A semiconductor dehumidification assembly, a semiconductor dehumidifier, and a control method thereof

Abstract

The application provides a semiconductor dehumidification assembly, a semiconductor dehumidifier and a control method thereof, wherein the semiconductor dehumidification assembly comprises a semiconductor refrigerating piece, the cold end of the semiconductor refrigerating piece is provided with a refrigerating piece, and the hot end is provided with a heat dissipating piece; the semiconductor dehumidification assembly further comprises a cooling structure, and the cooling structure is used for cooling the heat dissipating piece by using the cold energy of the condensate water generated by the refrigerating piece. According to the technical scheme of the application, the temperature of the hot end of the semiconductor refrigerating piece can be reduced by using the cold energy of the condensate water generated by the refrigerating piece to cool the heat dissipating piece, so that the temperature difference between the hot end and the cold end of the semiconductor refrigerating piece can be reduced, and the dehumidification capacity of the dehumidifier is improved.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor dehumidification technology, specifically relating to a semiconductor dehumidification component, a semiconductor dehumidifier, and its control method. Background Technology

[0002] Semiconductor dehumidifiers utilize semiconductor thermoelectric refrigeration technology, employing the Peltier effect of semiconductor materials to achieve cooling or heating. They typically consist of several pairs of p- and n-type semiconductor thermocouples connected in series, forming a semiconductor cooling element, usually in the form of a plate. When connected to a DC power supply, one end of the semiconductor cooling element will cool down; this cooled end is the cold end. Simultaneously, the temperature of the other end of the semiconductor cooling element will rise; this heated end is the hot end. The greater the temperature difference between the cold and hot ends of the semiconductor cooling element, the lower the dehumidification efficiency.

[0003] Therefore, to improve dehumidification efficiency, heat sinks with heat dissipation fins are installed at both ends of the semiconductor cooling component, and a tall fan is used to enhance heat dissipation from the heat sink, reducing the temperature of the hot end and ensuring that the temperature difference between the cold and hot ends is within a stable range. However, due to the limitation of the housing size, the fan is small and the heat sink is large, resulting in limited cooling effect of the fan on the hot end, thus limiting the dehumidification capacity. Summary of the Invention

[0004] Therefore, the present invention provides a semiconductor dehumidification component, a semiconductor dehumidifier and its control method. The main technical problem to be solved is: how to reduce the temperature difference between the hot end and the cold end of the semiconductor cooling component and increase the dehumidification capacity of the dehumidifier.

[0005] To address the aforementioned problems, the present invention provides a semiconductor dehumidification component, which includes a semiconductor cooling element, wherein the cold end of the semiconductor cooling element is provided with a cooling element and the hot end is provided with a heat dissipation element.

[0006] The semiconductor dehumidification component also includes a cooling structure, which is used to cool the heat dissipation component by utilizing the cooling capacity of the condensate generated by the dehumidification of the refrigeration component.

[0007] In some embodiments, the cooling structure includes a temperature-conducting element with a water collection tank for receiving condensate generated during dehumidification of the refrigeration unit.

[0008] The cooling structure exchanges heat with the heat dissipation component through a heat-conducting component, and uses the cooling capacity of the condensate generated by the dehumidification of the cooling component to cool the heat dissipation component.

[0009] In some embodiments, the cooling structure includes a guide pipe for guiding the condensate generated by the dehumidification of the refrigeration component to a set position; wherein the cooling structure exchanges heat with the heat dissipation component through the guide pipe to cool the heat dissipation component using the cooling capacity of the condensate generated by the dehumidification of the refrigeration component.

[0010] In some embodiments, when the cooling structure includes a temperature-conducting element and the temperature-conducting element is provided with a water collection tank, the guide pipe is connected to the water collection tank to receive the condensate generated by the dehumidification of the refrigeration element through the water collection tank.

[0011] In some embodiments, the heat sink is provided with heat dissipation fins, which are located below the tank structure of the water collection tank. The heat dissipation fins are used to support the tank structure of the water collection tank. The guide pipe contacts the heat dissipation fins to exchange heat with the heat sink through the heat dissipation fins.

[0012] In some embodiments, the semiconductor dehumidification component includes a first air inlet channel, a second air inlet channel, and an air outlet channel. The air outlet ends of both the first air inlet channel and the second air inlet channel are connected to the air outlet channel. The heat sink is located in the air outlet channel, the cooling component is located in the first air inlet channel, and the guide pipe is located in the second air inlet channel.

[0013] The semiconductor dehumidification assembly further includes a wind deflector, which is used to open or close the air inlet end of the second air inlet channel.

[0014] In some embodiments, the semiconductor dehumidification component includes an air inlet, wherein the air inlet end of the first air inlet channel and the air inlet end of the second air inlet channel correspond to different areas of the air inlet.

