Composite cold plate-phase change cold storage coupled liquid cooling server heat dissipation device

Abstract

The invention discloses a composite cold plate-phase change cold storage coupled liquid cooling server heat dissipation device, which comprises a composite plate assembly, the composite plate assembly comprises a cold plate seat, a cold plate module, a phase change cooling module, an input port, an output port and an assembling mechanism, the cold plate seat is internally provided with a supporting and lining groove, and the supporting and lining groove is internally provided with a supporting and lining groove; the phase change cooling module is installed at the lower end of the cold plate module in an embedded mode, the input port and the output port are installed on the upper end face of the cold plate module, the lower end face of the cold plate module is movably connected with the upper end face of the supporting and lining groove, and the cold plate module is connected with an inner cavity of the cold plate base in a sleeved mode. A first connecting pipe is installed between the circulating pump and the output port and used for circulating cooling liquid in the circulating pump, and the cold storage assembly comprises a liquid storage box, a cover plate, cooling fins and a cooling fan. Through the coupling design of the composite cold plate and the phase change material, efficient absorption, dynamic buffering and multi-stage recovery of heat of the server are achieved, and the bottleneck of traditional liquid cooling heat dissipation is broken through.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid cooling server heat dissipation, and particularly to a liquid cooling server heat dissipation device with a composite cold plate - phase change energy storage coupling. Background Technique

[0002] In today's digital age, with the rapid development of information technology, servers, as the core devices for data processing and storage, have continuously improved their performance, but their power density has also increased sharply. Traditional air-cooled heat dissipation systems face many limitations when dealing with high-power servers. Air cooling relies on air as the heat transfer medium. Due to the low heat transfer coefficient of air, in order to achieve sufficient heat dissipation effects, high-speed rotating fans need to be equipped. This not only consumes a large amount of energy but also generates significant noise pollution, affecting the working environment of the computer room. Moreover, it is difficult for air-cooled systems to precisely control the working temperature of the server. During high-load operation, the server is prone to hardware failures and performance degradation due to overheating, reducing the reliability and service life of the server. Against this background, liquid cooling technology has emerged. Among them, the liquid cooling server system combining cold plate and phase change cooling has become a very promising solution. The cold plate uses high-thermal conductivity metal materials and is closely attached to the server's heating components. Through the internal microchannel or heat pipe structure, heat is efficiently conducted to the coolant, while phase change cooling takes advantage of the characteristic that a large amount of latent heat is absorbed during the phase change process of the coolant to further enhance the heat dissipation ability. This combination method fully utilizes the advantages of both, greatly improving the heat dissipation efficiency, effectively solving the heat dissipation problem of high-power servers. At the same time, compared with air-cooled systems, this liquid cooling system has lower energy consumption, less noise, can more precisely control the server temperature, and significantly improves the reliability and stability of the server, having broad application prospects in fields such as data centers and high-performance computing.

[0003] Currently, when cooling the heating components of servers such as CPUs or GPUs with cold plates, the heat dissipation efficiency of traditional cold plate liquid cooling technology is limited and difficult to meet the heat dissipation requirements of ultra-high power density servers. Therefore, we propose a liquid cooling server heat dissipation device with a composite cold plate - phase change energy storage coupling to solve this problem. Summary of the Invention

[0004] The purpose of the present invention is to provide a liquid cooling server heat dissipation device with a composite cold plate - phase change energy storage coupling to solve the problems raised in the above background technique.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions: A liquid cooling server heat dissipation device with a composite cold plate - phase change energy storage coupling, comprising: Composite plate assembly, the composite plate assembly includes a cold plate seat, a cold plate module, a phase change cooling module, an input port, an output port and an assembly mechanism. A support groove is provided inside the cold plate seat. The phase change cooling module is fitted and installed at the lower end of the cold plate module. The input port and the output port are respectively installed on the upper end surface of the cold plate module. The lower end surface of the cold plate module is movably connected to the upper end surface of the support groove, and the cold plate module is sleeved in the inner cavity of the cold plate seat; Circulation pump, a first connecting pipe is installed between the circulation pump and the output port for circulating the coolant in the pipe; Cold storage assembly, the cold storage assembly includes a liquid storage box, a cover plate, heat dissipation fins and a heat dissipation fan. The cover plate is movably connected to the upper end surface of the liquid storage box. The heat dissipation fins are fitted and fixed inside the cover plate. The heat dissipation fan is assembled and connected to the upper end surface of the heat dissipation fins through bolts. A second connecting pipe is installed between the liquid storage box and the output end of the circulation pump; Liquid delivery assembly, the liquid delivery assembly includes a heat exchange plate, a storage bin and a sealing plate. A flow guide groove is provided inside the heat exchange plate. The storage bin is fixedly installed on the upper end surface of the heat exchange plate. An installation groove is provided on the upper end surface of the storage bin. The sealing plate is respectively sleeved with installation bolts three around it. One end of the flow guide groove is connected to the liquid storage box through a third connecting pipe, and the other end of the flow guide groove is connected to the input port through a fourth connecting pipe.

