Cooling assembly for a host circuit device and circuit assembly

Abstract

This disclosure relates to elastomeric embedded multi-point contact cooling. Example embodiments relate to a cooling assembly for a host circuit device, a circuit assembly including a host circuit device and a removable circuit device, and a method for thermal management of a removable circuit device removably connected to the host circuit device. The cooling assembly includes a cooling member and a thermal gap pad having an elastomeric member movably connected to the cooling member and a plurality of beams embedded in the elastomeric member. Each beam includes a first end, a second end, and a body portion extending between the first and second ends. The first end of each of the one or more beams is configured to be in first thermal contact with the cooling member, and the second end of each of the one or more beams is configured to be in second thermal contact with a heat sink of the removable circuit device.

Description

Technical Field

[0001] This disclosure relates to cooling techniques for circuit components in electronic devices. In particular, this disclosure relates to a cooling assembly for a host circuit device, and a circuit assembly. Background Technology

[0002] Electronic devices such as computers and network equipment may include circuit components, which include printed circuit boards (PCBs) with circuit modules to enable communication between the electronic device and external circuit modules. Circuit modules may include network switches, Universal Serial Bus (USB) hubs, etc., and external circuit modules may include Small Form-Pluggable (SFP) transceivers, Non-Volatile Memory Fast (NVMe) drives, etc. When connected to a circuit module, an external circuit module may generate waste heat during its operation. To minimize the adverse effects of this waste heat on the external circuit module, the circuit component may include a cold plate to draw the waste heat away from the external circuit module. Summary of the Invention

[0003] As used herein, "host circuitry" can refer to a circuit module housed within a circuit assembly of an electronic device. For example, host circuitry can include network switches, Universal Serial Bus (USB) hubs, etc. As used herein, "circuit assembly" refers to an electronic circuit having a printed circuit board, host circuitry, and removable circuitry, where the removable circuitry and host circuitry can respectively serve as the plug and socket of the electronic device. As used herein, "removable circuitry" can refer to an external circuit module that can be connected to the circuit assembly by being inserted into the host circuitry to transmit, receive, store, or process data. For example, removable circuitry can be a pluggable transceiver device or a pluggable memory drive, etc. Therefore, host circuitry can be a native device of an electronic device, while removable circuitry can be an auxiliary device of the electronic device. As used herein, "electronic device" can refer to a computer (server or storage device), network device (wireless access point or router), etc. Furthermore, as used herein, “inserting” a removable circuit device into a host circuit device can refer to assembling the removable circuit device into the host circuit device by inserting or sliding the plug of the removable circuit device into a socket of the host circuit device. Furthermore, as used herein, “thermal contact” can refer to a thermal connection between the surfaces of two components to establish a thermally conductive path between the two components that allows heat to be conducted between them. Two objects can be considered thermally connected if any of the following are true: (1) the two objects are in contact with each other (either directly or via a thermal interface material), (2) both objects are thermally connected to a thermally conductive medium (e.g., a heat pipe, a heat diffuser, etc.) (or to a chain of thermally connected thermally conductive media), or (3) the thermal transfer coefficient between the two objects is 5 W·m. 2 ·K 1 Or more. For example, a first thermal contact may be formed by contact between a first end of each of one or more beams of a thermal gap pad and a cooling component, and a second thermal contact may be formed by contact between a second end of each of these one or more beams and a heat sink of a removable circuit device. As used herein, “cold plate” is sometimes used in the art with different meanings, some of which are more general and others more specific. As used herein, “cold plate” specifically refers to a subset of thermal devices configured to receive waste heat from a component via conduction and dissipate such waste heat into a flow of liquid coolant (e.g., water), in contrast to “heat sink,” which, as used herein, specifically refers to a subset of thermal devices configured to receive waste heat from a component via conduction and transfer such waste heat to a cold plate thermally connected to the heat sink.

[0004] An object, device, or component (which may include multiple different bodies thermally joined and may comprise a variety of different materials) “conducts heat” between two thermal interfaces if any of the following is true: (i) the heat transfer coefficient between the thermal interfaces is 5 W·m at any temperature between 0°C and 100°C. 2 ·K 1 Or above, (ii) the object contains a thermal conductivity (typically expressed as k, λ, or κ) between the two interfaces such that it is 1 W·m at any temperature between 0°C and 100°C. 1 ·K 1 The material is one of the above, or (iii) the object is a heat pipe, vapor chamber, copper body, or aluminum body. The thermal conductivity is greater than 1 W·m between 0°C and 100°C. 1 ·K 1 Examples of materials include almost all metals and their alloys (e.g., copper, aluminum, gold, etc.), some plastics (e.g., TECACOMP® TC compounds, CoolPoly® D series thermally conductive plastics), and many other materials.

[0005] Electronic devices may include circuit components for housing circuit modules (e.g., host circuit devices). Host circuit devices can be used to enable communication between the electronic device and external circuit modules (e.g., removable circuit devices). Removable circuit devices can be removably connected to host circuit devices to perform various functions, such as transmitting, receiving, processing, and storing data. Typically, removable circuit devices convert electrical signals into optical signals or vice versa to perform the various functions discussed herein and generate waste heat during their operation. If this waste heat is not removed from the removable circuit device, it may exceed the thermal specifications of the electronic components of the removable circuit device, resulting in a reduction in the expected performance, reliability, and / or lifespan of the removable circuit device, and may also cause it to fail.

[0006] To overcome these issues related to waste heat in removable circuitry, a heat diffuser—a heat transfer device that increases thermal contact area and / or distributes heat more evenly—can be thermally connected to these multiple electronic components to remove waste heat from the removable circuitry. Furthermore, cooling air can be blown onto a heat sink to remove waste heat from the heat diffuser. However, when the removable circuitry is connected to the host circuitry, the heat diffuser may not receive a sufficient supply of cooling air to remove waste heat, thus degrading the performance of the removable circuitry.

[0007] Therefore, the host circuitry may include a cold plate for removing waste heat from the heat diffuser. For example, in the case where the removable circuitry is removably connected to the host circuitry, the cold plate may establish thermal contact (or form a thermal interface) with the heat diffuser to transfer waste heat from the heat diffuser to the cold plate and thereby remove waste heat from the heat diffuser. However, maintaining thermal contact between the cold plate and the heat diffuser (i.e., between the two mating surfaces) can be difficult because the mating surfaces may not be flat and / or smooth. Moreover, the accumulation of debris and / or surface defects (e.g., scratches, dents, etc.) on either mating surface may impair heat transfer between the mating surfaces.

