal 100 related to the optical module 200 is shown. As Figure 2As shown, the optical network terminal 100 further comprises a PCB circuit board 105 arranged in the housing, a cage 106 arranged on the surface of the PCB circuit board 105, and an electrical connector arranged inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has fins or other protrusions to increase the heat dissipation area.

[0062] The optical module 200 is inserted into the cage 106 of the optical network terminal 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 and the optical network terminal 100 establish a bidirectional electrical signal connection. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional electrical signal connection.

[0063] Figure 3 FIG. 1 is a structural diagram of an optical module according to some embodiments, Figure 4 FIG. 2 is an exploded view of the optical module according to some embodiments. As Figure 3 and Figure 4 As shown, the optical module 200 comprises a housing, a circuit board 300 arranged in the housing, and an optical transceiver device.

[0064] The housing comprises an upper housing 201 and a lower housing 202. The upper housing 201 is covered on the lower housing 202 to form the above-mentioned housing with two openings 204 and 205. The outer contour of the housing generally presents a square body.

[0065] In some embodiments of the present disclosure, the lower housing 202 comprises a bottom plate and two lower side plates arranged on both sides of the bottom plate and perpendicular to the bottom plate; the upper housing 201 comprises a cover plate and two upper side plates arranged on both sides of the cover plate and perpendicular to the cover plate. The two side walls are combined with the two side plates to realize that the upper housing 201 is covered on the lower housing 202.

[0066] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or can be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end (left end) of the optical module 200, and the opening 205 is also located at the end of the optical module 200. Figure 3 Figure 3 ​Or, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold fingers of the circuit board 300 extend from the electrical port 204 and are inserted into the host computer (such as the optical network terminal 100); the opening 205 is an optical port and is configured to access the external optical fiber 101 so that the optical fiber 101 is connected to the optical transceiver inside the optical module 200.

[0067] The upper shell 201 and the lower shell 202 are combined to facilitate the installation of the circuit board 300, the optical transceiver and other devices into the shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect these devices. In addition, when the circuit board 300 and other devices are assembled, the positioning components, heat dissipation components and electromagnetic shielding components of these devices can be easily arranged, which is conducive to the implementation of automated production.

[0068] In some embodiments, the upper shell 201 and the lower shell 202 are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation.

[0069] In some embodiments, the optical module 200 further includes an unlocking component 203 located on the outer wall of the shell of the optical module 200, and the unlocking component 203 is configured to achieve the fixed connection between the optical module 200 and the host computer or to release the fixed connection between the optical module 200 and the host computer.

[0070] For example, the unlocking component 203 is located on the outer wall of the two lower side plates of the lower shell 202 and includes a clamping component that matches the cage of the host computer (for example, the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the host computer, the clamping component of the unlocking component 203 fixes the optical module 200 in the cage of the host computer. When the unlocking component 203 is pulled, the clamping component of the unlocking component 203 moves, thereby changing the connection relationship between the clamping component and the host computer, so as to release the clamping relationship between the optical module 200 and the host computer, and the optical module 200 can be pulled out of the cage of the host computer.

[0071] Circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0072] Circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably support the chip; the rigid circuit board can also be inserted into the electrical connector in the host computer cage.

[0073] The circuit board 300 also includes gold fingers formed on its end surfaces, each gold finger consisting of a plurality of independent pins. The circuit board 300 is inserted into a cage 106 and electrically connected to an electrical connector within the cage 106 by the gold fingers. The gold fingers may be located only on one side of the surface of the circuit board 300 (e.g., ...). Figure 4 The upper surface shown can also be placed on the upper and lower surfaces of the circuit board 300 to accommodate applications with a large number of pins. The gold fingers are configured to establish an electrical connection with the host computer for power supply, grounding, I2C signal transmission, and data signal transmission. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.

[0074] Optical transceiver devices include optical transmitting sub-modules and optical receiving sub-modules.

[0075] Figure 5 This is an exploded view of a light source emitter and circuit board provided in an embodiment of this application. Figure 6 This is a partial cross-sectional view of an optical module provided in an embodiment of this application. Figure 5 and Figure 6As shown, the optical module is provided with a light source emitter 410 arranged above the circuit board 300 for emitting light, and connected with an outgoing optical fiber at one end. The sub-circuit board 420 is arranged above the circuit board 300 and electrically connected with the circuit board 300 through the flexible circuit board 440. The light source emitter 410 is electrically connected with the sub-circuit board 420, and the sub-circuit board 420 drives the photoelectric device in the light source emitter 410. The fixing frame 430 is arranged above the circuit board 300 for fixing the light source emitter 410. The light source emitter 410 is fixed on the fixing frame 430, and one side is provided with a plurality of pins connected with the sub-circuit board 420. The fixing frame 430 is also connected with the upper shell, and the light source emitter 410 is fixed on the upper shell through the fixing frame 430. The heat emitted by the light source emitter 410 can be directly transmitted to the upper shell through the fixing frame, thereby improving the heat dissipation function of the optical module.

[0076] In the embodiment of the present application, the light source emitter can be a light source emitting light without signal, and the light modulation chip receives the light emitted by the light source to load signal to form signal light.

