Simulation method, apparatus, device, and storage medium

Abstract

The present disclosure provides a simulation method, device, equipment and storage medium, relates to the technical field of computers, in particular to the technical field of quantum computers, quantum chips and quantum simulation. The specific implementation scheme is: quantum feature information of a reference quantum bit in a quantum chip packaged by a packaging box is simulated; wherein the quantum feature information includes at least one of the following: energy dissipation information of the reference quantum bit, frequency information of the reference quantum bit; the energy dissipation information of the reference quantum bit is related to base frequency information of the packaging box; at least based on the quantum feature information of the reference quantum bit, target metric information is obtained; the target metric information is used to represent whether the base frequency information of the packaging box meets a preset requirement.

Description

Technical Field

[0001] This disclosure relates to the field of computer technology, and in particular to the fields of quantum computers, quantum chips, and quantum simulation technology. Background Technology

[0002] Superconducting quantum chips are typically housed in a package that provides shielding against electromagnetic and thermal radiation to enhance their performance. However, within the package, a resonant cavity is formed, consisting of the superconducting quantum chip and the internal space of the package. This cavity possesses a series of inherent resonant frequencies, the lowest of which is called the fundamental frequency. The presence of this fundamental frequency can affect the components within the superconducting quantum chip, thereby significantly degrading its performance. Summary of the Invention

[0003] This disclosure provides a simulation method, apparatus, device, and storage medium.

[0004] According to one aspect of this disclosure, a simulation method is provided, comprising:

[0005] The simulation yields the quantum characteristic information of the reference qubit in the quantum chip encapsulated in the packaging box; wherein the quantum characteristic information includes at least one of the following: energy dissipation information of the reference qubit, frequency information of the reference qubit; the energy dissipation information of the reference qubit is related to the fundamental frequency information of the packaging box;

[0006] Based at least on the quantum characteristic information of the reference qubit, the target metric information is obtained; the target metric information is used to characterize whether the fundamental frequency information of the packaging box meets the preset requirements.

[0007] According to another aspect of this disclosure, a simulation apparatus is provided, comprising:

[0008] The processing unit is used to simulate and obtain the quantum characteristic information of the reference qubit in the quantum chip after it is packaged in the packaging box; wherein the quantum characteristic information includes at least one of the following: the energy dissipation information of the reference qubit, the frequency information of the reference qubit; the energy dissipation information of the reference qubit is related to the fundamental frequency information of the packaging box; at least based on the quantum characteristic information of the reference qubit, target metric information is obtained; the target metric information is used to characterize whether the fundamental frequency information of the packaging box meets the preset requirements;

[0009] The output unit is used to output the target measurement information.

[0010] According to another aspect of this disclosure, a computing device is provided, comprising:

[0011] At least one quantum processing unit (QPU);

[0012] A memory, coupled to the at least one QPU and used to store executable instructions,

[0013] The instruction is executed by the at least one QPU to enable the at least one QPU to perform the method described above;

[0014] Or, including:

[0015] At least one processor; and

[0016] A memory communicatively connected to the at least one processor; wherein,

[0017] The memory stores instructions that can be executed by the at least one processor, which, when executed by the at least one processor, enables the at least one processor to perform the method described above.

[0018] According to another aspect of this disclosure, a non-transitory computer-readable storage medium is provided storing computer instructions that, when executed by at least one quantum processing unit, cause the at least one quantum processing unit to perform the method described above.

[0019] Alternatively, the computer instructions may be used to cause the computer to perform the methods described above.

[0020] According to another aspect of this disclosure, a computer program product is provided, comprising a computer program that, when executed by at least one quantum processing unit, implements the methods described above.

[0021] Alternatively, the computer program may implement the above-described method when executed by a processor.

[0022] In this way, the disclosed solution can automatically and efficiently obtain target measurement information based on the quantum characteristic information of the reference qubit obtained by simulation, so as to measure whether the fundamental frequency information of the package meets the preset requirements. This can effectively avoid the impact of improper fundamental frequency design of the package on the performance of the quantum chip, thereby improving the performance of the quantum chip.

[0023] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0024] The accompanying drawings are provided to better understand this solution and do not constitute a limitation of this disclosure. Wherein:

[0025] Figure 1 This is a schematic diagram of the implementation flow of the simulation method according to the embodiments of this disclosure. Figure 1 ;

[0026] Figure 2 This is a schematic diagram of the packaging of a quantum chip according to an embodiment of this disclosure;

[0027] Figure 3 This is a schematic diagram of a quantum chip modeled according to an embodiment of the present disclosure;

[0028] Figures 4(a), 4(b), and 4(c) are explanatory diagrams of edge positions according to embodiments of the present disclosure;

[0029] Figure 5 This is a schematic diagram of the implementation flow of the simulation method according to the embodiments of this disclosure. Figure 2 ;

[0030] Figure 6(a), Figure 6(b) Figure 6(c) and 6(d) This is a simulation diagram of the packaging box according to an embodiment of the present disclosure;

[0031] Figure 7(a) is a schematic flowchart of a simulation method according to an embodiment of the present disclosure in one example;

[0032] Figure 7(b) is a schematic diagram of the setup of a reference quantum bit in an example of the simulation method according to an embodiment of the present disclosure;

[0033] Figures 8(a), 8(b) and 8(c) are schematic diagrams of the packaging of a quantum chip in one example according to an embodiment of the present disclosure;

[0034] Figure 9 This is a schematic diagram of the simulation device according to an embodiment of the present disclosure;

[0035] Figure 10 This is a block diagram of a computing device used to implement the simulation method of the embodiments of this disclosure. Detailed Implementation

[0036] The exemplary embodiments of this disclosure are described below with reference to the accompanying drawings, including various details of the embodiments to aid understanding, and should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope of this disclosure. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0037] As a landmark technology of the post-Moore's Law era, quantum computing has become a major development direction for both academia and industry. Compared to traditional computing, quantum computing has unparalleled advantages in solving certain specific problems (e.g., large number factorization, simulation of complex quantum systems). The development of various high-potential quantum applications has greatly promoted the development of quantum hardware, giving rise to a variety of technical implementation schemes. Among them, superconducting quantum circuits based on Josephson junctions have core advantages such as ease of fabrication, manipulation and readout, and easy scalability, and have become one of the most promising directions among many hardware implementation technologies. As a physical realization of superconducting quantum systems, the development of superconducting quantum chips integrating multiple superconducting qubits is becoming increasingly important.

[0038] In practical applications, superconducting quantum chips are typically housed in a package, connected to external measurement and control electronics via the package's connectors. The package provides shielding against electromagnetic and thermal radiation, enhancing the chip's performance. However, within the package, a resonant cavity is formed, consisting of the superconducting quantum chip and the internal space of the package. This cavity possesses a series of inherent resonant frequencies, the lowest of which is called the fundamental frequency. In recent years, the increasing number of qubits in superconducting quantum chips has led to a continuous increase in chip size; correspondingly, the size of the resonant cavity within the package has also increased, significantly reducing its fundamental frequency. When the fundamental frequency of the cavity decreases to a level close to that of a component (e.g., a qubit) within the superconducting quantum chip, that component will exhibit non-negligible coupling with the cavity. Furthermore, the component will experience energy leakage due to the influence of the package's fundamental frequency, severely degrading the superconducting quantum chip's performance. Therefore, determining whether the fundamental frequency of the package meets the preset requirements becomes a crucial issue.

