Ink for circuit board and method for preparing the same

Abstract

The ink for a circuit board provided by the present application comprises the following components by mass: 25-35 parts of resin, 40-50 parts of dilution solvent, 25-35 parts of pigment, 10-15 parts of curing agent, and 10-15 parts of auxiliary agent, wherein the pigment is modified titanium white powder. By using the resin and dilution solvent as the ink solution system, a moderate viscosity ink solution system can be obtained, and by further adding the pigment, curing agent and auxiliary agent, an ink with certain color can be prepared. Specifically, the pigment is modified titanium white powder, which is a white particle with high reflection brightness, and the modified titanium white powder has good durability and stable properties and is not prone to deterioration, thereby affecting the brightness of the surface of the circuit board, and improving the light efficiency of the surface of the circuit board while improving the durability of the ink for the circuit board.

Description

Technical Field

[0001] This invention relates to an ink material, and more particularly to an ink for circuit boards and a method for preparing the same. Background Technology

[0002] Ink is a commonly used printing material that can be sprayed or printed onto specific items to form an ink layer. Specifically, it can form text or certain graphics. Ink can be used for various printing applications such as books, packaging, architectural decoration, and circuit boards. Circuit boards are electronic products, and printing ink can provide excellent insulation and protection for the metal layers. As the application of circuit boards increases, the application of ink for circuit boards also increases.

[0003] However, PCB inks typically use white pigments as the pigment in the ink system, thus forming white inks. Therefore, PCB inks are also called white inks. When PCBs are in use, the electrical components on the PCBs generate heat, and the ink is prone to deterioration and yellowing when heated, which greatly affects the gloss of the PCB surface. Therefore, it is necessary to provide a PCB ink with high gloss efficiency and good durability. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide an ink for circuit boards.

[0005] The objective of this invention is achieved through the following technical solution:

[0006] An ink for circuit boards comprises the following components in parts by weight: 25-35 parts resin, 40-50 parts diluent, 25-35 parts pigment, 10-15 parts curing agent, and 10-15 parts additives, wherein the pigment is modified titanium dioxide.

[0007] In one embodiment, the resin is at least one selected from epoxy resin, acrylic resin, and phenolic resin.

[0008] In one embodiment, the modified titanium dioxide is prepared by: providing titanium dioxide, adding the titanium dioxide to deionized water and a dispersant, stirring and dispersing, then grinding to obtain a titanium dioxide slurry, diluting the titanium dioxide slurry with deionized water to obtain a diluted titanium dioxide slurry, heating the diluted titanium dioxide slurry, adding a pH adjuster to adjust the pH of the diluted titanium dioxide slurry to 6-7, providing an alkaline aluminum compound, adding the alkaline aluminum compound to the diluted titanium dioxide slurry, and stirring for 40-120 minutes to obtain primary titanium dioxide. Titanium dioxide coating slurry is prepared by providing a dilute sulfuric acid solution and an acidic aluminum compound. The dilute sulfuric acid solution is added to the primary titanium dioxide coating slurry, and the pH of the primary titanium dioxide coating slurry is adjusted to 5-6. The acidic aluminum compound is added to the primary titanium dioxide coating slurry, and the mixture is stirred for 40-120 minutes to obtain a secondary titanium dioxide coating slurry. The secondary titanium dioxide coating slurry is then filtered to obtain a titanium dioxide filter cake. The titanium dioxide filter cake is washed and dried to obtain a clean titanium dioxide filter cake. The clean titanium dioxide filter cake is then pulverized, and a polysiloxane emulsion is added and mixed evenly to obtain the modified titanium dioxide.

[0009] In one embodiment, the titanium dioxide is rutile titanium dioxide.

[0010] In one embodiment, the basic aluminum compound is sodium aluminate.

[0011] In one embodiment, the acidic aluminum compound is aluminum sulfate.

[0012] In one embodiment, the pH adjuster is a sodium hydroxide solution or a dilute sulfuric acid solution.

[0013] In one embodiment, during the heating operation of the titanium dioxide dilution slurry, a water bath is used to heat the titanium dioxide dilution slurry, and the heating temperature is controlled at 50°C to 55°C.

[0014] In one embodiment, the additives include 2-3 parts antioxidant, 2-3 parts defoamer, 2-3 parts leveling agent, 2-3 parts dispersant, and 2-3 parts anti-settling agent.

[0015] A method for preparing ink for circuit boards includes the following steps:

[0016] The following components are provided in parts by weight: 25-35 parts resin, 40-50 parts diluent, 25-35 parts pigment, 10-15 parts curing agent, and 10-15 parts additives, wherein the pigment is modified titanium dioxide;

[0017] The resin, the diluent, the pigment, the curing agent, and the additives are added to a planetary mixer in proportion and stirred for 3000 r / min to 3500 r / min for 30 min to 40 min to obtain ink for circuit boards.

[0018] Compared with the prior art, the present invention has at least the following advantages:

[0019] The aforementioned circuit board ink, by using resin and diluting solvent as the ink solution system, can obtain an ink solution system with a suitable viscosity. By adding pigments, curing agents, and additives, an ink with a certain color can be prepared. Specifically, the pigment used is modified titanium dioxide, which is a white particle with high reflectivity. This allows for the preparation of a high-brightness white ink. Furthermore, modified titanium dioxide has good durability, stable properties, and is not easily deteriorated, thus affecting the gloss of the circuit board surface. Therefore, while improving the surface gloss of the circuit board, it also helps to improve the durability of the circuit board ink. Attached Figure Description

[0020] Figure 1 This is a flowchart illustrating a method for preparing ink for circuit boards according to one embodiment. Detailed Implementation

[0021] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0022] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0024] In one embodiment, an ink for circuit boards comprises the following components in parts by weight: 25-35 parts resin, 40-50 parts diluent, 25-35 parts pigment, 10-15 parts curing agent, and 10-15 parts additives, wherein the pigment is modified titanium dioxide.

