Display module and display device

Abstract

A display module. The display module includes a display panel, a bonding circuit board, a flip-chip film, and a buffer device. The bonding circuit board includes a first differential line, which includes a P-polar differential line and an N-polar differential line. One end of the flip-chip film is connected to the first differential line, and the other end is connected to the display panel. The buffer device is disposed on the bonding circuit board and connected to the ends of the P-polar differential line and the N-polar differential line near the flip-chip film; the buffer device is configured to reduce signal reflection between the P-polar differential line and the N-polar differential line and the flip-chip film.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] With the development of display technology, large-size display devices (such as televisions) are receiving increasing attention. Large-size display devices (such as 70 inches or larger) require correspondingly longer signal transmission lines, placing higher demands on the accuracy and reliability of the signals transmitted through these lines.

[0003] Public content

[0004] On one hand, a display module is provided. The display module includes a display panel, a bonding circuit board, a flip-chip film, and a buffer device. The bonding circuit board includes a first differential line, which includes a P-polar differential line and an N-polar differential line. One end of the flip-chip film is connected to the first differential line, and the other end is connected to the display panel. The buffer device is disposed on the bonding circuit board and connected to the ends of the P-polar differential line and the N-polar differential line near the flip-chip film; the buffer device is configured to reduce signal reflection between the P-polar differential line and the N-polar differential line and the flip-chip film.

[0005] In some embodiments, the buffer includes a first resistor, one end of which is connected to the P-pole differential line and the other end of which is connected to the N-pole differential line.

[0006] In some embodiments, the resistance of the first resistor is approximately equal to the impedance of the first differential line.

[0007] In some embodiments, the resistance of the first resistor is 100Ω.

[0008] In some embodiments, the first resistor includes a surface mount resistor, the package size of which is less than or equal to that of a 0402 package.

[0009] In some embodiments, the buffer device includes an LVDS buffer. The LVDS buffer includes a first input terminal, a second input terminal, a first output terminal, and a second output terminal; the flip-chip film is connected to the first differential line through the LVDS buffer. The first input terminal is connected to the P-pole differential line, the second input terminal is connected to the N-pole differential line, and the first and second output terminals are connected to the flip-chip film.

[0010] In some embodiments, the interval between the P-pole differential line and the N-pole differential line is less than or equal to the line width of the P-pole differential line and the N-pole differential line.

[0011] In some embodiments, the flip-chip thin film includes an LVDS interface circuit. The LVDS interface circuit includes a first signal receiving terminal, a second signal receiving terminal, an output terminal, and a second resistor. The first signal receiving terminal is connected to the P-pole differential line, the second signal receiving terminal is connected to the N-pole differential line, the output terminal is connected to the display panel, and one end of the second resistor is connected to the first signal receiving terminal, and the other end is connected to the second signal receiving terminal.

[0012] In some embodiments, the resistance value of the second resistor is approximately equal to the impedance of the first differential line, and the second resistor includes two sub-resistors connected in series, the two sub-resistors having equal resistance values.

[0013] In some embodiments, the display module includes a plurality of bonding circuit boards spaced apart along a first direction. The display module also includes a driver circuit board and a plurality of flexible connectors. The driver circuit board is configured to output differential signals. Each of the bonding circuit boards in the plurality of flexible connectors is connected to the driver circuit board via at least one flexible connector. The flexible connector includes a trace layer comprising a second differential line, one end of which is connected to the driver circuit board, and the other end of which is connected to a first differential line. The first direction is parallel to the side of the display panel where the plurality of bonding circuit boards are located.

[0014] In some embodiments, at least one flexible connector further includes at least one shielding layer disposed on at least one side of the wiring layer along the thickness direction of the wiring layer, the shielding layer covering the second differential line.

[0015] In some embodiments, at least one flexible connector is not provided with the shielding layer, and the length of the flexible connector provided with the shielding layer is greater than the length of the flexible connector not provided with the shielding layer.

[0016] In some embodiments, the dimension of the driving circuit board along the first direction is greater than the distance between two bonding circuit boards located at both ends of the plurality of bonding circuit boards in the first direction; and along the second direction, each bonding circuit board has at least a portion opposite to the driving circuit board. The portion of the bonding circuit board opposite to the driving circuit board is connected to the driving circuit board via at least one flexible connector. The first direction is perpendicular to the second direction.

[0017] In some embodiments, the plurality of flexible connectors are approximately equal in length.

[0018] In some embodiments, the length extension direction of the flexible connector is substantially parallel to the second direction.

[0019] In some embodiments, the drive circuit board includes a main body and extensions located on opposite sides of the main body in the first direction, the extensions having a smaller dimension in the second direction than the main body in the second direction. The drive circuit board includes a timing controller disposed on the main body and configured to output the differential signal.

[0020] In some embodiments, the plurality of bonding circuit boards includes a first bonding circuit board and a second bonding circuit board disposed adjacent to each other. Along a second direction, at least a portion of the first bonding circuit board is opposite to the driving circuit board, and the second bonding circuit board is offset from the driving circuit board. The plurality of flexible connectors includes a first flexible connector, a second flexible connector, and a third flexible connector. The first direction is perpendicular to the second direction.

[0021] The first bonding circuit board is connected to the drive circuit board via a first flexible connector and a second flexible connector. The first flexible connector is configured to transmit differential signals required for the flip-chip film connected to the first bonding circuit board, and the second flexible connector is configured to transmit differential signals required for the flip-chip film connected to the second bonding circuit board. One end of the third flexible connector is connected to the first bonding circuit board, and the other end is connected to the second bonding circuit board. The differential signals transmitted by the second flexible connector are transmitted sequentially via the first bonding circuit board and the third flexible connector to the second bonding circuit board.