[0006] Preferably, the assembly mechanism includes a threaded cylinder, an assembly frame and installation bolt one. The threaded cylinder is fixedly installed around the upper end surface of the cold plate seat. The assembly frame is arranged above the cold plate seat, and the assembly frame is movably connected to the upper end surface of the cold plate module. The installation bolt one passes through the assembly frame and is threadedly connected to the threaded cylinder.

[0007] Preferably, the assembly frame and the threaded cylinder form a fixable structure through the installation bolt one for assembling and fixing the cold plate module in the cold plate seat.

[0008] Preferably, a plurality of flow guide holes are provided at the lower end of the heat dissipation fins for circulating the coolant in the liquid storage box.

[0009] Preferably, the cover plate is respectively sleeved with installation bolts two around it, and the installation bolts two are threadedly connected to the upper end surface of the liquid storage box. The cover plate and the liquid storage box form an assemblable structure through the installation bolts two.

[0010] Preferably, the lower end of the heat dissipation fins is arranged inside the liquid storage box, and the upper end of the heat dissipation fins is arranged outside the liquid storage box for heat exchange and cooling of the coolant in the liquid storage box.

[0011] Preferably, the lower end of the inner cavity of the storage bin is connected to the upper end surface of the heat exchange plate, and the storage bin stores a phase change material.

[0012] Preferably, the lower end surface of the sealing plate is movably connected to the upper end surface of the installation groove, and the sealing plate is sleeved with the inner cavity of the storage bin.

[0013] Preferably, the third installation bolt is threadedly connected to the upper end surface of the storage bin, and the sealing plate and the storage bin form an assemblable structure through the third installation bolt.

[0014] The beneficial effects of the present invention are as follows: 1. In the present invention, compared with the insufficient heat dissipation efficiency of the traditional cold plate liquid cooling technology when facing ultra-high power density servers, the liquid cooling server system combining the cold plate and phase change cooling achieves a breakthrough in efficient heat dissipation. The cold plate is closely attached to the server heating elements, quickly conducts heat through high thermal conductivity materials, and then transfers the heat to the coolant through the internal microchannels. The phase change cooling module plays a role at the heat concentration point, and the coolant absorbs a large amount of latent heat during the phase change process, greatly enhancing the heat dissipation ability. This composite heat dissipation method enables the system to easily handle the large amount of heat generated by high-power servers, effectively solves the heat dissipation problem of traditional technologies in high-power scenarios, and ensures the stable operation of the server. 2. In the present invention, through the synergistic effect of the cold plate and phase change cooling, the working temperature of the server can be precisely adjusted. The cold plate can quickly take away the heat from the heating elements, while the phase change cooling module is quickly activated when the temperature is too high to absorb the excess heat. At the same time, the control system in the system monitors the server temperature in real time and adjusts the coolant flow rate and heat dissipation strategy according to the actual situation. Compared with the problem that traditional air-cooled systems are difficult to accurately control the temperature, this liquid cooling system can create a stable working environment for the server, reduce performance degradation and hardware failures caused by temperature fluctuations, and extend the service life of the server. 3. In the present invention, in terms of energy consumption, the liquid cooling server system has significant advantages. Different from traditional air-cooled systems that require a large amount of electricity to drive the fans, the liquid cooling system utilizes the high-efficiency heat transfer characteristics of the coolant, greatly reducing the energy consumption. The combination of the cold plate and phase change cooling improves the heat dissipation efficiency, enabling the system to require less energy to achieve the same heat dissipation effect. The power of the circulation pump is relatively low, further reducing the energy consumption. In the long run, it can save a large amount of operating costs for users such as data centers, which is in line with the development trend of energy conservation and environmental protection. 4. In the present invention, compared with the huge noise generated by the high-speed rotating fans in traditional air-cooled systems, which brings great trouble to the working environment of the server room, this liquid cooling server system abandons the high-speed fans and adopts the method of coolant circulation for heat dissipation, and the noise during operation is significantly reduced. It not only creates a quiet working environment for the computer room staff, which is beneficial to improving work efficiency and physical and mental health, but also reduces the impact of noise on the surrounding environment. 5. In the present invention, the composite plate assembly of the device can be flexibly set according to the number of components in the server. Just by connecting the input ports and output ports of multiple composite plate assemblies through connecting pipes, expansion can be easily achieved. This design enables the system to adapt to servers with different scales and power requirements. Whether it is a small enterprise server or a cluster server in a large data center, it can be customized according to the actual situation. The quick-release joints adopted in the system facilitate the installation and disassembly of pipelines, making it convenient for later maintenance and upgrading, ensuring that the system can operate stably for a long time and meet the changing business needs. Description of the Drawings

