Encapsulation of a printed board assembly with a lead cable

Abstract

The application relates to a potting device of a printed board assembly with an outgoing cable, belonging to the field of potting matching devices, which comprises a base, a limiting assembly, a solenoid with an iron core, and a cover plate assembly; the center of the base is provided with a first mounting hole for horizontally suspending and placing the printed board assembly; a plurality of limiting assemblies are uniformly distributed on the base for positioning the printed board assembly; one side of each limiting assembly is provided with the solenoid with the iron core, and the solenoid with the iron core is electrically connected with an external function generator; the cover plate assembly is located directly above the base, a magnet corresponding to the solenoid with the iron core is embedded on a pressing plate of the cover plate assembly, and an aluminum sheet is arranged at the lower end of the magnet. The printed board assembly is installed in the first mounting hole and positioned by the limiting assembly, an outer cover plate is assembled after glue potting, the cover plate assembly is placed on the base, a signal is input into the solenoid with the iron core through the external function generator, electromagnetic force is generated to adsorb the magnet of the cover plate assembly, and the pressing plate is pressed against the outer cover plate. The application solves the potting quality problem of the printed board assembly with the outgoing cable.

Description

Technical Field

[0001] This invention belongs to the field of potting equipment, specifically relating to a potting device for a printed circuit board assembly with lead cables. Background Technology

[0002] A printed circuit board assembly with lead-out cables operates at a relatively high voltage, posing a risk of breakdown during environmental mechanical testing. Furthermore, its components are relatively tall, resulting in reduced safety clearances. Therefore, this printed circuit board assembly requires potting before environmental mechanical testing. Potting enhances the overall integrity of the electronic device, improving its resistance to external shocks and vibrations; it improves insulation between internal components and circuits, facilitating miniaturization and weight reduction; it prevents direct exposure of components and circuits, improving the device's waterproof and moisture-proof performance, and enhancing its overall performance and stability.

[0003] The printed circuit board assembly with lead cables includes lead cables, an assembly housing, and an outer cover. The lead cables are installed to the assembly housing with screws, and then assembled with the outer cover to form the printed circuit board assembly. The lead cables are relatively long, and the connection part with the assembly housing is the connector of the lead cables. The connector is heavy and protrudes from the assembly housing. Because of the protruding connector, the printed circuit board assembly cannot be placed flat on a horizontal surface, and the cables must be suspended in the air during the potting process. Considering the special structural characteristics of this printed circuit board assembly, the outer cover is bonded to the assembly housing by potting adhesive. Before the adhesive cures, the outer cover needs to be fixed with external force to prevent warping.

[0004] Existing technology for potting printed circuit board (PCB) assemblies with lead cables typically uses a plastic bracket to support the assembly housing, followed by 3M tape to secure the outer cover. This method has the following drawbacks: First, using 3M tape to secure the outer cover is inefficient and ineffective; the expansion of the adhesive can cause the outer cover to bulge outwards, and the tape can damage the plating. Second, the plastic bracket increases the weight of the PCB assembly after potting, and its insufficient support strength and uneven placement pose a risk of adhesive overflow. Third, if the PCB assembly is not placed stably or the outer cover is not properly secured, the potting adhesive may not be evenly distributed within the assembly, leaving gaps between high-voltage components unfilled. During power-on operation, the PCB assembly may be damaged, and the risk of high-voltage breakdown remains, thus failing to achieve the intended potting effect.

[0005] Therefore, it is necessary to design a potting device suitable for printed circuit board assemblies with lead cables to ensure potting quality. Summary of the Invention

[0006] The technical problem to be solved:

[0007] To avoid the shortcomings of the prior art, the present invention provides a potting device for a printed circuit board assembly with a lead cable. A through hole is provided in the center of the base to accommodate the connector of the lead cable, so that the lead cable is suspended in the air, and the housing assembly is placed horizontally on the base and positioned by a limiting component provided on the base. A solenoid with an iron core is provided around the base, and a function generator is connected to the solenoid with the iron core. The solenoid works in conjunction with the cover plate assembly to fix the outer cover plate of the potted printed circuit board assembly under the action of electromagnetic force.

