Drawing packaging detection method, device, electronic equipment and medium

Abstract

The present application relates to the field of design drawing processing, and provides a drawing package detection method, device, electronic device and medium, the method comprising: obtaining the package name of the device in the drawing to be tested and the production process of the drawing to be tested; comparing the package name of the device with the package name in the device package library; if there is a target package name consistent with the package name of the device in the device package library, then comparing the production process of the drawing to be tested with the production process associated with the target package name; if the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, and there is a package name associated with the production process of the drawing to be tested in the device package library, then determining that the device is a packaged device to be modified. The present application can quickly find out the device packages that are wrong and can be modified in the drawing to be tested, which is convenient for batch modification of such packages, thereby reducing the situation where package errors exist in the designed electronic drawings and improving the design efficiency of electronic drawings.

Description

Technical Field

[0001] The present application relates to the field of design drawing processing, and in particular to a drawing packaging detection method, device, electronic equipment and medium. Background Art

[0002] Before drawing electronic design drawings, engineers will set the process route, and the process route of each electronic design drawing is unique. For devices, different process routes require different packages, and the process route and package are one-to-one corresponding. However, during the design process, engineers drag devices from the device library to use, and the system will select the first package by default, but this package may not be suitable for the process route of this drawing. Since there are many devices in the electronic design drawings, it is very troublesome to change the packages one by one, which can easily lead to package errors in the designed electronic drawings due to missed detection or wrong detection, which in turn leads to low design efficiency of electronic drawings. Summary of the invention

[0003] The present application aims to solve at least one of the technical problems existing in the related art. To this end, the present application proposes a drawing packaging detection method, which can avoid the problem of packaging errors in the designed electronic drawings due to missed detection or wrong detection, and improve the design efficiency of electronic drawings.

[0004] The present application also proposes a drawing packaging detection device, electronic equipment and medium.

[0005] According to the first aspect of the present application, a drawing packaging detection method includes:

[0006] Obtaining the package name of the device in the drawing to be tested and the production process of the drawing to be tested;

[0007] Comparing the package name of the device with the package name in a device package library; the device package library is used to store the package name of the device and the association between the package name and the production process;

[0008] If there is a target package name that is consistent with the package name of the device in the device package library, then comparing the production process of the drawing to be tested with the production process associated with the target package name;

[0009] If the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, and there is a package name associated with the production process of the drawing to be tested in the device package library, the device is determined to be a package device to be modified.

[0010] According to the drawing package detection method of the embodiment of the present application, through the association between the package name and the production process in the device package library, it is possible to first determine whether the package name of each device in the drawing to be tested is included in the device package library. If so, it is determined whether the package of each device corresponds to the production process. If the package of the device does not correspond to the production process, it is determined to be a device whose package needs to be modified. In this way, the device packages that are wrong and can be modified in the drawing to be tested can be quickly found, which is convenient for batch modification of such packages, thereby reducing the situation where packaging errors exist in the designed electronic drawings and improving the design efficiency of electronic drawings.

[0011] According to one embodiment of the present application, after comparing the package name of the device with the package name in the device package library, the method further includes:

[0012] If each package name in the device package library is different from the package name of the device, it is determined that the device is a non-package library device.

[0013] According to an embodiment of the present application, after comparing the production process of the drawing to be tested with the production process associated with the target package name, the method further includes:

[0014] If the production process of the drawing to be tested is consistent with the production process associated with the target package name, it is determined that the device is packaged correctly.

[0015] According to an embodiment of the present application, after comparing the production process of the drawing to be tested with the production process associated with the target package name, the method further includes:

[0016] If the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, and the package name associated with the production process of the drawing to be tested does not exist in the device package library, the device is determined to be an abnormal package device.

[0017] According to an embodiment of the present application, after determining that the device is a packaged device to be modified, the method further includes:

[0018] Receiving a modification instruction based on at least one of the packaged devices to be modified, determining a target package name of the packaged device to be modified according to the production process of the drawing of the packaged device to be modified and the device type of the packaged device to be modified;

[0019] The current package name of the packaged device to be modified is modified to the target package name.