[0039] Based on this, the present invention provides a simulation method that can automatically, accurately, and efficiently determine whether the fundamental frequency of the package meets the preset requirements.

[0040] Specifically, Figure 1 This is a schematic diagram of the implementation flow of the simulation method according to the embodiments of this disclosure. Figure 1 This method can be optionally applied to quantum computing devices that also possess classical computing capabilities, or it can be applied to classical computing devices that also possess quantum computing capabilities, or it can be directly applied to classical computing devices. For example, it can be applied to electronic devices with classical computing capabilities such as personal computers, servers, and server clusters, or it can be directly applied to quantum computers. This disclosure does not impose any restrictions on this method.

[0041] Furthermore, the method includes at least a portion of the following: (e.g.) Figure 1 As shown, the simulation method includes:

[0042] Step S101: Simulation obtains the quantum characteristic information of the reference qubit in the quantum chip encapsulated in the encapsulation box.

[0043] Here, quantum characteristic information includes at least one of the following: energy dissipation information of the reference qubit, and frequency information of the reference qubit.

[0044] Here, the energy dissipation information of the reference qubit is related to the fundamental frequency information of the package. For example, the energy dissipation of the reference qubit is affected by the fundamental frequency information of the package. In a specific example, the energy dissipation information of the reference qubit can be represented by the quality factor (also known as the Q factor). The higher the Q factor, the smaller the energy dissipation of the reference qubit, that is, the less it is affected by the fundamental frequency information of the package, and the better the performance of the quantum chip.

[0045] In a specific example, the fundamental frequency information of the package, also referred to as the fundamental frequency, represents the lowest resonant frequency among a series of inherent resonant frequencies possessed by the resonant cavity formed inside the package. In the present disclosure, the fundamental frequency of the package can be obtained by simulating the package.

[0046] Furthermore, it should be noted that the frequency information of the reference qubit can affect the measurement result of the fundamental frequency information of the package. For example, if the fundamental frequency information of the package is close to the frequency information of the reference qubit, the two may produce non-negligible coupling, leading to a reduction in the performance of the quantum chip. In this case, the fundamental frequency information of the package does not meet the preset requirements.

[0047] Step S102: Obtain target metric information based at least on the quantum characteristic information of the reference qubit.

[0048] Here, the target metric information is used to characterize whether the baseband information of the package meets the preset requirements.

[0049] If the baseband information of the package box meets the preset requirements, it indicates that the baseband design of the package box is reasonable; conversely, if the baseband information of the package box does not meet the preset requirements, it indicates that the baseband design of the package box is unreasonable.

[0050] In this way, the disclosed solution can automatically and efficiently obtain target measurement information based on the quantum characteristic information of the reference qubit obtained by simulation, so as to measure whether the fundamental frequency information of the package meets the preset requirements. This can effectively avoid the impact of improper fundamental frequency design of the package on the performance of the quantum chip, thereby improving the performance of the quantum chip.

[0051] Furthermore, the proposed solution can be implemented solely through simulation, which is not only highly efficient and easy to operate and implement, but also allows for the prior measurement of the fundamental frequency information of the packaging box before the quantum chip is designed. Compared to the approach of indirectly obtaining the measurement of the fundamental frequency information of the packaging box by experimentally measuring the quantum chip after the quantum chip design, fabrication, and measurement and control process is completed, this approach avoids having to re-execute the quantum chip design, fabrication, and measurement and control process due to improper fundamental frequency design of the packaging box, thereby significantly saving manpower and time costs.

[0052] In one example, when the quantum feature information includes the energy dissipation information of the reference qubit, the target metric information can be obtained based on the numerical relationship between the energy dissipation information of the reference qubit and a preset energy value; or, in another example, when the quantum feature information includes the frequency information of the reference qubit, the target metric information can be obtained based on the numerical relationship between the frequency information of the reference qubit and the fundamental frequency information of the packaging box; or, in yet another example, when the quantum feature information includes both the energy dissipation information and the frequency information of the reference qubit, the target metric information can be obtained based on the numerical relationship between the energy dissipation information of the reference qubit and a preset energy value, and the numerical relationship between the frequency information of the reference qubit and the fundamental frequency information of the packaging box.

[0053] Here, the preset energy value can be set according to the performance requirements of the quantum chip, and this disclosed solution does not impose specific restrictions on it.

[0054] In a specific example of this disclosure, the quantum chip described above can be a superconducting quantum chip; here, a superconducting quantum chip refers to a quantum chip made of superconducting materials. For example, all components in a superconducting quantum chip (e.g., qubits, coupling devices, etc.) are made of superconducting materials. This allows the present disclosure to be applied to superconducting quantum chips, enriching its application scenarios.

[0055] Furthermore, in one example, the packaging box could be made of copper, such as... Figure 2 As shown, it can include two parts: a base and a top cover. Installing the top cover on the base creates an internal space between the base and the top cover to accommodate the quantum chip.

[0056] It should be noted that, to improve modeling efficiency during the simulation process, the base and top cover can also be modeled as a single, integral structure in the electromagnetic simulation software, such as... Figure 3 As shown, a packaging box with an internal space for accommodating a quantum chip is formed, and then the quantum chip is modeled within the internal space of the packaging box to simulate the quantum chip encapsulated in the packaging box. For example, based on this, the quantum feature information described in step S101 can be simulated.

[0057] In a specific example of the scheme disclosed herein, the reference qubit is used to simulate the qubit with the greatest energy dissipation caused by the fundamental frequency information of the package in the quantum chip packaged in the package.

[0058] It should be noted that, in the quantum chip encapsulated by the packaging box, the qubit with the greatest energy dissipation caused by the fundamental frequency information of the packaging box is the qubit most affected by the fundamental frequency information of the packaging box. Here, since the reference qubit of this disclosed scheme simulates the qubit in the quantum chip encapsulated by the packaging box that is most affected by the fundamental frequency information of the packaging box, it effectively simulates the limiting case of energy dissipation caused by the fundamental frequency information of the packaging box in the quantum chip, thereby further improving the accuracy of the target metric information.

[0059] Moreover, this disclosure does not impose any restrictions on the structure of the quantum chip, so it also has applicability and versatility.

[0060] Furthermore, in one example, in the quantum chip encapsulated by the packaging box, the closer to the edge of the packaging box, the greater the influence of the packaging box's fundamental frequency information on the energy dissipation of the qubits. For example, the closer to the side wall of the internal space of the packaging box, the greater the influence of the packaging box's fundamental frequency information on the energy dissipation of the qubits.

[0061] Based on this, in a specific example, the reference qubit is located at the edge of the device layer in the quantum chip, thus simulating a qubit that is close to the edge of the package.

