Hot air reflow oven for smoothly conveying PCB board

Abstract

The application discloses a hot air reflow oven for stably conveying PCB boards and relates to the field of PCB processing. The hot air reflow oven comprises a reflow oven body, a controller, an upper cover and a conveying mechanism. The controller is arranged on the front side of the reflow oven body. The upper cover is arranged above the reflow oven body. The conveying mechanism is arranged below the upper cover. The conveying mechanism is used for conveying the PCB boards into the reflow oven body for reflow soldering. The conveying mechanism comprises a first conveying mechanism, a second conveying mechanism, a third conveying mechanism and a fourth conveying mechanism. The hot air reflow oven is used for separately controlling the moving speeds of the PCB boards in different areas in the reflow oven body through four groups of independent conveying mechanisms. The first conveying mechanism and the second conveying mechanism are arranged in a staggered mode. The PCB boards can fall from the first conveying mechanism to the second conveying mechanism to adjust the speed, thereby adapting to different processing requirements.

Description

A hot air reflow oven for smooth PCB board transport Technical Field

[0001] This invention relates to the field of PCB board processing technology, specifically to a hot air reflow oven for stable PCB board conveying. Background Technology

[0002] When PCB boards are processed, electrical components on the board need to be fixed to the board by soldering. When soldering components on the PCB board, the components can be glued and placed in the designated position first, and then the PCB board is sent into the hot air reflow oven. Hot air is used to heat the solder to meet the soldering requirements, which can realize the automatic soldering of components.

[0003] Application No. CN201820123938.6, disclosed on September 25, 2018, describes a hot air reflow oven. The upper furnace chamber is constructed with inner and outer liner structures, creating high and low pressure to allow air circulation between them. Part of the exhaust gas is discharged outside the furnace through a recirculation vent in the inner liner and enters a filtration device. The filtration device separates waste that affects product quality, then returns the gas to the furnace for reuse, achieving waste gas treatment and environmentally friendly operation. Simultaneously, the filtered gas returns to the furnace at a relatively high temperature for reuse, effectively saving energy, reducing heat loss, and minimizing heating costs. Application No. CN201921875218.6, disclosed on May 26, 2020, describes an energy-saving reflow oven for SMT (Surface Mount Technology). The sidewalls of the cover have grooves, which can reduce the rate of heat loss inside the cover, thereby reducing the entry of hot air. At the same time, the waste heat in the heat return pipe can further enhance the heat insulation performance of the grooves, further reducing the heat loss inside the cover. The heat return plate allows the hot air rising to the top to flow back to the bottom, circulating the hot air and thus improving the utilization rate of resources. A reflow oven for soldering electronic products, disclosed in application number CN202122705443.9 on May 3, 2022, uses a combination of connecting and conveying mechanisms. Through two connecting pipes, the waste heat energy in the reflow zone is easily transported to the heat preservation zone, and the waste heat energy in the heat preservation zone is transported to the heating zone, improving the utilization rate of resources. The rotating blades enable better heat transfer and improve the heat transfer efficiency.

[0004] In current hot air reflow ovens, when processing PCBs, the PCBs need to pass through a preheating zone, a constant temperature zone, a reflow zone, and a cooling zone in sequence after entering the oven. Each zone provides a different processing temperature for the PCB. However, since the PCB is transported by a set of conveyor mechanisms at a constant speed through these four zones, the length of each zone will also be different due to the different dwell times of the PCB in each zone. When it is necessary to increase or decrease the time the PCB spends in one zone, the overall speed of the conveyor mechanism changes, and the transit time of the PCB in other zones will also change. Once the length of each zone is set, it is difficult to adjust. If it is necessary to control the transit time of the PCB in different zones, a PCB needs to be placed separately each time, and the transit time of a single PCB in different zones needs to be changed by adjusting the speed of the conveyor mechanism. This greatly reduces the efficiency of subsequent PCB processing and increases the energy consumption of the equipment. Summary of the Invention

