Display panel, preparation method thereof and display device

Abstract

The embodiment of the present application discloses a display panel, a preparation method thereof and a display device. The display panel provided by the embodiment of the present application comprises a display substrate, the display substrate comprises a driving array layer and a plurality of micro light emitting devices, the plurality of micro light emitting devices contact and are electrically connected with the driving array layer; a capacitive touch sensing structure is located on a side of the driving array layer adjacent to the plurality of micro light emitting devices and is arranged in a spaced manner with the plurality of micro light emitting devices, and the capacitive touch sensing structure is electrically connected with the driving array layer. The embodiment of the present application has the characteristics of simple structure, low cost and accurate sensing.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel, a method for manufacturing a display panel, and a display device. Background Technology

[0002] Micro LED (Micro Light Emitting Diode) display technology is currently widely used in various display devices. These devices typically require touchscreen functionality. Existing touchscreen manufacturing processes are mainly divided into two types: in-cell touch and on-cell touch. In-cell touch is commonly used in LCD (Liquid Crystal Display) or OLED (Organic Light-Emitting Diode) displays. However, when applied to Micro LED displays, the parasitic capacitance of the MicroLED itself can easily cause inaccurate judgment of the touch object's position. On the other hand, on-cell touch requires fabricating the sensing circuitry or electrodes on an external glass substrate, which presents problems such as high manufacturing costs and high process difficulty. Therefore, existing Micro LED touch display panels suffer from the incompatibility between high precision and low complexity.

[0003] Therefore, there is an urgent need to provide a new solution to address at least some of the problems associated with Micro LED touch panels. Summary of the Invention

[0004] Therefore, in order to overcome at least some of the defects in the prior art, the present invention provides a display panel, a method for manufacturing a display panel, and a display device, which have the characteristics of low cost and accurate sensing.

[0005] On one hand, one embodiment of the present invention provides a display panel, comprising: a display substrate, the display substrate including a driving array layer and a plurality of micro light-emitting devices, the plurality of micro light-emitting devices contacting and electrically connected to the driving array layer; and a capacitive touch sensing structure located on the side of the driving array layer adjacent to the plurality of micro light-emitting devices and spaced apart from the plurality of micro light-emitting devices, the capacitive touch sensing structure being electrically connected to the driving array layer.

[0006] In one embodiment, the display panel further includes a light-shielding layer disposed between the plurality of micro-light-emitting devices, exposing the side of the plurality of micro-light-emitting devices away from the driving array layer.

[0007] In one embodiment, the display panel further includes a planarization layer covering the light-shielding layer and the side of the plurality of microdevices away from the driving array layer; and a conductive via penetrating the planarization layer and the light-shielding layer and extending to the driving array layer; the capacitive touch sensing structure includes a transparent sensing circuit layer covering the side of the planarization layer away from the light-shielding layer and electrically connected to the driving array layer through the conductive via.

[0008] In one embodiment, the capacitive touch sensing structure is disposed within the light-shielding layer and located between the plurality of micro-light-emitting devices; or the capacitive touch sensing structure is disposed on the side of the light-shielding layer away from the driving array layer and located between the plurality of micro-light-emitting devices.

[0009] In one embodiment, the light-shielding layer includes a plurality of isolation pillars protruding from the driving array layer in a direction close to the side of the plurality of micro light-emitting devices, with one isolation pillar corresponding to any two adjacent micro light-emitting devices, and the height of each isolation pillar protruding from the driving array layer is not less than the height of the plurality of micro light-emitting devices protruding from the driving array layer.

[0010] In one embodiment, the capacitive touch sensing structure corresponds to the side of the target isolation pillar located away from the driving array layer among the plurality of isolation pillars.

[0011] In one embodiment, the plurality of isolation pillars are made of a light-reflective material.

[0012] Another embodiment of the present invention provides a method for manufacturing a display panel, comprising: providing a display substrate, the display substrate including a driving array layer and a plurality of micro light-emitting devices, the plurality of micro light-emitting devices contacting and electrically connected to the driving array layer; forming a capacitive touch sensing structure on the side of the display substrate adjacent to the plurality of micro light-emitting devices, such that the capacitive touch sensing structure is spaced apart from the plurality of micro light-emitting devices and electrically connected to the driving array layer.