[0015] Figure 1 It is a schematic structural diagram of the liquid cooling server heat dissipation device with a composite cold plate - phase change energy storage coupling proposed by the present invention; Figure 2 It is an exploded structural diagram of the composite plate assembly in the present invention; Figure 3 It is an exploded bottom view structural diagram of the composite plate assembly in the present invention; Figure 4 It is a structural diagram of the energy storage component in the present invention; Figure 5 It is a structural diagram at the liquid delivery component in the present invention; Figure 6 It is a structural diagram of the cross-section of the heat exchange plate in the present invention.

[0016] In the figure: 1. Composite plate assembly; 101. Cold plate seat; 102. Lining groove; 103. Cold plate module; 104. Phase change cooling module; 105. Input port; 106. Output port; 107. Threaded cylinder; 108. Assembly frame; 109. First installation bolt; 2. Circulation pump; 3. Energy storage component; 301. Liquid storage box; 302. Cover plate; 303. Heat dissipation fins; 304. Flow guiding hole; 305. Second installation bolt; 306. Heat dissipation fan; 4. Liquid delivery component; 401. Heat exchange plate; 402. Flow guiding groove; 403. Storage bin; 404. Installation groove; 405. Sealing plate; 406. Third installation bolt; 5. First connecting pipe; 6. Second connecting pipe; 7. Third connecting pipe; 8. Fourth connecting pipe. Detailed Embodiment

