Modular multi-connection heat pipe refrigeration combined cabinet and control method thereof

Abstract

The application provides a modular multi-connected heat pipe refrigeration combined cabinet and a control method thereof. The modular multi-connected heat pipe refrigeration combined cabinet is used for accommodating a server. The modular multi-connected heat pipe refrigeration combined cabinet comprises a cabinet, an accommodating cavity and a return air passage arranged in the cabinet, an air inlet and an air outlet formed on the cabinet, the air inlet being communicated with the accommodating cavity, and the return air passage being communicated with the accommodating cavity and the air outlet respectively. The accommodating cavity is used for accommodating the server, and an air inlet end of the server corresponds to the air inlet. A first heat dissipation unit is arranged in the return air passage and close to a communication position of the return air passage and the accommodating cavity. A second heat dissipation unit is arranged in the return air passage and located between the first heat dissipation unit and the air outlet. A refrigeration device is communicated with the first heat dissipation unit and the second heat dissipation unit and used for transmitting refrigerant into the first heat dissipation unit and the second heat dissipation unit, so that the first heat dissipation unit and the second heat dissipation unit cool air flow in the return air passage.

Description

Technical Field

[0001] This invention relates to the field of air conditioning technology, and specifically proposes a modular multi-unit heat pipe cooling combined cabinet and a control method for the modular multi-unit heat pipe cooling combined cabinet. Background Technology

[0002] In related technologies, the power consumption of data center cabinets often varies. In order to solve the problem of local hot spots in high-power cabinets, air conditioning systems often use a "flooding" cooling method, resulting in energy waste. Summary of the Invention

[0003] To address at least one of the aforementioned technical problems, the first objective of this invention is to propose a modular multi-unit heat pipe cooling combined cabinet.

[0004] The second objective of this invention is to propose a control method for a modular multi-unit heat pipe cooling combined cabinet.

[0005] In view of this, according to the first objective of the present invention, the modular multi-unit heat pipe cooling combined cabinet proposed by the present invention is used to house servers. The modular multi-unit heat pipe cooling combined cabinet includes: a housing, in which a housing cavity and a return air channel are provided, and an air inlet and an air outlet are provided on the housing. The air inlet is connected to the housing cavity, and the return air channel is connected to both the housing cavity and the air outlet. The housing cavity is used to house servers, and the air inlet of the servers corresponds to the air inlet. A first heat dissipation unit is disposed in the return air channel and is located near the connection between the return air channel and the housing cavity. A second heat dissipation unit is disposed in the return air channel and is located between the first heat dissipation unit and the air outlet. A cooling device is connected to the first heat dissipation unit and the second heat dissipation unit and is used to transfer refrigerant into the first heat dissipation unit and the second heat dissipation unit so that the first heat dissipation unit and the second heat dissipation unit cool the airflow in the return air channel.

[0006] The modular multi-unit heat pipe cooling combination cabinet proposed in this invention is specifically used to house servers for server protection.

[0007] The modular multi-unit heat pipe cooling cabinet includes a chassis, a first heat dissipation unit, a second heat dissipation unit, and a cooling device. The chassis is a hollow shell structure with a housing cavity and a return air channel inside. The chassis has an air inlet and an air outlet, with the air inlet connected to the housing cavity and the return air channel connected to both the housing cavity and the air outlet. Airflow enters the housing cavity through the air inlet, then flows through the housing cavity into the connected return air channel, and finally flows through the return air channel to the air outlet and is discharged from the chassis.

[0008] The enclosure is used to house the server. The air inlet of the server corresponds to the air inlet, so that when the airflow enters the enclosure through the air inlet, it can directly act on the air inlet of the server. The server dissipates heat under the action of the airflow, and the hot airflow enters the return air channel.

[0009] The first heat dissipation unit and the second heat dissipation unit are disposed in the return air channel. The first heat dissipation unit is close to the connection between the return air channel and the accommodating cavity. The second heat dissipation unit is located between the first heat dissipation unit and the air outlet. The refrigeration device is connected to the first heat dissipation unit and the second heat dissipation unit and is used to transfer refrigerant into the first heat dissipation unit and the second heat dissipation unit so that the first heat dissipation unit and the second heat dissipation unit can cool the airflow in the return air channel.

[0010] This invention arranges a first heat dissipation unit at the connection between the return air duct and the accommodating cavity, so that the first heat dissipation unit is close to the server and close to the heat load components for cooling. The remaining heat is carried away by the second heat dissipation unit in the return air duct in stages. By setting the number and position of the heat dissipation units, the heat dissipation efficiency is improved, and the waste of resources caused by filling the return air duct with heat dissipation units or using high-power heat dissipation components is avoided.

[0011] In addition, the modular multi-unit heat pipe cooling combined cabinet according to the above-mentioned technical solution provided by the present invention may also have the following additional technical features:

[0012] In some technical solutions, optionally, the first heat dissipation unit includes: a first coil disposed in the return air duct, the first coil including a first refrigerant inlet and a first refrigerant outlet; the refrigeration device includes: an evaporator-condenser connected to the first refrigerant inlet; a first pipeline connected to the first refrigerant outlet; a second pipeline connected to the first pipeline; a first valve body disposed on the second pipeline for controlling the on / off state of the second pipeline; a condensing pipeline connected to the second pipeline and the evaporator-condenser for condensing gaseous refrigerant into liquid refrigerant; and a cooling supplement component connected to the evaporator-condenser for heat exchange with the refrigerant in the evaporator-condenser.