[0008] This invention solves the problems in the prior art, such as difficulty in placing printed circuit board assemblies with lead cables stably during potting, poor fixation of the outer cover plate leading to potting glue overflow, outer cover plate warping and deformation, damage to the cover plate plating, uneven distribution of potting glue and the presence of air bubbles in traditional potting methods.

[0009] The technical solution of the present invention is: a potting device for a printed circuit board assembly with lead-out cables, comprising a base, a limiting component, a solenoid with an iron core, and a cover plate assembly;

[0010] The base is located at the bottom of the potting device, and the center of the base is provided with a first mounting hole for horizontally suspending the printed circuit board assembly.

[0011] Multiple limiting components are evenly distributed on the base along the circumference of the first mounting hole, with their limiting direction facing the first mounting hole, for clamping and positioning the printed circuit board assembly;

[0012] Each limit component is equipped with a solenoid with an iron core on one side, and the solenoid with an iron core is electrically connected to an external function generator;

[0013] The cover plate assembly includes a pressure plate, a magnet, and an aluminum sheet; the pressure plate is located directly above the base, and a magnet corresponding to a solenoid with an iron core on the base is embedded in the pressure plate; the aluminum sheet is located at the lower end of the magnet and is coaxially embedded in the pressure plate with the magnet;

[0014] The connector of the printed circuit board assembly is embedded in the first mounting hole. The lower end face of the component housing of the printed circuit board assembly is placed horizontally on the base. The lead cable passes through the first mounting hole and is suspended in the air. The printed circuit board assembly is positioned by the limiting component. After the adhesive is poured into the printed circuit board assembly, the outer cover plate is assembled and the cover plate assembly is placed on the base. A signal is passed to the iron core solenoid through an external function generator. The iron core solenoid generates an electromagnetic force to attract the magnet of the cover plate assembly. The outer cover plate of the printed circuit board assembly is pressed tightly by the pressure plate.

[0015] A further technical solution of the present invention is as follows: the base includes a base plate, a crossbeam, columns, and a support plate; multiple columns are fixed below the base plate to support the base plate so that it is horizontally suspended; multiple crossbeams are sequentially connected and surround the perimeter of the base plate, and the base plate and crossbeams together form an accommodating cavity; the support plate is horizontally placed in the accommodating cavity, the lower end face of the support plate is fixed to the base plate, and the perimeter sidewall of the support plate contacts the inner sidewall of the crossbeam; the first mounting hole is located at the center of the support plate and penetrates the base plate; the cored solenoid and the limiting assembly are installed on the support plate.

[0016] A further technical solution of the present invention is: the support plate has a plurality of second mounting holes evenly distributed around the first mounting hole for mounting a solenoid with an iron core.

[0017] A further technical solution of the present invention is: the solenoid with iron core includes a coil, an iron core and a transparent plastic shell, the iron core is vertically installed in the second mounting hole of the support plate; the coil is wound around the outer diameter of the iron core; the plastic shell is wrapped around the outside of the coil.

[0018] A further technical solution of the present invention is: the coil is electrically connected to the function generator, and a power amplifier is connected in series between the function generator and the coil, and the function generator is powered by a power supply.

[0019] A further technical solution of the present invention is as follows: the limiting component includes a guide rail, a slider, and a screw; the guide rail is fixed to the upper surface of the support plate, the central axis of the guide rail intersects perpendicularly with the axis of the first mounting hole, and slide rails parallel to the central axis of the guide rail are provided on both sides of the guide rail; the slider is fitted onto the guide rail and slidably connected with the slide rails; the screw passes through the slider, and its end extends to the slide rail, used to limit the axial position of the slider on the guide rail; the side of the slider facing the first mounting hole contacts the outer side of the component housing.