[0025] It should be noted that resin is a commonly used adhesive, and resin materials are readily available. By compounding it with a diluent, an ink solution system with suitable viscosity can be obtained, which is beneficial for better adhesion to the specific circuit board surface. In this embodiment, the diluent is at least one of ethanol, ethyl acetate, n-butanol, and butyl acetate. Ethanol, ethyl acetate, n-butanol, and butyl acetate are all commonly used diluents for inks, readily available, and easily volatile, non-toxic, and harmless, causing no pollution and facilitating subsequent drying. The diluent can be any one of ethanol, ethyl acetate, n-butanol, and butyl acetate, or a mixture of ethanol, ethyl acetate, n-butanol, and butyl acetate, used to adjust the resin viscosity and prepare a circuit board ink with suitable viscosity. Furthermore, by adding pigments, curing agents, and additives, the pigment is used to adjust the ink color, and the curing agent is used to promote the curing and shaping of the circuit board ink after it is coated onto the specific circuit board. For example, [the following is an example of a specific additive]. The curing agent can be a photocuring agent, specifically 2,4,6-trimethylbenzoyl-diphenylphosphine oxide. 2,4,6-trimethylbenzoyl-diphenylphosphine oxide is a highly efficient photocuring agent that can achieve rapid curing under light conditions. Adding additives helps to better prepare inks for circuit boards. For example, additives include antioxidants, defoamers, leveling agents, dispersants, and anti-settling agents. Antioxidants improve the durability of the finished circuit board ink, while defoamers, leveling agents, dispersants, and anti-settling agents improve the fluidity and uniformity of the prepared circuit board ink system, thus contributing to the preparation of higher quality circuit board inks. Furthermore, by using modified titanium dioxide as a pigment, which is a white particle with high reflectivity, high-brightness white ink can be prepared. Modified titanium dioxide also has good durability, stable properties, and is not easily degraded, thus affecting the gloss of the circuit board surface. Therefore, while improving the surface gloss of the circuit board, it also helps to improve the durability of the circuit board ink.

[0026] In one embodiment, the resin is at least one selected from epoxy resin, acrylic resin, and phenolic resin. It is understood that the resin used is epoxy resin, acrylic resin, or phenolic resin, all of which are commonly used resins with a certain viscosity. Epoxy resin, acrylic resin, and phenolic resin can be used in combination or individually, are readily available, inexpensive, and conducive to industrial production, resulting in finished circuit board inks with good viscosity.

[0027] In one embodiment, the modified titanium dioxide is prepared by: providing titanium dioxide, adding the titanium dioxide to deionized water and a dispersant, stirring and dispersing, then grinding to obtain a titanium dioxide slurry, diluting the titanium dioxide slurry with deionized water to obtain a diluted titanium dioxide slurry, heating the diluted titanium dioxide slurry, adding a pH adjuster to adjust the pH of the diluted titanium dioxide slurry to 6-7, providing an alkaline aluminum compound, adding the alkaline aluminum compound to the diluted titanium dioxide slurry, and stirring for 40-120 minutes to obtain primary titanium dioxide. Titanium dioxide coating slurry is prepared by providing a dilute sulfuric acid solution and an acidic aluminum compound. The dilute sulfuric acid solution is added to the primary titanium dioxide coating slurry, and the pH of the primary titanium dioxide coating slurry is adjusted to 5-6. The acidic aluminum compound is added to the primary titanium dioxide coating slurry, and the mixture is stirred for 40-120 minutes to obtain a secondary titanium dioxide coating slurry. The secondary titanium dioxide coating slurry is then filtered to obtain a titanium dioxide filter cake. The titanium dioxide filter cake is washed and dried to obtain a clean titanium dioxide filter cake. The clean titanium dioxide filter cake is then pulverized, and a polysiloxane emulsion is added and mixed evenly to obtain the modified titanium dioxide.

[0028] It should be noted that in this embodiment, titanium dioxide particles are provided, specifically rutile titanium dioxide. That is, rutile titanium dioxide is used, as it is a relatively pure form, minimizing the introduction of impurities and making it the best raw material for preparing titanium dioxide. Titanium dioxide and a dispersant are added to deionized water for dispersion to obtain a titanium dioxide slurry. Sodium silicate solution can be used as the dispersant, providing good dispersion. Then, by adding an appropriate amount of deionized water to dilute the titanium dioxide slurry, a titanium dioxide diluted slurry with a suitable concentration can be obtained, avoiding excessively high concentrations that would hinder subsequent coating operations. Under heating conditions, a pH adjuster is added according to the original pH value of the titanium dioxide diluted slurry to adjust the pH to 6-7, placing the slurry in a slightly acidic to neutral state. At this point, by first adding… Introducing an alkaline aluminum compound increases the pH of the titanium dioxide dilution slurry, adjusting it to a weakly alkaline state. Under these conditions, the aluminum compound hydrolyzes, allowing positively charged aluminum to adsorb and coat the outer surface of the titanium dioxide particles. This weakly alkaline environment also fosters the formation of flocculent pseudoboehmite structures on the surface of the particles. This rapid formation of multiple flocculent structures on the surface of the titanium dioxide particles helps prevent agglomeration and reduces microscopic collisions, improving their dispersibility and ensuring proper coating of each particle. This achieves a good coating effect, completing the first stage of titanium dioxide coating. The coating time for this first stage is 40-120 minutes, yielding a primary titanium dioxide coated slurry.

[0029] Furthermore, by adding dilute sulfuric acid and acidic aluminum compounds, the solution becomes acidic after hydrolysis. This means the primary titanium dioxide coating slurry becomes acidic. Under acidic conditions, the aluminum in the acidic aluminum compounds can further coat the surface of the titanium dioxide particles, forming a dense amorphous structure. This results in a dense coating layer on the surface of the titanium dioxide particles. This dense coating layer not only fills and binds the flocculent structure on the surface of the titanium dioxide particles but also forms a dense protective layer, ensuring comprehensive coating and protection of the titanium dioxide particles, thereby achieving the desired coating effect. The comprehensive coating of the particles effectively prevents deformation of titanium dioxide particles, significantly improving their durability. This secondary coating process yields a titanium dioxide coating slurry for headphones. This slurry is then filtered, washed, dried, and pulverized, followed by organic treatment with polysiloxane emulsion to produce modified titanium dioxide. This two-stage coating process creates a complete and dense coating layer, providing excellent protection and greatly improving the durability and stability of the modified titanium dioxide. This prevents deformation and yellowing of the resulting circuit board inks, thus significantly extending their durability and lifespan.

