Cooling device and server

Abstract

The present invention relates to the technical field of servers, and discloses a heat dissipation device and a server, wherein the heat dissipation device comprises a fan assembly and an air guide cover. The fan assembly comprises a heat dissipation fan and a fan compartment, wherein the heat dissipation fan is installed in the fan compartment, and the fan compartment is provided with an air guide structure on the air outlet side. The air guide structure is used to guide the airflow generated by the heat dissipation fan to flow along a first preset direction, so that the airflow is concentrated to flow to the area where the heat dissipation components exist, thereby effectively dissipating the heat of the heat dissipation components, reducing the loss of air volume, and solving the problem that the air volume of the heat dissipation fan is not fully utilized due to the existence of windless areas and windy areas, thereby meeting the heat dissipation requirements of the server without increasing the power of the heat dissipation fan, and reducing the heat dissipation energy consumption of the server. The air guide cover is arranged on the air outlet path of the heat dissipation fan, and is used to guide the airflow generated by the heat dissipation fan to flow along a second preset direction, so as to more effectively dissipate the heat of the heat dissipation components far away from the fan compartment, and improve the working stability of the server.

Description

Technical Field

[0001] The present invention relates to the technical field of servers, and in particular to a heat dissipation device and a server. Background Art

[0002] At present, the heat dissipation method of servers is usually air cooling. Air cooling mainly uses fans to bring the heat generated by heat-generating components such as the CPU and memory to the back of the chassis to achieve the heat dissipation of the CPU and memory. However, the heat still exists in the chassis, and the heat brought to the back of the chassis will put pressure on the heat dissipation of the power supply, M.2 module, OCP module, etc. located at the back of the chassis, resulting in the parts at the back of the chassis not being effectively cooled. In addition, for axial fans, there are windless areas and windy areas in front of the axis, resulting in the airflow generated by the fan not being fully utilized, resulting in air loss. For servers with high power consumption, if you want to meet the heat dissipation requirements, you usually increase the fan speed, resulting in increased energy consumption and increased noise generated by the fan.

[0003] Therefore, there is an urgent need for a heat dissipation device and a server to solve the above problems. Summary of the invention

[0004] Based on the above problems, the object of the present invention is to provide a heat dissipation device and a server, which can improve the air volume utilization rate of the fan, improve the heat dissipation efficiency, and reduce the heat dissipation energy consumption of the server.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] In one aspect, a heat dissipation device is provided, comprising:

[0007] A fan assembly, comprising a cooling fan and a fan compartment, wherein the cooling fan is installed in the fan compartment, and the fan compartment is provided with an air guide structure on an air outlet side, wherein the air guide structure is used to guide the airflow generated by the cooling fan to flow along a first preset direction;

[0008] The air guide cover is arranged on the air outlet path of the heat dissipation fan and is used for guiding the airflow generated by the heat dissipation fan to flow along a second preset direction.

[0009] As a preferred solution of the heat dissipation device of the present invention, the air guide structure includes a first air guide plate arranged above the fan compartment, and the first air guide plate is inclined from the top of the fan compartment to the direction close to the bottom of the fan compartment. The airflow generated by the heat dissipation fan flows in the direction close to the axis of the heat dissipation fan under the guidance of the first air guide plate, so that the airflow smoothly reaches the top of the motherboard along the inclined direction of the first air guide plate, and is closer to the CPU and memory on the chassis motherboard to be cooled. The air volume received by the cooling components can be effectively increased, thereby improving the cooling efficiency and meeting the high heat dissipation requirements of the CPU and memory.

[0010] As a preferred solution of the heat dissipation device of the present invention, the air guide structure also includes a second air guide plate arranged below the fan compartment, and the second air guide plate is inclined in a direction away from the first air guide plate. With such an arrangement, under the action of the "Coanda effect", the airflow generated by the cooling fan will flow along the inclined direction of the second air guide plate, so that the airflow can flow more smoothly to the memory, power module, etc. at the lower 1U height in the chassis, so that the memory and power module can be better cooled. At the same time, the first air guide plate and the second air guide plate cooperate up and down, which can make the airflow generated by the cooling fan flow more smoothly downstream, solve the problem of wind pockets on the outlet side of the cooling fan, and can further reduce the loss of air volume.