[0022] In some embodiments, the first bonding circuit board includes the first differential line and the first adapter line, and the third flexible connector includes the second adapter line. One end of the first differential line is connected to the first flexible connector, and the other end is connected to the flip-chip film to which the first bonding circuit board is attached. One end of the first adapter line is connected to the second flexible connector, and the other end is connected to the second adapter line.

[0023] In some embodiments, the plurality of bonding circuit boards further include a third bonding circuit board disposed adjacent to the second bonding circuit board, the third bonding circuit board being located on the side of the second bonding circuit board away from the first bonding circuit board. Along the second direction, the third bonding circuit board is offset from the drive circuit board.

[0024] The plurality of flexible connectors further includes a fourth flexible connector and a fifth flexible connector. One end of the fourth flexible connector is connected to the first bonding circuit board, and the other end is connected to the drive circuit board. The fourth flexible connector is configured to transmit differential signals required for the flip-chip film connected to the third bonding circuit board. One end of the fifth flexible connector is connected to the second bonding circuit board, and the other end is connected to the third bonding circuit board. The differential signals transmitted by the fourth flexible connector are transmitted sequentially through the first bonding circuit board, the third flexible connector, the second bonding circuit board, and the fifth flexible connector to the third bonding circuit board.

[0025] In some embodiments, the first bonding circuit board includes a third adapter cable, the third flexible connector includes a fourth adapter cable, the second bonding circuit board includes a fifth adapter cable, and the fifth flexible connector includes a sixth adapter cable. The third adapter cable, the fourth adapter cable, the fifth adapter cable, and the sixth adapter cable are connected sequentially, the third adapter cable is also connected to the fourth flexible connector, and the sixth adapter cable is also connected to the third bonding circuit board.

[0026] In some embodiments, the first flexible connector and the second flexible connector are of equal length, and / or the length extension directions of the first flexible connector and the second flexible connector are substantially parallel to the second direction.

[0027] When the display module further includes a fourth flexible connector, the lengths of the first flexible connector, the second flexible connector, and the fourth flexible connector are equal, and / or the length extension directions of the first flexible connector, the second flexible connector, and the fourth flexible connector are substantially parallel to the second direction.

[0028] In some embodiments, the display module includes a plurality of first bonding circuit boards, a plurality of second bonding circuit boards, a plurality of first flexible connectors, a plurality of second flexible connectors, and a plurality of third flexible connectors; the plurality of first bonding circuit boards, the plurality of second bonding circuit boards, the plurality of first flexible connectors, the plurality of second flexible connectors, and the plurality of third flexible connectors are respectively symmetrically arranged with respect to the centerline of the display panel along the second direction. When the display module further includes a plurality of third bonding circuit boards, a plurality of fourth flexible connectors, and a plurality of fifth flexible connectors, the plurality of third bonding circuit boards, the plurality of fourth flexible connectors, and the plurality of fifth flexible connectors are respectively symmetrically arranged with respect to the centerline of the display panel along the second direction.

[0029] In some embodiments, the plurality of flexible connectors further includes a plurality of sixth flexible connectors, each of the bonding circuit boards being connected to the drive circuit board via a sixth flexible connector; the sixth flexible connector includes traces for transmitting power signals.

[0030] On the other hand, a display device is provided, including the display module described in any of the above embodiments. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0032] Figure 1 This is a structural diagram of a display device according to some embodiments;

[0033] Figure 2 This is a structural diagram of a display module according to some embodiments;

[0034] Figure 3 for Figure 2 A magnified view of a portion of A in the image;

[0035] Figure 4 for Figure 2 Another magnified view of part A in the image;

[0036] Figure 5 This is another structural diagram of a display module according to some embodiments;

[0037] Figure 6 For along Figure 5 A sectional view of the mid-section line BB;

[0038] Figure 7 For along Figure 5 A sectional view of the center section line CC;

[0039] Figure 8 This is yet another structural diagram of a display module according to some embodiments;

[0040] Figure 9 This is yet another structural diagram of a display module according to some embodiments;

[0041] Figure 10 for Figure 9 A magnified view of a portion of E;

[0042] Figure 11 This is yet another structural diagram of a display module according to some embodiments;

[0043] Figure 12 for Figure 11 A magnified view of a portion of F. Detailed Implementation

[0044] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0045] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0046] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0047] In describing some embodiments, the terms "connected" and "linked" and their derivative expressions may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other.

[0048] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0049] The use of “configured as” in this article implies an open and inclusive language that does not exclude the applicability to or configuration of devices to perform additional tasks or steps.

[0050] As used herein, “approximately” or “about” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0051] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0052] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0053] Some embodiments of this disclosure provide a display device 1000. See also... Figure 1The display device 1000 can be any device that displays images, whether moving (e.g., video) or fixed (e.g., still images), and whether it contains text or images. For example, the display device 1000 can be a television, laptop, tablet, mobile phone, electronic photograph, electronic billboard or sign, personal digital assistant (PDA), navigator, wearable device, augmented reality (AR) device, virtual reality (VR) device, or any product or component with display functionality.