[0005] The purpose of this invention is to provide a hot air reflow oven for stable PCB board transport, thereby solving the problem mentioned in the background art. In current hot air reflow ovens, when processing PCB boards, the PCB boards need to pass through a preheating zone, a constant temperature zone, a reflow zone, and a cooling zone in sequence after entering the oven. Each zone provides a different processing temperature for the PCB board. However, since the PCB board is transported by a set of conveying mechanisms at a uniform speed through the above four zones, the dwell time of the PCB board in different zones is different, and therefore the set length of each zone is also different. When it is necessary to increase or decrease the time that the PCB board needs to pass through one of the zones, the overall speed of the conveying mechanism changes, and the passage time of the PCB board in other zones also changes. The length of each zone is difficult to adjust once it is set.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a hot air reflow oven for stable PCB board transport, comprising a reflow oven body, a controller, a top cover, and a conveying mechanism. The controller is installed on the front side of the reflow oven body, and a top cover is provided above the reflow oven body. A conveying mechanism is provided below the top cover. The conveying mechanism transports the PCB board into the reflow oven body for reflow soldering. The conveying mechanism includes a first conveying mechanism, a second conveying mechanism, a third conveying mechanism, and a fourth conveying mechanism. The first conveying mechanism, the second conveying mechanism, the third conveying mechanism, and the fourth conveying mechanism are respectively connected to the preheating zone, the constant temperature zone, and the reflow zone within the reflow oven body. Corresponding to the cooling zone, the first, second, third, and fourth conveying mechanisms control the movement speed of the PCB board in different zones, changing its dwell time in the corresponding zones. The first, second, third, and fourth conveying mechanisms are distributed sequentially from left to right and from top to bottom, so that the PCB board can automatically fall onto the second conveying mechanism after passing through the first conveying mechanism, and then proceed to the next process. The first, second, third, and fourth conveying mechanisms have the same structure and are fixed to each other.

[0007] To further optimize this technical solution, the first conveying mechanism includes a fixed base, a movable base, a conveyor belt, and a drive roller;

[0008] A mounting base is installed above the main body of the reflow oven;

[0009] The movable seat is located outside the fixed seat, and the side view of the movable seat has an "L" shaped structure design.

[0010] The conveyor belt is installed inside the fixed seat and the movable seat;

[0011] The drive roller, located at the end of the conveyor belt, controls the movement of the conveyor belt.

[0012] To further optimize this technical solution, two sets of movable seats are symmetrically arranged about the center line of the fixed seats, enabling them to simultaneously transport the two sets of PCB boards. A movement control mechanism is provided below the movable seats to adjust the distance between the movable seats and the fixed seats.

[0013] To further optimize this technical solution, a positioning support block is fixed through the middle of the fixed base, and the outer end of the positioning support block passes through the movable base to form a nested connection, providing support for it. The end of the positioning support block is connected to the reflow furnace body.

[0014] To further optimize this technical solution, the movement control mechanism includes a mounting block, a connecting block, and an adjusting rod;

[0015] The mounting block is fixed to the bottom of the mounting base;

[0016] The connecting block is fixed to the bottom of the movable seat;

[0017] The adjusting rod passes through the mounting block and the connecting block to form a rotatable connection. The adjusting rod is a two-way threaded rod, and the outer end of the adjusting rod passes through the connecting block to form a threaded connection.

[0018] To further optimize this technical solution, a second connecting shaft is fixed to the outside of the drive roller inside the fixed seat, and a first connecting shaft is fixed to the outside of the drive roller inside the movable seat. A guide block is fixed to the surface of the first connecting shaft, and the first connecting shaft forms a nested connection with the second connecting shaft through the guide block. The first connecting shaft and the second connecting shaft can rotate synchronously. A motor is connected to the outer end of the drive roller to control the rotation of the drive roller.

[0019] To further optimize this technical solution, positioning rollers are provided on the inner sides of both the fixed seat and the movable seat, and the positioning rollers are distributed horizontally at equal intervals to provide a vertical positioning effect for the PCB board.

[0020] To further optimize this technical solution, the outer end of the positioning roller is rotatably connected to a slider, and the slider is respectively set inside the fixed seat and the movable seat to form an up-and-down sliding structure with them. A first spring is fixed above the slider to provide a downward pushing force for the slider.

[0021] To further optimize this technical solution, the reflow oven body has a connecting groove inside, and the top of the connecting groove has an open structure design. The positioning support block is located inside the connecting groove, and the connecting groove is equipped with a docking locking mechanism to limit the positioning support block.

[0022] To further optimize this technical solution, the docking locking mechanism includes a locking rod, a second spring, a pressing block, a control rod, and a positioning groove;

[0023] The locking rod is set inside the positioning support block and between the positioning support block to form a front and back sliding structure, and there are two sets of locking rods inside the positioning support block;

[0024] The second spring, located on the outside of the locking lever, provides an inward thrust for the locking lever;

[0025] The squeezing block is located at the inner end of the locking rod, and the outer side of the squeezing block is designed with an inclined structure. The squeezing block and the positioning support block form an up-and-down sliding structure.

