Wafer and lower piece hand cleaning device
By designing the spray unit and wiping unit of the wafer and unloading hand cleaning device, automated cleaning of wafers and unloading hands was achieved, solving the problem of unloading hands contaminating the front side of the wafer and improving the cleaning effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CETC BEIJING ELECTRONICS EQUIP
- Filing Date
- 2023-10-27
- Publication Date
- 2026-06-02
AI Technical Summary
Existing wafer cleaning methods cannot effectively clean the wafer handlers, resulting in insufficient cleanliness of the wafer handlers contaminating the front side of the wafer when they are adsorbed.
A wafer and unloading hand cleaning device was designed, including a spray unit and a wiping unit. The spray unit sprays cleaning fluid onto the back of the wafer and the unloading hand, and the wiping unit wipes and cleans the wafer with a wiping roller. The device is combined with a drive unit and a sensing component to achieve automated cleaning.
Ensuring the cleanliness of the wafer unloading operator prevents contamination of the wafer's front side when picking up the next wafer, thus improving the cleaning effect on both the wafer and the unloading operator.
Smart Images
Figure CN117483304B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of integrated circuit manufacturing, specifically a wafer and unloading hand cleaning device. Background Technology
[0002] After the back side of the wafer is thinned by grinding, the wafer unloading operator picks up the wafer from the thinning machine and transfers it to the cleaning station for cleaning, thereby ensuring the cleanliness of the wafers placed in the cassette.
[0003] The existing cleaning method involves controlling the wafer unloading hand to hold the front side of the wafer, then moving the wafer face down above a brush, and then controlling the brush to wipe and clean the back side of the wafer. After cleaning, the wafer unloading hand loads the wafer into a cassette and moves it to a thinning machine to pick up the next wafer that has been ground and thinned.
[0004] The problem with existing cleaning methods is that the brushes cannot effectively clean the wafer handlers. Insufficiently cleaned handlers will contaminate the front side of the wafer when they are adsorbing it. Summary of the Invention
[0005] To solve the above-mentioned technical problems, this application provides a wafer and unloading hand cleaning device, which adopts the following technical solution:
[0006] A wafer and unloading hand cleaning apparatus, comprising:
[0007] The first and second uprights are set relative to each other;
[0008] The spray unit is disposed between the first vertical plate and the second vertical plate. The spray unit is used to spray cleaning solution onto the back of the wafer adsorbed on the wafer unattached, and to spray cleaning solution onto the wafer unattached.
[0009] The wiping unit includes a first eccentric disk, a second eccentric disk, a wiping roller, and a drive unit. The first eccentric disk is rotatably connected to the top of a first vertical plate, and the second eccentric disk is rotatably connected to the top of a second vertical plate. The two ends of the wiping roller are eccentrically connected to the first and second eccentric disks respectively and are arranged horizontally. The drive unit is disposed on the first vertical plate and is connected to the first eccentric disk for transmission. The drive unit drives the first eccentric disk to rotate, thereby causing the wiping roller to rotate and switch between a high wiping position and a low avoidance position. When the wiping roller rotates to the high wiping position, it wipes the back side of the wafer sprayed with cleaning fluid.
[0010] The cleaning plate has its two ends connected to the first and second vertical plates respectively and is set in a horizontal direction. The cleaning plate is used to cooperate with the spray unit to clean the lower plate.
[0011] After the wafer unloading hand picks up the front side of the wafer to be cleaned, it moves the wafer, back side down, above the first and second upright plates. The spray unit and wiping unit work together to clean the back side of the wafer. After placing the cleaned wafer into the hopper, the unloading hand returns to the area above the first and second upright plates, where the spray unit and cleaning plate work together to clean the unloading hand itself. This ensures the cleanliness of the unloading hand and prevents contamination of the front side of the wafer when picking up the next wafer.
[0012] In some embodiments, a first rotating shaft is provided at the center of the first eccentric disk, and the first eccentric disk is rotatably connected to the top of the first vertical plate via the first rotating shaft. A second rotating shaft is provided at the center of the second eccentric disk, and the second eccentric disk is rotatably connected to the top of the second vertical plate via the second rotating shaft. The wiping unit also includes a connecting rod, the two ends of which are eccentrically connected to the first eccentric disk and the second eccentric disk respectively and are arranged in a horizontal direction. The connecting rod and the wiping roller are located on opposite sides of the mounting axis of the first rotating shaft and the second rotating shaft.