[0062] Thus, the present disclosure provides a specific simulation method to effectively simulate components in a quantum chip that are significantly affected by the fundamental frequency information of the packaging box. Moreover, the scheme is simple and easy to implement in simulation, thereby further improving the practicality of the present disclosure while effectively ensuring the accuracy of the target measurement information.

[0063] It should be noted that the device layer can be understood as a layer structure that integrates the core components of a quantum chip (such as qubits and / or couplers). For example, in one example, the quantum chip may include a device layer for arranging components, and a wiring layer for arranging readout lines and control lines for connecting the components in the device layer.

[0064] Furthermore, in a specific example, the edge location can be defined as the corner point where any two edges intersect on the device layer of the quantum chip. This brings the reference qubit closer to the edge of the package, thereby maximizing the simulation of qubits more significantly affected by the fundamental frequency information of the package, and further improving the accuracy of the target metric information.

[0065] The edge positions are described in detail below with reference to the accompanying drawings. For example, in a specific example, the quantum chip may have a rectangular structure. For instance, the quantum chip may have a square or rectangular structure. In this example, the quantum chip described in this disclosure is a modeled chip model used for simulation; this chip model can be used to simulate a real quantum chip (hereinafter referred to as the real chip). In this case, the edge positions of the device layers in the modeled quantum chip can specifically simulate the location of the real qubit closest to the chip edge in the real chip. As shown in Figure 4(a), which is a top view comparison of the modeled quantum chip (i.e., the chip model) and the real chip, the real qubit closest to the chip edge in the real chip simulated by the quantum chip is located in region A. Therefore, the edge positions described in this disclosure can specifically simulate region A.

[0066] Alternatively, in another example, the edge location of the device layer in the modeled quantum chip can be any edge of the device layer in the quantum chip. As shown in Figure 4(b), which is a top view of the modeled quantum chip, the edge location of the device layer in the modeled quantum chip can refer to the perimeter region of the rectangular structure.

[0067] Alternatively, in another example, the edge positions of the device layers in the modeled quantum chip can be the corner points where any two edges (e.g., any two sides) intersect. As shown in Figure 4(c), which is a top view of the modeled quantum chip, the edge positions of the device layers can be any corner points where any two edges intersect. For example, it could be any of the following: the first corner point where the first and second edges intersect, the second corner point where the second and third edges intersect, the third corner point where the third and fourth edges intersect, and the fourth corner point where the first and fourth edges intersect.

[0068] In a specific example of the scheme disclosed herein, the reference qubit is used to simulate the qubit with the highest frequency in a quantum chip, for example, to simulate the qubit with the highest frequency in a quantum chip under normal operating conditions; or to simulate the qubit at the maximum limiting frequency, for example, to simulate the theoretical maximum limiting frequency of the qubit (for example, the maximum limiting frequency is not limited by the operating state of the quantum chip).

[0069] In this way, since the reference qubit can effectively simulate the qubit with the highest frequency in the quantum chip, or can be used to simulate the qubit at the maximum limiting frequency, it can effectively simulate whether coupling occurs between the qubit in the quantum chip and the resonant cavity formed inside the package under the limiting conditions, thereby further improving the accuracy of the target measurement information.

[0070] In a specific example of the scheme disclosed herein, the target metric information can also be obtained in the following manner. Specifically, the above-described method of obtaining the target metric information based at least on the quantum characteristic information of the reference qubit (e.g., step S101 described above) specifically includes:

[0071] Method 1: When the energy dissipation information of the reference qubit contained in the quantum feature information is greater than the preset energy value, the target metric information is obtained; at this time, the target metric information characterizes the fundamental frequency information of the packaging box to meet the preset requirements.

[0072] Alternatively, if the energy dissipation information of the reference qubit contained in the quantum feature information is less than or equal to a preset energy value, the target metric information is obtained; in this case, the target metric information indicates that the fundamental frequency information of the packaging box does not meet the preset requirements.

[0073] Method 2: When the frequency information of the reference qubit contained in the quantum feature information is less than the fundamental frequency information of the packaging box, the target metric information is obtained; at this time, the target metric information indicates that the fundamental frequency information of the packaging box meets the preset requirements.

[0074] Alternatively, if the frequency information of the reference qubit contained in the quantum feature information is greater than or equal to the fundamental frequency information of the packaging box, the target metric information is obtained; in this case, the target metric information indicates that the fundamental frequency information of the packaging box does not meet the preset requirement.

[0075] Method 3: When the energy dissipation information of the reference qubit contained in the quantum feature information is greater than the preset energy value and the frequency information of the reference qubit contained in the quantum feature information is less than the fundamental frequency information of the packaging box, the target metric information is obtained; at this time, the target metric information indicates that the fundamental frequency information of the packaging box meets the preset requirements.

[0076] Alternatively, if the energy dissipation information of the reference qubit contained in the quantum feature information is less than or equal to a preset energy value, or if the frequency information of the reference qubit contained in the quantum feature information is greater than or equal to the fundamental frequency information of the packaging box, target metric information is obtained; in this case, the target metric information indicates that the fundamental frequency information of the packaging box does not meet the preset requirements.

[0077] Here, in one example, the energy dissipation information of the reference qubit contained in the quantum feature information is less than or equal to a preset energy value, or the frequency information of the reference qubit contained in the quantum feature information is greater than or equal to the fundamental frequency information of the package, which can refer to one of the following three cases:

[0078] (1) The energy dissipation information of the reference qubit contained in the quantum feature information is less than or equal to the preset energy value, and the frequency information of the reference qubit contained in the quantum feature information is less than the fundamental frequency information of the packaging box.

[0079] (2) The energy dissipation information of the reference qubit contained in the quantum feature information is greater than the preset energy value, and the frequency information of the reference qubit contained in the quantum feature information is greater than or equal to the fundamental frequency information of the package.

[0080] (3) The energy dissipation information of the reference qubit contained in the quantum feature information is less than or equal to the preset energy value, and the frequency information of the reference qubit contained in the quantum feature information is greater than or equal to the fundamental frequency information of the package.

[0081] In one example, the preset energy value described above can be set according to the performance requirements of the quantum chip (e.g., it can be set to 10). 7 This public proposal does not impose specific restrictions on this.

[0082] In one example, the target metric information mentioned above can be represented by a first value or a second value, such as the value "1" and the value "0". In this case, the value "1" can specifically indicate that the baseband design of the package is reasonable; the value "0" can specifically indicate that the baseband design of the package is unreasonable.

[0083] It should be noted that any of the above three methods can be chosen and implemented, and this public plan does not impose any restrictions on this.

[0084] In this way, the disclosed solution can obtain target measurement information based on the numerical relationship between the energy dissipation information of the reference qubit and the preset energy value, and / or the numerical relationship between the frequency information of the reference qubit and the fundamental frequency information of the package. The target measurement information is accurate and highly interpretable. Moreover, the measurement method is simple and easy to implement. This effectively avoids the impact of improper fundamental frequency design of the package on the performance of the quantum chip, thereby improving the performance of the quantum chip.