[0026] The control rod is rotatably mounted above the extrusion block, and the upper end of the control rod passes through the upper surface of the positioning support block to form a threaded connection with the positioning support block.

[0027] The positioning groove is formed inside the connecting groove, and the positioning groove and the locking rod form an engaging structure.

[0028] Compared with the prior art, the beneficial effects of the present invention are:

[0029] (1) By setting up four independent conveying mechanisms, the speed of the PCB board in different areas of the reflow oven is controlled separately. The first conveying mechanism and the second conveying mechanism are staggered, so that the PCB board can be transferred from the first conveying mechanism to the second conveying mechanism to adjust the speed, thereby adapting to different processing needs.

[0030] (2) By adjusting the running speed of the four sets of conveying mechanisms, the dwell time of the PCB board in different areas of the reflow oven can be changed, so that the setting length of different areas does not need to be adjusted, and the conveying speed of the PCB board on different conveying mechanisms does not affect each other, so that the PCB board can be reflowed more effectively.

[0031] (3) The distance between the movable seat and the fixed seat can be adjusted by moving the movable seat, thereby changing its conveying width to adapt to the processing of PCB boards of different widths. The drive rollers on the movable seat and the fixed seat can rotate synchronously to improve the subsequent conveying stability.

[0032] (4) The positioning rollers can provide vertical positioning for the PCB board, making its movement on the conveyor belt more stable and avoiding the subsequent hot air blowing the PCB board to move, thus improving the stability of the PCB board movement during the processing.

[0033] (5) The positioning support block provides support for the four sets of conveying mechanisms. The positioning support block can be detachably installed in the reflow oven body. The positioning support block can be removed from the connecting groove by releasing the locking rod and the positioning groove, so that the conveying mechanism can be easily disassembled and removed from the reflow oven body for easy inspection and maintenance. Attached Figure Description

[0034] Figure 1 is a three-dimensional structural diagram of the present invention;

[0035] Figure 2 is a top view of the transmission mechanism of the present invention;

[0036] Figure 3 is a three-dimensional structural diagram of the transmission mechanism of the present invention;

[0037] Figure 4 is a three-dimensional structural diagram of the first conveying mechanism of the present invention;

[0038] Figure 5 is a schematic diagram of the main structure of the movable seat of the present invention;

[0039] Figure 6 is a schematic diagram of the side cross-section structure of the positioning roller of the present invention;

[0040] Figure 7 is a schematic diagram of the side cross-section of the first connecting shaft of the present invention;

[0041] Figure 8 is an enlarged structural schematic diagram of point a in Figure 7 of the present invention;

[0042] Figure 9 is a schematic diagram of the side cross-section structure of the positioning support block of the present invention;

[0043] Figure 10 is an enlarged structural schematic diagram of point b in Figure 9 of the present invention;

[0044] Figure 11 is a schematic diagram of the connection structure between the positioning support block and the main body of the reflow furnace according to the present invention;

[0045] Figure 12 is an enlarged structural diagram of point c in Figure 11 of the present invention.

[0046] In the diagram: 1. Reflow oven body; 2. Controller; 3. Top cover; 4. Conveying mechanism; 401. First conveying mechanism; 40101. Fixed seat; 40102. Movable seat; 40103. Conveyor belt; 40104. Drive roller; 402. Second conveying mechanism; 403. Third conveying mechanism; 404. Fourth conveying mechanism; 5. First connecting shaft; 6. Second connecting shaft; 7. Guide block; 8. Motor; 9. Positioning roller; 10. Slider; 11. First spring; 12. Mounting block; 13. Connecting block; 14. Adjusting rod; 15. Positioning support block; 16. Locking rod; 17. Second spring; 18. Extrusion block; 19. Control rod; 20. Connecting groove; 21. Positioning groove. Detailed Implementation

[0047] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0048] Please refer to Figures 1-12. The present invention provides the following technical solution: a hot air reflow oven for smooth transport of PCB boards, including a reflow oven body 1, a controller 2, an upper cover 3 and a transmission mechanism 4. The controller 2 is installed on the front side of the reflow oven body 1, and the upper cover 3 is provided above the reflow oven body 1. The transmission mechanism 4 is provided below the upper cover 3. The PCB board is transported into the reflow oven body 1 for reflow soldering through the transmission mechanism 4.

