Wafer inspection apparatus and method

Abstract

This invention provides a wafer inspection apparatus and method, including an inspection platform with inspection components mounted on top, and a wafer-carrying transport device. The transport device includes a first transport hand, which includes a first rotating joint and a first bearing end mounted at the end of the first rotating joint, fixing the wafer from the middle position via the first bearing end. It also includes a second transport hand, which includes a second rotating joint and a second bearing end mounted at the end of the second rotating joint, fixing the wafer from the edge position via the second bearing end. This invention enables relay inspection of wafers at the same location, improving inspection efficiency and making wafer inspection more complete and accurate.

Description

Technical Field

[0001] This invention relates to the field of wafer inspection technology, and more particularly to a wafer inspection apparatus and inspection method. Background Technology

[0002] Integrated circuits are typically designed and etched on the crystal facet (top surface) of a wafer. These circuit elements include transistors, resistors, capacitors, etc. The cut facet (bottom surface) of the wafer usually does not contain circuit elements; it is mainly obtained through a dicing process and is used to package and protect circuit elements.

[0003] After etching, the wafer surface needs to be inspected. Typically, both sides and edges of the wafer need to be inspected for damage. This is usually achieved through image comparison inspection, where the wafer is transported by a robotic arm to an image inspection device for image scanning inspection.

[0004] Because the bottom of the wafer is in contact with the handling arm, some areas on the bottom of the wafer cannot be detected, resulting in missing wafer bottom detection data. In order to improve the detection accuracy, it is necessary to control the wafer to flip or move it to a different detection device for re-detection. It is also necessary to control the robotic arm to move the wafer on different horizontal planes, which limits the wafer detection efficiency. Summary of the Invention

[0005] To address the aforementioned problems, this invention provides a wafer inspection device and method. This invention enables relay inspection of wafers at the same location, improving inspection efficiency and making wafer inspection more complete and accurate.

[0006] To solve the above problems, the technical solution adopted by the present invention is as follows:

[0007] A wafer inspection apparatus includes an inspection platform with an inspection component mounted on top of the inspection platform, and a wafer transport device. The transport device includes a first transport hand, which includes a first rotating joint and a first bearing end mounted at the end of the first rotating joint, and the wafer is fixed from the middle position through the first bearing end. The apparatus also includes a second transport hand, which includes a second rotating joint and a second bearing end mounted at the end of the second rotating joint, and the wafer is fixed from the edge position through the second bearing end. The second bearing end is hollow, and a staggered opening is provided on the outer side of the second bearing end for the first bearing end to pass through.

[0008] Preferably, the first transporter further includes a first support base, the surface of which is equipped with a first rotating element for controlling the rotation of the first rotating joint and a first lifting element for controlling the lifting of the first rotating joint.

[0009] Preferably, the second transporter further includes a second support base, the surface of which is equipped with a second rotating element for controlling the rotation of the second rotating joint and a second lifting element for controlling the lifting of the second rotating joint.

[0010] Preferably, the second bearing end has an arc-shaped guide chamber inside, an arc-shaped guide base is provided inside the guide chamber, a second negative pressure plate is fixedly connected to the surface of the guide base, a plurality of guide wheels are arranged circumferentially on the inner side of the guide base, a drive gear is provided on the outer side of the guide base, and an arc-shaped drive tooth plate is fixed on the outer wall of the guide base.

[0011] Preferably, the second negative pressure plate has a second negative pressure hole on its surface, the outer wall of the guide base is fixedly connected to a first negative pressure nozzle that communicates with the second negative pressure hole, the guide cavity is provided with a second negative pressure nozzle corresponding to the first negative pressure nozzle, the second negative pressure nozzle is connected to a negative pressure device through a conveying pipe, the second negative pressure nozzle is electrically retractable, and the first negative pressure nozzle is provided with a one-way valve.

[0012] Preferably, the second negative pressure hole is also connected to a pressure relief nozzle, and the first bearing end surface is also fixed with a pressure relief control component. After the pressure relief control component is positioned relative to the pressure relief nozzle, it controls the pressure relief nozzle to conduct.

[0013] Preferably, the pressure relief nozzle is installed on the inner wall of the second bearing end, and a control valve is installed inside the pressure relief nozzle. During the process of the first bearing end passing through the interior of the second bearing end, the pressure relief control component controls the pressure relief nozzle to open after the position of the pressure relief nozzle is relative to the first bearing end.