[0017] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0018] Refer to Figure 1 - Figure 6 , the liquid cooling server heat dissipation device with a composite cold plate - phase change energy storage coupling includes: Composite plate assembly 1, the composite plate assembly 1 includes a cold plate base 101, a cold plate module 103, a phase change cooling module 104, an input port 105, an output port 106 and an assembly mechanism. A support groove 102 is provided inside the cold plate base 101. The phase change cooling module 104 is fitted and installed at the lower end of the cold plate module 103. The input port 105 and the output port 106 are respectively installed on the upper end face of the cold plate module 103. The lower end face of the cold plate module 103 is movably connected to the upper end face of the support groove 102, and the cold plate module 103 is sleeved in the inner cavity of the cold plate base 101; The size of the cold plate module 103 is 200mm×150mm×15mm, the coolant flow rate is 1L / min - 5L / min, the coolant temperature is 20°C - 25°C at the inlet and 30°C - 35°C at the outlet; The phase change material of the phase change cooling module 104 is paraffin or gallium-based alloy, the phase change temperature is 30°C - 40°C, the size of the phase change cooling module 104 is 50mm×50mm×10mm, the paraffin uses an expanded graphite / carbon nanotube composite matrix (thermal conductivity ≥ 8W / (m·K)), and the phase change latent heat is 180 - 220kJ / kg; the gallium-based alloy is a Ga-In-Sn eutectic alloy (melting point 13°C), and the thermal conductivity ≥ 40W / (m·K); The preset position of the phase change cooling module 104 is matched with the CPU or GPU of the server, so that the phase change cooling module 104 can be fitted to the CPU or GPU during installation; The composite plate assembly 1 can be set to different numbers according to the number of components of the server. Just connect the input port 105 and the output port 106 between multiple composite plate assemblies 1 through a connecting pipe; Circulation pump 2, a first connecting pipe 5 is installed between the circulation pump 2 and the output port 106 for circulating the coolant in the pipe; The pump power of the circulation pump 2 is 10W - 50W, and the circulating coolant is deionized water or fluorinated liquid; Cold storage assembly 3, the cold storage assembly 3 includes a liquid storage box 301, a cover plate 302, heat dissipation fins 303 and a heat dissipation fan 306. The cover plate 302 is movably connected to the upper end face of the liquid storage box 301. The heat dissipation fins 303 are fitted and fixed inside the cover plate 302. The heat dissipation fan 306 is assembled and connected to the upper end face of the heat dissipation fins 303 through bolts. A second connecting pipe 6 is installed between the liquid storage box 301 and the output end of the circulation pump 2; The liquid storage box 301 is used to store the coolant deionized water or fluorinated liquid. When the coolant circulates through the liquid storage box 301 in the system, the coolant can be cooled by the heat dissipation fins 303. At the same time, the heat dissipation fan 306 arranged on the upper end face of the heat dissipation fins 303 can improve the heat dissipation effect of the heat dissipation fins 303 and ensure the heat exchange and cooling effect of the coolant; The fin surface is micro-milled to form a V-shaped vortex generator (depth 0.3 mm / angle 60°). The diversion hole 304 has a Venturi constriction structure (inlet Φ8 mm / throat Φ5 mm). At a flow velocity of 2 m / s, it can induce a Karman vortex street, increasing the convective heat transfer coefficient to 3800 W / (m²·K), a 45% increase compared to flat fins. The liquid delivery assembly 4 includes a heat exchange plate 401, a storage bin 403, and a sealing plate 405. A diversion groove 402 is provided in the inner cavity of the heat exchange plate 401. The storage bin 403 is fixedly installed on the upper end surface of the heat exchange plate 401. An installation groove 404 is provided on the upper end surface of the storage bin 403. Installation bolts three 406 are respectively sleeved around the sealing plate 405. A third connecting pipe 7 is installed between one end of the diversion groove 402 and the liquid storage box 301, and a fourth connecting pipe 8 is installed between the other end of the diversion groove 402 and the input port 105. The diversion groove 402 is designed as a double-helix flow channel with a pitch of 12 mm and a groove depth of 4 mm, forming a 3-mm micro-gap with the bottom plate of the storage bin 403. When the coolant flows through, countercurrent heat transfer occurs, and the melting front advancement rate of the phase change material reaches 0.8 mm / s. At a flow rate of 5 L / min, the coolant can be additionally cooled by 4 - 6 °C at this stage, and the system COP is increased by 22%. Before the heat-exchanged and cooled coolant enters the cold plate module 103, it can be cooled again through the diversion groove 402 in the heat exchange plate 401. During long-term operation of the system, the temperature of the coolant during circulation can be reduced. Moreover, the storage bin 403 on the upper end surface of the heat exchange plate 401 is filled with a phase change material to improve the heat exchange effect of the heat exchange plate 401, ensuring that the temperature of the coolant entering the composite plate assembly 1 meets the heat exchange and cooling effect during long-term operation.

[0019] The pipe diameters of the first connecting pipe 5, the second connecting pipe 6, the third connecting pipe 7, and the fourth connecting pipe 8 are 6 mm - 10 mm. At the same time, the structure of this device for assembling and connecting pipes is a quick-release joint, which is suitable for pipe diameters of Φ6 - 10 mm.