[0013] In some technical solutions, optionally, the cooling supplement component includes: a first condenser; a compressor, the output end of which is connected to the input end of the first condenser; and a cooling supplement pipe, one end of which is connected to the output end of the first condenser, and the other end of which is connected to the input end of the compressor, with part of the cooling supplement pipe located inside the evaporator-condenser.

[0014] In some technical solutions, the refrigeration device may optionally include a third pipeline, a second valve body, and a second condenser, wherein the third pipeline is connected to the first pipeline, the second valve body is disposed on the third pipeline for controlling the on / off state of the third pipeline, and the second condenser is connected to the third pipeline and the condensing pipeline.

[0015] In some technical solutions, the second heat dissipation unit includes: a second coil, which is disposed in the return air duct. The second coil includes a second refrigerant inlet and a second refrigerant outlet. The second refrigerant inlet is connected to the evaporator-condenser, and the second refrigerant outlet is connected to the first pipeline.

[0016] In some technical solutions, the modular multi-unit heat pipe cooling combined cabinet may optionally include a fan, which is located in the return air duct, between the second heat dissipation unit and the air outlet, and close to the air outlet; the air outlet direction of the fan is from the return air duct to the air outlet, so as to guide the airflow in the return air duct out of the return air duct.

[0017] In some technical solutions, the housing may optionally include a frame and a partition. The frame includes a first wall and a second wall opposite to each other, and the first wall has an opening. The partition is disposed in the frame, one end of the partition is connected to the first wall, and the other end of the partition has a gap with the second wall to separate the opening into an air inlet and an air outlet, and to separate the frame into a receiving cavity and a return air channel.

[0018] In some technical solutions, the frame may optionally include a body, which includes a first wall and a second wall, and a through hole is provided on at least one side of the body; the frame may also include a side plate, which is detachably disposed on the body and covers the through hole.

[0019] According to a second aspect of the present invention, the present invention also proposes a control method for a modular multi-unit heat pipe cooling combined cabinet, for controlling a modular multi-unit heat pipe cooling combined cabinet as described in any of the above technical solutions, wherein the control method for the modular multi-unit heat pipe cooling combined cabinet includes: acquiring the outdoor ambient temperature; and controlling the operation of the cooling device according to the outdoor ambient temperature.

[0020] The control method for the modular multi-unit heat pipe cooling combined cabinet proposed in the second aspect of the present invention is used to control the modular multi-unit heat pipe cooling combined cabinet as described in any of the above technical solutions, and therefore has all the beneficial effects of the modular multi-unit heat pipe cooling combined cabinet as described in any of the above technical solutions.

[0021] The control method for modular multi-unit heat pipe cooling combined cabinets includes: first, obtaining the outdoor ambient temperature, i.e. the ambient temperature where the cooling unit is located, and then controlling the operation of the cooling unit based on the outdoor ambient temperature.

[0022] This invention controls the operation of the refrigeration device according to the outdoor ambient temperature, thereby making better use of the outdoor cold source, accurately regulating the working status of the refrigeration device, and avoiding resource waste.

[0023] In some technical solutions, optionally, the operation of the refrigeration device is controlled according to the outdoor ambient temperature, including: controlling the first valve of the refrigeration device to close and the second valve of the refrigeration device to open when the outdoor ambient temperature is lower than a first preset temperature; controlling the first valve of the refrigeration device to close and the second valve of the refrigeration device to open when the outdoor ambient temperature is greater than or equal to the first preset temperature and less than a second preset temperature, and controlling the cooling supplementation component of the refrigeration device to operate at a first preset frequency; controlling the first valve of the refrigeration device to open and the cooling supplementation component of the refrigeration device to operate at a second preset frequency when the outdoor ambient temperature is greater than or equal to the second preset temperature, and controlling the second valve of the refrigeration device to close, wherein the second preset frequency is greater than the first preset frequency.

[0024] Additional aspects and advantages of the invention will become apparent in the following description or may be learned by practice of the invention. Attached Figure Description

[0025] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0026] Figure 1 This diagram illustrates the structure of a modular multi-unit heat pipe cooling combined cabinet according to one embodiment of the present invention.

[0027] Figure 2 This diagram illustrates the combined use of a modular multi-unit heat pipe cooling cabinet according to one embodiment of the present invention.

[0028] Figure 3 This is a schematic flowchart of one embodiment of the control method for a modular multi-unit heat pipe cooling combined cabinet according to the present invention;

[0029] Figure 4 This is a second schematic flowchart illustrating the control method of a modular multi-unit heat pipe cooling combined cabinet according to one embodiment of the present invention;

[0030] Figure 5 The third schematic flowchart illustrates the control method of a modular multi-unit heat pipe cooling combined cabinet according to one embodiment of the present invention;

[0031] Figure 6 The fourth flowchart illustrates the control method of a modular multi-unit heat pipe cooling combined cabinet according to one embodiment of the present invention.

