Assembled light emitting diode display device

Abstract

The application provides an assembled light emitting diode display device, which comprises a system motherboard and a plurality of assembled sub-boards. The assembled sub-boards are arranged on the system motherboard, each of the assembled sub-boards has a substrate, at least two groups of light emitting diode units arranged on the substrate, and at least one transistor switch. Each group of light emitting diode units has a plurality of light emitting diodes and is electrically connected with the same transistor switch. The light emitting diodes are arranged in rows and columns on the system motherboard. The light emitting diodes arranged in the same row in a first direction are electrically connected with a corresponding power line. The gate of at least one transistor switch of the same assembled sub-board is electrically connected with the same gate line. A large number of light emitting diodes can be simultaneously transferred by using the assembled sub-boards, so as to reduce the problem of mass transfer.

Description

Technical Field

[0001] This invention relates to a display device, and more particularly to an assembled light-emitting diode display device. Background Technology

[0002] Light-emitting diodes (LEDs), especially miniature LEDs (such as mini-LEDs or micro-LEDs), have been widely used in various fields in recent years and have become the mainstream of lighting and light sources due to their advantages such as small size, high brightness, low heat generation, and energy saving. However, when a large number of LEDs are needed, such as when LEDs are used as display light sources in displays, the miniaturization of their size and the huge number required for application not only make the transfer process time-consuming but also easily cause tolerance problems in the transfer alignment. This makes mass transfer a major bottleneck for the commercial application of miniature LEDs. Summary of the Invention

[0003] The purpose of this invention is to provide an assembled LED display device that reduces the yield problem of mass transfer.

[0004] The assembled LED display device of the present invention includes a system motherboard and multiple assembly daughterboards.

[0005] The system motherboard has a drive power supply circuit unit and a gate control circuit unit.

[0006] The assembly sub-board is disposed on the system motherboard. Each assembly sub-board has a substrate, at least two sets of light-emitting diode units disposed on the substrate, and at least one transistor switch. Each set of light-emitting diode units has multiple light-emitting diodes, and the light-emitting diodes of the same set of light-emitting diode units are electrically connected to the same transistor switch.

[0007] The light-emitting diodes are arranged in rows and columns at intervals on the motherboard of the system. The driving power supply circuit unit has multiple power lines extending in the same direction along a first direction. The gate control circuit unit has multiple gate lines extending in a second direction intersecting the first direction. The light-emitting diodes arranged in the same direction along the first direction are electrically connected to a corresponding power line. The gate of at least one transistor switch located on the same assembly subboard is electrically connected to the same gate line to receive timing signals.

[0008] Preferably, in the assembled LED display device of the present invention, each assembled sub-board has multiple sets of LED units and multiple transistor switches corresponding to the LED units, the LEDs of the same set of LED units are simultaneously electrically connected to one of the corresponding transistor switches, and the gate of the transistor switch of each assembled sub-board is electrically connected to the same gate line.

[0009] Preferably, in the assembled LED display device of the present invention, each assembled sub-board has a transistor switch, and the LED is simultaneously electrically connected to the transistor switch.

[0010] Preferably, in the assembled LED display device of the present invention, each group of LED units has at least three LEDs capable of emitting different colors of light.

[0011] Preferably, in the assembled LED display device of the present invention, the LEDs of each group of LED units are electrically connected to each other in a common cathode or common anode manner.

[0012] Preferably, in the trench gate transistor assembly of the present invention, the light-emitting diodes have a common cathode structure, the positive terminal of each light-emitting diode is electrically connected to the power line, and the negative terminal is electrically connected to the corresponding at least one transistor switch.

[0013] Preferably, in the assembled LED display device of the present invention, the LED has a common anode structure, the negative terminal of each LED is electrically connected to the power line, and the positive terminal is electrically connected to the corresponding at least one transistor switch.

[0014] Preferably, in the assembled LED display device of the present invention, the system motherboard further includes a grounding line and a timing control unit, the at least one transistor switch is electrically connected to the grounding line, and the drive power supply circuit unit and the gate control circuit unit are electrically connected to the timing control unit.

