A method, device and medium for temperature control using thermal field-coordinated electronic devices

Abstract

This application discloses a method, device, and medium for temperature control of electronic devices using a thermal field coordination mechanism. The method includes: acquiring temperature data collected from multiple temperature control points of the electronic device under test (DUT), and normalizing the temperature data; determining the weight values ​​corresponding to each temperature control point; obtaining a dimensionless weighted average temperature corresponding to the DUT based on the normalized temperature data and weight values; adjusting the speed of multiple preset cooling fans using a multi-fan simultaneous speed control method based on the temperature control target of the DUT; identifying the temperature control points that do not meet the preset device temperature conditions, and adjusting the speed of the preset cooling fans corresponding to the temperature control points using a target-oriented multi-fan speed monotonic power consumption optimization control method until the temperature data corresponding to the temperature control points meets the preset device temperature conditions, thereby obtaining the adjusted fan temperature control parameters. This method improves heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to the field of thermal control technology for electronic devices, and in particular to a method, device and medium for temperature control of electronic devices in conjunction with thermal field coordination. Background Technology

[0002] 50% of electronic device failures stem from thermal inefficiencies. High temperatures cause electronic components to deviate from their design values, leading to system performance degradation. For example, high temperatures alter resistor or capacitor values, causing capacitive reactance mismatch and increasing noise in high-speed signals. Furthermore, the leakage current of transistors in integrated circuits is highly sensitive to device temperature; high temperatures significantly increase leakage current, increase power consumption, and further worsen system heat dissipation. High temperatures severely threaten the reliability of electronic systems; studies have found that for every 10°C increase in temperature, the lifespan of electronic components is reduced by half. With advancements in modern semiconductor manufacturing processes, electronic devices are rapidly evolving towards miniaturization and higher performance. The continuous development of microelectronics technologies such as VLSI, ASICs, and UHVICs in structure, process, and assembly has rapidly increased the power density within electronic devices, with chip-level heat flux densities reaching as high as 300 W / cm².

[0003] Efficient heat dissipation design has become a common challenge for the electronics industry. Taking data centers as an example, 40% of the energy consumption of electronic equipment comes from the air conditioning systems used for cooling. Cooling strategies for electronic equipment are gradually shifting from redundant cooling to intelligent cooling, reducing system energy consumption while ensuring cooling requirements are met.

[0004] Currently, forced air cooling in electronic devices commonly employs single-point temperature-speed curves or target temperature-speed adaptive cooling as temperature control strategies. The single-point temperature or target temperature is typically based on the main chip temperature. This approach lacks a holistic understanding and coordinated control of the internal temperature field. Using only the main chip temperature as the basis for fan speed adjustment may overlook the risks to other heat-sensitive components, leading to cooling failures. Furthermore, relying solely on absolute temperature as the independent variable makes it difficult to fully consider the high-temperature tolerance of components and the need for thermal redundancy due to component thermal failure risks. To ensure effective cooling, fan flow redundancy is often increased, thereby increasing the energy consumption of the electronic device's cooling system and reducing energy efficiency. Summary of the Invention

[0005] This application provides a thermal field coordinated electronic device temperature control method, device and medium to solve the following technical problem: In the prior art, in order to ensure effective heat dissipation, the fan flow redundancy is usually increased, thereby increasing the energy consumption of the electronic device cooling system and thus reducing energy efficiency.

[0006] The embodiments of this application adopt the following technical solutions:

[0007] This application provides a method for temperature control of electronic devices using a thermal field coordination mechanism. The method includes: acquiring temperature data collected from multiple temperature control points corresponding to the electronic device under test (DUT), and normalizing the temperature data; wherein the location of the temperature control points is related to the location of the devices within the DUT; determining weight values ​​for each temperature control point based on a preset failure probability and a preset failure risk level; obtaining a dimensionless weighted average temperature corresponding to the DUT based on the normalized temperature data and the weight values; adjusting the speed of multiple preset cooling fans using a multi-fan simultaneous speed control method based on the DUT's temperature control target, so that the dimensionless weighted average temperature meets the temperature control target; identifying temperature control points that do not meet preset device temperature conditions, and adjusting the speed of the preset cooling fans corresponding to these temperature control points using a target-oriented multi-fan speed monotonic power consumption optimization control method until the temperature data corresponding to the temperature control point meets the preset device temperature conditions, thereby obtaining the adjusted fan temperature control parameters.