[0077] In the embodiment of the present application, the light source emitter is arranged above the circuit board for emitting light. The sub-circuit board 420 is arranged above the circuit board 300 and electrically connected with the circuit board 300 through the flexible circuit board. The light source is electrically connected with the sub-circuit board 420, and the sub-circuit board 420 drives the light source. The fixing frame 430 is arranged above the circuit board for fixing the light source. The fixing frame 430 is also connected with the upper shell 201, and the light source emitter 410 is fixed on the upper shell 201 through the fixing frame 430. The heat emitted by the light source emitter 410 can be directly transmitted to the upper shell through the fixing frame, thereby improving the heat dissipation function of the optical module.

[0078] Figure 7 A structure diagram of the upper shell and the light emitting component provided in the embodiment of the present application is shown in Figure 8 A structure diagram of the upper shell provided in the embodiment of the present application is shown in Figure 9 A structure diagram of the light source emitter provided in the embodiment of the present application is shown in Figure 7 、 Figure 8 and Figure 9As shown, the upper shell 201 comprises a cover plate 2011, and two first upper side plates 2012 and a second upper side plate 2013 vertically arranged on both sides of the cover plate 2011. The cover plate 2011 is provided with a bracket mounting groove 2014 recessed relative to the lower surface of the cover plate 2011. The bracket mounting groove 2014 is matched with the upper surface of the fixing frame, and the fixing frame 430 is mounted in the bracket mounting groove 2014. The bracket mounting groove 2014 is provided with a first fixing hole 2015 at a corner of the bracket mounting groove 2014, which is matched with the first connecting through hole 4311 of the fixing frame 430; and the bracket mounting groove 2014 is also provided with a second fixing hole 2016 at another corner of the bracket mounting groove 2014, which is matched with the second connecting through hole 4312 of the base.

[0079] In order to facilitate the connection and fixation of the fixing frame 430 and the upper shell 201 and improve the connection stability, the first fixing hole 2015 and the second fixing hole 2016 are located at opposite corners of the bracket mounting groove, which is convenient for installation and stability.

[0080] The fixing frame 430 comprises a base and a bracket. The base is a rectangular plate structure, one side is a plane structure connected with the upper shell for fixation, and the other side is provided with a plurality of avoiding grooves for fixing and mounting the light source and the sub-circuit board 420. The bracket comprises a support column and a pressing plate. The support column is arranged below the base, one end of which is connected with the base, and the other end is connected with the pressing plate. One side of the pressing plate is connected with the light source, which fixes the light source between the pressing plate and the base.

[0081] In the embodiment of the present application, the light source emitter 410 can be a common rectangular structure shell, which is provided with a light source emitter, one end of which is connected with an emitting optical fiber. The upper surface of the light source emitter 410 is connected with the lower surface of the base, and the lower surface is connected with the upper surface of the pressing plate. One side surface of the light source emitter 410 is provided with a plurality of metal pins connected with the sub-circuit board 420, which realizes the fixation and electrical connection of the light source and the sub-circuit board 420, and the metal pins are arranged towards the side of the sub-circuit board 420, which reduces the distance between the pins and the sub-circuit board 420 and increases the connection stability.

[0082] Figure 10 Another angle structure schematic view of the light source emitter provided in the embodiment of the present application, Figure 11 An exploded structure schematic view of the light source emitter provided in the embodiment of the present application, Figure 10 and Figure 11In the embodiment of the present application, the fixing frame 430 comprises a base 431 and a support 432. The base 431 is a rectangular plate structure, one side is a flat structure, connected with the upper shell, used for fixing; the other side is used for fixing and mounting the light source emitter 410 and the sub-circuit board 420. The support 432 comprises a support column 4321 and a pressing plate 4322, the support column 4321 is arranged below the base 431, one end is connected with the base 431, and the other end is connected with the pressing plate 4322. One side of the pressing plate 4322 is connected with the light source, and the light source is fixed between the pressing plate 4322 and the base 431.

[0083] In order to facilitate the positioning of the light source on the base 431, one side of the lower surface of the base 431 comprises a light source mounting portion 4313, which is matched with the light source for mounting. The base 431 comprises a fixing portion 4314, which is fixedly connected with the sub-circuit board 420. The fixing portion 4314 is arranged on one side of the light source mounting portion 4313.

[0084] The upper surface of the base 431 is connected with the upper shell 201, and the lower surface is provided with the light source emitter 410 and the sub-circuit board 420. The light source emitter 410 is arranged between the pressing plate 4322 and the base 431, and the sub-circuit board 420 is arranged on one side of the light source emitter 410 and connected with the sub-circuit board 420 through the pins. The heat generated by the light source emitter 410 is directly conducted to the upper shell 201 through the base 431, and then transmitted to the cage for heat dissipation.

[0085] In order to realize the fixed connection of the base 431 and the upper shell 201, the base 431 is provided with a plurality of connecting through holes, which are connected with the upper shell 201 through screws. The upper shell 201 is provided with fixed holes in a relative position, corresponding to the positions of the connecting through holes. When connected, the screws pass through the fixed holes and the connecting through holes to be connected. The connecting through hole can be a threaded hole with a thread, and the screw is connected with the connecting through hole.

[0086] A plurality of optoelectronic devices are arranged in the optical module, and a plurality of optical fibers are arranged to realize the propagation of light between the optoelectronic devices. In order to facilitate the installation of the optical fiber and reduce the optical loss, the length of the optical fiber is much greater than the distance between the optoelectronic devices. In order to improve the stability of the optical fiber, an optical fiber support is further arranged in the optical module, which is arranged above the circuit board. An optical fiber groove is arranged above the optical fiber support, and the optical fiber is fixed in the optical fiber groove.