[0085] For example, Figure 5 This is a schematic diagram of the implementation flow of the simulation method according to the embodiments of this disclosure. Figure 2 ;like Figure 5 As shown, the simulation method includes:

[0086] Step S501: Simulation obtains the quantum characteristic information of the reference qubit in the quantum chip encapsulated in the encapsulation box.

[0087] Here, the quantum characteristic information includes at least one of the following: the energy dissipation information of the reference qubit, the frequency information of the reference qubit; the energy dissipation information of the reference qubit is related to the fundamental frequency information of the packaging box.

[0088] The relevant description of quantum characteristic information can be found in the above explanation, and will not be repeated here.

[0089] Step S502: Determine whether the energy dissipation information of the reference qubit contained in the quantum feature information is greater than a preset energy value and whether the frequency information of the reference qubit contained in the quantum feature information is less than the fundamental frequency information of the packaging box; if yes, proceed to step S503; otherwise, that is, if the energy dissipation information of the reference qubit contained in the quantum feature information is less than or equal to the preset energy value, or the frequency information of the reference qubit contained in the quantum feature information is greater than or equal to the fundamental frequency information of the packaging box, proceed to step S504.

[0090] Step S503: When the energy dissipation information of the reference qubit contained in the quantum feature information is greater than a preset energy value, and the frequency information of the reference qubit contained in the quantum feature information is less than the fundamental frequency information of the packaging box, the target metric information is obtained. At this time, the target metric information indicates that the fundamental frequency information of the packaging box meets the preset requirements.

[0091] Step S504: If the energy dissipation information of the reference qubit contained in the quantum feature information is less than or equal to a preset energy value, or if the frequency information of the reference qubit contained in the quantum feature information is greater than or equal to the fundamental frequency information of the packaging box, the target metric information is obtained. In this case, the target metric information indicates that the fundamental frequency information of the packaging box does not meet the preset requirements.

[0092] In a specific example, the fundamental frequency information of the package can be obtained in the following way. For example, before step S502, the following operation is also performed: the fundamental frequency information of the package is obtained by simulation.

[0093] Here, in one example, the fundamental frequency information of the package is obtained during the simulation of the quantum chip packaged by the package. For example, the quantum chip packaged by the package is simulated to obtain the quantum characteristic information of the reference qubit and the fundamental frequency information of the package.

[0094] Alternatively, in another example, the fundamental frequency information of the package is obtained after simulating the package. For example, the package is modeled and simulated separately to obtain its fundamental frequency information. In this case, the quantum chip packaged by the simulated package and the simulated package are executed synchronously or asynchronously in different simulation processes, and this disclosure does not impose any restrictions on this.

[0095] Thus, this disclosure provides a specific simulation method for obtaining the fundamental frequency information of the packaging box. For example, the fundamental frequency information of the packaging box can be obtained during the simulation of the quantum chip packaged in the packaging box, which simplifies the simulation process. Alternatively, the packaging box can be simulated independently of the process of simulating the quantum chip packaged in the packaging box to obtain its fundamental frequency information, thereby improving simulation efficiency and providing data support for automatically, accurately, and efficiently determining whether the fundamental frequency of the packaging box meets the preset requirements.

[0096] Furthermore, in a specific example, obtaining the fundamental frequency information of the package box through simulation can specifically include: obtaining the fundamental frequency information corresponding to the target cavity within the package box through simulation. That is, in this example, the fundamental frequency information corresponding to the target cavity can be used as the fundamental frequency information of the package box. Here, the target cavity is the cavity with the largest empty volume within the package box.

[0097] Here, it can be understood that since the target cavity is the cavity with the largest volume in the package, the fundamental frequency information corresponding to the target cavity is the minimum value among the fundamental frequencies of the resonant cavities formed inside the package. Therefore, the fundamental frequency information of the target cavity is most likely to be close to the frequency information of the reference qubit in the quantum chip. At this time, if the fundamental frequency information corresponding to the target cavity (for example, it can be obtained by directly simulating the target cavity) is used as the fundamental frequency information of the package, and it meets the preset requirements, the fundamental frequency information of other cavities in the package will also necessarily meet the preset requirements, thereby further improving the accuracy of the target measurement information. At the same time, it also lays the foundation for further improving the simulation efficiency.

[0098] For example, in one example, the fundamental frequency information of the package is obtained during the simulation of the quantum chip packaged in the package. As shown in Figure 6(a), after modeling a package with an internal space for accommodating the quantum chip in electromagnetic simulation software, the quantum chip is modeled within the internal space of the package. The quantum chip then divides the internal space into two parts, forming a cavity in the first cavity and a cavity in the second cavity. In this example, the volume of the cavity in the second cavity is larger than the volume of the cavity in the first cavity. Here, because the volume of the cavity in the second cavity is larger than that in the first cavity, the second cavity is the cavity with the lowest fundamental frequency in the package. Further, in one example, if the cross-sectional area of ​​the cavity opening in the second cavity in the horizontal direction is smaller than the layer area of ​​the wiring layer, a stepped structure for supporting the quantum chip can also be formed in the second cavity. In this example, during the simulation of the quantum chip packaged in the package as shown in Figure 6(a), the fundamental frequency information corresponding to the second cavity in the package can be obtained through simulation, and this fundamental frequency information is used as the fundamental frequency information of the package. Here, while obtaining the fundamental frequency information corresponding to the second cavity, the quantum characteristic information of the reference qubit can also be obtained.

[0099] It should be noted that, as shown in Figure 6(a), after the quantum chip divides its internal space into two parts, the first cavity can form a first resonant cavity with the device layer of the quantum chip, and the second cavity can form a second resonant cavity with the wiring layer of the quantum chip. The fundamental frequency information of the second resonant cavity is less than that of the first resonant cavity.

[0100] Alternatively, in another example, the fundamental frequency information of the package is obtained after simulating the package. As shown in Figure 6(b), a package with a first internal space (the first internal space has the same volume as the internal space used to house the quantum chip in Figure 6(a)) can be modeled in electromagnetic simulation software. The package can then be simulated to obtain its fundamental frequency information.

[0101] In another example, the fundamental frequency information of the package is obtained after simulating the package. As shown in Figure 6(c), a package with a second internal space (the second internal space has the same volume as the cavity in the second cavity in Figure 6(a)) can be modeled in electromagnetic simulation software. Then, the package with the second internal space can be simulated to obtain the fundamental frequency information corresponding to the second cavity, which can then be used as the fundamental frequency information of the package.

[0102] Alternatively, in another example, the fundamental frequency information of the package is obtained after simulating the package. As shown in Figure 6(d), in electromagnetic simulation software, after modeling a package with a third internal space (the third internal space has the same volume as the internal space used to house the quantum chip in Figure 6(a)), a separator is modeled in the third internal space of the package. This separator divides the third internal space into two parts, forming cavities in the first cavity and the second cavity. Here, the separator can be the quantum chip or a layered structure made of the same material as the quantum chip. Subsequently, the second cavity can be simulated to obtain the fundamental frequency information corresponding to the second cavity, which can then be used as the fundamental frequency information of the package.