[0008] This application embodiment normalizes temperature data and determines the weight values ​​corresponding to multiple temperature control points based on the failure probability and risk level of preset temperature control points. This enables dimensionless normalization of the measured temperature based on the temperature resistance characteristics of each component within the electronic device. By weighting the temperature measurement points with the risk of component thermal failure, the field temperature of the electronic device system is obtained as a temperature control parameter, providing the possibility for optimal temperature control based on the temperature field. Furthermore, this application embodiment improves heat dissipation efficiency by setting up a multi-fan simultaneous speed control method and a target-oriented multi-fan speed monotonic power consumption optimization control method. This is achieved through corresponding heat dissipation adjustment strategies, prioritizing temperature control targets while minimizing energy consumption.

[0009] In one implementation of this application, the temperature data is normalized, specifically including: determining the temperature data collected by the thermal sensors at multiple temperature control points; determining the optimal operating temperature of the electronic device under test; determining the operating temperature range of different components in the electronic device under test; obtaining the temperature difference based on the temperature data and the optimal operating temperature; and obtaining the normalized temperature data based on the ratio between the difference and the operating temperature range.

[0010] In one implementation of this application, based on the preset temperature control point failure factor and the level of preset temperature control point failure risk, the weight values ​​corresponding to multiple temperature control points are determined respectively. Specifically, this includes: determining the temperature control point failure factor based on the preset temperature control point failure factor and the level of preset temperature control point failure risk, and determining the weight values ​​corresponding to multiple temperature control points respectively according to the proportion of the failure factor.

[0011] In one implementation of this application, a temperature control point failure factor is determined based on a preset temperature control point failure factor and a preset temperature control point failure risk level. Then, weight values ​​corresponding to multiple temperature control points are determined according to the proportion of the failure factor. Specifically, this includes: based on a preset function...

[0012] i fail =P fail ×R risk

[0013] Determine the failure factor of the temperature control point; based on the preset function

[0014]

[0015] The proportion of failure factors at each temperature control point is determined, and this proportion is used as the weight value corresponding to the temperature control point; where i fail P is the failure factor for the temperature control point. fail Preset the failure probability of the temperature control point; R risk To pre-determine the risk level of temperature control point failure; W i The weighting is the weight of the i-th temperature control point.

[0016] In one implementation of this application, the dimensionless weighted average temperature of the electronic device under test is obtained based on the normalized temperature data and weight values, specifically including: based on a preset function.

[0017]

[0018] The dimensionless weighted average temperature of the electronic device under test is obtained; where W i The weighted weight for the i-th temperature control point; t normalizationi The temperature data is after normalization; t system This is a dimensionless weighted average temperature.

[0019] In one implementation of this application, based on the temperature control target corresponding to the electronic device under test, a multi-fan same-speed control method is adopted to adjust the speed of multiple preset cooling fans so that the dimensionless weighted average temperature meets the temperature control target. Specifically, this includes: comparing the temperature control target corresponding to the electronic device under test with the dimensionless weighted average temperature; if the comparison difference is greater than a first preset difference threshold, uniformly adjusting the speed of multiple preset cooling fans; and adjusting the dimensionless weighted average temperature based on the temperature control curve of weighted average temperature-speed or the feedback adjustment method of target temperature-speed, and the uniformly adjusted speed, so that the difference is not greater than the first preset difference threshold.

[0020] In one implementation of this application, a target-oriented multi-fan speed monotonic power consumption optimization control method is adopted. The speed of a preset cooling fan corresponding to the temperature control point to be adjusted is adjusted until the temperature data corresponding to the temperature control point to be adjusted meets the preset device temperature conditions, and the adjusted fan temperature control parameters are obtained. Specifically, this includes: determining the current temperature corresponding to the temperature control point to be adjusted; determining the preset cooling fan corresponding to the temperature control point to be adjusted; adjusting the current speed of the preset cooling fan based on the difference between the current temperature and the preset device temperature conditions; and determining that the target-oriented multi-fan speed monotonic power consumption optimization control is completed when the difference between the current temperature and the preset device temperature conditions meets the second preset difference threshold, and obtaining the adjusted fan temperature control parameters.