[0087] The upper surface and the lower surface of the sub-circuit board 420 are both provided with a plurality of electronic components, and the sizes and heights of the electronic components are not completely consistent. In order to facilitate the setting of the fiber angle of the light source emitter 410, the fixing portion 4314 is provided with a plurality of avoiding recesses 43141 for avoiding the installation of the electronic components, so that the sub-circuit board 420 and the circuit board 300 are parallel or substantially parallel after installation.

[0088] For the fixing between the base 431 and the sub-circuit board 420, the base 431 is provided with a third connecting through hole 4315 located at one side of the fixing part 4314, for fixing with the sub-circuit board 420. The base 431 is further provided with a fourth connecting through hole 4316 located at the other side of the fixing part 4314, for fixing with the sub-circuit board 420. The sub-circuit board 420 is provided with a third fixing hole 421 matching the position of the third connecting through hole 4315. The third fixing hole 421 is connected with the third connecting through hole 4315 through a screw. The sub-circuit board 420 is provided with a fourth fixing hole 422 matching the position of the fourth connecting through hole 4316. The fourth fixing hole 422 is connected with the fourth connecting through hole 4316 through a screw.

[0089] Specifically, the third fixing hole 421 and the fourth fixing hole 422 are arranged at the opposite corners of the circuit board, to realize the positioning between the sub-circuit board 420 and the base 431 in the direction parallel to the plane of the circuit board. The third fixing hole 421 is arranged close to the support 432, which can be a circular through hole or a form of avoiding hole.

[0090] Figure 12 The sub-circuit board and the light source disassembled structure provided by the embodiment of the present application are shown in the figures. Figure 11 and Figure 12 As shown in the figures, the sub-circuit board 420 is provided with a mounting avoiding part 424, and the light source emitter 410 is arranged at the mounting avoiding part 424. The upper surface of the light source emitter 410 is in contact with the base, and the end of the light source emitter 410 close to the light port is in contact with the support 432, and the other end is connected with the corner position of the mounting avoiding part 424. One side of the light source emitter 410 is connected with the sub-circuit board 420 through a plurality of pins 411. Specifically, one side of the light source emitter 410 is connected with the upper surface of the sub-circuit board 420 through a pin.

[0091] Figure 13 The disassembled structure schematic diagram of a fixing frame provided by the embodiment of the present application is shown in the figures. Figure 14 Another angle disassembled structure schematic diagram of a fixing frame provided by the embodiment of the present application is shown in the figures. Figure 12 and Figure 13 As shown in the figures, in some embodiments of the present application, the base 431 and the support 432 can be an integrally formed structure, and the upper surface of the pressing plate 4322 is connected with the lower surface of the light source emitter 410. Alternatively, the base 431 and the support 432 are separate structures, as shown in the figures. The support 432 includes a supporting column 4321 and a pressing plate 4322, the supporting column 4321 is arranged below the base 431, one end of which is connected with the base 431, and the other end is connected with the pressing plate 4322. The upper surface of the pressing plate 4322 is connected with the light source emitter 410, to fix the light source emitter 410 between the pressing plate 4322 and the base 431. The supporting column 4321 is provided with a fixing threaded hole 43211, and the base 431 is provided with a connecting hole 4317 at the corresponding position.

[0092] In the installation, first, the third connecting hole 4315 and the third fixing hole 421 are connected by screw connection, the third connecting hole 4315 and the third fixing hole 421 are connected, the connection and fixation of the sub-circuit board 420 and the base 431 are realized. Then the light source emitter 410 is installed between the pressing plate 4322 and the light source emitter 410 installation groove of the base 431, and then the support column 4321 is connected with the base 431 by screw, and the light source emitter 410 is fixed on the base 431 by the pressing plate 4322. The base 431 is placed in the bracket 432 installation groove, the first connecting hole and the first fixing hole, the second connecting hole and the second fixing hole are connected by screw connection, the connection between the light source emitter 410 fixing frame 430 and the upper shell 201 is realized. Finally, the light source emitter 410 is fixed on the light source emitter 410 fixing frame 430, and then the light source emitter 410 fixing frame 430 is fixed on the lower surface of the upper shell 201, the installation and fixation of the light source emitter 410 in the optical module are realized, and the light source emitter 410 is connected with the upper shell 201 through the base 431, the heat emitted by the light source emitter 410 is transmitted to the upper shell 201 through the base 431, and the heat dissipation effect is improved.

[0093] In order to facilitate heat conduction, the material of the base 431 includes but is not limited to tungsten copper, raft alloy, SPCC (Steel Plate Cold rolled Commercial, cold rolled carbon steel), copper and the like, which is convenient for transmitting the heat generated by the optoelectronic device to the base 431. In the optical module, the light source emitter 410 is the most important heat source, and in the present application, the light source emitter 410 is arranged on the base 431, and the heat generated by the light source emitter 410 is directly conducted to the upper shell 201 through the base 431 and the upper shell 201. The upper shell 201 is connected with the cage outside, has a heat dissipation channel, and increases the heat conduction efficiency.

