Electronic devices and their heat dissipation components

Abstract

This invention discloses an electronic device, including a circuit board, a heat dissipation assembly, and a base. The circuit board includes a heat source. The heat dissipation assembly includes a housing, heat pipes, and a heat dissipation module. The housing includes an internal accommodating space, and the heat dissipation module is disposed in the internal accommodating space and contacts a heat-dissipating section. The heat dissipation module includes a first fin group and a second fin group stacked on top of each other. The first fin group includes a plurality of first heat dissipation fins. The first heat dissipation fins are spaced apart and arranged side by side in a first arrangement direction. The second fin group includes a plurality of second heat dissipation fins. The second heat dissipation fins are spaced apart and arranged side by side in a second arrangement direction. The first arrangement direction is different from the second arrangement direction. The base is connected to the heated section and the circuit board, so that the heated section contacts the heat source.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to an electronic device having a heat dissipation component. Background Technology

[0002] As the performance of electronic devices continues to improve, the processing speed of the chips within these devices also increases significantly. However, this increased processing speed comes with a substantial increase in power consumption and heat generation. Therefore, electronic devices require heat dissipation solutions for their chips to ensure they operate at suitable temperatures, thereby extending their lifespan and stability. To effectively dissipate heat from chips, air-cooled and liquid-cooled devices are available on the market. Air-cooled devices use air as the heat exchange medium, but this is not effective at reducing the temperature of high-performance chips. Liquid-cooled devices, on the other hand, use liquid as the heat exchange medium, offering better heat dissipation efficiency compared to air-cooled devices. Commercially available liquid-cooled devices use pipes to circulate coolant, which then contact the chip, allowing the coolant to absorb the heat generated by the chip. However, the coolant's transit time through the pipes is too short, resulting in the coolant only absorbing a portion of the chip's heat. Summary of the Invention

[0003] In view of this, an electronic device is provided, comprising a circuit board, a heat dissipation assembly, and a base. The circuit board includes a heat source. The heat dissipation assembly includes a housing, a heat pipe, and a heat dissipation module. The housing includes an inlet, an outlet, and an internal accommodating space, the inlet and outlet being respectively connected to the internal accommodating space. The heat pipe includes a heated section and a dissipated section, the dissipated section being located in the internal accommodating space, and the heated section being connected to the dissipated section and located outside the housing. The heat dissipation module is disposed in the internal accommodating space and contacts the dissipated section. The heat dissipation module includes a first fin group and a second fin group stacked on top of each other. The first fin group includes a plurality of first heat dissipation fins, each first heat dissipation fin being spaced apart from each other in a first arrangement direction. The second fin group includes a plurality of second heat dissipation fins, each second heat dissipation fin being spaced apart from each other in a second arrangement direction, wherein the first arrangement direction is different from the second arrangement direction. The base is connected to the heated section and the circuit board, such that the heated section contacts the heat source.

[0004] In some embodiments, a heat dissipation assembly is provided, including a housing, a heat pipe, and a heat dissipation module. The housing includes an inlet, an outlet, and an internal accommodating space, with the inlet and outlet respectively connected to the internal accommodating space. The heat pipe includes a heated section and a dissipated section, the dissipated section being located within the internal accommodating space, and the heated section being connected to the dissipated section and located outside the housing. The heat dissipation module is disposed within the internal accommodating space and contacts the dissipated section. The heat dissipation module includes a first fin group and a second fin group stacked on top of each other. The first fin group includes a plurality of first heat dissipation fins arranged side-by-side with spacing between them in a first arrangement direction. The second fin group includes a plurality of second heat dissipation fins arranged side-by-side with spacing between them in a second arrangement direction, wherein the first arrangement direction is different from the second arrangement direction.

[0005] In summary, through the heat dissipation assembly provided in some embodiments of the present invention, when the coolant is introduced into the heat dissipation assembly through the injection port, the coolant first contacts the first fin group and passes through each of the first heat dissipation fins of the first fin group. The coolant has good fluidity on the first heat dissipation fins, which makes the coolant have better heat dissipation efficiency on the first heat dissipation fins. When the coolant accumulates at the bottom of the heat dissipation assembly, the second fin group is immersed in the coolant, which allows the coolant to fully absorb the heat energy of the second heat dissipation fins. When the coolant reaches the drain port, the coolant can be discharged from the drain port. After completing heat exchange outside the heat dissipation assembly, the cooled coolant is introduced back into the heat dissipation assembly, so that the heat source can be maintained at an appropriate operating temperature.