[0030] In one embodiment, the alkaline aluminum compound is sodium aluminate. It is understood that the acidic aluminum compound is aluminum sulfate. Both sodium aluminate and sodium sulfate are commonly used aluminum compounds for coating and modifying titanium dioxide particles. Both sodium aluminate and sodium sulfate can undergo hydrolysis when added to a solution system, separating aluminum ions. This allows for effective coating and modification of titanium dioxide, resulting in durable modified titanium dioxide.

[0031] In one embodiment, the pH adjuster is a sodium hydroxide solution or a dilute sulfuric acid solution. It is understood that sodium hydroxide solution and dilute sulfuric acid solution are respectively strongly alkaline and strongly acidic, and can rapidly provide a large number of hydroxide ions and hydrogen ions. They are commonly used pH adjusters that can quickly adjust the pH value of the solution system. Depending on the pH of the titanium dioxide dilution slurry, either sodium hydroxide solution or dilute sulfuric acid solution can be selected to adjust the pH of the titanium dioxide dilution slurry to 6-7, thus achieving pH adjustment of the titanium dioxide dilution slurry.

[0032] In one embodiment, during the heating operation of the titanium dioxide diluted slurry, a water bath is used to heat the slurry, controlling the heating temperature to be between 50°C and 55°C. It is understood that water bath heating provides good heating effect, allowing for more uniform heating of the titanium dioxide diluted slurry and avoiding localized overheating. This prevents the titanium dioxide particles in the diluted slurry from charring and clumping, thus ensuring the smooth progress of the subsequent titanium dioxide coating operation. Furthermore, controlling the heating temperature to 50°C and 55°C is moderate; excessively high temperatures can damage the formed aluminum coating layer, hindering its formation. Conversely, excessively low temperatures can reduce the molecular motion rate of the solution system, impeding the coating reaction and reducing the efficiency of the circuit board ink preparation. Therefore, by precisely controlling the water bath heating temperature, preparation efficiency is improved while ensuring the normal progress of the titanium dioxide coating operation.

[0033] In one embodiment, the additives include 2-3 parts antioxidant, 2-3 parts defoamer, 2-3 parts leveling agent, 2-3 parts dispersant, and 2-3 parts anti-settling agent. Understandably, the additives used include antioxidants, defoamers, leveling agents, dispersants, and anti-settling agents. Among them, antioxidants can improve the stability of the circuit board ink system, thereby improving durability. For example, antioxidant 1010 can be used as an antioxidant. Defoamers can play a defoaming role, which helps to eliminate air bubbles in the circuit board ink system, thereby avoiding the presence of air bubbles in the finished circuit board ink and improving the quality of the finished circuit board ink. For example, organopolysiloxanes can be used as defoamers, as they have good defoaming effects and are commonly used. Polydimethylsiloxanes can be used as leveling agents, dimethyl silicone oil can be used as dispersants, and polyamide wax can be used as anti-settling agents. By adding leveling agents, dispersants, and anti-settling agents, the fluidity, uniformity, and stability of the prepared circuit board ink solution system can be effectively improved. The prepared circuit board ink has good fluidity and can be well coated on the specific circuit board surface, resulting in high-quality finished products.

[0034] In one embodiment, the product further includes 0.5 to 2 parts by weight of modified paraffin microcapsules. The modified paraffin microcapsules are prepared by: providing paraffin wax, adding the paraffin wax to deionized water, adding an emulsifier, and performing an emulsification reaction to obtain a paraffin emulsion; providing melamine and formaldehyde, stirring and mixing the melamine and formaldehyde to obtain a pre-capsulation solution; subjecting the pre-capsulation solution and the paraffin emulsion to water bath heating, controlling the heating temperature to 50°C to 55°C; adding the pre-capsulation solution to the paraffin emulsion, stirring, performing microencapsulation treatment, filtering, and drying to obtain the modified paraffin microcapsules.

[0035] It should be noted that in this embodiment, modified paraffin microcapsules are added. Paraffin is a commonly used phase change material that can absorb and store heat. By incorporating modified paraffin microcapsules into the circuit board ink system, when the ink is applied to the circuit board surface, the microcapsules can absorb and store the heat generated by the circuit board. This prevents the heat from affecting the modified titanium dioxide in the ink system, thus protecting the modified titanium dioxide and further improving its durability. Consequently, the overall durability of the circuit board ink is greatly improved. Specifically, the modified paraffin microcapsules use melamine as the capsule material, which coats the outer surface of the paraffin, providing a protective coating and forming stable microcapsules that can exist stably in the ink system. This achieves excellent heat absorption and storage effects, improving the stability and durability of the circuit board ink during application, resulting in high-quality finished products.

[0036] Please see Figure 1 In one embodiment, a method for preparing ink for circuit boards is also provided, comprising the following steps:

[0037] S110. Provide the following components in parts by weight: 25-35 parts resin, 40-50 parts diluent, 25-35 parts pigment, 10-15 parts curing agent, and 10-15 parts additives, wherein the pigment is modified titanium dioxide.

[0038] It should be noted that by using a weighing device to weigh each component in corresponding mass fractions, the amount of each component can be accurately measured, and the proportion of each component can be properly maintained, which facilitates the normal progress of subsequent preparation.

[0039] S120. The resin, the diluent, the pigment, the curing agent and the additives are added to a planetary mixer in proportion and stirred for 3000 r / min to 3500 r / min for 30 min to 40 min to obtain the ink for circuit boards.

