Antioxidant, backlight module and manufacturing method thereof

Abstract

The present invention discloses an antioxidant, a backlight module and a method for making the same. The antioxidant comprises a film-forming component and a volatilization-inhibiting additive, wherein the film-forming component comprises at least one of a substituted or unsubstituted acrylic resin, isopropanolamine, and imidazoline, and the boiling point of the volatilization-inhibiting additive is greater than the boiling point of the film-forming component. The present invention can slow down the volatilization rate of the volatile antioxidant; furthermore, during the application process, the antioxidant can be applied to the terminal of the backlight module and can gradually volatilize during the manufacturing process, that is, reducing the oxidation of the terminal and preventing the antioxidant from affecting the binding connection of the terminal.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to an antioxidant, a backlight module and a manufacturing method thereof. Background Art

[0002] Mini LED (micro light-emitting diode), a new technology regarded by many manufacturers as the next-generation display, has the advantages of consuming much less power than liquid crystal displays (LCD) and having a brightness better than organic light-emitting diode displays (OLED).

[0003] In the current manufacturing process of Mini LED backlight modules, it is necessary to apply an antioxidant on the terminals welded to the LEDs to prevent the terminals from oxidizing during the manufacturing process and affecting the connection effect of the terminals. However, if conventional antioxidants are applied to the binding terminals used to bind the driving components, the binding terminals will not be able to be bound and connected to the driving components. Therefore, the related art does not apply antioxidants on the binding terminals, which makes the binding terminals easily oxidized during the manufacturing process, such as high-temperature processes, affecting the binding effect. Summary of the invention

[0004] The embodiment of the present invention provides an antioxidant, a backlight module and a manufacturing method thereof, which can slow down the volatilization rate of the antioxidant.

[0005] An embodiment of the present invention provides an antioxidant, which includes a film-forming component and a volatility-inhibiting additive, wherein the film-forming component includes at least one of a substituted or unsubstituted acrylic resin, isopropanolamine, and imidazoline, and the boiling point of the volatility-inhibiting additive is greater than the boiling point of the film-forming component.

[0006] In one embodiment of the present invention, the volatilization suppression additive includes a lead complex and / or liquid paraffin.

[0007] In one embodiment of the present invention, the antioxidant further comprises a solvent, the solvent comprises an alcohol solvent, and the volatilization inhibition additive further comprises calcium chloride.

[0008] In one embodiment of the present invention, the boiling point of the film-forming component is less than or equal to 200°C.

[0009] In one embodiment of the present invention, the mass content of the film-forming component in the antioxidant is 40% to 50%, and the mass content of the volatility-inhibiting additive in the antioxidant is 11% to 19%.

[0010] According to the above-mentioned purpose of the present invention, an embodiment of the present invention further provides a method for manufacturing a backlight module, which is manufactured by using the antioxidant. The method for manufacturing the backlight module comprises the following steps:

[0011] forming a first terminal and a second terminal on the substrate;

[0012] Applying the antioxidant on the first terminal and the second terminal to form a first protective film on the first terminal and a second protective film on the second terminal;

[0013] Connecting the light emitting element to the first terminal and removing the second protective film;

[0014] Connect the driving component to the second terminal.

[0015] In an embodiment of the present invention, the step of connecting the light emitting element to the first terminal and removing the second protective film comprises:

[0016] The light emitting component is welded to the first terminal, and the first protective film and the second protective film are removed, and the light emitting component is electrically connected to the first terminal, wherein the removal rate of the second protective film is lower than the removal rate of the first protective film.

[0017] In one embodiment of the present invention, in the step of welding the light emitting element to the first terminal and removing the first protective film and the second protective film:

[0018] The boiling point of the volatilization suppressing additive in the second protective film is greater than or equal to a first temperature, and the first temperature is a soldering temperature of the light emitting element.

[0019] According to the above-mentioned purpose of the present invention, an embodiment of the present invention further provides a backlight module, and the backlight module is manufactured by using the manufacturing method of the backlight module.

[0020] In one embodiment of the present invention, the surface of the first terminal and / or the second terminal contains Pb 2+ , Pb, Al 3+ , Pb 2+ At least one of a eutectic alloy with a terminal metal, a carboxyl group, and a carbon-carbon double bond, and the material of the first terminal and the material of the second terminal include the terminal metal.