[0008] To address the aforementioned issues at the mating surfaces, the main circuitry may further include a thermal interface material, such as thermal grease. The thermal grease can be disposed on one of the mating surfaces such that it remains between the mating surfaces when the removable circuitry is removably connected to the main circuitry. Therefore, the thermal grease can maintain optimal thermal contact between the cold plate and the heat distributor, regardless of changes at the mating surfaces. However, repeated connection and disconnection between the removable circuitry and the main circuitry may cause the thermal grease to be scraped off from one of the mating surfaces. Furthermore, the thermal grease may need to be replaced after each maintenance event.

[0009] To overcome the aforementioned problems of thermally conductive grease, the host circuitry may include a thermal interface material, such as a plurality of thermally conductive spring fingers. For example, in the case where the removable circuitry is removably connected to the host circuitry, one end of each of these spring fingers may be attached to a cold plate, and the other end of each of these spring fingers may contact a heat diffuser. Each of these spring fingers may apply a contact force (e.g., spring force) to establish thermal contact with the heat diffuser, regardless of variations in the surface of the heat diffuser. However, the contact force applied by each of these spring fingers may be opposite to the insertion force applied by the user to connect the removable circuitry to the host circuitry or the removal force applied by the user to disconnect the removable circuitry from the host circuitry. In other words, each of these spring fingers may need to apply an optimal contact force to establish a thermal path between the heat diffuser and the cold plate, while simultaneously allowing the user to easily connect and easily disconnect the removable circuitry from the host circuitry. Furthermore, during repeated connection and disconnection between devices, the user may need to apply repetitive forces (e.g., multiple insertion and removal forces) to overcome the contact forces between the removable circuit device and the host circuit device. Unless the optimal contact force between the spring fingers and the heat diffuser is maintained within acceptable safety limits, such repetitive force application by the user can cause injury related to repetitive forces. However, adjusting these multiple spring fingers to maintain such optimal contact force can be very difficult.

[0010] A technical solution to the aforementioned problem may include providing a cooling assembly in the host circuitry of a circuit assembly to manage waste heat generated by the removable circuitry. In one or more examples, the cooling assembly includes a cooling component and a thermal gap pad, the thermal gap pad including an elastomeric component and a plurality of beams. The elastomeric component is an elastic and non-thermally conductive component, and each of the plurality of beams is a non-elastic and thermally conductive component. In some examples, the plurality of beams are embedded in the elastomeric component such that a first end of each beam protrudes beyond the top surface of the elastomeric component, a second end of each beam protrudes beyond the bottom surface of the elastomeric component, and a body portion extending between the first and second ends is held within the elastomeric component. The cooling component is rigidly connected to the cooling assembly, and the elastomeric component is movably connected to the cooling component. The thermal gap pad is disposed in the cooling assembly such that a first end of each of one or more of the plurality of beams is configured to be in first thermal contact with the cooling component, and a second end of each of the one or more of the beams is configured to be in second thermal contact with a heat sink of the removable circuitry.

[0011] In some examples, where the removable circuitry is removably connected to the host circuitry: i) the second end of each of the one or more beams rotates to contact the heat sink and displaces the elastomeric component upward toward the cooling component; ii) the elastomeric component causes each of the one or more beams to move upward toward the cooling component; and iii) the first end of each of the one or more beams rotates to contact the cooling component and establishes a thermal path between the cooling component and the heat sink via each of the one or more beams. Therefore, the second end of each of the one or more beams embedded in the elastomeric component can establish multiple points of contact with the heat sink, and the first end of each of the one or more beams embedded in the elastomeric component can create another multiple points of contact with the cooling component.

[0012] Elastomer components can apply contact forces to establish and maintain thermal contact between the heat sink and the cooling component via one or more beams. In some examples, the contact force applied by the elastomeric component can be adjusted by changing the type of material used in the elastomeric component. For example, using a stiffer material or a thinner elastomeric component can result in a higher contact force. Furthermore, the contact force applied by the elastomeric component can be adjusted by changing the physical properties or physical dimensions of the elastomeric component. Therefore, the ability of the elastomeric component to shift (e.g., bend or deform) when removable circuitry is connected can cause the one or more beams to change their physical geometry without affecting the contact force. Thus, the cross-sectional area of ​​the one or more beams can be maximized to establish a heat conduction path between the cooling component and the heat sink without compromising the significantly higher contact force that multiple spring fingers might require to establish the heat conduction path.

[0013] Furthermore, the elastomeric component can apply multiple contact forces (an array of contact forces) via these beams to create relatively low insertion forces for connecting the removable circuit device to the host circuit device and for disconnecting the removable circuit device from the host circuit device. Simultaneously, the elastomeric component can provide multi-point contact conductive cooling to the removable circuit device via these one or more beams for effective thermal management of the removable circuit device. In some examples, the multiple contact forces applied by the elastomeric component via these one or more beams are within acceptable safety limits to avoid repetitive force-related injuries. For example, the contact force applied by the elastomeric component via each beam can range from approximately 0.01 psi to 3.0 psi. In some examples, the elastomeric component can be displaced upwards toward the cooling component by approximately 0.3 mm to 1.5 mm to allow easy insertion of the removable circuit device into the host circuit device. The elastomeric component can maintain multi-point contact with the heat sink via these multiple beams, even if the cooling component and / or heat sink have non-smooth surfaces, uneven surfaces, surface defects, or debris, because the elastomeric component can independently move each beam to establish a direct thermal interface with the cooling component and heat sink. Therefore, the elastomeric component and these embedded multiple beams provide multi-point conductive cooling to overcome the aforementioned problems associated with multiple spring fingers.

[0014] In one or more examples of this disclosure, a cooling assembly for thermal management of a removable circuit device and a host circuit device having the cooling assembly are disclosed. The cooling assembly includes a cooling component and a thermal gap pad. The thermal gap pad includes an elastomeric component and a plurality of beams embedded in the elastomeric component. An elastomeric material is movably connected to the cooling component. Each of the plurality of beams includes a first end, a second end, and a body portion extending between the first end and the second end. The first end of each of the plurality of beams is configured to be in first thermal contact with the cooling component, and the second end of each of the plurality of beams is configured to be in second thermal contact with a heat sink. Attached Figure Description

[0015] The following examples will be described with reference to the attached figures.

[0016] FIG. 1A An exploded perspective view of a thermal gap pad according to an exemplary embodiment of the present disclosure is shown.

[0017] FIG. 1B Exemplary implementations according to this disclosure are shown. FIG. 1A A 3D view of the assembled thermal gap pad.

[0018] FIG. 1C An exploded perspective view of a cooling component according to an exemplary embodiment of the present disclosure is shown.

[0019] FIG. 1D Exemplary implementations according to this disclosure are shown. FIG. 1C A three-dimensional view of the assembled cooling components.