[0013] By setting a first rotating shaft, a rotatable connection is achieved between the first eccentric disk and the first vertical plate; by setting a second rotating shaft, a rotatable connection is achieved between the second eccentric disk and the second vertical plate. Furthermore, by setting a connecting rod, the connection strength between the first and second eccentric disks is improved. In addition, since the connecting rod and the wiping roller are located on opposite sides of the mounting axes of the first and second rotating shafts, the stability of the wiping unit during rotation is improved, preventing excessive weight on the side containing the wiping roller from causing jamming or vibration during rotation.
[0014] In some embodiments, the drive unit includes a drive motor, a drive pulley, a driven pulley, and a synchronous belt, wherein: the drive motor is mounted on the first vertical plate, the drive pulley is connected to the drive end of the drive motor, the driven pulley is mounted on the top of the first vertical plate and coaxially connected to the first eccentric disk, and the synchronous belt is sleeved on the drive pulley and the driven pulley; the drive motor drives the driven pulley to rotate via the drive pulley and the synchronous belt, so as to drive the first eccentric disk and the second eccentric disk to rotate synchronously.
[0015] A simple and stable drive unit structure is provided, which realizes the rotation drive of the first eccentric disk.
[0016] In some embodiments, the wiping unit further includes a sensing component. When the wiping roller rotates to the wiping high position, the sensing component is triggered to generate a positioning sensing signal. After receiving the sensing signal, the wafer unloading hand drives the wafer sprayed with cleaning fluid to move, so that the back side of the wafer abuts against the wiping roller and moves back and forth relative to the wiping roller.
[0017] By incorporating a sensing component, the positioning of the wiping roller is detected, triggering the wafer unloading hand to move the wafer so that the back side of the wafer rests against the wiping roller and moves back and forth relative to it, thus completing the automatic cleaning of the back side of the wafer. Furthermore, this design prevents the wafer unloading hand from moving the wafer when the wiping roller is in a low, avoidable contact between the wafer edge and other components such as the spray unit or cleaning plate, which could cause wafer damage.
[0018] In some embodiments, the sensing component includes a photoelectric sensor and an optical path baffle, wherein: the optical path baffle is connected to the outer circumference of the drive pulley and rotates synchronously with the drive pulley; the photoelectric sensor is disposed on the first upright plate and close to the drive pulley, and the optical path of the photoelectric sensor is located on the rotation path of the optical path baffle; when the wiping roller rotates to the wiping high position, the optical path baffle blocks the optical path of the photoelectric sensor, and the photoelectric sensor is triggered to generate a position sensing signal.
[0019] A non-contact implementation of a sensing component is provided, which uses a photoelectric sensor and an optical path baffle to sense the position of the wiping roller.
[0020] In some embodiments, the sensing component includes a proximity sensor and a trigger plate, wherein: the trigger plate is connected to the outer circumference of the drive pulley and rotates synchronously with the drive pulley; the proximity sensor is disposed on the first vertical plate and close to the drive pulley; when the wiping roller rotates to the wiping high position, the trigger plate approaches the proximity sensor, and the proximity sensor is triggered to generate an arrival sensing signal.
[0021] Another non-contact implementation of the sensing component is provided, which uses a photoelectric sensor and an optical path baffle to sense the position of the wiping roller.
[0022] In some embodiments, the spray unit includes a spray pipe, with its two ends connected to a first vertical plate and a second vertical plate, respectively, and a plurality of rows of spray holes densely distributed along the extension direction of the spray pipe.
[0023] By spraying the back of the wafer or the unloading area through rows of spray holes on the spray pipe, a comprehensive cleaning of the back of the wafer or the unloading area can be ensured, thus improving the cleaning effect.
[0024] In some embodiments, among the plurality of rows of spray holes, at least one row of spray holes has a spray direction that is inclined upward and toward the wiping unit, at least one row of spray holes has a spray direction that is inclined upward and toward the cleaning plate, and at least one row of spray holes has a spray direction that is vertically upward.