[0049] Example 1:

[0050] This invention provides a technical solution: a hot air reflow oven for stable PCB board transport, which discloses:

[0051] The transmission mechanism 4 includes a first conveying mechanism 401, a second conveying mechanism 402, a third conveying mechanism 403, and a fourth conveying mechanism 404. These four mechanisms correspond to the preheating zone, constant temperature zone, reflow zone, and cooling zone within the reflow oven body 1, respectively. The first, second, third, and fourth conveying mechanisms 401, 402, 403, and 404 control the movement speed of the PCB board in different areas, thus changing its dwell time in each area. The first, second, third, and fourth conveying mechanisms 401, 402, 403, and 404 are distributed sequentially from left to right and top to bottom, allowing the PCB board to automatically fall onto the second, third, and fourth conveying mechanisms after passing the first conveying mechanism 401, and so on. The conveying mechanism for the next process, the first conveying mechanism 401, the second conveying mechanism 402, the third conveying mechanism 403 and the fourth conveying mechanism 404 have the same composition structure, and the first conveying mechanism 401, the second conveying mechanism 402, the third conveying mechanism 403 and the fourth conveying mechanism 404 are fixed to each other. The first conveying mechanism 401 includes a fixed seat 40101, a movable seat 40102, a conveyor belt 40103 and a drive roller 40104. The fixed seat 40101 is set above the reflow oven body 1. The movable seat 40102 is set outside the fixed seat 40101, and the side view cross section of the movable seat 40102 is designed with an "L" shape. The conveyor belt 40103 is set inside the fixed seat 40101 and the movable seat 40102. The drive roller 40104 is set at the end of the conveyor belt 40103 and controls the movement of the conveyor belt 40103.

[0052] During use, the processing temperature curve of the reflow oven body 1 can be controlled by the controller 2. Then, the PCB board to be processed is placed on the conveying mechanism 4 and sent into the reflow oven body 1 for processing. The PCB board is first conveyed by the first conveying mechanism 401, then falls from the first conveying mechanism 401 onto the second conveying mechanism 402, and then moves sequentially to the fourth conveying mechanism 404. The first conveying mechanism 401, the second conveying mechanism 402, the third conveying mechanism 403, and the fourth conveying mechanism 404 correspond to the preheating zone, the constant temperature zone, the reflow zone, and the cooling zone inside the reflow oven body 1, respectively. By controlling the running speed of the first conveying mechanism 401, the moving speed and dwell time of the PCB board in the preheating zone can be controlled individually. The same applies to other areas. When the PCB board is on the first conveying mechanism 401, the drive roller 40104 drives the conveyor belt 40103 to move, thus moving the PCB board and conveying it.

[0053] Example 2:

[0054] Based on Embodiment 1, two sets of movable seats 40102 are symmetrically arranged about the center line of fixed seats 40101, enabling simultaneous transport of two sets of PCB boards. A movement control mechanism is located below the movable seats 40102 to adjust the distance between the movable seats 40102 and the fixed seats 40101. A positioning support block 15 is fixedly inserted through the middle of the fixed seats 40101, and the outer end of the positioning support block 15 penetrates the movable seats 40102, forming a nested connection to provide support. The end of the positioning support block 15 is connected to the reflow oven body 1. The movement control mechanism includes a mounting block 12, a connecting block 13, and an adjusting rod 14. The mounting block 12 is fixed below the fixed seats 40101, the connecting block 13 is fixed below the movable seats 40102, and the adjusting rod 14 penetrates the mounting block 12 and the connecting block 13, forming a rotatable connection. The adjusting rod 14 is a bidirectional threaded rod, and its outer end penetrates the connecting block. A threaded connection is formed between 13 and connecting block 13. A second connecting shaft 6 is fixed on the outside of the drive roller 40104 inside the fixed seat 40101. A first connecting shaft 5 is fixed on the outside of the drive roller 40104 inside the movable seat 40102. A guide block 7 is fixed on the surface of the first connecting shaft 5. The first connecting shaft 5 is nested with the second connecting shaft 6 through the guide block 7. The first connecting shaft 5 and the second connecting shaft 6 can rotate synchronously. A motor 8 is connected to the outer end of the drive roller 40104 to control the rotation of the drive roller 40104. Positioning rollers 9 are provided on the inner sides of both the fixed seat 40101 and the movable seat 40102. The positioning rollers 9 are horizontally and evenly distributed to provide a vertical positioning effect for the PCB board. A slider 10 is rotatably connected to the outer end of the positioning roller 9. The slider 10 is respectively set inside the fixed seat 40101 and the movable seat 40102 to form an up-and-down sliding structure. A first spring 11 is fixed above the slider 10 to provide a downward pushing force for the slider 10.