[0014] Preferably, the first bearing end includes a bearing plate, a positioning disk is rotatably disposed on the surface of the bearing plate, a first negative pressure hole is fixed on the surface of the positioning disk, and the pressure relief control component is fixed to the outer wall of the bearing plate.

[0015] Preferably, the detection assembly includes a vertically arranged first detection unit for detecting the wafer surface from above, and a horizontally retractable second detection unit for detecting the wafer surface from below.

[0016] A wafer inspection method includes the following steps: S1, transporting the wafer to the inspection components using a second transporter, and performing continuous inspection of the top and bottom middle positions of the wafer at a first height position; S2, controlling the first transporter to move to the bottom position of the wafer, and controlling the first bearing end of the first transporter to move from bottom to top, and completing the gripping of the wafer from the bottom middle position, and performing continuous inspection of the top and bottom edge positions of the wafer at a second height position.

[0017] The beneficial effects of this invention are as follows:

[0018] By using a combination of a second and a first transporter to carry the wafer, the wafer's two sides can be inspected from different heights, improving the accuracy of wafer surface inspection. Simultaneously, the combination of the second and first transporters allows them to adhere to different positions on the wafer's bottom, enabling inspection of the wafer's bottom from the same location, thus improving the inspection efficiency of the inspection component. Furthermore, while the first transporter is taking over from the second transporter for wafer inspection, the second transporter can move on to the next wafer, fully utilizing the idle window and further improving overall inspection efficiency. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0020] Figure 2 For the present invention Figure 1 A schematic diagram of the main structure.

[0021] Figure 3 For the present invention Figure 1 A top-view structural diagram.

[0022] Figure 4 This is a three-dimensional structural diagram of the first handling arm of the present invention.

[0023] Figure 5 For the present invention Figure 4 A top-view structural diagram.

[0024] Figure 6 This is a three-dimensional structural diagram of the second handling arm of the present invention.

[0025] Figure 7 For the present invention Figure 6 A top-view structural diagram.

[0026] Figure 8 For the present invention Figure 6 A schematic diagram of the main structure.

[0027] Figure 9 This is a schematic diagram of the internal structure of the second bearing end of the present invention.

[0028] In the diagram: 100, Detection platform; 200, Material box; 300, First transporter; 310, First support base; 320, First rotating element; 330, First lifting element; 340, First rotating joint; 350, First support end; 351, Support plate; 352, Positioning plate; 353, First negative pressure hole; 354, Pressure relief control assembly; 400, Second transporter; 410, Second support base; 420, Second rotating element; 430, Second lifting element; 440, Second rotating joint; 450, Second support end; 451, Guide chamber; 452, Second negative pressure plate; 453, Drive gear; 454, Guide base; 4541, Drive gear plate; 455, Guide wheel; 456, Conveying pipe; 500, Wafer; 600, Detection assembly; 610, First detection unit; 620, Second detection unit. Detailed Implementation

[0029] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0030] See attached document Figure 1 - Appendix Figure 9 A wafer inspection apparatus includes an inspection platform 100, an inspection component 600 mounted on the inspection platform 100, and a transport device for carrying a wafer 500. The transport device can transport the wafer 500 to the inspection component 600 to complete continuous inspection of the wafer surface. The inspection component 600 includes a vertically arranged first inspection unit 610 that inspects the surface of the wafer 500 from above, and a horizontally extendable second inspection unit 620 that inspects the surface of the wafer 500 from below. During the inspection process, the wafer 500 can be rotated. The first inspection unit 610 and the second inspection unit 620 continuously inspect the surface of the wafer 500 in their respective inspection areas to determine whether there are defects on the surface of the wafer 500. The first inspection unit 610 and the second inspection unit 620 can be selected from existing image inspection elements.

[0031] The transport device supports the wafer 500 from the bottom, keeping it horizontal. This increases the carrying area, reduces local pressure, and prevents damage to the wafer 500 during inspection and transport. However, because the bottom of the wafer 500 is in contact with the transport device, some areas on the bottom cannot be inspected, resulting in missing inspection data. To improve inspection accuracy, it is necessary to control the wafer 500 to flip or move it to a different inspection device for re-inspection. This requires controlling a robotic arm to move the wafer 500 on different horizontal planes, which limits the inspection efficiency of the wafer 500.