[0025] By setting spray holes with a vertically upward spray direction, pre-spraying of the wafer or wafer unloading hand can be implemented. By setting spray holes facing the wiping unit, both the wiping unit and the wafer can be sprayed simultaneously during the cleaning of the wafer's back side by the wiping unit, thereby further improving the cleaning effect on the wafer's back side. Similarly, by setting spray holes facing the cleaning board, both the cleaning board and the wafer unloading hand can be sprayed simultaneously during the cleaning of the wafer unloading hand by the cleaning board, thereby further improving the cleaning effect on the wafer unloading hand.
[0026] In some embodiments, the wiping roller includes a roller shaft and a sponge, wherein a first end of the roller shaft is rotatably connected to a first eccentric disk, a second end of the roller shaft is rotatably connected to a second eccentric disk, and the sponge is detachably wrapped around the roller shaft.
[0027] The back of the wafer is wiped and cleaned by a sponge wrapped around a roller. This method ensures effective cleaning while preventing damage to the wafer. In addition, the sponge is easy to replace when it gets dirty.
[0028] In some embodiments, the cleaning plate includes a mounting plate and a cleaning stone disposed on the mounting plate.
[0029] The conventional cleaning tool has a flat adsorption surface. By controlling the movement of the cleaning tool closely against the cleaning stone, dirt on the adsorption surface of the tool can be quickly removed, thereby improving the cleaning effect of the tool. Attached Figure Description
[0030] Figure 1 This is a schematic diagram of the wafer and unloading hand cleaning device in an embodiment of this application;
[0031] Figure 2 This is a schematic diagram of the cleaning process of the back side of the wafer by the wafer and unloading hand cleaning device in the embodiments of this application;
[0032] Figure 3 This is a schematic diagram of the cleaning process of the wafer and unloading hand cleaning device on the back of the unloading hand in an embodiment of this application;
[0033] Figures 1 to 3 Includes:
[0034] First upright board 1;
[0035] Second upright board 2;
[0036] Spray unit 3;
[0037] Wiping unit 4: First eccentric disc 41, second eccentric disc 42, wiping roller 43, drive unit 44, connecting rod 45, drive motor 441, drive pulley 442, driven pulley 443, synchronous belt 444;
[0038] Cleaning plate 5;
[0039] Sensing component 6: photoelectric sensor 61, optical path baffle 62;
[0040] 100 wafers, 200 wafer cutters. Detailed Implementation
[0041] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0042] Current wafer cleaning methods cannot effectively clean the hands handling the wafers using brushes. Hands that are not sufficiently clean will contaminate the front side of the wafer when they are being cleaned.
[0043] Therefore, this application provides a wafer and wafer unloading hand cleaning device, which can perform separate cleaning of the wafer and the wafer unloading hand, thereby ensuring the cleanliness of the wafer unloading hand and preventing the wafer unloading hand from contaminating the front side of the wafer when picking up the next wafer.
[0044] like Figure 1 As shown, the wafer and unloading hand cleaning device in this embodiment includes a first upright plate 1, a second upright plate 2, a spray unit 3, a wiping unit 4, and a cleaning plate 5, wherein:
[0045] The first upright plate 1 and the second upright plate 2 are arranged opposite to each other.
[0046] The spray unit 3 is disposed between the first vertical plate 1 and the second vertical plate 2. The spray unit 2 is used to spray cleaning liquid onto the back side of the wafer 100 adsorbed on the wafer unattached hand 200, and to spray cleaning liquid onto the wafer unattached hand 200.
[0047] The wiping unit 4 includes a first eccentric disk 41, a second eccentric disk 42, a wiping roller 43, and a drive unit 44. The first eccentric disk 41 is rotatably connected to the top of the first vertical plate 1, and the second eccentric disk 42 is rotatably connected to the top of the second vertical plate 2. The two ends of the wiping roller 43 are eccentrically connected to the first eccentric disk 41 and the second eccentric disk 42, respectively, and are arranged horizontally. The drive unit 44 is disposed on the first vertical plate 1 and is drively connected to the first eccentric disk 42. The drive unit 44 drives the first eccentric disk 42 to rotate, thereby causing the wiping roller 43 to rotate and switch between a high wiping position and a low avoidance position. When the wiping roller 43 rotates to the high wiping position, it wipes the back side of the wafer 100 sprayed with cleaning fluid.