[0032] in, Figure 1 and Figure 2 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0033] 100 Module Multi-Unit Heat Pipe Cooling Combined Cabinet, 102 Cabinet, 104 Frame, 106 Body, 108 First Wall, 110 Opening, 112 Air Inlet, 114 Air Outlet, 116 Second Wall, 118 Through Hole, 120 Side Panel, 122 Partition, 124 Receiving Cavity, 126 Gap, 128 Return Air Channel, 130 First Heat Dissipation Unit, 132 First Coil, 134 First Refrigerant Inlet, 136 Second Refrigerant Outlet, 138 Third Valve Body, 140 Second Heat Dissipation Unit, 142 Second Coil, 144 Second refrigerant inlet, 146 Second refrigerant outlet, 148 Fourth valve body, 150 Refrigeration unit, 152 Evaporator-condenser, 154 First pipeline, 156 Second pipeline, 158 First valve body, 160 Condensing pipeline, 162 Cooling supplement assembly, 164 First condenser, 166 Compressor, 168 Cooling supplement pipeline, 170 Expansion valve, 172 Refrigerant pump, 174 Third pipeline, 176 Second valve body, 178 Second condenser, 180 Fan, 200 Server, 202 Air inlet. Detailed Implementation

[0034] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0035] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0036] The following reference Figures 1 to 6 The present invention describes a modular multi-unit heat pipe cooling combined cabinet 100 and a control method thereof according to some embodiments of the present invention.

[0037] like Figure 1 and Figure 2As shown, in one embodiment of the present invention, a modular multi-unit heat pipe cooling combined cabinet 100 is proposed. The modular multi-unit heat pipe cooling combined cabinet 100 is used to house a server 200. The modular multi-unit heat pipe cooling combined cabinet 100 includes: a housing 102, a housing cavity 124 and a return air channel 128 are provided inside the housing 102, and an air inlet 112 and an air outlet 114 are opened on the housing 102. The air inlet 112 is connected to the housing cavity 124, and the return air channel 128 is connected to both the housing cavity 124 and the air outlet 114. The housing cavity 124 is used to house the server 200. The air inlet 202 corresponds to the air inlet 112; the first heat dissipation unit 130 is disposed in the return air channel 128 and is close to the connection between the return air channel 128 and the accommodating cavity 124; the second heat dissipation unit 140 is disposed in the return air channel 128 and is located between the first heat dissipation unit 130 and the air outlet 114; the cooling device 150 is connected to the first heat dissipation unit 130 and the second heat dissipation unit 140 and is used to transfer refrigerant into the first heat dissipation unit 130 and the second heat dissipation unit 140 so that the first heat dissipation unit 130 and the second heat dissipation unit 140 cool the airflow in the return air channel 128.

[0038] The modular multi-unit heat pipe cooling combined cabinet 100 proposed in this invention is specifically used to house the server 200 in order to protect the server 200.

[0039] The modular multi-unit heat pipe cooling combined cabinet 100 includes a housing 102, a first heat dissipation unit 130, a second heat dissipation unit 140, and a cooling device 150. The housing 102 is a hollow shell structure with a housing cavity 124 and a return air channel 128 inside. The housing 102 has an air inlet 112 and an air outlet 114. The air inlet 112 is connected to the housing cavity 124, and the return air channel 128 is connected to both the housing cavity and the air outlet 114. Airflow can enter the housing cavity 124 through the air inlet 112, then enter the connected return air channel 128 through the housing cavity 124, and then flow to the air outlet 114 and be discharged from the housing 102.

[0040] The accommodating cavity 124 is used to accommodate the server 200. The air inlet 202 of the server 200 corresponds to the air inlet 112, so that when the airflow enters the accommodating cavity 124 through the air inlet 112, it can directly act on the air inlet 202 of the server 200. The server 200 dissipates heat under the action of the airflow, and the hot airflow enters the return air channel 128.

[0041] The first heat dissipation unit 130 and the second heat dissipation unit 140 are disposed in the return air channel 128. The first heat dissipation unit 130 is close to the connection between the return air channel 128 and the accommodating cavity 124. The second heat dissipation unit 140 is located between the first heat dissipation unit 130 and the air outlet 114. The refrigeration device 150 is connected to the first heat dissipation unit 130 and the second heat dissipation unit 140 and is used to transfer refrigerant into the first heat dissipation unit 130 and the second heat dissipation unit 140 so that the first heat dissipation unit 130 and the second heat dissipation unit 140 cool the airflow in the return air channel 128.

[0042] The present invention arranges a first heat dissipation unit 130 at the connection between the return air channel 128 and the accommodating cavity 124, so that the first heat dissipation unit 130 is close to the server 200 and close to the heat load components for cooling. The remaining heat is carried away by the second heat dissipation unit 140 in the return air channel 128 in stages. By setting the number and position of the heat dissipation units, the heat dissipation efficiency is improved, and the waste of resources caused by filling the return air channel 128 with heat dissipation units or using high-power heat dissipation components is avoided.

[0043] like Figure 1 and Figure 2 As shown, in some embodiments, optionally, the first heat dissipation unit 130 includes: a first coil 132 disposed within the return air channel 128, the first coil 132 including a first refrigerant inlet 134 and a first refrigerant outlet 136; the refrigeration device 150 includes: an evaporator-condenser 152 connected to the first refrigerant inlet 134; a first pipe 154 connected to the first refrigerant outlet 136; a second pipe 156 connected to the first pipe 154; a first valve body 158 disposed on the second pipe 156 for controlling the on / off state of the second pipe 156; a condenser pipe 160 connected to the second pipe 156 and the evaporator-condenser 152 for condensing gaseous refrigerant into liquid refrigerant; and a cooling supplement component 162 connected to the evaporator-condenser 152 for heat exchange with the refrigerant within the evaporator-condenser 152.