[0020] A further technical solution of the present invention is that the size of the first mounting hole matches the outer diameter of the connector body of the printed circuit board assembly.

[0021] A further technical solution of the present invention is that the pressure plate and the support plate are both polytetrafluoroethylene (PTFE) plates.

[0022] A further technical solution of the present invention is that both the crossbeam and the base plate are steel plates.

[0023] A further technical solution of the present invention is that the column is hot-rolled equilateral steel, and the column is fixed to the base plate by welding.

[0024] Beneficial effects

[0025] The beneficial effects of the present invention are as follows: the potting device for the printed circuit board assembly with lead-out cable described in the present invention has a first mounting hole at the center of the base that matches the size of the connector of the lead-out cable of the printed circuit board assembly. The connector is embedded in the first mounting hole, the lower end face of the component housing of the printed circuit board assembly is placed horizontally on the base, and the lead-out cable passes through the first mounting hole and is suspended in the air, thus ensuring the horizontal placement of the printed circuit board assembly.

[0026] In this invention, multiple limiting components are evenly distributed on a support plate facing the first mounting hole. A slider positions the outer side of the component housing. By fixing the position of the slider, the printed circuit board assembly is kept stationary during the potting process. The position of the slider on the guide rail is adjusted according to the outer dimensions of the component housing, making this potting device suitable for printed circuit board assemblies of different sizes and specifications, thus possessing a multi-purpose function.

[0027] This invention utilizes a solenoid with an iron core mounted on a base, matched with a cover plate assembly containing a magnet. Under magnetic force, the outer cover plate is pressed firmly, exhibiting intelligent adaptability and a stable, continuous pressing effect. The potting compound is injected into the printed circuit board assembly, the outer cover plate is placed on top, and the cover plate assembly is positioned on the potted PCB assembly, with the aluminum sheet of the cover plate assembly aligned with the solenoid. By inputting a stable signal to the solenoid, it generates electromagnetic force, enabling the cover plate assembly to automatically position and press firmly against the outer cover plate of the PCB assembly, ensuring a tight fit between the outer cover plate and the potting compound.

[0028] The aluminum sheet in this invention makes the potting compound more evenly distributed: by applying a perturbation waveform to the iron-core solenoid, the magnitude of the magnetic field generated in the iron-core solenoid changes. When the changing magnetic field passes through the aluminum sheet, it changes the magnitude of the eddy currents in the aluminum sheet. The aluminum sheet is subjected to the Lorentz force in the magnetic field, generating ultrasonic waves. The pressure plate guides the ultrasonic waves into the potting compound. The ultrasonic waves make the potting compound more evenly distributed, and also avoid the possibility of small air bubbles between fine-pitch components, thus improving the potting quality and achieving the purpose of breakdown protection.

[0029] The potting device of this invention has a simple and compact structure and significant performance: when applied to manual or machine-based potting, the printed circuit board assembly does not shift during potting and subsequent curing, and the outer cover does not warp or deform. It also eliminates the need for fixing the outer cover with 3M tape, saving time and preventing damage to the outer coating. Simultaneously, the generation of ultrasonic waves solves the problems of uneven potting adhesive distribution and air bubbles. The application of a cored solenoid enables automatic positioning and allows for controllable electromagnetic force. Therefore, the potting efficiency is high, significantly reducing defective products. The number of printed circuit board assemblies potted increases from 30 sets / day to 50 sets / day, improving potting efficiency by approximately 67%. Attached Figure Description

[0030] Figure 1This is a schematic diagram of the overall structure of the printed circuit board assembly with lead cables assembled according to the present invention.

[0031] Figure 2 This is a schematic diagram of the cover plate assembly structure of the present invention;

[0032] Figure 3 This is a cross-sectional view of the cover plate assembly of the present invention;

[0033] Figure 4 This is a schematic diagram of the base of the present invention without columns;

[0034] Figure 5 This is a schematic diagram of the external structure of the printed circuit board assembly with lead-out cables according to the present invention.