[0021] In one implementation of this application, after acquiring the temperature data collected by multiple temperature control points corresponding to the electronic device under test, the method further includes: acquiring the temperature data collected by an auxiliary temperature control point set at the air inlet of the electronic device; and recording the temperature data collected by the auxiliary temperature control point, the load data of the electronic device, and the fan temperature control parameters.

[0022] This application provides a temperature control device for a thermal field-coordinated electronic device, including: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to: acquire temperature data collected from multiple temperature control points corresponding to the electronic device under test, and normalize the temperature data; wherein the location of the temperature control points is related to the location of the devices in the electronic device under test; and determine the weights corresponding to the multiple temperature control points based on a preset failure probability and a preset failure risk level of the temperature control points. Based on the normalized temperature data and weight values, the dimensionless weighted average temperature corresponding to the electronic device under test is obtained. Based on the temperature control target corresponding to the electronic device under test, a multi-fan same speed control method is adopted to adjust the speed of multiple preset cooling fans so that the dimensionless weighted average temperature meets the temperature control target. The temperature control point to be adjusted that does not meet the preset device temperature conditions is determined. A target-oriented multi-fan speed monotonic power consumption optimization control method is adopted to adjust the speed of the preset cooling fan corresponding to the temperature control point to be adjusted until the temperature data corresponding to the temperature control point to be adjusted meets the preset device temperature conditions, so as to obtain the adjusted fan temperature control parameters.

[0023] This application provides a non-volatile computer storage medium storing computer-executable instructions. These instructions are configured to: acquire temperature data collected from multiple temperature control points corresponding to an electronic device under test (DUT), and normalize the temperature data; wherein the location of each temperature control point is related to the location of a device within the DUT; determine weight values ​​for each temperature control point based on a preset failure probability and a preset failure risk level; obtain a dimensionless weighted average temperature corresponding to the DUT based on the normalized temperature data and the weight values; adjust the speed of multiple preset cooling fans using a multi-fan simultaneous speed control method based on the DUT's temperature control target, so that the dimensionless weighted average temperature meets the temperature control target; identify temperature control points that do not meet preset device temperature conditions, and adjust the speed of the preset cooling fans corresponding to these temperature control points using a target-oriented multi-fan speed monotonic power consumption optimization control method until the temperature data corresponding to the temperature control point meets the preset device temperature conditions, thereby obtaining the adjusted fan temperature control parameters.

[0024] The above-mentioned technical solutions adopted in the embodiments of this application can achieve the following beneficial effects: The embodiments of this application, by normalizing temperature data and determining the weight values ​​corresponding to multiple temperature control points based on the failure probability and risk level of preset temperature control points, can perform dimensionless normalization of the measured temperature based on the temperature resistance characteristics of each component within the electronic device. By weighting the temperature measurement points with the risk of component thermal failure, the field temperature on which the electronic device system is based is obtained as the temperature regulation parameter, providing the possibility for optimal temperature regulation based on the temperature field. Secondly, the embodiments of this application, by setting a multi-fan simultaneous speed control method and a target-oriented multi-fan speed monotonic power consumption optimization control method, improve heat dissipation efficiency by using corresponding heat dissipation adjustment strategies to achieve the temperature regulation target while minimizing energy consumption. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:

[0026] Figure 1 A schematic diagram of the hardware architecture of a thermal field collaborative optimization electronic device temperature control system provided in this application embodiment;

[0027] Figure 2 A flowchart of a thermal field-coordinated electronic device temperature control method provided in this application embodiment;

[0028] Figure 3 A flowchart illustrating the implementation of a temperature control strategy provided in this application embodiment;

[0029] Figure 4 This is a schematic diagram of the structure of a temperature control device for thermal field coordinated electronic equipment provided in an embodiment of this application. Detailed Implementation

[0030] This application provides a method, device, and medium for temperature control of electronic devices with thermal field coordination.