[0048] The two ends of the cleaning plate 5 are respectively connected to the first vertical plate 1 and the second vertical plate 2 and are arranged in a horizontal direction. The cleaning plate 5 is used to cooperate with the spray unit 5 to clean the lower hand 200.
[0049] To enable those skilled in the art to better understand the technical solution of this application, the following will combine... Figure 2 and Figure 3 The specific working process of the wafer and unloading hand cleaning device in the application embodiments is described by way of example.
[0050] Combination Figure 2 As shown, the first step is to clean the back side of the thinned wafer 100 (i.e., the grinding and thinning surface). The specific process is as follows:
[0051] The wafer unloading hand picks up the front side of the wafer 100 from inside the thinning machine, and then moves the wafer 100 with the back side facing down to above the first upright plate 1 and the second upright plate 2.
[0052] The spray unit 3 sprays the back side of the wafer 100.
[0053] After spraying is completed, the drive unit 44 drives the wiping roller 43 to the wiping high position via the first eccentric disk 41 and the second eccentric disk 42, so that the top of the wiping roller 43 is higher than the top of the first vertical plate 1 and the second vertical plate 2.
[0054] The wafer unloader 200 presses the back side of the wafer 100 against the wiping roller 4 and drives the wafer 100 to move back and forth relative to the wiping roller 4, so that the wiping roller 4 wipes the back side of the wafer 100. During this process, the spray unit 3 controls the spraying of cleaning fluid onto the back side of the wafer 100 and / or the wiping roller 4 to cooperate with the wiping roller 4 to complete the cleaning of the back side of the wafer 100.
[0055] After cleaning the back side of wafer 100, wafer unloading operator 200 places wafer 100 into the cassette. Of course, wafer 100 can be dried during this process.
[0056] Combination Figure 2 As shown, the next step is to clean the lower part of the blade 200. The specific process is as follows:
[0057] First, the drive unit 44 drives the wiping roller 43 to the low position of avoidance via the first eccentric disk 41 and the second eccentric disk 42.
[0058] After storing the wafer, the unloading hand 200 returns to the top of the first upright plate 1 and the second upright plate 2.
[0059] The spray unit 3 sprays water onto the lower handpiece 200.
[0060] After spraying, the unloading hand 200 moves and adheres to the cleaning plate 5. Then, the unloading hand 200 is controlled to move back and forth relative to the cleaning plate 5, so that the cleaning plate 5 cleans the adsorption surface of the unloading hand 200. During this process, the spraying unit 3 sprays cleaning fluid onto the unloading hand 20 and / or the cleaning plate 5 to cooperate with the cleaning plate 5 in cleaning the unloading hand 200.
[0061] After cleaning the wafer unloading hand 200, the wafer unloading hand 200 can pick up the next wafer 100 from the thinning machine and carry out the cleaning operation on the next wafer 100.
[0062] As can be seen, the wafer and wafer unloading hand cleaning device in this embodiment of the application realizes separate cleaning of the wafer and the wafer unloading hand, thereby ensuring the cleanliness of the wafer unloading hand and preventing the wafer unloading hand from contaminating the front side of the wafer when picking up the next wafer.
[0063] Optionally, a first rotating shaft is provided at the center of the first eccentric disk 41, and the first eccentric disk 41 is rotatably connected to the top of the first vertical plate 1 via the first rotating shaft. Similarly, a second rotating shaft is provided at the center of the second eccentric disk 42, and the second eccentric disk 42 is rotatably connected to the top of the second vertical plate via the second rotating shaft.
[0064] Optionally, the wiping unit 4 in this embodiment further includes a connecting rod 45, the two ends of which are eccentrically connected to the first eccentric disk 41 and the second eccentric disk 42 respectively and are arranged in a horizontal direction. In particular, the connecting rod 45 and the wiping roller 43 are located on opposite sides of the mounting axis of the first rotating shaft and the second rotating shaft.