[0015] The wind deflector opens the air inlet end of the second air inlet channel by opening the first area of ​​the air inlet; and the wind deflector closes the air inlet end of the second air inlet channel by closing the first area of ​​the air inlet; wherein, the first area is the area on the air inlet corresponding to the air inlet end of the second air inlet channel.

[0016] In some embodiments, the air outlet end of the first air inlet channel is provided with an air guide plate, which is used to adjust the opening size of the air outlet end of the first air inlet channel.

[0017] The present invention also provides a semiconductor dehumidifier, which includes the semiconductor dehumidification component described in any one of the above-mentioned methods.

[0018] The present invention also provides a control method for a semiconductor dehumidifier, wherein the semiconductor dehumidification component of the semiconductor dehumidifier is the semiconductor dehumidification component described above, and the control method includes:

[0019] When the semiconductor dehumidifier enters the dehumidification mode, it controls the operation of the semiconductor cooling component, controls the opening of the air guide plate, and controls the opening or closing of the wind deflector.

[0020] In some embodiments, the control method further includes:

[0021] The ambient humidity T-cycle is detected. When the ambient humidity T-cycle is greater than the set value T1, the semiconductor dehumidifier is controlled to enter the dehumidification mode; otherwise, the semiconductor dehumidifier is controlled to standby.

[0022] In some embodiments, the control method further includes:

[0023] When the semiconductor dehumidifier is running in dehumidification mode, the hot end temperature Thot and cold end temperature Tcold of the semiconductor cooling element are detected. If (Thot - Tcold) < Tset, the semiconductor dehumidifier is controlled to continue running in dehumidification mode. Otherwise, the semiconductor cooling element is controlled to stop running, and the fan is controlled to continue running for a set time before stopping. The fan is used to provide the power for airflow within the semiconductor dehumidifier.

[0024] The present invention provides a semiconductor dehumidification component, a semiconductor dehumidifier, and a control method thereof, which have the following characteristics:

[0025] Beneficial effects:

[0026] 1. By utilizing the cooling capacity of the condensate generated by the dehumidification of the refrigeration components to cool the heat dissipation components, the temperature of the hot end of the semiconductor refrigeration components can be reduced. This helps to reduce the temperature difference between the hot and cold ends of the semiconductor refrigeration components and increase the dehumidification capacity of the dehumidifier.

[0027] 2. The condensate produced by the dehumidification of the refrigeration components can flow into the water collection tank. Then, the condensate in the water collection tank can exchange heat with the heat dissipation components through the heat conduction components. In this way, the cooling structure uses the cooling capacity of the condensate produced by the dehumidification of the refrigeration components to cool the heat dissipation components.

[0028] 3. The condensate produced by the dehumidification of the refrigeration components can flow into the guide pipe. Then, the condensate can exchange heat with the heat dissipation components through the guide pipe. In this way, the cooling structure uses the cooling capacity of the condensate produced by the dehumidification of the refrigeration components to cool the heat dissipation components. Attached Figure Description

[0029] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. The drawings described below are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the structure of a semiconductor dehumidification component according to the present invention;

[0031] Figure 2 yes Figure 1 Sectional view along the DD direction;

[0032] Figure 3 yes Figure 1 A sectional view along the EE direction;

[0033] Figure 4 yes Figure 1 Sectional view along the FF direction;

[0034] Figure 5 This is an exploded view of the semiconductor dehumidifier of the present invention;

[0035] Figure 6 This is a partial assembly drawing of the semiconductor dehumidifier of the present invention;

[0036] Figure 7 This is an assembly drawing of the semiconductor dehumidifier of the present invention;

[0037] Figure 8 This is a cross-sectional view of the semiconductor dehumidifier of the present invention;

[0038] Figure 9 This is another cross-sectional view of the semiconductor dehumidifier of the present invention;

[0039] Figure 10 This is another cross-sectional view of the semiconductor dehumidifier of the present invention;

[0040] Figure 11 This is a partial view of the semiconductor dehumidifier of the present invention with the air guide plate closed;

[0041] Figure 12 This is a partial view of the semiconductor dehumidifier of the present invention with the air guide plate open;

[0042] Figure 13 This is a partial view of the wind deflector of the semiconductor dehumidifier of the present invention when it is open;

[0043] Figure 14 This is a partial view from another perspective when the wind deflector of the semiconductor dehumidifier of the present invention is open;

[0044] Figure 15 This is a partial view of the semiconductor dehumidifier of the present invention when the air deflector is closed;

[0045] Figure 16 This is a partial view of the semiconductor dehumidifier of the present invention when the deflector is closed;

[0046] Figure 17This is an assembly view of the wind deflector of the semiconductor dehumidifier of the present invention;

[0047] Figure 18 This is a control logic diagram of the control method for the semiconductor dehumidifier of the present invention.