[0054] In some embodiments, the display device 1000 may be a liquid crystal display (LCD); the display device 1000 may also be an electroluminescent display device or a photoluminescent display device. When the display device 1000 is an electroluminescent display device, it may be an organic light-emitting diode (OLED) or a quantum dot light-emitting diode (QLED). When the display device 1000 is a photoluminescent display device, it may be a quantum dot photoluminescent display device. The embodiments disclosed herein do not specifically limit the type of the display device 1000.

[0055] See Figure 2 and Figure 3 The display device 1000 includes a display module 1100. The display module 1100 may include a display panel 100, an X-printed circuit board (XPCB) 200, a chip-on-film (COF) 300, and a buffer device 400 (such as...). Figure 3 (As shown). Figure 3 The example shown uses the buffer device 400 with the first resistor 410.

[0056] The display panel 100 can be, for example, one of an LCD display panel, an OLED display panel, and a QLED display panel. The embodiments of this disclosure do not specifically limit the type and structure of the display panel 100.

[0057] The bonding circuit board 200 is located on one side of the display panel 100. The bonding circuit board 200 may include various signal connection lines, which are configured to transmit external signals (such as power signals, GOA signals, clock control signals, etc.) to the display panel 100 through the flip-chip film 300, thereby controlling the display panel 100 to display images.

[0058] In some embodiments, see Figure 3 The bonding circuit board 200 includes a first differential line 210, which includes a P-pole differential line 211 and an N-pole differential line 212. The first differential line 210 can be used to transmit differential signals, such as clock embedded differential signals (CEDS).

[0059] See Figure 2 and Figure 3 One end of the flip-chip film 300 is connected to the bonding circuit board 200 and the first differential line 210, and the other end is connected to the display panel 100.

[0060] In some embodiments, see Figure 3 The flip-chip thin film 300 includes an LVDS interface circuit 310, which includes a first signal receiving terminal V+, a second signal receiving terminal V-, a signal output terminal Out1, and a second resistor R20.

[0061] For example, the LVDS interface circuit 310 is connected to the first differential line 210. Specifically, the first signal receiving terminal V+ is connected to the P-pole differential line 211 of the first differential line 210, the second signal receiving terminal V- is connected to the N-pole differential line 212 of the first differential line 210, the output terminal Out1 is configured to be connected to the display panel 100, one end of the second resistor R20 is connected to the first signal receiving terminal V+, and the other end is connected to the second signal receiving terminal V-.

[0062] In related technologies, during the transmission of differential signals from the first differential line 210 to the flip-chip film 300, the flip-chip film 300 acts as a signal receiving end. The impedance of the first differential line 210 is lower than that of the flip-chip film 300; for example, the impedance of the first differential line 210 can be set to 100Ω, while the impedance of the flip-chip film 300 is greater than 100Ω. Thus, for differential signals, the flip-chip film 300 is a high-impedance circuit. When the differential signal is transmitted from the first differential line 210 to the flip-chip film 300, it is equivalent to a jump from 100Ω to high impedance. This causes signal reflection at the end where the first differential line 210 connects to the flip-chip film 300, resulting in the flip-chip film 300 being unable to receive the differential signal or incorrectly identifying the differential signal, leading to a malfunction in the display panel 100.

[0063] The display module 1100 provided in this embodiment is intended to solve the above-mentioned technical problems. (See also...) Figure 3 or Figure 4 It also includes a buffer 400. The buffer 400 is disposed on the bonding circuit board 200 and is connected to the end of the P-polar differential line 211 and the N-polar differential line 212 near the flip-chip film 300. The buffer 400 is configured to reduce signal reflection between the first differential line 210 and the flip-chip film 300.

[0064] The display module 1100 provided in this embodiment has a buffer 400 provided at one end of the P-polar differential line 211 and N-polar differential line 212 of the first differential line 210 near the flip-chip film 300. The buffer 400 can reduce signal reflection between the first differential line 210 and the flip-chip film 300. Therefore, it can reduce the risk of differential signal reflection during the transmission of differential signal from the first differential line 210 to the flip-chip film 300, improve the reliability of signal transmission, and reduce the risk of display abnormalities in the display panel 100.

[0065] In some embodiments, the buffer 400 may include a first resistor 410 (e.g., Figure 3 (as shown) or LVDS (Low Voltage Differential Signaling) buffer 420 (as shown) Figure 4 (As shown). Both the first resistor 410 and the LVDS buffer 420 can reduce the risk of signal reflection of the differential signal between the first differential line 210 and the flip-chip film 300.

[0066] In the case where the buffer 400 includes the first resistor 410, see [reference] Figure 3One end of the first resistor 410 is connected to the P-polarity differential line 211, and the other end is connected to the N-polarity differential line 211. The first resistor 410 acts as a signal receiving end. Thus, the impedance of the first differential line 210 at the end near the flip-chip film 300 can be equivalent to the resistance value of the first resistor 410. When the differential signal is transmitted to the end of the first differential line 210, the impedance of the trace transmitting the differential signal is equivalent to the change from the impedance of the first differential line 210 to the resistance value of the first resistor 410. In this way, by controlling the resistance value of the first resistor 410, the jump from low resistance to high resistance of the differential signal transmission line at the end of the first differential line near the flip-chip film can be reduced, thereby reducing the risk of differential signal reflection, improving the transmission quality of the differential signal, and reducing the risk of display defects in the display panel.

[0067] In some embodiments, the resistance of the first resistor 410 is approximately equal to the impedance of the first differential line 210. Thus, when the differential signal is transmitted near the end of the first differential line 210 close to the flip-chip film 300, the impedance of the signal transmission line does not change, effectively reducing the risk of differential signal reflection.