[0103] The following detailed explanation of this disclosure is provided with specific examples. Specifically, this disclosure offers a method for verifying the fundamental frequency design of a superconducting quantum chip package based on electromagnetic simulation, which can fully, accurately, and efficiently determine whether the fundamental frequency information of the package meets preset requirements.

[0104] More specifically, this disclosure provides a simulation verification process for checking the rationality of the fundamental frequency design of a package based on the frequency information and Q-factor of the qubits in a superconducting quantum chip. The Q-factor measures the energy dissipation of a component (e.g., a qubit); a higher Q-factor indicates lower energy dissipation and higher quantum chip performance. Based on this, this disclosure uses electromagnetic simulation software to simulate the package (e.g., one containing a superconducting quantum chip) to obtain the frequency information and corresponding Q-factor of the components in the superconducting quantum chip, thereby determining the rationality of the package's fundamental frequency design.

[0105] Before detailing the specific implementation of this disclosure, a brief overview of the structure of a superconducting quantum chip is provided. Here, a 3D flip-chip architecture (using 3D flip-chip technology to encapsulate a superconducting quantum chip) is used as an example. Specifically, the superconducting quantum chip includes an upper chip (e.g., a device layer) and a lower chip (e.g., a wiring layer). The packaging box is typically made of copper and consists of a base and a top cover. The top cover is mounted on the base, creating an internal space between the base and the top cover to accommodate the superconducting quantum chip. During simulation, as shown in Figure 6(a), the base and top cover can be modeled as a single, integrated structure in electromagnetic simulation software to form a packaging box with an internal space for accommodating the superconducting quantum chip. The superconducting quantum chip is then modeled within this internal space. In this case, the superconducting quantum chip divides its internal space into two parts, referred to as the upper cavity (i.e., the first cavity mentioned above) and the lower cavity (i.e., the second cavity mentioned above). In this example, the lower cavity is larger than the upper cavity; specifically, the volume of the cavity in the lower cavity is larger than the volume of the cavity in the upper cavity. The specific structure after modeling can be found in the description above, and will not be repeated here.

[0106] It should be noted that in practical applications, the larger the cavity volume in the cavity, the smaller its fundamental frequency. The smaller the fundamental frequency, the easier it is to couple with the components, thus affecting the performance of the superconducting quantum chip. Therefore, the cavity with the smaller fundamental frequency needs to be considered in the packaging box. In this example, the cavity with the smallest fundamental frequency is the lower cavity.

[0107] Furthermore, the content of this disclosure is specifically introduced and demonstrated from three aspects: Part 1, the inspection process of the package baseband design; Part 2, the inspection principle of the package baseband design; and Part 3, an example of the package baseband design, to verify the effectiveness of this disclosure.

[0108] Part 1: Inspection Process for Package Box Baseband Design

[0109] Specifically, as shown in Figure 7(a), the inspection process includes:

[0110] Step S701: Based on the designed dimensions of the packaging box and the superconducting quantum chip, a model of the packaging box and a model of the superconducting quantum chip are built in the electromagnetic simulation software.

[0111] Step S702: Model a frequency-tunable reference qubit on the surface of the superconducting quantum chip (e.g., in the device layer) to simulate the components in the superconducting quantum chip. For example, simulate the limiting case where energy dissipation is most affected by the fundamental frequency of the package due to its proximity to the edge of the package. For instance, as shown in Figure 7(b), the modeled reference qubit is located at a corner position of the device layer.

[0112] Step S703: Adjust the frequency of the reference quantum bit and set it to the maximum value to simulate the highest frequency component in a real chip.

[0113] Step S704: Simulate the fundamental frequency information of the package, as well as the frequency information and Q factor of the reference qubit.

[0114] Step S705: Determine whether the frequency information of the reference qubit is less than the fundamental frequency information of the package, and determine whether the Q factor of the reference qubit meets the preset energy requirement (e.g., whether it reaches the 7th power level). If both are true, proceed to step S706; otherwise, proceed to step S707.

[0115] Step S706: When the frequency information of the reference qubit is less than the fundamental frequency information of the package and the Q factor of the reference qubit meets the preset energy requirement, target metric information is obtained to characterize that the fundamental frequency information of the package meets the preset requirement. This target metric information can indicate that the fundamental frequency design of the package is reasonable.

[0116] Step S707: When the frequency information of the reference qubit is greater than or equal to the fundamental frequency information of the package, or when the Q factor of the reference qubit does not meet the preset energy requirement, a target metric information is obtained to characterize that the fundamental frequency information of the package does not meet the preset requirement. This target metric information can indicate that the fundamental frequency design of the package is unreasonable.

[0117] Here, the frequency information of the reference qubit being greater than or equal to the fundamental frequency information of the package, or the Q factor of the reference qubit not meeting the preset energy requirement, can refer to one of the following three situations:

[0118] (1) The frequency information of the reference quantum bit is greater than or equal to the fundamental frequency information of the package box, and the Q factor of the reference quantum bit meets the preset energy requirement;

[0119] (2) The frequency information of the reference quantum bit is less than the fundamental frequency information of the package box, and the Q factor of the reference quantum bit does not meet the preset energy requirement;

[0120] (3) The frequency information of the reference quantum bit is greater than or equal to the fundamental frequency information of the package box, and the Q factor of the reference quantum bit does not meet the preset energy requirement.

[0121] Part Two: Verification Principles of Package Box Baseband Design

[0122] The principles behind some details of the process in this disclosed solution will be explained below.

[0123] In step S702, the reference qubit is located at the edge of the superconducting quantum chip, simulating the extreme case where energy dissipation is most affected by the fundamental frequency of the packaging box. If the Q-factor of the reference qubit meets the preset energy requirement under this condition, then other components located at other positions, farther from the edge of the superconducting quantum chip, will experience less energy dissipation due to the fundamental frequency of the packaging box, and their Q-factors will also meet the preset energy requirement. Therefore, it is only necessary to check whether the Q-factors of components at the edge of the superconducting quantum chip meet the preset energy requirement.

[0124] In step S703, the frequency of the reference qubit is adjusted to simulate the highest frequency component in the real chip, or the maximum value of the component. If, in this case, the frequency information of the simulated reference qubit is less than the fundamental frequency information of the package, then the frequency information of other components must also be less than the fundamental frequency of the package. Therefore, it is only necessary to check whether the highest frequency component is less than the fundamental frequency of the package.

[0125] In the verification process shown in Figure 7(a), a single qubit (reference qubit) is used as the detector, and its frequency information and Q factor are simulated to verify the rationality of the package's fundamental frequency design. In practical applications, the energy dissipation of components is affected not only by the fundamental frequency information of the package but also by other dissipation sources, thus changing its Q factor. For example, it is affected by the load on its read and control lines. However, when verifying the dissipation caused by the fundamental frequency information of the package, the load effect on the read and control lines does not need to be considered for the following reasons:

[0126] The Q factor is defined as:

[0127]

[0128] Wherein, Q is used to characterize the Q factor corresponding to the component under the combined influence of the fundamental frequency information of the package and other dissipation sources; P is used to characterize the energy dissipation rate of the component, for example, P1 is used to characterize the energy dissipation rate of the component caused by the influence of the fundamental frequency information of the package; P2 is used to characterize the energy dissipation rate of the component caused by the influence of other dissipation sources.