[0044] In this embodiment, the first heat dissipation unit 130 specifically includes a first coil 132, which is disposed in the return air channel 128. The first coil 132 includes a first refrigerant inlet 134 and a first refrigerant outlet 136. Specifically, the first refrigerant inlet 134 is used to allow refrigerant to enter the interior of the first coil 132, and the first refrigerant outlet 136 is used to allow refrigerant to exit the interior of the first coil 132.

[0045] The refrigeration unit 150 includes an evaporator-condenser 152, a first pipe 154, a second pipe 156, a first valve body 158, and a first condenser coil. The evaporator-condenser 152 is connected to a first refrigerant inlet 134, and can transfer liquid refrigerant through the first refrigerant inlet 134 to the first coil 132, thereby cooling the air.

[0046] The first pipe 154 is connected to the first refrigerant outlet 136. The first pipe 154 is used to transfer the refrigerant flowing out of the first refrigerant outlet 136. Specifically, after the liquid refrigerant flows into the first coil 132, the first coil 132 acts on the airflow in the return air channel 128. The liquid refrigerant in the first coil 132 will gradually become gaseous refrigerant. The gaseous refrigerant can be discharged from the first refrigerant outlet 136 and enter the first pipe 154 for transfer.

[0047] The second pipe 156 is connected to the first pipe 154. The first valve body 158 is installed on the second pipe 156 and is used to control the opening and closing of the second pipe 156. The first condenser pipe is connected to the second pipe 156 and the evaporator condenser 152 and is used to condense the gaseous refrigerant into liquid refrigerant.

[0048] The present invention provides a refrigeration device 150 including a cooling supplement component 162 and a condenser pipe 160, which can achieve more accurate refrigeration in response to differences in room temperature and avoid meaningless energy consumption.

[0049] Specifically, the first valve body 158 is an electric valve.

[0050] like Figure 1 and Figure 2 As shown, in some embodiments, optionally, the cooling supplement assembly 162 includes: a first condenser 164; a compressor 166, the output end of which is connected to the input end of the first condenser 164; a cooling supplement pipe 168, one end of which is connected to the output end of the first condenser 164, and the other end of which is connected to the input end of the compressor 166, with a portion of the cooling supplement pipe 168 located within the evaporator condenser 152.

[0051] In this embodiment, the cooling component 162 specifically includes a first condenser 164, a compressor 166, and a cooling pipe 168. The first condenser 164 is used to convert gas or vapor into liquid, that is, to convert gaseous refrigerant into liquid refrigerant.

[0052] The cooling supplement assembly 162 also includes a compressor 166, the output end of which is connected to the input end of the first condenser 164. The compressor 166 is used to compress the refrigerant and can also drive the refrigerant to circulate.

[0053] One end of the supplementary cooling pipe 168 is connected to the output end of the first condenser 164, and the other end of the supplementary cooling pipe 168 is connected to the input end of the compressor 166. Part of the supplementary cooling pipe 168 is located inside the evaporator condenser 152. The compressor 166 and the first condenser 164 generate low-temperature substances during operation, and these substances are transferred through the supplementary cooling pipe 168. The pipe wall temperature of the supplementary cooling pipe 168 decreases due to the entry of the low-temperature substances. The supplementary cooling pipe 168 located inside the evaporator condenser 152 can contact the refrigerant inside the evaporator condenser 152 and exchange heat with it, further reducing the temperature of the refrigerant inside the evaporator condenser 152 and turning the gaseous refrigerant into a liquid refrigerant.

[0054] By setting up a cooling component 162 including a first condenser 164, a compressor 166, and a cooling pipe 168, the present invention can enable the refrigeration device 150 to have more levels of refrigeration capacity, thereby avoiding meaningless refrigeration energy consumption and accurately performing refrigeration operations.

[0055] Specifically, the first condenser 164 is a mechanical compression condenser.

[0056] Specifically, the cooling replenishment assembly 162 also includes an expansion valve 170, which is disposed on the cooling replenishment pipe 168 and located between the output end of the first condenser 164 and the evaporator condenser 152. The expansion valve 170 is used to regulate the flow rate of the low-temperature substance in the cooling replenishment pipe 168.

[0057] like Figure 1 and Figure 2 As shown, in some embodiments, optionally, the refrigeration device 150 further includes a third pipe 174, a second valve body 176, and a second condenser 178, wherein the third pipe 174 is connected to the first pipe 154, the second valve body 176 is disposed on the third pipe 174 for controlling the on / off state of the third pipe 174, and the second condenser 178 is connected to the third pipe 174 and the condensing pipe 160.

[0058] In this embodiment, the refrigeration device 150 further includes a third pipe 174, a second valve body 176, and a second condenser 178. The third pipe 174 is connected to the first pipe 154, and the second valve body 176 is disposed on the third pipe 174 to control the opening and closing of the third pipe 174. The second condenser 178 is connected to the third pipe 174 and the condensing pipe 160. The second condenser 178 is used to convert gas or vapor into liquid, that is, to convert gaseous refrigerant into liquid refrigerant.

[0059] In addition to the compression condensation circuit, this invention also includes a separate condensation circuit that utilizes a condenser. The compression condensation circuit and the separate condensation circuit have different cooling capacities. By controlling the first valve body 158 and the second valve body 176, the refrigeration device 150 can operate with different cooling capacities, thereby avoiding unnecessary refrigeration energy consumption and accurately performing refrigeration operations.

[0060] like Figure 1 and Figure 2 As shown, in some embodiments, the second heat dissipation unit 140 includes: a second coil 142 disposed in the return air channel 128, the second coil 142 including a second refrigerant inlet 144 and a second refrigerant outlet 146, the second refrigerant inlet 144 being connected to the evaporator condenser 152, and the second refrigerant outlet 146 being connected to the first pipeline 154.