[0065] Since the connecting rod 45 and the wiping roller 43 are located on opposite sides of the mounting axis of the first and second rotating shafts, the stability of the wiping unit 4 during rotation can be improved, preventing excessive weight on the side where the wiping roller 43 is located, which could cause the wiping unit 4 to jam or vibrate during rotation.
[0066] In addition, such as Figure 3 As shown, when the wiping roller 43 rotates to the low position, the connecting rod 45 rotates accordingly to the high position. Optionally, when the connecting rod 45 rotates to the high position, the top of the connecting rod is at the same height as the upper surface of the cleaning plate 5. In this way, during the cleaning process, the connecting rod 45 can also support and guide the lower handle 200, ensuring that the adsorption surface of the lower handle 200 is horizontal, thereby ensuring that the adsorption surface of the lower handle 200 remains in close contact with the cleaning plate 5 during the cleaning process. Optionally, the two ends of the connecting rod 45 are rotatably connected to the first vertical plate 1 and the second vertical plate 2, respectively, thus preventing the connecting rod 45 from obstructing the translation of the lower handle 200.
[0067] like Figures 1 to 3As shown, optionally, the drive unit 44 includes a drive motor 441, a drive pulley 442, a driven pulley 443, and a synchronous belt 444. The drive motor 441 is mounted on the first upright plate 1. The drive pulley 442 is connected to the drive end of the drive motor 441. The driven pulley 442 is mounted on the top of the first upright plate 1 and coaxially connected to the first eccentric disc 41. The synchronous belt 444 is sleeved on the drive pulley 442 and the driven pulley 443. The drive motor 441 drives the driven pulley 443 to rotate via the drive pulley 442 and the synchronous belt 444, thereby causing the first eccentric disc 41 and the second eccentric disc 42 to rotate synchronously, which in turn causes the wiping roller 43 to rotate and switch between a low-avoidance position and a high-wiping position.
[0068] Optionally, the wiping unit 4 in this embodiment further includes a sensing component 6. When the wiping roller 43 rotates to the wiping high position, the sensing component 6 is triggered to generate a positioning sensing signal. After receiving the sensing signal, the wafer unloading hand 200 drives the wafer 100 sprayed with cleaning fluid to move, so that the back side of the wafer 100 abuts against the wiping roller and moves back and forth relative to the wiping roller.
[0069] By setting the sensing component 6, the positioning of the wiping roller 43 is sensed, which in turn triggers the wafer unloading hand 200 to move the wafer 100 so that the back of the wafer 100 abuts against the wiping roller 43. This prevents the wafer unloading hand from lowering the wafer 100 when the wiping roller 43 is in the low avoidance position, causing the edge of the wafer 100 to come into contact with other components such as the spray unit 3 and the cleaning plate 5, resulting in damage to the wafer 100.
[0070] Figures 1 to 3 In the illustrated embodiment, the sensing component 6 includes a photoelectric sensor 61 and an optical path baffle 62. The optical path baffle 62 is connected to the outer circumference of the drive pulley 442 and rotates synchronously with the drive pulley 442. The photoelectric sensor 61 is disposed on the first upright plate 1 and close to the drive pulley 442, and the optical path of the photoelectric sensor 61 is located on the rotation path of the optical path baffle 62. When the wiping roller 43 rotates to the wiping high position, the optical path baffle 62 blocks the optical path of the photoelectric sensor 61, triggering the photoelectric sensor 61 to generate a position sensing signal.
[0071] Optionally, the photoelectric sensor 61 includes a U-shaped mounting base, a light emitter, and a photodetector. The U-shaped mounting base is mounted on the first vertical plate 1, and the light emitter and photodetector are respectively mounted on two opposing mounting arms of the U-shaped mounting base. The light emitter emits light towards the photodetector. The optical path baffle 62 can pass between the two mounting arms of the U-shaped mounting base when it rotates. When the wiping roller 43 rotates to the wiping high position, the optical path baffle 62 is exactly between the two mounting arms of the U-shaped mounting base, thereby blocking the optical path of the photoelectric sensor 61.