[0020] According to an embodiment of the present application, the device package library is further used to store the association relationship between the production process, the device type and the package name; the step of determining the target package name of the packaged device to be modified according to the production process of the drawing where the packaged device to be modified is located and the device type of the packaged device to be modified includes:

[0021] Based on the association between the production process, device type and package name, the package name corresponding to the production process of the drawing where the package device to be modified is located and the device type of the package device to be modified is queried, and the package name corresponding to the production process of the drawing where the package device to be modified is located and the device type of the package device to be modified is determined as the target package name.

[0022] According to an embodiment of the present application, the device type includes at least one of a plug-in device and a surface mount device.

[0023] According to an embodiment of the present application, after obtaining the package name of the device in the drawing to be tested and the production process of the drawing to be tested, the method further includes:

[0024] Comparing the production process of the drawing to be tested with the production process in the device package library;

[0025] If there is a target production process in the device package library that is consistent with the production process of the drawing to be tested, then comparing the package name of the device with the package name associated with the target production process;

[0026] If the package name of the device is inconsistent with the package name associated with the target production process, the device is determined to be a packaged device to be modified.

[0027] According to the second aspect of the present application, a drawing packaging detection device includes:

[0028] An acquisition module, used to acquire the package name of the device in the drawing to be tested and the production process of the drawing to be tested;

[0029] A first comparison module is used to compare the package name of the device with the package name in a device package library; the device package library is used to store the package name of the device and the association between the package name and the production process;

[0030] A second comparison module is used to compare the production process of the drawing to be tested with the production process associated with the target package name if there is a target package name consistent with the package name of the device in the device package library;

[0031] The determination module is used to determine that the device is a package device to be modified if the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, and there is a package name associated with the production process of the drawing to be tested in the device package library.

[0032] According to an electronic device of an embodiment of the third aspect of the present application, the electronic device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, the drawing packaging detection method described in any one of the above methods is implemented.

[0033] According to the medium of the fourth aspect embodiment of the present application, the medium is a non-transitory computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, it implements any of the drawing packaging detection methods described above.

[0034] The above one or more technical solutions in the embodiments of the present application have at least one of the following technical effects:

[0035] It is possible to quickly find out the device packages that are wrong and can be modified in the drawings to be tested, which is convenient for batch modification of such packages, thereby reducing the situation of package errors in the designed electronic drawings and improving the design efficiency of electronic drawings.

[0036] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1 It is one of the flow diagrams of the drawing packaging detection method provided in the embodiment of the present application;

[0039] Figure 2 This is the second flow chart of the drawing packaging detection method provided in the embodiment of the present application;

[0040] Figure 3 is a structural schematic diagram of a drawing packaging detection device provided in an embodiment of the present application;

[0041] Figure 4 It is a structural schematic diagram of the electronic device provided by this application. DETAILED DESCRIPTION

[0042] The following is a further detailed description of the implementation of the present application in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application but cannot be used to limit the scope of the present application.

[0043] In the description of the embodiments of the present application, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0044] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0045] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0046] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0047] Figure 1 It is one of the flow charts of the drawing packaging detection method provided in the embodiment of the present application, such as Figure 1 As shown, the drawing packaging detection method includes:

[0048] Step 110, obtaining the package name of the device in the drawing to be tested and the production process of the drawing to be tested.

[0049] It should be noted that the executor of the drawing packaging detection method provided in the embodiment of the present application can be a server, a computer device, such as a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), etc.

[0050] It should be noted that engineers will set the production process of the electronic drawing before designing it, and the production process of each electronic drawing is unique. At the same time, each device in the electronic drawing needs to be set with a packaging method, and different packaging methods correspond to a unique packaging name.

[0051] The drawing to be tested in this application is an electronic drawing that has been designed by an engineer. The designed electronic drawing can be used as the drawing to be tested when in use. The drawing to be tested may include one or more devices, and each device may have a bit number and a package name.

[0052] Therefore, after obtaining the drawing to be tested, the bit number of each device in the drawing to be tested can be obtained, and the package name corresponding to each bit number can be extracted, and the production process of the drawing to be tested can be obtained, which is determined by the engineer before designing the drawing.

[0053] Step 120 , comparing the package name of the device with the package name in the device package library.

[0054] In the present application, a device package library can be pre-constructed, and the device package library is used to store the package name of the device and the association between the package name and the production process.

[0055] In the device package library, each package name corresponds to a production process, thus forming an association between the package name and the production process.

[0056] It should be noted that each package name is associated with not only a production process but also a device type, thereby forming an association relationship between the production process, the device type and the package name.