[0068] For example, in the embodiments of this disclosure, the impedance of the first differential line 210 is 100Ω. When the impedance of the first differential line 210 is 100Ω, the resistance of the first resistor 410 is 100Ω.

[0069] In some embodiments, the first resistor 410 can be a surface mount resistor. Surface mount resistors, also known as chip resistors, are small in size, highly reliable, and facilitate the connection of the first resistor 410 with the P-pole differential line 211 and N-pole differential line 212 of the first differential line 210.

[0070] For example, the package size of the surface mount resistor can be less than or equal to the 0402 package size (inches). For example, the package size of the surface mount resistor can be a 0402 package size (length 1.00±0.10mm; width 0.50±0.10mm; height 0.30±0.10mm) or a 0201 package size (length 0.60±0.05mm; width 0.30±0.05mm; height 0.23±0.05mm). This helps to reduce the package size of the surface mount resistor, decrease the spacing between the P-terminal differential line 211 and the N-terminal differential line 212 of the first differential line 210, and improve the interference immunity of the first differential line 210.

[0071] See Figure 4When the buffer device 400 includes an LVDS buffer 420, the LVDS buffer 420 includes a first input terminal In+, a second input terminal In-, a first output terminal Out2, and a second output terminal Out3. The flip-chip film 300 is connected to the first differential line 210 through the LVDS buffer 420. Specifically, the first input terminal In+ can be connected to the P-pole differential line 211 of the first differential line 210, the second input terminal In- can be connected to the N-pole differential line 212 of the first differential line 210, and the first output terminal Out2 and the second output terminal Out3 are connected to the flip-chip film 300.

[0072] By way of example, when the flip-chip film 300 includes an LVDS interface circuit 310, see the following... Figure 4 The first output terminal Out2 can be electrically connected to the first signal receiving terminal V+, and the second output terminal Out3 is connected to the second signal receiving terminal V-.

[0073] In some embodiments, the resistance value of the second resistor R20 is approximately equal to the impedance of the first differential line 210, and the second resistor R20 includes two sub-resistors R21 connected in series, with equal resistance values ​​for the two sub-resistors R21. For example, when the impedance of the first differential line 210 is 100Ω, the resistance value of the second resistor R20 is 100Ω, where the resistance value of each sub-resistor R21 is 50Ω. Based on this, a bias voltage signal can be applied between the two sub-resistors R21 according to actual needs to adjust the differential signal. The embodiments of this disclosure do not specifically limit the setting of the bias voltage.

[0074] In some embodiments, see Figure 5 The display module 1100 may include a plurality of bonding circuit boards 200, the plurality of bonding circuit boards 200 being arranged along a first direction X ( Figure 5 The horizontal spacing is set. The first direction X is parallel to the side of the display panel 100 where the multiple bonding circuit boards 200 are located. Figure 5 (Lower side of the central display panel 100).

[0075] Depending on the size of the display panel 100, the number of bonding circuit boards 200 included in the display module 1100 can be flexibly set according to actual needs. For example, see [link to relevant documentation]. Figure 5 The display module may include four bonded circuit boards 200.

[0076] The display module 1100 also includes a driver circuit board 500 (TCON—Timing Controller; i.e., the TCON circuit board) and multiple flexible connectors 600. The driver circuit board 500 is configured to output differential signals.

[0077] For example, the driver board 500 may include a timing controller TCON configured to output a differential signal. For example, the differential signal may be a CEDS signal.

[0078] Each bonding circuit board 200 is connected to the drive circuit board 500 via at least one flexible connector 600. For example, as shown... Figure 5 As shown, each bonding circuit board 200 can be electrically connected to the drive circuit board 500 via two flexible connectors 600. One flexible connector 600 is configured to transmit the aforementioned differential signal, and the other flexible connector 600 (see the sixth flexible connector 600F below) is configured to transmit other signals such as power signals or GOA signals.

[0079] See Figure 6 and Figure 7 The flexible connector 600 includes a wiring layer 610, which includes a second differential line 611. One end of the second differential line 611 is connected to the driver circuit board 500, and the other end is connected to the first differential line 210 (e.g., ...). Figure 10 (As shown).

[0080] For example, the second differential line 611 includes a second P-pole differential line 6111 and a second N-pole differential line 6112. The second P-pole differential line 6111 is electrically connected to the P-pole differential line 211 of the first differential line 210, and the second N-pole differential line 6112 is electrically connected to the N-pole differential line 212 of the first differential line 210.

[0081] In some embodiments, the flexible connector 600 may include at least one of a flexible flat cable (FFC) and a flexible printed circuit (FPC). For example, the flexible connector 600 includes an FFC.

[0082] It is understood that the multiple flexible connectors 600 may all be FFC, all be FPC, or include some FFC and some FPC, and the embodiments of this disclosure do not specifically limit this. For example, the multiple flexible connectors 600 are all FFC.

[0083] As the size of the display panel 100 increases, the length of the flexible connector 600 also increases. The differential signal transmitted by the second differential line 611 in the flexible connector 600 is more susceptible to interference and signal attenuation, which may result in the differential signal transmitted to the flip-chip film 300 not being received by the flip-chip film 300 or not being correctly identified.

[0084] To address the above problems, in some embodiments, see [reference needed]. Figure 6 At least one flexible connector 600 also includes at least one shielding layer 620. The shielding layer 620 is a film layer capable of shielding against external signal interference, such as a copper mesh layer.