[0021] The beneficial effects of the present invention are as follows: the present invention arranges a film-forming component and a volatilization-inhibiting additive in the antioxidant, and the film-forming component includes at least one of a substituted or unsubstituted acrylic resin, isopropanolamine, and imidazoline, so that the antioxidant is a volatile antioxidant, and the boiling point of the volatilization-inhibiting additive is greater than the boiling point of the film-forming component, and thus the volatilization-inhibiting additive can slow down the volatilization rate of the antioxidant; and then during the application process, the antioxidant can be coated on the terminal of the backlight module and can gradually volatilize during the manufacturing process, that is, the oxidation of the terminal is reduced, and the antioxidant can be prevented from affecting the binding connection of the terminal. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The technical solutions and other beneficial effects of the present invention will be made apparent by describing in detail the specific embodiments of the present invention in conjunction with the accompanying drawings.

[0023] Figure 1 A flow chart of a method for manufacturing a backlight module provided by an embodiment of the present invention;

[0024] Figure 2 A structural schematic diagram of a backlight module provided by an embodiment of the present invention;

[0025] Figure 3 Another structural schematic diagram of a backlight module provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0027] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0028] An embodiment of the present invention provides an antioxidant, which includes a film-forming component and a volatility-inhibiting additive, wherein the film-forming component includes at least one of a substituted or unsubstituted acrylic resin, isopropanolamine, and imidazoline, and the boiling point of the volatility-inhibiting additive is greater than the boiling point of the film-forming component.

[0029] During the implementation and application process, the embodiment of the present invention arranges a film-forming component and a volatilization inhibitor additive in the antioxidant, and the film-forming component includes at least one of a substituted or unsubstituted acrylic resin, isopropanolamine, and imidazoline, so that the antioxidant is a volatile antioxidant, and the boiling point of the volatilization inhibitor additive is greater than the boiling point of the film-forming component, and thus the volatilization inhibitor additive can slow down the volatilization rate of the antioxidant; and then during the application process, the antioxidant can be coated on the terminal of the backlight module and can gradually volatilize during the manufacturing process, that is, reducing the oxidation of the terminal and preventing the antioxidant from affecting the binding connection of the terminal.

[0030] The antioxidant provided by the embodiment of the present invention is used to improve the phenomenon that the binding terminal in the related art is easily oxidized during the manufacturing process. The antioxidant includes a film-forming component and a volatilization inhibition additive.

[0031] Further, the film-forming component may include at least one of a substituted or unsubstituted acrylic resin, isopropanolamine, and imidazoline. In one embodiment, the boiling point of the film-forming component is less than or equal to 200° C., which can increase the volatility of the antioxidant, so that the antioxidant provided by the embodiment of the present invention is a volatile oxidant, which can be volatilized by the temperature of the high-temperature process during the process, so that after the antioxidant provided by the embodiment of the present invention is applied, it can be volatilized and removed in the subsequent process.

[0032] Optionally, the boiling point of the film-forming component may be greater than or equal to 100°C and less than or equal to 200°C, for example, 110°C, 120°C, 130°C, 140°C, 150°C, 160°C, 170°C, 180°C, or 190°C.

[0033] In one embodiment, the volatilization inhibition additive may include a lead complex and / or liquid paraffin, which can adjust the high temperature resistance of the antioxidant to slow down the volatilization rate of the antioxidant, thereby preventing the antioxidant from being quickly removed after coating, resulting in failure to play an effective anti-oxidation role.

[0034] In one embodiment, the mass content of the film-forming component in the antioxidant is 40% to 50%, and the mass content of the volatilization inhibitor additive in the antioxidant is 11% to 19%.

[0035] Further, the lead-containing complex may include lead acetate.

[0036] It should be noted that the antioxidant may further include a solvent, and the volatilization suppressing additive may further include calcium chloride, wherein the solvent may include an alcohol solvent, such as ethanol.

[0037] In one embodiment, the antioxidant includes substituted or unsubstituted acrylic resin, ethanol solvent, lead acetate, liquid paraffin and calcium chloride.