[0015] Preferably, in the assembled LED display device of the present invention, the driving power supply circuit unit further includes a driving IC electrically connected to the power line for controlling the driving current supplied to the power line.

[0016] Preferably, in the assembled LED display device of the present invention, the substrate of the assembled sub-board is selected from glass substrate, silicon substrate, polyimide, or circuit board, and the system motherboard also has a board body, the driving power supply circuit unit and the gate control circuit unit are disposed on the board body, and the board body is selected from glass substrate, silicon substrate, polyimide, or circuit board.

[0017] The beneficial effects of the present invention are as follows: by using an assembly method, multiple assembly sub-boards pre-equipped with multiple light-emitting diodes and at least one transistor switch are assembled onto the system motherboard, and a large number of light-emitting diodes can be transferred simultaneously by the assembly sub-boards to reduce the problem of insufficient mass transfer yield. Attached Figure Description

[0018] Figure 1This is a top view illustrating an embodiment of an assembled LED display device;

[0019] Figure 2 This is a top-down view diagram for illustrative purposes. Figure 1 The light-emitting display unit of one of the assembly sub-boards in this embodiment;

[0020] Figure 3 This is a top view schematic diagram illustrating another electrical connection state between the light-emitting display unit and the transistor switch in this embodiment;

[0021] Figure 4 This is a top view schematic diagram illustrating another embodiment of the light-emitting display unit and transistor switch in this example; and

[0022] Figure 5 This is a top view schematic diagram illustrating another aspect of the number and arrangement of light-emitting diodes in the light-emitting display unit of one of the assembly sub-boards in this embodiment. Detailed Implementation

[0023] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0024] See Figure 1 , 2 An embodiment of the assembled LED display device of the present invention includes a system motherboard 20 and a plurality of assembly subboards 30.

[0025] The system motherboard 20 includes a board body 21, a timing control unit 22 disposed on the board body 21, a drive power supply circuit unit 23, a gate control circuit unit 24, and a grounding line 25, which are electrically connected to the timing control unit 22 respectively.

[0026] In detail, the board 21 can be a glass substrate, a silicon substrate, polyimide (PI), or a circuit board, etc. In this embodiment, the board 21 is described as a circuit board with a circuit structure. The timing control unit 22 is disposed on the board 21 and electrically connected to the circuit structure, and can be used to provide timing signals to the drive power circuit unit 23 and the gate control circuit unit 24 respectively. The drive power circuit unit 23 has a drive IC 231 electrically connected to the timing control unit 22, and a plurality of power lines 232 respectively electrically connected to the drive IC 231. The power lines 232 are staggered and extend in the same direction along the first direction Y. The drive IC 231 can receive timing signals and control the drive current provided to the power lines 232. The gate control circuit unit 24 has a gate signal controller 241 electrically connected to the timing control unit 22, and a plurality of gate lines G respectively electrically connected to the gate signal controller 241. The gate lines G extend in the same direction along a second direction X perpendicular to the first direction Y. In this embodiment, the first direction is the Y direction and the second direction is the X direction, but in actual implementation, it is not limited to this.

[0027] The assembly sub-boards 30 are mounted on the system motherboard 20. Each assembly sub-board 30 has a substrate 31 with an area smaller than that of the board body 21 of the system motherboard 20, multiple sets of light-emitting diode units 32 disposed on the substrate 31, and a transistor switch T.

[0028] The substrate 31 can be a glass substrate, a silicon substrate, polyimide, or a circuit board, etc. Each group of light-emitting diode units 32 has three diodes that can emit three different colors of light. Figure 1 R, B, and G represent light-emitting diodes L that emit red, blue, and green light, respectively, and the transistor switch T is simultaneously electrically connected to each light-emitting diode L in the light-emitting diode unit 32.