[0085] Along the thickness direction (third direction Z) of the trace layer 610, at least one shielding layer 620 is disposed on at least one side of the trace layer 610; exemplarily, a shielding layer 620 is disposed on each side of the trace layer 610. The shielding layer 620 covers the second differential line 611, thereby shielding external signals and reducing interference from external signals to the differential signals in the second differential line 611.

[0086] Of course, in some embodiments, see Figure 7 It may also include at least one flexible connector 600 without a shielding layer 620. See also... Figure 5 The length of the flexible connector with shielding layer 620 is greater than the length of the flexible connector 600 without shielding layer 620.

[0087] This can also be understood as follows: when the length of the flexible connector 600 is greater than a preset value, the flexible connector 600 may include a shielding layer 620 to reduce interference from external signals to the differential signal in the second differential line 611. When the length of the flexible connector 600 is less than the preset value, the flexible connector 600 may not have a shielding layer. For example, taking the flexible connector 600 as an FFC, the preset value can be 300mm to 500mm. For example, the preset value can be 300mm, meaning that when the length of the FFC is greater than or equal to 300mm, the FFC may include a shielding layer 620; conversely, when the length of the FFC is less than 300mm, the FFC may not have a shielding layer 620. For example, the preset value can also be 400mm, 450mm, or 500mm, and these embodiments are not listed individually in this disclosure.

[0088] In some embodiments, to reduce the length of the flexible connector 600, the attenuation of the differential signal on the second differential line 611 of the flexible connector 600 is reduced. See also Figure 8 The dimension D1 of the drive circuit board 500 along the first direction X is greater than the distance D2 between two bonding circuit boards 200 located at both ends in the first direction X; and along the second direction Y, each bonding circuit board 200 has at least a portion opposite to the drive circuit board 500. The first direction X is perpendicular to the second direction Y.

[0089] The portion of the bonding circuit board 200 opposite to the driving circuit board 500 is connected to the driving circuit board 500 via at least one flexible connector 600. This allows for a reduction in the attenuation of the differential signal on the second differential line 611 of the flexible connector 600 by increasing the size of the driving circuit board 500 along the first direction X and decreasing the size of the flexible connector 600 connecting the bonding circuit boards 200 and the driving circuit board 500 at both ends along the first direction X, thereby reducing the size of the driving circuit board 500 along the second differential line 611 of the flexible connector 600.

[0090] It is understandable that, given the same signal line length, the attenuation of the differential signal on the driver board 500 and the bonding board 200 is less than the attenuation on the flexible connector 600 (FFC).

[0091] In some embodiments, the lengths of the plurality of flexible connectors 600 are approximately equal. That is, the side of the drive circuit board 500 near the display panel 100 is approximately parallel to the first direction X. This helps to improve the uniformity of the differential signals received on different flip-chip films 300, while also improving the versatility of the flexible connectors 600 and facilitating the assembly of the display module 1100.

[0092] For example, see Figure 8 The length extension direction of the flexible connector 600 is approximately parallel to the second direction Y. It can be understood that the length extension direction of the flexible connector 600 is parallel to the extension direction of the second differential line 611.

[0093] In some embodiments, see Figure 8 The drive circuit board 500 includes a main body 510 and extensions 520 located on opposite sides of the main body 510 in a first direction X. The dimensions of the extensions 520 in the second direction Y are smaller than the dimensions of the main body 510 in the second direction Y. The drive circuit board 500 includes a timing controller TCON, which is disposed on the main body 510 and configured to output differential signals. The smaller dimensions of the extensions 520 in the second direction Y compared to the main body 510 facilitate the mounting of the timing controller TCON.

[0094] For example, the extension 520 is provided with a third differential line 521. One end of the third differential line 521 is connected to the timing controller TCON, and the other end is connected to the second differential line 611 of the flexible connector 600. The differential signal output by the timing controller TCON is transmitted sequentially through the third differential line 521, the second differential line 611 and the first differential line 210 to the LVDS interface circuit 310 of the flip-chip thin film 300 (not shown in the figure).

[0095] In some embodiments, to reduce the attenuation of the differential signal on the flexible connector 600, see [reference]. Figure 9 The plurality of bonding circuit boards 200 include a first bonding circuit board 200A and a second bonding circuit board 200B disposed adjacent to each other; along the second direction Y, at least a portion of the first bonding circuit board 200A is opposite to the driving circuit board 500, and the second bonding circuit board 200B is offset from the driving circuit board 500. The first direction X is perpendicular to the second direction Y.

[0096] That is, the length of the drive circuit board 500 along the first direction X is less than the interval between the two bonding circuit boards 200 at both ends. Along the second direction Y, the part of the bonding circuit board 200 opposite to the drive circuit board 500 is called the first bonding circuit board 200A, and the part of the bonding circuit board 200 offset from the drive circuit board 500 is called the second bonding circuit board 200B.

[0097] For example, such as Figure 9 As shown, the display module 1100 includes four bonding circuit boards 200, wherein, along the first direction X, the two bonding circuit boards 200 located in the middle are the first bonding circuit boards 200A, and the two bonding circuit boards 200 located on both sides are the second bonding circuit boards 200B.

[0098] The plurality of flexible connectors 600 include a first flexible connector 600A, a second flexible connector 600B, and a third flexible connector 600C.

[0099] The first bonding circuit board 200A is connected to the drive circuit board 500 via a first flexible connector 600A and a second flexible connector 600B. The first flexible connector 600A is configured to transmit differential signals required by the flip-chip film 300 connected to the first bonding circuit board 200A, and the second flexible connector 600B is configured to transmit differential signals required by the flip-chip film 300 connected to the second bonding circuit board 200B.