[0006] Various embodiments are described in detail below; however, these embodiments are merely illustrative and do not limit the scope of protection intended for this invention. Furthermore, some elements are omitted in the drawings of the embodiments to clearly illustrate the technical features of the invention. The same reference numerals will be used to denote the same or similar elements in all drawings. Attached Figure Description

[0007] Figure 1 A side view of an electronic device according to some embodiments of the present invention.

[0008] Figure 2 This is a perspective view of a heat dissipation assembly according to some embodiments of the present invention.

[0009] Figure 3 This is an exploded view of a heat dissipation assembly according to some embodiments of the present invention.

[0010] Figure 4 for Figure 2 A cross-sectional view of the heat dissipation device at position AA.

[0011] Figure 5 for Figure 4 A schematic diagram of the circulation path of the coolant in the heat dissipation component.

[0012] Figure 6 This is a schematic diagram showing the drain outlet at the bottom in some embodiments of the present invention.

[0013] Figure 7 A side view (ii) of an electronic device according to some embodiments of the present invention.

[0014] Figure 8 for Figure 7 A cross-sectional view of the heat dissipation component along the Z-axis.

[0015] In the attached figures, the following labels are used:

[0016] 1: Electronic devices

[0017] 11: Circuit Board

[0018] 111: Heat source

[0019] 12: Heat dissipation components

[0020] 121: Shell

[0021] 1211: Liquid injection port

[0022] 1212: Drain port

[0023] 1213: Internal storage space

[0024] 1214: Top

[0025] 1215: Bottom

[0026] 1216: Non-immersion area

[0027] 1217: Soaking Area

[0028] 122: Heat pipe

[0029] 1221: Heated Section

[0030] 1222: Heat release section

[0031] 123: Heat dissipation module

[0032] 124: First fin group

[0033] 1241: First heat dissipation fin

[0034] 125: Second fin group

[0035] 1251: Second heat dissipation fin

[0036] 126: Thermal conductive sleeve

[0037] 13: Base

[0038] 14: Heat exchange module

[0039] 141: First catheter

[0040] 142: Second catheter

[0041] 143: Sub-takeover

[0042] 144, 144': Flow regulating valve

[0043] C: Coolant

[0044] D1: First Altitude

[0045] D2: Second Altitude

[0046] H: Thermal energy

[0047] S: Spacing Detailed Implementation

[0048] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0049] Please see Figure 1 The figure shows a side view of an electronic device according to some embodiments of the present invention. Figure 1 The electronic device 1 shown includes a circuit board 11, a heat sink 12, and a base 13. The circuit board 11 includes a heat source 111. The heat source 111 of the circuit board 11 can be an electronic component that generates heat during operation, such as a central processing unit (CPU), a solid-state drive, or memory. The heat sink 12 is normally disposed on the circuit board 11 and in contact with the heat source 111, so that the heat sink 12 can absorb the heat generated by the heat source 111 during operation and then dissipate the absorbed heat to reduce or maintain the heat source 111 at an appropriate temperature.

[0050] Please refer to both together. Figure 1 , Figure 2 and Figure 3 . Figure 2 This is a perspective view of a heat dissipation assembly according to some embodiments of the present invention. Figure 3 This is an exploded view of a heat dissipation assembly according to some embodiments of the present invention. The heat dissipation assembly 12 includes a housing 121, a heat pipe 122, and a heat dissipation module 123. The housing 121 includes an inlet 1211, an outlet 1212, and an internal accommodating space 1213. The inlet 1211 and the outlet 1212 are respectively connected to the internal accommodating space 1213. In the use state, a coolant (such as...) is supplied with the coolant. Figure 5The coolant C shown can be introduced into the internal accommodating space 1213 through the injection port 1211 and then discharged through the drain port 1212. After the heat dissipation component 12 absorbs heat energy from the heat source 111, the coolant can absorb heat energy from the heat dissipation component 12 during its flow within the internal accommodating space 1213. After completing heat exchange outside the heat dissipation component 12, the coolant is reintroduced into the heat dissipation component 12 at a relatively low temperature so that it can absorb heat from the heat dissipation component 12 again (details to follow). The injection port 1211 and the drain port 1212 can be connected by multiple pipelines to form a closed circulation path within the internal accommodating space 1213, ensuring that the coolant can always flow and be stored within the internal accommodating space 1213 and preventing coolant leakage onto the circuit board 11. In some embodiments, the coolant can be a non-conductive liquid (e.g., fluorinated liquid, mineral oil, or silicone oil) or an aqueous solution; any liquid capable of absorbing heat energy can be used, and this is not a limitation.