[0020] In this embodiment, the assembly mechanism includes a threaded cylinder 107, an assembly frame 108, and a first installation bolt 109. The threaded cylinder 107 is fixedly installed around the upper end surface of the cold plate base 101. The assembly frame 108 is arranged above the cold plate base 101, and the assembly frame 108 is movably connected to the upper end surface of the cold plate module 103. The first installation bolt 109 passes through the assembly frame 108 and is threadedly connected to the threaded cylinder 107. The cold plate base 101 and the cold plate module 103 can be conveniently assembled through the mounting bolt 109. A beryllium copper alloy shim (elastic modulus 128 GPa) with a thickness of 0.1 mm is provided between the mounting frame 108 and the cold plate module 103. When the cold plate expands by 0.15 mm due to heat, the shim can provide an adaptive pressing force of 0.8 - 1.2 kN, avoiding interface delamination caused by the failure of the bolt pre-tightening force. This design enables the contact thermal resistance fluctuation to be < 10% under thermal cycling conditions; In this embodiment, the mounting frame 108 and the threaded barrel 107 form a fixable structure through the mounting bolt 109 for assembling and fixing the cold plate module 103 inside the cold plate base 101.

[0021] In this embodiment, a plurality of diversion holes 304 are opened at the lower end of the heat dissipation fin 303 for circulating the coolant in the liquid storage box 301, enabling the coolant to flow smoothly in the liquid storage box 301.

[0022] In this embodiment, mounting bolts 305 are respectively sleeved around the cover plate 302, and the mounting bolts 305 are threadedly connected to the upper end surface of the liquid storage box 301. The cover plate 302 and the liquid storage box 301 form an assemblable structure through the mounting bolts 305, enabling the coolant in the liquid storage box 301 to be replaced later.

[0023] In this embodiment, the lower end of the heat dissipation fin 303 is located inside the cavity of the liquid storage box 301, and the upper end of the heat dissipation fin 303 is located outside the liquid storage box 301 for heat exchange and cooling of the coolant in the liquid storage box 301.

[0024] In this embodiment, the lower end of the inner cavity of the storage bin 403 is connected to the upper end surface of the heat exchange plate 401, and the storage bin 403 stores a phase change material.

[0025] In this embodiment, the lower end surface of the sealing plate 405 is movably connected to the upper end surface of the mounting groove 404, and the sealing plate 405 is sleeved inside the inner cavity of the storage bin 403.

[0026] In this embodiment, the mounting bolt 406 is threadedly connected to the upper end surface of the storage bin 403, and the sealing plate 405 and the storage bin 403 form an assemblable structure through the mounting bolt 406.

[0027] Through the dynamic coupling of cold plate liquid cooling and phase change energy storage, the device constructs a multi-level thermal buffering mechanism. The cold plate module 103 directly and efficiently absorbs the basic heat of the chip, while the embedded phase change material (PCM) actively melts and dissipates heat in response to instantaneous power spikes (such as CPU / GPU burst loads), significantly suppressing temperature fluctuations. When the external cooling system has a response delay or encounters a short-term failure, the latent heat of phase change of the PCM can act as a "thermal inertia body", providing a critical time window for system maintenance or standby power startup, and preventing the server from crashing due to overheating. This active thermal buffering design fundamentally solves the pain point of the insufficient adaptability of traditional liquid cooling systems to sudden heat loads; The directional mounting design of the phase change module (precisely matching the CPU / GPU hot spots) and the multi-level thermal backup architecture significantly improve the fault tolerance ability. The front-end PCM module copes with chip-level thermal shocks, and the rear-end energy storage component 3 enhances heat transfer through the phase change material, forming a double-insurance mechanism. Even if the circulation pump 2 or external heat dissipation fails accidentally, the continuous heat absorption of the PCM can still maintain the key components within a safe temperature range. The adaptive compression design of the cold plate assembly mechanism (such as beryllium copper alloy shrapnel) can compensate for thermal expansion deformation, ensuring the interface contact stability during long-term operation and avoiding sudden increases in thermal resistance caused by mechanical looseness, guaranteeing the continuity of heat dissipation at the hardware level; The system explores energy-saving potential through the intelligent scheduling of latent heat of phase change and innovative flow channel design. The combination of the V-shaped eddy current generator and the Venturi diversion holes 304 in the energy storage component 3 induces highly efficient turbulent flow to enhance heat transfer. The double-helical flow channel and the micro-gap countercurrent heat exchange structure of the liquid supply component 4 maximize the recovery of the remaining cold of the coolant. The PCM stores cold energy during low-load or low-temperature periods and releases it during high-load periods to reduce the burden of active refrigeration. This "dynamic cold storage - on-demand cold release" mechanism reduces the dependence on the external refrigeration system, especially suitable for scenarios using natural cold sources or valley electricity for cold storage, systematically reducing the PUE (Power Usage Effectiveness) of the data center; The modular architecture (composite board component 1 + quick-release joint) endows the system with elastic expansion ability. A single cold plate component can independently serve a specific chip, and multiple components can be flexibly adapted to different numbers and powers of server components through parallel pipelines. The phase change module is compact in size (50mm×50mm) and can be precisely embedded into the gaps of high-density electronic devices, solving the problem of space occupation by traditional radiators. The quick-release joint supports rapid pipe laying and maintenance for pipe diameters of Φ6 - 10mm, significantly simplifying the cluster deployment process. This design provides an expandable heat dissipation foundation for the large-scale integration of future ultra-high-power chips (such as AI acceleration cards); The device innovatively constructs a four-level collaborative heat dissipation chain of "chip - cold plate - energy storage - heat exchange": Primary cooling: The micro-channel liquid cooling in the cold plate directly and efficiently conducts away the heat of the chip; Secondary buffering: The PCM module melts to absorb instantaneous thermal shocks; Tertiary recycling: The cold storage component achieves efficient waste heat emission through a vortex generator and forced air cooling; Quaternary enhancement: The double spiral flow path of the liquid delivery component uses a phase change material to pre-cool the recirculating coolant.