[0031] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this specification, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this application.

[0032] The technical solutions proposed in the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0033] Figure 1 A schematic diagram of the hardware architecture of a thermal field collaborative optimization electronic temperature control system provided in this application embodiment is shown below. Figure 1 As shown, the hardware architecture of the thermal field collaborative optimization electronic temperature control system mainly includes:

[0034] (1) Data acquisition system, including multi-point temperature control measurement points composed of thermocouples, thermistors, etc., and unified signal acquisition and analog-to-digital conversion components.

[0035] (2) Central data analysis and strategy control system, including central processing unit and storage devices.

[0036] (3) Cooling system, including multiple cooling fans with individually adjustable speeds.

[0037] Figure 2 A flowchart of a thermal field-coordinated electronic device temperature control method provided in this application embodiment is shown below. Figure 2 As shown, the thermal field-coordinated electronic device temperature control method includes the following steps:

[0038] S101. Obtain temperature data collected from multiple temperature control points corresponding to the electronic device under test, and normalize the temperature data.

[0039] In one embodiment of this application, temperature data collected by thermal sensors at multiple temperature control points are determined, along with the optimal operating temperature of the electronic device under test (DUT) and the operating temperature ranges for different components within the DUT. Based on the temperature data and the optimal operating temperature, a temperature difference is obtained. Based on the ratio between this difference and the operating temperature range, normalized temperature data is obtained. The location of each temperature control point is related to the location of the components within the DUT.

[0040] Specifically, in the temperature measurement-multi-fan speed control stage of this application, a weighted average method using multiple temperature measurement points is used to describe the overall heat dissipation state inside the electronic device system. This weighted average method needs to address two key issues: First, different components have different temperature resistance characteristics and operating temperatures, and directly summing and averaging them masks the thermal risks of components with lower operating temperatures (for example, within the same system, one component operates at 40 degrees Celsius and another at 80 degrees Celsius; a direct average results in 60 degrees Celsius, thus masking or amplifying the temperature risks of different components in the system). Second, the weighting of temperature measurement data obtained from different temperature control points when weighting and summing the system temperatures.

[0041] To address issue one, the thermal field collaborative optimization electronic device temperature control strategy proposed in this application introduces a temperature normalization process. The obtained temperature measurement data is normalized and used as strain parameters for subsequent weighted averaging and temperature regulation. This normalization process shields the influence of differences in the operating temperature characteristics of different devices within the system. The normalization method involves using a preset function:

[0042]

[0043] Among them, t normalization For normalized temperature, T measure T represents the actual temperature measured by the thermal sensor. design The optimal operating temperature for thermal design of electronic devices, T range This refers to the normal operating temperature range of the device.

[0044] S102. Based on the failure probability and failure risk level of the preset temperature control point, determine the weight values ​​corresponding to multiple temperature control points respectively.

[0045] In one embodiment of this application, a temperature control point failure factor is determined based on a preset temperature control point failure factor and a preset temperature control point failure risk level, and the weight values ​​corresponding to the plurality of temperature control points are determined according to the proportion of the failure factor.

[0046] Specifically, regarding the issue of determining the weights of temperature measurement data obtained from different temperature control points when performing weighted summation of system temperatures, this application's embodiments employ different assignment methods based on the nature of each temperature control point, according to their respective weights in the system's weighted average temperature calculation. For core component temperature control points, the main considerations are the probability of thermal failure of the component at the temperature measurement point and the risk level of thermal failure. For auxiliary temperature control points, such as power supply air inlets using internal chassis cooling, the main considerations are the probability of regional over-temperature and the risk of component failure due to over-temperature.

[0047] Furthermore, based on the preset function:

[0048] i fail =P fail ×R risk

[0049] The failure factor of the temperature control point was determined based on a preset function:

[0050]

[0051] The proportion of failure factors at each temperature control point is determined, and this proportion is used as the weight value corresponding to each temperature control point. Where i fail P is the failure factor for the temperature control point. fail Preset the failure probability of the temperature control point; R risk To pre-determine the risk level of temperature control point failure; W i The weighting is the weight of the i-th temperature control point.