[0051] The heat pipe 122 includes a heated section 1221 and a heat dissipating section 1222. The heat dissipating section 1222 is located in the internal accommodating space 1213. The heated section 1221 is connected to the heat dissipating section 1222 and is located outside the shell 121. The heat pipe 122 can be made of a material with good thermal conductivity (e.g., copper pipe). The heated section 1221 and the heat dissipating section 1222 can be integrally formed or connected to each other. The heated section 1221 can directly or indirectly contact the heat source 111, so that the heated section 1221 can absorb the heat energy of the heat source 111 and conduct the heat energy to the heat dissipating section 1222.

[0052] Please refer to both together. Figures 1 to 4 , Figure 4 for Figure 2 A cross-sectional view of the heat dissipation device at position AA. The heat dissipation module 123 is disposed within the internal accommodating space 1213 and contacts the heat dissipation section 1222. The heat dissipation module 123 includes a first fin group 124 and a second fin group 125 stacked on top of each other. The first fin group 124 includes a plurality of first heat dissipation fins 1241, each first heat dissipation fin 1241 arranged in a first orientation (e.g., ...). Figure 4 The second fin group 125 includes a plurality of second heat dissipation fins 1251, which are spaced apart and arranged side by side in a second arrangement direction (e.g., along the X-axis). Figure 4The components (along the Y-axis) are spaced apart and arranged side-by-side. In some embodiments, the first arrangement direction is different from the second arrangement direction. The base 13 is connected to the heated section 1221 and the circuit board 11, so that the heated section 1221 contacts the heat source 111. In some embodiments, the base 13 can be locked to the circuit board 11 or the heat source 111, so that the heat dissipation assembly 12 (including the housing 121, heat pipe 122, and heat dissipation module 123) can be fixed to the circuit board 11 or the heat source 111. The heat dissipation assembly 12 after assembly is as follows: Figure 2 As shown. The aforementioned "spaced apart and side by side" can refer to each of the first heat dissipation fins 1241 (or the second heat dissipation fins 1251) having a separation distance S between each other. When each of the first heat dissipation fins 1241 is separated from each other by the separation distance S, the coolant can pass between two adjacent first heat dissipation fins 1241. Therefore, compared with the second fin group 125, the coolant has a greater fluidity in the first fin group 124 than in the second fin group 125. When each of the second heat dissipation fins 1251 is separated from each other by the separation distance S, when the second heat dissipation fins 1251 are immersed in the coolant, each of the second heat dissipation fins 1251 can contact the coolant, so that the coolant can fully absorb the heat energy of the second heat dissipation fins 1251. In some embodiments, the heat dissipation module 123 includes a thermally conductive sleeve 126, which is sleeved on the outside of the heat dissipation section 1222. Each first heat dissipation fin 1241 and each second heat dissipation fin 1251 extends from the outer periphery of the thermally conductive sleeve 126. The thermally conductive sleeve 126 may be made of a material with good thermal conductivity, and it may be in direct contact with the outside of the heat dissipation section 1222, allowing it to conduct heat energy from the heat dissipation section 1222 to each first heat dissipation fin 1241 and each second heat dissipation fin 1251.

