Display panel and preparation method thereof

Abstract

The application discloses a display panel and a preparation method thereof. The display panel comprises a substrate, a black matrix layer arranged on one side of the substrate, the black matrix layer comprising a plurality of pixel openings arranged in a pattern, a passivation structure arranged in the pixel openings, the passivation structure being provided with a through hole penetrating through upper and lower surfaces of the passivation structure, the through hole being in a central-symmetrical pattern in a cross section along a plane of the substrate, and a color filter material at least partially filled in the through hole. The application designs the cross section shape of the through hole of the passivation structure as a central-symmetrical pattern, so that the color filter material at opposite positions in the through hole is subjected to the same force, the leveling property of the color filter material in the through hole is improved, the surface of the formed color filter material is more flat, and the brightness uniformity of the display screen is improved.

Description

Technical Field

[0001] This application relates to the field of display panel technology, specifically to a display panel and its manufacturing method. Background Technology

[0002] To reduce the power consumption of displays, technologies such as PLP (Pol Less Panel) and MLP (Micro Lens Panel) are generally used to manufacture display panels. PLP technology uses BM (black matrix) to block light in non-pixel areas and CF (color filter) material in pixel areas. Because CF material has a higher light transmittance than polarizers, it reduces reflection and power consumption. MLP technology, on the other hand, modifies the optical path design, utilizing the light-focusing properties of microlenses to focus light scattered to the sides of the screen onto the front, thereby improving screen brightness and reducing power consumption.

[0003] To further reduce display power consumption, PLP technology can be combined with MLP technology. However, when manufacturing display panels using a combination of PLP and MLP technologies, the surface of the CF material in the pixel area is prone to unevenness, resulting in poor brightness uniformity of the display. Summary of the Invention

[0004] This application provides a display panel and its manufacturing method, aiming to make the surface of the CF material smoother and improve the brightness uniformity of the display screen.

[0005] On one hand, this application provides a display panel, the display panel comprising:

[0006] Substrate;

[0007] A black matrix layer is disposed on one side of the substrate, and the black matrix layer includes a plurality of patterned pixel openings;

[0008] A passivation structure is disposed in the pixel opening. The passivation structure has a through hole penetrating the upper and lower surfaces of the passivation structure. The cross-sectional shape of the through hole along the plane of the substrate is a centrally symmetrical pattern.

[0009] Colored filter material is at least partially filled in the through-hole.

[0010] In some embodiments, the cross-sectional shape of the via along the plane of the substrate matches the pixel shape of the pixel opening.

[0011] In some embodiments, the refractive index of the color filter material is greater than that of the passivation structure, and the aperture of the through hole gradually increases from the side closer to the substrate to the side farther away from the substrate.

[0012] In some embodiments, the color filter material is further disposed on the surface of the passivation structure away from the substrate, and the upper surface of the color filter material is higher than the top of the passivation structure.

[0013] In some embodiments, the passivation structure has a notch on the surface away from the substrate, and the notch is filled with the color filter material.

[0014] In some embodiments, the black matrix layer includes multiple light-transmitting areas and light-blocking areas. The light-transmitting areas are the areas where the pixel openings are located, and the light-blocking areas are the areas where the light-blocking portions are located. The color filter material is also disposed on the upper surface of the light-blocking portions, and the bottom of the notch is at the same horizontal height as the upper surface of the light-blocking portions.

[0015] In some embodiments, the display panel further includes:

[0016] A planarization layer, wherein the black matrix layer, the passivation structure, and the color filter material are disposed between the substrate and the planarization layer.

[0017] In some embodiments, the substrate includes an array substrate, a light-emitting layer, an encapsulation layer, and a touch film layer disposed sequentially.

[0018] In some embodiments, the color filter material is any one of red filter material, green filter material, and blue filter material.

[0019] On the other hand, embodiments of this application provide a method for manufacturing a display panel, the method comprising:

[0020] Obtain the substrate;

[0021] A black matrix layer is formed on the substrate, the black matrix layer including a plurality of patterned pixel openings;

[0022] A passivation structure is formed on the substrate, the passivation structure is disposed in the pixel opening, the passivation structure is provided with a through hole penetrating the upper and lower surfaces of the passivation structure, and the cross-sectional shape of the through hole along the plane of the substrate is a centrally symmetrical pattern.