[0020] FIG. 1E Exemplary embodiments of the present disclosure are shown, including FIGS. 1A-1B thermal gap pad and FIGS. 1C-1D A block diagram of the cooling components of the cooling system.

[0021] FIG. 2 An example embodiment of the present disclosure is shown, comprising a host circuit board and FIG. 1E A schematic diagram of the main circuitry of the cooling components.

[0022] FIG. 3 A perspective view of a removable circuit device having a circuit board, multiple electronic components, and a heat sink, according to an exemplary embodiment of the present disclosure, is shown.

[0023] FIG. 4A A perspective view shows a portion of the circuit assembly of an electronic device according to an exemplary embodiment of the present disclosure, in which... FIG. 3 The removable circuit device is removably connected to FIG. 2 The main circuit equipment.

[0024] FIG. 4B Exemplary implementations according to this disclosure are shown. FIG. 4A A block diagram of a portion of the circuit components, in which... FIG. 1C The cooling components via FIG. 1B thermal gap pad and FIG. 3 The heatsink is in thermal contact, and FIG. 3 The circuit board is connected to the communication ground. FIG. 2 The main circuit board.

[0025] FIG. 5 A flowchart illustrating a thermal management method for a removable circuit device according to an example embodiment of the present disclosure is shown. Detailed Implementation

[0026] The following detailed description is with reference to the accompanying drawings. For purposes of explanation, please refer to Figures 1 to 12. FIG. 5 The components shown illustrate certain examples. However, the functions of the shown components may overlap, and they may exist in fewer or more elements and components. Furthermore, the disclosed examples can be implemented in various environments and are not limited to the examples shown. Furthermore, in conjunction with... FIG. 5 The described sequence of operations is illustrative and not intended to be limiting. Where possible, the same reference numerals are used in the drawings and in the following description to refer to the same or similar parts. However, it should be clearly understood that the drawings are for illustrative and descriptive purposes only. While several examples are described in this document, modifications, adaptations, and other implementations are possible. Therefore, the following detailed description does not limit the disclosed examples. Rather, the proper scope of the disclosed examples may be defined by the appended claims.

[0027] FIG. 1A The cooling component 100 (such as) is described FIG. 1E An exploded three-dimensional view of the thermal gap pad 102 (shown). FIG. 1B A three-dimensional view of the assembled thermal gap pad 102 is depicted. In the following description, for ease of explanation, it is also described... FIGS. 1A-1B The thermal gap pad 102 includes an elastomer component 106 and multiple beams 108 (such as...). FIG. 1B (As shown). Thermal gap pad 102 can be used between cooling component 104 and heat sink 310 (e.g., as shown). FIG. 3 and FIG. 4B A heat conduction path is established between the removable circuit device 300 and the multiple electronic components 306 (as shown) to dissipate heat from the removable circuit device 300. FIG. 3 and FIG. 4B Waste heat (as shown in the figure).

[0028] In some examples, the elastomeric component 106 is an elastic and non-thermally conductive component with a rectangular shape having a top surface 110 and a bottom surface 112. The elastomeric component 106 may be made of one of silicone, rubber, foam, or thermoplastic polyurethane materials. The elastomeric component 106 can be displaced (e.g., bent or deformed) when a force (or load) is applied to one of its surfaces and returns to its original shape after the force is removed. Furthermore, the elastomeric component 106 does not conduct (or transfer) waste heat from the heat sink 310 to the cooling component 104, even when the cooling component 104 and the heat sink 310 are arranged to be in thermal contact with each other via the elastomeric component 106. In some examples, the elastomeric component 106 has a length “L1” extending in the longitudinal direction 10, a width “W1” extending in the transverse direction 20, and a height “H1” extending in the vertical direction 30. Further, the elastomeric component 106 has a plurality of through holes 114. Each of the plurality of through holes 114 extends between the top surface 110 and the bottom surface 112 of the elastomeric member 106. Furthermore, each of the plurality of through holes 114 is spaced apart from each other along a longitudinal direction 30 and a transverse direction 20. For example, the plurality of through holes 114 are arranged along a length “L1” along a plurality of columns 120 to form a through hole array 115. The through hole array 115 may include multiple sets of through holes arranged along the plurality of columns 120, such as 115A, 115B...115N. In some examples, the first set of through holes 115A in the through hole array 115 is arranged along a first column 120A. Similarly, the second set of through holes 115B in the through hole array 115 is arranged along a second column 120B of the plurality of columns 120. In such an example, each hole in the first set of through holes 115A is positioned between two adjacent through holes in the second set of through holes 115B, and the first set of through holes 115A has an offset or staggered arrangement relative to the second set of through holes 115B. In some examples, each of the plurality of through holes 114 is an angled hole with a rectangular cross-sectional profile. Each of the plurality of through holes 114 has a first width “W2”. In one or more examples, each of the plurality of through holes 114 is inclined relative to the bottom surface 112 at a first angle “α1”. In some examples, the first angle “α1” can be in the range of approximately 30 degrees to approximately 60 degrees. The elastomeric component 106 further includes a plurality of retaining holes 116 (such as... FIG. 1B (Clearly shown). In some examples, each of these plurality of retaining holes 116 has a fishhook profile. The fishhook profile of each retaining hole includes a linearly extending through-hole portion 116A and a curved hole portion 116B connected to the linearly extending through-hole portion 116A. These plurality of retaining holes 116 are formed at the top surface 110 and positioned near the peripheral corner 118 of the elastomeric member 106.

[0029] exist FIG. 1AIn the examples, only one of the plurality of beams 108 is shown for ease of illustration. In one or more examples, for example, each of the plurality of beams 108 has an inclined S-shaped profile. In some examples, each of the plurality of beams 108 is made of one of copper, aluminum, alloy materials, etc. Each of the plurality of beams 108 is an inelastic and thermally conductive component. As used herein, "inelastic component" can refer to a rigid component that does not deform or bend when a force (or load) is applied. For example, an inelastic component may only move (or rotate) when a force is applied and cannot deform or bend. Furthermore, when the cooling component 104 and the radiator 310 are arranged to be in thermal contact with each other via corresponding beams 108, each of the plurality of beams 108 can conduct (or transfer) waste heat from the radiator 310 to the cooling component 104. In some examples, each of the plurality of beams 108 has a first end 122, a second end 124, and a body portion 126 extending between the first end 122 and the second end 124. In some examples, the first end 122 may be referred to as the top end and the second end 124 may be referred to as the bottom end. In other words, the first end 122 and the second end 124 are opposite ends of the corresponding beam 108. In some examples, the first end 122 has a first curved surface 122A and the second end 124 has a second curved surface 124A, which allows the first end 122 and the second end 124 of the corresponding beam 108 to rotate when in contact with the corresponding engagement surface. The second end 124 of each of the plurality of beams 108 further includes an electrically insulating layer 128 to prevent any electrical short circuit. For example, the second end 124 may be coated with an electrically insulating layer 128. In one or more examples, the electrically insulating layer 128 may be a thermally conductive layer. In some examples, the electrically insulating layer 128 may be made of one of ceramic or mica materials. In some examples, each beam 108 has a second height “H2” that is substantially greater than the first height “H1” of the elastomeric component 106. For example, the second height “H2” can be in the range of approximately 1.3 to 1.6 times the first height “H1”. Further, each beam 108 has a second width “W3”, which is substantially equal to the first width “W2” of each through-hole 114 of the elastomeric component 106. In some examples, the body portion 126 of each beam 108 is an angled body portion. In one or more examples, the body portion 126 of each beam 108 is inclined at a second angle “β1” relative to the second end 124. In some examples, the second angle “β1” can be in the range of approximately 30 degrees to approximately 60 degrees.