[0038] In one embodiment, the mass content of substituted or unsubstituted acrylic resin in the antioxidant is 40% to 50%, for example, 40%, 42%, 44%, 46%, 48% or 50%; the mass content of ethanol solvent in the antioxidant is 35% to 45%, for example, 35%, 37%, 39%, 41%, 43% or 45%; the content of lead acetate in the antioxidant is 8% to 12%, for example, 8%, 9%, 10%, 11% or 12%; the content of liquid paraffin in the antioxidant is 2% to 4%, for example, 2%, 3% or 4%; the mass content of calcium chloride in the antioxidant is 1% to 3%, for example, 1%, 2% or 3%.

[0039] In one embodiment of the present invention, an antioxidant component and a preparation method thereof are provided, wherein the antioxidant comprises 45% by mass of methacrylic resin, 40% by mass of ethanol, 10% by mass of lead acetate, 3% by mass of liquid paraffin, and 2% by mass of calcium chloride. Specifically, the methacrylic resin, lead acetate, liquid paraffin, and calcium chloride can be mixed and dissolved in ethanol to obtain a mixture, that is, the antioxidant.

[0040] In another embodiment of the present invention, an antioxidant component and a preparation method thereof are provided, wherein the antioxidant comprises 43% by mass of methacrylic resin, 42% by mass of ethanol, 10% by mass of lead acetate, 3% by mass of liquid paraffin, and 2% by mass of calcium chloride. Specifically, the methacrylic resin, lead acetate, liquid paraffin, and calcium chloride can be mixed and dissolved in ethanol to obtain a mixture, that is, the antioxidant.

[0041] In another embodiment of the present invention, an antioxidant component and a preparation method thereof are provided, wherein the antioxidant comprises 43% by mass of methacrylic resin, 43% by mass of ethanol, 8% by mass of lead acetate, 3% by mass of liquid paraffin, and 3% by mass of calcium chloride. Specifically, the methacrylic resin, lead acetate, liquid paraffin, and calcium chloride can be mixed and dissolved in ethanol to obtain a mixture, that is, the antioxidant.

[0042] As described above, the embodiment of the present invention arranges a film-forming component and a volatilization inhibitor additive in the antioxidant, and the film-forming component includes at least one of a substituted or unsubstituted acrylic resin, isopropanolamine, and imidazoline, so that the antioxidant is a volatile antioxidant, and the boiling point of the volatilization inhibitor additive is greater than the boiling point of the film-forming component, and thus the volatilization inhibitor additive can slow down the volatilization rate of the antioxidant; and then during the application process, the antioxidant can be coated on the terminals of the backlight module and can gradually volatilize during the manufacturing process, thereby reducing the oxidation of the terminals and preventing the antioxidant from affecting the binding connection of the terminals.

[0043] Furthermore, the application process of the antioxidant provided in the embodiment of the present invention is described below in conjunction with specific embodiments. The embodiment of the present invention also provides a method for manufacturing a backlight module, in which the antioxidant described in the above embodiment needs to be used.

[0044] A first terminal and a second terminal are formed on the substrate.

[0045] An antioxidant is applied to the first terminal and the second terminal to form a first protective film on the first terminal and a second protective film on the second terminal.

[0046] The light emitting element is connected to the first terminal, and the second protective film is removed.

[0047] Connect the drive assembly to the second terminal.

[0048] The embodiment of the present invention can coat the antioxidant on the second terminal of the backlight module, and can remove the second protective film formed on the second terminal during the manufacturing process and volatilize gradually, thereby reducing oxidation of the second terminal and preventing the antioxidant from affecting the binding connection of the second terminal.

[0049] Specifically, please combine Figure 1 , Figure 2 and Figure 3 The manufacturing method of the backlight module comprises the following steps:

[0050] S10 , forming a first terminal 11 and a second terminal 12 on the substrate 10 .

[0051] In step S10 , a substrate 10 is first provided, and the substrate 10 may be a PCB circuit board or a glass substrate, which is not limited here. The substrate 10 includes a device mounting surface 101 and a binding side 102 located at least on one side of the device mounting surface 101 .

[0052] A first terminal 11 is formed on the device mounting surface 101 of the substrate 10, and a second terminal 12 is formed on the binding side 102 of the substrate 10. In addition, a driving circuit may be formed on the substrate 10, and the driving circuit may connect the first terminal 11 and the second terminal 12 to achieve signal control and transmission.