[0029] The light-emitting diode L can be of a standard size (length x width not exceeding 100 x 100 μm) or a smaller mini-LED or micro LED (length x width not exceeding 20 x 20 μm). The transistor switch T is a field-effect transistor (FET). For example, the transistor switch T can be a thin-film transistor (TFT) and can be directly formed on the substrate 31 through semiconductor processes. Furthermore, the transistor switch T can be an N-type transistor or a P-type transistor depending on the material of the substrate 31. For instance, if the substrate 31 is a glass substrate and the material deposited on its surface is amorphous silicon (Si), only N-type thin-film transistors can be used. When it is low-temperature polycrystalline silicon (LTPS), either N-type or P-type thin-film transistors can be used. When the substrate 31 is a silicon substrate, either N-type or P-type transistors can be used.

[0030] It should be noted that the light-emitting diodes (LEDs) L located on the same substrate 31 can be formed by transferring multiple LEDs L formed on a single native epitaxial substrate to the substrate 31 in a single-chip transfer or a single-chip transfer; or, the LEDs L can be pre-aligned and formed on another light-transmitting substrate corresponding to the substrate 31, and then electrically connected to the substrate 31 by flip-chip transfer (i.e., the light-transmitting substrate is opposite to the substrate 31 and the light-transmitting substrate is the light-emitting surface). LEDs L formed in the aforementioned manner can be transferred directly in a single transfer, or all LEDs L to be formed on each substrate 31 can be transferred at once, without the need for a complex mass transfer process.

[0031] It should be further noted that when the light-emitting diode L is transferred to the substrate 31 using a single multi-chip transfer method, the light-emitting diode L can be considered to have a common cathode or common anode structure based on its electrical connection with the transistor switch T. Furthermore, the light-emitting diode L can emit different wavelengths of light by utilizing different luminescent materials. For example, the light-emitting diode L may include those capable of emitting at least three colors of light: red (R), blue (B), and green (G); or the light-emitting diode L may be constructed using short-wavelength luminescent materials (blue or ultraviolet luminescent materials) that emit the same color of light, and then different light conversion materials, such as phosphors or quantum dots, are applied to the light-emitting surface to convert the wavelength and emit different wavelengths of light (e.g., red, blue, green, etc.). The aforementioned detailed structures of the light-emitting diode L, such as common cathode or common anode, and the material selection of the light-emitting diode L, are well known to those skilled in the art and will not be elaborated further.

[0032] The assembly method of the aforementioned assembled LED display device is as follows: First, multiple LED chips L formed on another substrate are transferred to the corresponding substrate 31 to obtain multiple sets of LED units 32 distributed on the substrate 31. Then, these units are electrically connected to the corresponding transistor switches T to obtain multiple assembly sub-boards 30. Next, the required number of assembly sub-boards 30 are assembled on the board body 21, and the transistor switches T of the assembly sub-boards 30 are electrically connected to the driving power supply circuit unit 23, the gate control circuit unit 24, and the grounding line 25, respectively, to obtain the assembled LED display device of the present invention.

[0033] See also Figure 1 , Figure 1 Taking an N-type transistor switch T as an example, each assembly sub-board 30 has multiple sets of light-emitting diode (LED) units 32, and each set of LED units 32 has three LEDs L that can emit different colors of light (R, G, B). When the assembly sub-board 30 with multiple sets of LED units 32 is assembled on the board 21, the LEDs L will be arranged in an array with spacing between them, and the LEDs L can be a common cathode structure. The electrical connection of the assembled LEDs L is as follows: the positive terminals of the LEDs L arranged in the same column are electrically connected to the same corresponding power line 232 to provide driving current from the power line 232 to the LEDs L. The negative terminals of the LEDs L arranged in the same row on the same assembly sub-board 30 are electrically connected to the drain of the transistor switch T on the assembly sub-board 30, the gate of the transistor switch T is electrically connected to one of the corresponding gate lines G, and the source is electrically connected to the ground line 25.