[0048] The attached figures are labeled as follows:

[0049] 1. Rear housing; 11. Air outlet; 12. Air inlet; 13. Shaft hole; 14. Air duct; 15. Mounting hole; 16. First air inlet channel; 17. Air outlet channel; 18. Second air inlet channel; 2. Controller; 3. Fan; 31. Fan air outlet; 32. Fan air inlet; 4. Air guide plate; 41. Rotating shaft; 5. Motor; 51. Motor shaft; 6. Semiconductor dehumidification component; 61. Heat sink; 62. Semiconductor cooling component; 63. Manufacturing process 64. Cooling component; 611. Water collection tank; 612. Overflow port; 613. Guide pipe; 614. Drain port; 615. Heat dissipation fins; 7. Front shell; 71. Air inlet; 72. Limiting rib; 73. Guide groove; 74. Grille; 8. Water tank; 9. Wind deflector; 91. Handle; 92. Guide rib; a. Controller cavity; b. Fan cavity; c. Dehumidification cavity; d. Water tank cavity; 711. First area; 712. Second area. Detailed Implementation

[0050] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0052] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0053] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0054] See also Figure 1-3 As shown, according to an embodiment of the present invention, a semiconductor dehumidification component 6 is provided, which includes a semiconductor cooling element 62. The semiconductor cooling element 62 can be in the form of a sheet, and is therefore sometimes referred to as a semiconductor cooling plate. The semiconductor cooling element 62 has a cold end and a hot end. When the semiconductor cooling element 62 is working, the temperature of its cold end decreases and the temperature of its hot end increases. The cold end of the semiconductor cooling element 62 is provided with a cooling element 63, and the hot end is provided with a heat dissipation element 61. Both the cooling element 63 and the heat dissipation element 61 can be in the form of a sheet. The heat dissipation element 61 can also be referred to as a heat sink. The cooling element 63 can also be referred to as a heat dissipation element or heat sink. Because the cooling element 63 is located at the cold end of the semiconductor cooling element 62, its temperature is relatively low. The cooling element 63 is used to exchange heat with the air to cool the air, achieving a cooling effect. Water vapor in the air condenses into water upon encountering the low-temperature cooling element 63, thus enabling the cooling element 63 to dehumidify the air.

[0055] The aforementioned semiconductor dehumidification component 6 also includes a cooling structure, which is used to cool the heat sink 61 by utilizing the cooling capacity of the condensate generated by the dehumidification of the cooling component 63.

[0056] In the above example, since the cooling capacity of the condensate generated by the dehumidification of the cooling component 63 is used to cool the heat sink 61, the temperature of the hot end of the semiconductor cooling component 62 can be reduced. This helps to reduce the temperature difference between the hot and cold ends of the semiconductor cooling component 62 and increase the dehumidification capacity of the dehumidifier.

[0057] It should be noted here that the aforementioned semiconductor cooling device 62 can be electrically connected to the controller 2 (e.g., via wires). Figure 5 As shown, the controller 2 controls the opening and closing of the semiconductor cooling element 62. The aforementioned heat sink 61 is a heat sink, and the cooling element 63 is a cooling element. The heat sink 61 and the cooling element 63 are respectively attached to opposite sides of the semiconductor cooling element 62. The semiconductor cooling element 62 dissipates heat into the air through the heat sink 61 and cools the surrounding air through the cooling element 63. The heat sink 61 and the cooling element 63 are spaced apart to prevent airflow from passing vertically through them. The heat sink 61, the cooling element 63, and the semiconductor cooling element 62 are connected by clips and / or screws and / or riveting.

[0058] To achieve the aforementioned cooling structure's function, the cooling structure can utilize the cooling capacity of the condensate generated by the dehumidification of the cooling component 63 to cool the heat dissipation component 61. In some embodiments, such as... Figures 1 to 3 As shown, the aforementioned cooling structure may include a temperature-conducting element 64, which is provided with a water collection tank 611 for receiving condensate generated by the dehumidification of the cooling element 63. The cooling structure exchanges heat with the heat dissipation element 61 through the temperature-conducting element 64, utilizing the cooling capacity of the condensate generated by the dehumidification of the cooling element 63 to cool the heat dissipation element 61.

[0059] In the above example, the condensate generated by the dehumidification of the cooling component 63 can flow into the water collection tank 611. Then, the condensate in the water collection tank 611 can exchange heat with the heat dissipation component 61 through the heat conduction component 64. In this way, the cooling structure uses the cooling capacity of the condensate generated by the dehumidification of the cooling component 63 to cool the heat dissipation component 61.

[0060] It should be noted that the aforementioned temperature-conducting component 64 can be integrally formed on the heat dissipation component 61. The aforementioned water collection tank 611 can be located below the cooling component 63, so that the condensate generated by the dehumidification of the cooling component 63 can drip into the water collection tank 611 under the action of gravity.