[0053] In one embodiment, the material of the first terminal 11 and the material of the second terminal 12 may both include copper or aluminum.

[0054] It should be noted that the first terminal 11 can be used for connecting the light-emitting element, and the second terminal 12 can be used for binding the driving component.

[0055] S20 , applying an antioxidant 20 on the first terminal 11 and the second terminal 12 to form a first protective film 21 on the first terminal 11 and a second protective film 22 on the second terminal 12 .

[0056] In step S20, the antioxidant 20 provided in the above embodiment is coated on the first terminal 11 and the second terminal 12, so that a first protective film 21 can be formed on the first terminal 11, and a second protective film 22 can be formed on the second terminal 12. The first protective film 21 can cover the entire exposed surface of the first terminal 11, and the second protective film 22 can cover the entire exposed surface of the second terminal 12, so as to block water and oxygen from the first terminal 11 and the second terminal 12, thereby preventing the first terminal 11 and the second terminal 12 from being oxidized.

[0057] In one embodiment, the antioxidant 20 may also be used to coat the entire surface of the substrate 10 .

[0058] Then, white oil may be coated on the device mounting surface 101 of the substrate 10 , and windows may be opened in the white oil to form a plurality of openings, and the plurality of openings may be arranged in one-to-one correspondence with the plurality of first terminals 11 .

[0059] S30 , connecting the light emitting element to the first terminal 11 , and removing the second protective film 22 .

[0060] In step S30, solder paste may be formed on the first terminal 11, and then the light-emitting element and the first terminal 11 may be soldered together by the solder paste. It is understandable that during the soldering process of the light-emitting element and the first terminal 11, due to the high temperature, the first protective film 21 on the first terminal 11 will be directly reacted to remove the first protective film 21, so that the first terminal 11 and the light-emitting element are electrically connected; and the second protective film 22 will also be affected by the high temperature and begin to volatilize, and under the action of the volatilization inhibitor additive, the volatilization process of the second protective film 22 is gradual and slow, and then in the process of removing the second protective film 22, the rate at which the second protective film 22 is removed is slowed down, so that the second terminal 12 will not be exposed too early and will not be oxidized to a large extent in the high-temperature process.

[0061] The removal rate of the second protective film 22 is lower than the removal rate of the first protective film 21 .

[0062] Optionally, the light-emitting element may include an LED lamp, for example, a Mini LED lamp.

[0063] In the welding process of the light emitting element and the first terminal 11, a reflow soldering method may be specifically adopted, and the entire reflow soldering process is divided into three stages:

[0064] The first stage is the heating process, which takes about 5 minutes; the second stage is the heat preservation process, which keeps the melting point of the solder paste for about 2 minutes; the third stage is the cooling process, which takes about 3 minutes;

[0065] Among them, since the surface of the second terminal 12 is covered with the second protective film 22, the second terminal 12 has no oxidation risk during the heating process; when the temperature reaches the melting point of the solder paste, the second protective film 22 begins to volatilize, and due to the presence of the volatilization inhibitory additive, the volatilization rate of the second protective film 22 is slow, and it can still play an anti-oxidation role for the second terminal 12 and reduce the degree of oxidation of the second terminal 12; during the cooling process, the antioxidant 20 is basically completely volatilized, but the overall temperature also drops rapidly, that is, the high-temperature process caused by welding is ended, and the oxidation risk of the second terminal 12 is greatly reduced. Therefore, compared with the related art, the present invention can coat the antioxidant 20 on the second terminal 12 used for binding to form a second protective film 22, and during the welding process, the second protective film 22 can be slowly volatilized and removed, and before and during welding, it can play an anti-oxidation role for the second terminal 12, thereby improving the connection effect and yield rate of the subsequent binding connection of the second terminal 12.

[0066] In one embodiment, the boiling point of the volatilization suppressing additive is greater than or equal to a first temperature, and the first temperature is the soldering temperature of the light-emitting component, which can also be regarded as the melting point temperature of the solder paste; wherein the first temperature can be greater than or equal to 215°C and less than or equal to 245°C, and the boiling point of the volatilization suppressing additive can be greater than or equal to 220°C and less than or equal to 260°C.