[0094] In some embodiments of the present application, a gasket 4323 is arranged between the pressing plate 4322 and the light source emitter 410 for convenient maintenance. The upper surface of the pressing plate 4322 is provided with a pressure bearing part 43221 and a receiving part 43222, the receiving part 43222 is arranged between the pressure bearing part 43221 and the support column 4321, and the connection between the pressure bearing part 43221 and the support column 4321 is realized. The upper surface of the pressure bearing part 43221 is connected with the lower surface of the gasket 4323, and the upper surface of the gasket 4323 is connected with the light source emitter 410. The upper surface of the pressure bearing part 43221 is lower than the upper surface of the receiving part 43222, so that there is a step surface between the pressure bearing part 43221 and the receiving part 43222, one end of the gasket 4323 is in contact with the step surface, and the positioning of the gasket 4323 is realized.

[0095] Optionally, the upper surface of the gasket 4323 is not lower than the upper surface of the receiving portion 43222. For the convenience of maintenance and disassembly, the upper surface of the gasket 4323 is higher than the upper surface of the receiving portion 43222, so that the light source emitter 410 is connected to the upper surface of the gasket 4323, and there is a gap between the light source emitter 410 and the receiving portion 43222, avoiding the stress of the screw between the support column 4321 and the base 431 being too large, and the pressure of the pressing plate 4322 on the light source emitter 410 being too large, avoiding the pressing plate 4322 being broken.

[0096] During installation, the third connecting through hole 4315 and the third fixing hole 421 are connected by screw connection, the third connecting through hole 4315 and the third fixing hole 421 are connected, the connection and fixation of the sub-circuit board 420 and the base 431 are realized. The light source emitter 410 is installed between the pressing plate 4322 and the light source emitter 410 mounting groove of the base 431, the gasket 4323 is installed between the pressing plate 4322 and the light source emitter 410, and then the support column 4321 and the base 431 are connected by screw, and the light source emitter 410 is fixed on the base 431 by the pressing plate 4322. The base 431 is placed in the support 432 mounting groove, the first connecting through hole and the first fixing hole, and the second connecting through hole and the second fixing hole are connected by screw connection, the connection between the light source emitter 410 fixing frame 430 and the upper shell 201 is realized. Finally, the light source emitter 410 is fixed on the light source emitter 410 fixing frame 430, and then the light source emitter 410 fixing frame 430 is fixed on the lower surface of the upper shell 201, the installation and fixation of the light source emitter 410 in the optical module is realized, and the light source emitter 410 is connected with the upper shell 201 through the base 431, the heat emitted by the light source emitter 410 is transmitted to the upper shell 201 through the base 431, and the heat dissipation effect is improved. During disassembly, only the screw connecting the support column 4321 and the base 431 is loosened for several turns, the gasket 4323 is loosened between the pressing plate 4322 and the light source emitter 410, and the gasket 4323 can be taken out, and the connection between the light source emitter 410 and the base 431 is released. Therefore, when repairing and replacing the light source emitter 410, only the screw connecting the support column 4321 and the base 431 is loosened, and the light source emitter 410 can be taken out, which is convenient and fast.

[0097] To realize the electrical connection between the sub-circuit board 420 and the circuit board 300, the first connector is arranged on the sub-circuit board 420, located on the lower surface of the sub-circuit board 420, and the opening is directed away from the light source emitter 410. The circuit board 300 is provided with the second connector, and the opening is directed in the same direction as the opening of the first connector. The first connector and the second connector are connected by the flexible circuit board. One end of the circuit board 300 is provided with a gold finger, which is connected to the upper computer to receive the electrical signal of the upper computer, and the signal is transmitted to the sub-circuit board 420 through the flexible circuit board, and then connected to the external pin of the light source emitter 410 through the electrical pin on the sub-circuit board 420, to realize signal transmission.

[0098] The heat generated by the light source emitter 410 is transmitted to the upper shell 201 through the base 431, and then the base 431 is connected to the upper shell 201. The heat emitted by the light source emitter 410 is transmitted to the upper shell 201 through the base 431, improving the heat dissipation effect. In order to realize the heat dissipation of the light source emitter 410, the material of the shell of the light source emitter 410 includes but is not limited to tungsten copper, can alloy, SPCC (Steel Plate Cold rolled Commercial, cold rolled carbon steel), copper, etc., which is convenient for transmitting the heat generated by the photoelectric device to the base 431.

[0099] Figure 15 Another angle structure diagram of the upper shell provided by the embodiment of the application is shown in Figure 16 The exploded structure diagram of the upper shell and the fixing frame is shown in Figure 17 The structure diagram of the upper shell, the light source emitter and the fiber adapter provided by the embodiment of the application is shown in Figure 15 、 Figure 16 and Figure 17 In order to facilitate the connection and fixation of the fixing frame 430 and the upper shell 201 and improve the connection stability, the fixing frame 430 is installed in the bracket mounting groove 2014, and the upper surface of the base contacts the lower surface of the bracket mounting groove 2014. The first fixing hole 2015 and the second fixing hole 2016 are located at the opposite corners of the bracket mounting groove, which is convenient for installation and stability. The first fixing hole 2015 and the second fixing hole 2016 are arranged as counterbores on the upper surface of the cover plate 2011, which is convenient for the screw head to sink in and not protrude from the surface of the cover plate 2011, so that the appearance of the optical module is more tidy, and the connection with the structure of the upper computer is facilitated. The cover plate 2011 is also provided with a third fixing hole which passes through the upper surface and the lower surface of the cover plate 2011, and is used to fix the upper shell 201 and the lower shell 202. In the present application, the countersunk screw is screwed into the inside of the optical module from the lower surface of the upper shell 201, and the fixing frame 430 is installed on the lower surface of the upper shell 201.