[0057] It should be noted that the device types in this application may include but are not limited to plug-in devices and surface mount devices.

[0058] Since only one production process can be selected for electronic product production, and each device can only correspond to one package under each production process, when creating a device package library, all existing packages involved need to be maintained first to ensure that enough production process scenarios are covered.

[0059] In one embodiment, for plug-in devices, the production process uses the red plastic wave peak process, but the packaging difference is reflected in the single-sided packaging and double-sided packaging. Therefore, it is stipulated that the package name of the single-sided packaging of the plug-in device has a suffix "S"; the package name of the double-sided packaging of the plug-in device does not have a suffix "S".

[0060] For SMD devices, the production process is divided into red glue wave process and solder paste reflow process. Therefore, it is stipulated that the package name of the SMD device with red glue wave process has a suffix "W"; the package name of the SMD device with solder paste reflow process does not have a suffix "W".

[0061] When creating a device package library, follow the above rules when naming the package of each SMD device and plug-in device to facilitate subsequent package capture.

[0062] This application can maintain a configuration file in the device package library, which contains the package names of plug-in devices and surface mount devices required for different production processes. The mapping relationship is shown in Table 1 below:

[0063] Table 1

[0064]

[0065] As shown in the table above, these are the commonly used production processes for electronic products, and this mapping relationship is maintained in the configuration table.

[0066] In addition to the mapping relationship, the configuration file also includes the package names of all device package libraries in order to determine whether the device is a brand new material, because the package name of a brand new material is not included in the device package library, and the package name is generally different from that in the device package library.

[0067] Therefore, after obtaining the package name of each device, the present application can compare the package name with the package name in the device package library for each device, thereby determining whether the package name of each device is the package name in the device package library.

[0068] Step 130 : If there is a target package name that is consistent with the package name of the device in the device package library, then the production process of the drawing to be tested is compared with the production process associated with the target package name.

[0069] For each device, if it is determined through comparison that there is a package name in the device package library that is consistent with the package name of the device, the package name in the device package library is determined as the target package name.

[0070] Furthermore, the production process associated with the target package name is found out through the association relationship between the package name and the production process.

[0071] The production process associated with the target package name is compared with the production process of the drawing to be tested, thereby determining whether the device package name and the corresponding production process match a set of package names and production processes in the device package library.

[0072] Step 140 : If the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, and there is a package name associated with the production process of the drawing to be tested in the device package library, then the device is determined to be a package device to be modified.

[0073] If it is determined through comparison that the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, it means that the package name of the device and the corresponding production process do not match a set of package names and production processes in the device package library, indicating that the package name is wrong, that is, the packaging method is wrong.

[0074] Furthermore, it is possible to check whether there is a package name associated with the production process of the drawing to be tested in the device package library. If so, it means that the package name of the device can be modified to correct its packaging method and avoid packaging errors.

[0075] Therefore, it can be determined that the device is a packaged device to be modified.

[0076] It should be noted that if there are multiple device package names in the device package library, but the production process of the drawing is inconsistent with the production process of the corresponding package name and the production process of the drawing has an associated package name in the device package library, then the multiple devices will be determined as package devices to be modified.

[0077] According to the drawing package detection method of the embodiment of the present application, through the association between the package name and the production process in the device package library, it is possible to first determine whether the package name of each device in the drawing to be tested is included in the device package library. If so, it is determined whether the package of each device corresponds to the production process. If the package of the device does not correspond to the production process, it is determined to be a device whose package needs to be modified. In this way, the device packages that are wrong and can be modified in the drawing to be tested can be quickly found, which is convenient for batch modification of such packages, thereby reducing the situation where packaging errors exist in the designed electronic drawings and improving the design efficiency of electronic drawings.

[0078] This application aims to solve the problem that users cannot modify packages in batches, so as to meet the needs of users to quickly and accurately find and modify packages in batches, thereby improving the efficiency of drawing drawings and reducing the probability of design errors.

[0079] Based on the above embodiment, the above step 120 may include:

[0080] Step 150: If the package names in the device package library are all different from the package name of the device, then it is determined that the device is a non-package library device.

[0081] After comparing the package name of the device with the package name in the device package library, if it is determined that the package names in the device package library are different from the package name of the current device, it means that the package name of the current device is not in the device package library. The device can be considered to be a new device, or a device using a new packaging method. Therefore, it can be determined that the device is a non-package library device. Further, a prompt message "Non-package library device, do not modify" can be output for the bit number of the device.