[0011] As a preferred solution of the heat dissipation device of the present invention, the heat dissipation device also includes a radiator, the radiator includes a connected liquid cooling component and a heat sink group, the liquid cooling component is used to contact and transfer heat with the component to be cooled, and the heat sink group is located between the fan compartment and the air guide cover. After the liquid cooling component absorbs the heat of the component to be cooled, it dissipates the heat of the coolant through the heat sink group, thereby achieving a liquid cooling effect. Since the CPU generates a lot of heat, the CPU is cooled simultaneously by liquid cooling and air cooling, which can ensure that the CPU works at a suitable temperature and improve the working reliability of the server.

[0012] As a preferred solution of the heat dissipation device of the present invention, a heat dissipation portion is convexly provided on a side of the heat sink group close to the fan compartment, the heat dissipation portion is inclined in a direction close to the fan compartment, and the heat dissipation portion is located on a side of the first air guide plate facing away from the fan compartment, and an air guide hole opposite to the heat dissipation portion is provided on the first air guide plate. With such a configuration, part of the airflow generated by the cooling fan can be blown from the air guide hole to the heat dissipation portion of the heat sink group, thereby bringing the heat on the heat sink group out from above the first air guide plate, so that the heat brought out of the CPU by the heat sink group flows to the top of the chassis, thereby preventing all the heat generated by the CPU from flowing with the airflow to the downstream components to be cooled (such as power modules, M.2 modules, OCP modules, etc.), preventing the downstream components to be cooled from overheating, and further improving the operating stability of the server.

[0013] As a preferred solution of the heat dissipation device of the present invention, a heat dissipation air duct is provided on the air guide cover, and the air inlet side of the heat dissipation air duct is inclined to form an air guide slope on the air guide cover, and a bevel angle is provided on the side of the heat sink group facing away from the fan compartment, and the bevel angle is opposite to the air guide slope. The setting of the air guide slope can maximize the flow of air along the solid wall surface below the air guide cover, reduce air volume loss, and make the air flow more smoothly to the location where the CPU and memory are located, thereby improving the heat dissipation efficiency of the CPU and memory. By processing the bevel angle on the heat sink group, the heat sink group can be prevented from interfering with the air guide slope. At the same time, the design of the bevel angle can reduce the resistance of the airflow to the air guide cover, thereby ensuring the smoothness of the airflow.

[0014] As a preferred solution of the heat dissipation device of the present invention, a limit structure is provided on the fan compartment, and air outlets are provided on the wind guide slope on both upper and lower sides of the axis direction of the heat dissipation fan. Since the largest heat in the chassis comes from the CPU and memory under the air guide cover, the air outlets allow more air to enter the heat dissipation duct to better dissipate heat for the CPU and memory.

[0015] As a preferred solution of the heat dissipation device of the present invention, a plurality of heat dissipation air ducts are arranged at intervals on the air guide cover, and the plurality of heat dissipation air ducts include a first air duct, a second air duct and a third air duct arranged in sequence along the width direction of the chassis, and the outlet sides of the first air duct and the third air duct are both provided with a wind shield structure, and the wind shield structure is inclined toward the direction close to the second air duct. The airflow flowing out of the first air duct and the third air duct carries the heat generated by the CPU and the memory, and under the action of the wind shield structure, this part of the airflow can be guided to the middle area downstream of the second air duct, thereby reducing the air temperature at the OCP module and the power module downstream of the first air duct and the third air duct, and preventing the power module and the OCP module from overheating.