[0030] refer to FIG. 1BFor ease of illustration, the elastomeric component 106 is shown as transparent, and this illustration should not be construed as limiting the scope of this disclosure. The plurality of beams 108 are embedded in the elastomeric component 106. For example, each beam 108 is disposed in a corresponding through-hole among the plurality of through-holes 114 to embed the corresponding beam 108 into the elastomeric component 106. Since the second width “W3” of each beam 108 is substantially equal to the first width “W2” of each through-hole 114, each beam 108 is pressed into the corresponding through-hole 114 to be embedded in the elastomeric component 106. In some examples, the first end 122 of each beam 108 protrudes beyond the top surface 110 of the elastomeric component 106, the second end 124 of each beam 108 protrudes beyond the bottom surface 112 of the elastomeric component 106, and the body portion 126 of each beam 108 is positioned within the elastomeric component 106. Because the second height “H2” of each beam 108 is substantially greater than the first height “H1” of the elastomeric component 106, the first end 122 and the second end 124 protrude beyond the elastomeric component 106. In one or more examples, each of these plurality of beams 108 is a discrete beam. As used herein, “discrete beam” can refer to separate beams that are not directly connected or joined to each other. The discrete beams of these plurality of beams 108 are arranged adjacent to each other along the transverse direction 20 and the longitudinal direction 10 of the elastomeric component 106 to form a beam array 109. The beam array 109 may include multiple columns 120 (e.g., ... FIG. 1B Multiple sets of beams (as shown) are arranged, such as 109A, 109B, ..., 109N. In some examples, the first set of beams 109A in beam array 109 is arranged along the first column 120A. Similarly, the second set of beams 109B in beam array 109 is arranged along the second column 120B.

[0031] In one or more examples, the second end 124 of each of the plurality of beams 108 can absorb waste heat from the radiator 310, the body portion 126 can conduct the absorbed waste heat to the first end 122 of the corresponding beam 108, and the first end 122 can transfer the waste heat to the cooling component 104.

[0032] FIG. 1C An exploded perspective view of the cooling component 104 of the cooling assembly 100 is depicted. FIG. 1D Depicting FIG. 1C A perspective view of the assembled cooling component 104. In the following description, for ease of explanation, a perspective view is also described. FIGS. 1C-1DIn one or more examples, the cooling component 104 is a thermally conductive component made of copper, aluminum, or an alloy. The cooling component 104 can serve as a cold plate. The cooling component 104 may include a body 130 and a housing 132. The body 130 may include heat transfer features 134, such as fins or internal tubes. Further, the housing 132 may be fluid-tightly attached to the top of the body 130, or may be integral with the body 130 (e.g., the body 130 and housing 132 are formed as a single unit). The housing 132 may include a coolant inlet 136 and a coolant outlet 138. The body 130 may absorb waste heat from the first end 122 of one or more of the plurality of beams 108. Coolant may enter from the coolant inlet 136, absorb heat from the body 130 via the heat transfer features 134, and exit from the coolant outlet 138. The cooling assembly 100 may further include thermally conductive grease 140. In some examples, the thermally conductive grease 140 may be disposed on the outer surface of the body 130. Waste heat can be conducted from the first end 122 of one or more beams 108 to the body 130 of the cooling component 104 via thermally conductive grease 140. The thermally conductive grease 140 can be attached to the cooling component 104 via a thermally conductive epoxy resin layer.

[0033] FIGS. 1A-1B A block diagram depicts a cooling assembly 100 of a host circuit device 200, the cooling assembly having FIGS. 1C-1D Thermal gap pad 102 and FIG. 3 Cooling component 104. In one or more examples, cooling component 100 is used for removable circuit device 300 (such as...) FIG. 2 Thermal management (as shown). For example, cooling component 100 can be installed in host circuitry 200 (such as...). FIG. 2 The cooling assembly 100 is housed within the casing (shown) for thermal management of the removable circuitry 300. Therefore, when the removable circuitry 300 is removably connected to the host circuitry 200, the cooling assembly 100 can establish a thermal path between the heat sink 310 of the removable circuitry 300 and the cooling component 104 to conduct waste heat from these multiple electronic components 306 to the cooling component 104.

[0034] In some examples, the cooling component 104 may be rigidly coupled to the receiving housing 208 of the host circuitry 200 (e.g., FIGS. 1C-1D As shown). FIG. 1D As discussed herein, the cooling component 104 includes a body 130 and a housing 132. The body 130 may include heat transfer features 134 (such as... FIGS. 1A-1BAs shown), and housing 132 may be attached to the top of body 130. Housing 132 may include coolant inlet 136 and coolant outlet 138. Coolant inlet 136 may be connected to the inlet manifold of coolant distribution unit (CDU, not shown), and coolant outlet 138 may be connected to the outlet manifold of the CDU.