[0100] One end of the third flexible connector 600C is connected to the first bonding circuit board 200A, and the other end is connected to the second bonding circuit board 200B. The differential signal transmitted by the second flexible connector 600C is transmitted to the second bonding circuit board 200B via the first bonding circuit board 200A and the third flexible connector 600C in sequence.

[0101] See Figure 10 , Figure 10 For illustrative purposes, only a portion of the signal lines are shown, not all of them.

[0102] The first bonding circuit board 200A includes a first differential line 210 and a first adapter line 220, and the third flexible connector 600C includes a second adapter line 630.

[0103] One end of the first differential line 210 of the first bonding circuit board 200A is connected to the first flexible connector 600A (second differential line 611), and the other end is connected to the flip-chip film 300 connected to the first bonding circuit board 200A.

[0104] One end of the first adapter cable 220 is connected to the second flexible connector 600B, and the other end is connected to the second adapter cable 630. The other end of the second adapter cable 630 is connected to the first differential line 210 of the second bonding circuit board 200B.

[0105] The first differential line 210 of the second bonding circuit board 200B is connected to the other end of the second adapter line 630. In this way, the differential signal required by the flip-chip film 300 connected to the second bonding circuit board 200B, emitted by the drive circuit board 500, is transmitted sequentially through the second flexible connector 600B (second differential line 611), the first adapter line 220 of the first bonding circuit board 200A, and the second adapter line 630 of the third flexible connector 600C to the first differential line 210 of the second bonding circuit board 200B, and then to the flip-chip film 300 connected to the second bonding circuit board 200B.

[0106] In this way, by transferring the differential signal required by the first bonding circuit board 200A to the second bonding circuit board 200B, the transmission length of the differential signal required by the second bonding circuit board 200B on the flexible connector 600 can be reduced, thereby reducing the degree of differential signal attenuation.

[0107] In some embodiments, see Figure 11 The plurality of bonding circuit boards 200 also includes a third bonding circuit board 200C disposed adjacent to the second bonding circuit board 200B, the third bonding circuit board 200C being located on the side of the second bonding circuit board 200B away from the first bonding circuit board 200A. That is, the third bonding circuit board 200C is located on the side of the second bonding circuit board 200B away from the first bonding circuit board 200A among the plurality of bonding circuit boards 200. Furthermore, along the second direction Y, the third bonding circuit board 200C is offset from the drive circuit board 500.

[0108] For example, such as Figure 11 As shown, the plurality of bonding circuit boards 200 also includes two third bonding circuit boards 200C, which are located at both ends of the plurality of bonding circuit boards 200 along the first direction X.

[0109] The multiple flexible connectors 600 also include a fourth flexible connector 600D and a fifth flexible connector 600E.

[0110] One end of the fourth flexible connector 600D is connected to the first bonding circuit board 200A, and the other end is connected to the driver circuit board 500. The fourth flexible connector 600D is configured to transmit the differential signal required by the flip-chip film 300 connected to the third bonding circuit board 200C.

[0111] One end of the fifth flexible connector 600E is connected to the second bonding circuit board 200B, and the other end is connected to the third bonding circuit board 200C. The differential signal transmitted by the fourth flexible connector 600D is transmitted sequentially through the first bonding circuit board 200A, the third flexible connector 600C, the second bonding circuit board 200B, and the fifth flexible connector 600E to the third bonding circuit board 200C.

[0112] For example, see Figure 12 The first bonding circuit board 200A includes a third adapter cable 230, the third flexible connector 600C includes a fourth adapter cable 640, the second bonding circuit board 200B includes a fifth adapter cable 240, and the fifth flexible connector 600E includes a sixth adapter cable 650. Among these, Figure 12 The image only shows a portion of the signal lines of the bonding circuit board 200 and the flexible connector 600, not all of them.

[0113] The third adapter cable 230, the fourth adapter cable 640, the fifth adapter cable 240 and the sixth adapter cable 650 are connected in sequence. The third adapter cable 230 is also connected to the fourth flexible connector 600D, and the sixth adapter cable 650 is also connected to the third bonding circuit board 200C.

[0114] In this way, the differential signal required by the flip-chip film 300 connected to the third bonding circuit board 200C, emitted by the drive circuit board 500, is transmitted sequentially through the fourth flexible connector 600D (second differential line 611), the third adapter line 230 of the first bonding circuit board 200A, the fourth adapter line 640 on the third flexible connector 600C, the fifth adapter line 240 on the second bonding circuit board 200B, and the sixth adapter line 650 of the fifth flexible connector 600E to the first differential line 210 of the third bonding circuit board 200C, and further transmitted to the flip-chip film 300 connected to the third bonding circuit board 200C.

[0115] Similar to the above embodiments, this embodiment can reduce the differential signal required by the third bonding circuit board 200C by reducing the transmission length of the differential signal required by the third bonding circuit board 200C on the flexible connector 600, thereby reducing the degree of differential signal attenuation.

[0116] Understandably, as the number of bonding circuit boards 200 increases, flexible connectors 600 can be added in a similar manner to transmit the differential signals required by the outer bonding circuit board 200 sequentially through the flexible connectors 600 between the middle bonding circuit board 200 and the adjacent bonding circuit boards 200 to the outer bonding circuit board 200.