[0061] In this embodiment, the second heat dissipation unit 140 specifically includes a second coil 142, which is disposed in the return air channel 128. The second coil 142 functions in the return air channel 128 to cool the airflow in the return air channel 128.

[0062] The second coil 142 includes a second refrigerant inlet 144 and a second refrigerant outlet 146. The second refrigerant inlet 144 is connected to the evaporator-condenser 152, and the second refrigerant outlet 146 is connected to the first pipeline 154. The evaporator-condenser 152 inputs low-temperature liquid refrigerant into the second coil 142 through the second refrigerant inlet 144. The liquid refrigerant in the second coil 142 will become gaseous after acting on the hot air flow and will flow out from the second refrigerant outlet 146 into the first pipeline 154. After condensation and evaporation, it will become liquid refrigerant again.

[0063] The present invention connects the first heat dissipation unit 130 and the second heat dissipation unit 140 to the same cooling device 150, thereby improving the convenience of controlling the first heat dissipation unit 130 and the second heat dissipation unit 140.

[0064] Specifically, the second heat dissipation unit 140 also includes a fourth valve body 148, which is installed at the second refrigerant inlet 144 of the second coil 142. The refrigerant flow rate of the second coil 142 is adjusted by adjusting the valve opening of the fourth valve body 148.

[0065] Specifically, the fourth valve body 148 is an electric valve.

[0066] Specifically, a refrigerant pump 172 can be installed on the pipeline connecting the evaporator condenser 152 and the second refrigerant inlet 144 to provide power for refrigerant circulation in scenarios where the refrigerant gravity return slope is not met.

[0067] Specifically, such as Figure 2 As shown, there are multiple refrigeration devices 150. The first heat dissipation unit 130 and the second heat dissipation unit 140 can also be connected to different refrigeration devices 150. The present invention adopts a multi-stage refrigeration concept, which enables the first heat dissipation unit 130 and the second heat dissipation unit 140 to operate at different evaporation temperatures, so as to make better use of outdoor cold sources.

[0068] like Figure 1 and Figure 2 As shown, in some embodiments, optionally, the modular multi-unit heat pipe cooling combined cabinet 100 also includes a fan 180, which is disposed in the return air channel 128, located between the second heat dissipation unit 140 and the air outlet 114, and close to the air outlet 114; the air outlet direction of the fan 180 is from the return air channel 128 to the air outlet 114, so as to guide the airflow in the return air channel 128 out of the return air channel 128.

[0069] In this embodiment, the modular multi-unit heat pipe cooling combined cabinet 100 also includes a fan 180, which is disposed in the return air duct 128, located between the second heat dissipation unit 140 and the air outlet 114, and close to the air outlet 114. The air outlet direction of the fan 180 is from the return air duct 128 to the air outlet 114, so as to guide the airflow in the return air duct 128 out of the return air duct 128, thereby achieving heat dissipation for the server 200 and reducing the room load in the computer room.

[0070] like Figure 1 and Figure 2 As shown, in some embodiments, optionally, the housing 102 includes a frame 104 and a partition 122. The frame 104 includes a first wall 108 and a second wall 116 opposite to each other. The first wall 108 has an opening 110. The partition 122 is disposed inside the frame 104. One end of the partition 122 is connected to the first wall 108, and the other end of the partition 122 has a gap 126 between it and the second wall 116, so as to divide the opening 110 into an air inlet 112 and an air outlet 114, and to divide the frame 104 into a receiving cavity 124 and a return air channel 128.

[0071] In this embodiment, the modular multi-unit heat pipe cooling combined cabinet 100 includes a frame 104, which specifically includes a first wall 108 and a second wall 116 opposite to the first wall 108. The first wall 108 has an opening 110, and the second wall 116 is a completely closed wall structure.

[0072] The housing 102 also includes a partition 122, which is disposed within the frame 104. One end of the partition 122 is connected to the first wall 108, while the other end of the partition 122 has a gap 126 between it and the second wall 116. The end of the partition 122 connected to the first wall 108 divides the opening 110 on the first wall 108, thereby dividing the opening 110 into an air inlet 112 and an air outlet 114. Since the partition 122 is disposed within the housing and the other end of the partition 122 has a gap 126 between it and the second wall 116, the partition 122 also divides the space within the housing, separating the space within the housing into a receiving cavity 124 and a return air channel 128.

[0073] This invention divides the internal space of the housing using a partition 122. Within the housing, the space containing the server 200 is separated from the heat dissipation components by the partition 122, isolating the main body of the server 200 and its air intake 202 from the first heat dissipation unit 130 and the second heat dissipation unit 140. A gap 126 connects the return air channel 128 to the accommodating cavity 124, allowing the exhaust air from the server 200 to enter the first heat dissipation unit 130 and the second heat dissipation unit 140 for cooling. This invention forms a micro-thermal channel inside the modular multi-unit heat pipe cooling rack 100, resulting in good airflow organization, close proximity to the heat source for cooling, energy efficiency, and more convenient and flexible installation, while also having a small overall footprint.

[0074] like Figure 1 and Figure 2 As shown, in some embodiments, optionally, the frame 104 includes a body 106, the body 106 includes a first wall 108 and a second wall 116, and the body 106 has a through hole 118 on at least one side; the frame 104 also includes a side plate 120, the side plate 120 is detachably disposed on the body 106 and covers the through hole 118.