[0072] Of course, the sensing component 6 can also adopt other structures. For example, in some other embodiments, the sensing component 6 includes a proximity sensor and a trigger plate, wherein: the trigger plate is connected to the outer circumference of the drive pulley 442 and rotates synchronously with the drive pulley 442. The proximity sensor is disposed on the first upright plate 1 and close to the drive pulley 442. When the wiping roller 43 rotates to the wiping high position, the trigger plate rotates to the trigger position close to the proximity sensor, and the proximity sensor is triggered to generate a position sensing signal.
[0073] Optionally, the spray unit 3 includes a spray pipe, with its two ends connected to the first vertical plate 1 and the second vertical plate 2, respectively. Several rows of spray holes are densely distributed along the extension direction of the spray pipe. By spraying the back side of the wafer 100 or the wafer unloading hand 200 through the rows of spray holes on the spray pipe, comprehensive cleaning of the back side of the wafer 100 or the wafer unloading hand 200 can be ensured, improving the cleaning effect.
[0074] Optionally, in a plurality of rows (e.g., 3 rows) of spray holes, at least one row of spray holes has a spray direction that is inclined upward and toward the wiping roller 43 of the wiping unit 4, at least one row of spray holes has a spray direction that is inclined upward and toward the cleaning plate 5, and at least one row of spray holes has a spray direction that is vertically upward.
[0075] By setting spray holes with a vertically upward spray direction, pre-spraying of the wafer 100 or the wafer unloading hand 200 can be implemented. By setting spray holes facing the wiping unit 4, spraying can be performed simultaneously on the wiping unit 4 and the wafer 100 during the cleaning of the back side of the wafer 100 by the wiping unit 4, thereby further improving the cleaning effect on the back side of the wafer. Similarly, by setting spray holes facing the cleaning plate 5, spraying can be performed simultaneously on the cleaning plate 5 and the wafer unloading hand 200 during the cleaning of the wafer unloading hand 200 by the cleaning plate 5, thereby further improving the cleaning effect on the wafer unloading hand 200.
[0076] Optionally, the wiping roller 43 includes a roller shaft and a sponge. The first end of the roller shaft is rotatably connected to a first eccentric disk 41, and the second end of the roller shaft is rotatably connected to a second eccentric disk 42. The sponge is detachably wrapped around the roller shaft. Wiping and cleaning the back side of the wafer is performed using the sponge wrapped around the roller shaft, ensuring cleaning effectiveness while preventing pressure damage to the wafer. Furthermore, the sponge is easy to replace when dirty.
[0077] Optionally, the cleaning plate 5 includes a mounting plate and a cleaning stone mounted on the mounting plate. The adsorption surface of the lower hand 200 is flat. By controlling the lower hand 200 to move closely against the cleaning stone, dirt on the adsorption surface of the lower hand 200 can be quickly removed, thereby improving the cleaning effect on the lower hand 100.
[0078] The foregoing has provided a sufficiently detailed and specific description of this application. Those skilled in the art should understand that the descriptions in the embodiments are merely exemplary, and all changes made without departing from the true spirit and scope of this application should fall within the protection scope of this application. The scope of protection claimed in this application is defined by the claims, and not by the above descriptions in the embodiments.
Claims
1. A wafer and unloading hand cleaning device, characterized in that, The cleaning device includes: The first and second uprights are set relative to each other; A spray unit is disposed between the first vertical plate and the second vertical plate. The spray unit is used to spray cleaning fluid onto the back of the wafer attached to the wafer holder, and to spray cleaning fluid onto the wafer holder that is not attached to the wafer holder. The wiping unit includes a first eccentric disk, a second eccentric disk, a wiping roller, and a drive unit. Wherein: the first eccentric disk is rotatably connected to the top of the first upright plate, the second eccentric disk is rotatably connected to the top of the second upright plate, the two ends of the wiping roller are respectively eccentrically connected to the first eccentric disk and the second eccentric disk and are arranged in a horizontal direction, the driving unit is arranged on the first upright plate and is drivenly connected to the first eccentric disk, the driving unit is used to drive the first eccentric disk to rotate, so as to drive the wiping roller to rotate and switch between the wiping high position and the avoidance low position; when the wiping roller rotates to the wiping high position, the wiping roller wipes the back side of the wafer sprayed with cleaning fluid; A cleaning plate, the two ends of which are respectively connected to the first upright plate and the second upright plate and are arranged in a horizontal direction, the cleaning plate is used to cooperate with the spray unit to clean the lower hand. A first rotating shaft is provided at the center of the first eccentric disk, and the first eccentric disk is rotatably connected to the top of the first upright plate via the first rotating shaft. A second rotating shaft is provided at the center of the second eccentric disk, and the second eccentric disk is rotatably connected to the top of the second upright plate via the second rotating shaft. The wiping unit also includes a connecting rod, the two ends of which are eccentrically connected to the first eccentric disk and the second eccentric disk and are arranged in a horizontal direction, and the connecting rod and the wiping roller are located on opposite sides of the mounting axis of the first rotating shaft and the second rotating shaft.