[0117] In some embodiments, see Figure 9 When the display module includes a first flexible connector 600A and a second flexible connector 600B, the lengths (dimensions along the second direction Y) of the first flexible connector 600A and the second flexible connector 600B are equal. And / or, the length extension directions of the first flexible connector 600A and the second flexible connector 600B are approximately parallel to the second direction Y. In this way, the lengths of the first flexible connector 600A and the second flexible connector 600B can be minimized to the greatest extent, thereby reducing the transmission length of the differential signal on the first flexible connector 600A and the second flexible connector 600B and reducing the attenuation of the differential signal.

[0118] like Figure 11 As shown, when the display module includes a first flexible connector 600A, a second flexible connector 600B, and a fourth flexible connector 600D, the lengths of the first flexible connector 600A, the second flexible connector 600B, and the fourth flexible connector 600D are equal, and / or, the length extension directions of the first flexible connector 600A, the second flexible connector 600B, and the fourth flexible connector 600D are approximately parallel to the second direction Y. This minimizes the lengths of the first flexible connector 600A, the second flexible connector 600B, and the fourth flexible connector 600D, thereby reducing the transmission length of the differential signal on the first flexible connector 600A, the second flexible connector 600B, and the fourth flexible connector 600D, and reducing the attenuation of the differential signal.

[0119] In some embodiments, see Figure 9 The display module 1100 includes multiple first bonding circuit boards 200A, multiple second bonding circuit boards 200B, multiple first flexible connectors 600A, multiple second flexible connectors 600B, and multiple third flexible connectors 600C. At this time, the multiple first bonding circuit boards 200A, multiple second bonding circuit boards 200B, multiple first flexible connectors 600A, multiple second flexible connectors 600B, and multiple third flexible connectors 600C are symmetrically arranged relative to the centerline L1 of the display panel 100 along the second direction Y.

[0120] In the case where the display module also includes multiple third bonding circuit boards 200C, multiple fourth flexible connectors 600D and multiple fifth flexible connectors 600E, the multiple third bonding circuit boards 200C, multiple fourth flexible connectors 600D and multiple fifth flexible connectors 600E are respectively symmetrically arranged with respect to the center line L1 of the display panel 100 along the second direction Y.

[0121] This reduces the distance between the bonding circuit board 200, which is furthest from the driver circuit board 500, and the driver circuit board 500, thereby reducing the length of the differential signal transmission path.

[0122] In some embodiments, the plurality of flexible connectors 600 further include a plurality of sixth flexible connectors 600F, each bonding circuit board 200 being connected to the drive circuit board 500 via a sixth flexible connector 600F, the sixth flexible connector 600F including traces for transmitting power signals. The power signals have strong immunity to signal interference; therefore, it is not necessary to specifically reduce the length of the sixth flexible connector 600F, thereby simplifying the structure of the display module 1100.

[0123] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display module, comprising: Display panel; A bonding circuit board includes a first differential line, the first differential line including a P-pole differential line and an N-pole differential line; A flip-chip thin film includes an LVDS interface circuit, wherein the LVDS interface circuit includes a first signal receiving terminal, a second signal receiving terminal, a signal output terminal, and a second resistor; the first signal receiving terminal is connected to the P-pole differential line, the second signal receiving terminal is connected to the N-pole differential line, the signal output terminal is connected to the display panel, one end of the second resistor is connected to the first signal receiving terminal, and the other end is connected to the second signal receiving terminal; the resistance value of the second resistor is approximately equal to the impedance of the first differential line, and the second resistor includes two sub-resistors connected in series, the two sub-resistors having equal resistance values; A buffer device is disposed on the bonding circuit board and connected to the end of the P-pole differential line and the N-pole differential line near the flip-chip film; the buffer device is configured to reduce signal reflection between the first differential line and the flip-chip film.

2. The display module according to claim 1, wherein, The buffer device includes a first resistor, one end of which is connected to the P-pole differential line and the other end of which is connected to the N-pole differential line.

3. The display module according to claim 2, wherein, The resistance of the first resistor is approximately equal to the impedance of the first differential line.

4. The display module according to claim 2, wherein, The resistance of the first resistor is 100Ω.

5. The display module according to claim 2, wherein, The first resistor includes a surface mount resistor, and the package size of the surface mount resistor is less than or equal to the 0402 package size.

6. The display module according to claim 1, wherein, The buffer device includes an LVDS buffer, which includes a first input terminal, a second input terminal, a first output terminal, and a second output terminal; the flip-chip film is connected to the first differential line through the LVDS buffer; The first input terminal is connected to the P-pole differential line, the second input terminal is connected to the N-pole differential line, and the first output terminal and the second output terminal are connected to the flip-chip film.

7. The display module according to any one of claims 1 to 6, wherein, The interval between the P-pole differential line and the N-pole differential line is less than or equal to the line width of the P-pole differential line and the N-pole differential line.

8. The display module according to any one of claims 1 to 6, wherein the display module includes a plurality of the bonding circuit boards, the plurality of bonding circuit boards being spaced apart along a first direction; the first direction is parallel to the side of the display panel where the plurality of bonding circuit boards are located; The display module further includes: The driver circuit board is configured to output differential signals; Multiple flexible connectors, each of the bonding circuit boards is connected to the drive circuit board via at least one flexible connector; The flexible connector includes a wiring layer, which includes a second differential line. One end of the second differential line is connected to the drive circuit board, and the other end is connected to the first differential line.

9. The display module according to claim 8, wherein, At least one flexible connector further includes: at least one shielding layer disposed on at least one side of the wiring layer along the thickness direction of the wiring layer, the shielding layer covering the second differential line.