[0013] In one embodiment, the display panel fabrication method further includes: fabricating a light-shielding layer between the plurality of micro-light-emitting devices, and exposing the side of the micro-light-emitting devices away from the driving array layer.

[0014] In one embodiment, the step of forming a light-shielding layer between the plurality of micro-light-emitting devices and exposing the side of the micro-light-emitting devices away from the driving array layer includes: covering the side of the plurality of micro-light-emitting devices away from the driving array layer with a light-shielding film and exposing the side of the micro-light-emitting devices away from the driving array layer to form the light-shielding layer; or filling a light-shielding material liquid between the plurality of micro-light-emitting devices, exposing the side of the micro-light-emitting devices away from the driving array layer, and curing the light-shielding material liquid to form the light-shielding layer.

[0015] In one embodiment, the display panel fabrication method further includes: fabricating a planarization layer on the side of the light-shielding layer away from the driving array layer; forming a capacitive touch sensing structure on the side of the display substrate adjacent to the plurality of micro light-emitting devices, such that the capacitive touch sensing structure is spaced apart from the plurality of micro light-emitting devices and electrically connected to the driving array layer, including: forming a conductive via penetrating the planarization layer and the light-shielding layer; covering a transparent sensing circuit layer on the side of the planarization layer away from the light-shielding layer, such that the transparent sensing circuit layer is electrically connected to the driving array layer through the conductive via, and the transparent sensing circuit layer forms the capacitive touch sensing structure.

[0016] In one embodiment, forming a capacitive touch sensing structure on the side of the display substrate adjacent to the plurality of micro light-emitting devices, such that the capacitive touch sensing structure is spaced apart from and electrically connected to the driving array layer, includes forming a capacitive touch sensing structure between two adjacent target micro light-emitting devices among the plurality of micro light-emitting devices.

[0017] In one embodiment, the display panel fabrication method further includes: forming a plurality of isolation pillars in the light-shielding layer, such that an isolation pillar is formed between any two adjacent micro light-emitting devices, and the height of each isolation pillar protruding from the driving array layer is not less than the height of the plurality of micro light-emitting devices protruding from the driving array layer.

[0018] In one embodiment, forming a capacitive touch sensing structure between two adjacent micro-light-emitting devices among the plurality of micro-light-emitting devices includes: forming a capacitive touch sensing structure on the side of a target isolation pillar away from the driving array layer among the plurality of isolation pillars.

[0019] Another embodiment of the present invention provides a display device, including a display panel as described in any of the foregoing embodiments, or a display panel made by a display panel manufacturing method as described in any of the foregoing embodiments.

[0020] The above embodiments of the present invention have at least one or more of the following beneficial effects: the capacitive touch sensing structure and multiple micro light-emitting devices are disposed on the same side of the driving array layer. By placing the capacitive touch sensing structure on the top surface of the micro light-emitting devices away from the driving array layer or placing it among multiple micro light-emitting devices and surrounding them, the capacitive touch sensing structure will not be affected by the parasitic capacitance of the micro light-emitting devices themselves, thus avoiding the problem of inaccurate judgment. Compared with the external touch technology, it is less difficult and less expensive.

[0021] Other aspects and features of the invention will become apparent from the following detailed description with reference to the accompanying drawings. However, it should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of the invention. It should also be understood that, unless otherwise indicated, the drawings are not necessarily drawn to scale; they are merely intended to conceptually illustrate the structures and processes described herein. Attached Figure Description

[0022] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0023] Figure 1 A schematic diagram of the structure of the display panel provided in the first embodiment of the present invention.

[0024] Figure 2 This is a schematic diagram of the structure of a display panel provided in the second embodiment of the present invention.

[0025] Figure 3 This is a schematic diagram of another display panel provided in the second embodiment of the present invention.

[0026] Figure 4 This is a schematic diagram of another display panel provided in the second embodiment of the present invention.

[0027] Figure 5 for Figure 2 The diagram shows a structural schematic of a specific embodiment of the display panel.

[0028] Figure 6 for Figure 4 The diagram shows a structural schematic of a specific embodiment of the display panel.

[0029] Figure 7 for Figure 6 The diagram shows a structural schematic of a specific embodiment of the display panel.