[0129] If a component is defined to be affected by a single dissipation source (e.g., a package or other dissipation source), then its Q value is:

[0130]

[0131] Q1 is used to characterize the Q factor of the component affected by the fundamental frequency information of the package; Q2 is used to characterize the Q factor of the component affected by other dissipation sources in the package.

[0132] Therefore, the total Q factor satisfies:

[0133]

[0134] Wherein, Q is used to characterize the Q factor of the component under the combined influence of the fundamental frequency information of the package and other dissipation sources; Q1 is used to characterize the Q factor of the component affected by the fundamental frequency information of the package; and Q2 is used to characterize the Q factor of the component affected by other dissipation sources of the package.

[0135] It is evident that the total Q factor must be smaller than either Q1 or Q2, which is the weakest link effect. Therefore, as long as Q1 is verified to meet the preset energy requirements, it can be proven that the energy dissipation caused by the fundamental frequency information of the package box is not dominant, and the fundamental frequency design of the package box is reasonable.

[0136] Part Three: Examples of Package Box Baseband Design

[0137] The effectiveness of this disclosed solution will be verified by a specific example below.

[0138] According to the verification process shown in Figure 7(a), the verification process is as follows:

[0139] Step (1): As shown in Figures 8(a) and 8(b), a model of the packaging box is established in the electromagnetic simulation software. The packaging box is made of copper. The internal space of the packaging box is divided into an upper cavity and a lower cavity by a superconducting quantum chip. The dimensions (length × width × height) of the lower cavity are 40 mm × 14 mm × 5 mm. The upper cavity is divided into two parts with dimensions of 42.4 mm × 14 mm × 2 mm and 23 mm × 11 mm × 3 mm, respectively. A 3D flip-chip architecture is modeled inside the packaging box, including an upper chip (device layer) and a lower chip (wiring layer). The upper chip measures 23mm x 11mm (length x width), and the lower chip measures 42.4mm x 14mm. The upper and lower chips are spaced 0.01mm apart. Both chips have a 0.4mm thick sapphire substrate. Each chip has a layer of ideally conductive metal covering its surface. Elements (e.g., qubits) can be formed by etching the metal layer covering the upper chip, and wiring structures providing power and / or signal connections for each element can be formed by etching the metal layer covering the lower chip. Furthermore, as shown in Figure 8(c), the portion of the metal layer on the upper chip that serves as a zero-potential reference ground is connected to the portion of the metal layer on the lower chip that serves as a zero-potential reference ground by multiple indium pillars, forming a unified zero-potential reference ground. These indium pillars also support the upper chip.

[0140] Step (2): Model a reference qubit, which is located in the lower left corner of the upper chip (i.e., the device layer). The structure of the reference qubit can be formed by etching the metal layer covering the surface of the upper chip.

[0141] Step (3): Adjust the frequency of the reference quantum bit to about 10 gigahertz (GHz) to simulate the highest frequency component in a real chip.

[0142] Step (4): Simulate the fundamental frequency information of the package box, as well as the frequency information and Q factor of the reference quantum bit. The fundamental frequency information of the package box is 12.43 GHz, the frequency information of the reference quantum bit is 10.06 GHz, and the Q factor of the reference quantum bit is on the order of the 7th power.

[0143] Step (5): Determine that the frequency information of the reference quantum bit is less than the fundamental frequency information of the package.

[0144] Step (6): Determine that the Q factor of the reference qubit meets the preset energy requirement (reaching the 7th power level).

[0145] Step (7): Obtain target metric information to characterize the baseband information of the package box to meet the preset requirements. This target metric information can indicate that the baseband design of the package box is reasonable.

[0146] This disclosure provides a method for verifying the fundamental frequency design of a superconducting quantum chip package based on electromagnetic simulation. This method can fully, accurately, and efficiently determine whether the fundamental frequency information of the package meets preset requirements. Specifically, this disclosure has the following advantages, including:

[0147] (1) It ensures the high performance of the superconducting quantum chip. The fundamental frequency design of the package directly affects the performance of the superconducting quantum chip. The scheme disclosed in this paper fully considers whether the Q factor of the components in the superconducting quantum chip meets the preset energy requirements, which can ensure that the fundamental frequency of the qualified package will not affect the performance of the superconducting quantum chip.

[0148] (2) High testing efficiency. The proposed solution relies solely on electromagnetic simulation, and the required model is simple and the simulation is rapid, which can efficiently obtain the judgment result of the rationality of the fundamental frequency of the package.

[0149] (3) Significantly saves resource costs. The disclosed solution can obtain the measurement results of the fundamental frequency information of the packaging box in advance before designing the superconducting quantum chip. Compared with the solution that obtains the measurement results of the fundamental frequency information of the packaging box indirectly by experimentally measuring the quantum chip after completing the design, processing and measurement and control process of the quantum chip, it can avoid re-execution of the design, processing and measurement and control process of the quantum chip due to improper design of the fundamental frequency of the packaging box, thereby significantly saving manpower and time costs.

[0150] This disclosure also provides a simulation device, such as Figure 9 As shown, it includes:

[0151] Processing unit 901 is used to simulate and obtain quantum characteristic information of a reference qubit in a quantum chip packaged in a packaging box; wherein the quantum characteristic information includes at least one of the following: energy dissipation information of the reference qubit, frequency information of the reference qubit; the energy dissipation information of the reference qubit is related to the fundamental frequency information of the packaging box; and target metric information is obtained based at least on the quantum characteristic information of the reference qubit; the target metric information is used to characterize whether the fundamental frequency information of the packaging box meets preset requirements.

[0152] Output unit 902 is used to output the target measurement information.

[0153] In a specific example of the scheme disclosed herein, the reference qubit is used to simulate the qubit in the quantum chip encapsulated by the package box that has the greatest energy dissipation due to the fundamental frequency information of the package box.

[0154] In one specific example of the scheme disclosed herein, the reference qubit is located at the edge of the device layer in the quantum chip.

[0155] In a specific example of the scheme disclosed herein, the edge position is the corner point where any two edges on the device layer of the quantum chip intersect.

[0156] In one specific example of the scheme disclosed herein, the reference qubit is used to simulate the qubit with the highest frequency in the quantum chip, or to simulate the qubit at the maximum limiting frequency.

[0157] In a specific example of the scheme disclosed herein, the processing unit 901 is specifically configured to perform at least one of the following:

[0158] When the energy dissipation information of the reference qubit contained in the quantum feature information is greater than a preset energy value, the target metric information is obtained; the target metric information characterizes that the fundamental frequency information of the packaging box meets the preset requirement;

[0159] When the energy dissipation information of the reference qubit contained in the quantum feature information is less than or equal to the preset energy value, the target metric information is obtained; the target metric information indicates that the fundamental frequency information of the packaging box does not meet the preset requirement.