[0052] S103. Based on the normalized temperature data and the weight value, the dimensionless weighted average temperature corresponding to the electronic device under test is obtained.

[0053] In one embodiment of this application, based on a preset function

[0054]

[0055] The dimensionless weighted average temperature of the electronic device under test is obtained; where W i The weighted weight for the i-th temperature control point; t normalizationi The temperature data is after normalization; t system This is a dimensionless weighted average temperature.

[0056] Specifically, based on the normalized temperature data, the temperature data is multiplied by the corresponding weighting weight to obtain the dimensionless weighted average temperature corresponding to the current electronic device under test.

[0057] S104. Based on the temperature control target corresponding to the electronic device under test, a multi-fan same speed control method is adopted to control the speed of multiple preset cooling fans so that the dimensionless weighted average temperature meets the temperature control target.

[0058] In one embodiment of this application, the temperature control target corresponding to the electronic device under test is compared with the dimensionless weighted average temperature. If the difference between the comparisons exceeds a first preset difference threshold, the speed of multiple preset cooling fans is uniformly adjusted. Based on the temperature control curve of weighted average temperature-speed or the feedback adjustment method of target temperature-speed, and the uniformly adjusted speed, the dimensionless weighted average temperature is adjusted so that the difference does not exceed the first preset difference threshold.

[0059] Specifically, the fan speed regulation in the temperature control strategy proposed in this application embodiment is divided into two parts. The first stage is the multi-fan same speed regulation stage, in which the dimensionless weighted average temperature of the system is used as the regulation variable, and the multi-fan system adopts a uniform speed for regulation, providing a better initial state of the system for subsequent power consumption optimization.

[0060] That is, the calculated dimensionless weighted average temperature is compared with the set temperature control target data. If the difference between the two is large, exceeding a first preset difference threshold, the speed of multiple fans is uniformly adjusted until the difference between the dimensionless weighted average temperature corresponding to the electronic device and the temperature control target is no greater than the first preset difference threshold. For multi-fan speed control, a positive adjustment using the weighted average temperature-speed temperature control curve can be used, or a feedback adjustment using the target temperature-speed can be used.

[0061] S105. Determine the temperature control point to be adjusted that does not meet the preset device temperature conditions. Use a target multi-fan speed monotonic power consumption optimization control method to adjust the speed of the preset heat dissipation fan corresponding to the temperature control point to be adjusted until the temperature data corresponding to the temperature control point to be adjusted meets the preset device temperature conditions, so as to obtain the adjusted fan temperature control parameters.

[0062] In one embodiment of this application, the current temperature corresponding to the temperature control point to be adjusted is determined; and the preset cooling fan corresponding to the temperature control point to be adjusted is determined. Based on the difference between the current temperature and the preset device temperature conditions, the current speed of the preset cooling fan is adjusted. When the difference between the current temperature and the preset device temperature conditions meets a second preset difference threshold, the monotonic power consumption optimization control of the target multi-fan speed is determined to be complete, and the adjusted fan temperature control parameters are obtained.

[0063] Specifically, in the target-oriented multi-fan speed monotonic power consumption optimization stage, after the temperature control target is achieved, fan speed optimization is implemented with the system weighted average temperature as the objective. This stage uses the speeds of multiple cooling fans as fine-tuning parameters, and employs multi-objective optimization methods such as multi-objective evolutionary algorithms, fuzzy optimization, neural networks, and multi-objective particle swarm optimization to obtain the optimal speed match for power consumption while meeting the system temperature control target, thereby improving the intelligence and energy efficiency of the system temperature control. This stage uses the system state obtained in the previous multi-fan speed control stage as the initial state for energy consumption optimization.

[0064] Furthermore, after controlling the speed of multiple fans at the same speed, when the temperature of the electronic device under test meets the temperature control target, the temperature value corresponding to each temperature control point is determined. If the temperature of the temperature control point is greater than the preset temperature condition corresponding to the temperature control point, the corresponding fan to be adjusted is determined based on the position of the temperature control point. At this time, only the local adjustment of a single fan is performed. Through the preset target optimization algorithm, the corresponding speed is calculated based on the current temperature and other data to adjust the speed of the fan to be adjusted.