[0030] Figure 8 This is a top view of the display panel structure in one embodiment of the present invention.

[0031] Figure 9 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention.

[0032] Figure 10 This is a schematic flowchart of a display panel fabrication method according to an embodiment of the present invention.

[0033] Figure 11 This is a schematic flowchart of a display panel fabrication method provided in another embodiment of the present invention.

[0034] Figure 12 This is a schematic diagram of the structure of a display device provided in one embodiment of the present invention.

[0035] [Explanation of Labels in the Attached Image]

[0036] 100: Display device; 10: Display panel; 11: Display substrate; 111: Driving array layer; 112: Multiple micro light-emitting devices; 12: Capacitive touch sensing structure; 121: Transparent sensing circuit layer; 13: Light-shielding layer; 131: Isolation pillar; 14: Planarization layer; 15: Conductive via. Detailed Implementation

[0037] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0038] To enable those skilled in the art to better understand the technical solutions of the present invention, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0039] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0040] It should also be noted that the division of multiple embodiments in this invention is only for the convenience of description and should not constitute a special limitation. Features in various embodiments can be combined and referenced in each other without contradiction.

[0041] [First Embodiment]

[0042] like Figure 1 As shown, a first embodiment of the present invention provides a display panel 10, which includes, for example, a display substrate 11, a capacitive touch sensing structure 12, a light-shielding layer 13, and a planarization layer 14. The display substrate 11 includes a driving array layer 111 and a plurality of micro-light-emitting devices 112, the plurality of micro-light-emitting devices 112 contacting and electrically connected to the driving array layer 111. The light-shielding layer 13 is disposed between the plurality of micro-light-emitting devices 112 and exposes the side of the plurality of micro-light-emitting devices 112 away from the driving array layer 111. The planarization layer 14 covers the light-shielding layer 13 and the side of the plurality of micro-light-emitting devices 112 away from the driving array layer 111. Conductive vias 15 are also formed on the display substrate 10, penetrating the planarization layer 14 and the light-shielding layer 13 and extending to the driving array layer 111. The capacitive touch sensing structure 12 is located on the side of the driving array layer 111 adjacent to the plurality of micro-light-emitting devices 112 and spaced apart from the plurality of micro-light-emitting devices 112, and is electrically connected to the driving array layer 111. Specifically, in this embodiment, the capacitive touch sensing structure 12 includes a transparent sensing circuit layer 121. The transparent sensing circuit layer 121 covers the side of the planarization layer 14 away from the light-shielding layer 13 and is electrically connected to the driving array layer 111 through a conductive via 15. The planarization layer 14 isolates the transparent sensing circuit layer 121 from the micro-light-emitting devices 112, that is, the capacitive touch sensing structure 12 is spaced apart from the multiple micro-light-emitting devices 112 through the planarization layer 14.