[0016] As a preferred embodiment of the heat dissipation device of the present invention, the fan assembly further includes a handle structure, the handle structure is rotatably connected to the fan compartment, the first air guide plate is arranged on the handle structure, and the handle structure can be switched between a first position where the first air guide plate is rotated to a wind-guiding state and a second position where the handle structure is rotated to a lifting state. When installing and disassembling the fan assembly, the fan assembly can be conveniently transferred through the handle structure, thereby improving the efficiency of assembly and disassembly. The first air guide plate and the handle structure are arranged as one body, which can increase the strength of the handle structure without affecting the wind-guiding function of the first air guide plate, and can also reduce the number of parts and simplify the processing and assembly processes of the fan assembly.

[0017] On the other hand, a server is provided, comprising a chassis, a component to be cooled and the cooling device as described above, wherein the component to be cooled is located in the chassis, and the cooling device is used to cool the component to be cooled.

[0018] The beneficial effects of the present invention are:

[0019] The heat dissipation device and server provided by the present invention can guide the airflow generated by the heat dissipation fan to flow along the first preset direction by setting an air guide structure on the air outlet side of the fan compartment, so that the airflow is concentrated to flow to the area where the heat dissipation components exist, thereby effectively dissipating the heat of the heat dissipation components, reducing air volume loss, and solving the problem that the air volume of the heat dissipation fan is not fully utilized due to the existence of windless areas and wind trap areas, thereby meeting the heat dissipation requirements of the server without increasing the power of the heat dissipation fan, reducing the heat dissipation energy consumption of the server, and not increasing the noise of the heat dissipation fan. By setting an air guide cover, the airflow generated by the heat dissipation fan can flow along the second preset direction, fully utilizing the air volume of the heat dissipation fan, so as to more effectively dissipate the heat of the heat dissipation components far away from the fan compartment, and improve the working stability of the server. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0021] Figure 1 It is a decomposed schematic diagram of a server provided in a specific embodiment of the present invention;

[0022] Figure 2 It is a top view of a server provided by a specific embodiment of the present invention (with the air guide cover and the radiator hidden);

[0023] Figure 3 yes Figure 1 A partial enlarged view of the middle A;

[0024] Figure 4 is a schematic structural diagram of a fan assembly provided in a specific embodiment of the present invention;

[0025] Figure 5 is a cross-sectional view of a fan assembly provided in a specific embodiment of the present invention;

[0026] Figure 6 It is a structural schematic diagram of an air guide cover provided in a specific embodiment of the present invention;

[0027] Figure 7 is a cross-sectional view of an air guide cover and a heat sink assembly provided in a specific embodiment of the present invention;

[0028] Figure 8 is a first cross-sectional view of a server provided by a specific embodiment of the present invention;

[0029] Fig. 9 yes Figure 8 A partial view of

[0030] Fig.10 is a second cross-sectional view of a server provided by a specific embodiment of the present invention;

[0031] Fig.11 is a third cross-sectional view of a server provided in a specific embodiment of the present invention;

[0032] Fig.12 It is a fourth cross-sectional view of the server provided by the specific implementation manner of the present invention.

[0033] In the figure:

[0034] 1-Fan assembly; 2-Air guide cover; 3-Radiator;

[0035] 11- cooling fan; 12- fan compartment; 13- air guide structure; 14- handle structure;

[0036] 121-limiting column; 131-first air guide plate; 132-second air guide plate;

[0037] 141-crossbeam; 142-connecting plate; 143-rotating shaft;

[0038] 1311- air guide hole; 1411- handle slot; 1412- indication structure; 1421- limit slot;

[0039] 21-first air duct; 22-second air duct; 23-third air duct; 24-wind shielding structure;

[0040] 211- wind guide slope; 2111- air outlet; 241- upper wind shield; 242- lower wind shield;

[0041] 31-liquid cooling assembly; 32-heat sink assembly;

[0042] 321- heat dissipation part; 322- chamfered corner;

[0043] 100-chassis; 200-hard disk module; 300-CPU; 400-memory; 500-motherboard; 600-power module; 700-IO board; 800-M.2 module; 900-OCP module. DETAILED DESCRIPTION

[0044] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0045] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.