[0053] In some embodiments, such as Figure 4 As shown, the housing 121 includes a top 1214 and a bottom 1215. An injection port 1211 is located at the top 1214, and a drain port 1212 is adjacent to the bottom 1215 relative to the injection port 1211. The aforementioned "first arrangement direction is different from the second arrangement direction" can mean that the first arrangement direction and the second arrangement direction are perpendicular to each other. Specifically, the injection port 1211 has an opening direction that extends along a central axis of the injection port 1211 (i.e., as shown in the diagram). Figure 4 In the Y-axis direction, the first fin group 124 is adjacent to the injection port 1211 relative to the second fin group 125, and the first arrangement direction of the first fin group 124 is perpendicular to the opening direction, while the second arrangement direction of the second fin group 125 is parallel to the opening direction. For example... Figure 4As shown, the internal accommodating space 1213 includes a non-immersion area 1216 and an immersion area 1217. The non-immersion area 1216 is adjacent to the top 1214 relative to the immersion area 1217, such that the first fin assembly 124 is located in the non-immersion area 1216 and the second fin assembly 125 is located in the immersion area 1217. In some embodiments, the injection port 1211 is connected to the non-immersion area 1216, and the drainage port 1212 is located between the non-immersion area 1216 and the immersion area 1217.

[0054] Please refer to the following: Figures 1 to 4 The electronic device 1 further includes a heat exchange module 14, which is connected to the heat dissipation assembly 12 via at least one first conduit 141 and at least one second conduit 142 to form a cooling circuit. The first conduit 141 may be connected to an inlet 1211, and the second conduit 142 may be connected to an outlet 1212. The heat exchange module 14 may be a water-cooled radiator. After the coolant circulates in the heat dissipation assembly 12 to absorb heat, the coolant is output to the outside of the heat exchange module 14 via the second conduit 142. When the coolant is delivered to the heat exchange module 14, the heat exchange module 14 can perform heat exchange on the coolant at its current higher temperature to lower the coolant temperature, allowing the coolant at a lower temperature to be input into the heat dissipation assembly 12 via the first conduit 141. In some embodiments, such as... Figure 4 As shown, the first fin group 124 has a first height D1, and the second fin group 125 has a second height D2. The first height D1 is different from the second height D2. Specifically, when the first height D1 is greater than the second height D2, that is, the non-immersion area 1216 is greater than the immersion area 1217, the heat dissipation assembly 12 can improve the flow of the coolant. Conversely, when the second height D2 is greater than the first height D1, that is, the immersion area 1217 is greater than the non-immersion area 1216, the heat dissipation assembly 12 can improve the heat dissipation effect of the coolant.

[0055] Please refer to both together. Figures 1 to 5 , Figure 5 for Figure 4 A schematic diagram of the coolant circulation path in the heat dissipation components. (See diagram below.) Figure 5As shown, when the electronic device 1 is in operation, the heat energy H generated by the heat source 111 can be absorbed by the heated section 1221 that is in contact with the heat source 111, and the heat energy H can be conducted to the heat release section 1222. The first fin group 124 and the second fin group 125 can absorb heat energy from the heat release section 1222. When coolant C is introduced into the internal accommodating space 1213 through the first conduit 141 from the injection port 1211, coolant C will flow from the non-immersion zone 1216 to the immersion zone 1217. In the non-immersion zone 1216, since the first arrangement direction is perpendicular to the opening direction, coolant C can first flow to the first fin group 124 and flow between each first heat dissipation fin 1241. During the flow, coolant C will absorb the heat energy H of each first heat dissipation fin 1241 and flow to the immersion zone 1217. Coolant C has high fluidity when passing between each first heat dissipation fin 1241, so coolant C has better heat absorption efficiency in the first fin group 124. As the coolant C continuously flows into the immersion zone 1217, it accumulates there, immersing the second heat dissipation fin 1251 in the coolant C. Since the second arrangement direction is parallel to the opening direction, the second heat dissipation fin 1251 has a large contact area with the coolant C, allowing the coolant C to fully absorb the heat energy H from the second heat dissipation fin 1251. It should be noted that when the coolant C flows and accumulates in the immersion zone 1217, it can absorb the heat energy H from both the first heat dissipation fin 1241 and the second heat dissipation fin 1251. Therefore, the temperature of the coolant C in the immersion zone 1217 is greater than the temperature of the coolant C in the non-immersion zone 1216. When the coolant C accumulates to the drain port 1212, the coolant C, having absorbed heat energy H, will be output to the outside of the heat dissipation component 12 through the drain port 1212 and transported to the heat exchange module 14 through the second conduit 142, so that the heat exchange module 14 can perform heat exchange on the coolant C. After heat exchange, the coolant C, which is at a relatively low temperature, will be transported back to the injection port 1211 through the first conduit 141, so that the coolant C continuously circulates between the heat dissipation component 12 and the heat exchange module 14, so that the heat source 111 can be maintained at an appropriate operating temperature. It should be noted that when the coolant C is in the immersion zone 1217, due to the temperature difference between the coolant C in the immersion zone 1217 and the coolant C in the non-immersion zone 1216, the coolant C with the lower temperature will form thermal convection with the coolant C with the higher temperature. That is, the coolant C with the lower temperature will flow towards the bottom 1215, while the coolant C with the higher temperature will flow towards the top 1214, so as to ensure that the coolant C with the higher temperature can be discharged from the drain port 1212, while the coolant C with the lower temperature can continuously absorb the heat energy H of the second heat dissipation fin 1251 in the immersion zone 1217.In some embodiments, the electronic device 1 further includes a branch pipe 143, which connects to the first conduit 141 or the second conduit 142. When there are multiple injection ports 1211 or drainage ports 1212, the heat exchange module 14 can connect the branch pipe 143 to each injection port 1211 or each drainage port 1212 to input or output coolant C to the heat dissipation assembly 12. In some embodiments, the electronic device 1 further includes a flow regulating valve 144, which is connected to the first conduit 141 or the second conduit 142. The flow regulating valve 144 is used to regulate the flow rate of coolant C in the heat dissipation assembly 12 to ensure that the coolant C has sufficient time to absorb heat energy H.