[0061] In some implementations, such as Figures 1 to 3 As shown, the aforementioned cooling structure may include a guide pipe 613, which is used to guide the condensate generated by the dehumidification of the refrigeration component 63 to a set location, such as the water tank 8 of the dehumidifier. The cooling structure exchanges heat with the heat sink 61 through the guide pipe 613, utilizing the cooling capacity of the condensate generated by the dehumidification of the refrigeration component 63 to cool the heat sink 61.

[0062] In the above example, the condensate generated by the dehumidification of the cooling component 63 can flow into the guide pipe 613. Then, the condensate can exchange heat with the heat sink 61 through the guide pipe 613. In this way, the cooling structure uses the cooling capacity of the condensate generated by the dehumidification of the cooling component 63 to cool the heat sink 61.

[0063] like Figures 1 to 3 As shown, when the cooling structure includes a temperature-conducting element 64 and a water collection tank 611 is provided on the temperature-conducting element 64, the aforementioned guide pipe 613 is connected to the water collection tank 611 so as to receive the condensate generated by the dehumidification of the cooling element 63 through the water collection tank 611. This has the purpose of conveniently receiving the condensate generated by the dehumidification of the cooling element 63 through the guide pipe 613.

[0064] Furthermore, the aforementioned temperature-conducting element 64 and the flow guide pipe 613 work together to allow the condensate generated by the dehumidification of the cooling element 63 to flow into the water collection tank 611. Within the water collection tank 611, the condensate exchanges heat with the heat sink through the temperature-conducting element 64, thus cooling the heat sink initially. Then, the condensate in the water collection tank 611 flows out through the flow guide pipe 613, where it exchanges heat with the heat sink again, further cooling the heat sink. This further reduces the temperature of the hot end of the semiconductor cooling element 62, which helps to further reduce the temperature difference between the hot and cold ends of the semiconductor cooling element 62, thereby further increasing the dehumidification capacity of the dehumidifier.

[0065] In a specific application example, such as Figures 1 to 3 As shown, the aforementioned heat sink 61 may be provided with heat dissipation fins 615, which may be integrally formed on the heat sink 61. The heat dissipation fins 615 are located below the heat conduction element 64, and the heat dissipation fins 615 can provide support for the heat conduction element 64. The flow guide tube 613 contacts the heat dissipation fins 615 to exchange heat with the heat sink 61 through the heat dissipation fins 615. Preferably, the flow guide tube 613 is integrally formed on the heat dissipation fins 615.

[0066] In the above example, the condensate in the water collection tank 611 can exchange heat with the heat dissipation fins 615 through the heat-conducting element 64, so that the heat dissipation fins 615 and the heat dissipation element 61 can exchange heat indirectly. The condensate in the aforementioned guide pipe 613 can also exchange heat indirectly with the heat dissipation element 61 through the heat dissipation fins 615.

[0067] like Figures 1 to 3As shown, the aforementioned water collection tank 611 is also equipped with an overflow port 612. The water collection tank 611 is used to collect condensate generated by the refrigerant 63. The overflow port 612 and the guide pipe 613 are located at the bottom of the water collection tank 611. The guide pipe 613 is a hollow cylinder with a diameter of φ0.3~φ5mm, and the overflow port 612 is a hollow cylinder with a diameter of φ5~φ10mm. The overflow port 612 is 1~10mm higher than the bottom of the water collection tank 611. There can be one or more guide pipes 613 and overflow ports 612. The overflow port 612 has a larger diameter and is higher than the guide pipe 613. The overflow port 612 is used to accelerate the discharge of condensate when the condensate volume is large and the water depth reaches a certain depth. The guide pipe 613 is connected to the heat dissipation fins 615. The coolness absorbed by the guide pipe 613 is transferred to the heat sink 61 through the heat dissipation fins 615 to reduce the temperature of the heat sink 61. At the same time, there is a gap between two adjacent heat dissipation fins 615. When air flows through the gap, it can absorb the coolness on the guide pipe 613 and the heat dissipation fins 615, reduce the air temperature, and use the low-temperature air to further cool the heat sink 61.

[0068] like Figure 4 As shown, the aforementioned airflow guide 613 is connected to the heat dissipation fin 615, for example, the airflow guide 613 and the heat dissipation fin 615 are integrally formed. The airflow guides 613 are arranged in an alternating pattern to increase the contact area with the flowing air, which is beneficial for convection and cooling the air.

[0069] In some implementations, such as Figures 8 to 10 As shown, the aforementioned semiconductor dehumidification assembly 6 may further include a first air inlet channel 16, a second air inlet channel 18, and an air outlet channel 17. The air outlet ends of both the first air inlet channel 16 and the second air inlet channel 18 are connected to the air outlet channel 17. The aforementioned heat sink 61 is located in the air outlet channel 17 and can exchange heat with the air in the air outlet channel 17. The cooling component 63 is located in the first air inlet channel 16 and can exchange heat with the air in the first air inlet channel 16. The guide pipe 613 is located in the second air inlet channel 18 and can exchange heat with the air in the second air inlet channel 18. The semiconductor dehumidification assembly 6 also includes a baffle 9, which is used to open or close the air inlet end of the second air inlet channel 18.