[0032] To address the aforementioned issues, the transport device includes a first transporter 300, which comprises a first rotating joint 340 and a first bearing end 350 mounted at the end of the first rotating joint 340, securing the wafer 500 from the center via the first bearing end 350. It also includes a second transporter 400, which comprises a second rotating joint 440 and a second bearing end 450 mounted at the end of the second rotating joint 440, securing the wafer 500 from the edge via the second bearing end 450. The second bearing end 450 is hollow, and its outer side has a staggered opening for the passage of the first bearing end 350. After the first bearing end 350 and the second bearing end 450 are positioned relative to each other, the first bearing end 350 can move upwards, passing through the hollow portion of the second bearing end 450 to complete the relay bearing of the wafer 500. Simultaneously, the staggered opening allows the first rotating joint 340 to pass through, ensuring smooth alternating movement between the two.

[0033] During the inspection process, the first transporter 300 and the second transporter 400 support different positions on the bottom of the wafer 500, preventing the constant area on the bottom of the wafer 500 from being undetectable. Specifically, the second transporter 400 transports the wafer 500 between the inspection components 600, achieving continuous inspection of the top and middle positions of the bottom of the wafer 500 at a first height position. The first transporter 300 is controlled to move to the bottom position of the wafer 500, and its first supporting end 350 is controlled to move from bottom to top, gripping the wafer 500 from the middle position on the bottom, achieving continuous inspection of the top and bottom edge positions of the wafer 500 at a second height position. The above placement, with the wafer 500 moved horizontally, allows the first transporter 300 to lift and carry the wafer 500 for relay testing, eliminating the need to control the wafer 500 to flip or move to the next testing device, thus improving testing efficiency. Simultaneously, the first transporter 300 and the second transporter 400 carry different areas, enabling the complete acquisition of image data of the bottom of the wafer 500 during a single testing process, improving the completeness of wafer 500 testing. In particular, by controlling the top surface of the wafer 500 at different heights, the first testing unit 610 can perform two tests on the upper surface of the wafer 500 at different angles, improving the accuracy of the upper surface testing and further ensuring the accuracy of the testing results.

[0034] Please refer to the appendix for details. Figure 4 Appendix Figure 5Specifically, the first transporter 300 also includes a first support base 310. The surface of the first support base 310 is equipped with a first rotating element 320 for controlling the rotation of the first rotating joint 340 and a first lifting element 330 for controlling the lifting of the first rotating joint 340. The first rotating element 320 can control the rotation of the first rotating joint 340, thereby driving the first support end 350 to different horizontal positions. The first lifting element 330 can control the first support end 350 to different vertical positions. The combination of the first rotating element 320 and the first lifting element 330 can drive the first support end 350 to complete the loading and unloading of the wafer 500.

[0035] Please refer to the appendix for details. Figure 6 - Appendix Figure 8 Specifically, the second transporter 400 also includes a second support base 410. The surface of the second support base 410 is equipped with a second rotating element 420 for controlling the rotation of the second rotating joint 440, and a second lifting element 430 for controlling the lifting of the second rotating joint 440. The second rotating element 420 can control the second support end 450 to be in different horizontal positions, and the second lifting element 430 can control the second support end 450 to be in different vertical positions. The combination of the second rotating element 420 and the second lifting element 430 can drive the second support end 450 to complete the loading and unloading of the wafer 500. The second transporter 400 and the first transporter 300 cooperate with each other during the inspection process to complete the relay bearing and inspection, thereby improving the overall inspection efficiency.

[0036] Please refer to the appendix for details. Figure 9 Furthermore, an arc-shaped guide chamber 451 is formed inside the second bearing end 450. An arc-shaped guide base 454 is set inside the guide chamber 451. A second negative pressure plate 452 is fixedly connected to the surface of the guide base 454. Several guide wheels 455 are arranged circumferentially on the inner side of the guide base 454. A drive gear 453 is arranged on the outer side of the guide base 454. An arc-shaped drive tooth plate 4541 is fixed on the outer wall of the guide base 454. The drive gear 453 is controlled to rotate by an electronic control device. During the rotation, the drive gear 453 can mesh with the drive tooth plate 4541 on the outer wall of the guide base 454, thereby controlling the guide base 454 to rotate in the guide chamber 451 in an directional manner, so as to realize continuous detection during the rotation of the top wafer 500.