[0056] Please refer to both together. Figures 1 to 6 . Figure 6 This is a schematic diagram showing the drain outlet at the bottom in some embodiments of the present invention. Figure 6 As shown, in this embodiment, the injection port 1211 is located at the top 1214, and the drain port 1212 is located at the bottom 1215. After the coolant C is injected into the heat dissipation assembly 12 through the injection port 1211, the coolant C can pass through the first fin group 124 and the second fin group 125, and then be output from the drain port 1212. In this embodiment, two flow regulating valves (144, 144') are respectively connected to the first conduit 141 and the second conduit 142. By adjusting the output flow of the two flow regulating valves (144, 144'), for example, adjusting the output flow of flow regulating valve 144' to be less than the output flow of flow regulating valve 144, even though the drain port 1212 is located at the bottom 1215, the coolant C can still accumulate in the immersion area 1217, so that the coolant C can fully absorb the heat energy H of the second heat dissipation fin 1251, and then be output from the drain port 1212.

[0057] Please refer to both together. Figure 7 and Figure 8 , Figure 7 A side view (ii) of an electronic device according to some embodiments of the present invention. Figure 8 for Figure 7A cross-sectional view of the heat dissipation assembly in the Z-axis direction. In some embodiments, the inlet 1211 of the heat dissipation assembly 12 is adjacent to the bottom 1215, for example, the inlet 1211 may be located at the bottom 1215 or between the bottom 1215 and the immersion area 1217, while the outlet 1212 is adjacent to the top 1214. Accordingly, when the heat exchange module 14 inputs a coolant C at a lower temperature into the inlet 1211 through the first conduit 141, the coolant C flows from the bottom 1215 to the top 1214. When the coolant C reaches the outlet 1212, the coolant C can be discharged from the outlet 1212 and transported to the heat exchange module 14 via the second conduit 142 to form another type of cooling circuit. When the coolant C continuously accumulates between the bottom 1215 and the top 1214, since the first heat dissipation fin 1241 and the second heat dissipation fin 1251 are completely immersed in the coolant C, the coolant C can contact the entire area of ​​the first heat dissipation fin 1241 and the second heat dissipation fin 1251, thereby improving the heat dissipation efficiency of the heat dissipation component 12 on the heat source 111.

[0058] In summary, through the heat dissipation assembly provided in some embodiments of the present invention, when the coolant is introduced into the heat dissipation assembly through the injection port, the coolant first contacts the first fin group and passes through each of the first heat dissipation fins of the first fin group. The coolant has good fluidity on the first heat dissipation fins, which makes the coolant have better heat dissipation efficiency on the first heat dissipation fins. When the coolant accumulates at the bottom of the heat dissipation assembly, the second fin group is immersed in the coolant, which allows the coolant to fully absorb the heat energy of the second heat dissipation fins. When the coolant reaches the drain port, the coolant can be discharged from the drain port. After completing heat exchange outside the heat dissipation assembly, the cooled coolant is introduced back into the heat dissipation assembly, so that the heat source can be maintained at an appropriate operating temperature.