[0070] In the above example, when the wind deflector 9 closes the air inlet end of the second air inlet channel 18, only the first air inlet channel 16 receives air. At this time, the air intake volume of the semiconductor dehumidification component 6 is relatively small, and it is in the normal dehumidification mode. When the wind deflector 9 opens the air inlet end of the second air inlet channel 18, both the first air inlet channel 16 and the second air inlet channel 18 receive air simultaneously. At this time, the air intake volume of the semiconductor dehumidification component 6 is relatively large, and it is in the enhanced dehumidification mode.

[0071] By opening and closing the air inlet of the second air inlet channel 18 through the wind deflector 9, the semiconductor dehumidification component 6 can be controlled to be in either the normal dehumidification mode or the enhanced dehumidification mode, thus adapting to different user needs.

[0072] like Figures 8 to 10 As shown, the aforementioned semiconductor dehumidification component 6 also includes an air inlet 71, with the air inlet end of the first air inlet channel 16 and the air inlet end of the second air inlet channel 18 corresponding to different areas of the air inlet 71. The aforementioned baffle 9 opens the air inlet end of the second air inlet channel 18 by opening the first area 711 of the air inlet 71; and closes the air inlet end of the second air inlet channel 18 by closing the first area 711 of the air inlet 71. The first area 711 is the area on the air inlet 71 corresponding to the air inlet end of the second air inlet channel 18.

[0073] It should be noted that the first area 711 mentioned above is the air inlet 71 of the second air inlet channel 18.

[0074] In the above example, the air intake ends of the first air intake channel 16 and the second air intake channel 18 are air intake through different areas of the same air intake 71, which simplifies the structure of the air intake 71 and facilitates processing.

[0075] The aforementioned semiconductor dehumidification assembly 6 has a housing, and the aforementioned air inlet 71 is disposed on the housing. To achieve the effect of the aforementioned wind deflector 9 opening or closing the first region 711 of the air inlet 71, as... Figures 13 to 16 As shown, the aforementioned wind deflector 9 is movably mounted on the housing. The wind deflector 9 is used to open the first region 711 when moved to the first position and to close the first region 711 when moved to the second position. In a specific application example, such as... Figure 17 As shown, the housing is provided with a guide groove 73, and the wind baffle 9 is plate-shaped. The wind baffle 9 is slidably disposed in the guide groove 73 and is used to move along the guide groove 73 to the first position and the second position mentioned above. Both ends of the wind baffle 9 are provided with guide ribs 92, and there are two guide grooves 73. The wind baffle 9 is slidably disposed in the corresponding guide grooves 73 by the guide ribs 92 at both ends.

[0076] like Figure 17 As shown, the aforementioned wind deflector 9 may be equipped with a handle 91 to facilitate pushing the wind deflector 9 to the aforementioned first and second positions. Figure 16 As shown, the aforementioned housing may be provided with a limiting rib 72, which the wind deflector 9 abuts against when it moves to the aforementioned second position. The limiting rib 72 can limit the movement displacement of the wind deflector 9, so that the wind deflector 9 can move precisely to the second position of the closed first region 711.

[0077] like Figure 17As shown, the aforementioned air inlet 71 is provided with a grille 74, and a handle 91 is fitted between the grilles 74. Pushing the handle 91 allows it to slide up and down between the grilles 74. Figures 8 to 10 As shown, the limiting rib 72 divides the air inlet 71 into two areas, namely the first area 711 and the second area 712. The first area 711 is the air inlet of the second air inlet channel 18, and the second area 712 is the air inlet of the first air inlet channel 16. When the baffle plate opens the second area 712, the incoming air flows into the second air inlet channel 18 and flows through the guide pipe 613 and the heat dissipation fins 615. The incoming air exchanges heat with the guide pipe 613 and the heat dissipation fins 615 as it flows through them.

[0078] It should be noted that the aforementioned housing can be composed of a front housing 7 and a rear housing 1. The aforementioned air inlet 71 is located on the front housing 7. The aforementioned wind deflector 9 is also located on the front housing 7.

[0079] like Figures 8 to 10 As shown, the air outlet end of the aforementioned first air inlet channel 16 is provided with an air guide plate 4, which is used to adjust the opening size of the air outlet end of the first air inlet channel 16.

[0080] In the above example, the size of the opening at the air outlet of the first air inlet channel 16 is adjusted by the air guide plate 4, which can adjust the air intake volume and keep the temperature difference between the hot and cold ends within a stable range required by the technology, thereby improving the dehumidification capacity.

[0081] like Figure 11 and Figure 12 As shown, the aforementioned semiconductor dehumidification component 6 may also include a motor 5, which drives the air guide plate 4 to rotate in order to adjust the opening size of the air outlet of the first air inlet channel 16.