[0023] A color filter material is coated on the substrate, and the color filter material at least partially fills the through-hole.

[0024] In some embodiments, forming a passivation structure on the substrate includes:

[0025] A positive photoresist material is coated on the substrate.

[0026] The passivation structure is formed by using a slit mask process based on the development of the positive photoresist material, and the passivation structure has a notch on the surface away from the substrate.

[0027] The display panel and its fabrication method provided in this application include: a substrate; a black matrix layer disposed on one side of the substrate, the black matrix layer including a plurality of patterned pixel openings; a passivation structure disposed in the pixel openings, the passivation structure having through holes penetrating the upper and lower surfaces of the passivation structure, the cross-sectional shape of the through holes along the plane of the substrate being a centrally symmetrical pattern; and a color filter material, at least partially filling the through holes. This application embodiment designs the cross-sectional shape of the through holes of the passivation structure as a centrally symmetrical pattern, so that the color filter material on opposite sides of the through holes experiences consistent force, improving the leveling of the color filter material in the through holes, thereby making the surface of the formed color filter material smoother and improving the brightness uniformity of the display screen. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the film layer structure of a display panel using PLP and MLP technologies.

[0030] Figure 2 This is a schematic diagram of a film structure of a display panel provided in an embodiment of this application;

[0031] Figure 3 This is a schematic diagram of another film layer structure of the display panel provided in the embodiments of this application;

[0032] Figure 4 This is a schematic diagram of a film structure of a substrate provided in an embodiment of this application;

[0033] Figure 5 This is a schematic diagram of a film structure of an array substrate provided in an embodiment of this application;

[0034] Figure 6 This is a schematic diagram of another film layer structure of the array substrate provided in the embodiments of this application;

[0035] Figure 7This is a schematic diagram of a formation process for the passivation structure provided in an embodiment of this application;

[0036] Figure 8 This is a schematic diagram of another formation process of the passivation structure provided in the embodiments of this application;

[0037] Figure 9 This is a schematic diagram of coating a color filter material on a substrate according to an embodiment of this application.

[0038] Explanation of reference numerals in the attached figures:

[0039] 101. Substrate; 102. Light-blocking portion; 103. Passivation structure; 104. Color filter material; 105. Planarization layer; 106. Optical adhesive layer; 201. Glass substrate; 202. Array substrate; 203. Light-emitting layer; 204. Encapsulation layer; 205. Touch film layer; 301. First substrate; 302. Inorganic film layer; 303. Second substrate; 304. Water and oxygen barrier layer; 305. Buffer layer; 306. First insulating layer; 307. Second insulating layer; 308. Third insulating layer; 309. Passivation layer; 310. Thin-film transistor; 311. Anode; 312. Via; 313. Pixel definition layer; 314. Support pillar; 501. First mask; 502. Second mask. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0041] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified. In the description of this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in its actual use or working state, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0042] In this application, the term "exemplary" is used to mean "used as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use this application. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that this application can be made without using these specific details. In other instances, well-known structures and processes are not described in detail to avoid obscuring the description of this application with unnecessary detail. Therefore, this application is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0043] First, refer to Figure 1 , Figure 1 This is a schematic diagram of the film layer structure of a display panel using PLP and MLP technologies.

[0044] exist Figure 1 In this display panel, a substrate 101, a black matrix (BM) layer, a passivation structure 103, a color filter (CF) material 104, a planarization layer 105 (overcoat, OC), and an optical adhesive layer 106 (OCA) are included. The black matrix layer includes a light-blocking portion 102. Based on PLP technology, the display panel only allows light of the same color as the color filter material 104 to pass through; other light (including incident and reflected light) is absorbed by the light-blocking portion 102, thereby reducing reflection and power consumption. Based on MLP technology, light is refracted at the interface between the color filter material 104 and the passivation structure 103, thereby focusing the light and concentrating light scattered to the sides of the screen onto the front of the screen as much as possible. Combining PLP and MLP technologies increases the thickness of the color filter material 104, making its upper surface prone to unevenness, resulting in poor brightness uniformity of the display screen.