[0067] It should be noted that the purpose of the embodiments of the present invention is to slow down the volatilization rate of the antioxidant during the welding process by adding a volatilization inhibitor additive to the antioxidant, and the volatilization rate of the antioxidant can be controlled by adjusting the components, content and welding temperature of the volatilization inhibitor additive to meet actual needs.

[0068] S40, connecting the driving component to the second terminal.

[0069] In step S40 , in step S30 , the second protection film 22 on the surface of the second terminal 12 has been removed to expose the second terminal 12 .

[0070] Next, the driving component may be bound to the second terminal 12. In one embodiment, the driving component may include a chip-on-film and a flexible circuit board, wherein the chip-on-film is connected between the second terminal 12 and the flexible circuit board to achieve signal transmission.

[0071] In summary, the embodiment of the present invention provides a film-forming component and a volatilization inhibitor additive in the antioxidant 20, and the film-forming component includes at least one of a substituted or unsubstituted acrylic resin, isopropanolamine, and imidazoline, so that the antioxidant is a volatile antioxidant, and the boiling point of the volatilization inhibitor additive is greater than the boiling point of the film-forming component, and the volatilization inhibitor additive can slow down the volatilization of the antioxidant; in the backlight module provided by the embodiment of the present invention, the antioxidant 20 can be coated on both the first terminal 11 and the second terminal 12 to form a first protective film 21 and a second protective film 22 respectively, wherein the first protective film 21 can be directly reacted and removed during the welding process, and the second protective film 22 can be gradually volatilized and slowly removed in a high temperature environment, on the one hand, avoiding the second terminal 12 from being oxidized to a large extent before and after welding, and on the other hand, the second protective film 22 can be removed during the welding process to expose the second terminal 12, thereby realizing the binding connection between the second terminal 12 and the driving component, and improving the connection effect and the yield rate of the backlight module.

[0072] In addition, the embodiment of the present invention further provides a backlight module, please refer to Figure 2 The backlight module is manufactured by the manufacturing method of the backlight module described in the above embodiment.

[0073] The backlight module includes a substrate 10, a first terminal 11 and a second terminal 12 arranged on the substrate 10; wherein the substrate 10 includes a device mounting surface 101 and a binding side 102 located on at least one side of the device mounting surface 101, the first terminal 11 is arranged on the device mounting surface 101, and the second terminal 12 is arranged on the binding side 102.

[0074] It is understandable that the backlight module also includes a driving circuit disposed on the substrate 10, and the driving circuit is connected between the first terminal 11 and the second terminal 12 to achieve signal transmission. The first terminal 11 can be used to connect the light-emitting element, and the second terminal 12 can be used to bind the driving component.

[0075] In one embodiment, the thickness of the substrate 10 may be 0.4 mm, or 0.5 mm, or 0.7 mm.

[0076] Since the backlight module provided by the embodiment of the present invention is made of the antioxidant described in the above embodiment, components of the antioxidant will remain on the first terminal 11 and the second terminal 12 .

[0077] In one embodiment, the surface of the first terminal 11 and / or the second terminal 12 contains Pb 2+ , Pb, Al 3+ , Pb 2+ At least one of a eutectic alloy with a terminal metal, a carboxyl group, and a carbon-carbon double bond, and the material of the first terminal 11 and the material of the second terminal 12 may include the terminal metal.

[0078] Specifically, the acrylic resin in the antioxidant has a high viscosity, and its maximum volatility is only about 95% in a 220°C environment, with more than 5% of the substance remaining, and the chemical properties are stable, and the characteristic functional groups will not be structurally damaged. The characteristic functional groups of acrylic resin are carbon-carbon double bonds and carboxyl groups, that is, substances with both carbon-carbon double bonds and carboxyl groups belong to acrylic resin substances. Based on this, the residual acrylic resin on the first terminal 11 and the second terminal 12 can be characterized.

[0079] For example, it can be determined by chemical atomic absorption method and atomic absorption spectroscopy; it can also be determined by atomic fluorescence spectroscopy, where carbon-carbon double bonds produce fluorescence under a specific light source, to detect the presence of carbon-carbon double bonds remaining on the first terminal 11 and / or the second terminal 12; and the presence of carboxyl groups can be determined by acid-base neutralization titration. Furthermore, the presence of carbon-carbon double bonds and carboxyl groups on the first terminal 11 and / or the second terminal 12 can be detected through the above detection process to prove that the antioxidant used in the backlight module contains acrylic resin components.