[0082] like Figure 11 and Figure 12 As shown, the air guide plate 4 has a rotating shaft 41, which may include two rotating shaft parts disposed at both ends of the air guide plate 4, the axes of the two rotating shaft parts being coincident. The aforementioned housing has two shaft holes 13, each corresponding to one of the two rotating shaft parts, and each rotating shaft part can be rotatably installed in the corresponding shaft hole 13. The aforementioned motor 5 has a motor shaft. The housing has mounting holes 15, and the motor 5 is connected to the mounting holes 15 by screws, thus mounting the motor 5 on the unit. The motor 5 is electrically connected to the controller 2 via wires, and the controller 2 controls its opening and closing. The motor shaft is connected to the air guide plate 4, and the axis of the motor shaft coincides with the axis of the rotating shaft 41. In this design, the motor shaft and the air guide plate 4 use a flat shaft that engages with the shaft hole 13, and the function of the motor 5 is to drive the opening and closing of the air guide plate 4.

[0083] It should be noted that the aforementioned first air inlet channel 16 may have two air outlets, and both air outlets are provided with the aforementioned air guide plate 4. The number of the aforementioned motors 5 is equal to the number of air guide plates 4 and they correspond one-to-one.

[0084] It should be noted that the aforementioned cooling component 63 faces the air inlet 71, and the air guide plate 4 and motor 5 are located on the left and right sides of the cooling component 63 and are installed on the rear shell 1.

[0085] The present invention also provides a semiconductor dehumidifier, which may include the semiconductor dehumidification component 6 of any of the above-mentioned methods. Because the semiconductor dehumidifier uses the aforementioned semiconductor dehumidification component 6, the cooling capacity of the condensate generated by the cooling element 63 is used to cool the heat sink 61, thereby reducing the temperature of the hot end of the semiconductor cooling element 62. This helps to reduce the temperature difference between the hot and cold ends of the semiconductor cooling element 62 and improves the dehumidification capacity of the dehumidifier.

[0086] like Figure 5 and Figure 6 As shown, the aforementioned semiconductor dehumidifier may further include a controller 2, a fan 3, and a water tank 8. The aforementioned casing is divided into four chambers from top to bottom: a controller chamber a, a fan chamber b, a dehumidification chamber c, and a water tank chamber d. The fan chamber b is located at the top of the casing, and the controller chamber a is located at the upper left corner of the fan chamber b. The purpose of placing the controller chamber a in this position is to prevent condensate from entering and to dissipate heat from the controller 2 using the airflow from the fan 3. Below the fan chamber b is the dehumidification chamber c, where the aforementioned semiconductor dehumidification component 6 is placed. Below the dehumidification chamber c is the water tank chamber d, used to collect condensate.

[0087] like Figures 5 to 10 As shown, the aforementioned housing consists of a front housing 7 and a rear housing 1. The rear housing 1 is connected to the front housing 7 by means of snap-fit, screws, or ultrasonic welding. The rear housing 1 is provided with an air outlet 11 and an air intake 12. The front housing 7 is provided with the aforementioned air inlet 71. The air outlet 11 is connected to the fan chamber b, and its function is to discharge the dried air inside the unit outside the unit. The air inlet 71 is connected to the dehumidification chamber c, and its function is to draw air into the unit and into the dehumidification chamber c.

[0088] The aforementioned fan 3 is equipped with a fan outlet 31 and a fan inlet 32. The fan 3 is electrically connected to the controller 2, which can control the start and stop of the fan 3. The fan outlet 31 is connected to the aforementioned outlet 11, and the fan inlet 32 ​​is located inside the fan cavity b. When the fan 3 starts, air is discharged from the fan outlet 31, creating a negative pressure inside the fan 3, which is then drawn in from the fan cavity b through the fan inlet 32 ​​to replenish the pressure.

[0089] Because the aforementioned fan 3 serves as the power source for air circulation, the fan chamber b will generate negative pressure, which will draw air from the dehumidification chamber c through the air intake 12. The dehumidification chamber c will also generate negative pressure, prompting the unit to draw in air from outside the unit through the air inlet 71 to replenish it.

[0090] The aforementioned first air inlet channel 16 and air outlet channel 17 are connected to form the first wind field channel. Figure 8 and Figure 9 The diagram shows the airflow within the first airflow channel. Air enters the dehumidifier chamber from the second area 712 of the air inlet 71, comes into contact with the cooling component 63, enters the downward air duct 14 through the left and right air guide plates 4, then enters from the bottom of the heat sink 61, and finally enters the fan air intake 32 through the heat sink 61.