[0082] In this embodiment, when it is determined that all package names in the device package library are different from the package name of the device, the device is determined to be a non-package library device for further verification by engineers, which can improve the design accuracy of electronic drawings.

[0083] Based on the above embodiment, the above step 130 may include:

[0084] Step 160: If the production process of the drawing to be tested is consistent with the production process associated with the target package name, it is determined that the device package is correct.

[0085] After comparing the production process of the drawing to be tested with the production process associated with the target package name, if it is determined that the production process of the drawing to be tested is consistent with the production process associated with the target package name, it means that the package name of the current device is in compliance with the production process. Therefore, it can be determined that the packaging of the current device is correct, and a prompt message of "Complies with the process, no modification is required" can be output for the bit number of the device.

[0086] This embodiment determines that the device packaging is correct when it is determined that the production process of the drawing to be tested is consistent with the production process associated with the target package name. This can automatically detect the package name of each device in the drawing, avoid missed detection and false detection during manual inspection, and improve the design accuracy of electronic drawings.

[0087] Based on the above embodiment, the above step 130 may further include:

[0088] Step 170: If the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, and the package name associated with the production process of the drawing to be tested does not exist in the device package library, then the device is determined to be an abnormal package device.

[0089] After comparing the production process of the drawing to be tested with the production process associated with the target package name, if it is determined that the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, it can be further determined whether there is a package name associated with the production process of the drawing to be tested in the device package library.

[0090] If it is determined that there is no package name associated with the production process of the drawing to be tested in the device package library, it can be determined that the package name of the current device cannot be modified to the correct package name, so the device can be determined to be an abnormal package device. At the same time, a prompt message "No package matching the process found, no modification" can be output for the bit number of the device for engineers to check and correct.

[0091] In this embodiment, when it is determined that the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, and the package name associated with the production process of the drawing to be tested does not exist in the device package library, the device can be determined to be an abnormal package device for further investigation and correction by engineers, thereby improving the design accuracy of electronic drawings.

[0092] Based on the above embodiment, the above step 140 may include:

[0093] Step 180, receiving a modification instruction based on at least one packaged device to be modified, and determining a target package name of the packaged device to be modified according to the production process of the drawing where the packaged device to be modified is located and the device type of the packaged device to be modified;

[0094] In this application, engineers can select packaged devices to be modified individually or in batches according to the detection results of each device, and can initiate modification instructions for modifying the packaged devices to be modified for the selected devices.

[0095] When receiving a modification instruction from an engineer for at least one packaged device to be modified, the present application can find the package name associated with the production process and device type of the drawing where the packaged device to be modified is located based on the association between the production process, device type and package name, and determine the package name as the target package name of the packaged device to be modified.

[0096] Step 190, modify the current package name of the packaged device to be modified to the target package name.

[0097] After determining the target package name of the current packaged device to be modified, the current package name of the current packaged device to be modified can be obtained, and the package name can be modified to the target package name, thereby completing the package name modification of the packaged device to be modified, and further realizing the package modification of the packaged device to be modified.

[0098] Based on the above embodiment, the above step 180 may include:

[0099] Step 181, based on the association between the production process, device type and package name, query the package name corresponding to the production process of the drawing where the package device to be modified is located and the device type of the package device to be modified, and determine the package name corresponding to the production process of the drawing where the package device to be modified is located and the device type of the package device to be modified as the target package name.

[0100] After receiving the modification instruction, the present application can obtain the association between the production process, device type and package name from the device package library.

[0101] Furthermore, for each packaged device to be modified, based on the association relationship, it is possible to query the device package library to see whether there is a package name corresponding to the production process of the drawing where the current packaged device to be modified is located and the device type of the current packaged device to be modified; if after query there is a package name corresponding to the production process of the drawing where the current packaged device to be modified is located and the device type of the current packaged device to be modified, then the package name is determined as the target package name.

[0102] This embodiment can modify the device package names in batches according to the modification instructions, avoiding engineers from checking each device one by one and modifying the packages one by one, which can reduce the situation of package errors in the designed electronic drawings and improve the design efficiency of the electronic drawings.