[0160] In a specific example of the scheme disclosed herein, the processing unit 901 is specifically configured to perform at least one of the following:

[0161] When the frequency information of the reference qubit contained in the quantum feature information is less than the fundamental frequency information of the packaging box, the target metric information is obtained; the target metric information indicates that the fundamental frequency information of the packaging box meets the preset requirement;

[0162] When the frequency information of the reference qubit contained in the quantum feature information is greater than or equal to the fundamental frequency information of the packaging box, the target metric information is obtained; the target metric information indicates that the fundamental frequency information of the packaging box does not meet the preset requirement.

[0163] In a specific example of the scheme disclosed herein, the processing unit 901 is specifically configured to perform at least one of the following:

[0164] The target metric information is obtained when the energy dissipation information of the reference qubit contained in the quantum feature information is greater than a preset energy value and the frequency information of the reference qubit contained in the quantum feature information is less than the fundamental frequency information of the packaging box; the target metric information indicates that the fundamental frequency information of the packaging box meets the preset requirement.

[0165] The target metric information is obtained when the energy dissipation information of the reference qubit contained in the quantum feature information is less than or equal to the preset energy value, or when the frequency information of the reference qubit contained in the quantum feature information is greater than or equal to the fundamental frequency information of the packaging box; the target metric information indicates that the fundamental frequency information of the packaging box does not meet the preset requirement.

[0166] In a specific example of the scheme disclosed herein, the processing unit is further configured to:

[0167] The fundamental frequency information of the package is obtained through simulation; wherein the fundamental frequency information of the package is obtained during the simulation of the quantum chip packaged by the package, or after simulating the package.

[0168] In a specific example of the disclosed solution, the processing unit is specifically used for:

[0169] The fundamental frequency information corresponding to the target cavity in the package is obtained by simulation; the target cavity is the cavity with the largest empty volume in the package.

[0170] In a specific example of the scheme disclosed herein, the quantum chip is a superconducting quantum chip.

[0171] The specific functions and examples of each module and submodule of the apparatus in this disclosure can be found in the relevant descriptions of the corresponding steps in the above method embodiments, and will not be repeated here.

[0172] This disclosure also provides a non-transitory computer-readable storage medium storing computer instructions that, when executed by at least one quantum processing unit, cause the at least one quantum processing unit to perform the method described above using a quantum computing device.

[0173] This disclosure also provides a computer program product, including a computer program that, when executed by a processor, implements the methods described above for use in classical computing devices.

[0174] Alternatively, the computer program, when executed by at least one quantum processing unit, implements the method applied to a quantum computing device.

[0175] This disclosure also provides a quantum computing device, the quantum computing device comprising:

[0176] At least one quantum processing unit;

[0177] A memory, coupled to the at least one QPU and used to store executable instructions,

[0178] The instructions are executed by the at least one quantum processing unit to enable the at least one quantum processing unit to perform the method applied to the quantum computing device.

[0179] It is understood that the quantum processing unit (QPU) used in the present disclosure may also be referred to as a quantum processor or quantum chip, and may involve a physical chip comprising multiple qubits interconnected in a specific manner.

[0180] Furthermore, it is understood that the qubit described in this disclosure can refer to the basic information unit of a quantum computing device. The qubit is contained within the QPU and extends the concept of the classical digital bit.

[0181] The acquisition, storage, and application of user personal information involved in the technical solution disclosed herein comply with the provisions of relevant laws and regulations and do not violate public order and good morals.

[0182] Figure 10 A schematic block diagram of an example computing device 1000 that can be used to implement embodiments of the present disclosure is shown. The computing device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The computing device may also represent various forms of mobile devices, such as personal digital assistants, cellular phones, smartphones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the present disclosure described and / or claimed herein.

[0183] like Figure 10 As shown, device 1000 includes a computing unit 1001, which can perform various appropriate actions and processes according to a computer program stored in read-only memory (ROM) 1002 or a computer program loaded from storage unit 1008 into random access memory (RAM) 1003. The RAM 1003 may also store various programs and data required for the operation of device 1000. The computing unit 1001, ROM 1002, and RAM 1003 are interconnected via bus 1004. Input / output (I / O) interface 1005 is also connected to bus 1004.

[0184] Multiple components in device 1000 are connected to I / O interface 1005, including: input unit 1006, such as keyboard, mouse, etc.; output unit 1007, such as various types of monitors, speakers, etc.; storage unit 1008, such as disk, optical disk, etc.; and communication unit 1009, such as network card, modem, wireless transceiver, etc. Communication unit 1009 allows device 1000 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0185] The computing unit 1001 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the computing unit 1001 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The computing unit 1001 performs the various methods and processes described above, such as simulation methods. For example, in some embodiments, the simulation method may be implemented as a computer software program tangibly contained in a machine-readable medium, such as storage unit 1008. In some embodiments, part or all of the computer program may be loaded and / or installed on device 1000 via ROM 1002 and / or communication unit 1009. When the computer program is loaded into RAM 1003 and executed by the computing unit 1001, one or more steps of the simulation method described above may be performed. Alternatively, in other embodiments, the computing unit 1001 may be configured to perform simulation methods by any other suitable means (e.g., by means of firmware).

[0186] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0187] The program code used to implement the methods of this disclosure may be written in any combination of one or more programming languages. This program code may be provided to a processor or controller of a general-purpose computer, special-purpose computer, or other programmable data processing apparatus, such that when executed by the processor or controller, the program code causes the functions / operations specified in the flowcharts and / or block diagrams to be implemented. The program code may be executed entirely on a machine, partially on a machine, as a standalone software package partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0188] In the context of this disclosure, a machine-readable medium can be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, apparatus, or device. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can be, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0189] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device for displaying information to the user (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor); and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the computer. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0190] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as a data server), or computing systems that include middleware components (e.g., an application server), or computing systems that include frontend components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with embodiments of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., a communication network). Examples of communication networks include local area networks (LANs), wide area networks (WANs), and the Internet.

[0191] Computer systems can include clients and servers. Clients and servers are generally located far apart and typically interact via communication networks. Client-server relationships are created by computer programs running on the respective computers and having a client-server relationship with each other. Servers can be cloud servers, servers in distributed systems, or servers incorporating blockchain technology.

[0192] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this disclosure can be achieved, and this is not limited herein.