[0035] Figure 6 This is a cross-sectional schematic diagram of the printed circuit board assembly with lead-out cables described in this invention.

[0036] Explanation of reference numerals in the attached drawings: 1. Base, 11. First mounting hole, 12. Base plate, 13. Crossbeam, 14. Column, 15. Support plate, 2. Limiting assembly, 21. Guide rail, 211. Slide rail, 22. Slider, 23. Screw, 3. Solenoid with iron core, 31. Coil, 32. Iron core, 33. Transparent plastic shell, 4. Cover plate assembly, 41. Pressure plate, 42. Magnet, 43. Aluminum sheet, 5. Printed circuit board assembly, 51. Connector, 52. Assembly housing, 53. Lead cable, 54. Outer cover plate, A. Fitting part between printed circuit board assembly and base. Detailed Implementation

[0037] The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the invention, and should not be construed as limiting the invention.

[0038] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0039] See Figure 1 The present invention proposes a potting device for a printed circuit board assembly with lead-out cables, including a base 1, a limiting component 2, a solenoid with an iron core 3, and a cover plate assembly 4.

[0040] The base 1 is located at the bottom of the potting device and serves to suspend and support the printed circuit board assembly 5 with the lead cable, as well as the mounting and limiting assembly 2 and the solenoid 3 with iron core. See also... Figure 1 , 4 The base 1 specifically includes a base plate 12, crossbeams 13, columns 14, and a support plate 15. The base plate 12 is square, and four columns 14 are welded to its lower part, supporting the base plate 12 horizontally suspended. Four crossbeams 13 are connected sequentially, surrounding the perimeter of the base plate 12, forming a concave cavity together with the crossbeams 13. The support plate 15 matches the dimensions of the cavity, is horizontally placed within the cavity, and its lower end face is fixed to the base plate 12. The periphery of the support plate 15 contacts the inner surface of the crossbeams 13. See also... Figure 5 , 6 The base 1 has a first mounting hole 11 at its center for horizontally suspending the printed circuit board assembly 5. Specifically, the first mounting hole 11 is located at the center of the support plate 15 and passes through the base plate 12. The size of the first mounting hole 11 matches the outer diameter of the connector 51 of the printed circuit board assembly 5. The connector 51 is embedded in the first mounting hole 11. The lower end face of the component housing 52 of the printed circuit board assembly 5 is horizontally placed on the support plate 15. The lead cable 53 of the printed circuit board assembly 5 passes through the first mounting hole 11 and is suspended in the air, so that the printed circuit board assembly 5 is placed horizontally and stably.

[0041] See Figure 1 , 4 The limiting component 2 has four sets, evenly distributed around the first mounting hole 11 on the support plate 15, for clamping and positioning the printed circuit board assembly 5. Specifically, the limiting component 2 includes a guide rail 21, a slider 22, and screws 23. The guide rail 21 is fixed to the upper surface of the support plate 15 by rivets. The central axis of the guide rail 21 intersects perpendicularly with the axis of the first mounting hole 11. The guide rail 21 has concave slide rails 211 on both sides, parallel to the central axis of the guide rail 21. The slider 22 is fitted onto the guide rail 21. The slider 22 has protrusions on both sides that slide along the concave slide rails 211, allowing it to slide along the guide rail 21 when not fixed. The protrusions on both sides of the slider 22 have threaded holes for connection with the screws 23. The screws 23 penetrate the protrusions of the slider 22, and the screw end of the screw 23 extends to the slide rail 211. Tightening the screws 23 limits the axial position of the slider 22 on the guide rail 21. The side of the slider 22 facing the first mounting hole 11 contacts the outer side of the component housing 52, and the position of the slider on the guide rail 21 is determined according to the size of the component housing 52.