[0040] It should be noted that by adding each component to a planetary mixer and mixing them at high speed, the components are uniformly mixed together to prepare the finished ink for circuit boards. By using modified titanium dioxide, which is a white particle with high reflectivity, a high-gloss white ink can be prepared. Furthermore, modified titanium dioxide has good durability, stable properties, and is not easily deteriorated, thus affecting the gloss of the circuit board surface. Therefore, while improving the surface gloss of the circuit board, it is also beneficial to improve the durability of the ink for circuit boards.

[0041] In one embodiment, the resin is at least one selected from epoxy resin, acrylic resin, and phenolic resin. The curing agent is 2,4,6-trimethylbenzoyl-diphenylphosphine oxide. It is understood that ethanol, ethyl acetate, n-butanol, and butyl acetate are all commonly used diluents for inks and are readily available. The diluent can be any one of ethanol, ethyl acetate, n-butanol, and butyl acetate, or a mixture of ethanol, ethyl acetate, n-butanol, and butyl acetate, used to adjust the viscosity of the resin. The curing agent, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, can achieve rapid curing under light conditions. The resin used is epoxy resin, acrylic resin, and phenolic resin. Epoxy resin, acrylic resin, and phenolic resin are all commonly used resins with a certain viscosity. Epoxy resin, acrylic resin, and phenolic resin can be used in combination or alone, are readily available, inexpensive, and conducive to industrial production, resulting in finished circuit board inks with good viscosity.

[0042] In one embodiment, the modified titanium dioxide is prepared by: providing titanium dioxide, adding the titanium dioxide to deionized water and a dispersant, stirring and dispersing, then grinding to obtain a titanium dioxide slurry, diluting the titanium dioxide slurry with deionized water to obtain a diluted titanium dioxide slurry, heating the diluted titanium dioxide slurry, adding a pH adjuster to adjust the pH of the diluted titanium dioxide slurry to 6-7, providing an alkaline aluminum compound, adding the alkaline aluminum compound to the diluted titanium dioxide slurry, and stirring for 40-120 minutes to obtain primary titanium dioxide. Titanium dioxide coating slurry is prepared by providing a dilute sulfuric acid solution and an acidic aluminum compound. The dilute sulfuric acid solution is added to the primary titanium dioxide coating slurry, and the pH of the primary titanium dioxide coating slurry is adjusted to 5-6. The acidic aluminum compound is added to the primary titanium dioxide coating slurry, and the mixture is stirred for 40-120 minutes to obtain a secondary titanium dioxide coating slurry. The secondary titanium dioxide coating slurry is then filtered to obtain a titanium dioxide filter cake. The titanium dioxide filter cake is washed and dried to obtain a clean titanium dioxide filter cake. The clean titanium dioxide filter cake is then pulverized, and a polysiloxane emulsion is added and mixed evenly to obtain the modified titanium dioxide.

[0043] In this embodiment, modified titanium dioxide is prepared. The modified titanium dioxide is coated twice to form a complete and dense coating layer, which has a good coating protection effect and greatly improves the durability and stability of the modified titanium dioxide. This can avoid deformation and yellowing of the circuit board ink prepared subsequently, thereby greatly improving the durability and service life of the prepared circuit board ink.

[0044] In this embodiment, the alkaline aluminum compound is sodium aluminate. It is understood that the acidic aluminum compound is aluminum sulfate. Both sodium aluminate and sodium sulfate are commonly used aluminum compounds for coating and modifying titanium dioxide particles. Both sodium aluminate and sodium sulfate can undergo hydrolysis when added to a solution system, separating aluminum ions. This allows for effective coating and modification of titanium dioxide, resulting in durable modified titanium dioxide.

[0045] In this embodiment, the pH adjuster is a sodium hydroxide solution or a dilute sulfuric acid solution. It is understood that sodium hydroxide solution and dilute sulfuric acid solution are respectively strongly alkaline and strongly acidic, and can quickly provide a large number of hydroxide ions and hydrogen ions. They are commonly used pH adjusters that can quickly adjust the pH value of the solution system. Depending on the pH of the titanium dioxide dilution slurry, either sodium hydroxide solution or dilute sulfuric acid solution can be selected to adjust the pH of the titanium dioxide dilution slurry to 6-7, thus achieving pH adjustment of the titanium dioxide dilution slurry.

[0046] In this embodiment, during the heating operation of the titanium dioxide dilution slurry, a water bath is used to heat the titanium dioxide dilution slurry, and the heating temperature is controlled at 50℃~55℃. It is understood that using a water bath to heat the titanium dioxide dilution slurry, and controlling the heating temperature at 50℃~55℃, improves preparation efficiency while ensuring the normal progress of the titanium dioxide coating operation.

[0047] In one embodiment, the additives include 2-3 parts antioxidant, 2-3 parts defoamer, 2-3 parts leveling agent, 2-3 parts dispersant, and 2-3 parts anti-settling agent. Understandably, the additives used include antioxidants, defoamers, leveling agents, dispersants, and anti-settling agents. Among them, antioxidants can improve the stability of the circuit board ink system, thereby improving durability. For example, antioxidant 1010 can be used as an antioxidant. Defoamers can play a defoaming role, which helps to eliminate air bubbles in the circuit board ink system, thereby avoiding the presence of air bubbles in the finished circuit board ink and improving the quality of the finished circuit board ink. For example, organopolysiloxanes can be used as defoamers, as they have good defoaming effects and are commonly used. Polydimethylsiloxanes can be used as leveling agents, dimethyl silicone oil can be used as dispersants, and polyamide wax can be used as anti-settling agents. By adding leveling agents, dispersants, and anti-settling agents, the fluidity, uniformity, and stability of the prepared circuit board ink solution system can be effectively improved. The prepared circuit board ink has good fluidity and can be well coated on the specific circuit board surface, resulting in high-quality finished products.