[0075] In this technical solution, the frame 104 specifically includes a body 106 and a side plate 120. The body 106 has the aforementioned first wall 108 and second wall 116. In addition, between the first wall 108 and the second wall 116, that is, on the side wall of the body 106, at least one side of the body 106 is provided with a through hole 118, which is connected to the return air channel 128.

[0076] The side panel 120 is detachably mounted on the main body 106 and covers the through hole 118. When multiple modular multi-unit heat pipe cooling combined cabinets 100 are used in combination, the side panel 120 can be removed from the main body 106, and then the through holes 118 of different main bodies 106 are aligned to realize the connection of the return air channel 128. The first heat dissipation unit 130 and / or the second heat dissipation unit 140 are used to cool the airflow in different return air channels 128.

[0077] like Figure 3The diagram illustrates one embodiment of a control method for a modular multi-unit heat pipe cooling cabinet according to the present invention. The control method for the modular multi-unit heat pipe cooling cabinet includes:

[0078] S302: Obtain outdoor ambient temperature;

[0079] S304: Controls the operation of the refrigeration unit according to the outdoor ambient temperature.

[0080] In this embodiment, the control method for the modular multi-unit heat pipe cooling combined cabinet proposed in this invention is used to control the modular multi-unit heat pipe cooling combined cabinet as described in any of the above embodiments, and therefore has all the beneficial effects of the modular multi-unit heat pipe cooling combined cabinet as described in any of the above embodiments.

[0081] The control method for a modular multi-unit heat pipe cooling cabinet includes: first, acquiring the outdoor ambient temperature, i.e., the ambient temperature where the cooling unit is located; and then controlling the operation of the cooling unit based on the outdoor ambient temperature. This invention, by controlling the operation of the cooling unit according to the outdoor ambient temperature, achieves better utilization of the outdoor cold source, accurately regulates the operating status of the cooling unit, and avoids resource waste.

[0082] like Figure 4 The diagram shown is a second schematic flowchart illustrating a control method for a modular multi-unit heat pipe cooling cabinet according to an embodiment of the present invention. The control method for the modular multi-unit heat pipe cooling cabinet includes:

[0083] S402: Obtain outdoor ambient temperature;

[0084] S404: Based on the outdoor ambient temperature being lower than the first preset temperature, the first valve of the refrigeration unit is closed, and the second valve of the refrigeration unit is opened.

[0085] In this embodiment, the process of controlling the operation of the cooling device based on the outdoor ambient temperature is configured as follows: when the outdoor ambient temperature is lower than a first preset temperature, the first valve of the cooling device is closed, and the second valve of the cooling device is opened. When the outdoor ambient temperature is lower than the first preset temperature, the outdoor ambient temperature is relatively low, and the heat can be completely removed through the refrigeration cycle of the second condenser, eliminating the need to activate the supplemental cooling component. By controlling the operation based on the outdoor ambient temperature, the cooling capacity of the cooling device can be made suitable for current modular multi-unit heat pipe cooling rack equipment, suitable for the current server heat load, and reducing unnecessary energy consumption.

[0086] like Figure 5 The diagram shown is a third flowchart illustrating a control method for a modular multi-unit heat pipe cooling cabinet according to an embodiment of the present invention. The control method for the modular multi-unit heat pipe cooling cabinet includes:

[0087] S502: Obtain outdoor ambient temperature;

[0088] S504: Based on the outdoor ambient temperature being greater than or equal to the first preset temperature and less than the second preset temperature, control the first valve of the refrigeration device to close, control the second valve of the refrigeration device to open, and control the cooling replenishment component of the refrigeration device to operate at the first preset frequency.

[0089] In this embodiment, the process of controlling the operation of the refrigeration device based on the outdoor ambient temperature is configured as follows: when the outdoor ambient temperature is greater than or equal to a first preset temperature and less than a second preset temperature, the first valve of the refrigeration device is closed, the second valve of the refrigeration device is opened, and the supplementary cooling component of the refrigeration device is operated at a first preset frequency. When the outdoor ambient temperature is greater than or equal to the first preset temperature and less than the second preset temperature, the outdoor ambient temperature is relatively high, and pre-cooling can be performed by the second condenser. Then, supplementary cooling is performed by the supplementary cooling component operating at a non-full frequency, so that the refrigeration component can both meet the cooling requirements of the airflow and have good energy consumption performance.

[0090] like Figure 6 The diagram shown is a fourth flowchart illustrating a control method for a modular multi-unit heat pipe cooling cabinet according to an embodiment of the present invention. The control method for the modular multi-unit heat pipe cooling cabinet includes:

[0091] S602: Obtain outdoor ambient temperature

[0092] S604: Based on the outdoor ambient temperature being greater than or equal to the second preset temperature, control the first valve of the refrigeration device to open, control the cooling replenishment component of the refrigeration device to operate at the second preset frequency, and control the second valve of the refrigeration device to close.

[0093] In this embodiment, the process of controlling the operation of the refrigeration device based on the outdoor ambient temperature is configured as follows: Based on an outdoor ambient temperature greater than or equal to a second preset temperature, the first valve of the refrigeration device is opened, the cooling compensation component of the refrigeration device is operated at a second preset frequency, and the second valve of the refrigeration device is closed. The second preset frequency is greater than the first preset frequency. When the outdoor ambient temperature is greater than or equal to the second preset temperature, the outdoor temperature is very high, and the second condenser of the refrigeration component cannot provide sufficient cooling capacity. Therefore, the operating pipeline of the second condenser is closed, allowing all the heat to be carried away through the compression cooling cycle of the cooling compensation component.