[0042] See Figure 1 , 4Four cored solenoids 3 are provided, evenly distributed around the first mounting hole 11 on the support plate 15, located outside the limiting component 2. Specifically, the support plate 15 has multiple second mounting holes evenly distributed around the first mounting hole 11 for mounting the cored solenoids 3. The cored solenoid 3 includes a coil 31, an iron core 32, and a transparent plastic shell 33. The iron core 32 is vertically mounted in the second mounting hole of the support plate 15; the coil 31 is wound around the outer diameter of the iron core 32; the plastic shell 33 covers the outside of the coil 31, serving not only an aesthetic purpose but also preventing wear on the coil 31. The coil 31 of the cored solenoid 3 is electrically connected to an external function generator, which provides a stable signal to the cored solenoid 3. A power amplifier is connected in series between the cored solenoid 3 and the external function generator, amplifying the signal input to the function generator. An external power supply powers the function generator.

[0043] See Figure 1-3 The cover plate assembly 4 includes a pressure plate 41, magnets 42, and aluminum sheets 43. The pressure plate 41 is a square plate with dimensions matching the support plate 15. The pressure plate 41 is located directly above the base 1, and four magnets 42, corresponding one-to-one with the iron-core solenoids 3 on the support plate 15, are embedded in the four corners of the pressure plate 41. The aluminum sheets 43 are located below the magnets 42 and are coaxially embedded in the pressure plate 41 with the magnets 42. In this embodiment, the thickness of the aluminum sheet 43 is 1-2 mm, and the diameter of the aluminum sheet 43 is basically the same as that of the magnets 42.

[0044] See Figure 1 , 5 6. The printed circuit board assembly 5 is placed horizontally on the base 1 and positioned by the limiting component 2. After the adhesive is poured into the printed circuit board assembly 5, the outer cover plate 54 is assembled, and the cover plate assembly 4 is placed on the base 1. A stable signal is supplied to the iron-core solenoid 3 through an external function generator. The iron-core solenoid 3 generates an electromagnetic force to attract the magnet 42 of the cover plate assembly 4, and the outer cover plate 54 of the printed circuit board assembly 5 is continuously pressed by the pressure plate 41. The function of the iron-core solenoid 3 is to generate electromagnetic force and Lorentz force. The iron core 32 concentrates the magnet, and the cover plate assembly 4 is placed in the magnetic field and is subjected to electromagnetic force, so that the cover plate assembly 4 is automatically attracted to the base 1. The method of positioning the cover plate assembly 4 by electromagnetic force can not only automatically position it, but also control the magnitude of the force.

[0045] In this embodiment, to prevent sharp metal structural components from damaging the printed circuit board assembly 5, the pressure plate 41 and the support plate 15 are both made of polytetrafluoroethylene (PTFE). The crossbeam 13 and the base plate 12 are both made of 45 steel plates, and the column 14 is made of hot-rolled equilateral 45 steel to ensure load-bearing capacity and support rigidity requirements. The crossbeam 13 and the base plate 12 are connected by welding to form an assembly, which is then assembled with the support plate 15. The lower end face of the support plate 15 coincides with the upper end face of the base plate 12, and the support plate 15 is directly embedded into the assembly formed by the crossbeam 13 and the base plate 12. After assembly, the first mounting hole 11 is drilled uniformly. It should be noted that the shape of the first mounting hole 11 only needs to match the shape of the connector 51 of the printed circuit board assembly 5. The purpose is to accommodate the connector 51 and allow the lead cable 53 to pass through the hole. Therefore, the shape of the first mounting hole 11 is designed according to the shape of the connector 51, and it can also be a hole of other shapes.