[0100] When installing, the sub-circuit board 420 and the base 431 are fixed by the third fixing hole 421 and the third connecting through hole 4315, the fourth fixing hole 422 and the fourth connecting through hole 4316 through a screw, the light source emitter 410 is fixed between the pressing plate 4322 and the base 431, and the support column 4321 is connected with the base 431 by using a screw. The light source emitter 410 and the sub-circuit board 420 are fixed on the fixing frame 430. Then, a screw is used to be screwed into the interior of the optical module from the lower surface of the upper shell 201, connected with the first fixing hole 2015 and the first connecting through hole 4311, and connected with the second fixing hole 2016 and the second connecting through hole 4312, so as to connect the fixing frame 430 on which the light source emitter 410 and the sub-circuit board 420 are installed with the upper shell 201.

[0101] The fifth fixing hole 2017 is arranged on one side of the bracket mounting groove 2014 and close to the light port position. In order to realize uniform stress of the upper shell and the lower shell, the distance from the fifth fixing hole to the first upper side plate 2012 is consistent with the distance from the fifth fixing hole to the second upper side plate 2013.

[0102] In order to realize the transmission of light, the first optical fiber adapter 206 and the second optical fiber adapter 207 are arranged in the optical module and arranged at the light port 205. The first optical fiber adapter 206 is arranged close to the light source emitter 410. In order to facilitate the installation of the first optical fiber adapter 206, the support column 4321 is provided with an adaptive avoiding groove 4324. The first optical fiber adapter 206 and the second optical fiber adapter 207 are arranged between the fixing frame and the circuit board 300. The edge of the first optical fiber adapter 206 is in contact with the adaptive avoiding groove 4324, so that the avoiding installation of the first optical fiber adapter 206 can be realized, the positioning of the first optical fiber adapter 206 is realized, and the stability of the first optical fiber adapter is beneficial. The first optical fiber adapter 206 is connected with the optical modulation chip through an optical fiber, and is used for transmitting an optical signal to the outside of the optical module.

[0103] Figure 18 A circuit board and lower shell structure schematic diagram provided by the embodiment of the application, Figure 19 A circuit board and lower shell structure exploded schematic diagram provided by the embodiment of the application. Combined with Figure 18 and Figure 19As shown, the lower shell 202 includes a bottom plate 2021 and two lower side plates vertically arranged on both sides of the bottom plate, a first lower side plate 2022 and a second lower side plate 2023. The upper shell 201 is combined with the two side walls and the two side plates to cover the lower shell 202. To position the circuit board in the lower shell, the lower shell 202 is provided with a plurality of fixing tables 2024, which have the same top surface height and are used to support the circuit board. The support top surface of the fixing table 2024 is used to contact the lower surface of the circuit board 300 to support and position the circuit board 300 in the height direction of the optical module. In the embodiment of the present application, the fixing table can be a structure protruding from the inner side wall of the lower shell 202 and having a support top surface. The shapes of the fixing tables can be the same or different.

[0104] Further, to ensure the installation accuracy of the circuit board 300, the side wall of the lower shell 202 is further provided with a first limiting column 2025 and a second limiting column 2026. The first limiting column 2025 and the second limiting column 2026 can not only realize the installation and positioning of the circuit board 300, but also realize the fixation of the circuit board 300 in the length direction of the optical module. The positions of the first limiting column 2025 and the second limiting column 2026 in the length direction of the optical module can be different or the same.

[0105] The side edge of the circuit board 300 is provided with a first limiting port 301, which is connected with the first limiting column 2025. The second side edge of the circuit board 300 is provided with a second limiting port 302, which is connected with the second limiting column 2026. In the embodiment of the present application, the first limiting column 2025 and the second limiting column 2026 correspond to the first limiting port 301 and the second limiting port 302.

[0106] To fix the circuit board 300 and the lower shell, the middle part of the bottom plate 2021 is provided with a fifth mounting through hole 20211, and the circuit board 300 is provided with a seventh fixing hole 310. A screw is used to connect the fifth mounting through hole 20211 and the seventh fixing hole 310 from the upper surface of the circuit board 300. Since the lower surface of the circuit board 300 is also provided with a plurality of electronic components, to support the circuit board, the middle part of the bottom plate 2021 is provided with a through hole table 20212, and the fifth mounting through hole 20211 is located on the through hole table 20212. The lower surface of the circuit board 300 is connected with the through hole table 20212 to support and position the circuit board 300. The through hole table 20212 protrudes from the inner side wall of the bottom plate 2021 and has a support top surface.

[0107] Further, in order to facilitate the installation of the circuit board 300 and to achieve uniform stress on the circuit board 300, the through hole platform 20212 is arranged at the middle of the bottom plate 2021, the distance from the through hole platform 20212 to the first lower side plate 2022 is the same as the distance from the through hole platform 20212 to the second lower side plate 2023. The distance from the end surface of the through hole platform 20212 to the lower surface of the bottom plate 2021 is greater than the distance from the upper surface of the bottom plate 2021 to the lower surface, that is, the thickness of the through hole platform 20212 is greater than the thickness of the bottom plate 2021. The screw is inserted from above the seventh fixing hole 310 on the circuit board 300 and connected with the fifth mounting through hole 20211, but does not protrude from the lower end surface of the fifth mounting through hole 20211, thereby maintaining the integrity of the lower surface of the bottom plate 2021 and facilitating the connection of the optical module with the upper computer.