[0091] When the semiconductor cooling device 62 is turned on, the cooling device 63 cools, and the heat sink 61 dissipates heat. Air flowing through the cooling device 63 condenses into water, which flows into the water collection tank 611. Finally, the condensate flows from the guide pipe 613 through the drain port 614 to the water tank 8. The guide pipe 613 is connected to the heat sink fins 615. As the condensate passes through the guide pipe 613, some of the cooling energy is transferred to the heat sink fins 615 for heat dissipation by the heat sink 61. Another portion of the cooling energy is carried away by the air between the guide pipe 613 and the heat sink fins 615. The cooled air then flows through the heat sink 61 for further heat dissipation.

[0092] The aforementioned second air inlet channel 18 and air outlet channel 17 are connected to form a second wind field channel. Figure 10 The airflow diagram for the second wind field channel shows that air enters the dehumidifier chamber from the first area 711 of the air inlet 71, comes into contact with the guide pipe 613 and the heat dissipation fins 615, and then enters from the bottom of the heat dissipation component 61, and finally enters the fan air intake 32 through the heat dissipation component 61.

[0093] like Figure 18 As shown, the present invention also provides a control method for a semiconductor dehumidifier, wherein the semiconductor dehumidification component 6 of the semiconductor dehumidifier has the aforementioned air guide plate 4 and wind deflector 9. The control method includes: when the semiconductor dehumidifier enters dehumidification mode, controlling the semiconductor cooling component 62 to operate, controlling the air guide plate 4 to open, and controlling the wind deflector 9 to open or close.

[0094] It should be noted that the above dehumidification modes include a regular dehumidification mode and an enhanced dehumidification mode. In the regular dehumidification mode, the semiconductor cooling element 62 is controlled to operate, the air guide plate 4 is controlled to open, and the air deflector 9 is controlled to close. In the enhanced dehumidification mode, the semiconductor cooling element 62 is controlled to operate, the air guide plate 4 is controlled to open, and the air deflector 9 is controlled to open.

[0095] In the above example, by controlling the opening or closing of the wind deflector 9, the semiconductor dehumidification component 6 can be controlled to be in a normal dehumidification mode or an enhanced dehumidification mode, thus adapting to different user needs.

[0096] The aforementioned control method also includes: detecting the ambient humidity T-ring; when the ambient humidity T-ring is greater than the set value T1, controlling the semiconductor dehumidifier to enter the dehumidification mode; otherwise, controlling the semiconductor dehumidifier to standby mode.

[0097] In the example above, the decision to activate the dehumidification mode is based on the ambient humidity. The dehumidification mode is only activated when the ambient humidity T_ring is lower than expected.

[0098] The aforementioned control method further includes: when the semiconductor dehumidifier is running in dehumidification mode, detecting the hot end temperature Thot and cold end temperature Tcold of the semiconductor cooling element 62; if (Thot - Tcold) < Tset, then controlling the semiconductor dehumidifier to continue running in dehumidification mode; otherwise, controlling the semiconductor cooling element 62 to stop running, and controlling the fan 3 to continue running for a set time before stopping. The fan 3 is used to provide the power for airflow within the semiconductor dehumidifier.

[0099] In the example above, because semiconductor dehumidifiers have the characteristic that the greater the temperature difference between the cold and hot ends, the dehumidification efficiency is lower. When the temperature difference between the cold and hot ends is not within the set range, the operation of the semiconductor cooling component 62 can be stopped to enhance the heat dissipation of the fan 3, preventing the heat sink from overheating and damaging the unit. Conversely, it can continue to operate to ensure that the temperature difference between the cold and hot ends is within a stable range required by the technology, thereby increasing the dehumidification capacity.

[0100] It should be noted that the semiconductor dehumidifier also has an air supply mode. In this air supply mode, the fan 3 is controlled to run, and the semiconductor cooling component 62 is controlled to stop running.

[0101] The technical solution of this invention addresses the bottleneck of poor dehumidification performance in existing semiconductor dehumidifiers. By incorporating a water collection tank 611 and a guide pipe 613 on the heat sink 61 (e.g., a heat sink), when the semiconductor cooling element 62 (e.g., a semiconductor cooling chip) is operating, condensate generated at its cold end first flows into the water collection tank 611. The water collection tank 611 then introduces the cooling energy of the condensate into the heat sink 61, performing the first step of cooling. Simultaneously, in conjunction with the design of the water collection tank 611, the condensate is guided into the guide pipe 613, which is connected to the heat dissipation fins 615 on the heat sink 61. This further utilizes the cooling energy of the condensate to pre-cool the air passing through the heat sink 61. Finally, the condensate flows through the entire heat sink 61, performing the second step of cooling, thereby improving the dehumidifier's dehumidification capacity. In terms of control logic, by varying the opening of the air duct 14 based on different ambient humidity levels and user needs, the semiconductor dehumidifier of this invention offers a conventional dehumidification mode, an accelerated dehumidification mode, and an air supply mode.

[0102] It will be readily understood by those skilled in the art that, without conflict, the advantageous technical features of the above-mentioned methods can be freely combined and superimposed.