[0046] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] like Figure 1 As shown, this embodiment provides a heat dissipation device, which can be applied to a server to dissipate heat from components to be dissipated in the server, with good heat dissipation effect and high air volume utilization. The heat dissipation device includes a fan assembly 1 and an air guide cover 2.

[0048] Among them, see Figure 1 , Figure 2 and Figure 4 The fan assembly 1 includes a heat dissipation fan 11 and a fan compartment 12. The heat dissipation fan 11 is installed in the fan compartment 12. The fan compartment 12 is provided with an air guide structure 13 at the air outlet side. The air guide structure 13 is used to guide the airflow generated by the heat dissipation fan 11 to flow along a first preset direction. Figure 1 and Figure 6 The air guide cover 2 is arranged on the air outlet path of the heat dissipation fan 11, and is used to guide the airflow generated by the heat dissipation fan 11 to flow along a second preset direction.

[0049] See also Figure 1 and Figure 2 The server includes a chassis 100, in which a hard disk module 200, a fan assembly 1 and a mainboard 500 are sequentially arranged, a CPU 300 and a memory 400 are arranged on the mainboard 500, a power module 600, an IO board 700 and an OCP module 900 are connected to the rear end of the mainboard 500, and an M.2 module 800 is installed on the IO board 700. The components to be cooled include the above-mentioned CPU 300, memory 400, power module 600, M.2 module 800 and OCP module 900.

[0050] The heat dissipation device provided in this embodiment can guide the airflow generated by the heat dissipation fan 11 to flow along the first preset direction by setting an air guide structure 13 on the air outlet side of the fan compartment 12, so that the airflow is concentrated to flow to the area where the heat dissipation components exist, thereby effectively dissipating the heat of the heat dissipation components, reducing air volume loss, and solving the problem that the air volume of the heat dissipation fan 11 is not fully utilized due to the existence of windless areas and wind trap areas, thereby meeting the heat dissipation requirements of the server without increasing the power of the heat dissipation fan 11, reducing the heat dissipation energy consumption of the server, and not increasing the noise of the heat dissipation fan 11. By setting the air guide cover 2, the airflow generated by the heat dissipation fan 11 can flow along the second preset direction, fully utilizing the air volume of the heat dissipation fan 11, so as to more effectively dissipate the heat of the heat dissipation components far away from the fan compartment 12, and improve the working stability of the server.

[0051] Optionally, see Figure 1 , Figure 4 and Figure 5 The air guide structure 13 includes a first air guide plate 131 disposed above the fan compartment 12. The first air guide plate 131 is inclined from the top of the fan compartment 12 toward the bottom of the fan compartment 12. Figure 5 , Figure 8 and Fig. 9 As shown, the airflow generated by the cooling fan 11 flows toward the direction close to the axis of the cooling fan 11 under the guidance of the first air guide plate 131 ( Figure 5 and Fig. 9 The direction indicated by the hollow arrow is the air flow direction), so that the airflow smoothly reaches the top of the mainboard 500 along the tilt direction of the first air guide plate 131, and is closer to the CPU 300 and memory 400 on the mainboard 500 of the chassis 100 to wait for heat dissipation components, which can effectively increase the air volume received by the heat dissipation components, thereby improving the heat dissipation efficiency and meeting the high heat dissipation requirements of the CPU 300 and memory 400.

[0052] For example, refer to Figure 5 In the orientation, the first air guide plate 131 is tilted downward at a 45 degree angle, which can effectively guide the wind from the air outlet of the cooling fan 11 downward, so that the wind blown by the cooling fan 11 is better concentrated in the middle and lower layer area, closer to the height of the components to be cooled. In other embodiments, the tilt angle of the first air guide plate 131 can also be adaptively adjusted according to factors such as the type of the cooling fan 11 or the cooling requirements of the server.

[0053] In this embodiment, refer to Figure 4The fan compartment 12 is divided into multiple compartments, each of which is equipped with a cooling fan 11 to ensure the air volume of the fan assembly 1. Furthermore, the size of the first air guide plate 131 along the width direction of the chassis 100 is equal to the size of the fan compartment 12 along the width direction of the chassis 100, so that the wind blown by the cooling fan 11 moves downward as a whole, covering multiple components to be cooled in the chassis 100, and effectively improving the air volume utilization rate of the cooling fan 11.