[0103] Figure 2 This is the second flow chart of the drawing packaging detection method provided in the embodiment of the present application, such as Figure 2 As shown, in some embodiments, after an engineer selects an existing drawing as a drawing to be tested, the drawing packaging detection method of the present application may include the following steps:

[0104] (1) First, take out the bit numbers and current packages of all the devices in the drawing to be tested, and make the following judgments for each device:

[0105] (2) Determine whether the current package name of the device exists in the configuration file of the device package library. If it is determined that the current package name with a bit number does not exist in the configuration file, the corresponding bit number will be reported as an error and recorded as "non-package library device, do not modify". This situation is generally a brand new material. If it is determined that the current package name with a bit number exists in the configuration file, proceed to the next step of judgment:

[0106] (3) Determine whether the current package name is in line with the selected production process. If it is, the bit number is recorded as "compliant with the process, no modification required". If it is determined that the current package name is not in line with the selected production process, proceed to the next step:

[0107] (4) Determine whether the package with the corresponding package name can be found according to the mapping relationship of the configuration file. If the package with the corresponding package name cannot be found according to the mapping relationship of the configuration file, the corresponding bit number will be reported as an error, recorded as "No package matching the process found, no modification". This situation is generally because the package name of the package has not been maintained in the device package library. If the package with the corresponding package name is found according to the mapping relationship of the configuration file, the corresponding bit number will be recorded as "need to be modified".

[0108] In one embodiment, after the engineer reviews the judgment result of the software, he clicks the "Apply" button to let the software perform the operation of replacing the packaging action for the device with the bit number "needing to be modified" according to the mapping relationship in the configuration file. The software does not process the device with the bit number that originally meets the production process or has an error item.

[0109] Based on the above embodiment, the above step 110 may further include:

[0110] Step 210, comparing the production process of the drawing to be tested with the production process in the device package library;

[0111] In one embodiment, after obtaining the package name of the device in the drawing to be tested and the production process of the drawing to be tested, the present application can also compare the production process of the drawing to be tested with the production process in the device package library to determine whether there is a consistent production process in the device package library.

[0112] If there is no consistent production process, it can be determined that the production process of the drawing to be tested is wrong, and prompt information can be output for engineers to check and correct.

[0113] Step 220, if there is a target production process in the device package library that is consistent with the production process of the drawing to be tested, then compare the package name of the device with the package name associated with the target production process;

[0114] If it is determined that a target production process that is consistent with the production process of the drawing to be tested exists in the device package library, a package name corresponding to the target production process is obtained from the device package library.

[0115] It should be noted that each production process in the device package library may correspond to one or more package names depending on the device type.

[0116] The package names of the target production process are compared with the package names of the devices in the drawing to be tested, thereby determining whether the package name and production process of each device in the drawing to be tested match a set of package names and production processes in the device package library.

[0117] If it is determined that the package name of the device is consistent with the package name associated with the target production process, it is determined that the package of the device is normal.

[0118] Step 230: If the package name of the device is inconsistent with the package name associated with the target production process, the device is determined to be a packaged device to be modified.

[0119] If it is determined that the package name of the device is inconsistent with the package name associated with the target production process, it means that the package of the device is incorrect but there is a package name that can be modified in the device package library, so the device is determined to be a package device to be modified.

[0120] This embodiment can quickly find out the device packages that are wrong and can be modified in the drawing to be tested, which is convenient for batch modification of such packages, thereby reducing the situation where package errors exist in the designed electronic drawings and improving the design efficiency of electronic drawings.

[0121] Figure 3 is a structural schematic diagram of a drawing packaging detection device provided in an embodiment of the present application, such as Figure 3 As shown in the drawing, the packaging detection device includes:

[0122] An acquisition module 310 is used to acquire the package name of the device in the drawing to be tested and the production process of the drawing to be tested;

[0123] A first comparison module 320, used to compare the package name of the device with the package name in a device package library; the device package library is used to store the package name of the device and the association between the package name and the production process;

[0124] A second comparison module 330 is used to compare the production process of the drawing to be tested with the production process associated with the target package name if there is a target package name consistent with the package name of the device in the device package library;

[0125] The determination module 340 is used to determine that the device is a package device to be modified if the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, and there is a package name associated with the production process of the drawing to be tested in the device package library.