10. The display module according to claim 9, wherein, At least one flexible connector does not have the shielding layer, and the length of the flexible connector with the shielding layer is greater than the length of the flexible connector without the shielding layer.

11. The display module according to claim 8, wherein, The dimension of the drive circuit board along the first direction is greater than the distance between the two bonding circuit boards located at both ends of the plurality of bonding circuit boards in the first direction; Furthermore, along the second direction, each of the bonding circuit boards has at least a portion opposite to the driving circuit board; the first direction is perpendicular to the second direction; The portion of the bonding circuit board opposite to the driving circuit board is connected to the driving circuit board via at least one flexible connector.

12. The display module according to claim 11, wherein, The lengths of the plurality of flexible connectors are approximately equal.

13. The display module according to claim 11, wherein, The length extension direction of the flexible connector is approximately parallel to the second direction.

14. The display module according to claim 11, wherein, The drive circuit board includes a main body and extensions located on opposite sides of the main body in the first direction, wherein the size of the extensions in the second direction is smaller than the size of the main body in the second direction. The drive circuit board includes a timing controller, which is disposed on the main body and configured to output the differential signal.

15. The display module according to claim 8, wherein, The plurality of bonding circuit boards include a first bonding circuit board and a second bonding circuit board disposed adjacent to each other; along a second direction, at least a portion of the first bonding circuit board is opposite to the driving circuit board, and the second bonding circuit board is offset from the driving circuit board; The first direction is perpendicular to the second direction; The plurality of flexible connectors includes a first flexible connector, a second flexible connector, and a third flexible connector; The first bonding circuit board is connected to the drive circuit board via the first flexible connector and the second flexible connector; the first flexible connector is configured to transmit differential signals required for the flip-chip film connected to the first bonding circuit board, and the second flexible connector is configured to transmit differential signals required for the flip-chip film connected to the second bonding circuit board. One end of the third flexible connector is connected to the first bonding circuit board, and the other end is connected to the second bonding circuit board; the differential signal transmitted by the second flexible connector is transmitted to the second bonding circuit board in sequence via the first bonding circuit board and the third flexible connector.

16. The display module according to claim 15, wherein, The first bonding circuit board includes the first differential line and the first adapter line, and the third flexible connector includes the second adapter line; One end of the first differential line is connected to the first flexible connector, and the other end is connected to the flip-chip film connected to the first bonding circuit board. One end of the first adapter cable is connected to the second flexible connector, and the other end is connected to the second adapter cable.

17. The display module according to claim 15, wherein, The plurality of bonding circuit boards also include a third bonding circuit board disposed adjacent to the second bonding circuit board, the third bonding circuit board being located on the side of the second bonding circuit board away from the first bonding circuit board; along the second direction, the third bonding circuit board is offset from the drive circuit board; The plurality of flexible connectors also includes a fourth flexible connector and a fifth flexible connector; One end of the fourth flexible connector is connected to the first bonding circuit board, and the other end is connected to the drive circuit board; the fourth flexible connector is configured to transmit differential signals required by the flip-chip film connected to the third bonding circuit board. One end of the fifth flexible connector is connected to the second bonding circuit board, and the other end is connected to the third bonding circuit board; the differential signal transmitted by the fourth flexible connector is transmitted to the third bonding circuit board in sequence via the first bonding circuit board, the third flexible connector, the second bonding circuit board and the fifth flexible connector.

18. The display module according to claim 17, wherein, The first bonding circuit board includes a third adapter cable, the third flexible connector includes a fourth adapter cable, the second bonding circuit board includes a fifth adapter cable, and the fifth flexible connector includes a sixth adapter cable; The third adapter cable, the fourth adapter cable, the fifth adapter cable, and the sixth adapter cable are connected in sequence. The third adapter cable is also connected to the fourth flexible connector, and the sixth adapter cable is also connected to the third bonding circuit board.

19. The display module according to claim 15, wherein, The first flexible connector and the second flexible connector are of equal length, and / or the length extension directions of the first flexible connector and the second flexible connector are substantially parallel to the second direction; When the display module further includes a fourth flexible connector, the lengths of the first flexible connector, the second flexible connector, and the fourth flexible connector are equal, and / or the length extension directions of the first flexible connector, the second flexible connector, and the fourth flexible connector are substantially parallel to the second direction.

20. The display module according to claim 8, wherein, The display module includes multiple first bonding circuit boards, multiple second bonding circuit boards, multiple first flexible connectors, multiple second flexible connectors, and multiple third flexible connectors. The multiple first bonding circuit boards, multiple second bonding circuit boards, multiple first flexible connectors, multiple second flexible connectors, and multiple third flexible connectors are respectively symmetrically arranged with respect to the centerline of the display panel along a second direction; the second direction is perpendicular to the first direction. In the case where the display module further includes multiple third bonding circuit boards, multiple fourth flexible connectors, and multiple fifth flexible connectors, the multiple third bonding circuit boards, the multiple fourth flexible connectors, and the multiple fifth flexible connectors are respectively symmetrically arranged with respect to the centerline of the display panel along the second direction.

21. The display module according to claim 15, wherein, The plurality of flexible connectors also include a plurality of sixth flexible connectors, each of the bonding circuit boards being connected to the drive circuit board via a sixth flexible connector; the sixth flexible connector includes traces for transmitting power signals.

22. A display device comprising a display module as claimed in any one of claims 1 to 21.

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