[0037] A second negative pressure hole is formed on the surface of the second negative pressure plate 452. The wafer 500 can be placed on the surface of the second negative pressure hole to achieve negative pressure gripping. A first negative pressure nozzle communicating with the second negative pressure hole is fixedly connected to the outer wall of the guide base 454. A second negative pressure nozzle corresponding to the first negative pressure nozzle is set in the guide chamber 451. The second negative pressure nozzle is connected to a negative pressure device through the delivery pipe 456. The second negative pressure nozzle is electrically retractable. A one-way valve is set in the first negative pressure nozzle. When the wafer 500 is located on the surface of the second bearing end 450, the second negative pressure nozzle is controlled to extend and seal into the first negative pressure nozzle, and the negative pressure device is activated. At this time, by drawing a vacuum between the wafer 500 and the second negative pressure hole, the second bearing end 450 can stably adsorb the wafer 500. At the same time, during the rotation of the guide base 454, the first negative pressure nozzle and the second negative pressure nozzle are controlled to separate. Under the action of the one-way valve, the sealing of the overall structure is ensured, the negative pressure state during the rotation process is ensured, and the adsorption is stable.

[0038] The second negative pressure hole is also connected to a pressure relief nozzle, and a pressure relief control component 354 is fixed on the surface of the first bearing end 350. After the pressure relief control component 354 is positioned relative to the pressure relief nozzle, it controls the pressure relief nozzle to conduct, so as to realize the automatic release of the second negative pressure hole from the adsorption of the chip 500, so that the chip 500 can be smoothly carried between the second bearing end 450 and the first bearing end 350.

[0039] Specifically, the pressure relief nozzle is installed on the inner wall of the second bearing end 450. A control valve is installed inside the pressure relief nozzle. During the process of the first bearing end 350 passing through the interior of the second bearing end 450, the pressure relief control component 354 controls the pressure relief nozzle to be open after the position of the pressure relief nozzle is relative to the pressure relief nozzle. During the process of the first bearing end 350 moving from bottom to top through the second bearing end 450, the pressure relief control component 354 can open the control valve to make the pressure relief nozzle open to the outside. At this time, the negative pressure adsorption effect of the second negative pressure hole on the wafer 500 disappears, and the first bearing end 350 completes the relay bearing of the wafer 500. The control valve can be selected as a touch valve, and the pressure relief control component 354 is selected as a touch block protruding outward. During the movement, the touch valve is squeezed to control it to be in the open state.

[0040] It should also be noted that the control valve here has a built-in elastic reset component. When the first bearing end 350 passes through the second bearing end 450, squeezing the control valve can put the pressure relief nozzle in a venting state, realizing automatic venting of the second negative pressure hole. No instrument operation is required, the jerking is low, the relay bearing chip 500 is smooth, and the efficiency is improved.

[0041] Please refer to the appendix for details. Figure 5Specifically, the first bearing end 350 includes a bearing plate 351, a positioning disk 352 is rotatably disposed on the surface of the bearing plate 351, a first negative pressure hole 353 is fixed on the surface of the positioning disk 352, a pressure relief control component 354 is fixed to the outer wall of the bearing plate 351, the positioning disk 352 is electrically rotatable, and adsorbs the middle position of the bottom of the wafer 500 through the first negative pressure hole 353 to fix the wafer 500 and drive the wafer 500 to rotate stably to complete the detection.

[0042] Using the above-described apparatus, a wafer inspection method includes the following steps:

[0043] S1. The second transporter 400 transports the wafer 500 to the detection assembly 600, and performs continuous detection on the top of the wafer 500 and the middle position of the bottom of the wafer 500 at the first height position; the wafer 500 completes the detection during continuous rotation, the first detection unit 610 completes the detection on the top of the wafer 500, and the second detection unit 620 completes the detection on the middle position of the bottom of the wafer 500.