[0103] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention. The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the protection scope of the present invention.

Claims

1. A semiconductor dehumidification component (6), characterized in that: The device includes a semiconductor cooling element (62), which has a cooling element (63) at its cold end and a heat dissipation element (61) at its hot end; the semiconductor dehumidification assembly (6) also includes a cooling structure, which is used to cool the heat dissipation element (61) by utilizing the cooling capacity of the condensate generated by the dehumidification of the cooling element (63); the cooling structure includes a temperature-conducting element (64), which has a water collection tank (611) for receiving the condensate generated by the dehumidification of the cooling element (63); the cooling structure exchanges heat with the heat dissipation element (61) through the temperature-conducting element (64) to cool the heat dissipation element (61) by utilizing the cooling capacity of the condensate generated by the dehumidification of the cooling element (63); The heat sink (61) and the cooling component (63) are separated to prevent airflow from passing vertically through the heat sink (61) and the cooling component (63).

2. The semiconductor dehumidification component (6) according to claim 1, characterized in that: The cooling structure includes a guide pipe (613), which is used to guide the condensate generated by the dehumidification of the refrigeration component (63) to a set position; wherein, the cooling structure exchanges heat with the heat sink (61) through the guide pipe (613) to cool the heat sink (61) by utilizing the cooling capacity of the condensate generated by the dehumidification of the refrigeration component (63).

3. The semiconductor dehumidification component (6) according to claim 2, characterized in that: When the cooling structure includes a temperature-conducting element (64) and the temperature-conducting element (64) is provided with a water collection tank (611), the guide pipe (613) is connected to the water collection tank (611) so as to receive the condensate generated by the dehumidification of the refrigeration element (63) through the water collection tank (611).

4. The semiconductor dehumidification component (6) according to claim 2, characterized in that: The heat sink (61) is provided with heat sink fins (615), and the guide pipe (613) contacts the heat sink fins (615) to exchange heat with the heat sink (61) through the heat sink fins (615).

5. The semiconductor dehumidification component (6) according to claim 2, characterized in that: The semiconductor dehumidification component (6) includes a first air inlet channel (16), a second air inlet channel (18), and an air outlet channel (17). The air outlet ends of both the first air inlet channel (16) and the second air inlet channel (18) are connected to the air outlet channel (17). The heat sink (61) is located in the air outlet channel (17), the cooling component (63) is located in the first air inlet channel (16), and the guide pipe (613) is located in the second air inlet channel (18). The semiconductor dehumidification component (6) further includes a wind deflector (9), which is used to open or close the air inlet end of the second air inlet channel (18).

6. The semiconductor dehumidification component (6) according to claim 5, characterized in that: The semiconductor dehumidification component (6) includes an air inlet (71), and the air inlet end of the first air inlet channel (16) and the air inlet end of the second air inlet channel (18) correspond to different areas of the air inlet (71). The wind deflector (9) opens the air inlet end of the second air inlet channel (18) by opening the first area (711) of the air inlet; and the wind deflector (9) closes the air inlet end of the second air inlet channel (18) by closing the first area (711) of the air inlet; wherein, the first area (711) is the area on the air inlet (71) corresponding to the air inlet end of the second air inlet channel (18).

7. The semiconductor dehumidification assembly (6) according to claim 5 or 6, characterized in that: The first air inlet channel (16) has an air guide plate (4) at its air outlet end, which is used to adjust the opening size of the air outlet end of the first air inlet channel (16).

8. A semiconductor dehumidifier, characterized in that: Includes the semiconductor dehumidification component (6) according to any one of claims 1-7.

9. A control method for a semiconductor dehumidifier, wherein the semiconductor dehumidification component (6) of the semiconductor dehumidifier is the semiconductor dehumidification component of claim 7, characterized in that: The control method includes: When the semiconductor dehumidifier enters the dehumidification mode, it controls the operation of the semiconductor cooling component (62), controls the opening of the air guide plate (4), and controls the opening or closing of the wind deflector (9).

10. The control method for a semiconductor dehumidifier according to claim 9, characterized in that: The control method further includes: The ambient humidity T-cycle is detected. When the ambient humidity T-cycle is greater than the set value T1, the semiconductor dehumidifier is controlled to enter the dehumidification mode; otherwise, the semiconductor dehumidifier is controlled to standby.

11. The control method for a semiconductor dehumidifier according to claim 9 or 10, characterized in that: The control method further includes: When the semiconductor dehumidifier is running in dehumidification mode, the hot end temperature Thot and cold end temperature Tcold of the semiconductor cooling element (62) are detected. If (Thot - Tcold) < Tset, the semiconductor dehumidifier is controlled to continue running in dehumidification mode. Otherwise, the semiconductor cooling element (62) is controlled to stop running, and the fan (3) is controlled to continue running for a set time before stopping. The fan (3) is used to provide the power for airflow within the semiconductor dehumidifier.

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