[0043] The micro-light-emitting device 112 is, for example, a micro-light-emitting diode device, i.e., a Micro LED. The driving array layer 111 includes a TFT driving array for driving the micro-light-emitting device 112 to emit light, specifically including, for example, a substrate glass and, on the surface of the substrate glass, a buffer layer, an active layer, a gate insulation layer (GI layer), a first metal layer, a first passivation layer, a second metal layer, a second passivation layer, etc., and a third metal layer, etc., stacked sequentially. Figure 1(Not shown in the image), the active layer, the first metal layer, and the second metal layer are used to form the TFT (Thin Film Transistor) device structure. The gate insulating layer, the first passivation layer, and the second passivation layer are mainly used for insulation and isolation between the active layer, the first metal layer, and the second metal layer. The third metal layer can be used for electrical connection with devices other than the driving array layer 111. Specifically, the driving array layer 111 is a TFT driving board used to drive the micro-light-emitting devices 112 to emit light; that is, the display substrate 11 refers to the TFT driving array board on which multiple micro-light-emitting devices 112 have been soldered. Specifically, the micro-light-emitting devices 112 are, for example, soldered onto the third metal layer of the driving array layer 111 to electrically connect to the driving array layer 111. (See reference...) Figure 1The light-shielding layer 13 is, for example, a full-layer BM (Black Matrix) film, i.e., a black film, or other BM materials. The light-shielding layer 13 is disposed between multiple micro-light-emitting devices 112. Specifically, the light-shielding layer 13 exposes the side of the micro-light-emitting device 112 away from the driving array layer 111. For example, when the light-shielding layer 13 is a full-layer BM film, its upper surface is flush with the upper surface of the micro-light-emitting device 112, exposing the upper surface of the micro-light-emitting device 112 to block light crosstalk between adjacent micro-light-emitting devices 112, allowing multiple micro-light-emitting devices 112 to emit light upwards. Alternatively, in some embodiments, when the height of the light-shielding layer 13 is greater than the height of the micro-light-emitting device 112, it is necessary to cut out the corresponding upper surface of the micro-light-emitting device 112 so that the surface of the micro-light-emitting device 112 can be exposed to the light-shielding layer 13 without being blocked. A planarization layer 14 covers the light-shielding layer 13 and multiple micro-light-emitting devices 112 to flatten the upper surface of the display substrate 11. The thickness between the upper surface of the planarization layer 14 and the upper surface of the driving array layer 111 is 7–15 μm. Conductive vias 15 are formed, for example, by photolithography or plasma etching. A transparent sensing circuit layer 121 is, for example, an ITO (Indium Tin Oxide) thin film, used to sense changes in capacitance caused by a touch object. The transparent sensing circuit layer 121 is electrically connected to the third metal layer of the driving array layer 11 through conductive vias 15, so that the sensing signal is transmitted by the internal circuitry of the driving array layer 11 to the IC (Integrated Circuit) chip of the TFT driver board to determine the location of the touch signal source, thereby achieving the touch function of identifying the touch object. The display panel 10 provided in this embodiment can solve the problem that in the prior art, when the touch sensing circuit is located below the MicroLED, the internal capacitance of the MicroLED changes due to the applied current and voltage, which blocks or changes the capacitance difference caused by the touch object, thus causing inaccurate judgment. The display panel 10 provided in this embodiment has a simple structure and accurate touch control.

[0044] [Second Embodiment]

[0045] Reference Figure 2A second embodiment of the present invention provides another display panel 10, which includes, for example, a substrate 11, a capacitive touch sensing structure 12, and a light-shielding layer 13. The display substrate 11 includes a driving array layer 111 and a plurality of micro-light-emitting devices 112, the plurality of micro-light-emitting devices 112 contacting and electrically connected to the driving array layer 111. The light-shielding layer 13 is disposed between the plurality of micro-light-emitting devices 112 and exposes the side of the plurality of micro-light-emitting devices 112 away from the driving array layer 111. The capacitive touch sensing structure 12 is located on the side of the driving array layer 111 adjacent to the plurality of micro-light-emitting devices 112 and spaced apart from the plurality of micro-light-emitting devices 112, and is electrically connected to the driving array layer 111.

[0046] The micro-light-emitting device 112 is, for example, a micro-light-emitting diode device, i.e., a Micro LED. The driving array layer 111 includes a TFT driving array for driving the micro-light-emitting device 112 to emit light, specifically including, for example, a substrate glass and, on the surface of the substrate glass, a buffer layer, an active layer, a gate insulation layer (GI layer), a first metal layer, a first passivation layer, a second metal layer, a second passivation layer, etc., and a third metal layer, etc., stacked sequentially. Figure 1 (Not shown in the image), the active layer, the first metal layer, and the second metal layer are used to form the TFT (Thin Film Transistor) device structure. The gate insulating layer, the first passivation layer, and the second passivation layer are mainly used for insulation and isolation between the active layer, the first metal layer, and the second metal layer. The third metal layer can be used for electrical connection with devices other than the driving array layer 111. That is, the driving array layer 111 is specifically the part of the TFT driving array used to drive the micro light-emitting devices 112 to emit light. That is, the display substrate 11 refers to the TFT driving board on which multiple micro light-emitting devices 112 have been soldered. Specifically, the micro light-emitting devices 112 are, for example, soldered on the third metal layer of the driving array layer 111 to electrically connect to the driving array layer 111.

