Micro-led wafer repairing device

Abstract

The application discloses a Micro-LED wafer repairing device, and belongs to the technical field of semiconductors. The wafer repairing device is characterized in that a filter screen and a cleaning assembly are arranged in the second inner cavity of the carrier disc seat. In the air extraction process, the cleaning assembly is cleaned under the action of air flow to scrape off impurities on the filter screen, and the scraped-off impurities are collected by the collecting frame below, so that the impurities are removed in the air extraction process. When the repairing work of the wafer is completed, the air pump is inflated, the wafer is slightly suspended, and the wafer is convenient to take away. At this time, since the impurities on the filter screen have been removed, the inflation air flow cannot carry the impurities to be sprayed out from the adsorption groove, the damage of the impurities to the bottom surface of the wafer is effectively avoided, and the repairing work of the wafer is facilitated.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor technology, and specifically relates to a Micro-LED wafer repair device. Background Technology

[0002] Micro-LED wafers are silicon wafers for Micro-LEDs. Their raw material is silicon. The preparation process generally involves dissolving high-purity polycrystalline silicon and then doping it with silicon crystal seeds. The silicon crystals are then stretched to form cylindrical single-crystal silicon (i.e., silicon ingots). After grinding, polishing, and slicing, the silicon ingots are formed into silicon wafers, which are wafers. As the critical dimensions of wafers become smaller, the scratches caused by chemical mechanical polishing (CMP) have an increasingly significant impact on product yield. When scratches and dents occur on the wafer surface, it is necessary to repair these surface defects to minimize economic losses for the company. Existing wafer repair equipment, in order to ensure the wafer's design requirements, often fills the scratches and dents with repair material and cures it. Finally, a grinding device is used to make the repair material conform to the wafer surface, achieving the purpose of wafer repair. However, existing wafer repair equipment typically uses a vacuum adsorption carrier to hold the wafer in place during the repair grinding process. Impurities generated during grinding can easily fall into the adsorption holes of the vacuum adsorption carrier, making them difficult to clean. Furthermore, when the vacuum adsorption carrier releases the vacuum to release the wafer, these impurities are ejected from the adsorption holes under the airflow, causing scratches and damage to the bottom surface of the wafer, thus affecting the wafer repair process.

[0003] Therefore, existing technologies need to be improved and developed. Summary of the Invention

[0004] The purpose of this application is to provide a Micro-LED wafer repair device that can effectively avoid damage to the bottom surface of the wafer caused by impurities, thereby facilitating wafer repair work.

[0005] This application provides a Micro-LED wafer repair device, including a repair device body and a tray holder. The tray holder is disposed on the repair device body and is provided with a cleaning component, a filter, a first inner cavity, a second inner cavity, and multiple adsorption tanks.

[0006] The upper surface of the tray holder is used to place the wafer. A plurality of adsorption grooves are disposed on the upper surface of the tray holder, and the plurality of adsorption grooves are all connected to the first inner cavity. The first inner cavity is connected to the air pump through the second inner cavity. A filter screen and a cleaning component are disposed in the second inner cavity. The cleaning component is movably disposed on the upper side of the filter screen. When the air pump performs air extraction and inflation, the cleaning component cleans the filter screen under the airflow to scrape off impurities on the filter screen. A collection frame is disposed on the lower side of the filter screen, and the collection frame is used to collect the scraped-off impurities.

[0007] The above settings effectively prevent impurities from damaging the bottom surface of the wafer, thus facilitating wafer repair.

[0008] Furthermore, the cleaning assembly includes a rotating shaft, a cleaning brush, and multiple fan blades. The multiple fan blades are arranged at intervals along the circumference of the rotating shaft. The rotating shaft is disposed in the second inner cavity and is rotatable. The cleaning brush is fixed to the rotating shaft by a fixing assembly. When the air pump performs air extraction and inflation, the airflow in the second inner cavity drives the fan blades to rotate the rotating shaft, thereby enabling the cleaning brush to clean the filter.