[0108] A plurality of optoelectronic devices are arranged in the optical module, and a plurality of optical fibers are arranged to achieve the propagation of light between the optoelectronic devices. In order to facilitate the installation of the optical fiber and reduce the optical loss, the length of the optical fiber is much greater than the distance between the optoelectronic devices. In order to improve the stability of the optical fiber, an optical fiber support 500 is arranged in the optical module and arranged above the circuit board 300. An optical fiber groove is arranged above the optical fiber support, and the optical fiber is fixed in the optical fiber groove.

[0109] Figure 20 A structure schematic diagram of a fixing frame, an optical fiber support and a circuit board provided by the embodiment of the present application is shown in Figure 21 A split structure schematic diagram of an optical fiber support and a circuit board provided by the embodiment of the present application is shown in Figure 22 Another angle structure schematic diagram of an optical fiber support provided by the embodiment of the present application is shown in Figure 20 、 Figure 21 and Figure 22 In order to achieve the positioning and installation of the optical fiber support 500 and the circuit board 300, the bottom surface of the optical fiber support 500 is provided with a first limiting part 501 and a second limiting part 502. The circuit board 300 is provided with a third limiting port 303, and the first limiting part 501 is arranged to connect the third limiting port 303. The circuit board 300 is provided with a fourth limiting port 304, and the second limiting part 502 is arranged to connect the fourth limiting port 304. The first limiting part 501 and the second limiting part 502 not only can achieve the installation and positioning of the optical fiber support 500 on the circuit board 300, but also can achieve the fixation of the optical fiber support 500 in the height direction of the optical module.

[0110] Further, the first limiting part 501 is provided with a first clamping part 5011 which is embedded into the third limiting hole 303 and clamped with the circuit board 300 to fix the optical fiber support 500 in the length direction of the optical module. The first clamping part 5011 is protruded downward relative to the first supporting surface 5012, and the first supporting surface 5012 is in contact with the upper surface of the circuit board 300 to fix the optical fiber support 500 in the height direction of the optical module. The first clamping part 5011 is embedded into the third limiting hole 303 to fix the optical fiber support 500 in the length direction of the optical module.

[0111] The second limiting part 502 is provided with a second clamping part 5021 which is embedded into the fourth limiting hole 304 and clamped with the circuit board 300 to fix the optical fiber support 500 in the length direction of the optical module. The second clamping part 5021 is protruded downward relative to the second supporting surface 5022, and the second supporting surface 5022 is in contact with the upper surface of the circuit board 300 to fix the optical fiber support 500 in the height direction of the optical module. The second clamping part 5021 is embedded into the fourth limiting hole 304 to fix the optical fiber support 500 in the length direction of the optical module.

[0112] Further, to improve the stability of the optical fiber support 500 on the circuit board 300, the lower surface of the optical fiber support 500 is further provided with a first supporting part 503 and a second supporting part 504 which are in contact with the upper surface of the circuit board 300 to fix the optical fiber support 500 in the height direction of the optical module. The first supporting part 503 and the second supporting part 504 have flat supporting top surfaces which are used to be in contact with the upper surface of the circuit board 300. In the embodiment, the end parts of the first supporting part 503 and the second supporting part 504 have the same height to facilitate the installation of the circuit board photoelectric device. The end parts of the first supporting part 503 and the second supporting part 504 are at the same height as the first supporting surface 5012 and the second supporting surface 5022.

[0113] In the application, the first supporting part 503 and the second supporting part 504 are in contact with the upper surface of the circuit board 300 to fix the optical fiber support 500 in the height direction of the optical module. The first limiting part 501 and the second limiting part 502 are clamped with the third limiting hole 303 and the fourth limiting hole 304 to fix the optical fiber support 500 with the circuit board 300.

[0114] During installation, the first support portion 503 and the second support portion 504 contact and connect with the upper surface of the circuit board 300. The first locking portion 5011 is embedded in the third limiting port 303 and engages with the circuit board 300; the second locking portion 5021 is embedded in the fourth limiting port 304 and engages with the circuit board 300, thereby fixing the fiber optic bracket 500 in the height direction of the optical module. The first support portion 503 and the second support portion 504 contact and connect with the upper surface of the circuit board 300, thereby fixing the fiber optic bracket 500 in the height direction of the optical module. The fiber optic bracket 500 is then fixed to the circuit board 300.

[0115] The fiber optic bracket 500 has a first mounting slot 505 on one side, corresponding to the position of the first limiting port 301 on the circuit board 300, and is engaged with the first limiting post 2025. The fiber optic bracket 500 also has a second mounting slot 506 on one side, corresponding to the position of the second limiting port 302 on the circuit board 300, and is engaged with the second limiting post 2026. The first mounting slot 505 and the second mounting slot 506 enable the fiber optic bracket 500 to be positioned along its length within the lower housing 202.