[0047] In one embodiment, specifically, the capacitive touch sensing structure 12 is disposed within the light-shielding layer 13 and located among a plurality of micro-light-emitting devices 112. (Refer to...) Figure 2The light-shielding layer 13, for example, is a full-layer BM (Black Matrix) film or other BM material, and is disposed between multiple micro-light-emitting devices 112. Specifically, the light-shielding layer 13 exposes the side of the micro-light-emitting device 112 away from the driving array layer 111. For example, when the light-shielding layer 13 is a full-layer BM film, its upper surface is flush with the upper surface of the micro-light-emitting device 112, exposing the upper surface of the micro-light-emitting device 112 to block light crosstalk between adjacent micro-light-emitting devices 112, allowing multiple micro-light-emitting devices 112 to emit light upwards. Alternatively, in some embodiments, when the height of the light-shielding layer 13 is greater than the height of the micro-light-emitting device 112, it is necessary to cut out the corresponding upper surface of the micro-light-emitting device 112 so that the surface of the micro-light-emitting device 112 can be exposed to the light-shielding layer 13 without being blocked. The capacitive touch sensing structure 12 is located between multiple micro-light-emitting devices 112, specifically referring to... Figure 2 For example, located on the bottom side of the light-shielding layer 13 near the driving array layer 111. Or refer to Figure 3 In another embodiment, the capacitive touch sensing structure 12 is located, for example, between the upper and lower surfaces of the light-shielding layer 13. Alternatively, refer to... Figure 4 In another embodiment, the capacitive touch sensing structure 12 is located, for example, on the top side of the light-shielding layer away from the driving array layer 111. Positioning the capacitive touch sensing structure 12 at the middle and top of the light-shielding layer 13 increases the variation in capacitance of the touched object, making the touch signal more sensitive and increasing sensing sensitivity. Figure 2 , Figure 3 and Figure 4 The top view of the display panel 10 shown can be referenced for example. Figure 8 The capacitive touch sensing structure 12 forms a circuit around the micro light-emitting device 112, for example... Figure 8 Four sensing areas are formed in the middle, of course Figure 8 The area shown is only one example; different sensing areas of the capacitive touch sensing structure 12 are achieved, for example, through conductive vias at different locations within the light-shielding layer 13. Figure 2 (Not shown) is electrically connected to the third metal layer of the driving array layer. The sensing signal is transmitted by the internal circuitry of the driving array layer 11 to the IC chip of the TFT driver board to determine the position of the touch signal source, thereby achieving the touch function of recognizing the touch object. At this time, the capacitive touch sensing structure 12 can be made of ITO material or other metal materials, which can ensure the light emission of the micro-light-emitting device 112 and avoid the judgment abnormality caused by the parasitic capacitance of the micro-light-emitting device itself.

[0048] More specifically, in one embodiment, the light-shielding layer 13 further includes a plurality of isolation pillars 131 protruding from the driving array layer 111 near the side of the plurality of micro-light-emitting devices 112. An isolation pillar 131 is disposed between any two adjacent micro-light-emitting devices 112, and the height of each isolation pillar 131 protruding from the driving array layer 111 is not less than the height of the plurality of micro-light-emitting devices 112 protruding from the driving array layer 111. For example, refer to... Figure 5 , it is Figure 2 The diagram shows a structural schematic of a specific embodiment of the display panel 10. The light-shielding layer 13 is patterned and etched to form a plurality of isolation pillars 131, the isolation pillars 131 protruding beyond the height of the drive array layer 111, for example... Figure 5 As shown in H1, the micro-light-emitting device 112 protrudes from the driving array layer 111 at a height of, for example, Figure 5 H2 is shown, where H1 is not less than H2. Or refer to Figure 6 , it is Figure 4 The diagram shows a structural schematic of a specific embodiment of the display panel 10. A capacitive touch sensing structure 12 is disposed on the side of a target isolation pillar away from the driving array layer 111 among a plurality of isolation pillars 131. The capacitive touch sensing structure 12 is disposed on top of the target isolation pillar. For example, see... Figure 8 A top-view structural diagram shows that a capacitive touch sensing structure 12 is provided on the isolation pillar 131 between the micro-light-emitting devices 111 in the first row and first column and the first row and second column, respectively. This isolation pillar 131 is the aforementioned target isolation pillar. However, the isolation pillar between the micro-light-emitting devices 111 in the first row and first column and the second row and first column does not have a capacitive touch sensing structure 12; therefore, this isolation pillar is not the target isolation pillar. The isolation pillar 131 blocks crosstalk between adjacent micro-light-emitting devices 112 and exposes the upper surface of the micro-light-emitting devices 112, allowing them to emit light upwards. Furthermore, referring to… Figure 7 , it is Figure 6 The schematic diagram of a specific embodiment shows that the isolation column 131 is made of light-reflecting material, so that the light emitted by the micro light-emitting device 112 can be recovered as much as possible.