[0193] The specific embodiments described above do not constitute a limitation on the scope of protection of this disclosure. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A simulation method, comprising: The simulation obtains the quantum characteristic information of a reference qubit in a quantum chip packaged in a packaging box; wherein the energy dissipation information of the reference qubit is affected by the fundamental frequency information of the packaging box; wherein the quantum characteristic information includes at least one of the following: the energy dissipation information of the reference qubit, the frequency information of the reference qubit; when the quantum characteristic information includes the energy dissipation information of the reference qubit, the reference qubit is used to simulate the qubit with the largest energy dissipation caused by the fundamental frequency information of the packaging box in the quantum chip packaged in the packaging box; when the quantum characteristic information includes the frequency information of the reference qubit, the reference qubit is used to simulate the qubit with the highest frequency in the quantum chip or to simulate the qubit at the maximum limiting frequency; And at least based on the quantum characteristic information of the reference qubit, target metric information is obtained; the target metric information is used to characterize whether the fundamental frequency information of the packaging box meets the preset requirements; Wherein, obtaining the target metric information based at least on the quantum characteristic information of the reference qubit includes one of the following: When the quantum feature information includes the energy dissipation information of the reference qubit, and the energy dissipation information of the included reference qubit is greater than a preset energy value, the target metric information is obtained; the target metric information indicates that the fundamental frequency information of the packaging box meets the preset requirement; When the quantum feature information includes the energy dissipation information of the reference qubit, and the energy dissipation information of the included reference qubit is less than or equal to the preset energy value, the target metric information is obtained; the target metric information indicates that the fundamental frequency information of the package does not meet the preset requirement. When the quantum feature information includes the frequency information of the reference qubit, and the frequency information of the included reference qubit is less than the fundamental frequency information of the packaging box, the target metric information is obtained; the target metric information indicates that the fundamental frequency information of the packaging box meets the preset requirement. When the quantum feature information includes the frequency information of the reference qubit, and the frequency information of the included reference qubit is greater than or equal to the fundamental frequency information of the packaging box, the target metric information is obtained; the target metric information indicates that the fundamental frequency information of the packaging box does not meet the preset requirement; The target metric information is obtained when the quantum feature information includes the energy dissipation information and frequency information of the reference qubit, and the energy dissipation information of the reference qubit included in the quantum feature information is greater than a preset energy value and the frequency information of the reference qubit included in the quantum feature information is less than the fundamental frequency information of the packaging box; the target metric information indicates that the fundamental frequency information of the packaging box meets the preset requirement. The target metric information is obtained when the quantum feature information includes the energy dissipation information and frequency information of the reference qubit, and the energy dissipation information of the reference qubit included in the quantum feature information is less than or equal to the preset energy value, or the frequency information of the reference qubit included in the quantum feature information is greater than or equal to the fundamental frequency information of the packaging box; the target metric information indicates that the fundamental frequency information of the packaging box does not meet the preset requirement.

2. The method according to claim 1, wherein, The reference qubit is located at the edge of the device layer in the quantum chip.

3. The method according to claim 2, wherein, The edge position is the corner point where any two edges on the device layer of the quantum chip intersect.

4. The method according to claim 1, 2, or 3, further comprising: The fundamental frequency information of the package is obtained through simulation; wherein the fundamental frequency information of the package is obtained during the simulation of the quantum chip packaged by the package, or after simulating the package.

5. The method according to claim 4, wherein, The simulation obtains the fundamental frequency information of the package, including: The fundamental frequency information corresponding to the target cavity in the package is obtained by simulation; the target cavity is the cavity with the largest empty volume in the package.

6. The method according to claim 1, 2, or 3, wherein, The quantum chip is a superconducting quantum chip.

7. A simulation device, comprising: A processing unit is configured to simulate and obtain quantum characteristic information of a reference qubit in a quantum chip packaged in a packaging box; wherein the energy dissipation information of the reference qubit is affected by the fundamental frequency information of the packaging box; wherein the quantum characteristic information includes at least one of the following: the energy dissipation information of the reference qubit, the frequency information of the reference qubit; when the quantum characteristic information includes the energy dissipation information of the reference qubit, the reference qubit is used to simulate the qubit with the largest energy dissipation caused by the fundamental frequency information of the packaging box in the quantum chip packaged in the packaging box; when the quantum characteristic information includes the frequency information of the reference qubit, the reference qubit is used to simulate the qubit with the highest frequency in the quantum chip or to simulate the qubit at the maximum limiting frequency; and to obtain target metric information based at least on the quantum characteristic information of the reference qubit; the target metric information is used to characterize whether the fundamental frequency information of the packaging box meets a preset requirement. Output unit, used to output the target measurement information; Specifically, the processing unit is configured to perform one of the following: when the quantum feature information includes the energy dissipation information of the reference qubit, and the energy dissipation information of the included reference qubit is greater than a preset energy value, the target metric information is obtained; the target metric information indicates that the fundamental frequency information of the packaging box meets the preset requirement. When the quantum feature information includes the energy dissipation information of the reference qubit, and the energy dissipation information of the included reference qubit is less than or equal to the preset energy value, the target metric information is obtained; the target metric information indicates that the fundamental frequency information of the package does not meet the preset requirement. When the quantum feature information includes the frequency information of the reference qubit, and the frequency information of the included reference qubit is less than the fundamental frequency information of the packaging box, the target metric information is obtained; the target metric information indicates that the fundamental frequency information of the packaging box meets the preset requirement. When the quantum feature information includes the frequency information of the reference qubit, and the frequency information of the included reference qubit is greater than or equal to the fundamental frequency information of the packaging box, the target metric information is obtained; the target metric information indicates that the fundamental frequency information of the packaging box does not meet the preset requirement; The target metric information is obtained when the quantum feature information includes the energy dissipation information and frequency information of the reference qubit, and the energy dissipation information of the reference qubit included in the quantum feature information is greater than a preset energy value and the frequency information of the reference qubit included in the quantum feature information is less than the fundamental frequency information of the packaging box; the target metric information indicates that the fundamental frequency information of the packaging box meets the preset requirement. The target metric information is obtained when the quantum feature information includes the energy dissipation information and frequency information of the reference qubit, and the energy dissipation information of the reference qubit included in the quantum feature information is less than or equal to the preset energy value, or the frequency information of the reference qubit included in the quantum feature information is greater than or equal to the fundamental frequency information of the packaging box; the target metric information indicates that the fundamental frequency information of the packaging box does not meet the preset requirement.

8. The apparatus according to claim 7, wherein, The reference qubit is located at the edge of the device layer in the quantum chip.

9. The apparatus according to claim 8, wherein, The edge position is the corner point where any two edges on the device layer of the quantum chip intersect.

10. The apparatus according to claim 7, 8, or 9, wherein, The processing unit is further configured to: The fundamental frequency information of the package is obtained through simulation; wherein the fundamental frequency information of the package is obtained during the simulation of the quantum chip packaged by the package, or after simulating the package.

11. The apparatus according to claim 10, wherein, The processing unit is specifically used for: The fundamental frequency information corresponding to the target cavity in the package is obtained by simulation; the target cavity is the cavity with the largest empty volume in the package.

12. The apparatus according to claim 7, 8, or 9, wherein, The quantum chip is a superconducting quantum chip.

13. A computing device, comprising: At least one quantum processing unit (QPU); A memory, coupled to the at least one QPU and used to store executable instructions, The instructions are executed by the at least one QPU to enable the at least one QPU to perform the method of any one of claims 1 to 6; Or, including: At least one processor; and A memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the method of any one of claims 1-6.

14. A non-transitory computer-readable storage medium storing computer instructions, characterized in that, When at least one quantum processing unit is executed, the computer instructions cause the at least one quantum processing unit to perform the method according to any one of claims 1 to 6; Alternatively, the computer instructions are used to cause the computer to perform the method according to any one of claims 1-6.

15. A computer program product comprising a computer program that, when executed by at least one quantum processing unit, implements the method according to any one of claims 1-6; Alternatively, the computer program, when executed by a processor, implements the method according to any one of claims 1-6.

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