[0059] Although the technical content of the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any modifications and refinements made by those skilled in the art without departing from the spirit of the present invention should be included within the scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. An electronic device, characterized by comprising: include: A circuit board, including a heat source; A heat dissipation component, including: A housing includes an injection port, a drain port, and an internal accommodating space, wherein the injection port and the drain port are respectively connected to the internal accommodating space; A heat pipe includes a heated section and a dissipated section, the dissipated section being located within the internal accommodating space, and the heated section being connected to the dissipated section and located outside the housing; and A heat dissipation module is disposed within the internal accommodating space and in contact with the heat dissipation section. The heat dissipation module includes a first fin group and a second fin group stacked on top of each other. The first fin group includes a plurality of first heat dissipation fins arranged side-by-side with spacing between them in a first arrangement direction. The second fin group includes a plurality of second heat dissipation fins arranged side-by-side with spacing between them in a second arrangement direction, wherein the first arrangement direction is different from the second arrangement direction. A base is connected to the heated section and the circuit board, so that the heated section is in contact with the heat source; The housing includes a top and a bottom. The injection port is located at the top, and the drain port is adjacent to the bottom relative to the injection port. The injection port has an opening direction. The first fin group is adjacent to the injection port relative to the second fin group. The first arrangement direction is perpendicular to the opening direction, and the second arrangement direction is parallel to the opening direction. 2.The electronic device of claim 1, wherein, It also includes a heat exchange module, which is connected to the heat dissipation assembly by at least one first conduit and at least one second conduit to form a cooling loop. 3.The electronic device of claim 1, wherein, The first arrangement direction is perpendicular to the second arrangement direction. 4.The electronic device of claim 1, wherein, The internal accommodating space includes a non-immersion area and an immersion area. The non-immersion area is adjacent to the top relative to the immersion area. The first fin group is located in the non-immersion area, and the second fin group is located in the immersion area. 5.The electronic device of claim 4, wherein, The injection port is connected to the non-immersion area, and the drainage port is located between the non-immersion area and the immersion area. 6.The electronic device of claim 1, wherein, The heat dissipation module includes a heat-conducting sleeve that is fitted over the outside of the heat dissipation section, and the first heat dissipation fins and the second heat dissipation fins extend from the outer periphery of the heat-conducting sleeve.

7. A heat dissipating assembly, characterized by, include: A housing includes an injection port, a drain port, and an internal accommodating space, wherein the injection port and the drain port are respectively connected to the internal accommodating space; A heat pipe includes a heated section and a dissipated section, the dissipated section being located within the internal accommodating space, and the heated section being connected to the dissipated section and located outside the housing; and A heat dissipation module is disposed in the internal accommodating space and in contact with the heat dissipation section. The heat dissipation module includes a first fin group and a second fin group stacked on top of each other. The first fin group includes a plurality of first heat dissipation fins, which are spaced apart from each other and arranged side by side in a first arrangement direction. The second fin group includes a plurality of second heat dissipation fins, which are spaced apart from each other and arranged side by side in a second arrangement direction. The first arrangement direction is different from the second arrangement direction. The housing includes a top and a bottom. The injection port is located at the top, and the drain port is adjacent to the bottom relative to the injection port. The injection port has an opening direction. The first fin group is adjacent to the injection port relative to the second fin group. The first arrangement direction is perpendicular to the opening direction, and the second arrangement direction is parallel to the opening direction.

8. The heat dissipating assembly of claim 7, wherein, The first arrangement direction is perpendicular to the second arrangement direction.

9. The heat dissipating assembly of claim 7, wherein, The internal accommodating space includes a non-immersion area and an immersion area. The non-immersion area is adjacent to the top relative to the immersion area. The first fin group is located in the non-immersion area, and the second fin group is located in the immersion area.

10. The heat dissipating assembly of claim 9, wherein, The injection port is connected to the non-immersion area, and the drainage port is located between the non-immersion area and the immersion area.

11. The heat dissipating assembly of claim 7, wherein, The heat dissipation module includes a heat-conducting sleeve that is fitted over the outside of the heat dissipation section, and the first heat dissipation fins and the second heat dissipation fins extend from the outer periphery of the heat-conducting sleeve.

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