[0035] like FIG. 1B As discussed herein, the thermal gap pad 102 includes an elastomeric component 106 and a plurality of beams 108. In one or more examples, these plurality of beams 108 are embedded in the elastomeric component 106. For example, the elastomeric component 106 includes a plurality of through holes 114. In such an example, the plurality of beams 108 are disposed in the plurality of through holes 114 to be embedded in the elastomeric component 106. A first end 122 of each beam 108 protrudes beyond the top surface 110 of the elastomeric component 106, a second end 124 protrudes beyond the bottom surface 112 of the elastomeric component 106, and an angled body portion 126 is disposed within the elastomeric component 106. Further, the elastomeric component 106 having such a plurality of embedded beams 108 is movably connected to a cooling component 104. For example, the cooling assembly 100 includes a plurality of hook-like members 142 having a first end 142A and a second end 142B. The first end 142A may have a flat profile, and the second end 142B may have a fishhook profile. Specifically, the second end 142B has a linear extension portion 142B1 and a curved portion 142B2 connected to the linear extension portion 142B1. In such an example, the first end 142A is rigidly connected to the cooling member 104, and the second end 142B is disposed in a corresponding retaining hole among a plurality of retaining holes 116 formed in the elastomer member 106. For example, the linear extension portion 142B1 of each hook 142 may be disposed in the linearly extending through-hole portion 116A, and the curved portion 142B2 of each hook 142 may be disposed in the curved hole portion 116B of the corresponding retaining hole 116. The linearly extending through-hole portion 116A allows the elastomer member 106 to reciprocate relative to the linear extension portion 142B1, and the curved portion 142B2 may reciprocate with the curved hole portion 116B (e.g., ...). FIG. 2(As shown) engagement to movably connect the elastomeric component 106 to the cooling component 104. Therefore, this connection of the elastomeric component 106 to the cooling component 104 via a plurality of hooks 142 allows the elastomeric component 106 to have a movable connection relative to the cooling component 104. In some examples, where the elastomeric component 106 is movably connected to the cooling component 104, a first end 122 of one or more of the plurality of beams 108 is configured to be in a first thermal contact 144 with the cooling component 104, and a second end 124 of the one or more beams 108 may be configured to be in a second thermal contact 146 with the heat sink 310 of the removable circuit device 300. In some examples, the first thermal contact 144 is formed between wet contact surfaces, and the second thermal contact 146 is formed between dry contact surfaces. As used herein, "dry contact surface" can refer to the thermally joined surfaces of two objects that do not contain any intermediary element to allow waste heat to be transferred from one object to another. As used herein, "wet contact surface" can refer to the thermally joined surfaces of two objects, where an intermediary object (such as thermal grease) is included between them to allow waste heat to be transferred from one object to the other via the intermediary object. In some examples, where the one or more beams 108 form a first thermal contact and a second thermal contact with the cooling component 104 and the heat sink 310, respectively, a thermal path 148 can be established between the heat sink 310 and the cooling component 104 via each of the one or more beams 108 to conduct waste heat from the plurality of electronic components 306 to the cooling component 104.

[0036] FIG. 2 A perspective view of host circuit device 200 is depicted. In some examples, host circuit device 200 is a network switch, such as an Ethernet switch. In other examples, host circuit device 200 may be a Universal Serial Bus (USB) hub, etc., without departing from the scope of this disclosure. Host circuit device 200 may include a housing 202, a host circuit board 204, multiple sockets 206, and multiple cooling assemblies 100. It may be noted herein that, for ease of illustration, FIG. 1A The example only shows one socket 206 and one cooling assembly 100, and this illustration should not be construed as limiting the scope of this disclosure. The host circuit device 200 may be an integral part of the circuit assembly 400 (as shown in Figure 4) or may be a modular component that can be attached / connected to the circuit assembly 400 of an electronic device (such as a server system, storage system, network system, etc.).

[0037] The housing 202 can accommodate the main circuit board 204 and includes multiple receiving housings 208. FIG. 1EIn the example shown, the host circuit device 204 has six receiving housings 208 arranged adjacent to each other. Furthermore, these multiple receiving housings 208 are at least partially positioned on the host circuit board 204. Each receiving housing 208 includes a front end 210 with an opening 212 and a rear end 214.

[0038] The host circuit board 204 is disposed within the housing 202. In some examples, the host circuit board 204 may include a front end segment 220 and a rear end segment 222. In such examples, the rear end segment 222 may be connected to a printed circuit board (e.g., a motherboard, not shown) of the circuit assembly 400 via a suitable interconnection mechanism (e.g., soldering).

[0039] Multiple receptacles 206 are spaced apart from each other and mounted on the front end segment 220 of the host circuit board 204. For example, each receptacle 206 is positioned near the distal end 214 of the receiving housing 208, such that the open end 216 of the corresponding receptacle 206 is positioned facing the opening 212, and the closed end 218 of the corresponding receptacle 206 is positioned on the front end segment 220 of the host circuit board 204. In some examples, each receptacle 206 may be a small form factor pluggable (SFP) receptacle or an SFP port. Furthermore, each of these multiple receptacles 206 facing the opening 212 may receive a removable circuit device 300 and establish communication between the removable circuit device 300 and the circuit assembly 400 via the host circuit device 200.

[0040] In some examples, each cooling assembly 100 is disposed within a corresponding receiving housing 208, positioned adjacent to the host circuit board 204, and located near the front end 210 of the corresponding receiving housing 208. Further, each cooling assembly 100 is coupled to the corresponding receiving housing 208. For example, a cooling assembly 100 includes a cooling member 104 rigidly connected to the corresponding receiving housing 208 via a plurality of fasteners 224. Each cooling assembly 100 further includes a thermal gap pad 102. The thermal gap pad 102 includes a plurality of beams 108 and an elastomer member 106. In one or more examples, the plurality of beams 108 are embedded in the elastomer member 106. Further, the elastomer member 106 having the plurality of embedded beams 108 is movably connected to the cooling member 104 via a plurality of hooks 142. In some examples, where the elastomer member 106 is movably connected to the cooling member 104, the first end 122 of one or more of the plurality of beams 108 is positioned in a first thermal contact 144 with the cooling member 104 (e.g., ...). FIG. 1E (as shown), and the second end 124 of this one or more beams 108 may be configured to be in second thermal contact 146 with the heat sink 310 of the removable circuit device 300 (as shown). FIG. 1E(As shown). In some examples, where the one or more beams 108 establish a first thermal contact and a second thermal contact with the cooling component 104 and the radiator 310 respectively, a heat conduction path 148 can be established between the radiator 310 and the cooling component 104 via each of the one or more beams 108 (e.g., FIG. 3 As shown), waste heat is conducted from these multiple electronic components 306 to the cooling component 104.

[0041] FIG. 4A A perspective view of a removable circuit device 300 is depicted. In some examples, the removable circuit device 300 is a pluggable electronic device, such as a data communication device with a transceiver. In some examples, the transceiver may be a small form factor (SFP) transceiver coupled to an active optical cable (AOC, not shown) or a quad small form factor (QSFP) transceiver coupled to an AOC, etc. Other types of removable circuit devices 300 are conceivable, such as storage drives, such as NVMe storage drives, without departing from the scope of this disclosure.

[0042] The removable circuit device 300 includes a housing 302, a circuit board 304, multiple electronic components 306, a plug 308, a heat sink 310, and a handle 312. The housing 302 can shield the circuit board 304 and the multiple electronic components 306 from electromagnetic interference (EMI) and improve the reliability of the removable circuit device 300. The housing 302 may have an opening 314 at a distal end 316 and a handle 312 connected to a front end 318.