[0055] The distance between the fixed seat 40101 and the movable seat 40102 can be adjusted to accommodate the conveying of PCB boards of different widths. During adjustment, the adjusting rod 14 can be rotated. The adjusting rod 14 can drive the movable seat 40102 to move through the threaded connection between it and the connecting block 13. At the same time, the movable seat 40102 slides on the positioning support block 15 to adjust its position. Meanwhile, the first connecting shaft 5 slides within the second connecting shaft 7 to maintain the connection between the driving roller 40104 in the fixed seat 40101 and the driving roller 40104 in the movable seat 40102. When conveying the PCB board, the positioning roller 9 can provide vertical positioning for the PCB board to prevent it from being blown away by hot air. The positioning roller 9 can also move downward under the force of the first spring 11 under the action of the slider 10, and contact the surface of the PCB board to ensure its limiting effect.

[0056] Example 3:

[0057] Based on Embodiment 2, a connecting groove 20 is disclosed inside the reflow oven body 1, and the upper part of the connecting groove 20 has an open structure design. The positioning support block 15 is located inside the connecting groove 20, and a docking locking mechanism is provided inside the connecting groove 20 to limit the positioning support block 15. The docking locking mechanism includes a locking rod 16, a second spring 17, a pressing block 18, a control rod 19, and a positioning groove 21. The locking rod 16 is arranged inside the positioning support block 15 and forms a front-to-back sliding structure between the locking rod 16 and the positioning support block 15. The locking rod 16 has two... The set includes a second spring 17, which is located on the outside of the locking rod 16 to provide an inward thrust for the locking rod 16; a pressing block 18, which is located at the inner end of the locking rod 16, and the outer side of the pressing block 18 is designed with an inclined structure, and the pressing block 18 and the positioning support block 15 form an up-and-down sliding structure; a control rod 19, which is rotatably mounted above the pressing block 18, and the upper end of the control rod 19 passes through the upper surface of the positioning support block 15 and forms a threaded connection with the positioning support block 15; and a positioning groove 21, which is opened inside the connecting groove 20, and the positioning groove 21 and the locking rod 16 form an engaging structure.

[0058] The positioning support block 15 is installed inside the reflow oven body 1 through the connecting groove 20 and locked by the locking rod 16 and the positioning groove 21. When it is necessary to remove the transmission mechanism 4 from the reflow oven body 1, the control rod 19 can be rotated to drive the pressing block 18 to move through the threaded connection between it and the positioning support block 15, thereby releasing the pressing block 18 from the locking rod 16. This allows the second spring 17 to push the locking rod 16 to move, releasing the connection between the locking rod 16 and the positioning groove 21. Then, the positioning support block 15 can be moved upward from the connecting groove 20 to disassemble the transmission mechanism 4.