[0065] In one embodiment of this application, temperature data collected by an auxiliary temperature control point located at the air inlet of the electronic device is acquired. The temperature data collected by the auxiliary temperature control point, the load data of the electronic device, and the fan temperature control parameters are recorded.

[0066] For example, to improve the safety of this temperature control strategy, for newly started systems, due to the lack of past operating data for reference, the cooling fans operate at full speed to serve the system startup. During operation, if a local temperature control point exceeds the temperature control range, the associated fan is automatically activated to enter local full-speed operation and sends an alarm message to the system. To improve the control rate, this embodiment of the application arranges an auxiliary temperature control point at the air inlet. This control point is used to monitor the air temperature entering the system in real time and does not participate in the weighted average calculation of the system temperature control points. As mentioned in the system optimization strategy of this embodiment, after the system completes the determination of the final fan temperature control parameters, it will save the current system intake air temperature, power load, and fan temperature control parameters as learning data for the intelligent temperature control strategy. Combined with machine learning algorithms, as the system continues to run, the system quickly matches the optimal temperature control strategy for thermal field coordination based on the ambient intake temperature and equipment load.

[0067] Figure 3 This is a flowchart illustrating a temperature control strategy implementation method provided in an embodiment of this application. Figure 3 As shown, after obtaining the temperatures corresponding to multiple temperature control points of the electronic device under test, the acquired temperature data is normalized, and the normalized data is then weighted to obtain a weighted average temperature. The obtained weighted average temperature is compared with the temperature control target. If the comparison result does not meet the requirements, the fan speed is adjusted by controlling the speed of multiple fans simultaneously until the weighted average temperature meets the temperature control target. Secondly, through target-based multi-fan speed monotonic power consumption optimization, the fan speeds of devices that do not meet the temperature requirements are adjusted to achieve optimal control of the fan speed combination, ensuring that the local temperature meets the requirements, and the fan temperature control parameters are recorded.

[0068] Figure 4 This is a schematic diagram of a temperature control device for thermal field coordination electronic equipment provided in an embodiment of this application. Figure 4As shown, a temperature control device for a thermal field-coordinated electronic device includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to: acquire temperature data collected from multiple temperature control points corresponding to the electronic device under test, and normalize the temperature data; wherein the location of the temperature control points is related to the location of the devices in the electronic device under test; and determine the weight values ​​corresponding to the multiple temperature control points based on a preset failure probability and a preset failure risk level of the temperature control points. Based on the normalized temperature data and the weighted values, the dimensionless weighted average temperature corresponding to the electronic device under test is obtained. Based on the temperature control target corresponding to the electronic device under test, a multi-fan same-speed control method is adopted to adjust the speed of multiple preset cooling fans so that the dimensionless weighted average temperature meets the temperature control target. The temperature control point to be adjusted that does not meet the preset device temperature conditions is determined, and a target-oriented multi-fan speed monotonic power consumption optimization control method is adopted to adjust the speed of the preset cooling fan corresponding to the temperature control point to be adjusted until the temperature data corresponding to the temperature control point to be adjusted meets the preset device temperature conditions, so as to obtain the adjusted fan temperature control parameters.

[0069] This application embodiment also provides a non-volatile computer storage medium storing computer-executable instructions, which are configured to: acquire temperature data collected from multiple temperature control points corresponding to an electronic device under test, and normalize the temperature data; wherein the position of the temperature control point is related to the position of the device in the electronic device under test; determine the weight values ​​corresponding to the multiple temperature control points based on the preset failure probability and preset failure risk level of the temperature control point; obtain the dimensionless weighted average temperature corresponding to the electronic device under test based on the normalized temperature data and the weight values; based on the temperature control target corresponding to the electronic device under test, use a multi-fan same speed control method to adjust the speed of multiple preset cooling fans so that the dimensionless weighted average temperature meets the temperature control target; identify the temperature control point to be adjusted that does not meet the preset device temperature conditions, and use a target-oriented multi-fan speed monotonic power consumption optimization control method to adjust the speed of the preset cooling fan corresponding to the temperature control point to be adjusted until the temperature data corresponding to the temperature control point to be adjusted meets the preset device temperature conditions, so as to obtain the adjusted fan temperature control parameters.