[0116] Furthermore, the circuit board 300 is equipped with multiple optoelectronic chips, such as a DSP. To facilitate the fixed installation of the fiber optic bracket 500 and reduce space occupation, an optoelectronic clearance groove is provided on the lower surface of the fiber optic bracket 500, and the DSP and other chips are placed in the optoelectronic clearance groove. The fiber optic bracket 500 covers the DSP, and the distance between the fiber optic bracket 500 and the circuit board 300 is small, reducing space and facilitating the miniaturization of the optical module.

[0117] The lower surface of the fiber optic bracket 500 is provided with a fiber optic groove for fixing the emitted fiber of the light source transmitter 410. Both the fiber optic bracket 500 and the mounting bracket 430 are positioned above the circuit board 300, with the fiber optic bracket 500 located to one side of the mounting bracket 430. The projection of the fiber optic bracket 500 onto the circuit board 300 does not coincide with the projection of the mounting bracket 430 onto the circuit board 300. In this application, both the mounting bracket 430 and the fiber optic bracket 500 are located near the optical port 205.

[0118] To facilitate the installation of the circuit board 300 on the lower housing, the seventh fixing hole 310 and the fifth mounting through hole 20211 are located outside the projection of the fiber optic bracket 500 onto the circuit board 300, near the optical port 205.

[0119] Figure 23 A schematic diagram of a partial structure of an optical module provided in an embodiment of this application. Figure 2 ; Figure 24 This is a cross-sectional schematic diagram of a partial structure of an optical module provided in an embodiment of this application. Figure 23 andFigure 24 As shown in FIG. 4, to realize the electrical connection between the sub-circuit board 420 and the circuit board 300, the first connector 423 is arranged on the sub-circuit board 420, and is located on the lower surface of the sub-circuit board 420 and opens towards the side of the light source emitter 410. The circuit board 300 is provided with the second connector 305, which opens towards the same direction as the first connector. The first connector 423 and the second connector 305 are connected by the flexible circuit board 440. One end of the circuit board 300 is provided with a golden finger, which is connected to the upper computer, receives the electrical signal of the upper computer, and transmits the signal to the sub-circuit board 420 through the flexible circuit board 440. The signal is transmitted to the light source emitter 410 through the electrical pin on the sub-circuit board 420 and the external pin of the light source emitter 410.

[0120] Further, to facilitate installation, the first connector 423 is located on the outer side of the fixing frame, and the projection of the first connector 423 on the circuit board 300 is consistent with the projection of the second connector 305 on the circuit board 300 in the position of the length direction of the optical module.

[0121] The lower surface of the sub-circuit board 420 is close to the upper surface of the circuit board 300, and the gap between the lower surface of the sub-circuit board 420 and the upper surface of the circuit board 300 is small after installation, which is not conducive to the arrangement of the electrical connector. Therefore, in the present application, the second connector 305 is arranged on the lower surface of the circuit board 300, the first connector 423 is arranged on the upper surface of the sub-circuit board 420, and the flexible circuit board 440 is wrapped on the outer side of the light source emitter 410. Specifically, the flexible circuit board 440 is wrapped on the outer side of the fiber joint of the light source emitter 410. The flexible circuit board 440 has good flexibility, which facilitates installation.

[0122] When installing, the sub-circuit board 420 and the base 431 are fixed by the third fixing hole 421 and the third connecting through hole 4315, the fourth fixing hole 422 and the fourth connecting through hole 4316 through a screw, the light source emitter 410 is fixed between the pressing plate 4322 and the base 431, and the support column 4321 is connected with the base 431 by a screw. The light source emitter 410 and the sub-circuit board 420 are fixed on the fixing frame 430. Then a screw is used to screw into the interior of the optical module from the lower surface of the upper shell 201, connected with the first fixing hole 2015 and the first connecting through hole 4311, and the second fixing hole 2016 is connected with the second connecting through hole 4312 on the base, and the fixing frame 430 on which the light source emitter 410 and the sub-circuit board 420 are installed is connected with the upper shell 201. The first support part 503 and the second support part 504 are connected with the upper surface of the circuit board 300, the first clamping part 5011 is embedded in the third limiting port 303 and clamped with the circuit board 300, the second clamping part 5021 is embedded in the fourth limiting port 304 and clamped with the circuit board 300, and the optical fiber support 500 is fixed in the height direction of the optical module. The first support part 503 and the second support part 504 are connected with the upper surface of the circuit board 300; the first support part 503 and the second support part 504 are connected with the upper surface of the circuit board 300, and the optical fiber support 500 is fixed in the height direction of the optical module. The optical fiber support 500 is fixed on the circuit board 300. A screw is inserted from above the seventh fixing hole 310 on the circuit board 300 and connected with the fifth mounting through hole 20211, and the circuit board 300 is fixed in the lower shell. One end of the flexible circuit board 440 is connected with the second connector on the lower surface of the circuit board 300, the other end passes around the light source emitter 410 and is connected with the first connector on the upper surface of the sub-circuit board 420, and the electrical connection between the circuit board 300 and the sub-circuit board 420 is realized. Then the upper shell and the lower shell are connected.