[0094] In one embodiment of the invention, the modular multi-unit heat pipe cooling combined cabinet 100 is provided with a housing cavity 124 and a return air channel 128. The return air channel 128 is provided with a first heat dissipation unit 130, a second heat dissipation unit 140 and a fan. The housing cavity 124 and the return air channel 128 are connected at the rear and separated by a partition 122 in the middle.

[0095] The hot air from the server 200 first flows through the first heat dissipation unit 130 for primary cooling, and the remaining heat is cooled by the second heat dissipation unit 140. The cooled airflow is blown by the fan 180 to the front of the modular multi-unit heat pipe cooling combined cabinet 100. The first heat dissipation unit 130 and the second heat dissipation unit 140 are supplied with refrigerant by the cooling device 150.

[0096] Specifically, the second condenser 178 is a heat pipe condenser. The refrigeration device 150 of this invention consists of a heat pipe refrigeration cycle and a mechanical compression supplementary cooling cycle. The heat pipe refrigeration cycle mainly includes a heat pipe condenser, an evaporator condenser 152 (condensation side), and corresponding piping. When the outdoor ambient temperature is low, the high-temperature gaseous refrigerant evaporated from the indoor environment is condensed into a low-temperature liquid by the heat pipe condenser. After flowing through the evaporator condenser 152 (without heat exchange), it flows back to the first heat dissipation unit 130 and the second heat dissipation unit 140 by gravity.

[0097] The mechanical compression refrigeration cycle mainly includes a cooling supplement component 162, an evaporator-condenser 152 (evaporator side), and corresponding piping. When the outdoor ambient temperature is high, the low-pressure refrigerant is compressed into a high-temperature, high-pressure gas by the compressor 166, and then condensed into a high-pressure liquid at the mechanical compression condenser. After being throttled by the expansion valve 170, it becomes a low-pressure liquid and evaporates and absorbs heat in the evaporator-condenser 152, thus providing cooling supplement for the heat pipe cycle.

[0098] Specifically, the first heat dissipation unit 130 also includes a third valve body 138, which is installed at the first refrigerant inlet 134 of the first coil 132. The refrigerant flow rate of the first coil 132 is adjusted by adjusting the valve opening of the third valve body 138.

[0099] Specifically, the third valve body 138 is an electric valve.

[0100] Specifically, a refrigerant pump 172 can be installed on the pipeline connecting the evaporator condenser 152 and the first refrigerant inlet 134 to provide power for refrigerant circulation in scenarios where the refrigerant gravity return slope is not met.

[0101] The modular multi-unit heat pipe cooling combined cabinet 100 proposed in this invention has a pure heat pipe operation mode, a mechanical compression partial cooling mode, and a mechanical compression complete cooling operation mode.

[0102] 1. Pure heat pipe operation mode.

[0103] When T (outdoor ambient temperature) < T1 (first preset temperature, the first preset temperature is adjustable), the first valve body 158 is closed and the second valve body 176 is opened. At this time, the outdoor temperature is relatively low, and the heat in the computer room is completely removed through the heat pipe cooling cycle. There is no need to start the mechanical compression cooling cycle. The overall energy consumption unit is small and the system has extremely high energy efficiency.

[0104] 2. Mechanical compression section cooling mode.

[0105] When T1≤T<T2 (second preset temperature, the second preset temperature is adjustable), the first valve body 158 is closed and the second valve body 176 is opened. At this time, the outdoor temperature is relatively high. After the heat in the machine room is pre-cooled by the heat pipe condenser, the mechanical compression cooling cycle is used for supplementary cooling. Since the compressor 166, which has the highest energy consumption, does not need to run at full load at this time, the air conditioning system still has good energy consumption performance.

[0106] 3. Mechanical compression fully compensated cooling operation mode.

[0107] When the outdoor temperature T ≥ T2, the first valve 158 opens and the second valve 176 closes. At this time, the outdoor temperature is very high, and the heat pipe condenser can no longer provide cooling. The heat in the computer room needs to be completely removed by the compression cooling cycle. Because the system is close to the heat load for cooling, the refrigerant evaporation temperature in the computer room is significantly higher than that of a conventional air-cooled system. Therefore, T2 increases accordingly, resulting in a significant reduction in the operating time of this mode and a limited increase in overall energy consumption.

[0108] Specifically, heat pipe condensers and mechanical compression condensers can be stacked in a "V" shape (with the heat pipe condenser on the outermost layer) and share a common cooling fan. Evaporation spray modules can be added to the sides of the heat pipe condenser and mechanical compression condenser to further extend the natural cooling time and improve condensation efficiency.

[0109] Specifically, such as Figure 2 As shown, in the scenario of a multi-module, multi-unit heat pipe cooling rack 100 in a data center, heat dissipation unit 1 and heat dissipation unit 2 can be connected to different host systems. By removing the side panel 120, a through return air channel 128 is formed at the rear of the entire multi-module, multi-unit heat pipe cooling rack 100. Among them, the first heat dissipation unit 130, which is close to the server 200 and has a high evaporation temperature, can make fuller use of natural cold sources for primary cooling, and the heat pipe compressor cooling unit connected to it can reduce or even eliminate the need for a compressor system. The second heat dissipation unit 140 performs tiered cooling with a relatively low evaporation temperature to meet the inlet air temperature requirements of the multi-module, multi-unit heat pipe cooling rack 100.