[0070] The various embodiments in this application are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the embodiments of apparatus, devices, and non-volatile computer storage media are basically similar to the method embodiments, so the descriptions are relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0071] The above descriptions are merely embodiments of this application and are not intended to limit the scope of this application. For those skilled in the art, various modifications and variations can be made to the embodiments of this application. These modifications or substitutions do not cause the essence of the corresponding technical solutions to depart from the spirit and scope of the technical solutions in the embodiments of this application.

Claims

1. A method for temperature control of electronic devices with thermal field coordination, characterized in that, The method includes: Temperature data collected from multiple temperature control points corresponding to the electronic device under test are obtained and normalized; wherein, the position of the temperature control point is related to the position of the device in the electronic device under test. Based on the failure probability and failure risk level of the preset temperature control point, the weight values ​​corresponding to the multiple temperature control points are determined. Specifically, the failure factor of the temperature control point is determined based on the failure probability and failure risk level of the preset temperature control point, and the weight value corresponding to the multiple temperature control points is determined according to the proportion of the failure factor. Based on the normalized temperature data and the weight values, the dimensionless weighted average temperature corresponding to the electronic device under test is obtained. Based on the temperature control target corresponding to the electronic device under test, a multi-fan same speed control method is adopted to adjust the speed of multiple preset cooling fans so that the dimensionless weighted average temperature meets the temperature control target. The temperature control point to be adjusted that does not meet the preset device temperature conditions is identified. A target multi-fan speed monotonic power consumption optimization control method is adopted to adjust the speed of the preset heat dissipation fan corresponding to the temperature control point to be adjusted until the temperature data corresponding to the temperature control point to be adjusted meets the preset device temperature conditions, so as to obtain the adjusted fan temperature control parameters.

2. The method for temperature control of an electronic device with thermal field coordination according to claim 1, characterized in that, The normalization process for the temperature data specifically includes: The temperature data collected by the thermal sensors at the multiple temperature control points were determined; and Determine the optimal operating temperature for the electronic device under test; and Determine the operating temperature ranges corresponding to different components in the electronic device under test; Based on the temperature data and the optimal operating temperature, a temperature difference is obtained. Based on the ratio between the temperature difference and the operating temperature range, normalized temperature data is obtained.

3. The method for temperature control of an electronic device with thermal field coordination according to claim 1, characterized in that, The method involves determining a temperature control point failure factor based on the failure probability and risk level of the preset temperature control point, and then determining the weight values ​​corresponding to the multiple temperature control points according to the proportion of the failure factor. Specifically, this includes: Based on preset function The failure factor of the temperature control point was determined; Based on preset function The proportion of each failure factor at the temperature control point is determined, and the proportion is used as the weight value corresponding to the temperature control point. in, This refers to the failure factor of the temperature control point; The failure probability of the preset temperature control point; The failure risk level of the preset temperature control point; For the first i The weighted average of each temperature control point.

4. The method for temperature control of an electronic device with thermal field coordination according to claim 1, characterized in that, The step of obtaining the dimensionless weighted average temperature of the electronic device under test based on the normalized temperature data and the weight value specifically includes: Based on preset function The dimensionless weighted average temperature corresponding to the electronic device under test is obtained; wherein, For the first i The weighted weights of each temperature control point; The temperature data is after normalization. This is a dimensionless weighted average temperature.

5. The method for temperature control of an electronic device with thermal field coordination according to claim 1, characterized in that, Based on the temperature control target corresponding to the electronic device under test, a multi-fan simultaneous speed control method is adopted to adjust the speed of multiple preset cooling fans so that the dimensionless weighted average temperature meets the temperature control target. Specifically, this includes: The temperature control target corresponding to the electronic device under test is compared with the dimensionless weighted average temperature. If the comparison difference is greater than the first preset difference threshold, the speed of the multiple preset cooling fans is uniformly adjusted. Based on the temperature control curve of weighted average temperature-speed or the feedback adjustment method of target temperature-speed, and the speed after unified adjustment, the dimensionless weighted average temperature is adjusted so that the difference is not greater than the first preset difference threshold.