[0048] In one embodiment, the product further includes 0.5 to 2 parts by weight of modified paraffin microcapsules. The modified paraffin microcapsules are prepared by: providing paraffin wax, adding the paraffin wax to deionized water, adding an emulsifier, and performing an emulsification reaction to obtain a paraffin emulsion; providing melamine and formaldehyde, stirring and mixing the melamine and formaldehyde to obtain a pre-capsulation solution; subjecting the pre-capsulation solution and the paraffin emulsion to water bath heating, controlling the heating temperature to 50°C to 55°C; adding the pre-capsulation solution to the paraffin emulsion, stirring, performing microencapsulation treatment, filtering, and drying to obtain the modified paraffin microcapsules.

[0049] In this embodiment, the durability of modified titanium dioxide is further improved by adding modified paraffin microcapsules, thereby greatly improving the overall durability of the ink for circuit boards and resulting in high-quality finished products.

[0050] Compared with the prior art, the present invention has at least the following advantages:

[0051] The aforementioned circuit board ink, by using resin and diluting solvent as the ink solution system, can obtain an ink solution system with a suitable viscosity. By adding pigments, curing agents, and additives, an ink with a certain color can be prepared. Specifically, the pigment used is modified titanium dioxide, which is a white particle with high reflectivity. This allows for the preparation of a high-brightness white ink. Furthermore, modified titanium dioxide has good durability, stable properties, and is not easily deteriorated, thus affecting the gloss of the circuit board surface. Therefore, while improving the surface gloss of the circuit board, it also helps to improve the durability of the circuit board ink.

[0052] The following is a detailed implementation example.

[0053] Example 1

[0054] In this embodiment, the ink for the circuit board comprises, by weight, the following components: 25 parts resin, 40 parts diluent, 35 parts pigment, 10 parts 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2 parts antioxidant 1010, 2 parts organopolysiloxane, 2 parts polydimethylsiloxane, 2 parts dimethyl silicone oil, and 2 parts polyamide wax, wherein the pigment is modified titanium dioxide.

[0055] In this embodiment, the preparation method of the modified titanium dioxide is as follows: titanium dioxide is provided, added to deionized water, and sodium silicate solution is added. The mixture is stirred and dispersed, then ground to obtain a titanium dioxide slurry. The titanium dioxide slurry is diluted with deionized water to obtain a diluted titanium dioxide slurry. The diluted titanium dioxide slurry is heated in a water bath at 50°C. A pH adjuster is added to the diluted titanium dioxide slurry to adjust its pH to 6. Sodium aluminate is provided, added to the diluted titanium dioxide slurry, and stirred for 40 minutes. A primary titanium dioxide coating slurry is obtained by providing a dilute sulfuric acid solution and aluminum sulfate. The dilute sulfuric acid solution is added to the primary titanium dioxide coating slurry, and the pH of the primary titanium dioxide coating slurry is adjusted to 5. The aluminum sulfate is added to the primary titanium dioxide coating slurry, and the mixture is stirred for 40 minutes to obtain a secondary titanium dioxide coating slurry. The secondary titanium dioxide coating slurry is then filtered to obtain a titanium dioxide filter cake. The titanium dioxide filter cake is washed and dried to obtain a clean titanium dioxide filter cake. The clean titanium dioxide filter cake is then pulverized, and a polysiloxane emulsion is added and mixed evenly to obtain the modified titanium dioxide.

[0056] The method for preparing circuit board ink provided in this embodiment includes the following steps:

[0057] The following components are provided in parts by weight: 25 parts resin, 40 parts diluent, 35 parts pigment, 10 parts 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2 parts antioxidant 1010, 2 parts organopolysiloxane, 2 parts polydimethylsiloxane, 2 parts dimethyl silicone oil, and 2 parts polyamide wax, wherein the pigment is modified titanium dioxide;

[0058] The resin, the diluent, the pigment, the 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, the antioxidant 1010, the organopolysiloxane, the polydimethylsiloxane, the dimethyl silicone oil, and the polyamide wax were added to a planetary mixer in proportion and stirred and mixed at a speed of 3200 r / min for 35 min to obtain the circuit board ink of Example 1.

[0059] Example 2

[0060] In this embodiment, the ink for the circuit board comprises, by weight, the following components: 30 parts resin, 45 parts diluent, 30 parts pigment, 12 parts 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2.5 parts antioxidant 1010, 2.5 parts organopolysiloxane, 2.5 parts polydimethylsiloxane, 2.5 parts dimethyl silicone oil, and 2.5 parts polyamide wax, wherein the pigment is modified titanium dioxide.

[0061] In this embodiment, the preparation method of the modified titanium dioxide is as follows: titanium dioxide is provided, added to deionized water, and sodium silicate solution is added. The mixture is stirred and dispersed, then ground to obtain a titanium dioxide slurry. The titanium dioxide slurry is diluted with deionized water to obtain a diluted titanium dioxide slurry. The diluted titanium dioxide slurry is heated using a water bath at a controlled temperature of 52.5°C. A pH adjuster is added to the diluted titanium dioxide slurry to adjust its pH to 6.5. Sodium aluminate is provided, added to the diluted titanium dioxide slurry, and stirred for 80 minutes. n. To obtain a primary titanium dioxide coating slurry, a dilute sulfuric acid solution and aluminum sulfate are provided. The dilute sulfuric acid solution is added to the primary titanium dioxide coating slurry, and the pH of the primary titanium dioxide coating slurry is adjusted to 5.5. The aluminum sulfate is added to the primary titanium dioxide coating slurry, and the mixture is stirred for 80 minutes to obtain a secondary titanium dioxide coating slurry. The secondary titanium dioxide coating slurry is then filtered to obtain a titanium dioxide filter cake. The titanium dioxide filter cake is washed and dried to obtain a clean titanium dioxide filter cake. The clean titanium dioxide filter cake is then pulverized, and a polysiloxane emulsion is added and mixed evenly to obtain the modified titanium dioxide.

[0062] The method for preparing circuit board ink provided in this embodiment includes the following steps:

[0063] The following components are provided in parts by weight: 30 parts resin, 45 parts diluent, 30 parts pigment, 12 parts 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2.5 parts antioxidant 1010, 2.5 parts organopolysiloxane, 2.5 parts polydimethylsiloxane, 2.5 parts dimethyl silicone oil, and 2.5 parts polyamide wax, wherein the pigment is modified titanium dioxide;

[0064] The resin, the diluent, the pigment, the 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, the antioxidant 1010, the organopolysiloxane, the polydimethylsiloxane, the dimethyl silicone oil, and the polyamide wax were added to a planetary mixer in proportion and stirred and mixed at a speed of 3200 r / min for 35 min to obtain the circuit board ink of Example 2.