[0054] Optionally, see Figure 1 , Figure 4 and Figure 5 The air guide structure 13 also includes a second air guide plate 132 disposed below the fan compartment 12, and the second air guide plate 132 is tilted in a direction away from the first air guide plate 131. With such a configuration, under the effect of the "Coanda effect", the airflow generated by the cooling fan 11 will flow along the wall along the tilt direction of the second air guide plate 132, so that the airflow can flow more smoothly to the memory 400, power module 600, etc. at the lower 1U height in the chassis 100, so that the memory 400 and the power module 600 can be better cooled. At the same time, the first air guide plate 131 and the second air guide plate 132 cooperate up and down, so that the airflow generated by the cooling fan 11 can flow more smoothly downstream, solving the problem of wind trapping on the outlet side of the cooling fan 11, and further reducing the air volume loss.

[0055] Optionally, see Figure 4 and Figure 5 The fan assembly 1 also includes a handle structure 14, which is rotatably connected to the fan compartment 12, and a first air guide plate 131 is arranged on the handle structure 14, and the handle structure 14 can be switched between a first position where the first air guide plate 131 is in an air guiding state and a second position where the handle structure 14 is in a lifting state. When installing and disassembling the fan assembly 1, the fan assembly 1 can be conveniently transferred through the handle structure 14, thereby improving the efficiency of assembly and disassembly. The first air guide plate 131 and the handle structure 14 are arranged as one body, which can increase the strength of the handle structure 14 without affecting the air guiding function of the first air guide plate 131, and can also reduce the number of parts and simplify the processing and assembly processes of the fan assembly 1.

[0056] Further, see Figure 3 and Figure 4The handle structure 14 includes a crossbeam 141 and connecting plates 142 arranged at both ends of the crossbeam 141. The two connecting plates 142 are rotatably connected to the fan compartment 12 through a rotating shaft 143 to realize the rotation of the handle structure 14. A handle groove 1411 is recessed in the middle of the crossbeam 141, which is convenient for applying force through the handle groove 1411 to lift the crossbeam 141, making it easier to operate when transferring the fan assembly 1. An indication structure 1412 is respectively provided at both ends of the handle groove 1411 on the crossbeam 141, and the indication structure 1412 is used to indicate the lifting direction of the handle structure 14. Exemplarily, the indication structure 1412 is an arrow engraved on the crossbeam 141.

[0057] Optionally, a limiting structure is provided on the fan compartment 12, and the handle structure 14 can be limited to the second position by the limiting structure. The setting of the limiting structure can limit the rotation angle of the handle structure 14, avoid the handle structure 14 from shaking randomly during the transfer of the fan assembly 1, and improve the convenience of disassembly and assembly of the fan assembly 1 in the chassis 100.

[0058] For example, see Figure 3 The limiting structure is a limiting column 121 protruding from the side wall of the fan compartment 12, and a limiting groove 1421 is provided on the connecting plate 142 of the handle structure 14. When the handle structure 14 is rotated to the second position, the limiting groove 1421 is stuck in the limiting column 121, thereby preventing the handle structure 14 from continuing to rotate.

[0059] Optionally, see Figure 1 The heat dissipation device also includes a radiator 3, which includes a connected liquid cooling component 31 and a heat sink group 32. The liquid cooling component 31 is used to contact and transfer heat with the component to be dissipated, and the heat sink group 32 is located between the fan compartment 12 and the air guide cover 2. After the liquid cooling component 31 absorbs the heat of the component to be dissipated, it dissipates the heat of the coolant through the heat sink group 32, thereby achieving a liquid cooling effect. In this embodiment, the liquid cooling component 31 is installed on the CPU 300, and is used to perform liquid cooling and heat dissipation on the CPU 300. The air guide cover 2 is located above the radiator 3. Since the heat generation of the CPU 300 is relatively high, the CPU 300 is cooled simultaneously by liquid cooling and air cooling, which can ensure that the operating temperature of the CPU 300 is appropriate and improve the working reliability of the server.