[0049] [Third Embodiment]

[0050] The third embodiment of the present invention provides a method for manufacturing a display panel, referring to... Figure 9The display panel fabrication method provided in this embodiment includes, for example, steps S1 and S2. Step S1: A display substrate is provided, the display substrate including a driving array layer and a plurality of micro light-emitting devices, the plurality of micro light-emitting devices contacting and electrically connecting to the driving array layer; Step S2: A capacitive touch sensing structure is formed on the side of the display substrate adjacent to the plurality of micro light-emitting devices, such that the capacitive touch sensing structure is spaced apart from the plurality of micro light-emitting devices and electrically connected to the driving array layer.

[0051] The display substrate provided in step S1 has the same structure as the display substrate 11 described in the first and second embodiments, and will not be described again in this embodiment. In a specific embodiment, step S3 is included between step S1 and step S2: a light-shielding layer is prepared between the plurality of micro light-emitting devices, exposing the side of the micro light-emitting devices away from the driving array layer.

[0052] Between steps S3 and S2, step S4 is further included: preparing a planarization layer on the side of the light-shielding layer away from the driving array layer. Step S4 is used to planarize the surface of the light-shielding layer before performing step S2. Step S2 specifically includes step S21: forming a conductive via penetrating the planarization layer and the light-shielding layer; step S22: covering the side of the planarization layer away from the light-shielding layer with a transparent sensing circuit layer, and making the transparent sensing circuit layer electrically connected to the driving array layer through the conductive via, the transparent sensing circuit layer forming the capacitive touch sensing structure.

[0053] In step S21, conductive vias are formed, for example, by photolithography or plasma etching. Step S3 specifically includes, for example, step S31: covering the side of the plurality of micro-light-emitting devices away from the driving array layer with a light-shielding film, exposing the side of the micro-light-emitting devices away from the driving array layer, to form the light-shielding layer; specifically, for example, after covering with the light-shielding film, a polishing machine or a grinding machine is used to remove excess parts, so that the upper surface of the micro-light-emitting devices is exposed from the light-shielding layer and is not blocked. The fabrication steps of the display panel in this embodiment are, for example, referred to... Figure 10 The steps (a) to (f) are shown in the table: (a) providing a display substrate → (b) covering with a light-shielding film → (c) polishing to form a light-shielding layer → (d) preparing a planarization layer → (e) forming a via → (f) covering with a transparent conductive layer.

[0054] Alternatively, in another embodiment, step S3 may include step S32: filling the space between the plurality of micro-light-emitting devices with a light-shielding liquid, exposing the side of the micro-light-emitting devices away from the driving array layer, and curing the light-shielding liquid to form the light-shielding layer. Specifically, the light-shielding liquid may be selected as a material that is liquid and highly fluid when heated, possessing cohesive properties. For example, by dripping or spin-coating, the light-shielding liquid is applied to the micro-light-emitting devices, and its cohesive properties prevent it from remaining on the surface of the micro-light-emitting devices, thus ensuring that the upper surface of the micro-light-emitting devices is not obscured and is exposed from the light-shielding layer. The fabrication steps of the display panel in this embodiment are, for example, referred to... Figure 11 Steps (g) to (l) are shown in the table below: (g) providing a display substrate → (h) drop- or spin-coating a light-shielding material liquid → (i) curing the light-shielding material liquid to form a light-shielding layer → (j) preparing a planarization layer → (k) forming vias → (l) covering with a transparent conductive layer. (Comparison) Figure 10 and Figure 11 As can be seen from the steps, step S3 using the process of step S32 is simpler than using the process of step S31 because it eliminates the polishing step.

[0055] The above embodiments of this utility model can be used to prepare the display panel described in the first embodiment, which has the effect of simple process and the same beneficial effects as the first embodiment. This embodiment will not be described again.