[0046] Working principle: See Figure 1 , 6 When using the potting device for the printed circuit board assembly with lead-out cables described in this invention, the printed circuit board assembly 5 with lead-out cables to be potted is placed in the base 1, with the connector 51 embedded in the first mounting hole 11. The lower end face of the assembly housing 52 is placed horizontally on the support plate 15, and the lead-out cable 53 passes through the first mounting hole 11 and is suspended in the air, thereby placing the printed circuit board assembly 5 horizontally. The position of the slider 22 on the guide rail 21 is adjusted according to the outer dimensions of the assembly housing 52, and the slider 22 is fixed by screws 23 to limit the radial movement of the printed circuit board assembly 5. The pre-prepared adhesive is poured into the printed circuit board assembly 5 according to the specified amount. After potting, the outer cover plate 54 of the printed circuit board assembly 5 is assembled with the assembly housing 52, and the outer cover plate 54 and the assembly housing 52 are bonded together by the adhesive. Then, the cover plate assembly 4 is pressed onto the printed circuit board assembly 5. A stable signal amplified by a power amplifier is input to the iron-core solenoid 3 via a function generator. The iron-core solenoid 3 generates a long-term electromagnetic force, which causes the cover plate assembly 4 to automatically position and press the outer cover plate 54 of the printed circuit board assembly 5, so that the outer cover plate 54 and the potting adhesive are tightly bonded.

[0047] After the potting compound is injected, a stable and varying signal is first introduced, followed by a perturbation waveform. This changes the magnitude of the magnetic field of the iron core 32, which, when passing through the aluminum sheet 43, alters the eddy currents within it. The aluminum sheet 43, being a conductor, experiences a Lorentz force in the magnetic field, generating and transmitting ultrasonic waves. The pressure plate 41, while pressing the outer cover plate 54 of the printed circuit board assembly 5, also acts as a waveguide, guiding the ultrasonic waves into the potting compound. The ultrasonic waves ensure a more uniform distribution of the potting compound, preventing the possibility of small air bubbles between fine-pitch components, thus improving potting quality and achieving breakdown protection. After the potting compound has completely cured, the signal input is stopped, the cover plate assembly 4 is removed, the screw 23 fixing the slider 22 in the limiting assembly 2 is unscrewed, the slider 22 is moved, and the printed circuit board assembly 5 is removed. The potting operation is then complete.

[0048] The potting device of the present invention ensures that the printed circuit board assembly 5 is placed horizontally and stably. By attracting the cover plate assembly 4 and the base 1 together by the electromagnetic force between the solenoid with iron core 3 and the magnet 42, the outer cover plate 54 of the printed circuit board assembly 5 is fixed to the assembly housing 52 in a good and stable manner. The ultrasonic waves are introduced into the potting adhesive by the setting of the aluminum sheet 43, which further improves the potting quality.

[0049] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention without departing from the principles and spirit of the present invention.

Claims

1. A potting apparatus for a printed circuit board assembly with lead-out cables, characterized in that: Includes base (1), limiting assembly (2), solenoid with iron core (3), and cover plate assembly (4); The base (1) is located at the bottom of the potting device, and the base (1) has a first mounting hole (11) in the center for horizontally suspending the printed circuit board assembly (5). Multiple limiting components (2) are evenly distributed on the base (1) along the circumference of the first mounting hole (11), with their limiting direction facing the first mounting hole (11), for clamping and positioning the printed circuit board assembly (5). Each limiting component (2) has a cored solenoid (3) on one side, and the cored solenoid (3) is electrically connected to an external function generator; The cover plate assembly (4) includes a pressure plate (41), a magnet (42), and an aluminum sheet (43); the pressure plate (41) is located directly above the base (1), and the pressure plate (41) is embedded with a magnet (42) that corresponds one-to-one with the iron core solenoid (3) on the base (1); the aluminum sheet (43) is located at the lower end of the magnet (42) and is coaxially embedded in the pressure plate (41) with the magnet (42). The connector (51) of the printed circuit board assembly (5) is embedded in the first mounting hole (11), the lower end face of the assembly housing (52) is placed horizontally on the base (1), the lead cable (53) passes through the first mounting hole (11) and is suspended in the air, and the printed circuit board assembly (5) is positioned by the limiting component (2); after the adhesive is poured into the printed circuit board assembly (5), the outer cover plate (54) is assembled, and the cover plate assembly (4) is placed on the base (1); the cored solenoid (3) is energized by the external function generator. The signal, the iron core solenoid (3) generates electromagnetic force to attract the magnet (42) of the cover plate assembly (4), and the outer cover plate (54) of the printed circuit board assembly (5) is pressed by the pressure plate (41); by applying a disturbance waveform to the iron core solenoid, the magnitude of the magnetic field generated in the iron core solenoid changes. When the changing magnetic field passes through the aluminum sheet, it will change the magnitude of the eddy current in the aluminum sheet. The aluminum sheet is subjected to the Lorentz force in the magnetic field and generates ultrasonic waves. The pressure plate introduces the ultrasonic waves into the potting adhesive.