[0045] To address the aforementioned problems, this application provides a display panel and a method for manufacturing the same. Detailed descriptions follow. It should be noted that the order of description in the following embodiments is not intended to limit the preferred order of the embodiments.

[0046] On the one hand, this application provides a display panel, referring to Figure 2 , Figure 2 This is a schematic diagram of a film layer structure for a display panel.

[0047] exist Figure 2In the display panel, there are a substrate 101, a black matrix layer, a passivation structure 103, and a color filter material 104.

[0048] A black matrix layer is disposed on one side of the substrate 101. The black matrix layer includes a plurality of patterned pixel openings. The area where the pixel openings are located is the light-transmitting area, through which light can be transmitted. The black matrix layer also includes a light-shielding area, which is provided with a light-blocking part 102 for blocking light so that light cannot be transmitted through the light-shielding area.

[0049] The passivation structure 103 is typically made of materials such as silicon dioxide, silicon nitride, silicon oxynitride, and silicon phosphide glass. The passivation structure 103 is disposed within the pixel opening. The passivation structure 103 has through-holes penetrating its upper and lower surfaces. The cross-sectional shape of the through-holes along the plane of the substrate 101 is centrally symmetrical. This allows for the filling of color filter material 104 within the through-holes, and ensures that the color filter material 104 at opposite positions within the through-holes experiences uniform stress, improving the leveling properties of the color filter material 104 within the through-holes and resulting in a smoother surface for the formed color filter material 104. The centrally symmetrical shape can be a regular polygon, circle, rhombus, ellipse, etc. Taking a circle as an example, the stress on the color filter material 104 at various positions within the through-holes is more uniform, resulting in better leveling properties.

[0050] In some embodiments of this application, the cross-sectional shape of the via along the plane of the substrate 101 matches the pixel shape of the pixel opening. For example, when the pixel shape is circular, the cross-sectional shape of the via along the plane of the substrate 101 is also circular. Or, for example, when the pixel shape is rhomboid, the cross-sectional shape of the via along the plane of the substrate 101 is also rhomboid.

[0051] The color filter material 104 is any one of a red filter material, a green filter material, and a blue filter material, and can be set based on the actual pixel color arrangement rules. The color filter material 104 at least partially fills the through-hole, and to ensure that all light passing through the pixel opening is filtered, the color filter material 104 can also be disposed on the upper surface of the passivation structure 103, or on the outer side of the passivation structure 103 away from the through-hole, for example... Figure 2 As shown, the upper surface of the color filter material 104 is higher than the top of the passivation structure 103, so that the color filter material 104 is evenly coated on each surface of the passivation structure 103 away from the substrate 101.

[0052] In some embodiments of this application, when applying MLP technology, the refractive index of the color filter material 104 is greater than that of the passivation structure 103, and the aperture of the via gradually increases from the side closer to the substrate 101 to the side farther away from the substrate 101. The cross-section of the via perpendicular to the plane of the substrate 101 is as follows: Figure 2 As shown. In this way, light can be refracted at the junction of the color filter material 104 and the passivation structure 103, thereby focusing the light scattered to the side of the screen onto the front of the screen.

[0053] In some embodiments of this application, due to Figure 1 The distance between the center portion of the upper surface of the color filter material 104 and the substrate 101 is generally much greater than the distance between the upper surface of the color filter material 104 and the upper surface of the passivation structure 103. This results in a large step difference between the center and edge portions of the color filter material 104, leading to poor leveling of the color filter material 104 and an uneven upper surface. Therefore, this embodiment also provides a passivation structure 103, with a notch on the surface of the passivation structure 103 away from the substrate 101, and the notch is filled with the color filter material 104. For example... Figure 3 This is a schematic diagram of another film layer structure for a display panel. The passivation structure 103 has a notch on the surface away from the substrate 101, as shown in the diagram. Figure 3 As shown in the image. Compared to Figure 1 and Figure 2 , Figure 3 The area with larger segment difference in the color filter material 104 is less, which can improve the leveling of the color filter material 104 and make the upper surface of the color filter material 104 smoother.