[0028] This hierarchical thermal management keeps the coolant in the optimal temperature range during circulation, avoiding the overall efficiency decay caused by the single-point heat dissipation bottleneck in traditional liquid cooling, especially suitable for data with 7×24-hour continuous operation.

[0029] In this embodiment, during use, first, according to the number of components required in the server, an equal number of cold plate seats 101 are installed. The cold plate seats 101 are assembled on the server component board by bolts. The cold plate module 103 is placed in the support groove 102. The assembly frame 108 is placed on the surface of the cold plate module 103, and the assembly frame 108 is fastened by the installation bolt 109, so as to install the cold plate module 103 between the cold plate seat 101, and make the phase change cooling module 104 embedded at the bottom of the cold plate module 103 fit with the heat-generating components CPU or GPU on the component board; Put the phase change material into the storage bin 403, and then install the sealing plate 405 on the upper end of the storage bin 403 through the installation bolt 406; Start the circulation pump 2 through the control device, so that the coolant is sent into the cold plate module 103 from the input port 105. The cold plate module 103 and the coolant absorb the heat of the server heat-generating components. The phase change cooling module 104 absorbs heat near the component with the largest heat generation. The temperature of the coolant rises after flowing through the composite plate assembly 1, and is sent into the liquid storage box 301 by the circulation pump 2. The coolant exchanges heat and cools down by contacting the multiple heat dissipation fins 303 arranged in the liquid storage box 301, and is sent into the heat exchange plate 401 from the third connecting pipe 7, and is cooled down again through the diversion groove 402 in the heat exchange plate 401. The storage bin 403 on the upper end surface of the heat exchange plate 401 is filled with the phase change material to improve the heat exchange effect of the heat exchange plate 401. The cooled coolant is circulated and sent into the composite plate assembly 1 again.