[0009] By setting a rotating shaft in the second inner cavity, the airflow passing through the second inner cavity drives the fan blades to rotate, thus enabling the cleaning brush to clean the filter without providing additional driving energy.

[0010] Furthermore, the fixing assembly includes two fixing rods and two bushings. One end of each of the two fixing rods is fixedly connected to both ends of the cleaning brush, and the other ends of each of the two fixing rods are respectively disposed at both ends of the rotating shaft through one of the bushings.

[0011] Furthermore, the bottom of the second inner cavity is provided with a first through hole and a second through hole. The first through hole is located on the side of the filter screen near the cleaning brush, and the second through hole is located on the side of the filter screen away from the cleaning brush. Both the first through hole and the second through hole are connected to the collection frame.

[0012] Furthermore, the adsorption tank is provided with a one-way air outlet and multiple one-way air inlets. The one-way air outlet and multiple one-way air inlets are all connected to the first inner cavity. The one-way air inlets are used to adsorb the wafer when the air pump draws air, and the one-way air outlet is used to de-adsorb the wafer when the air pump supplies air.

[0013] Furthermore, a conductive block is provided inside the carrier plate, and the conductive block is grounded through a wire.

[0014] By placing a conductive block inside the disk carrier, the static electricity of the disk carrier is conducted to the ground, thereby eliminating the effect of electrostatic adsorption on the wafer.

[0015] Furthermore, a waterproof and breathable layer is provided on the side of the one-way air outlet near the first inner cavity.

[0016] Furthermore, the one-way air outlet is disposed on the side wall of the adsorption tank, and multiple one-way air inlets are disposed at the bottom of the adsorption tank.

[0017] Furthermore, the filter screen is an arc-shaped structure coaxial with the rotating shaft.

[0018] Furthermore, the main body of the repair device includes a base, two guide rails, a sliding assembly, and a grinding device. The disk carrier is disposed on the base, and the two guide rails are respectively disposed on both sides of the disk carrier and extend along the X-axis direction. The grinding device is disposed on the guide rails through the sliding assembly, and the grinding device can slide along the Y-axis direction on the sliding assembly. The grinding device is used to repair the wafer on the disk carrier.

[0019] As can be seen from the above, the Micro-LED wafer repair device of the present invention, by setting a filter and a cleaning component in the second inner cavity of the tray holder, cleans the filter under the push of airflow during the air extraction process to scrape off the impurities on the filter, and the scraped impurities are collected by the collection frame below, thereby achieving the removal of impurities during the air extraction process. When the wafer repair work is completed, the air pump inflates the wafer, making the wafer slightly suspended for easy removal. At this time, since the impurities on the filter have been removed, the airflow will not carry impurities out of the adsorption tank, effectively avoiding damage to the bottom surface of the wafer by impurities, thus facilitating the wafer repair work.

[0020] Other features and advantages of this application will be set forth in the following description and will be apparent in part from the description or may be learned by practicing embodiments of this application. The objectives and other advantages of this application may be realized and obtained by means of the structures particularly pointed out in the written description and the accompanying drawings. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of a Micro-LED wafer repair device provided in an embodiment of this application.

[0022] Figure 2 This is a first-view structural schematic diagram of the tray holder provided in an embodiment of this application.

[0023] Figure 3 This is a second-view structural schematic diagram of the disk holder provided in an embodiment of this application.

[0024] Figure 4 for Figure 3 A magnified structural diagram of point A in the middle.

[0025] Figure 5 This is a cross-sectional view of the tray holder provided in an embodiment of this application.

[0026] Figure 6 for Figure 5 A magnified structural diagram at point B in the middle.

[0027] Figure 7 This is a diagram showing the positions of the cleaning components and the filter.