[0059] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0060] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A hot air reflow oven for stable transport of PCB boards, comprising a reflow oven body (1), a controller (2), a top cover (3), and a transport mechanism (4), wherein the controller (2) is installed on the front side of the reflow oven body (1), and the top cover (3) is provided above the reflow oven body (1), and the transport mechanism (4) is provided below the top cover (3), the PCB board being transported into the reflow oven body (1) for reflow soldering via the transport mechanism (4); characterized in that: The transmission mechanism (4) includes a first conveying mechanism (401), a second conveying mechanism (402), a third conveying mechanism (403), and a fourth conveying mechanism (404). The first conveying mechanism (401), second conveying mechanism (402), third conveying mechanism (403), and fourth conveying mechanism (404) correspond to the preheating zone, constant temperature zone, reflow zone, and cooling zone within the reflow oven body (1), respectively. The first conveying mechanism (401), second conveying mechanism (402), third conveying mechanism (403), and fourth conveying mechanism (404) control the movement speed of the PCB board in different areas, changing its dwell time in the corresponding areas. (401), the second conveying mechanism (402), the third conveying mechanism (403), and the fourth conveying mechanism (404) are arranged sequentially from left to right and from top to bottom, so that the PCB board can automatically fall onto the second conveying mechanism (402) after passing through the first conveying mechanism (401) and be conveyed to the next process in sequence. The first conveying mechanism (401), the second conveying mechanism (402), the third conveying mechanism (403), and the fourth conveying mechanism (404) have the same composition structure, and the first conveying mechanism (401), the second conveying mechanism (402), the third conveying mechanism (403), and the fourth conveying mechanism (404) are fixed to each other; the first conveying mechanism (401) includes a fixed base (40101). The reflow oven body (1) consists of a movable seat (40102), a conveyor belt (40103), and a drive roller (40104); a fixed seat (40101) is located above the reflow oven body (1); the movable seat (40102) is located outside the fixed seat (40101), and the side view of the movable seat (40102) is designed with an "L" shape; the conveyor belt (40103) is located inside the fixed seat (40101) and the movable seat (40102); the drive roller (40104) is located at the end of the conveyor belt (40103) to control the movement of the conveyor belt (40103); the movable seat (40102) is symmetrically arranged in two sets about the center line of the fixed seat (40101) so that it can move synchronously. Two sets of PCB boards are conveyed, and a movement control mechanism is provided below the movable seat (40102) to adjust the distance between the movable seat (40102) and the fixed seat (40101); a positioning support block (15) is fixed through the middle of the fixed seat (40101), and the outer end of the positioning support block (15) passes through the movable seat (40102) to form a nested connection, providing support for it, and the end of the positioning support block (15) is connected to the reflow oven body (1); positioning rollers (9) are provided on the inner side of both the fixed seat (40101) and the movable seat (40102), and the positioning rollers (9) are horizontally and equally spaced to provide a vertical positioning effect for the PCB board;The outer end of the positioning roller (9) is rotatably connected to a slider (10), and the slider (10) is respectively disposed inside the fixed seat (40101) and the movable seat (40102) to form an up-and-down sliding structure. A first spring (11) is fixed above the slider (10) to provide a downward thrust for the slider (10).

2. The hot air reflow oven for stable PCB board conveying according to claim 1, characterized in that: The moving control mechanism includes a mounting block (12), a connecting block (13), and an adjusting rod (14); the mounting block (12) is fixed below the fixed seat (40101); the connecting block (13) is fixed below the movable seat (40102); the adjusting rod (14) passes through the mounting block (12) and the connecting block (13) to form a rotatable connection, and the adjusting rod (14) is a bidirectional threaded rod, with the outer end of the adjusting rod (14) passing through the connecting block (13) to form a threaded connection.

3. The hot air reflow oven for stable PCB board conveying according to claim 1, characterized in that: A second connecting shaft (6) is fixed to the outside of the drive roller (40104) inside the fixed seat (40101), and a first connecting shaft (5) is fixed to the outside of the drive roller (40104) inside the movable seat (40102). A guide block (7) is fixed to the surface of the first connecting shaft (5), and the first connecting shaft (5) and the second connecting shaft (6) are nested together through the guide block (7). The first connecting shaft (5) and the second connecting shaft (6) can rotate synchronously. A motor (8) is connected to the outer end of the drive roller (40104) to control the rotation of the drive roller (40104).

4. The hot air reflow oven for stable PCB board conveying according to claim 1, characterized in that: The reflow oven body (1) has a connecting groove (20) inside, and the top of the connecting groove (20) is designed as an open structure. The positioning support block (15) is located inside the connecting groove (20), and the connecting groove (20) is provided with a docking locking mechanism to limit the positioning support block (15).

5. The hot air reflow oven for stable PCB board conveying according to claim 4, characterized in that: The docking locking mechanism includes a locking rod (16), a second spring (17), a pressing block (18), a control rod (19), and a positioning groove (21); the locking rod (16) is disposed inside the positioning support block (15) and forms a front-to-back sliding structure between the positioning support block (15), and two sets of locking rods (16) are disposed inside the positioning support block (15); the second spring (17) is disposed outside the locking rod (16) to provide an inward pushing force for the locking rod (16); the pressing block (18) is disposed on the locking rod (16) is located at the inner end of the extrusion block (18), and the outer side of the extrusion block (18) is designed with an inclined structure. The extrusion block (18) and the positioning support block (15) form an up-and-down sliding structure. The control rod (19) is rotatably installed above the extrusion block (18), and the upper end of the control rod (19) passes through the upper surface of the positioning support block (15) and forms a threaded connection with the positioning support block (15). The positioning groove (21) is opened inside the connecting groove (20), and the positioning groove (21) and the locking rod (16) form a locking structure.

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