[0043] In some examples, circuit board 304 may include semiconductor components. Circuit board 304 is disposed on a base on housing 302. A plurality of electronic components 306 are disposed on circuit board 304. In some examples, the plurality of electronic components 306 may include processors, capacitors, resistors, etc. A plug 308 is connected to the distal end (not labeled) of circuit board 304, such that plug 308 is configured to face opening 314.

[0044] In some examples, the heat sink 310 is located within the housing 302 and thermally coupled to the plurality of electronic components 306. For example, the heat sink 310 is disposed on the plurality of electronic components 306 such that the inner surface 320 of the heat sink 310 is in thermal contact with the plurality of electronic components 306 and the outer surface 322 of the heat sink 310 protrudes beyond the removable circuit device 300. The inner surface 320 of the heat sink 310 can absorb waste heat from the plurality of electronic components 306 and transfer the absorbed waste heat to the outer surface 322. In one or more examples, the heat sink 310 comprises a thermally conductive material, such as copper, aluminum, etc. A handle 312 can be used to removably couple the removable circuit device 300 to the host circuit device 200.

[0045] FIG. 4B A perspective view depicting a portion of a circuit assembly 400 of an electronic device (not shown). FIG. 4A Depicting FIGS. 4A-4B A block diagram of a portion of a circuit assembly 400, which includes a cooling component 104, a heat sink 310, a circuit board 304, and a host circuit board 204. In the following description, for ease of illustration, [the following description also includes...] FIG. 2 Circuit assembly 400 may be housed within a casing 402 of an electronic device, such as a computer (server or storage device), network device (wireless access point or router), etc. Circuit assembly 400 may include a host circuit device 200, a printed circuit board (e.g., a motherboard, not shown), and a removable circuit device 300. In some examples, the host circuit device 200 and the printed circuit board may be housed within the casing 402. Furthermore, the printed circuit board may be communicatively coupled to the host circuit device 200, and the removable circuit device 300 may be removably coupled to the host circuit device 200.

[0046] As mentioned above FIG. 2 As discussed in the example, the host circuit device 200 includes a host circuit board 204, at least one socket 206, and a cooling assembly 100. The host circuit board 204 is disposed within the housing 202 of the host circuit device 200 (e.g., FIG. 2 (As shown). The socket 206 is disposed in the receiving housing 208 of the housing 202 (as shown). FIG. 3 (As shown) and mounted on the host circuit board 204. A cooling assembly 100 is disposed within and coupled to the receiving housing 208. The cooling assembly 100 includes a cooling component 104 rigidly connected to the receiving housing 208 and a thermal gap pad 102 movably connected to the cooling component 104. The thermal gap pad 102 includes an elastomer component 106 and a plurality of beams 108 embedded in the elastomer component 106.

[0047] As mentioned above FIG. 1A As discussed in the examples, the removable circuit device 300 includes a circuit board 304, a plurality of electronic components 306, a plug 308, and a heat sink 310. In the example embodiment of the removable circuit device 300, each of these plurality of electronic components 306 is shown as a processor for illustrative purposes.

[0048] The removable circuit device 300 can be removably connected to the host circuit device 200 via an opening 212 formed in the host circuit device 200. In one or more examples, the removable circuit device 300 is inserted (or pushed) into the receiving housing 208 in the longitudinal direction 10 via the opening 212 of the host circuit device 200 to removably connect the removable circuit device 300 to the host circuit device 200. In some examples, when the removable circuit device 300 is pushed (inserted) into the host circuit device 200, the circuit board 304 is communicatively coupled to the host circuit board 204. For example, the plug 308 of the circuit board 304 is inserted into the socket 206 of the host circuit board 204 to communicatively couple the circuit board 304 to the host circuit board 204. Further, when the removable circuit device 300 is inserted into the host circuit device 200, the first end 122 of each of one or more of the plurality of beams 108 is configured to be in first thermal contact 144 with the cooling member 104. In one or more examples, a first thermal contact 144 is formed between wet contact surfaces because thermally conductive grease 140 is present between the first end 122 of each of the one or more beams 108 and the cooling component 104. Further, a second end 124 of each of the one or more beams 108 is configured to be in second thermal contact 146 with the radiator 310. In one or more examples, a second thermal contact 146 is formed between dry contact surfaces because there is direct thermal contact between the second end 124 of each of the one or more beams 108 and the radiator 310. In one or more examples, when forming the first thermal contact 144 and the second thermal contact 146, a thermal path 148 is established between the cooling component 104 and the radiator 310 via each of the one or more beams 108. For example, the thermal path 148 is via the first end 122 of each of the one or more beams 108, the body portion 126 (e.g., ...), and the heat exchanger 146. FIG. 1E (As shown) and the second end 124 are established between the heat sink 310 and the cooling component 104. In one or more examples, waste heat is conducted from the removable circuit device 300 to the host circuit device 200 via a heat conduction path.

[0049] In some examples, each beam is aligned at a first position 408 before the removable circuit device 300 is removably connected to the host circuit device 200. When the removable circuit device 300 is connected to the host circuit device 200, the elastomeric component 106 applies a contact force to the heat sink 310 via the plurality of beams 108. In such an example, the second end 124 of each of the one or more beams 108 is rotated counterclockwise 404 to contact the heat sink 310 and displace the elastomeric component 106 upward 406 toward the cooling component 104. Thus, each of the one or more beams 108 moves from the first position 408 to the second position 410 and displaces the elastomeric component 106 upward toward the cooling component 104. In one or more examples, the elastomeric component 106 bends or deforms due to its displacement by the first end 122 of each of the one or more beams 108.

[0050] Furthermore, as the elastomeric component 106 moves upward, it simultaneously moves each of the one or more beams 108 upward toward the cooling component 104. Since the body portion 126 of each of the one or more beams 108 is embedded in the elastomeric component 106, the displacement of the elastomeric component 106 can cause the body portion 126 of each of the one or more beams 108 to be displaced via the elastomeric component 106.

[0051] Subsequently, displacement of the body portion 126 of each of the one or more beams 108 can cause the first end 122 of each of the one or more beams 108 to rotate clockwise 412 to contact the cooling component 104. Thus, a heat conduction path 148 is established between the cooling component 104 and the heat sink 310 via each of the one or more beams 108 (e.g., FIGS. 1C-1D (As shown). In some examples, the first group of beams 109A and the last group of beams 109N in the beam array 109 (only one beam in each group is shown for illustration) can be rotated by the elastomeric member 106 to a degree that they may not establish thermal contact with at least one of the radiator 310 or the cooling member 104. Because the first end 122 has a first curved surface 122A and the second end 124 has a second curved surface 124A, each of these one or more beams 108 can be easily rotated to contact the cooling member 104 and the radiator 310, respectively.