[0034] See also Figure 1 ,by Figure 1 The circuit layout structure is illustrated, and the driver IC 231 is described as an LED driver with time-multiplexing constant current scanning. When performing time-multiplexing scanning using the LED display component of this invention, the driver IC 231 can provide a constant current to the power supply line 232 according to the timing signal received from the timing control unit 22. The gate line G can receive a timing signal provided by the gate signal controller 241 to turn on the corresponding transistor switch T, thereby driving current to the corresponding LED L.

[0035] Since each group of light-emitting diode units 32 in this invention is composed of multiple light-emitting diodes L, the number of transfers can be reduced and the mounting efficiency can be improved when transferring the light-emitting diode units 32 to the substrate 31. Furthermore, when the light-emitting diodes L are miniature light-emitting diodes, assembling multiple assembly sub-boards 30 that already carry multiple groups of light-emitting diode units 32 onto the board body 21 through an assembly method can avoid alignment tolerance problems caused by massive transfers and deformation / warping problems of the circuit board during the assembly process, making it easier to use.

[0036] See Figure 3 It should be noted that when the transistor switch T uses a P-type thin-film transistor, the light-emitting diode L can also be a common-anode structure, and the electrical connection after assembly is as follows: the negative terminals of the light-emitting diodes L arranged in the same column are electrically connected to the same corresponding power line 232 and connected to the ground line; the positive terminals of the light-emitting diodes L arranged in the same row on the same assembly sub-board 30 are electrically connected to the source terminal of the transistor switch T located on the assembly sub-board 30; the gate terminal of the transistor switch T is electrically connected to one of the corresponding gate lines G; and the drain terminal is electrically connected to a positive voltage source (V). Since its time-division scanning control method is the same as described above, it will not be repeated.

[0037] In some embodiments, the number of transistor switches T for each assembly sub-board 30 used for assembly may also correspond to the array of the light-emitting diode units 32.

[0038] Specifically, see Figure 4 Let's take an N-type transistor switch T as an example. Each assembly sub-board 30 has multiple sets of light-emitting diode units 32 and multiple transistor switches T corresponding to the array of the light-emitting diode units 32. The drain of each transistor switch T is electrically connected to the negative terminals of the three light-emitting diodes L in each set of light-emitting diode units 32. After assembly, the gates of two transistor switches T located on the same assembly sub-board 30 are electrically connected to the same gate line G. The remaining electrical connections are as described above and will not be explained further. It should be noted that... Figure 4 Taking the example of each group of LED units 32 being electrically connected to the same transistor switch T, in actual implementation, two, three, or more groups of LED units 32 can be electrically connected to the same transistor switch T depending on the requirements and design, without limitation. By having one transistor switch T carry one or more groups of LED units 32, the parasitic capacitance / inductance effect can be reduced and the display effect improved.

[0039] In other embodiments, the number of light-emitting diodes L in each group of light-emitting diode units 32 of the assembly sub-board 30 may also be three or more. See also Figure 5 , Figure 5 Taking an N-type transistor switch T as an example, and only displaying two groups of LED units 32 on the assembly sub-board 30, each group of LED units 32 has six LEDs L that emit different colors of light (R, G, B), the LEDs L are arranged in two alternating rows and then connected in parallel to the transistor switch T, and all LEDs L are electrically connected to the same transistor switch T. However, in actual implementation, the number and arrangement of LEDs L are not limited to this, and the number of transistor switches in the transistor switch T can also be as described above: one transistor switch T corresponds to multiple groups of LED units 32, or each group of LED units 32 corresponds to one transistor switch T.

[0040] It should be noted that the arrangement of the light-emitting diodes L can be as follows: Figure 4 The arrangement of the LEDs in the diagram, whether in an alternating row and column pattern or any other arrangement, is acceptable as long as the arrangement of the assembled LEDs on the board 21 meets the display requirements and is easy to connect to the corresponding power line 232. There are no particular restrictions.