[0028] Labeling Explanation: 100, Carrier Plate; 110, Cleaning Component; 111, Rotating Shaft; 112, Cleaning Brush; 113, Fan Blade; 114, Fixing Rod; 115, Bushing; 120, Filter Screen; 130, First Inner Cavity; 140, Second Inner Cavity; 141, First Through Hole; 142, Second Through Hole; 143, Collection Frame; 150, Adsorption Tank; 151, One-Way Air Outlet; 152, One-Way Air Inlet; 160, Conductive Block; 170, Wafer; 181, Base; 182, Guide Rail; 183, Grinding Device; 184, Sliding Component; 1841, Mounting Plate; 1842, First Motor; 1843, Crossbar; 1844, Sliding Seat; 1845, Second Motor; 1846, Sliding Block; 190, Door Panel; 200, Air Pump; 210, Baffle. Detailed Implementation

[0029] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0030] The following disclosure provides many different embodiments or examples for implementing different structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0031] like Figures 1-7 As shown, this application provides a Micro-LED wafer repair device, including a repair device body and a tray 100. The tray 100 is disposed on the repair device body and is provided with a cleaning component 110, a filter 120, a first inner cavity 130, a second inner cavity 140 and a plurality of adsorption grooves 150.

[0032] The upper surface of the tray holder 100 is used to place the wafer 170. Multiple adsorption grooves 150 are disposed on the upper surface of the tray holder 100. All multiple adsorption grooves 150 are connected to the first inner cavity 130. The first inner cavity 130 is connected to the air pump 200 through the second inner cavity 140. The second inner cavity 140 is provided with a filter screen 120 and a cleaning component 110. The cleaning component 110 is movably disposed on the upstream side of the filter screen 120. When the air pump 200 performs air extraction and inflation, the cleaning component 110 cleans the filter screen 120 under the push of the airflow to scrape off the impurities on the filter screen 120. A collection frame 143 is provided on the lower side of the filter screen 120. The collection frame 143 is used to collect the scraped-off impurities.

[0033] Upstream refers to the direction upstream based on the airflow direction during vacuuming. For example... Figure 5 During vacuuming, the airflow passes through the filter 120 from right to left, so the upstream of the filter 120 is the right side, and the cleaning component 110 is movably disposed on the right side of the filter 120.

[0034] Specifically, by providing a filter 120 and a cleaning assembly 110 in the second inner cavity 140 of the disk carrier 100, when the air pump 200 is pumping air (adsorbing the wafer 170 onto the upper surface of the disk carrier 100), impurities on the adsorption tank 150 enter the first inner cavity 130 and the second cavity under the force of the gas until they adhere to the filter 120. The cleaning assembly 110 cleans the filter 120 under the push of the airflow to scrape off the impurities on the filter 120, and the scraped-off impurities are collected by the collection frame 143 below, thereby achieving the removal of impurities during the pumping process. When the wafer... After the repair work on wafer 170 is completed, the air pump 200 inflates the wafer (i.e., releases the adsorption state of wafer 170), making wafer 170 slightly suspended for easy removal. At this time, since the impurities on the filter 120 have been removed, the airflow will not carry impurities out of the adsorption tank 150, effectively avoiding damage to the bottom surface of wafer 170 by impurities, thus facilitating the repair work of wafer 170. Moreover, the cleaning component 110 of this application does not require additional driving energy, which can be achieved by the air extraction during the repair process of wafer 170 or the air inflation during the release of adsorption, which can both remove impurities and save energy.

[0035] In some preferred embodiments, the cleaning assembly 110 includes a rotating shaft 111, a cleaning brush 112, and a plurality of fan blades 113. The plurality of fan blades 113 are arranged at intervals along the circumference of the rotating shaft 111 (i.e., the plurality of fan blades 113 are arranged at intervals along the circumference of the rotating shaft 111, and the fan blades 113 are inclined; wherein, the inclined arrangement of the fan blades 113 means that there is an angle between the fan blades 113 and the axis of the rotating shaft 111). The rotating shaft 111 is disposed in the second inner cavity 140 and is rotatable. The cleaning brush 112 is fixed on the rotating shaft 111 by a fixing assembly. When the air pump 200 performs air extraction and inflation, the airflow in the second inner cavity 140 drives the fan blades 113 to drive the rotating shaft 111 to rotate, thereby causing the cleaning brush 112 to clean the filter 120.