[0044] S2. Control the first transporter 300 to move to the bottom position of the wafer 500, and control the first bearing end 350 of the first transporter 300 to move from bottom to top, and complete the gripping of the wafer 500 from the middle position of the bottom. At the second height position, continuous detection is realized on the top and bottom edge positions of the wafer 500. Similarly, the wafer 500 is continuously detected during rotation at the second position. The first detection unit 610 can detect the top of the wafer 500 at different angles, which improves the detection accuracy. The second detection unit 620 can detect the bottom edge position of the wafer 500 to complete the detection of the bottom of the wafer 500, which improves the detection accuracy and efficiency.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer inspection apparatus, comprising an inspection platform (100), an inspection component (600) mounted on the inspection platform (100), and a transport device for carrying wafers (500), characterized in that: The transport device includes a first transporter (300), which includes a first rotating joint (340) and a first bearing end (350) installed at the end of the first rotating joint (340), and the wafer (500) is fixed from the middle position through the first bearing end (350); It also includes a second transporter (400), which includes a second rotating joint (440) and a second bearing end (450) installed at the end of the second rotating joint (440). The wafer (500) is fixed from the edge position through the second bearing end (450). The second bearing end (450) is hollow and has a misaligned opening on the outside of the second bearing end (450) for the first bearing end (350) to pass through. The second bearing end (450) has an arc-shaped guide chamber (451) inside. An arc-shaped guide base (454) is provided inside the guide chamber (451). A second negative pressure plate (452) is fixedly connected to the surface of the guide base (454). Several guide wheels (455) are arranged circumferentially on the inner side of the guide base (454). A drive gear (453) is arranged on the outer side of the guide base (454). An arc-shaped drive tooth plate (4541) is fixed on the outer wall of the guide base (454). The second negative pressure plate (452) has a second negative pressure hole on its surface. The outer wall of the guide base (454) is fixedly connected to a first negative pressure nozzle that communicates with the second negative pressure hole. The guide chamber (451) is provided with a second negative pressure nozzle corresponding to the first negative pressure nozzle. The second negative pressure nozzle is connected to a negative pressure device through a conveying pipe (456). The second negative pressure nozzle is electrically retractable. The first negative pressure nozzle is provided with a one-way valve. The second negative pressure hole is also connected to a pressure relief nozzle, and a pressure relief control component (354) is fixed on the surface of the first bearing end (350). The pressure relief control component (354) controls the pressure relief nozzle to conduct after the pressure relief nozzle is positioned relative to the pressure relief nozzle.

2. A wafer inspection apparatus as claimed in claim 1, wherein The first transporter (300) also includes a first support base (310), on the surface of which a first rotating element (320) for controlling the rotation of the first rotating joint (340) and a first lifting element (330) for controlling the lifting of the first rotating joint (340) are mounted.

3. The wafer inspection device according to claim 1, characterized in that, The second transporter (400) also includes a second support base (410), on the surface of which a second rotating element (420) for controlling the rotation of the second rotating joint (440) and a second lifting element (430) for controlling the lifting of the second rotating joint (440) are mounted.

4. The wafer inspection apparatus of claim 1, wherein The pressure relief nozzle is installed on the inner wall of the second bearing end (450). A control valve is installed inside the pressure relief nozzle. During the process of the first bearing end (350) passing through the inside of the second bearing end (450), the pressure relief control component (354) controls the pressure relief nozzle to open after the position is relative to the pressure relief nozzle.

5. The wafer inspection apparatus of claim 1, wherein The first bearing end (350) includes a bearing plate (351), a positioning disk (352) is rotatably disposed on the surface of the bearing plate (351), a first negative pressure hole (353) is fixed on the surface of the positioning disk (352), and the pressure relief control component (354) is fixed to the outer wall of the bearing plate (351).

6. The wafer inspection apparatus of claim 1, wherein The detection component (600) includes a vertically arranged first detection unit (610) for detecting the surface of the wafer (500) from above, and a horizontally retractable second detection unit (620) for detecting the surface of the wafer (500) from below.

7. A wafer inspection method characterized by, Using the wafer inspection apparatus according to claim 6 includes the following steps: S1. The wafer (500) is transported between the first detection unit (610) and the second detection unit (620) of the detection assembly (600) by the second transporter (400), and continuous detection of the top of the wafer (500) and the middle position of the bottom of the wafer (500) is realized at the first height position; S2. Control the first transporter (300) to move to the bottom position of the wafer (500), control the first bearing end (350) of the first transporter (300) to move from bottom to top, complete the gripping of the wafer (500) from the middle position of the bottom, and realize continuous detection of the top and bottom edge positions of the wafer (500) at the second height position.

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