[0060] Exemplarily, the liquid cooling component 31 includes a driving pump, a cooling pipeline and a base having a liquid cooling cavity. The heat sink group 32 includes a plurality of heat sinks arranged on the cooling pipeline. The liquid cooling cavity is filled with coolant. The liquid inlet end of the cooling pipeline is connected to the liquid outlet of the liquid cooling cavity. The liquid outlet end of the cooling pipeline is connected to the liquid inlet of the liquid cooling cavity. The driving pump is used to drive the coolant to circulate in the liquid cooling cavity and the cooling pipeline. The heat of the coolant in the cooling pipeline is consumed by heat exchange with the air through a plurality of heat sinks, thereby realizing liquid cooling heat dissipation.

[0061] Optionally, see Figure 6 , Figure 7 and Fig. 9 The heat sink 32 has a convex heat sink 321 on one side close to the fan compartment 12. The heat sink 321 is tilted toward the fan compartment 12 and is located on the side of the first air guide plate 131 facing away from the fan compartment 12. The first air guide plate 131 is provided with an air guide hole 1311 opposite to the heat sink 321. With this arrangement, part of the airflow generated by the cooling fan 11 can be blown from the air guide hole 1311 to the heat sink 321 of the heat sink 32, thereby taking the heat on the heat sink 32 out from above the first air guide plate 131, so that the heat taken out from the CPU 300 by the heat sink 32 flows to the top of the chassis 100 (such as Fig. 9 The hollow arrow above the middle air guide hole 1311 indicates the direction of the heat generated by the CPU 300, so as to prevent all the heat generated by the CPU 300 from flowing with the air flow to the downstream heat dissipation components (such as Figure 8 , Fig.10 and Fig.11 The power module 600, M.2 module 800, OCP module 900, etc. shown in the figure can prevent the downstream components to be cooled from overheating, thereby further improving the operation stability of the server.

[0062] In this embodiment, Figure 1 As shown, a plurality of heat sink fin groups 32 are arranged at intervals along the width direction of the chassis 100. Figure 4 As shown, a plurality of air guide holes 1311 are provided in the area corresponding to each heat sink group 32 on the first air guide plate 131 to ensure smooth air flow.

[0063] Exemplarily, the heat dissipation portion 321 has an inclination angle of 45 degrees and is parallel to the first air guide plate 131 , which can increase the contact area between the airflow flowing out of the air guide hole 1311 and the heat dissipation portion 321 , thereby improving the heat dissipation efficiency.

[0064] Optionally, see Figure 6 and Figure 7 The air guide cover 2 is provided with a heat dissipation duct, and the air inlet side of the heat dissipation duct is tilted to form an air guide slope 211 on the air guide cover 2. The heat sink group 32 is provided with a chamfer 322 on the side facing away from the fan compartment 12, and the chamfer 322 is opposite to the air guide slope 211. Figure 8 , Fig.10 and Fig.11 As shown, the heat dissipation duct is opposite to the CPU 300 and the memory 400 in the chassis 100, and the setting of the wind guide slope 211 can maximize the airflow along the solid wall below the air guide cover 2, reduce the air volume loss, and make the airflow flow more smoothly to the location where the CPU 300 and the memory 400 are located (such as Figures 1 to 12As shown in the figure, the hollow arrow in the figure indicates the airflow direction), thereby improving the heat dissipation efficiency of the CPU 300 and the memory 400. By machining the chamfered angle 322 on the heat sink group 32, the heat sink group 32 can be prevented from interfering with the wind guide slope 211. At the same time, the design of the chamfered angle 322 can reduce the resistance of the airflow to the wind guide cover 2, thereby ensuring the smoothness of the airflow.