[0036] Specifically, such as Figure 6 and Figure 7 As shown, by setting a rotating shaft 111 in the second inner cavity 140, the airflow passing through the second inner cavity 140 drives the fan blades 113 to rotate the rotating shaft 111, so that the cleaning brush 112 can clean the filter 120 without providing additional driving energy.

[0037] In some preferred embodiments, the fixing assembly includes two fixing rods 114 and two bushings 115. One end of each fixing rod 114 is fixedly connected to both ends of the cleaning brush 112, and the other ends of each fixing rod 114 are respectively disposed at both ends of the rotating shaft 111 through a bushing 115.

[0038] Specifically, such as Figure 7 As shown, the cleaning brush 112 is fixed to the rotating shaft 111 by two fixing rods 114. When the rotating shaft 111 rotates, it drives the cleaning brush 112 to rotate to scrape off the impurities on the filter screen 120.

[0039] In some preferred embodiments, the bottom of the second inner cavity 140 is provided with a first through hole 141 and a second through hole 142. The first through hole 141 is located on the side of the filter screen 120 close to the cleaning brush 112, and the second through hole 142 is located on the side of the filter screen 120 away from the cleaning brush 112. Both the first through hole 141 and the second through hole 142 are connected to the collection frame 143.

[0040] Specifically, during the vacuuming process, most of the airflow passes through the filter 120, and a small portion of the airflow enters the collection frame 143 through the first through hole 141 and then flows out through the second through hole 142, thereby creating a suction force at the first through hole 141, which draws the scraped-off impurities into the collection frame 143, ensuring that the impurities reliably fall into the collection frame 143.

[0041] In some preferred embodiments, a baffle 210 is provided at the bottom of the second inner cavity 140 between the first through hole 141 and the second through hole 142, and the baffle 210 extends downward into the collection frame 143.

[0042] Specifically, such as Figure 6 As shown, by setting up the baffle 210, the scraped impurities are prevented from directly entering the second through hole 142 from the first through hole 141. This ensures that the scraped impurities fall directly into the collection frame 143 from the first through hole 141 and are less likely to enter the second through hole 142, effectively reducing the probability of impurities being carried into the second through hole 142 by the airflow. Specifically, as the airflow flows from the first through hole 141 to the second through hole 142, it is redirected by bypassing the baffle 210. Impurities in the airflow will move downwards to the bottom of the collection frame 143 under centrifugal force and will not flow out of the second through hole 142 with the airflow.

[0043] In some preferred embodiments, the adsorption tank 150 is provided with a one-way air outlet 151 and multiple one-way air inlets 152. The one-way air outlet 151 and multiple one-way air inlets 152 are all connected to the first inner cavity 130. The one-way air inlets 152 are used to adsorb the wafer 170 when the air pump 200 is drawing air, and the one-way air outlet 151 is used to release the adsorption of the wafer 170 when the air pump is supplying air.

[0044] Specifically, when it is necessary to adsorb the wafer 170, it is necessary to tighten the wafer 170 by evacuating air. The air evacuation volume and speed requirements are large. Therefore, each adsorption tank 150 is provided with multiple one-way air inlets 152 to quickly meet the adsorption conditions. When it is necessary to contact the adsorption state, the air evacuation is stopped, and gas is only needed to be supplied to the adsorption tank 150 through a one-way air outlet 151 to release the wafer 170 from the tight state. There is no need to set multiple one-way air outlets 151.

[0045] Both the one-way air outlet 151 and the one-way air inlet 152 are equipped with one-way air valves, so that the one-way air outlet 151 can only discharge air in one direction and cannot discharge air, and the one-way air inlet 152 can only discharge air and cannot discharge air. The one-way air valve is existing technology and is not specifically limited here.

[0046] In some preferred embodiments, a conductive block 160 is provided inside the tray holder 100, and the conductive block 160 is grounded through a wire.

[0047] Specifically, since static electricity is easily generated during the adsorption of wafer 170, static electricity can attract suspended particles in the air, which can easily contaminate the surface of wafer 170 and thus affect the repair work of wafer 170. Therefore, a conductive block 160 is set inside the disk carrier 100 to conduct the static electricity of the disk carrier 100 to the ground, so as to eliminate the impact of static adsorption on wafer 170.