[0126] According to the drawing packaging detection device of the embodiment of the present application, through the association between the packaging name and the production process in the device packaging library, it is possible to first determine whether the packaging name of each device in the drawing to be tested is included in the device packaging library. If so, it is determined whether the packaging of each device corresponds to the production process. If the packaging of the device does not correspond to the production process, it is determined to be a device whose packaging needs to be modified. In this way, the device packaging that is wrong and can be modified in the drawing to be tested can be quickly found, which is convenient for batch modification of such packaging, thereby reducing the situation where packaging errors exist in the designed electronic drawings and improving the design efficiency of electronic drawings.

[0127] Based on any of the above embodiments, the first comparison module 320 is further used for:

[0128] If each package name in the device package library is different from the package name of the device, it is determined that the device is a non-package library device.

[0129] Based on any of the above embodiments, the second comparison module 330 is further used for:

[0130] If the production process of the drawing to be tested is consistent with the production process associated with the target package name, it is determined that the device is packaged correctly.

[0131] Based on any of the above embodiments, the second comparison module 330 is further used for:

[0132] If the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, and the package name associated with the production process of the drawing to be tested does not exist in the device package library, the device is determined to be an abnormal package device.

[0133] Based on any of the above embodiments, the determination module 340 is further configured to:

[0134] Receiving a modification instruction based on at least one of the packaged devices to be modified, and determining a target package name of the packaged device to be modified according to a production process of a drawing of the packaged device to be modified and a device type of the packaged device to be modified;

[0135] The current package name of the packaged device to be modified is modified to the target package name.

[0136] Based on any of the above embodiments, the determination module 340 further includes a determination unit, and the determination unit is configured to:

[0137] Based on the association between the production process, device type and package name, the package name corresponding to the production process of the drawing where the package device to be modified is located and the device type of the package device to be modified is queried, and the package name corresponding to the production process of the drawing where the package device to be modified is located and the device type of the package device to be modified is determined as the target package name.

[0138] Based on any of the above embodiments, the drawing packaging detection device further includes:

[0139] A third comparison module is used to compare the production process of the drawing to be tested with the production process in the device packaging library;

[0140] a fourth comparison module, configured to compare the package name of the device with the package name associated with the target production process if there is a target production process consistent with the production process of the drawing to be tested in the device package library;

[0141] The determination module is further configured to determine that the device is a packaged device to be modified if the package name of the device is inconsistent with the package name associated with the target production process.

[0142] Figure 4 An example of a physical structure diagram of an electronic device is shown in FIG. Figure 4 As shown, the electronic device may include: a processor 410, a communication interface 420, a memory 430 and a communication bus 440, wherein the processor 410, the communication interface 420 and the memory 430 communicate with each other through the communication bus 440. The processor 410 may call the logic instructions in the memory 430 to execute the following method: obtaining the package name of the device in the drawing to be tested and the production process of the drawing to be tested;

[0143] Comparing the package name of the device with the package name in a device package library; the device package library is used to store the package name of the device and the association between the package name and the production process;

[0144] If there is a target package name that is consistent with the package name of the device in the device package library, then comparing the production process of the drawing to be tested with the production process associated with the target package name;

[0145] If the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, and there is a package name associated with the production process of the drawing to be tested in the device package library, the device is determined to be a package device to be modified.

[0146] In addition, the logic instructions in the above-mentioned memory 430 can be implemented in the form of a software functional unit and can be stored in a computer-readable storage medium when it is sold or used as an independent product. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the relevant technology. The computer software product is stored in a storage medium, including several instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk, etc. Various media that can store program codes.

[0147] On the other hand, the embodiments of the present application further provide a non-transitory computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the method provided by the above embodiments is implemented, for example, including: obtaining the package name of the device in the drawing to be tested and the production process of the drawing to be tested;

[0148] Comparing the package name of the device with the package name in a device package library; the device package library is used to store the package name of the device and the association between the package name and the production process;

[0149] If there is a target package name that is consistent with the package name of the device in the device package library, then comparing the production process of the drawing to be tested with the production process associated with the target package name;

[0150] If the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, and there is a package name associated with the production process of the drawing to be tested in the device package library, the device is determined to be a package device to be modified.

[0151] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.

[0152] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the relevant technology can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiment.

[0153] Finally, it should be noted that the above implementation modes are only used to illustrate the present application, rather than to limit the present application. Although the present application is described in detail with reference to the embodiments, a person skilled in the art should understand that various combinations, modifications or equivalent substitutions of the technical solutions of the present application do not depart from the spirit and scope of the technical solutions of the present application, and should be included in the scope of the claims of the present application.