[0065] Example 3

[0066] In this embodiment, the ink for the circuit board comprises, by weight, the following components: 35 parts resin, 50 parts diluent, 25 parts pigment, 15 parts 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 3 parts antioxidant 1010, 3 parts organopolysiloxane, 3 parts polydimethylsiloxane, 3 parts dimethyl silicone oil, and 3 parts polyamide wax, wherein the pigment is modified titanium dioxide.

[0067] In this embodiment, the modified titanium dioxide is prepared as follows: titanium dioxide is provided, added to deionized water, and sodium silicate solution is added. The mixture is stirred and dispersed, then ground to obtain a titanium dioxide slurry. The titanium dioxide slurry is diluted with deionized water to obtain a diluted titanium dioxide slurry. The diluted titanium dioxide slurry is heated in a water bath at 55°C. A pH adjuster is added to the diluted titanium dioxide slurry to adjust its pH to 7. Sodium aluminate is provided, added to the diluted titanium dioxide slurry, and stirred for 120 minutes. A primary titanium dioxide coating slurry is obtained by providing a dilute sulfuric acid solution and aluminum sulfate. The dilute sulfuric acid solution is added to the primary titanium dioxide coating slurry, and the pH of the primary titanium dioxide coating slurry is adjusted to 6. The aluminum sulfate is added to the primary titanium dioxide coating slurry, and the mixture is stirred for 120 minutes to obtain a secondary titanium dioxide coating slurry. The secondary titanium dioxide coating slurry is then filtered to obtain a titanium dioxide filter cake. The titanium dioxide filter cake is washed and dried to obtain a clean titanium dioxide filter cake. The clean titanium dioxide filter cake is then pulverized, and a polysiloxane emulsion is added and mixed evenly to obtain the modified titanium dioxide.

[0068] The method for preparing circuit board ink provided in this embodiment includes the following steps:

[0069] The following components are provided in parts by weight: 35 parts resin, 50 parts diluent, 25 parts pigment, 15 parts 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 3 parts antioxidant 1010, 3 parts organopolysiloxane, 3 parts polydimethylsiloxane, 3 parts dimethyl silicone oil, and 3 parts polyamide wax, wherein the pigment is modified titanium dioxide;

[0070] The resin, the diluent, the pigment, the 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, the antioxidant 1010, the organopolysiloxane, the polydimethylsiloxane, the dimethyl silicone oil, and the polyamide wax are added to a planetary mixer in proportion and stirred and mixed. The stirring speed is controlled at 3000 r / min to 3500 r / min, and the stirring time is 30 min to 40 min to obtain the circuit board ink of Example 3.

[0071] Example 4

[0072] In this embodiment, the ink for the circuit board comprises, by weight, the following components: 30 parts resin, 45 parts diluent, 30 parts pigment, 12 parts 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2.5 parts antioxidant 1010, 2.5 parts organopolysiloxane, 2.5 parts polydimethylsiloxane, 2.5 parts dimethyl silicone oil, 2.5 parts polyamide wax, wherein the pigment is modified titanium dioxide, and 1.5 parts modified paraffin microcapsules.

[0073] In this embodiment, the preparation method of the modified titanium dioxide is as follows: titanium dioxide is provided, added to deionized water, and sodium silicate solution is added. The mixture is stirred and dispersed, then ground to obtain a titanium dioxide slurry. The titanium dioxide slurry is diluted with deionized water to obtain a diluted titanium dioxide slurry. The diluted titanium dioxide slurry is heated using a water bath at a controlled temperature of 52.5°C. A pH adjuster is added to the diluted titanium dioxide slurry to adjust its pH to 6.5. Sodium aluminate is provided, added to the diluted titanium dioxide slurry, and stirred for 80 minutes. n. To obtain a primary titanium dioxide coating slurry, a dilute sulfuric acid solution and aluminum sulfate are provided. The dilute sulfuric acid solution is added to the primary titanium dioxide coating slurry, and the pH of the primary titanium dioxide coating slurry is adjusted to 5.5. The aluminum sulfate is added to the primary titanium dioxide coating slurry, and the mixture is stirred for 80 minutes to obtain a secondary titanium dioxide coating slurry. The secondary titanium dioxide coating slurry is then filtered to obtain a titanium dioxide filter cake. The titanium dioxide filter cake is washed and dried to obtain a clean titanium dioxide filter cake. The clean titanium dioxide filter cake is then pulverized, and a polysiloxane emulsion is added and mixed evenly to obtain the modified titanium dioxide.

[0074] In this embodiment, the modified paraffin microcapsules are prepared as follows: paraffin is provided, the paraffin is added to deionized water, and an emulsifier is added to carry out an emulsification reaction to obtain a paraffin emulsion; melamine and formaldehyde are provided, and the melamine and formaldehyde are stirred and mixed to obtain a pre-capsulation solution; the pre-capsulation solution and the paraffin emulsion are respectively subjected to water bath heating, and the heating temperature is controlled at 52.5°C; the pre-capsulation solution is then added to the paraffin emulsion, stirred, and microencapsulation is carried out; after filtration and drying, the modified paraffin microcapsules are obtained.

[0075] The method for preparing circuit board ink provided in this embodiment includes the following steps:

[0076] The following components are provided in parts by weight: 30 parts resin, 45 parts diluent, 30 parts pigment, 12 parts 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2.5 parts antioxidant 1010, 2.5 parts organopolysiloxane, 2.5 parts polydimethylsiloxane, 2.5 parts dimethyl silicone oil, and 2.5 parts polyamide wax, wherein the pigment is modified titanium dioxide;

[0077] The resin, the diluent, the pigment, the 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, the antioxidant 1010, the organopolysiloxane, the polydimethylsiloxane, the dimethyl silicone oil, and the polyamide wax were added to a planetary mixer in proportion and stirred and mixed at a speed of 3200 r / min for 35 min to obtain the circuit board ink of Example 4.