[0048] In some preferred embodiments, a waterproof and breathable layer is provided on the side of the one-way vent 151 near the first inner cavity 130.

[0049] Specifically, in order to prevent the polishing slurry during the polishing process from entering the bottom surface of the wafer 170 through the one-way vent 151 from the first inner cavity 130 and causing contamination, a waterproof and breathable layer is provided on the side of the one-way vent 151 near the first inner cavity 130. This prevents the polishing slurry from contaminating the bottom surface of the wafer 170 and helps improve the repair performance of the wafer 170 repair device. The waterproof and breathable layer is a waterproof and breathable film, which is existing technology. The specific model and specifications are set according to actual needs.

[0050] In some preferred embodiments, a one-way air outlet 151 is provided on the side wall of the adsorption tank 150, and a plurality of one-way air inlets 152 are provided at the bottom of the adsorption tank 150.

[0051] Specifically, by providing a one-way air outlet 151 on the side wall of the adsorption tank 150, the polishing slurry in the adsorption tank 150 can be prevented from directly contaminating the one-way air outlet 151, because when the air pump 200 is filling, the polishing slurry adhering to the one-way air outlet 151 will contaminate the bottom surface of the wafer 170. In order to better adsorb the wafer 170, multiple one-way air inlets 152 are spaced apart at the bottom of the adsorption tank 150.

[0052] In some preferred embodiments, the filter 120 is an arc-shaped structure coaxial with the rotating shaft 111.

[0053] Specifically, such as Figure 7 As shown, the filter screen 120 has an arc-shaped structure, and the cleaning brush 112 can effectively scrape off the impurities on the filter screen 120.

[0054] In some preferred embodiments, the main body of the repair device includes a base 181, two guide rails 182, a sliding assembly 184, and a polishing device 183. The disk holder 100 is disposed on the base 181. The two guide rails 182 are respectively disposed on both sides of the disk holder 100 and extend along the X-axis direction. The polishing device 183 is disposed on the guide rails 182 through the sliding assembly 184. The polishing device 183 can slide along the Y-axis direction on the sliding assembly 184. The polishing device 183 is used to repair the wafer 170 on the disk holder 100.

[0055] Specifically, such as Figure 1 As shown, by setting a polishing device 183 on the base 181, the polishing device 183 can slide in the X-axis and Y-axis directions, thereby being able to move precisely above the wafer 170 and perform repair work on the wafer 170.

[0056] In some preferred embodiments, the sliding assembly 184 includes a mounting plate 1841, a first motor 1842, two crossbars 1843, and a sliding seat 1844. The two crossbars 1843 are disposed on both sides of the output end of the first motor 1842 and fixed on the sliding seat 1844. The two crossbars 1843 extend along the Y-axis. The mounting plate 1841 is slidably disposed on the two crossbars 1843 via a sliding block 1846. The grinding device 183 is disposed on the mounting plate 1841 and on the side close to the wafer 170. The first motor 1842 is used to drive the mounting plate 1841 to move, thereby driving the grinding device 183 to move. The sliding seat 1844 is slidably disposed on two guide rails 182. Specifically, as shown... Figure 1 As shown, the second motor 1845 is mounted on the base 181 and is used to drive the sliding seat 1844 to move on the two guide rails 182.

[0057] The grinding device 183 is existing technology and is not specifically limited here.

[0058] In some preferred embodiments, a door panel 190 is provided on the side of the base 181, and the door panel 190 is hinged. By providing the door panel 190, it is easy to open the door panel 190 and remove the collection frame 143 from the tray holder 100 to clean the impurities in the collection frame 143, and the door panel 190 can prevent external impurities from entering the interior of the tray holder.

[0059] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0060] In this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, without necessarily requiring or implying any such actual relationship or order between these entities or operations.

[0061] The above descriptions are merely some embodiments of the present invention. Those skilled in the art can make various modifications and improvements without departing from the inventive concept of the present invention, and these all fall within the scope of protection of the present invention.