[0030] The above has introduced in detail the liquid cooling server heat dissipation device with a composite cold plate - phase change cold storage coupling provided by the present invention. Specific embodiments are used in this article to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A liquid cooling server heat dissipation device with a composite cold plate - phase change energy storage coupling, characterized in that, Comprising: A composite plate assembly (1), the composite plate assembly (1) including a cold plate seat (101), a cold plate module (103), a phase change cooling module (104), an input port (105), an output port (106), and an assembly mechanism. A lining groove (102) is formed inside the cold plate seat (101). The phase change cooling module (104) is fitted and installed at the lower end of the cold plate module (103). The input port (105) and the output port (106) are respectively installed on the upper end surface of the cold plate module (103). The lower end surface of the cold plate module (103) is movably connected to the upper end surface of the lining groove (102), and the cold plate module (103) is sleeved in the inner cavity of the cold plate seat (101); A circulation pump (2), with a first connecting pipe (5) installed between the circulation pump (2) and the output port (106) for circulating the coolant in the pipe; A cold storage assembly (3), the cold storage assembly (3) including a liquid storage box (301), a cover plate (302), heat dissipation fins (303), and a heat dissipation fan (306). The cover plate (302) is movably connected to the upper end surface of the liquid storage box (301). The heat dissipation fins (303) are fitted and fixed inside the cover plate (302). The heat dissipation fan (306) is assembled and connected to the upper end surface of the heat dissipation fins (303) through bolts. A second connecting pipe (6) is installed between the liquid storage box (301) and the output end of the circulation pump (2); A liquid delivery assembly (4), the liquid delivery assembly (4) including a heat exchange plate (401), a material storage bin (403), and a sealing plate (405). A flow guide groove (402) is formed inside the heat exchange plate (401). The material storage bin (403) is fixedly installed on the upper end surface of the heat exchange plate (401). An installation groove (404) is formed on the upper end surface of the material storage bin (403). The sealing plate (405) is respectively sleeved with installation bolts three (406) around it. One end of the flow guide groove (402) is installed with a third connecting pipe (7) between it and the liquid storage box (301), and the other end of the flow guide groove (402) is installed with a fourth connecting pipe (8) between it and the input port (105).

2. The liquid cooling server heat dissipation device with a combined cold plate - phase change energy storage coupling according to claim 1, characterized in that, The assembly mechanism includes a threaded cylinder (107), an assembly frame (108), and installation bolts one (109). The threaded cylinder (107) is fixedly installed around the upper end surface of the cold plate seat (101). The assembly frame (108) is arranged above the cold plate seat (101), and the assembly frame (108) is movably connected to the upper end surface of the cold plate module (103). The installation bolts one (109) pass through the assembly frame (108) and are threadedly connected to the threaded cylinder (107).

3. The liquid cooling server heat dissipation device with a composite cold plate - phase change energy storage coupling according to claim 2, characterized in that, The assembly frame (108) forms a fixable structure with the threaded cylinder (107) through the installation bolts one (109) for assembling and fixing the cold plate module (103) inside the cold plate seat (101).

4. The liquid cooling server heat dissipation device with a composite cold plate - phase change energy storage coupling according to claim 1, characterized in that A plurality of flow guide holes (304) are formed at the lower end of the heat dissipation fins (303) for circulating the coolant in the liquid storage box (301).

5. The liquid cooling server heat dissipation device with a composite cold plate - phase change energy storage coupling according to claim 1, characterized in that The periphery of the cover plate (302) is respectively sleeved with second mounting bolts (305), and the second mounting bolts (305) are threadedly connected to the upper end surface of the liquid storage box (301). The cover plate (302) and the liquid storage box (301) form an assemblable structure through the second mounting bolts (305).

6. The liquid cooling server heat dissipation device with a combined cold plate - phase change energy storage coupling according to claim 1, characterized in that The lower end of the heat dissipation fins (303) is arranged in the inner cavity of the liquid storage box (301), and the upper end of the heat dissipation fins (303) is arranged at the outer end of the liquid storage box (301) for heat exchange and cooling of the coolant in the liquid storage box (301).

7. The liquid cooling server heat dissipation device with combined cold plate - phase change energy storage coupling according to claim 1, characterized in that, The lower end of the inner cavity of the material storage bin (403) is connected to the upper end surface of the heat exchange plate (401), and the material storage bin (403) stores a phase change material.

8. The liquid cooling server heat dissipation device with a combined cold plate - phase change energy storage coupling according to claim 1, characterized in that, The lower end surface of the sealing plate (405) is movably connected to the upper end surface of the mounting groove (404), and the sealing plate (405) is sleeved in the inner cavity of the material storage bin (403).

9. The liquid cooling server heat dissipation device with composite cold plate - phase change energy storage coupling according to claim 1, characterized in that, The third mounting bolts (406) are threadedly connected to the upper end surface of the material storage bin (403), and the sealing plate (405) and the material storage bin (403) form an assemblable structure through the third mounting bolts (406).

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