6. The method for temperature control of an electronic device with thermal field coordination according to claim 1, characterized in that, The method of using a fixed-target multi-fan speed monotonic power consumption optimization control involves adjusting the speed of the preset cooling fan corresponding to the temperature control point to be adjusted until the temperature data corresponding to the temperature control point to be adjusted meets the preset device temperature conditions, and obtaining the adjusted fan temperature control parameters. Specifically, this includes: Determine the current temperature corresponding to the temperature control point to be adjusted; and Identify the preset cooling fan corresponding to the temperature control point to be adjusted; Based on the difference between the current temperature and the preset device temperature conditions, the current speed of the preset cooling fan is adjusted; When the difference between the current temperature and the preset device temperature condition meets the second preset difference threshold, the target multi-fan speed monotonic power consumption optimization control is completed, and the adjusted fan temperature control parameters are obtained.

7. The method for temperature control of an electronic device with thermal field coordination according to claim 1, characterized in that, After acquiring the temperature data collected from multiple temperature control points corresponding to the electronic device under test, the method further includes: Acquire temperature data from the auxiliary temperature control point set at the air inlet of the electronic device; The temperature data collected from the auxiliary temperature control point, the load data of the electronic equipment, and the temperature control parameters of the fan are recorded.

8. A temperature control device for thermal field-coordinated electronic equipment, comprising: At least one processor; as well as, A memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to: Temperature data collected from multiple temperature control points corresponding to the electronic device under test are obtained and normalized; wherein, the position of the temperature control point is related to the position of the device in the electronic device under test. Based on the failure probability and failure risk level of the preset temperature control point, the weight values ​​corresponding to the multiple temperature control points are determined. Specifically, the failure factor of the temperature control point is determined based on the failure probability and failure risk level of the preset temperature control point, and the weight value corresponding to the multiple temperature control points is determined according to the proportion of the failure factor. Based on the normalized temperature data and the weight values, the dimensionless weighted average temperature corresponding to the electronic device under test is obtained. Based on the temperature control target corresponding to the electronic device under test, a multi-fan same speed control method is adopted to adjust the speed of multiple preset cooling fans so that the dimensionless weighted average temperature meets the temperature control target. The temperature control point to be adjusted that does not meet the preset device temperature conditions is identified. A target multi-fan speed monotonic power consumption optimization control method is adopted to adjust the speed of the preset heat dissipation fan corresponding to the temperature control point to be adjusted until the temperature data corresponding to the temperature control point to be adjusted meets the preset device temperature conditions, so as to obtain the adjusted fan temperature control parameters.

9. A non-volatile computer storage medium storing computer-executable instructions, wherein the computer-executable instructions are configured as follows: Temperature data collected from multiple temperature control points corresponding to the electronic device under test are acquired, and the temperature data is normalized; wherein, The location of the temperature control point is related to the location of the device in the electronic device under test; Based on the failure probability and failure risk level of the preset temperature control point, the weight values ​​corresponding to the multiple temperature control points are determined. Specifically, the failure factor of the temperature control point is determined based on the failure probability and failure risk level of the preset temperature control point, and the weight value corresponding to the multiple temperature control points is determined according to the proportion of the failure factor. Based on the normalized temperature data and the weight values, the dimensionless weighted average temperature corresponding to the electronic device under test is obtained. Based on the temperature control target corresponding to the electronic device under test, a multi-fan same speed control method is adopted to adjust the speed of multiple preset cooling fans so that the dimensionless weighted average temperature meets the temperature control target. The temperature control point to be adjusted that does not meet the preset device temperature conditions is identified. A target multi-fan speed monotonic power consumption optimization control method is adopted to adjust the speed of the preset heat dissipation fan corresponding to the temperature control point to be adjusted until the temperature data corresponding to the temperature control point to be adjusted meets the preset device temperature conditions, so as to obtain the adjusted fan temperature control parameters.

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