[0078] Comparative Example 1

[0079] In this comparative example, the circuit board ink, by weight, comprises the following components: 30 parts resin, 45 parts diluent, 30 parts pigment, 12 parts 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2.5 parts antioxidant 1010, 2.5 parts organopolysiloxane, 2.5 parts polydimethylsiloxane, 2.5 parts dimethyl silicone oil, and 2.5 parts polyamide wax, wherein the pigment is titanium dioxide (titanium white).

[0080] The method for preparing the ink for circuit boards provided in this comparative example includes the following steps:

[0081] The following components are provided in parts by weight: 30 parts resin, 45 parts diluent, 30 parts pigment, 12 parts 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2.5 parts antioxidant 1010, 2.5 parts organopolysiloxane, 2.5 parts polydimethylsiloxane, 2.5 parts dimethyl silicone oil, and 2.5 parts polyamide wax, wherein the pigment is titanium dioxide (titanium white).

[0082] The resin, the diluent, the pigment, the 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, the antioxidant 1010, the organopolysiloxane, the polydimethylsiloxane, the dimethyl silicone oil, and the polyamide wax were added to a planetary mixer in proportion and stirred and mixed at a speed of 3200 r / min for 35 min to obtain the circuit board ink of Comparative Example 1.

[0083] Comparative Example 2

[0084] In this comparative example, the circuit board ink, by weight, comprises the following components: 30 parts resin, 45 parts diluent, 30 parts pigment, 12 parts 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2.5 parts antioxidant 1010, 2.5 parts organopolysiloxane, 2.5 parts polydimethylsiloxane, 2.5 parts dimethyl silicone oil, and 2.5 parts polyamide wax, wherein the pigment is modified titanium dioxide.

[0085] In this comparative example, the preparation method of the modified titanium dioxide is as follows: titanium dioxide is provided, the titanium dioxide is added to deionized water, and sodium silicate solution is added. The mixture is stirred and dispersed, then ground to obtain a titanium dioxide slurry. The titanium dioxide slurry is diluted with deionized water to obtain a diluted titanium dioxide slurry. The diluted titanium dioxide slurry is heated using a water bath at a controlled temperature of 52.5°C. A pH adjuster is added to the diluted titanium dioxide slurry. The pH of the diluted slurry is adjusted to 6.5, sodium aluminate is provided, the sodium aluminate is added to the titanium dioxide diluted slurry, and stirring is performed for 160 minutes to obtain a titanium dioxide coated slurry. The titanium dioxide coated slurry is filtered to obtain a titanium dioxide filter cake. The titanium dioxide filter cake is washed and dried to obtain a clean titanium dioxide filter cake. The clean titanium dioxide filter cake is pulverized, and a polysiloxane emulsion is added and mixed evenly to obtain the modified titanium dioxide.

[0086] The method for preparing the ink for circuit boards provided in this comparative example includes the following steps:

[0087] The following components are provided in parts by weight: 30 parts resin, 45 parts diluent, 30 parts pigment, 12 parts 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2.5 parts antioxidant 1010, 2.5 parts organopolysiloxane, 2.5 parts polydimethylsiloxane, 2.5 parts dimethyl silicone oil, and 2.5 parts polyamide wax, wherein the pigment is modified titanium dioxide;

[0088] The resin, the diluent, the pigment, the 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, the antioxidant 1010, the organopolysiloxane, the polydimethylsiloxane, the dimethyl silicone oil, and the polyamide wax were added to a planetary mixer in proportion and stirred and mixed at a speed of 3200 r / min for 35 min to obtain the circuit board ink of Comparative Example 2.

[0089] Comparative Example 3

[0090] In this comparative example, the circuit board ink, by weight, comprises the following components: 30 parts resin, 45 parts diluent, 30 parts pigment, 12 parts 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2.5 parts antioxidant 1010, 2.5 parts organopolysiloxane, 2.5 parts polydimethylsiloxane, 2.5 parts dimethyl silicone oil, and 2.5 parts polyamide wax, wherein the pigment is modified titanium dioxide.

[0091] In this comparative example, the preparation method of the modified titanium dioxide is as follows: titanium dioxide is provided, the titanium dioxide is added to deionized water, and sodium silicate solution is added. The mixture is stirred and dispersed, then ground to obtain a titanium dioxide slurry. The titanium dioxide slurry is diluted with deionized water to obtain a diluted titanium dioxide slurry. The diluted titanium dioxide slurry is heated using a water bath at a controlled temperature of 52.5°C. A pH adjuster is added to the diluted titanium dioxide slurry to adjust its pH to 6.5. A dilute sulfuric acid solution and sulfur dioxide are provided. Aluminum sulfate is added to the titanium dioxide dilution slurry, the pH of the titanium dioxide dilution slurry is adjusted to 5.5, aluminum sulfate is added to the titanium dioxide dilution slurry, and stirring is performed for 160 minutes to obtain a titanium dioxide coated slurry. The titanium dioxide coated slurry is filtered to obtain a titanium dioxide filter cake. The titanium dioxide filter cake is washed and dried to obtain a clean titanium dioxide filter cake. The clean titanium dioxide filter cake is pulverized, and polysiloxane emulsion is added and mixed evenly to obtain the modified titanium dioxide.

[0092] The method for preparing the ink for circuit boards provided in this comparative example includes the following steps:

[0093] The following components are provided in parts by weight: 30 parts resin, 45 parts diluent, 30 parts pigment, 12 parts 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2.5 parts antioxidant 1010, 2.5 parts organopolysiloxane, 2.5 parts polydimethylsiloxane, 2.5 parts dimethyl silicone oil, and 2.5 parts polyamide wax, wherein the pigment is modified titanium dioxide;

[0094] The resin, the diluent, the pigment, the 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, the antioxidant 1010, the organopolysiloxane, the polydimethylsiloxane, the dimethyl silicone oil, and the polyamide wax were added to a planetary mixer in proportion and stirred and mixed at a speed of 3200 r / min for 35 min to obtain the circuit board ink of Comparative Example 3.