[0054] In some embodiments of this application, such as Figure 3 As shown, the color filter material 104 is also disposed on the upper surface of the light-blocking part 102. The bottom of the notch is at the same horizontal height as the upper surface of the light-blocking part 102. That is, the height of the color filter material 104 on the upper surface of the light-blocking part 102 is consistent with the height of the color filter material 104 on the notch, thereby further eliminating the large step difference in the color filter material 104 and further improving the leveling of the color filter material 104.

[0055] In some embodiments of this application, such as Figure 2 and Figure 3As shown, the display panel also includes a planarization layer 105. A black matrix layer, a passivation structure 103, and a color filter material 104 are all disposed between the substrate 101 and the planarization layer 105. The material of the planarization layer 105 is generally a passivation material such as silicon dioxide, silicon nitride, silicon oxynitride, or silicon phosphosilicate glass. The planarization layer 105 can be generated based on processes such as coating, exposure, development, and curing. In the embodiments of this application, an optical adhesive layer 106 is also covered on the side of the planarization layer 105 away from the color filter material 104.

[0056] In some embodiments of this application, Figure 4 This is a schematic diagram of a film structure for a substrate 101. Figure 4 In the process, the substrate 101 includes a glass substrate 201, an array substrate 202, a light-emitting layer 203 (EL), an encapsulation layer 204 (TFE), and a touch film layer 205 (DOT) arranged sequentially.

[0057] In a further embodiment, the film structure of the array substrate 202 is described. Specifically, Figure 5 This is a schematic diagram of a film structure of the array substrate 202 provided in an embodiment of this application. Figure 5 In the array substrate 202, there are a first substrate 301, an inorganic film layer 302, a second substrate 303, a water and oxygen barrier layer 304 (M / B), a buffer layer 305, a first insulating layer 306, a second insulating layer 307 and a third insulating layer 308 stacked in sequence.

[0058] In the embodiments of this application, the thickness of the first substrate 301 can be set to 10 μm, the thickness of the inorganic film layer 302 can be set to 500 nm, the thickness of the second substrate 303 can be set to 6 μm, the thickness of the buffer layer 305 can be set to 500 nm, the thickness of the first insulating layer 306 can be set to 130 nm, the thickness of the second insulating layer 307 can be set to 130 nm, and the thickness of the third insulating layer 308 can be set to 300 nm. Furthermore, the thickness of each of the above-mentioned film layers can be set according to the actual thickness of the product, and is not further limited here.

[0059] Furthermore, a plurality of thin-film transistors 310 are disposed within the array substrate 202. Each thin-film transistor 310 includes an active layer, a first gate insulated on the active layer, a second gate insulated on the first gate, and a source / drain metal layer insulated on the second gate, wherein the source / drain metal layer is electrically connected to the active layer through a via. The specific film layer structure is as follows: Figure 5 As shown, the settings can be configured according to the common thin-film transistor structure, which will not be elaborated here.

[0060] In the embodiments of this application, the thickness of the active layer can be set to 45 nm, the thickness of the first gate can be set to 250 nm, the thickness of the second gate can be set to 250 nm, and the thickness of the source / drain metal layer can be set to 600 nm. Furthermore, the thickness of each of the above-mentioned layers can be set according to the actual thickness of the product, and is not further limited here.

[0061] Concurrently, a passivation layer 309 is also disposed on the third insulating layer 308. This passivation layer 309 completely covers the corresponding source / drain metal layers. An anode 311 is disposed on the passivation layer 309, and the anode 311 is electrically connected to the source / drain metal layers of the thin-film transistor through corresponding vias, thereby transmitting control signals. In the embodiments of this application, the thickness of the anode 311 can be set to 140 nm.

[0062] Furthermore, Figure 6 This is a schematic diagram of another film structure of the array substrate 202 provided in an embodiment of this application. Based on Figure 5 In the structure described above, a pixel definition layer 313 (PDL) is further disposed on the array substrate 202 to form pixel light-emitting regions. The pixel definition layer 313 is disposed on the passivation layer 309, and support pillars 314 are also disposed on the pixel definition layer 313 to support the upper film layer. Simultaneously, a via structure is provided on the pixel definition layer 313, corresponding to the anode 311. In the embodiments of this application, the thickness of the pixel definition layer 313 can be set to 1.5 μm.