Claims

1. A Micro-LED wafer repair device, comprising a repair device body and a disk holder (100), wherein the disk holder (100) is disposed on the repair device body, characterized in that, The carrier plate (100) is provided with a cleaning component (110), a filter (120), a first inner cavity (130), a second inner cavity (140), and a plurality of adsorption tanks (150). The upper surface of the tray (100) is used to place the wafer (170). A plurality of adsorption grooves (150) are disposed on the upper surface of the tray (100). The plurality of adsorption grooves (150) are all connected to the first inner cavity (130). The first inner cavity (130) is connected to the air pump (200) through the second inner cavity (140). A filter screen (120) and a cleaning component (110) are disposed in the second inner cavity (140). The cleaning component (110) is movably disposed on the upstream side of the filter screen (120). When the air pump (200) pumps air and inflates air, the cleaning component (110) cleans the filter screen (120) under the airflow to scrape off the impurities on the filter screen (120). A collection frame (143) is disposed on the lower side of the filter screen (120). The collection frame (143) is used to collect the scraped-off impurities. The main body of the repair device includes a base, two guide rails, a sliding assembly, and a grinding device. The disk holder (100) is disposed on the base. The two guide rails are respectively disposed on both sides of the disk holder (100) and extend along the X-axis direction. The grinding device is disposed on the guide rails through the sliding assembly. The grinding device can slide along the Y-axis direction on the sliding assembly. The grinding device is used to repair the wafer (170) on the disk holder (100).

2. The Micro-LED wafer repair device according to claim 1, characterized in that, The cleaning assembly (110) includes a rotating shaft (111), a cleaning brush (112), and multiple fan blades (113). The multiple fan blades (113) are arranged at intervals along the circumference of the rotating shaft (111). The rotating shaft (111) is disposed in the second inner cavity (140) and is rotatable. The cleaning brush (112) is fixed on the rotating shaft (111) by a fixing assembly. When the air pump (200) is pumping and inflating, the airflow in the second inner cavity (140) drives the fan blades (113) to drive the rotating shaft (111) to rotate, thereby enabling the cleaning brush (112) to clean the filter (120).

3. The Micro-LED wafer repair device according to claim 2, characterized in that, The fixing assembly includes two fixing rods (114) and two bushings (115). One end of each of the two fixing rods (114) is fixedly connected to both ends of the cleaning brush (112), and the other ends of each of the two fixing rods (114) are respectively disposed at both ends of the rotating shaft (111) through one of the bushings (115).

4. The Micro-LED wafer repair device according to claim 2, characterized in that, The bottom of the second inner cavity (140) is provided with a first through hole (141) and a second through hole (142). The first through hole (141) is located on the side of the filter screen (120) close to the cleaning brush (112), and the second through hole (142) is located on the side of the filter screen (120) away from the cleaning brush (112). Both the first through hole (141) and the second through hole (142) are connected to the collection frame (143).

5. The Micro-LED wafer repair device according to claim 1, characterized in that, The adsorption tank (150) is provided with a one-way air outlet (151) and multiple one-way air inlets (152). The one-way air outlet (151) and multiple one-way air inlets (152) are all connected to the first inner cavity (130). The one-way air inlets (152) are used to adsorb the wafer (170) when the air pump (200) draws air, and the one-way air outlet (151) is used to de-adsorb the wafer (170) when the air pump (200) supplies air.

6. The Micro-LED wafer repair device according to claim 5, characterized in that, The carrier plate (100) is provided with a conductive block (160) inside, and the conductive block (160) is grounded through a wire.

7. The Micro-LED wafer repair device according to claim 5, characterized in that, A waterproof and breathable layer is provided on the side of the one-way air outlet (151) near the first inner cavity (130).

8. The Micro-LED wafer repair device according to claim 5, characterized in that, The one-way air outlet (151) is located on the side wall of the adsorption tank (150), and a plurality of the one-way air inlets (152) are located at the bottom of the adsorption tank (150).

9. The Micro-LED wafer repair device according to claim 2, characterized in that, The filter screen (120) is an arc-shaped structure coaxial with the rotating shaft (111).

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