[0095] Specifically, epoxy resin was used in all embodiments and comparative examples, ethanol was used as the diluent, and rutile titanium dioxide was used in all examples. The circuit board inks of Examples 1, 2, 3, and 4, as well as the circuit board inks of Comparative Examples 1, 2, and 3, were coated onto each circuit board and dried at 80°C for 5 minutes. Then, they were irradiated with ultraviolet light for 5 minutes. The ink layer on each circuit board was then tested to detect the initial reflectivity and the reflectivity after 1000 hours of light irradiation. At the same time, the surface changes of the ink layer after 1000 hours of light irradiation were observed. The specific performance test results are shown in Table 1.

[0096] Table 1 Performance Test Results

[0097]

[0098] As shown in Table 1, the reflectivity and durability of the circuit board inks in Examples 1, 2, 3, and 4 are superior to those in Comparative Examples 1-3. Specifically, comparing Example 2 with Comparative Examples 1-3 reveals that the modified titanium dioxide, through two coating processes, forms a complete and dense coating layer, providing excellent protection and significantly improving the durability and stability of the modified titanium dioxide. This prevents deformation and yellowing of the subsequently prepared circuit board ink, thereby greatly enhancing its durability and service life. Comparing Example 2 with Example 4 shows that the addition of modified paraffin microcapsules allows for heat absorption and storage, preventing the heat generated by the circuit board from affecting the modified titanium dioxide in the ink system. This protects the modified titanium dioxide and further improves its durability, thus significantly enhancing the stability and durability of the circuit board ink during application, resulting in the best product quality.

[0099] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. An ink for a wiring board, characterized by comprising: The paint comprises the following components in parts by mass: 25-35 parts of resin, 40-50 parts of dilution solvent, 25-35 parts of pigment, 10-15 parts of curing agent, and 10-15 parts of auxiliary agent, wherein the pigment is modified titanium white powder; The preparation method of the modified titanium white powder comprises the following steps: providing titanium dioxide, adding the titanium dioxide into deionized water and adding a dispersant, performing stirring and dispersion operation, performing grinding operation, obtaining titanium dioxide slurry, performing dilution operation on the titanium dioxide slurry by using deionized water to obtain titanium dioxide dilution slurry, performing heating operation on the titanium dioxide dilution slurry, adding a pH regulator into the titanium dioxide dilution slurry, adjusting the pH of the titanium dioxide dilution slurry to 6-7, providing an alkaline aluminum compound, adding the alkaline aluminum compound into the titanium dioxide dilution slurry and performing stirring operation, stirring for 40-120 minutes to obtain primary titanium dioxide coating slurry, providing a dilute sulfuric acid solution and an acidic aluminum compound, adding the dilute sulfuric acid solution into the primary titanium dioxide coating slurry, adjusting the pH of the primary titanium dioxide coating slurry to 5-6, adding the acidic aluminum compound into the primary titanium dioxide coating slurry and performing stirring operation, stirring for 40-120 minutes to obtain secondary titanium dioxide coating slurry, performing filtration operation on the secondary titanium dioxide coating slurry to obtain titanium dioxide filter cake, performing washing and drying on the titanium dioxide filter cake to obtain clean titanium dioxide filter cake, performing crushing operation on the clean titanium dioxide filter cake, adding polysiloxane emulsion and uniformly mixing to obtain the modified titanium white powder. The paint further comprises 0.5-2 parts of modified paraffin wax microcapsules, and the preparation method of the modified paraffin wax microcapsules comprises the following steps: providing paraffin, adding the paraffin into deionized water and adding an emulsifying agent, performing emulsification reaction to obtain paraffin emulsion, providing melamine and formaldehyde, performing stirring and mixing operation on the melamine and the formaldehyde to obtain pre-capsule liquid, performing water bath heating operation on the pre-capsule liquid and the paraffin emulsion respectively, controlling the heating temperature to be 50-55°C, adding the pre-capsule liquid into the paraffin emulsion, performing stirring, performing microcapsulation treatment, and performing filtration and drying to obtain the modified paraffin wax microcapsules.

2. The ink for a wiring board according to claim 1, characterized by The resin is at least one of epoxy resin, acrylic resin and phenolic resin.

3. The ink for a wiring board according to claim 1, wherein The titanium dioxide is rutile titanium dioxide.

4. The ink for a wiring board according to claim 1, characterized by The alkaline aluminum compound is sodium metaaluminate.

5. The ink for a wiring board according to claim 1, wherein The acidic aluminum compound is aluminum sulfate.

6. The ink for a wiring board according to claim 1, wherein The pH regulator is sodium hydroxide solution or dilute sulfuric acid solution.

7. The ink for a wiring board according to claim 1, wherein In the heating operation on the titanium dioxide dilution slurry, water bath heating is adopted to heat the titanium dioxide dilution slurry, and the heating temperature is controlled to be 50-55°C.

8. The ink for a wiring board according to any one of claims 1 to 7, characterized by The auxiliary agent comprises 2-3 parts of antioxidant, 2-3 parts of defoaming agent, 2-3 parts of leveling agent, 2-3 parts of dispersing agent and 2-3 parts of anti-settling agent.

9. The method for producing an ink for a wiring board according to any one of claims 1 to 8, characterized by, The paint comprises the following steps: Provided are the following components by mass: 25-35 parts of resin, 40-50 parts of dilution solvent, 25-35 parts of pigment, 10-15 parts of curing agent, and 10-15 parts of auxiliary agent, wherein the pigment comprises modified titanium white powder; The resin, the dilution solvent, the pigment, the curing agent, and the auxiliary agent are added into a planetary mixer in proportion, a stirring and mixing operation is performed, the stirring speed is controlled to be 3000-3500 r / min, and stirring is performed for 30-40 min to obtain the ink for circuit board.

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