[0056] [Fourth Embodiment]

[0057] The fourth embodiment of the present invention provides a method for manufacturing a display panel, referring to... Figure 9 The display panel fabrication method provided in this embodiment includes, for example, steps S1 and S2. Step S1: A display substrate is provided, the display substrate including a driving array layer and a plurality of micro light-emitting devices, the plurality of micro light-emitting devices contacting and electrically connecting to the driving array layer; Step S2: A capacitive touch sensing structure is formed on the side of the display substrate adjacent to the plurality of micro light-emitting devices, such that the capacitive touch sensing structure is spaced apart from the plurality of micro light-emitting devices and electrically connected to the driving array layer.

[0058] In this embodiment, the display substrate provided in step S1 has the same structure as the display substrate 11 described in the first and second embodiments, and will not be described again in this embodiment. In a specific embodiment, step S2 specifically includes step S23: forming a capacitive touch sensing structure between two adjacent target micro-light-emitting devices among the plurality of micro-light-emitting devices. The target micro-light-emitting devices can be some or all of the plurality of micro-light-emitting devices, that is, the capacitive touch sensing structure can be formed only between some of the micro-light-emitting devices among the plurality of micro-light-emitting devices, or it can be formed between any two adjacent micro-light-emitting devices. This embodiment is not limited to this.

[0059] For example, step S3 is included before step S23: a light-shielding layer is prepared between the plurality of micro-light-emitting devices, exposing the side of the micro-light-emitting devices away from the driving array layer. Alternatively, in some embodiments, step S3 may also be performed after step S23. Performing step S23 before step S3 can be used to prepare the aforementioned... Figure 2 and Figure 3 The structure of the display panel 10 shown is described. After step S3, the process performed via step S22 can be used to prepare a display panel as shown in step S3. Figure 4 The structure of the display panel 10 shown is as follows. Before step S23, the method may include, for example, forming a conductive via, so that the capacitive touch sensing structure can be electrically connected to the driving array layer through the conductive via.

[0060] Furthermore, in another embodiment, step S3 may further include step S33: forming a plurality of isolation pillars in the light-shielding layer, such that an isolation pillar is formed between any two adjacent micro-light-emitting devices, and the height of each isolation pillar protruding from the driving array layer is not less than the height of the plurality of micro-light-emitting devices protruding from the driving array layer. The plurality of isolation pillars may, for example, be formed by etching the light-shielding layer after patterning. The isolation pillars block crosstalk between adjacent micro-light-emitting devices and expose the upper surface of the micro-light-emitting devices, allowing them to emit light upwards. Alternatively, in some embodiments, light-reflecting materials may be used to form the isolation pillars, allowing the light emitted by the micro-light-emitting devices to be recovered as much as possible. Light-reflecting materials may, for example, be metallic reflective materials such as Ag (silver) or Cr (chromium), DBR (Distributed Bragg Reflection) materials, or TiO2 nanoparticle mixtures. Similarly, step S33 can be performed after step S22 and can be used to prepare, for example, Figure 5 The display panel shown. Step S33 can also be performed before step S22, and step S22 specifically includes step S221: forming a capacitive touch sensing structure on the side of the target isolation pillar away from the driving array layer among the plurality of isolation pillars, which can be used to prepare such as Figure 6 or Figure 7 The display panel shown.

[0061] The display panel manufacturing method provided in this embodiment can be used to manufacture the display panel 10 as described in the second embodiment above, and therefore has the same beneficial effects as the second embodiment.

[0062] [Fifth Embodiment]

[0063] Reference Figure 12 The fifth embodiment of the present invention provides a display device 100, which includes, for example, any of the display panels 10 described in the first and second embodiments. The display device 100 can be any electronic product with display and touch functions, including but not limited to televisions, laptops, desktop monitors, tablets, digital cameras, smart bracelets, smart glasses, automotive displays, medical devices, industrial control systems, touch interaction terminals, etc. The embodiments of the present invention do not impose any limitations on this. The display device 100, employing the display panel 10 described in the foregoing embodiments, therefore has the same beneficial effects as the foregoing embodiments.