[0052] In some examples, the contact force applied by the elastomer component 106 can be adjusted based on at least one of the physical properties (e.g., stiffness) and physical dimensions (e.g., height, width, length) of the elastomer component 106. Therefore, the ability of the elastomer component to become displaced (e.g., deformed and bent) when the removable circuitry is removably connected can cause the one or more beams to change their physical geometry without affecting the contact force. Thus, the cross-sectional area of ​​the one or more beams 108 can be maximized to establish a thermal path 148 and heat conduction between the cooling component 104 and the heat sink 310 without compromising the significantly higher contact force that multiple spring fingers might require to establish the thermal path and heat conduction.

[0053] In one or more examples, the elastomeric component 106 may apply optimal contact force via each of the one or more beams 108 to allow the removable circuit device 300 to be easily inserted (e.g., inserted or slid into) into the host circuit device 200. For example, when the removable circuit device 300 is inserted into the host circuit device 200, the elastomeric component 106 may shift upward toward the cooling component 104 and bend slightly. However, the optimal contact force applied by the elastomeric component 106 via each of the one or more beams 108 may be sufficient to establish a thermal path between the cooling component 104 and the heat sink 310. In other words, the elastomeric component 106 may provide multiple contact forces (an array of contact forces) via each of the one or more beams 108 to create a substantially low insertion force for inserting the removable circuit device 300 into the host circuit device 200. In some examples, the multiple contact forces are within acceptable safety limits to avoid injury associated with repetitive forces (e.g., insertion or removal forces). In some examples, the amount of repetitive force required for the removable circuit device 300 to be removably connected to or disconnected from the host circuit device 200 may be approximately 20 pounds. The contact force applied by the elastomeric component 106 via each beam 108 may range from approximately 0.01 pounds to 3.0 pounds. In some examples, the elastomeric component 106 may be displaced upward toward the cooling component 104 in the range of approximately 0.3 mm to 1.5 mm to allow the removable circuit device 300 to be easily inserted into the host circuit device 200.

[0054] In one or more examples, the elastomeric component 106 can maintain multi-point contact with the cooling component 104 and the heat sink 310 via one or more beams 108, even if the mating surfaces have non-smooth surfaces, non-flat surfaces, surface defects, or debris, because the elastomeric component 106 can apply optimal contact force via each beam 108 to establish a thermal conduction path 148 between the cooling component 104 and the heat sink 310. It may be noted herein that the mating surfaces can refer to i) the upper surface of the heat sink 310 and ii) the bottom surface of the cooling component 104.

[0055] During operation, the plurality of electronic components 306 of the removable circuit device 300 can send, receive, process, or store data. Therefore, the removable circuit device 300 may generate waste heat. In some examples, the removable circuit device 300 may generate approximately 20 joules of waste heat per second. In such an example, the thermal coupling of the heat sink 310 to the inner surface 320 of the plurality of electronic components 306 can transfer waste heat from the plurality of electronic components 306 to the outer surface 322 of the heat sink 310. Furthermore, a second thermal contact 146 formed between the outer surface 322 of the heat sink 310 and the second end 124 of each of the one or more beams 108 (i.e., via a dry contact surface) transfers waste heat from the removable circuit device 300 to the thermal gap pad 102. The waste heat is further transferred from the second end 124 to the first end 122 via an angled body portion 126. Subsequently, a first thermal contact 144 formed between the bottom surface of the cooling component 104 and the first end 122 of each of the one or more beams 108 (i.e., through a wet contact surface) transfers waste heat from the thermal gap pad 102 to the cooling component 104.

[0056] Coolant can be supplied from coolant inlet 136 (e.g.) FIGS. 1C-1D (As shown) enters the cooling component 104, via the heat transfer feature 134 (e.g.) FIGS. 1C-1D As shown) from body 130 (as FIGS. 1C-1D (as shown) absorbs waste heat and can be discharged from coolant outlet 138 (e.g. FIG. 5 The heated liquid coolant can be pumped to the outside of the host circuitry 200 of the electronic device to exchange heat with an external coolant (not shown) and regenerate the liquid coolant. Thus, according to one or more examples of this disclosure, the elastomeric component 106 and the embedded plurality of beams 108 provide multi-point conductive cooling for effective thermal management of the removable circuitry 300, while simultaneously overcoming the problems associated with multiple spring fingers.

[0057] FIGS. 1A-1E This is a flowchart depicting a method 500 for thermal management of a removable device. It should be noted that method 500 is combined with, for example... FIG. 2 ,FIG. 3 , FIGS. 4A-4B and FIG. 4A Described.

[0058] Method 500 begins at block 502 and continues to block 504. At block 504, method 500 includes removably connecting the removable circuit device to the host circuit device, such as... FIG. 4B and FIG. 4A As described herein. In some examples, the removable circuitry includes a circuit board, multiple electronic components disposed on the circuit board, and a heat sink thermally coupled to the multiple electronic components. The host circuitry includes a host circuit board and a cooling assembly having a cooling component and a thermal gap pad including an elastomeric component movably coupled to the cooling component and multiple beams embedded in the elastomeric component. In some examples, removably connecting the removable circuitry to the host circuitry includes performing one of the following: applying an insertion force exceeding the contact force applied by the elastomeric component to establish a thermal path; or applying a removal force exceeding the contact force to disrupt the thermal path.

[0059] Furthermore, method 500 continues to block 506. At block 506, method 500 includes the step of communicatively connecting the circuit board to the host circuit board, such as... FIG. 4B and FIG. 4A As described herein. In some examples, box 506 includes inserting a plug belonging to a board of removable circuitry into a socket belonging to a host board of host circuitry to communicatively connect the board to the host board. Method 500 continues to box 508.

[0060] At block 508, method 500 includes setting a first end of each of one or more of the plurality of beams to be in first thermal contact with a cooling component and setting a second end of each of the one or more of the beams to be in second thermal contact with a heat sink, so as to establish a heat conduction path between the cooling component and the heat sink via each of the one or more of the beams, such as FIG. 4B and ​ As described herein. In one or more examples, a first thermal contact is formed between wet contact surfaces because of the presence of thermally conductive grease between the first end of each of the one or more beams and the cooling component. Furthermore, a second thermal contact is formed between dry contact surfaces because of direct thermal contact between the second end of each of the one or more beams and the radiator.

[0061] In some examples, establishing a heat conduction path includes rotating the second end of each of the one or more beams to contact the heat sink and displacing the elastomeric component upward toward the cooling component, and moving each of the one or more beams upward toward the cooling component via the elastomeric component. Additionally, establishing a heat conduction path includes rotating the first end of each of the one or more beams to contact the cooling component. Thus, a heat conduction path is established between the cooling component and the heat sink. Method 500 ends at block 512.