[0110] In this invention, the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "link," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "link" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0111] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0112] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A modular multi-unit heat pipe cooling combined cabinet, characterized in that, For housing servers, the modular multi-unit heat pipe cooling combined cabinet includes: The housing has a receiving cavity and a return air channel inside. The housing has an air inlet and an air outlet. The air inlet is connected to the receiving cavity, and the return air channel is connected to both the receiving cavity and the air outlet. The accommodating cavity is used to accommodate the server, and the air inlet of the server corresponds to the air inlet. The first heat dissipation unit is disposed in the return air channel and is close to the connection between the return air channel and the accommodating cavity; The second heat dissipation unit is disposed in the return air channel, located between the first heat dissipation unit and the air outlet; A refrigeration device, connected to the first heat dissipation unit and the second heat dissipation unit, is used to transfer refrigerant into the first heat dissipation unit and the second heat dissipation unit so that the first heat dissipation unit and the second heat dissipation unit cool the airflow in the return air channel; The first heat dissipation unit includes a first coil; The first coil is disposed in the return air duct, and the first coil includes a first refrigerant inlet and a first refrigerant outlet; The refrigeration device includes an evaporator-condenser, a first pipeline, a second pipeline, a first valve body, a condenser pipeline, and a cooling compensation component; The evaporator-condenser is connected to the first refrigerant inlet; The first pipeline is connected to the first refrigerant outlet; The second pipeline is connected to the first pipeline; The first valve body is disposed on the second pipeline and is used to control the on / off state of the second pipeline; The condensing pipeline is connected to the second pipeline and the evaporator-condenser, and is used to condense the gaseous refrigerant into liquid refrigerant; The cooling supplement component is connected to the evaporator-condenser and is used to exchange heat with the refrigerant in the evaporator-condenser. The cooling supplement assembly includes a first condenser, a compressor, and cooling supplement piping; The output end of the compressor is connected to the input end of the first condenser; One end of the cooling supply pipe is connected to the output end of the first condenser, and the other end of the cooling supply pipe is connected to the input end of the compressor. Part of the cooling supply pipe is located inside the evaporator-condenser. The cooling replenishment assembly also includes an expansion valve, which is disposed in the cooling replenishment pipe between the output end of the first condenser and the evaporator-condenser. The expansion valve is used to regulate the flow rate of the low-temperature substance in the cooling replenishment pipe.

2. The modular multi-unit heat pipe cooling combined cabinet according to claim 1, characterized in that, The refrigeration device further includes: The third pipeline is connected to the first pipeline; The second valve body is disposed on the third pipeline and is used to control the opening and closing of the third pipeline; The second condenser is connected to the third pipeline and the condenser pipeline.

3. The modular multi-unit heat pipe cooling combined cabinet according to claim 1 or 2, characterized in that, The second heat dissipation unit includes: The second coil is installed in the return air duct, and the second coil includes a second refrigerant inlet and a second refrigerant outlet; The second refrigerant inlet is connected to the evaporator-condenser, and the second refrigerant inlet is connected to the first pipeline.

4. The modular multi-unit heat pipe cooling combined cabinet according to claim 1 or 2, characterized in that, The modular multi-heat pipe cooling combination cabinet also includes: A fan is installed in the return air duct, located between the second heat dissipation unit and the air outlet, and close to the air outlet; The fan's air outlet direction is from the return air duct to the air outlet, so as to exhaust the airflow in the return air duct.

5. The modular multi-unit heat pipe cooling combined cabinet according to claim 1 or 2, characterized in that, The housing includes: The frame includes a first wall and a second wall opposite to each other, the first wall having an opening; A partition is disposed within the frame, one end of which is connected to the first wall, and the other end of which has a gap with the second wall, so as to divide the opening into the air inlet and the air outlet, and to divide the frame into the accommodating cavity and the return air channel.

6. The modular multi-unit heat pipe cooling combined cabinet according to claim 5, characterized in that, The frame includes: The body includes the first wall and the second wall; The main body has a through hole on at least one side; Side plate, which is detachably disposed on the body and covers the through hole.

7. A control method for a modular multi-unit heat pipe cooling combined cabinet, characterized in that, The control method for the modular multi-unit heat pipe cooling combined cabinet as described in any one of claims 1 to 6 includes: Obtain the outdoor ambient temperature; The operation of the refrigeration device is controlled according to the outdoor ambient temperature.

8. The control method for the modular multi-unit heat pipe cooling combined cabinet according to claim 7, characterized in that, The step of controlling the operation of the refrigeration device based on the outdoor ambient temperature includes: Based on the fact that the outdoor ambient temperature is lower than the first preset temperature, the first valve of the refrigeration device is controlled to close, and the second valve of the refrigeration device is controlled to open. Based on the outdoor ambient temperature being greater than or equal to a first preset temperature and less than a second preset temperature, the first valve of the refrigeration device is controlled to close, the second valve of the refrigeration device is controlled to open, and the cooling replenishment component of the refrigeration device is controlled to operate at a first preset frequency. Based on the outdoor ambient temperature being greater than or equal to the second preset temperature, the first valve of the refrigeration device is controlled to open, the cooling replenishment component of the refrigeration device is controlled to operate at the second preset frequency, and the second valve of the refrigeration device is controlled to close. The second preset frequency is greater than the first preset frequency.

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