[0063] Meanwhile, a via 312 is also provided on one side of the second thin-film transistor 310. This via 312 is etched with multiple layers of film, as detailed in [link to documentation]. Figure 5 The via 312 is structured as follows. The array substrate 202 can be bonded through this via 312. In embodiments of this application, the depth of the via 312 can be set to 1.5 μm.

[0064] In some embodiments of this application, the touch film layer 205 includes a first insulating film, a first metal layer, a second insulating film, and a second metal layer stacked sequentially. The first insulating film is an insulating material with a thickness that can be set to 300 nm. The first metal layer can be a film layer of titanium, aluminum, and titanium, with the thicknesses of titanium, aluminum, and titanium set to 50, 200, and 80 nm respectively. The first insulating film is an insulating material with a thickness that can be set to 300 nm. The second metal layer can be a film layer of titanium, aluminum, and titanium, with the thicknesses of titanium, aluminum, and titanium set to 50, 200, and 50 nm respectively. Furthermore, the thickness of each of the above-mentioned film layers can be set according to the actual thickness of the product, and is not further limited here.

[0065] On the other hand, this application provides a method for fabricating a display panel, the method comprising: obtaining a substrate 101, specifically, referring to... Figure 4 The substrate 101 shown has a film structure in which an array substrate 202, a light-emitting layer 203, an encapsulation layer 204, and a touch film layer 205 are sequentially fabricated on a glass substrate 201. The array substrate 202 can be configured according to... Figure 5 and Figure 6 The structure shown is fabricated using existing processes, which will not be described in detail here. A black matrix layer is formed on the substrate 101, including a plurality of patterned pixel openings. A passivation structure 103 is formed on the substrate 101, disposed in the pixel openings. The passivation structure 103 has through-holes penetrating its upper and lower surfaces, and the cross-sectional shape of the through-holes along the plane of the substrate 101 is centrally symmetrical. A color filter material 104 is coated on the substrate 101, and the color filter material 104 at least partially fills the through-holes. The resulting display panel is shown below. Figure 2 or Figure 3 As shown.

[0066] Reference Figure 7 , Figure 7 This is a schematic diagram of a black matrix layer formed on a substrate 101. As can be seen, pixel openings are formed between the light-blocking portions 102 in the black matrix layer. The black matrix layer can be generated based on processes such as coating, exposure, development, and curing.

[0067] Reference Figure 7 , Figure 7 This is a schematic diagram of a formation process for forming a passivation structure 103 on a substrate 101. Figure 7 In this process, a passivation structure 103 is formed on the substrate 101 using a partial masking method. Specifically, a positive photoresist material is first coated on the substrate 101, and then a first mask 501 is used to form a passivation structure 103 based on the development process of the positive photoresist material. Figure 2 The passivation structure 103 is shown. The first mask 501 includes a light-transmitting portion (black portion) and an opaque portion (transparent portion), so that light passing through the light-transmitting portion can be... Figure 7 The positive photoresist material directly below the light-transmitting portion is developed away, while the positive photoresist material directly below the opaque portion is not developed away, thus forming... Figure 2 The passivation structure 103 is shown. Of course... Figure 2 The passivation structure 103 shown can also be generated based on processes such as coating, exposure, development, and curing, or based on inkjet printing; no restrictions are imposed here.

[0068] Reference Figure 8 , Figure 8 This is a schematic diagram of another formation process for forming a passivation structure 103 on a substrate 101. Figure 8In this process, a passivation structure 103 is formed on the substrate 101 using a slit mask. Specifically, a positive photoresist material is first coated on the substrate 101, and then a second mask 502 is used to form a passivation structure 103 based on the development process of the positive photoresist material. Figure 3 The passivation structure 103 is shown. The second mask 502 includes a light-transmitting portion (black portion), an opaque portion (transparent portion), and a slit between the light-transmitting and opaque portions. This allows light passing through the light-transmitting portion to be focused and filtered. Figure 8 The positive photoresist material directly below the light-transmitting portion is developed away, while the positive photoresist material directly below the opaque portion is not developed away. The light intensity passing through the slit is reduced, thus partially eliminating the positive photoresist material directly below the slit, forming a passivation structure 103 with a gap away from the surface of the substrate 101, resulting in... Figure 3 The passivation structure 103 is shown. Of course... Figure 3 The passivation structure 103 shown can also be generated based on processes such as coating, exposure, development, and curing, or based on inkjet printing; no restrictions are imposed here.