2. The wafer and unloading hand cleaning apparatus as described in claim 1, characterized in that, The drive unit includes a drive motor, a driving pulley, a driven pulley, and a synchronous belt, wherein: The drive motor is mounted on the first upright plate, the drive pulley is connected to the drive end of the drive motor, the driven pulley is mounted on the top of the first upright plate and coaxially connected to the first eccentric disc, and the synchronous belt is sleeved on the drive pulley and the driven pulley; The drive motor drives the driven pulley to rotate via the driving pulley and the synchronous belt, thereby causing the first eccentric disk and the second eccentric disk to rotate synchronously.
3. The wafer and unloading hand cleaning apparatus as described in claim 2, characterized in that, The wiping unit also includes a sensing component. When the wiping roller rotates to the wiping high position, the sensing component is triggered to generate a positioning sensing signal. After receiving the sensing signal, the wafer unloading hand drives the wafer sprayed with cleaning fluid to move, so that the back side of the wafer abuts against the wiping roller and moves back and forth relative to the wiping roller.
4. The wafer and unloading hand cleaning apparatus as described in claim 3, characterized in that, The sensing component includes a photoelectric sensor and an optical path baffle, wherein: The optical path baffle is connected to the outer circumference of the drive pulley, and the optical path baffle rotates synchronously with the drive pulley; The photoelectric sensor is mounted on the first upright plate and close to the drive pulley, and the optical path of the photoelectric sensor is located on the rotation path of the optical path baffle. When the wiping roller rotates to the wiping high position, the optical path baffle blocks the optical path of the photoelectric sensor, and the photoelectric sensor is triggered to generate the position sensing signal.
5. The wafer and unloading hand cleaning apparatus as described in claim 3, characterized in that, The sensing component includes a proximity sensor and a trigger plate, wherein: The trigger plate is connected to the outer circumference of the drive pulley, and the trigger plate rotates synchronously with the drive pulley; The proximity sensor is mounted on the first upright plate and is close to the drive pulley; When the wiping roller rotates to the wiping high position, the trigger piece approaches the proximity sensor, and the proximity sensor is triggered to generate the positioning sensing signal.
6. The wafer and unloading hand cleaning apparatus as described in claim 1, characterized in that, The spray unit includes a spray pipe, with its two ends connected to the first upright plate and the second upright plate, respectively. The spray pipe has several rows of spray holes densely distributed along its extension direction.
7. The wafer and unloading hand cleaning apparatus as described in claim 6, characterized in that, In the plurality of rows of spray holes, at least one row of spray holes has a spray direction that is inclined upward and toward the wiping unit, at least one row of spray holes has a spray direction that is inclined upward and toward the cleaning plate, and at least one row of spray holes has a spray direction that is vertically upward.
8. The wafer and unloading hand cleaning apparatus as described in claim 1, characterized in that, The wiping roller includes a roller shaft and a sponge, wherein a first end of the roller shaft is rotatably connected to a first eccentric disk, a second end of the roller shaft is rotatably connected to a second eccentric disk, and the sponge is detachably wrapped around the roller shaft.
9. The wafer and unloading hand cleaning apparatus as described in claim 1, characterized in that, The cleaning plate includes a mounting plate and a cleaning stone mounted on the mounting plate.