[0064] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A display panel, characterized in that, include: The display substrate includes a driving array layer and a plurality of micro light-emitting devices, wherein the plurality of micro light-emitting devices are in contact with and electrically connected to the driving array layer; A capacitive touch sensing structure is located on the side of the driving array layer adjacent to the plurality of micro light-emitting devices and spaced apart from the plurality of micro light-emitting devices, and the capacitive touch sensing structure is electrically connected to the driving array layer; A light-shielding layer is disposed between the plurality of micro-light-emitting devices, and the side of the plurality of micro-light-emitting devices away from the driving array layer is exposed; A planarization layer covers the light-shielding layer and the side of the plurality of micro-light-emitting devices away from the driving array layer to flatten the upper surface of the display substrate; the planarization layer is in contact with the side of the plurality of micro-light-emitting devices away from the driving array layer; as well as A conductive via penetrates the planarization layer and the light-shielding layer and extends to the driving array layer; The capacitive touch sensing structure includes a transparent sensing circuit layer, which covers the side of the planarization layer away from the light-shielding layer and is electrically connected to the driving array layer through the conductive via. The orthographic projection of the transparent sensing circuit layer onto the driving array layer overlaps with the orthographic projection of the plurality of micro-light-emitting devices onto the driving array layer.

2. A display panel, characterized in that, include: The display substrate includes a driving array layer and a plurality of micro light-emitting devices, wherein the plurality of micro light-emitting devices are in contact with and electrically connected to the driving array layer; A light-shielding layer is disposed between the plurality of micro-light-emitting devices, and the side of the plurality of micro-light-emitting devices away from the driving array layer is exposed; A capacitive touch sensing structure is disposed within the light-shielding layer and located between the plurality of micro light-emitting devices. The capacitive touch sensing structure is spaced apart from the driving array layer and from the plurality of micro light-emitting devices.

3. The display panel as described in claim 2, characterized in that, The light-shielding layer includes a plurality of isolation pillars protruding from the driving array layer in a direction close to the side of the plurality of micro light-emitting devices. An isolation pillar is disposed between any two adjacent micro light-emitting devices, and the height of each isolation pillar protruding from the driving array layer is not less than the height of the plurality of micro light-emitting devices protruding from the driving array layer.

4. The display panel as described in claim 3, characterized in that, The multiple isolation pillars are made of light-reflecting materials.

5. A method for manufacturing a display panel, characterized in that, include: A display substrate is provided, the display substrate including a driving array layer and a plurality of micro light-emitting devices, the plurality of micro light-emitting devices contacting and electrically connected to the driving array layer; A light-shielding layer is prepared between the plurality of micro-light-emitting devices, exposing the side of the micro-light-emitting devices away from the driving array layer; a capacitive touch-sensing structure is formed on the side of the display substrate adjacent to the plurality of micro-light-emitting devices, such that the capacitive touch-sensing structure is spaced apart from the plurality of micro-light-emitting devices and electrically connected to the driving array layer, specifically including: A planarization layer is prepared on the side of the light-shielding layer away from the driving array layer to flatten the upper surface of the display substrate and the surface of the light-shielding layer, and the planarization layer contacts the side of the plurality of micro light-emitting devices away from the driving array layer; A conductive via is formed that penetrates the planarization layer and the light-shielding layer; A transparent sensing circuit layer is covered on the side of the planarization layer away from the light-shielding layer, and the transparent sensing circuit layer is electrically connected to the driving array layer through the conductive via. The orthographic projection of the transparent sensing circuit layer on the driving array layer overlaps with the orthographic projection of the plurality of micro light-emitting devices on the driving array layer; the transparent sensing circuit layer forms a capacitive touch sensing structure.

6. The method for manufacturing a display panel as described in claim 5, characterized in that, The step of fabricating a light-shielding layer between the plurality of micro-light-emitting devices and exposing the side of the micro-light-emitting devices away from the driving array layer includes: A light-shielding film is applied to the side of the plurality of micro-light-emitting devices away from the driving array layer, exposing the side of the micro-light-emitting devices away from the driving array layer to form the light-shielding layer; or A light-shielding liquid is filled between the plurality of micro-light-emitting devices, so that the light-shielding liquid is exposed on the side of the micro-light-emitting devices away from the driving array layer, and the light-shielding liquid is cured to form the light-shielding layer.

7. A display device, characterized in that, Includes a display panel as described in any one of claims 1-4 or a display panel manufactured using the display panel manufacturing method as described in any one of claims 5-6.

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