Claims

1. A drawing packaging detection method, characterized in that: include: Obtaining the package name of the device in the drawing to be tested and the production process of the drawing to be tested; Comparing the package name of the device with the package name in the device package library; The device package library is used to store the package name of the device and the association between the package name and the production process; Each package name in the association relationship corresponds to a production process; If there is a target package name that is consistent with the package name of the device in the device package library, then comparing the production process of the drawing to be tested with the production process associated with the target package name; If the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, and there is a package name associated with the production process of the drawing to be tested in the device package library, then the device is determined to be a package device to be modified; After determining that the device is a packaged device to be modified, the method further includes: Receiving a modification instruction based on at least one of the packaged devices to be modified, and determining a target package name of the packaged device to be modified according to a production process of a drawing of the packaged device to be modified and a device type of the packaged device to be modified; Modify the current package name of the packaged device to be modified to the target package name; The device package library is also used to store the association relationship between the production process, the device type and the package name; the step of determining the target package name of the packaged device to be modified according to the production process of the drawing where the packaged device to be modified is located and the device type of the packaged device to be modified includes: Based on the association between the production process, the device type and the package name, query the package name corresponding to the production process of the drawing where the package device to be modified is located and the device type of the package device to be modified, and determine the package name corresponding to the production process of the drawing where the package device to be modified is located and the device type of the package device to be modified as the target package name; If each package name in the device package library is different from the package name of the device, it is determined that the device is a non-package library device.

2. The drawing packaging detection method according to claim 1, characterized in that: After comparing the production process of the drawing to be tested with the production process associated with the target package name, the method further includes: If the production process of the drawing to be tested is consistent with the production process associated with the target package name, it is determined that the device is packaged correctly.

3. The drawing packaging detection method according to claim 1, characterized in that: After comparing the production process of the drawing to be tested with the production process associated with the target package name, the method further includes: If the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, and the package name associated with the production process of the drawing to be tested does not exist in the device package library, the device is determined to be an abnormal package device.

4. The drawing packaging detection method according to claim 1, characterized in that: The device type includes at least one of a plug-in device and a surface mount device.

5. The drawing packaging detection method according to any one of claims 1 to 4, characterized in that: After obtaining the package name of the device in the drawing to be tested and the production process of the drawing to be tested, the method further includes: Comparing the production process of the drawing to be tested with the production process in the device package library; If there is a target production process in the device package library that is consistent with the production process of the drawing to be tested, then comparing the package name of the device with the package name associated with the target production process; If the package name of the device is inconsistent with the package name associated with the target production process, the device is determined to be a packaged device to be modified.

6. A drawing packaging detection device, characterized in that: include: An acquisition module, used to acquire the package name of the device in the drawing to be tested and the production process of the drawing to be tested; A first comparison module is used to compare the package name of the device with the package name in a device package library; the device package library is used to store the package name of the device and the association between the package name and the production process; each package name in the association corresponds to a production process; A second comparison module is used to compare the production process of the drawing to be tested with the production process associated with the target package name if there is a target package name consistent with the package name of the device in the device package library; a determination module, configured to determine that the device is a package device to be modified if the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, and there is a package name associated with the production process of the drawing to be tested in the device package library; The determination module is further configured to receive a modification instruction based on at least one of the packaged devices to be modified, and determine a target package name of the packaged device to be modified according to a production process of a drawing of the packaged device to be modified and a device type of the packaged device to be modified; Modify the current package name of the packaged device to be modified to the target package name; The determination module is further used to query the package name corresponding to the production process of the drawing where the package device to be modified is located and the device type of the package device to be modified based on the association relationship between the production process, the device type and the package name, and determine the package name corresponding to the production process of the drawing where the package device to be modified is located and the device type of the package device to be modified as the target package name; The first comparison module is further configured to determine that the device is a non-package library device if all package names in the device package library are different from the package name of the device.

7. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the program, the drawing packaging detection method as described in any one of claims 1 to 5 is implemented.

8. A medium, the medium being a non-transitory computer-readable storage medium, on which a computer program is stored, characterized in that: When the computer program is executed by a processor, the drawing packaging detection method as described in any one of claims 1 to 5 is implemented.

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