[0041] In summary, this invention utilizes a segmented assembly method. First, multiple groups of LED units 32 are transferred in a group transfer manner to a smaller substrate 31, with each group of LED units 32 having multiple LEDs L, resulting in multiple assembly sub-boards 30 for assembly. Next, the multiple assembly sub-boards 30, each already carrying multiple LEDs L, are assembled onto the board body 21 of the system motherboard 2 using a second assembly method. Since each group of LED units 32 on the assembly sub-board 30 is composed of multiple LEDs L, the number of transfers can be reduced and the mounting efficiency improved when transferring the LED units 32 to the substrate 31 of the assembly sub-board 30. Furthermore, when the LEDs L are miniature LEDs, assembling multiple assembly sub-boards 30 already carrying multiple groups of LED units 32 onto the board body 21 of the system motherboard 2 using a segmented assembly method avoids alignment tolerance problems caused by large-scale transfers and deformation / warping problems of the circuit board during assembly, making it easier to use and thus effectively achieving the objectives of this invention.

[0042] However, the above description is merely an embodiment of the present invention and should not be construed as limiting the scope of the present invention. Any simple equivalent changes and modifications made in accordance with the claims and description of the present invention shall still fall within the scope of the present invention.

Claims

1. An assembled light-emitting diode display device, comprising: The system motherboard includes a drive power supply circuit unit and a gate control circuit unit; and Multiple assembly sub-boards are assembled on the system motherboard. Each assembly sub-board has a substrate, at least two sets of light-emitting diode (LED) units disposed on the substrate, and at least one transistor switch. Each set of LED units has multiple LEDs, and the LEDs in the same set of LED units are electrically connected to the same transistor switch. in, The light-emitting diodes are arranged in rows and columns at intervals on the motherboard of the system. The driving power supply circuit unit has multiple power lines extending in the same direction along a first direction. The gate control circuit unit has multiple gate lines extending in a second direction intersecting the first direction. The light-emitting diodes arranged in the same direction along the first direction are electrically connected to a corresponding power line. The gates of the at least one transistor switch located on the same assembly subboard are electrically connected to the same gate line to receive timing signals.

2. The assembled LED display device according to claim 1, characterized in that: Each assembly sub-board has multiple sets of light-emitting diode units and multiple transistor switches corresponding to the light-emitting diode units. The light-emitting diodes of the same set of light-emitting diode units are simultaneously electrically connected to one of the corresponding transistor switches, and the gate of the transistor switch of each assembly sub-board is electrically connected to the same gate line.

3. The assembled light-emitting diode display device according to claim 1, characterized in that: Each of the assembled subboards has a transistor switch, and the light-emitting diode is also electrically connected to the transistor switch.

4. The assembled light-emitting diode display device according to claim 1, characterized in that: Each group of LED units has at least three LEDs that can emit different colors of light.

5. The assembled light-emitting diode display device according to claim 1, characterized in that: The light-emitting diodes in each group of light-emitting diode units are electrically connected to each other in a common cathode or common anode manner.

6. The assembled light-emitting diode display device according to claim 5, characterized in that: The light-emitting diode has a common cathode structure, with the positive terminal of each light-emitting diode electrically connected to the power line and the negative terminal electrically connected to the corresponding at least one transistor switch.

7. The assembled light-emitting diode display device according to claim 5, characterized in that: The light-emitting diode has a common anode structure, with the negative terminal of each light-emitting diode electrically connected to the power line and the positive terminal electrically connected to the corresponding at least one transistor switch.

8. The assembled light-emitting diode display device according to claim 1, characterized in that: The system motherboard also includes a grounding line and a timing control unit, with at least one transistor switch electrically connected to the grounding line, and the drive power supply circuit unit and the gate control circuit unit electrically connected to the timing control unit.

9. The assembled light-emitting diode display device according to claim 1, characterized in that: The drive power supply circuit unit also has a drive IC electrically connected to the power line for controlling the drive current supplied to the power line.

10. The assembled light-emitting diode display device according to claim 1, characterized in that: The substrate of the assembly subboard is selected from glass substrate, silicon substrate, polyimide, or circuit board. The system motherboard also has a board body, on which the drive power supply circuit unit and the gate control circuit unit are disposed. The board body is selected from glass substrate, silicon substrate, polyimide, or circuit board.

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