[0069] Reference Figure 9 , Figure 9 This is a schematic diagram showing the coating of a color filter material 104 on a substrate 101. Figure 3 Under the action of the passivation structure 103 shown, the upper surface of the coated color filter material 104 is smoother, thereby improving the brightness uniformity of the display screen. Of course, Figure 9 The color filter material 104 shown can also be generated based on processes such as coating, exposure, development, and curing, and there are no restrictions here.

[0070] This application also provides a display device, which includes any of the display panels provided in this application. By improving the passivation structure in the display panel, the surface of the formed color filter material is made smoother, thereby improving the brightness uniformity of the display device.

[0071] In this embodiment of the application, the display device corresponding to the display panel can be any product or component with display function, such as a mobile phone, computer, electronic paper, monitor, laptop, or digital photo frame, and its specific type is not specifically limited.

[0072] The above provides a detailed description of a display panel and its manufacturing method according to the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the structure and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display panel, characterized in that, The display panel includes: Substrate; A black matrix layer is disposed on one side of the substrate. The black matrix layer includes a plurality of patterned pixel openings. The black matrix layer includes a plurality of light-transmitting areas and light-shielding areas. The light-transmitting areas are the areas where the pixel openings are located, and the light-shielding areas are the areas where the light-blocking parts are located. A color filter material is also disposed on the upper surface of the light-blocking parts. A passivation structure is disposed in the pixel opening. The passivation structure has a through hole penetrating the upper and lower surfaces of the passivation structure. The cross-sectional shape of the through hole along the plane of the substrate is a centrally symmetrical figure. A notch is provided on the surface of the passivation structure away from the substrate. The bottom of the notch is at the same horizontal height as the upper surface of the light-blocking part. A color filter material is at least partially filled in the through-hole, and the notch is filled with the color filter material.

2. The display panel as described in claim 1, characterized in that, The cross-sectional shape of the via along the plane of the substrate matches the pixel shape of the pixel opening.

3. The display panel as described in claim 1, characterized in that, The refractive index of the color filter material is greater than that of the passivation structure, and the aperture of the through hole gradually increases from the side closer to the substrate to the side farther away from the substrate.

4. The display panel as described in claim 1, characterized in that, The color filter material is also disposed on the surface of the passivation structure away from the substrate, and the upper surface of the color filter material is higher than the top of the passivation structure.

5. The display panel as described in claim 1, characterized in that, The display panel also includes: A planarization layer, wherein the black matrix layer, the passivation structure, and the color filter material are disposed between the substrate and the planarization layer.

6. The display panel as described in claim 1 or 5, characterized in that, The substrate comprises an array substrate, a light-emitting layer, an encapsulation layer, and a touch film layer arranged sequentially.

7. The display panel as described in claim 1, characterized in that, The color filter material is any one of red filter material, green filter material, and blue filter material.

8. A method for manufacturing a display panel, characterized in that, The method includes: Obtain the substrate; A black matrix layer is formed on the substrate. The black matrix layer includes a plurality of patterned pixel openings. The black matrix layer includes a plurality of light-transmitting areas and light-shielding areas. The light-transmitting areas are the areas where the pixel openings are located. The light-shielding areas are the areas where the light-blocking parts are located. A passivation structure is formed on the substrate, the passivation structure is disposed in the pixel opening, the passivation structure is provided with a through hole penetrating the upper and lower surfaces of the passivation structure, the cross-sectional shape of the through hole along the plane of the substrate is a centrally symmetrical figure, the surface of the passivation structure away from the substrate is provided with a notch, the bottom of the notch is at the same horizontal height as the upper surface of the light blocking part; A color filter material is coated on the substrate, the color filter material at least partially fills the through hole, the color filter material is also disposed on the upper surface of the light blocking part, and the notch is filled with the color filter material.

9. The method for manufacturing a display panel as described in claim 8, characterized in that, The formation of a passivation structure on the substrate includes: A positive photoresist material is coated on the substrate. The passivation structure is formed by using a slit mask process based on the development of the positive photoresist material.

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