[0123] The application discloses a light module, comprising: a light source emitter 410 arranged above a circuit board and used for emitting light; a sub-circuit board 420 arranged above the circuit board 300 and electrically connected to the circuit board 300 through a flexible circuit board; the light source emitter 410 is electrically connected to the sub-circuit board 420, and the sub-circuit board 420 drives the light source emitter 410; a light source emitter 410 fixing frame 430 arranged above the circuit board and used for fixing the light source emitter 410; the light source emitter 410 is fixed on the light source emitter 410 fixing frame 430 and is connected to the sub-circuit board 420 through a plurality of pins arranged on one side of the light source emitter 410; the light source emitter 410 fixing frame 430 is further connected to an upper shell 201, and the light source emitter 410 is fixed on the upper shell 201 through the light source emitter 410 fixing frame 430, so that the heat generated by the light source emitter 410 can be directly transmitted to the upper shell 201 through the light source emitter 410 fixing frame 430, thereby improving the heat dissipation function of the light module; the support 432 comprises a supporting column 4321 and a pressing plate 4322; the supporting column 4321 is arranged below the base 431 and connected to the base 431 at one end and connected to the pressing plate 4322 at the other end; the upper surface of the pressing plate 4322 is connected to the light source emitter 410, so that the light source emitter 410 is fixed between the pressing plate 4322 and the base 431, thereby realizing the fixation of the light source emitter 410; the heat generated by the light source emitter 410 is directly conducted to the upper shell 201 through the base 431 and then transmitted to the cage for heat dissipation.

[0124] Since the above embodiments are described in combination with other modes, the same parts exist between different embodiments, and the same parts between different embodiments in the description are referred to each other. Here, no longer detailed description is given.

[0125] It should be noted that, in the present specification, the relationship terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the term "comprise", "include" or any other variant thereof is intended to cover non-exclusive inclusion, so that the circuit structure, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such circuit structure, article or device. Without more limitation, the element defined by the phrase "comprising a" does not exclude the presence of another same element in the circuit structure, article or device including the element.

[0126] Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. It is intended that the specification and examples be considered as exemplary only, with the true scope and spirit of the application being indicated by the contents of the following claims.

[0127] The above-described embodiments of the application do not constitute a limitation in terms of the protection scope of the application.

Claims

1. An optical module characterized by comprising: The application relates to a light source fixing device. The application comprises: an upper shell; a lower shell which is combined with the upper shell to form a cavity; a circuit board which is arranged in the cavity and fixedly connected with the lower shell; a sub-circuit board which is arranged above the circuit board and electrically connected with the circuit board; a fixing frame which comprises a base and a support, the support being detachably connected with the base, wherein the support comprises a supporting column and a pressing plate, one end of the supporting column being connected with the pressing plate, the other end of the supporting column being connected with the base, and the base comprising: a fixing part which is hung below the inner wall of the upper shell, and the sub-circuit board is arranged below the fixing part; and a light source mounting part which is arranged above the circuit board and located at one side of the fixing part; a light source emitter which is connected with the light source mounting part, the light source emitter being located above the circuit board, a side wall of the light source emitter being provided with a pin, the pin being connected with the sub-circuit board, and the light source emitter emitting light without carrying signals; 2. The optical module according to claim 1, characterized by a light modulation chip which is connected with the light source emitter through an optical fiber, the light modulation chip loading signals on the light to form signal light. The application further comprises: an optical fiber support which is located above the circuit board and at one side of the sub-circuit board; a bottom surface of the optical fiber support being provided with a first limiting part and a second limiting part; the circuit board being provided with a third limiting opening and a fourth limiting opening, 3. The optical module according to claim 2, characterized by the first limiting part being clamped with the third limiting opening, and the second limiting part being clamped with the fourth limiting opening. the first limiting part comprising a first clamping part and a first supporting surface, the first clamping part being protruded downward relative to the first supporting surface, the first supporting surface being in contact with the upper surface of the circuit board, and the first clamping part being embedded in the third limiting opening; 4. The optical module according to claim 2, characterized by the second limiting part comprising a second clamping part and a second supporting surface, the second clamping part being protruded downward relative to the second supporting surface, the second supporting surface being in contact with the upper surface of the circuit board, and the second clamping part being embedded in the fourth limiting opening.

5. The optical module according to claim 4, characterized by a lower surface of the optical fiber support being further provided with a first supporting part and a second supporting part, the first supporting part and the second supporting part being in contact with the upper surface of the circuit board.

6. The optical module according to claim 5, characterized by end portions of the first supporting part and the second supporting part are at the same height as the first supporting surface and the second supporting surface. The application further comprises: a gasket which is located between the pressing plate and the light source emitter; an upper surface of the pressing plate being provided with a pressure bearing part and a receiving part, the receiving part being arranged between the pressure bearing part and the supporting column; an upper surface of the pressure bearing part being connected with a lower surface of the gasket, and an upper surface of the light source emitter being connected with the gasket; 7. The optical module of claim 1, wherein, the upper surface of the pressure bearing part being lower than the upper surface of the receiving part. a lower surface of the circuit board being provided with a second connector; an upper surface of the sub-circuit board being provided with a first connector, and the first connector being connected with the second connector through a flexible circuit board.

8. The optical module of claim 1, wherein, The inner wall of the upper shell is provided with a bracket mounting groove for positioning the upper surface of the fixed part; the first and second fixing holes are arranged at the diagonal positions of the bracket mounting groove; the fixed part is provided with first and second connecting through holes; the first connecting through hole is connected with the first fixing hole through a screw; and the second connecting through hole is connected with the second fixing hole through a screw.

9. The optical module of claim 5, wherein, The support column is arranged below the light source mounting part, one end of which is connected with the light source mounting part; and the sub-circuit board is provided with a mounting avoiding part for positioning the light source emitter.

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