2. The potting apparatus for a printed circuit board assembly with lead-out cables according to claim 1, characterized in that: The base (1) includes a base plate (12), a crossbeam (13), a column (14), and a support plate (15); multiple columns (14) are fixed below the base plate (12) to support the base plate (12) so that it is suspended horizontally; multiple crossbeams (13) are connected in sequence to surround the base plate (12), and the base plate (12) and the crossbeams (13) together form a cavity; the support plate (15) is placed horizontally in the cavity, the lower end face of the support plate (15) is fixed to the base plate (12), and the periphery of the support plate (15) is in contact with the inner side wall of the crossbeam (13); the first mounting hole (11) is located in the center of the support plate (15) and penetrates the base plate (12); the cored solenoid (3) and the limiting component (2) are installed on the support plate (15).

3. The potting apparatus for a printed circuit board assembly with lead-out cables according to claim 2, characterized in that: The size of the first mounting hole (11) matches the outer diameter of the connector (51) of the printed circuit board assembly (5).

4. The potting apparatus for a printed circuit board assembly with lead-out cables according to claim 2, characterized in that: The support plate (15) has a plurality of second mounting holes evenly distributed around the first mounting hole (11) for mounting a solenoid tube (3) with an iron core.

5. The potting apparatus for a printed circuit board assembly with lead-out cables according to claim 4, characterized in that: The cored solenoid (3) includes a coil (31), an iron core (32) and a transparent plastic shell (33). The iron core (32) is vertically installed in the second mounting hole of the support plate (15). The coil (31) is wound around the outer diameter of the iron core (32). The plastic shell (33) is wrapped around the outside of the coil (31).

6. The potting apparatus for a printed circuit board assembly with lead-out cables according to claim 5, characterized in that: The coil (31) is electrically connected to the function generator. A power amplifier is connected in series between the function generator and the coil (31) to supply power to the function generator.

7. The potting apparatus for a printed circuit board assembly with lead-out cables according to claim 2, characterized in that: The limiting component (2) includes a guide rail (21), a slider (22), and a screw (23). The guide rail (21) is fixed to the upper surface of the support plate (15). The central axis of the guide rail (21) intersects perpendicularly with the axis of the first mounting hole (11). The two sides of the guide rail (21) are provided with slides (211) parallel to the central axis of the guide rail. The slider (22) is fitted onto the guide rail (21) and is slidably connected to the slide (211). The screw (23) passes through the slider (22) and its end extends to the slide (211) to limit the axial position of the slider (22) on the guide rail (21). The side of the slider (22) facing the first mounting hole (11) contacts the outer side of the component housing (52).

8. The potting apparatus for a printed circuit board assembly with lead-out cables according to claim 2, characterized in that: Both the pressure plate (41) and the support plate (15) are polytetrafluoroethylene (PTFE) plates.

9. The potting apparatus for a printed circuit board assembly with lead-out cables according to claim 2, characterized in that: Both the crossbeam (13) and the base plate (12) are made of 45 steel plate.

10. The potting apparatus for a printed circuit board assembly with lead-out cables according to claim 2, characterized in that: The column (14) is made of hot-rolled equilateral 45 steel, and the column (14) is fixed to the base plate (12) by welding.

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