[0062] The various features described in the examples herein can be implemented in systems (such as host devices) and methods for thermal management of removable devices. In one or more examples, the elastomeric component maintains optimal contact force via one or more beams when the removable circuitry is inserted into the host circuitry, this optimal contact force being within acceptable safety limits to avoid injury associated with repetitive forces (e.g., insertion or removal forces). Furthermore, the elastomeric component is capable of maintaining multi-point contact with the removable circuitry and cooling components via these one or more beams, even if the surfaces of the cooling components and / or heat sinks have non-smooth surfaces, uneven surfaces, surface defects, or debris.

[0063] In the foregoing description, numerous details have been set forth to provide an understanding of the subject matter disclosed herein. However, embodiments may be practiced without some or all of these details. Other embodiments may include modifications, combinations, and variations of the details discussed above. The appended claims are intended to cover such modifications and variations.

Claims

1. A cooling assembly for a host circuit device, the cooling assembly comprising: Cooling components; as well as A thermal gap pad includes an elastomeric component movably connected to the cooling component and a plurality of beams embedded in and extending through the elastomeric component, wherein a first end of one or more of the plurality of beams is configured to be in first thermal contact with the cooling component, and a second end of each of the one or more of the beams is configured to be in second thermal contact with a heat sink of a removable circuit device, wherein the second end of each of the plurality of beams includes an electrically insulating layer, wherein the elastomeric component is an elastic and non-thermally conductive component, and wherein each of the plurality of beams is an inelastic and thermally conductive component. Wherein, when the removable circuitry is removably connected to the host circuitry, the elastomeric component is able to move each beam independently to establish a heat conduction path between the cooling component and the heat sink.

2. The cooling assembly according to claim 1, wherein, The elastomeric component includes a plurality of through holes extending between the top and bottom surfaces of the elastomeric component, wherein the plurality of beams are disposed in the plurality of through holes to be embedded in the elastomeric component.

3. The cooling assembly according to claim 2, wherein, Each of the plurality of through holes is an angled hole, and each of the plurality of beams includes an angled body portion extending between a first end and a second end of the corresponding beam.

4. The cooling assembly according to claim 2, wherein, The first end of each of the plurality of beams protrudes beyond the top surface of the elastomeric component, and the second end of each of the plurality of beams protrudes beyond the bottom surface of the elastomeric component.

5. The cooling assembly according to claim 1, wherein, The elastomeric component comprises at least one of silicone resin, rubber, foam, or thermoplastic polyurethane material, and each of the plurality of beams comprises at least one of copper, aluminum, or an alloy.

6. The cooling assembly according to claim 1, wherein, Each of the plurality of beams has a first end with thermally conductive grease to establish a first thermal contact with the cooling component, and wherein each of the plurality of beams has a second end with a dry contact surface to establish a second thermal contact with the radiator.

7. The cooling assembly according to claim 1, wherein, The plurality of beams are discrete beams, and the discrete beams are arranged to be adjacent to each other along the transverse and longitudinal directions of the elastomeric component to form a beam array.

8. The cooling assembly according to claim 1, wherein, When the removable circuit device is removably connected to the host circuit device, a contact force is applied to the heat sink by the elastomeric component via the plurality of beams, and wherein the contact force is adjusted based on at least one of the physical properties or physical dimensions of the elastomeric component.

9. The cooling assembly according to claim 1, wherein, Each of the plurality of beams has a first curved surface at its first end and a second curved surface at its second end, wherein, in the case that the removable circuit device is removably connected to the host circuit device: i) the second end of one or more of the plurality of beams rotates to contact the heat sink and displaces the elastomeric component upward toward the cooling component, ii) the elastomeric component causes each of the one or more beams to move upward toward the cooling component, and iii) the first end of each of the one or more beams rotates to contact the cooling component and establishes a heat conduction path between the cooling component and the heat sink via each of the one or more beams.

10. A circuit assembly, the circuit assembly comprising: A removable circuit device, the removable circuit device including a circuit board, a plurality of electronic components disposed on the circuit board, and a heat sink thermally connected to the plurality of electronic components; as well as A host circuit device, the host circuit device including a host circuit board and a cooling assembly, wherein the removable circuit device is removably connected to the host circuit device, wherein the cooling assembly includes: Cooling components; and A thermal gap pad, the thermal gap pad comprising an elastomeric component movably connected to the cooling component and a plurality of beams embedded in the elastomeric component and extending through the elastomeric component; Wherein, in the case that the removable circuit device is removably connected to the host circuit device: i) the host circuit board is communicatively connected to the circuit board, and ii) a first end of each of one or more of the plurality of beams is configured to be in first thermal contact with the cooling component and a second end of each of the one or more of the beams is configured to be in second thermal contact with the heat sink, so as to establish a heat conduction path between the cooling component and the heat sink via each of the one or more of the beams. The elastomeric component is an elastic and non-thermally conductive component, each of the plurality of beams is an inelastic and thermally conductive component, and each of the plurality of beams has a second end comprising an electrically insulating layer.

11. The circuit assembly of claim 10, wherein, The elastomeric component includes a plurality of through holes extending between a top surface and a bottom surface of the elastomeric component, wherein the plurality of beams are disposed in the plurality of through holes to be embedded in the elastomeric component, wherein each of the plurality of through holes is an angled hole, and wherein each of the plurality of beams includes an angled body portion extending between a first end and a second end of the corresponding beam.

12. The circuit assembly of claim 10, wherein, The elastomeric component comprises at least one of silicone resin, rubber, foam, or thermoplastic polyurethane material, and each of the plurality of beams comprises at least one of copper, aluminum, or an alloy.

13. The circuit assembly of claim 10, wherein, When the removable circuit device is removably connected to the host circuit device, a contact force is applied to the heat sink by the elastomeric component via the plurality of beams, and wherein the contact force is adjusted based on at least one of the physical properties or physical dimensions of the elastomeric component.

14. The circuit assembly of claim 10, wherein, Each of the plurality of beams has a first curved surface at its first end and a second curved surface at its second end, wherein, in the case that the removable circuit device is removably connected to the host circuit device: i) the second end of one or more of the plurality of beams rotates to contact the heat sink and displaces the elastomeric component upward toward the cooling component, ii) the elastomeric component causes each of the one or more beams to move upward toward the cooling component, and iii) the first end of each of the one or more beams rotates to contact the cooling component and establish the heat conduction path.

15. The circuit assembly of claim 10, wherein, The removable circuit device is a pluggable electronic device, which includes either a small pluggable SFP transceiver or a non-volatile memory fast NVMe storage drive.

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