[0065] Further, see Figure 7 The air guide slope 211 is provided with air outlet holes 2111 on both upper and lower sides of the axis direction of the cooling fan 11 . Figure 7 The dotted line in the figure is the axis line of the cooling fan 11. Since the largest heat in the chassis 100 comes from the CPU 300 and the memory 400 below the air guide cover 2, by setting air outlet holes 2111 on both sides of the axis line of the cooling fan 11 on the air guide slope 211, more air can enter the cooling air duct to better dissipate heat for the CPU 300 and the memory 400.

[0066] Exemplarily, two rows of air outlet holes 2111 are processed on the air guide slope 211, one row above and one row below the axis of the cooling fan 11, and each row includes multiple air outlets 2111 to ensure smooth ventilation.

[0067] Further, see Figure 7 The bottom of the air guide cover 2 has an arc transition at the air guide slope 211 to further reduce the air flow resistance, allowing the air flow generated by the cooling fan 11 to flow more smoothly along the bottom wall of the air guide cover 2.

[0068] Optionally, see Figure 6 A plurality of heat dissipation air ducts are arranged at intervals on the air guide cover 2. The plurality of heat dissipation air ducts include a first air duct 21, a second air duct 22, and a third air duct 23 arranged in sequence along the width direction of the chassis 100. A convex hull structure is formed between the first air duct 21 and the second air duct 22, and between the second air duct 22 and the third air duct 23. The convex hull structure is used to avoid the radiator 3 under the air guide cover 2.

[0069] Further, see Figure 6 The wind shielding structure 24 is disposed on the air outlet side of the first air duct 21 and the third air duct 23, and the wind shielding structure 24 is disposed in an inclined direction toward the second air duct 22. Since the airflow outflowing from the first air duct 21 and the third air duct 23 carries the heat generated by the CPU 300 and the memory 400, the airflow can be guided to the middle area downstream of the second air duct 22 by the wind shielding structure 24, thereby reducing the air temperature at the OCP module 900 and the power module 600 downstream of the first air duct 21 and the third air duct 23, and preventing the power module 600 and the OCP module 900 from overheating.

[0070] In this embodiment, Figure 6As shown, the wind shield structure 24 includes an upper wind shield 241 and a lower wind shield 242 respectively arranged on the upper and lower sides of the wind guide cover 2, the upper wind shield 241 can guide the airflow above the first heat dissipation air duct (third heat dissipation air duct) to the middle area, and the lower wind shield 242 can guide the airflow below the first heat dissipation air duct (third heat dissipation air duct) to the middle area, reducing the heat dissipation pressure at the OCP module 900 and the power module 600. Exemplarily, the inclination angles of the upper wind shield 241 and the lower wind shield 242 are both 45 degrees.

[0071] like Figure 1 and Figure 2 As shown, this embodiment also provides a server, including a chassis 100, a component to be cooled and the cooling device as described above, wherein the component to be cooled is located in the chassis 100, and the cooling device is used to cool the component to be cooled. Figure 1 and Figure 2 , a hard disk module 200, a fan assembly 1 and a heat sink 3 are sequentially arranged in the chassis 100 along the airflow direction, the CPU 300 is located below the heat sink 3, the motherboard 500 is located below the CPU 300, and the air guide 2 is located above the heat sink 3. The motherboard 500 is also provided with a memory 400 arranged side by side with the CPU 300, the tail end of the motherboard 500 is connected with a power module 600, an IO board 700 and an OCP module 900, and an M.2 module 800 is installed on the IO board 700. The components to be cooled include the above-mentioned CPU 300, memory 400, power module 600, M.2 module 800 and OCP module 900.