[0080] Furthermore, the melting point of the lead complex is generally around 300°C. After decomposition, a portion of it generates chemically stable PbO2, which remains on the surface of the pad (>10%). 2+ It will undergo a substitution reaction with the metal in the first terminal 11 and the second terminal 12, remain in the first terminal 11 and the second terminal 12, and form a stable eutectic alloy (the surface of the first terminal 11 and / or the second terminal 12 has a single substance Pb>50%).

[0081] In one embodiment, the material of the first terminal 11 and the second terminal 12 may include copper or aluminum. For example, when the material of the first terminal 11 and the second terminal 12 is copper, the surface of the first terminal 11 and / or the second terminal 12 contains Pb 2+ , Pb, Al 3+ , Pb 2+ At least one of a eutectic alloy with copper, a carboxyl group, and a carbon-carbon double bond, and the material of the first terminal 11 and the material of the second terminal 12 may include a terminal metal.

[0082] Among them, the lead-containing complex will have a large amount of stable Pb after decomposition. 2+ and single-element Pb residues. If any of them is detected on the surface of the first terminal 11 and / or the second terminal 12, it can be proved that the backlight module provided by the embodiment of the present invention has been treated with Pb-containing substances. For example, the terminal without anti-oxidation copper can be used as a blank control group, and the type and content of Pb elements on the surface of the blank terminal can be obtained by means of testing methods such as EDS element analysis, XPS energy spectrum analysis, and ICP element content determination; then the same method is used to test the type and content of Pb elements on the surface of the terminals in the test group. By comparing the type and content of Pb elements, it can be proved whether the terminals in the test group have been treated with Pb-containing substances.

[0083] In summary, the embodiment of the present invention provides a film-forming component and a volatilization inhibitor additive in the antioxidant 20, and the film-forming component includes at least one of a substituted or unsubstituted acrylic resin, isopropanolamine, and imidazoline, so that the antioxidant is a volatile antioxidant, and the boiling point of the volatilization inhibitor additive is greater than the boiling point of the film-forming component, and the volatilization inhibitor additive can slow down the volatilization of the antioxidant; in the backlight module provided by the embodiment of the present invention, the antioxidant 20 can be attached to the first terminal 11 and the second terminal 12 to form a first protective film 21 and a second protective film 22 respectively, wherein the first protective film 21 can be directly reacted and removed during the welding process, and the second protective film 22 can be gradually volatilized and slowly removed in a high temperature environment, on the one hand, avoiding the second terminal 12 from being oxidized to a large extent before and after welding, and on the other hand, the second protective film 22 can be removed during the welding process to expose the second terminal 12, thereby realizing the binding connection between the second terminal 12 and the driving component, and improving the connection effect and the yield rate of the backlight module.

[0084] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0085] The above is a detailed introduction to an antioxidant, a backlight module and a manufacturing method thereof provided in an embodiment of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present invention. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for manufacturing a backlight module, characterized in that: The manufacturing method of the backlight module comprises the following steps: forming a first terminal and a second terminal on the substrate; Applying an antioxidant on the first terminal and the second terminal to form a first protective film on the first terminal and a second protective film on the second terminal; the antioxidant is composed of a film-forming component, a volatilization inhibitor additive and an ethanol solvent, the film-forming component is methacrylic resin, the volatilization inhibitor additive is lead acetate, liquid paraffin and calcium chloride, the mass content of the film-forming component in the antioxidant is 40% to 50%, and the mass content of the volatilization inhibitor additive in the antioxidant is 11% to 19%; Soldering the light-emitting component to the first terminal, and removing the first protective film and the second protective film, and the light-emitting component is electrically connected to the first terminal, wherein the removal rate of the second protective film is lower than the removal rate of the first protective film, and the boiling point of the volatilization inhibitor in the second protective film is greater than or equal to a first temperature, and the first temperature is the welding temperature of the light-emitting component; Connect the driving component to the second terminal.

2. A backlight module, characterized in that: The backlight module is manufactured by the manufacturing method of the backlight module according to claim 1.

3. The backlight module according to claim 2, characterized in that: The material of the first terminal and the material of the second terminal are copper or aluminum.

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