[0072] In a server using the heat dissipation device, the first air guide plate 131 and the second air guide plate 132 on the fan compartment 12 can guide the airflow to flow to the area where the heat dissipation components are located, thereby effectively dissipating the heat of the heat dissipation components, reducing the loss of air volume, and solving the problem that the air volume of the heat dissipation fan 11 is not fully utilized due to the existence of windless areas and windy areas, thereby meeting the heat dissipation requirements of the server without increasing the power of the heat dissipation fan 11 and reducing the heat dissipation energy consumption of the server. The heat dissipation channel on the air guide cover 2 can guide the airflow generated by the heat dissipation fan 11 to fully contact the CPU 300 and the memory 400, thereby improving the heat dissipation efficiency. The setting of the wind shield structure 24 can guide the airflow flowing through the CPU 300 and the memory 400 to the middle area of ​​the chassis 100, thereby reducing the air temperature at the OCP module 900 and the power module 600 located downstream of the first air duct 21 and the third air duct 23, thereby preventing the power module 600 and the OCP module 900 from overheating and improving the working stability of the server.

[0073] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A heat dissipation device, characterized in that: include: A fan assembly (1) comprises a heat dissipation fan (11) and a fan compartment (12), wherein the heat dissipation fan (11) is installed in the fan compartment (12), and the fan compartment (12) is provided with an air guide structure (13) on the air outlet side, and the air guide structure (13) is used to guide the airflow generated by the heat dissipation fan (11) to flow along a first preset direction; An air guide cover (2) is arranged on an air outlet path of the heat dissipation fan (11) and is used to guide the airflow generated by the heat dissipation fan (11) to flow along a second preset direction; A radiator (3), the radiator (3) comprising a liquid cooling component (31) and a heat sink group (32) connected to each other, the liquid cooling component (31) being used for contacting and transferring heat with a component to be cooled, and the heat sink group (32) being located between the fan compartment (12) and the air guide cover (2); The air guide cover (2) is provided with a heat dissipation air duct, the air inlet side of the heat dissipation air duct is tilted to form an air guide slope (211) on the air guide cover (2), and a chamfer (322) is provided on the side of the heat sink group (32) facing away from the fan compartment (12), and the chamfer (322) is opposite to the air guide slope (211); the air guide slope (211) is provided with air outlet holes (2111) on both upper and lower sides in the direction of the axis of the heat dissipation fan (11).

2. The heat dissipation device according to claim 1, characterized in that: The air guide structure (13) comprises a first air guide plate (131) arranged above the fan bin (12), wherein the first air guide plate (131) is arranged obliquely from the top of the fan bin (12) toward a direction close to the bottom of the fan bin (12).

3. The heat dissipation device according to claim 2, characterized in that: The air guide structure (13) further comprises a second air guide plate (132) arranged below the fan compartment (12), wherein the second air guide plate (132) is arranged to be inclined in a direction away from the first air guide plate (131).

4. The heat dissipation device according to claim 2, characterized in that: A heat dissipation portion (321) is protrudingly provided on a side of the heat sink group (32) close to the fan compartment (12); the heat dissipation portion (321) is arranged obliquely in a direction close to the fan compartment (12); and the heat dissipation portion (321) is located on a side of the first air guide plate (131) facing away from the fan compartment (12); and the first air guide plate (131) is provided with an air guide hole (1311) opposite to the heat dissipation portion (321).

5. The heat dissipation device according to claim 2, characterized in that: A plurality of heat dissipation air ducts are arranged at intervals on the air guide cover (2), the plurality of heat dissipation air ducts comprising a first air duct (21), a second air duct (22) and a third air duct (23) arranged in sequence along the width direction of the chassis (100), a wind shielding structure (24) being arranged on the air outlet side of the first air duct (21) and the third air duct (23), the wind shielding structure (24) being arranged inclined in a direction close to the second air duct (22).

6. The heat dissipation device according to any one of claims 2 to 5, characterized in that: The fan assembly (1) further comprises a handle structure (14), wherein the handle structure (14) is rotatably connected to the fan compartment (12), wherein the first air guide plate (131) is arranged on the handle structure (14), and wherein the handle structure (14) can be switched between a first position in which the first air guide plate (131) is in an air guiding state and a second position in which the handle structure (14) is in a lifting state.

7. A server, characterized in that It comprises a chassis (100), a component to be cooled and a heat dissipation device according to any one of claims 1 to 6, wherein the component to be cooled is located in the chassis (100), and the heat dissipation device is used to dissipate heat for the component to be cooled.

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